TW202323438A - 樹脂組成物、預浸體、積層板、樹脂薄膜、印刷線路板及半導體封裝體 - Google Patents

樹脂組成物、預浸體、積層板、樹脂薄膜、印刷線路板及半導體封裝體 Download PDF

Info

Publication number
TW202323438A
TW202323438A TW111133364A TW111133364A TW202323438A TW 202323438 A TW202323438 A TW 202323438A TW 111133364 A TW111133364 A TW 111133364A TW 111133364 A TW111133364 A TW 111133364A TW 202323438 A TW202323438 A TW 202323438A
Authority
TW
Taiwan
Prior art keywords
resin
group
resin composition
carbons
maleimide
Prior art date
Application number
TW111133364A
Other languages
English (en)
Chinese (zh)
Inventor
藤井俊希
下川諒
日高圭芸
柳田真
中村幸雄
Original Assignee
日商力森諾科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商力森諾科股份有限公司 filed Critical 日商力森諾科股份有限公司
Publication of TW202323438A publication Critical patent/TW202323438A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08L79/085—Unsaturated polyimide precursors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L35/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
TW111133364A 2021-09-03 2022-09-02 樹脂組成物、預浸體、積層板、樹脂薄膜、印刷線路板及半導體封裝體 TW202323438A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-144141 2021-09-03
JP2021144141 2021-09-03

Publications (1)

Publication Number Publication Date
TW202323438A true TW202323438A (zh) 2023-06-16

Family

ID=85412437

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111133364A TW202323438A (zh) 2021-09-03 2022-09-02 樹脂組成物、預浸體、積層板、樹脂薄膜、印刷線路板及半導體封裝體

Country Status (5)

Country Link
JP (1) JPWO2023033131A1 (https=)
KR (1) KR20240051946A (https=)
CN (1) CN117881738A (https=)
TW (1) TW202323438A (https=)
WO (1) WO2023033131A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2025126952A1 (https=) * 2023-12-12 2025-06-19
WO2025258485A1 (ja) * 2024-06-11 2025-12-18 日本ゼオン株式会社 樹脂組成物、プリプレグ、積層体、金属張積層板および配線板

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5995051B2 (ja) 2012-03-08 2016-09-21 Dic株式会社 硬化性樹脂組成物、その硬化物、及びプリント配線基板
JP6089615B2 (ja) * 2012-11-16 2017-03-08 日立化成株式会社 熱硬化性樹脂組成物、プリプレグ、金属張積層板及びプリント配線板
JP6896993B2 (ja) * 2015-09-18 2021-06-30 昭和電工マテリアルズ株式会社 樹脂組成物、プリプレグ、積層板及び多層プリント配線板
EP4094940A1 (en) * 2020-01-24 2022-11-30 Mitsubishi Gas Chemical Company, Inc. Resin composition, resin sheet, prepreg, and printed wiring board

Also Published As

Publication number Publication date
KR20240051946A (ko) 2024-04-22
WO2023033131A1 (ja) 2023-03-09
JPWO2023033131A1 (https=) 2023-03-09
CN117881738A (zh) 2024-04-12

Similar Documents

Publication Publication Date Title
TWI840527B (zh) 樹脂組成物、樹脂組成物之硬化物、樹脂薄片、印刷配線板及半導體裝置
JP7732216B2 (ja) 樹脂組成物、プリプレグ、積層板、樹脂フィルム、多層プリント配線板、半導体パッケージ、樹脂組成物の製造方法及び変性共役ジエンポリマー
JP7298383B2 (ja) 樹脂組成物、樹脂組成物の硬化物、樹脂シート、プリント配線板及び半導体装置
JP6809014B2 (ja) 熱硬化性樹脂組成物、層間絶縁用樹脂フィルム、複合フィルム、プリント配線板及びその製造方法
JP7259783B2 (ja) 樹脂組成物
JP7722392B2 (ja) 樹脂組成物、プリプレグ、積層板、樹脂フィルム、プリント配線板及び半導体パッケージ
TW202330781A (zh) 樹脂組成物、預浸體、積層板、樹脂膜、印刷線路板及半導體封裝體
JP2020169273A (ja) 樹脂組成物、プリプレグ、積層板、多層プリント配線板及び半導体パッケージ
JP2020169276A (ja) 樹脂組成物、プリプレグ、積層板、多層プリント配線板及び半導体パッケージ
TWI825128B (zh) 銅箔的處理方法、銅箔、積層體、覆銅積層板、印刷線路板及對應高速通訊之模組
TW202323438A (zh) 樹脂組成物、預浸體、積層板、樹脂薄膜、印刷線路板及半導體封裝體
TW202229442A (zh) 馬來醯亞胺樹脂組成物、預浸體、積層板、樹脂薄膜、印刷線路板及半導體封裝體
CN120153001A (zh) 树脂组合物、树脂膜、预浸料、层叠板、印刷线路板和半导体封装体
JP2023060674A (ja) 樹脂組成物、プリプレグ、積層板、樹脂フィルム、プリント配線板及び半導体パッケージ
CN116063897A (zh) 树脂组合物
JP7552218B2 (ja) 樹脂組成物、樹脂付き金属箔、プリプレグ、積層板、多層プリント配線板及び半導体パッケージ
TWI905282B (zh) 樹脂組成物、附有樹脂的金屬箔、預浸體、積層板、多層印刷線路板及半導體封裝體
JP6896994B2 (ja) 樹脂組成物、プリプレグ、積層板及び多層プリント配線板
CN115505313A (zh) 树脂组合物
JP2023013224A (ja) アンテナモジュール用積層板の製造方法、アンテナ装置の製造方法、アンテナモジュールの製造方法及び通信装置の製造方法
TW202227558A (zh) 馬來醯亞胺樹脂組成物、預浸體、樹脂薄膜、積層板、印刷線路板及半導體封裝體
JP2023013230A (ja) 樹脂組成物、プリプレグ、積層板、樹脂フィルム、多層プリント配線板、アンテナ装置及びアンテナモジュール
JP2021075729A (ja) 樹脂組成物、プリプレグ、積層板及び多層プリント配線板
JP2020169275A (ja) 樹脂組成物、プリプレグ、積層板、多層プリント配線板及び半導体パッケージ
KR20260008086A (ko) 수지 조성물, 수지 필름, 프리프레그, 적층판, 프린트 배선판 및 반도체 패키지