TW202323367A - 組成物、硬化物、硬化物的製造方法、結構體及元件 - Google Patents

組成物、硬化物、硬化物的製造方法、結構體及元件 Download PDF

Info

Publication number
TW202323367A
TW202323367A TW111136596A TW111136596A TW202323367A TW 202323367 A TW202323367 A TW 202323367A TW 111136596 A TW111136596 A TW 111136596A TW 111136596 A TW111136596 A TW 111136596A TW 202323367 A TW202323367 A TW 202323367A
Authority
TW
Taiwan
Prior art keywords
group
composition
compound
fluorine atom
preferable
Prior art date
Application number
TW111136596A
Other languages
English (en)
Chinese (zh)
Inventor
青島俊栄
Original Assignee
日商富士軟片股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商富士軟片股份有限公司 filed Critical 日商富士軟片股份有限公司
Publication of TW202323367A publication Critical patent/TW202323367A/zh

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F10/00Homopolymers and copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40High-molecular-weight compounds
    • C08G18/42Polycondensates having carboxylic or carbonic ester groups in the main chain
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40High-molecular-weight compounds
    • C08G18/64Macromolecular compounds not provided for by groups C08G18/42 - C08G18/63
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02Polycondensates containing more than one epoxy group per molecule
    • C08G59/04Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/02Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW111136596A 2021-09-30 2022-09-27 組成物、硬化物、硬化物的製造方法、結構體及元件 TW202323367A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021161594 2021-09-30
JP2021-161594 2021-09-30

Publications (1)

Publication Number Publication Date
TW202323367A true TW202323367A (zh) 2023-06-16

Family

ID=85782590

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111136596A TW202323367A (zh) 2021-09-30 2022-09-27 組成物、硬化物、硬化物的製造方法、結構體及元件

Country Status (3)

Country Link
JP (1) JPWO2023054222A1 (fr)
TW (1) TW202323367A (fr)
WO (1) WO2023054222A1 (fr)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1891761B (zh) * 2001-12-17 2010-10-06 大金工业株式会社 交联性弹性体组合物及由该组合物形成的成型品
WO2016171104A1 (fr) * 2015-04-20 2016-10-27 旭硝子株式会社 Tôle d'acier électromagnétique à revêtement isolant et agent de traitement de surface aqueux
JP6859736B2 (ja) * 2017-02-16 2021-04-14 三菱マテリアル株式会社 電着液及びこれを用いた絶縁皮膜付き導体の製造方法
JP2020037662A (ja) * 2018-09-05 2020-03-12 Agc株式会社 フッ素樹脂膜、分散液の製造方法およびフッ素樹脂膜付基材の製造方法

Also Published As

Publication number Publication date
WO2023054222A1 (fr) 2023-04-06
JPWO2023054222A1 (fr) 2023-04-06

Similar Documents

Publication Publication Date Title
TWI758415B (zh) 感光性樹脂組成物、含雜環聚合物前體、硬化膜、積層體、硬化膜的製造方法及半導體裝置
TWI728137B (zh) 負型感光性樹脂組成物、硬化膜、硬化膜的製造方法、半導體裝置、積層體的製造方法、半導體裝置的製造方法及聚醯亞胺前驅物
JP5064950B2 (ja) 新規な感光性樹脂組成物、それから得られる感光性樹脂組成物溶液、感光性フィルム、絶縁膜及び絶縁膜付きプリント配線板
KR20190033582A (ko) 수지 조성물 및 그 응용
US8063245B2 (en) Phosphazene compound, photosensitive resin composition and use thereof
TWI751341B (zh) 感光性樹脂組成物、聚合物前驅物、硬化膜、積層體、硬化膜的製造方法及半導體裝置
TWI802640B (zh) 感光性樹脂組成物、樹脂、硬化膜、積層體、硬化膜之製造方法、半導體元件
JP2005154643A (ja) 活性エネルギー線硬化型アルカリ可溶性イミド樹脂、活性エネルギー線硬化型アルカリ可溶性イミド樹脂組成物、ソルダーレジスト用組成物、プリント配線板および感光性ドライフィルム
JP5644068B2 (ja) 感光性樹脂組成物、レジストパターンの製造法、及びハードディスクサスペンション
JP7431050B2 (ja) 樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス
KR20230110590A (ko) 수지 조성물, 경화물, 적층체, 경화물의 제조 방법, 및, 반도체 디바이스
CN111094397B (zh) 聚酰亚胺树脂及包含其的负型感光性树脂组合物
WO2022158359A1 (fr) Composition de résine photosensible, procédé de production de film durci de polyimide l'utilisant et film durci de polyimide
JP5576181B2 (ja) 感光性樹脂組成物及びそれを用いた感光性フィルム
CN112805317A (zh) 树脂组合物、固化膜、层叠体、固化膜的制造方法及半导体器件
JP2008007623A (ja) ナノインプリント用組成物
JP7422763B2 (ja) 硬化性樹脂組成物、硬化性樹脂組成物の製造方法、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス
JP2011208025A (ja) ポリイミド前駆体及びポリイミド前駆体を用いた感光性樹脂組成物
JP5367809B2 (ja) 感光性樹脂組成物及び硬化膜
TWI836111B (zh) 負型硬化性組成物、硬化膜、積層體、硬化膜的製造方法及半導體器件
TWI819121B (zh) 硬化膜的製造方法、硬化膜、積層體的製造方法及半導體元件的製造方法
CN113892058A (zh) 感光性树脂组合物和其固化膜
US20240176240A1 (en) Photosensitive resin composition, production method for polyimide cured film using same, and polyimide cured film
TW202323367A (zh) 組成物、硬化物、硬化物的製造方法、結構體及元件
CN113166409B (zh) 聚酰亚胺前体、聚酰亚胺、聚酰亚胺树脂膜、及柔性器件