TW202321375A - 熱硬化性樹脂組成物、預浸體及印刷配線板 - Google Patents
熱硬化性樹脂組成物、預浸體及印刷配線板 Download PDFInfo
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- TW202321375A TW202321375A TW111129448A TW111129448A TW202321375A TW 202321375 A TW202321375 A TW 202321375A TW 111129448 A TW111129448 A TW 111129448A TW 111129448 A TW111129448 A TW 111129448A TW 202321375 A TW202321375 A TW 202321375A
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- epoxy
- compound
- resin composition
- thermosetting resin
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- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 37
- 239000011574 phosphorus Substances 0.000 claims abstract description 36
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- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 43
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- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 11
- 239000004020 conductor Substances 0.000 description 11
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- PJANXHGTPQOBST-UHFFFAOYSA-N stilbene Chemical group C=1C=CC=CC=1C=CC1=CC=CC=C1 PJANXHGTPQOBST-UHFFFAOYSA-N 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
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- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- H—ELECTRICITY
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| TWI888159B (zh) * | 2024-04-28 | 2025-06-21 | 大陸商中山台光電子材料有限公司 | 樹脂組合物、其用途及其製品 |
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| JPH044213A (ja) * | 1990-04-23 | 1992-01-08 | Sumitomo Bakelite Co Ltd | 半導体封止用樹脂の製造方法 |
| JPH06136093A (ja) * | 1992-09-08 | 1994-05-17 | Fujitsu Ltd | エポキシ樹脂組成物 |
| JPH08176280A (ja) * | 1994-12-27 | 1996-07-09 | Matsushita Electric Works Ltd | 液状エポキシ樹脂組成物及びその製法 |
| JP2009007467A (ja) * | 2007-06-28 | 2009-01-15 | Shin Etsu Chem Co Ltd | 実装用難燃性サイドフィル材及び半導体装置 |
| TWI798194B (zh) * | 2016-12-28 | 2023-04-11 | 日商三菱瓦斯化學股份有限公司 | 印刷電路板用樹脂組成物、預浸體、樹脂片、疊層板、覆金屬箔疊層板、印刷電路板、及多層印刷電路板 |
| US11499005B2 (en) | 2018-07-26 | 2022-11-15 | Mitsubishi Gas Chemical Company, Inc. | Curable composition, prepreg, resin sheet, metal foil-clad laminate and printed wiring board |
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| TWI888159B (zh) * | 2024-04-28 | 2025-06-21 | 大陸商中山台光電子材料有限公司 | 樹脂組合物、其用途及其製品 |
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| CN118251457A (zh) | 2024-06-25 |
| WO2023013711A1 (ja) | 2023-02-09 |
| JPWO2023013711A1 (https=) | 2023-02-09 |
| KR20240040056A (ko) | 2024-03-27 |
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