TW202320183A - Semiconductor component pickup device and operation control method thereof capable of correcting the descending height of the vacuum pickup according to various situations - Google Patents

Abstract

The present invention discloses a semiconductor component pickup device and an operation control method thereof. By grasping a working state of a motor of a vacuum pickup device, a lowering height of the vacuum pickup device can be determined based on the working state, so as to correct the vacuum pickup device to the accurate lowering height according to various situations. A method for controlling operation of a semiconductor component pickup device includes: a vacuum pickup device lowering step for enabling a motor of a vertical drive part to work toward the semiconductor component, so as to lower the vacuum pickup device; a contact height determining step for monitoring the working state related to the motor of the vertical drive part through an encoder and comparing a work setting value of the motor with a measurement value of the encoder, so as to determine whether the vacuum pickup device is in contact with the semiconductor component; and a height setting step for setting the height at the time point when the vacuum pickup device has been determined to contact the semiconductor component as the lowering height of the vacuum pickup device relative to the semiconductor component.

Description

Semiconductor component pick-up device and operation control method thereof

The present invention relates to a semiconductor component pick-up device and an operation control method thereof, and more particularly, relates to being able to correct the vacuum according to various situations by grasping the working state of the motor of the vacuum pick-up and judging the descending height of the vacuum pick-up based on the working state. Accurate drop height scheme for the pickup.

Generally, a semiconductor element can be formed on a silicon wafer used as a semiconductor substrate by repeatedly performing a series of manufacturing processes, and the semiconductor element formed as described above can be manufactured by a plurality of A semiconductor strip made from a semiconductor package.

The semiconductor strips manufactured in this way can be individualized into a plurality of semiconductor packages through a cutting and sorting (Sawing & Sorting) process, and sorted according to the judgment of good or bad products. For example, after the semiconductor strips are loaded onto the chuck table, they can be individualized into a plurality of semiconductor packages by using a dicing blade, and the individualized semiconductor packages can be inspected by a vision module after being cleaned and dried. In addition, according to the detection results obtained by the vision module, it can be classified into good products and defective products.

Specifically, the semiconductor packages can be transferred to good product and defective product trays via a buffer table for performing a drying process and an inspection process, an inversion table for turning over the semiconductor packages, and a pallet table for sorting, etc. . At this time, the transfer of the semiconductor package may be performed by a package picker and a vacuum picker. The package picker can be used to simultaneously pick up the individualized semiconductor packages and transfer them to the buffer table and the pallet table in sequence, and the vacuum picker can be used to pick up the semiconductor packages individually parts and transfer them to the pallet.

In the process of transferring the semiconductor package on the pallet table to the pocket of the tray by the vacuum picker, if the vacuum picker puts the semiconductor package on the pocket of the tray with excessive pressure, the semiconductor package will be damaged. Damage may occur, and conversely, if the picking state is released while floating from the pocket of the tray, it may happen that the semiconductor package cannot be properly placed inside the pocket and becomes suspended. Therefore, it is necessary to determine the exact height of the vacuum pickup.

As a method of measuring the height of the vacuum pickup, when the pickup is lowered while the vacuum pressure is lowered while the vacuum pressure is applied to the vacuum pickup, it is judged that the bottom height is different, and the offset (offset) is adjusted here. Applies to picker height at production start.

However, there is a problem that since such a vacuum pressure contact position is not the contact surface of the actual semiconductor package, the offset is set depending on the manager's experience value depending on the situation, and the height of the vacuum pickup cannot be set accurately.

(Patent Document 0001) Korean Patent Registration Publication No. 10-2096567

(Patent Document 0002) Korean Patent Publication No. 10-2020-0065621

The present invention is proposed in order to solve the problems of the prior art as described above, and its purpose is: by correcting the accurate height of the vacuum pick-up in the semiconductor element pick-up device that transfers semiconductor package, thereby solve the problem when picking up semiconductor package The problem of damage occurs and the problem of not being able to properly seat the semiconductor package in the pocket of the tray is solved.

In particular, its purpose is to solve the following problem: in the case of the conventional method of grasping the height by measuring the internal vacuum pressure of the vacuum pickup, since the vacuum pressure contact height is not the contact surface of the actual semiconductor package, it depends on the situation depending on the situation. It is impossible to set the drop height of the vacuum pickup accurately because the offset is set based on the administrator's experience value.

The object of the present invention is not limited to the foregoing, and other unmentioned objects and advantages of the present invention can be understood through the following description.

It may be that an embodiment of the operation control method of the semiconductor component pick-up device according to the present invention includes: a step of lowering the vacuum pick-up, causing the motor of the vertical driving part to work toward the semiconductor component, thereby lowering the vacuum pick-up; a step of judging the contact height, While monitoring the working state related to the motor of the vertical drive part through the encoder, compare the working set value of the motor with the measured value of the encoder, thereby judging whether the vacuum pick-up is in contact with the semiconductor element; and height setting Step, setting the height at the time point when it is judged that the vacuum picker contacts the semiconductor element as the descending height of the vacuum picker to the semiconductor element.

Preferably, in the step of setting the height, an offset distance may be added to the height at the time point when the vacuum picker contacts the semiconductor element, thereby setting the height of the vacuum picker to the semiconductor element. The drop height of the component.

More preferably, in the step of lowering the vacuum pickup, the motor of the vertical drive unit may be moved in steps while the vacuum pressure of the vacuum pickup is not applied.

Furthermore, in the step of judging the contact height, it is also possible to judge the height of the vacuum pickup by considering the measured value of the drop of the vacuum pickup obtained by the position detection sensor for measuring the drop degree of the vacuum pickup. Whether the device is in contact with the semiconductor element or not.

As an example, in the contact height judging step, a reader may recognize a linear scale display provided outside the vacuum pickup to measure the degree of descent of the vacuum pickup.

Preferably, in the height setting step, the vacuum pickup may be set in consideration of a variation of an elastic member disposed on the vacuum pickup based on a variation related to a degree of descent of the vacuum pickup. tor to the drop height of the semiconductor element.

As an example, in the step of judging the contact height, the comparison between the torque measurement amount and the torque setting amount related to the motor of the vertical driving part may be considered, so as to judge whether the vacuum pick-up has the same effect on the semiconductor element. contact or not.

As an example, in the step of judging the contact height, a comparison between a load measurement amount and a load setting amount related to the motor of the vertical drive unit may be considered, so as to judge whether the vacuum pickup has an impact on the semiconductor element. contact or not.

Furthermore, in the step of lowering the vacuum picker, the vacuum picker is lowered toward the semiconductor element placed on the pallet table, and in the step of setting the height, the height of the vacuum picker is set to the height of the pallet. The drop height of the semiconductor components on the pallet.

Alternatively, in the step of lowering the vacuum picker, the vacuum picker is lowered toward the semiconductor element placed in the pocket of the tray, and in the step of setting the height, the height of the vacuum picker is set against the tray. The drop height of the semiconductor component on the pocket.

In addition, it may be that an embodiment of the semiconductor element pick-up device according to the present invention includes: a vacuum picker that absorbs and transfers the semiconductor element with vacuum pressure; a vertical drive unit that lifts the vacuum picker; While monitoring the working state of the motor of the vertical driving part, it is judged whether the vacuum picker is in contact with the semiconductor element, so as to set the lowering height of the vacuum picker to the semiconductor element.

Preferably, the control unit may include: a vacuum control unit, controlling the vacuum pressure of the vacuum picker; a picker height control unit, controlling the vertical driving unit to adjust the height of the vacuum picker; and picking up The device height judging part monitors the working state of the motor of the vertical driving part through an encoder, and judges whether the vacuum pick-up is in contact with the semiconductor element, so as to set the position of the vacuum pick-up on the Drop height of semiconductor components.

Furthermore, the picker height judging unit may add an offset distance to the height judged to be the time point when the vacuum picker comes into contact with the semiconductor element, thereby setting the height of the vacuum picker to the semiconductor element. drop height.

As an example, the semiconductor element pick-up device may further include a position detection sensor for measuring the degree of descent of the vacuum picker, and the picker height determination unit may also consider the position detection sensor obtained by the position detection sensor. The measured value of the drop of the vacuum picker is used to determine whether the vacuum picker is in contact with the semiconductor element.

Here, the position detection sensor may include: a linear scale display part provided outside the vacuum pickup; and a reader for identifying the linear scale display part.

As an example, the semiconductor device pick-up device may further include: a torque meter for measuring the torque related to the motor of the vertical drive unit, and the picker height determination unit may also consider the torque related to the motor of the vertical drive unit. A comparison between the measured torque and the set torque is used to determine whether the vacuum picker is in contact with the semiconductor element.

As an example, the semiconductor device pick-up device may further include: a load measuring instrument for measuring the load related to the motor of the vertical drive unit, and the picker height determination unit may also consider the load related to the motor of the vertical drive unit. By comparing the measured load with the set load, it is judged whether the vacuum picker is in contact with the semiconductor element.

As an example, the vacuum pickup may include: a chuck for sucking a semiconductor element with vacuum pressure; The amount of change of the elastic part of the picker is used to set the descending height of the vacuum picker to the semiconductor element.

Further, it may be that the vacuum picker transfers the semiconductor element from the pallet table on which the semiconductor element that has completed the cleaning and drying process is placed to a tray provided with a pocket for storing the semiconductor element that has completed the visual inspection, and the control unit sets the The lowering height of the vacuum picker to the pallet stage or the semiconductor components on the tray.

In addition, the operation control method of the semiconductor element pick-up device according to the present invention may include: a step of lowering the vacuum pick-up, in the state where no vacuum pressure is applied to the vacuum pick-up, the motor of the vertical driving part is placed on the pallet table toward The semiconductor element or the semiconductor element placed in the pocket of the tray moves step by step, thereby causing the vacuum picker to descend; the contact height judgment step monitors the working state related to the motor of the vertical drive part through the encoder, The degree of descent of the vacuum pick-up is measured based on an encoder measurement result comparing an operation setting value of the motor with a measurement value of the encoder, and a linear scale display portion provided outside the vacuum pick-up is recognized by a reader. Considering the change amount of the elastic member disposed on the vacuum pick-up, it is judged whether the vacuum pick-up is in contact with the semiconductor element or not; An offset distance is added to the height of the time point when the picker touches the semiconductor element, so as to set the descending height of the vacuum picker to the semiconductor element on the pallet table or the semiconductor element on the tray.

According to the present invention as described above, by correcting the accurate height of the vacuum pick-up in the semiconductor element pick-up device that transfers the semiconductor element, the semiconductor element can be placed accurately while the semiconductor element is not damaged when picking up the semiconductor element. in the pocket of the tray.

The effects of the present invention are not limited to the above-mentioned effects, and those who have ordinary knowledge in the technical field to which the present invention pertains can clearly understand other effects not mentioned from the following description.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, but the present invention is not limited or limited by the embodiments.

In order to illustrate the present invention and its operational advantages and objects achieved by the practice of the present invention, preferred embodiments of the present invention will be illustrated and described with reference to the embodiments.

First of all, the terms used in the present application are only used to describe specific embodiments, and are not intended to limit the present invention. As long as there is no obvious different meaning in the context, singular expressions may include plural expressions. In addition, in this application, it should be understood that terms such as "comprising" or "having" are used to designate the existence of features, numbers, steps, operations, constituent elements, components or combinations thereof described in the specification, without pre-excluding one or more of them. or more other features or numbers, steps, operations, constituting elements, parts, or the possibility of their existence or addition in combination.

When describing the present invention, when it is judged that a specific description for a related announced structure or function will obscure the gist of the present invention, its detailed description will be omitted.

The present invention proposes to grasp the working state of the motor when grasping the height of the vacuum picker of the semiconductor component pick-up device, and judge the descending height of the vacuum picker based on the working state of the motor, so that the accuracy of the vacuum picker according to various situations can be corrected techniques for descending heights.

FIG. 1 shows a schematic structural view of a semiconductor package cutting and sorting device to which the present invention can be applied.

The semiconductor package cutting and sorting equipment 10 can be used to cut a semiconductor strip 1 composed of a plurality of semiconductor packages 2 to individualize the semiconductor packages 2 , inspect the individualized semiconductor packages 2 , and perform classification according to the result.

The semiconductor package cutting and sorting equipment 10 may include: a cutting module 20 for cutting the semiconductor strip 1 and individualizing it into a semiconductor package 2; a sorting module 30 for checking the semiconductor package 2 and sorting the semiconductor package according to the inspection result; Item 2 is classified.

A magazine 15 containing a plurality of semiconductor strips may be disposed on one side of the semiconductor package cutting and sorting device 10 .

In addition, although not shown in detail, a holder (not shown) for extracting the semiconductor strip 1 from the magazine 15 may be provided, and the semiconductor strip 1 extracted from the magazine 15 may be guided by guide rails.

The semiconductor strip 1 can be picked up by the strip picker 25 and then transferred to the vacuum chuck 40 . The strip picker 25 may be configured to be rotatable in order to adjust the arrangement direction of the semiconductor strips 1 . For example, the strip picker 25 may rotate the semiconductor strips 1 after picking up the semiconductor strips 1 extracted from the magazine 15 , and then may transfer the rotated semiconductor strips 1 to the vacuum chuck 40 .

The vacuum chuck 40 can be supported by a chuck table 41 that can move the semiconductor strip 1 to the cutting module 20 . The cutting module 20 may include a cutting mandrel 22 for cutting the semiconductor strip 1 , and the chuck table 41 may move the semiconductor strip 1 under the cutting mandrel 22 through another driving part (not shown).

The semiconductor packages 2 individualized by the dicing die 20 can be picked up and transferred by the package picker 55 . The semiconductor package cutting and sorting apparatus 10 may include a package transfer unit 50 for moving a package picker 55 , and the package transfer unit 50 may include a package picker holder 52 for gripping the package picker 55 . For example, the package transfer unit 50 may include an orthogonal coordinate robot for moving the package picker carriage 52 in horizontal and vertical directions.

The semiconductor package cutting and sorting apparatus 10 may include a cleaning unit 60 for cleaning the individualized semiconductor packages 2 . After the semiconductor package 2 is picked up by the package picker 55, the package transfer unit 50 can move the package picker 55 above the cleaning unit 60, and the cleaning unit 60 can remove foreign matter from the semiconductor package 2 using brushes and cleaning liquid. In addition, the cleaning unit 60 may dry the semiconductor package 2 by spraying air to the semiconductor package 2 .

After the cleaning and drying of the semiconductor packages 2 is completed, the package transfer unit 50 can transfer the semiconductor packages 2 to the sorting module 30 . For example, the sorting module 30 may include a pallet table 31 for supporting the semiconductor packages 2 , and the package transfer unit 50 may transfer the semiconductor packages 2 onto the pallet table 31 .

The sorting module 30 may include: a table transfer unit 32 for moving the pallet table 31 in the horizontal direction; and a vision unit 35 configured above the transfer path of the pallet table 31 and used for checking The semiconductor package 2.

The sorting module 30 may include: a tray 71 for storing the semiconductor packages 2 judged to be good by the vision unit 35; a container 75 for storing the semiconductor packages 2 judged to be defective. In addition, the sorting module 30 may include a tray transfer unit 72 for moving the tray 71 .

The stage transfer unit 32 and the tray transfer unit 72 can move the pallet stage 31 and the tray 71 to the sorting area, and the sorting module 30 can include: a wafer picker 85 for storing the semiconductor package 2 into the tray 71 and the container 75 ; The wafer picker transfer unit 80 is used to move the wafer picker 85 . Additionally, the sorting module 30 may include a tray supply unit 70 for supplying trays 71 .

The semiconductor component pick-up device and the operation control method therefor proposed in the present invention can be applied to the semiconductor package cutting and sorting apparatus as described above.

Hereinafter, when the semiconductor element pick-up device according to the present invention is applied to the above-described semiconductor package cutting and sorting equipment 10 for storing semiconductor packages 2 from the pallet table 31 of the sorting module 30 into the tray 71 and The situation of the wafer picker 85 of the container 75 is described, but not limited thereto, and the present invention can be appropriately modified and applied to various process situations of transferring semiconductor packages.

The semiconductor component pick-up device according to the present invention will be described more specifically by way of examples.

FIG. 2 shows an embodiment of a semiconductor component pick-up device according to the present invention.

The semiconductor element mentioned below may include a semiconductor package as a material picked up and transferred by the semiconductor element pick-up device.

The semiconductor component pickup apparatus 100 may include: a vacuum pickup 110 for picking up a semiconductor component with vacuum pressure; a vertical driving part 120 for moving the vacuum pickup 110 in a vertical direction; and a control unit 150 for controlling the vacuum pickup 110 and the work of the vertical drive unit 120.

The vertical drive unit 120 includes a linear motor (not shown) that lifts the vacuum picker 110 up and down, and the control unit 150 controls the operation of the linear motor to control the lift of the vacuum picker 110 .

In addition, the semiconductor component pick-up apparatus 100 may include a horizontal driving unit 130 for moving the vacuum picker 110 above the semiconductor component to be picked up, and the operation of the horizontal driving unit 130 may be controlled by the control unit 150 .

The vacuum picker 110 may include: a picker main body 112 mounted on the vertical driving part 120; and a chuck 114 connected to a lower portion of the picker main body 112 and used to vacuum absorb semiconductor components.

The vacuum pressure applied to the chuck 114 can be controlled by the control unit 150 when measured. For example, the control unit 150 may include a vacuum control unit (not shown) that provides vacuum pressure to the vacuum pickup 110 and measures and controls the internal vacuum pressure of the vacuum pickup 110 .

At the same time, the control unit 150 may measure the working state of the linear motor of the vertical driving part 120 and determine the height of the vacuum picker 110 according to the working state, so as to control the lifting of the vacuum picker 110 .

FIG. 3 shows a block diagram of an embodiment of a control unit for a semiconductor component pick-up device according to the present invention.

The control unit 150 of the semiconductor component pick-up apparatus 100 may include a vacuum control unit 151, a picker height control unit 153, a picker height determination unit 155, and the like.

In addition, the control unit 150 may also control other components provided in the semiconductor device pick-up device 100 such as the horizontal driving unit 130 .

The vacuum control part 151 may control the degree of the vacuum pressure while supplying the vacuum pressure to the vacuum pickup 110 . To this end, the vacuum control unit 151 may include: a vacuum pressure providing device for providing vacuum pressure to the vacuum pickup 110 ; and a vacuum pressure measuring device for measuring the internal vacuum pressure of the vacuum pickup 110 .

Further, the vacuum control unit 151 can be linked with the picker height control unit 153 to control the vacuum pressure for the vacuum picker 110 to absorb and pick up the semiconductor components or to put down the semiconductor components at the transfer position.

The pickup height control unit 153 can control the lifting height of the vacuum pickup 110 . For example, by controlling the linear motor of the vertical driving part 120, the vacuum pickup 110 may be lowered to a specific height or raised to a specific height.

The picker height determination unit 155 can set the descending height of the vacuum picker 110 . For example, the picker height judging unit 155 can set the descending height of the vacuum picker 110 for the semiconductor components placed on the pallet table after the cleaning and drying process. In addition, the picker height determination unit 155 may set the descending height of the vacuum picker 110 for placing the semiconductor device in the pocket of the tray 71 after the visual inspection is completed.

In order to set the descending height of the vacuum picker 110, the picker height judging part 155 can monitor the operating state related to the linear motor of the vertical drive part 120 that lifts the vacuum picker 110 through an encoder, and judge the height of the vacuum picker 110 against the semiconductor. Whether the component is in contact or not, thereby setting the descending height of the vacuum picker 110 .

In connection with this, description will be made with reference to an example of encoder measurement values according to the operating state of the motor in the present invention shown in FIG. 4 .

The picker height control unit 153 may operate the linear motor of the vertical driving unit 120 based on a preset operation setting value corresponding to the corresponding position, thereby lowering the vacuum picker 110 . Preferably, the picker height control unit 153 can make the linear motor of the vertical driving unit 120 step and move by a small amount, so as to perform precise control.

The picker height judging part 155 may monitor the working state related to the linear motor of the vertical driving part 120 through an encoder. The picker height judging section 155 can judge the contact time of the vacuum picker 110 to the semiconductor element by comparing the height change A of the vacuum picker 110 according to the work setting value with the height change B of the vacuum picker 110 according to the measured value of the encoder. point, the height determined as the contact time point is set as the descending height of the vacuum pickup 110 . For example, while the vacuum pick-up 110 is lowered according to the work set value, while comparing the measured value of the encoder, the point P at which a difference occurs between the work set value and the encoder measured value can be set as the corresponding position of the vacuum pick-up 110. drop height.

Preferably, the pickup height judging part 155 can set the descending height of the vacuum pickup 110 by adding an offset distance according to the corresponding position.

Besides, in the present invention, the picker height judging unit 155 can add various methods to set the descending height of the vacuum picker 110 , which will be described through various embodiments.

If the picker height determination unit 155 sets the lowering height of the vacuum picker to the semiconductor element at the corresponding position, then the picker height control unit 153 will set the lowering height of the vacuum picker corresponding to the corresponding position in the process of executing the actual process. It is applied as an operation setting value related to the linear motor of the vertical driving unit 120, so that the pick-up and transfer of semiconductor components can be realized.

Furthermore, the vacuum picker of the semiconductor device pick-up device may be equipped with an elastic member above the chuck for shock relief.

The vacuum pickup 110 may include: a pickup body 112 mounted on a vertical drive portion 120; and a chuck 114 connected to the lower part of the pickup body 112 and used for vacuum adsorption of semiconductor elements, and may be mounted between the chuck 114 and the pickup body Elastic members 116 are arranged between 112 .

Vacuum pickup 110 descends, and when clamping head 114 is in contact with semiconductor element, in order to absorb semiconductor element 2 with the vacuum pressure of chucking head 114, chucking head 114 should be close to semiconductor element 2, for this reason, along with chucking head 114 and semiconductor element 2 contact, the picker main body 112 is further lowered, so that the semiconductor element 2 can be tightly attached to the chuck 114. At this time, when the chuck 114 is in close contact with the semiconductor element 2, an impact may be generated. The elastic member 116 absorbs the shock applied to the clip 114 and the semiconductor element 2 when the clip 114 is in close contact with the semiconductor element 2 , thereby preventing damage to all of the clip 114 and the semiconductor element 2 .

As the elastic member 116, a coil spring or the like can be used, and various members capable of absorbing shock can be used instead.

By providing the elastic member 116 in the vacuum pickup 110 , it is necessary to further accurately measure the degree of compression and deformation of the elastic member 116 when measuring the operating state of the motor of the vertical drive unit 120 with the encoder. That is, as the vacuum pickup 110 descends, after the collet 114 comes into contact with the semiconductor element 2, the vacuum pickup 110 can further descend with the deformation of the elastic member 116. When the deformation of the elastic member 116 exceeds a certain level, the The load due to the drop is applied to the chuck 114 and the semiconductor element 2 as they are, and damage may occur. Therefore, it is necessary to further precisely control the descent of the vacuum pickup 110 according to the degree of deformation of the elastic member 116 .

For this reason, the semiconductor component pick-up device according to the present invention may further include an additional structure for grasping the degree of descent of the vacuum pick-up, explained by various embodiments of the semiconductor component pick-up device according to the present invention.

6 and 7 show another embodiment of the semiconductor element pick-up device according to the present invention.

6 and 7 are applicable to vacuum pick-ups with elastic components, the degree of deformation of the elastic components can be considered to further accurately determine the decline of the vacuum pick-up, but it can also be applied to vacuum pick-ups without elastic components. Vacuum pick-up to further accurately judge the drop of the vacuum pick-up.

The above-mentioned FIG. 6 shows the case where the position detection sensor is applied to additionally grasp the descent of the vacuum pickup.

As the position detection sensor, the linear scale display part 145 provided outside the vacuum pickup 110 and the reader 140 for recognizing the linear scale display part 145 can be applied.

On the outside of the pickup body 112 of the vacuum pickup 110, a linear scale display part 145 for displaying the degree of elevation in minute units may be provided. In addition, the reader 140 may emit light and use the reflected light to recognize the unit scale of the linear scale display part 145 as the vacuum pickup 110 descends. Alternatively, the reader 140 may zoom in on the linear scale display portion 145 with a camera to recognize the unit scale as the vacuum picker 110 descends.

The control unit 150 may determine the degree of descent of the vacuum pickup 110 based on the unit scale itself of the linear scale display part 145 recognized by the reader 140 or the amount of change in the unit scale accompanying the descent.

The above-mentioned FIG. 7 shows the case where either or both of the torque meter and the load meter are used to additionally grasp the descent of the vacuum pickup.

It may be that the torque measuring instrument 160 measures the torque related to the motor of the vertical driving part 120, and the control unit 150 compares the torque setting value with the torque measurement value, thereby judging whether the vacuum picker 110 is in contact with the semiconductor element as it descends. .

It may be that the load measuring instrument 170 measures the amount of load applied to the motor of the vertical driving portion 120, and the control unit 150 compares the set amount of load with the measured amount of load, thereby judging whether the vacuum picker 110 is in contact with the semiconductor element as it descends. . Here, the amount of load may be measured based on the amount of current applied to the motor of the vertical driving unit 120 .

As described above, according to the semiconductor component pick-up device of the present invention, it is possible to measure the encoder measurement value related to the motor of the vertical drive part, and in addition, it is also possible to measure the descending height by the position detection sensor, or by the torque meter and A load measuring device or the like judges whether or not the vacuum pickup is in contact based on the measured torque value, the measured load value, or the like.

It is preferable to additionally reflect various measurement results based on encoder measurement values, so that the lowering height of the vacuum pickup can be set with higher reliability.

Further, in the present invention, the work control method of the semiconductor element pick-up device described above is proposed, and the embodiment of the semiconductor element pick-up device according to the present invention described above will be referred to below together, and the semiconductor element pick-up according to the present invention will be described through the embodiment. The operation control method of the device.

FIG. 8 shows a flow chart of an embodiment of an operation control method for a semiconductor component pick-up device according to the present invention.

It may be that the control unit 150 moves the vacuum picker 110 to a specific position for picking up or putting down the semiconductor component through the semiconductor component pick-up device when performing the process, and controls the motor of the vertical driving part 120 to lower the vacuum picker 110 (S100 ), monitoring the degree of descent of the vacuum pickup 110 (S200).

Here, the monitoring of the degree of descent of the vacuum pickup 110 can be grasped by measuring the motor operation of the vertical drive part 120 with an encoder, or can be grasped by a position detection sensor, or can be grasped by measuring the motor operation of the vertical drive part 120. Torque measurement or load measurement to grasp.

It may be that the control unit 150 lowers the vacuum pick-up 110 while judging whether it is in contact with the semiconductor element (S300), and sets the height at the point in time when it is judged that the vacuum pick-up 110 is in contact with the semiconductor element as the height of the vacuum pick-up at the corresponding position. 110 to the descending height of the semiconductor element (S400).

It may be that the control unit 150 saves the descending height of the vacuum picker 110 according to the corresponding position, and controls the vacuum picker 110 according to the set descending height according to the corresponding position when performing an actual process.

Through various embodiments, the specific process of the operation control method of the semiconductor device pick-up device according to the present invention will be further described.

FIG. 9 shows an example of judging the contact of the vacuum pickup and setting the descending height in the operation control method of the semiconductor device pickup device according to the present invention.

The control unit 150 may move the vacuum pickup 110 to a corresponding position, and lower the vacuum pickup 110 in a state where no vacuum pressure is applied to the vacuum pickup 110 .

Preferably, the linear motor of the vertical driving part 120 may be moved by a small amount in steps, so that the vacuum pickup 110 is lowered in stages (S110).

The control unit 150 may measure an operation state related to the linear motor of the vertical driving part 120 through an encoder while lowering the vacuum pickup 110 (S210).

In addition, the control unit 150 can compare the operation setting value related to the linear motor of the vertical driving part 120 with the measurement value of the encoder to grasp whether there is a difference between the operation measurement value and the encoder measurement value, so as to compare the operation measurement value and the encoder measurement value. The timing at which a difference of a certain level or more occurs between the measured values is determined as the timing at which the vacuum pickup 110 contacts the semiconductor element at the corresponding position ( S310 ).

The control unit 150 can set the height determined as the contact time of the vacuum picker 110 as the height of the vacuum picker 110 to the semiconductor element at the corresponding position. At this time, considering various conditions and manufacturing processes at the corresponding position, it can also An offset is additionally added (S410).

That is, the control unit 150 may add an offset to the height judged as the contact time point of the vacuum pickup 110 at the corresponding position, thereby setting it as the descending height of the vacuum pickup 110 (S420).

For example, it may be that when setting the height of the drop for the vacuum picker 110 to pick up the semiconductor element at the corresponding position, the vacuum picker 110 needs to be sufficiently close in order to absorb the semiconductor element, so it is determined that the contact time point of the vacuum picker 110 Add an offset with a positive value to the height of , thereby setting it as the descending height of the vacuum pickup 110 .

In addition, it may be that, when setting the descending height for the vacuum picker 110 to drop the semiconductor element at the corresponding position, an offset having a negative value is added to the height judged as the contact time point of the vacuum picker 110 so that it The lowering height of the vacuum picker 110 is set so that the vacuum picker 110 does not fall to the bottom surface and be squeezed while the semiconductor element is being sucked.

Here, the offset can be set in consideration of various conditions of the corresponding position and various factors such as the process.

FIG. 10 shows another example of judging the contact of the vacuum pickup and setting the descending height in the operation control method of the semiconductor device pickup device according to the present invention.

The pick-up device for the semiconductor element may be provided with a position detection sensor, and the degree of descent of the vacuum picker is monitored by the position detection sensor, so as to determine whether the vacuum picker is in contact.

When the aforementioned semiconductor device pick-up device as shown in FIG. 6 is used, the control unit 150 can recognize the linear scale display part 145 with the reader 140 (S220), thereby monitoring the degree of descent of the vacuum picker 110.

In particular, for the vacuum pickup 110 equipped with the elastic member 116 as shown in FIG. (S330).

For example, before the vacuum pick-up 110 comes into contact with the semiconductor element, the elastic member 116 is not deformed under pressure, so the vacuum pick-up 110 descends at a certain speed. , no change in the descending speed occurs. On the contrary, when the vacuum pickup 110 is in contact with the semiconductor element and the elastic member 116 is deformed under pressure, the descending speed of the vacuum pickup 110 changes. In this state, if the linear scale display part 145 is recognized by the reader 140, Then, the amount of change can be recognized in the case where the descending speed becomes smaller.

Therefore, the control unit 150 considers the change amount of the elastic member based on the drop measurement value of the position detection sensor, thereby judging the drop change amount of the vacuum pick-up 110 (S330), based on which it is possible to judge whether the vacuum pick-up 110 is sensitive to the semiconductor element. Contact or not (S340).

Further, the control unit 150 can additionally apply this embodiment to the embodiment of FIG. 9 , so as to set the descending height of the vacuum picker 110 more accurately.

FIG. 11 shows still another example of judging the contact of the vacuum pickup and setting the descending height in the operation control method of the semiconductor device pickup device according to the present invention.

The semiconductor device pick-up device may include one or more of a torque meter or a load meter, and monitors the torque measurement or the load measurement to determine whether the vacuum pickup is in contact.

When applying the semiconductor component pick-up device as described above as shown in FIG. 7, the control unit 150 can measure the torque or load related to the motor of the vertical driving part 120 through the torque meter 160 or the load meter 170 (S230). , and based on this, the degree of descent of the vacuum pickup 110 is monitored.

For the vacuum pickup 110 provided with the elastic member 116 as shown in FIG. 5 , the change amount of the elastic member 116 when the vacuum pickup 110 is in contact with the semiconductor element can be considered, based on the amount of torque or the load, and the vacuum pickup can be judged. device 110 drops.

For example, the elastic member 116 is not deformed under pressure until the vacuum picker 110 comes into contact with the semiconductor device, so the amount of torque or load on the motor of the vertical drive unit 120 that lowers the vacuum picker 110 can be maintained at a certain level.

On the contrary, when the vacuum pickup 110 is in contact with the semiconductor element and the elastic member 116 is deformed under pressure, the amount of torque or load related to the motor of the vertical drive part 120 that lowers the vacuum pickup 110 may change, and its value will gradually change. Increase.

Therefore, the control unit 150 can compare the torque measurement with the torque setting, or compare the load measurement with the load setting (S350), and judge whether the vacuum picker 110 is in contact with the semiconductor device based on this (S360).

Here, the torque setting amount and the load setting amount can be set in consideration of various factors such as various conditions of the corresponding positions, physical properties of each component included in the vacuum pickup, and corresponding manufacturing processes.

Further, the control unit 150 can additionally apply this embodiment to the embodiment of FIG. 9 , so as to set the descending height of the vacuum picker 110 more accurately.

The above-described operation control method of the semiconductor device pick-up device according to the present invention can be applied to setting the lowering height of the vacuum picker when the vacuum picker is lowered to pick up the semiconductor device mounted on the pallet table. Alternatively, it can also be applied to setting the descending height of the vacuum picker in order to set the semiconductor element in the pocket of the tray.

Further, the embodiment of FIG. 10 and the embodiment of FIG. 11 can also be applied to the embodiment of FIG. 9 to set the descending height of the vacuum pickup.

According to such the present invention, by correcting the accurate height of the vacuum pick-up in the semiconductor element pick-up device that transfers the semiconductor element, thereby when picking up the semiconductor element, the damage of the semiconductor element does not occur, and the semiconductor element can be accurately placed on the Tray pocket.

The above description is merely an illustration of the technical concept of the present invention, and those who have ordinary knowledge in the technical field to which the present invention pertains can make various modifications and variations without departing from the essential characteristics of the present invention. Therefore, the examples described in the present invention are not intended to limit the technical idea of the present invention but to explain the technical idea of the present invention, and the technical idea of the present invention is not limited to these examples. The protection scope of the present invention should be interpreted by the appended patent application scope, and all technical ideas within the equivalent scope should be interpreted as included in the scope of rights of the present invention.

1: Semiconductor strip 2: Semiconductor package 10: Classification equipment 15: Magazine 20: Cutting module 22: Cutting mandrel 25: Strip Picker 30: Classification module 31: pallet table 32: Table transfer unit 35: Visual unit 40: vacuum chuck 41: chuck table 50: Package transfer unit 52:Package Picker Bracket 55:Package picker 60: cleaning unit 70: Pallet supply unit 71: tray 72: Pallet transfer unit 75: container 80: Wafer picker transfer unit 85: Wafer picker 100: Semiconductor component pick-up device 110: vacuum pickup 112: Pickup body 114: Chuck 116: Elastic parts 120: Vertical drive unit 130: Horizontal drive unit 140: reader 145: Linear scale display part 150: control unit 151: Vacuum control department 153: Pickup height control unit 155: Pickup height judgment department 160: Torque tester 170: load tester A: Altitude change B: Altitude change P: point of difference S100, S200, S300, S400: steps S110, S210, S310, S410, S420: steps S220, S330, S340: steps S230, S350, S360: steps

FIG. 1 shows a schematic structural view of a semiconductor package cutting and sorting device to which the present invention can be applied.

FIG. 2 shows an embodiment of a semiconductor component pick-up device according to the present invention.

FIG. 3 shows a block diagram of an embodiment of a control unit for a semiconductor component pick-up device according to the present invention.

FIG. 4 shows an example of encoder measurement values according to the operating state of the motor in the present invention.

FIG. 5 is a diagram showing the operation of the semiconductor element pick-up device according to the present invention according to the provision of the elastic member.

FIG. 6 shows another embodiment of a semiconductor component pick-up device according to the present invention.

FIG. 7 shows yet another embodiment of a semiconductor component pick-up device according to the present invention.

FIG. 8 shows a flow chart of an embodiment of an operation control method for a semiconductor component pick-up device according to the present invention.

FIG. 9 shows an example of judging the contact of the vacuum pickup and setting the descending height in the operation control method of the semiconductor device pickup device according to the present invention.

FIG. 10 shows another example of judging the contact of the vacuum pickup and setting the descending height in the operation control method of the semiconductor device pickup device according to the present invention.

FIG. 11 shows still another example of judging the contact of the vacuum pickup and setting the descending height in the operation control method of the semiconductor device pickup device according to the present invention.

S100: step

S200: Steps

S300: Steps

S400: Steps

Claims (20)

A work control method for a semiconductor component pick-up device, comprising: a step of lowering the vacuum pickup by causing the motor of the vertical driving part to work toward the semiconductor element, thereby lowering the vacuum pickup; In the step of judging the contact height, while monitoring the working state of the motor of the vertical drive part through the encoder, comparing the working setting value of the motor with the measured value of the encoder, thereby judging the degree of contact of the vacuum pickup to the semiconductor element. exposure; and In the height setting step, the height at the time point when it is judged that the vacuum picker contacts the semiconductor element is set as the descending height of the vacuum picker to the semiconductor element. The work control method of the semiconductor component pick-up device as described in Claim 1, wherein: In the height setting step, an offset distance is added to the height determined at the point in time when the vacuum picker contacts the semiconductor element, thereby setting a descending height of the vacuum picker to the semiconductor element. The work control method of the semiconductor component pick-up device as described in Claim 1, wherein: In the step of lowering the vacuum pickup, the motor of the vertical driving portion is moved stepwise in a state where the vacuum pressure of the vacuum pickup is not applied. The work control method of the semiconductor component pick-up device as described in Claim 1, wherein: In the contact height judging step, it is also considered whether the vacuum picker is in contact with the semiconductor element by taking into account the measured value of the fall of the vacuum picker obtained by the position detection sensor that measures the degree of fall of the vacuum picker. . The work control method of the semiconductor component pick-up device as described in Claim 4, wherein: In the contact height judging step, the degree of descent of the vacuum pickup is measured by recognizing the linear scale display portion provided outside the vacuum pickup with a reader. The work control method of the semiconductor component pick-up device as described in Claim 5, wherein: In the height setting step, a drop height of the vacuum pick-up for the semiconductor element is set in consideration of a change amount of an elastic member disposed on the vacuum pick-up based on a change amount related to a drop degree of the vacuum pick-up. The work control method of the semiconductor component pick-up device as described in Claim 1, wherein: In the contact height judging step, the comparison between the measured torque and the set torque of the motor of the vertical drive unit is also taken into consideration, thereby judging whether the vacuum pickup has contacted the semiconductor element. The work control method of the semiconductor component pick-up device as described in Claim 1, wherein: In the contact height judging step, the comparison between the measured load and the set load for the motor of the vertical drive unit is also taken into consideration, thereby judging whether the vacuum pickup has contacted the semiconductor element. The work control method of the semiconductor component pick-up device as described in Claim 1, wherein: In the step of lowering the vacuum pickup, the vacuum pickup is lowered toward the semiconductor device placed on the pallet table, In the height setting step, a lowering height of the vacuum picker to the semiconductor element on the pallet stage is set. The work control method of the semiconductor component pick-up device as described in Claim 1, wherein: In the step of lowering the vacuum picker, the vacuum picker is lowered toward the semiconductor element housed in the pocket of the tray, In the height setting step, a lowering height of the vacuum picker to the semiconductor element on the pocket of the tray is set. A semiconductor component pickup device, comprising: Vacuum picker, which absorbs and transfers semiconductor components with vacuum pressure; a vertical drive to lift the vacuum pickup; and The control unit monitors the working state of the motor of the vertical driving part through the encoder and judges whether the vacuum picker touches the semiconductor element, so as to set the lowering height of the vacuum picker to the semiconductor element. The semiconductor component pick-up device as claimed in claim 11, wherein: The control unit includes: a vacuum control unit, controlling the vacuum pressure of the vacuum pickup; a pickup height control part, which controls the vertical driving part to adjust the height of the vacuum pickup; and The picker height judging part, while monitoring the working state related to the motor of the vertical drive part through the encoder, judges whether the vacuum picker is in contact with the semiconductor element, thereby setting the vacuum picker's contact with the semiconductor element. drop height. The semiconductor component pickup device as claimed in claim 12, wherein: The picker height judging unit adds an offset distance to the height at the time point when the vacuum picker is judged to be in contact with the semiconductor element, thereby setting a lowering height of the vacuum picker to the semiconductor element. The semiconductor component pickup device as claimed in claim 12, wherein: The semiconductor component picking device also includes: a position detection sensor to measure the degree of descent of the vacuum pickup, The picker height judging unit also considers the measured value of the vacuum picker drop obtained by the position detection sensor, thereby judging whether the vacuum picker is in contact with the semiconductor element. The semiconductor component pickup device as claimed in claim 14, wherein: The position detection sensor includes: a linear scale display part is arranged on the outside of the vacuum pickup; and The reader recognizes the linear scale display unit. The semiconductor component pickup device as claimed in claim 12, wherein: The semiconductor component picking device also includes: a torque meter for measuring the torque associated with the motor of the vertical drive section, The picker height judging unit also considers the comparison between the measured torque and the set torque for the motor of the vertical driving unit, thereby judging whether the vacuum picker is in contact with the semiconductor device. The semiconductor component pickup device as claimed in claim 12, wherein: The semiconductor component picking device also includes: a load measuring instrument for measuring the load associated with the motor of the vertical drive section, The picker height judging unit also considers a comparison between a load measurement amount and a load setting amount for the motor of the vertical drive unit, thereby judging whether the vacuum picker is in contact with the semiconductor device. The semiconductor component pickup device as claimed in claim 12, wherein: This vacuum pickup includes: a chuck that absorbs the semiconductor element with vacuum pressure; and elastic member that absorbs the shock applied to the chuck, The picker height determination unit considers the change amount of the elastic member disposed on the vacuum picker, and sets the height of the vacuum picker lowering the semiconductor element. The semiconductor component pick-up device as claimed in claim 11, wherein: The vacuum picker transfers the semiconductor component from the pallet table on which the semiconductor component completed the cleaning and drying process is placed, to a tray provided with a pocket for receiving the semiconductor component completed the visual inspection, The control unit sets the descending height of the vacuum picker to the pallet table or the semiconductor element on the tray. A work control method for a semiconductor component pick-up device, comprising: In the step of lowering the vacuum picker, the motor of the vertical driving unit is moved stepwise toward the semiconductor device placed on the pallet table or the semiconductor device placed in the pocket of the tray in the state where no vacuum pressure is applied to the vacuum picker. Vacuum picker down; The contact height judging step is to monitor the operating state related to the motor of the vertical drive part through the encoder, based on the encoder measurement result comparing the operating setting value of the motor with the measurement value of the encoder, and identifying the setting with the reader The measurement result of the sensor that measures the degree of descent of the vacuum pick-up on the linear scale display part outside the vacuum pick-up, considers the change amount of the elastic member disposed on the vacuum pick-up, thereby judging that the vacuum pick-up contact or absence of semiconductor components; and The height setting step is to add an offset distance to the height at the time point when it is judged that the vacuum picker contacts the semiconductor element, thereby setting the vacuum picker to the semiconductor element on the pallet table or the semiconductor element on the tray. Drop height of semiconductor components.

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