KR100402948B1 - Wafer frame unloading stack device of tape removal - Google Patents

Abstract

PURPOSE: An unloading stacker of a tape remover is provided to perform an automatic tape removing process by exactly keeping a descent position of a fixing plate due to a weight of a wafer frame when unloading the wafer frame in the unloading stacker and provided to easily extract the wafer frame from the unloading stacker by automatically moving the unloading stacker filled up with wafer frames to an extract space. CONSTITUTION: An unloading stacker comprises a fixing plate(6) stably fixed with a wafer frame(1) capable of being lifted along a plurality of guide bars(5) and springs(7) respectively inserted to the guide bars(5). At this point, the guide bars(5) are located on an installing plate(4) and the springs(7) are located between the installing plate(4) and the fixing plate(6). The unloading stacker further includes a plurality of guiders(8) vertically fixed on the fixing plate(6) for guiding the unloaded wafer frame(1).

Description

Wafer frame unloading stack device of tape removal}

The present invention relates to an unloading stacker of a tape remover attached to a wafer frame which in turn loads the tape to which the tape is removed as the tape attached to the wafer frame is removed at the tape remover.

In general, the semiconductor manufacturing process is largely divided into a process of forming desired semiconductor elements (hereinafter referred to as "chips") on a wafer, an assembly process of packaging the semiconductor elements, and an inspection process of inspecting characteristics and lifespan of the completed packages. Can be classified.

In the semiconductor manufacturing process, after the chip is formed on the wafer, an electrical function test of the chips formed on the wafer is performed to mark the chip that is determined to be defective, but the chips that have been processed as defective are excluded from the packaging process.

After the inspection process for sorting the defective chips as described above, a sawing process of cutting the chips into a predetermined size from the wafer is performed.

The sawing process is divided into a wafer tape mounting process of adhering the back side of the wafer onto a tape bonded to a ring-shaped wafer frame and a substantial sawing process of cutting a chip using a cutter such as diamond. Even if the chip is separated from the wafer, the tape is not completely cut, so that each chip is not scattered from the tape by the adhesive force of the tape.

Therefore, in the later chip bonding process, each chip attached to the tape can be picked up one by one and bonded on the pad of the lead frame.

After the bonding of the good chip adhered on the tape through the above process on the pad of the lead frame, only the defective chip 3 remains on the tape as shown in FIG. In order to recycle the tape, the tape 2 having the defective chip is removed from the wafer frame.

However, since the equipment for automatically removing the tape with the bad chip from the wafer frame has not been developed in the related art, the worker removes the tape by hand, and thus, if the bad chip is broken, the broken bad chip is frequently stuck in the hand of the worker. It became.

The present invention has been made to solve such a conventional problem, and developed a device that automatically removes the tape from the tape attached wafer frame, so that the wafer frame from which the tape is removed is transferred by the transfer in order The purpose is to make it possible.

Another object of the present invention is to enable a wafer frame having a different specification in order to load a wafer frame having a different specification in sequence without a separate structural change by using one device.

According to an aspect of the present invention for achieving the above object, it is fitted to the plurality of guide rods fixed to the mounting plate to be seated on the seating plate to be seated on the wafer frame, the mounting plate and the seating plate is fitted to each guide rod There is provided an unloading stacker of a tape remover attached to a wafer frame comprising a spring and a guider for guiding a wafer frame which is fixed and unloaded vertically on the seating plate.

1 is a perspective view of a state in which a bad chip is attached to a tape on a wafer frame

Figure 2 is a perspective view showing the main part of the present invention

3 is a front view of the present invention

4A and 4B are plan views of the present invention.

4A is a state diagram in which the unloading stacker is located at the unloading position

4b is a state in which the unloading stacker is moved to the take-out space

Explanation of symbols for main parts in the drawings

4: mounting plate 5: guide rod

6: seating plate 7: spring

8: guider 14: driving means

15: detection piece 17, 19a, 19b: sensor

18: Detection piece

Hereinafter, the present invention will be described in more detail with reference to FIGS. 2 to 4 as an embodiment.

Figure 2 is a perspective view showing the main part of the present invention, Figure 3 is a front view of the present invention and Figures 4a and 4b is a plan view of the present invention, the present invention is a plurality of guide rods 5 are fixed to the mounting plate (4) And a seating plate 6 on which the wafer frame 1 is seated so as to be lifted and lowered.

Each guide rod 5 positioned between the mounting plate 4 and the seating plate 6 is compressed as the wafer frame 1 is loaded on the seating plate 6 so that the unloading position of the wafer is always constant. A spring 7 for lowering the seating plate 6 is fitted so that a plurality of guiders 8 for guiding the unloaded wafer frame 1 are vertically fixed on the seating plate 6.

Notched groove 6a on the seating plate 6 on which the wafer frame 1 is seated to adjust the position of the guider 8 according to the size (8 ", 12", etc.) of the wafer frame 1 being unloaded. Is formed.

In addition, two mounting pieces 10 are fixed to the upper surface of the seating plate 6 so that the bottom surface of the wafer frame 1 abuts to form the space 9, which is mounted on the seating plate 6. This is to allow the operator to easily take out the wafer frame 1 loaded on the seating plate 6 using the space 9 when taking out the wafer frame 1.

On the other hand, as the wafer frame 1 from which the tape is removed by transfer (not shown) is completely loaded on the seating plate 6, the operator can easily take out the wafer frame from the seating plate 6. It is preferable to configure the mounting plate 4 on which the plate 6 is installed to be moved to the take-out space 11. In the following, it is detected as the wafer frame 1 is loaded on the seating plate 6. The structure which automatically transfers the mounting plate 4 to the take-out space 11 side is demonstrated concretely.

Detecting means for detecting the take-out time of the wafer frame (1) is fixed to the base 12, the guide rail 13 for guiding the horizontal movement of the seating plate (6) and unloaded on one side of the seating plate (6) One side of the seating plate 6 is provided with the seating plate 6 as the take-out space 11 as the detecting means detects the take-out time of the wafer frame 1 loaded on the seating plate 6. It is fitted to the rodless cylinder which is the drive means 14 to convey.

The detection means is installed on the detection piece 15 fixed to one side of the seating plate 6, the sensor fixing piece 16 installed perpendicular to one side of the seating plate 6, and the sensor fixing piece 16 It consists of a sensor 17 for driving the drive means 14 in accordance with the detection piece 15 fixed to the seating plate 6, the long hole 16a is perpendicular to the sensor fixing piece 16 It is formed to adjust the position of the sensor 17.

Since the load acting on the seating plate 6 varies depending on the sizes 8 "and 12" of the wafer frame 1 loaded on the seating plate 6, the taking-out time of the wafer frame 1 also changes, so the wafer frame This is because the position of the sensor 17 that detects the ejection timing should be adjusted according to the size of.

If the detection piece 18 detects that the detection piece 18 is fixed to one side of the seating plate 6 and the seating plate 6 is transferred to the unloading position and the take-off position of the wafer frame 1, the driving means. Sensors 19a and 19b for controlling the drive of the rodless cylinder (14) are provided.

The operation of the present invention configured as described above will be described as follows. First, when the seating plate on which the magazine is placed is inclined at a predetermined angle while the plurality of wafer frames 1 are stacked in the magazine, the wafer frame ( 1) is pulled out to one side. In this state, when the rotation cylinder is driven and the load is raised by driving the controller to take out the wafer frame 1 located on the uppermost side of the mega and place it in the loading unit, the rotation cylinder The rotating plate hinged to the rod of the rotating plate rotates about the axis. As described above, after the rotating plate rotates, a pair of guiders on which the wafer frame 1 is mounted is moved to the guide rail side by the rodless cylinder to move the wafer frame ( It waits for 1) to be transported by its own weight. With the above operation, a pair of guiders moves to the guide rail side. After the transfer, the seating plate of the elevator portion rises by one step, so that the wafer frame 1 located on the upper side of the magazine is located on the upper side of the guide rail. The wafer frame 1, which is located on the upper side of the magazine, is pulled out and transferred to the upper surface of the guider by its own weight, and the wafer frame is placed on the positioning plate opposite to the transfer direction. When the sensing means detects that one wafer frame 1 is transported along the guider, the pair of guiders transferred to the wafer frame supply side is reduced to the initial state by re-drive of the driving means. Initial state of the rotating plate that rotated by a certain angle by the rotating cylinder Since the wafer frame 1 mounted on the guider is positioned at the loading position, the lifting cylinder which raises and lowers the loading side picker and unloading side picker simultaneously drives the lifting plate down to the bottom dead center along the guide rod. A plurality of pickers provided on the lifting plate are connected to the wafer frame positioned at the loading position and the upper surface of the wafer frame positioned at the unloading position, respectively.

In this way, the wafer frame, from which the tape has been removed from the unloading side picker by moving the slider while the loading side picker and the unloading side picker respectively hold the wafer frame, is positioned directly above the unloading position. Since the tape attached to the picker is placed on the upper part of the tape removal position, the wafer frame is lowered to the bottom dead center by driving the lifting cylinder.The removed tape is loaded into the unloading stacker and the tape is attached. The wafer frame is placed on the seating plate of the tape removing unit. Hereinafter, the process of unloading the wafer frame from which the tape is separated into the unloading stacker will be described in more detail. By transfer (not shown) with the stacker in the unloading position When the tape is removed, the wafer frame (1) is transferred to the wafer sequentially frame is guided on guider (8) is mounted on the mounting plate (6).

As the wafer frame 1 is loaded on the seating plate 6 as described above, a load is applied to the spring 7 fitted to the guide rod 5 by the weight of the wafer frame, so that the seating plate 6 is spring 7. The unloading position of the wafer frame is always kept constant as it is gradually lowered while compressing.

The sensor plate fixed to the sensor fixing piece 16 has the detection plate 15 fixed to one side of the seat plate by lowering the seat plate 6 while compressing the spring 7 by the subsequent unloading operation of the wafer frame 1. When the detection is performed by 17, the unloading operation of the wafer frame is temporarily stopped under the control of a controller (not shown), and at the same time, the rodless cylinder which is the driving means 14 is driven. It is moved to the ejection space 11 side in the direction of the arrow.

As described above, when the guide plate 13 is guided by the mounting plate 4 and moves to the ejection space 11 as shown in FIG. 4B, the sensor 19a detects the detection piece 18 fixed to one side of the mounting plate. At the same time, the operator stops the driving of the wafer frame 1 from the unloading stacker by a notifying means such as a buzzer.

Therefore, the operator can easily grip the wafer frame 1 through the space portion 9 formed by the seating piece 10 fixed to the upper surface of the seating plate 6, thereby taking out the wafer frame from the unloading stacker. You can do it.

After taking out the wafer frame 1 loaded from the seating plate 6, the seating plate 6, which was lowered while compressing the spring 7, rises as in the initial state by the restoring force of the spring 7 to fix the sensor. Since the sensor 17 fixed to the piece 16 does not detect the detection piece 15, the mounting plate 4 may cause the sensor 17 to detect the detection piece 18 by re-drive of the driving means 14. Until the wafer frame 1 is continuously unloaded onto the seating plate 6.

As described above, the present invention provides a tape remover because the wafer frame from which the tape has been removed is transferred by a transfer, and thus, when the unloading stacker is unloaded in the unloading stacker, the seating plate is lowered by the weight of the wafer frame to always maintain the unloading position. In addition, it is possible to realize the automation of the wafer, and when the wafer frame is completely filled in the unloading stacker, the mounting plate is automatically moved to the take-out space, so that the operator can easily take out the wafer frame from the unloading stacker. .

In addition, according to the specifications of the wafer frame, it is also possible to automatically unload various types of wafer frames without changing the structure of the device.

Claims (5)

A seating plate fitted to the plurality of guide rods fixed to the mounting plate to be lifted and seated on the wafer frame, a spring fitted to each guide rod to be positioned between the mounting plate and the seating plate, and a plurality of fixed vertically fixed to the seating plate An unloading stacker of a tape remover attached to a wafer frame, characterized by comprising a guider for guiding the wafer frame being loaded. The method of claim 1, An unloading stacker of the tape remover attached to the wafer frame, characterized in that the seating piece is fixed so that a bottom portion of the wafer frame abuts on the top surface of the seating plate. The method of claim 1, A guide rail for guiding the horizontal movement of the seating plate, detection means for detecting a take-out time of the wafer frame installed and unloaded on one side of the seating plate, and one side of the seating plate is fitted to detect the take-out time. And a driving means for transferring the seating plate to the take-out space, and a detection piece and a sensor installed at the unloading position and the takeout position of the wafer frame to detect movement of the seating plate. Unloading stacker of the removed tape remover. The method of claim 3, wherein The detecting means detects a detection piece fixed to one side of the seating plate, a sensor fixing piece installed perpendicularly to one side of the seating plate, and a detection piece installed on the fixing piece and fixed to the seating plate to drive the driving means. Unloading stacker of the tape remover attached to the wafer frame, characterized in that consisting of a sensor. The method of claim 4, wherein The unloading stacker of the tape remover attached to the wafer frame, characterized in that the long hole is formed perpendicular to the fixing piece to adjust the position of the sensor.