TW202318484A - Production method for frame with film and production method for protective cap - Google Patents

Abstract

A production method for a frame with a film, said frame comprising a glass frame portion 5 having a through portion H, and a film 7 formed on one end surface 5b of the frame portion 5, wherein the production method includes a preparation step in which the frame portion 5 is prepared, and a film formation step S11 in which the film 7 is formed on the one end surface 5b of the frame portion 5 by sputtering a target 11 inside a chamber 10. In the film formation step S11, the pressure inside the chamber 10 during film forming is 0.1 to 1.0 Pa.

Description

Manufacturing method of film-attached frame and manufacturing method of protective cover

The present invention relates to a method of manufacturing a film-attached frame and a method of manufacturing a protective cover.

Electronic devices including electronic components such as LEDs are used in various fields such as lighting and communication for reasons such as long life and energy saving.

In such an electronic device, in order to protect the electronic components, a base material on which the electronic components are mounted is sometimes covered with a protective cover so that the electronic components are housed inside.

As disclosed in, for example, Patent Document 1, the protective cover includes a frame (second member in the same document) surrounding the electronic component and a cover (cover member in the same document) covering one end opening of the frame. [Prior Art Literature] [Patent Document]

[Patent Document 1] International Publication No. 2015/190242

[Problem to be solved by the invention]

The manufacturing process of such an electronic device includes a process of bonding a substrate on which electronic components are mounted and a protective cover. In addition, the manufacturing process of this kind of protective cover includes the procedure of joining the frame part and the cover part.

In the manufacturing process of electronic devices, a film may be formed on one end surface of the frame portion of the protective cover (the end surface opposite to the end surface of the bonded cover portion) for the purpose of improving bonding between the base material and the protective cover.

This film is generally formed on one end surface of the frame portion before bonding the frame portion and the cover portion in the process of manufacturing the protective cover. That is, in this case, in the manufacturing process of the protective cover, the film-attached frame part and the cover part with the film formed on one end surface are bonded. However, the film-attached frame may be warped due to internal stress of the film, and the film-attached frame may have a distorted shape. When the film-attached frame portion is warped in this way, bonding failure between the film-attached frame portion and the cover portion is likely to occur. As a result, there is a possibility that a situation in which the lid portion is peeled off from the frame portion occurs. In addition, when such separation between the frame portion and the cover portion occurs in the state of the electronic device, the airtightness of the housing space of the electronic component is lowered, causing a problem of deterioration of the electronic component.

The object of the present invention is to reliably suppress warping of a film-attached frame portion in which a film is formed on one end surface. [Technical means to solve the problem]

(1) The present invention, made in order to solve the above-mentioned problems, is a method of manufacturing a film-attached frame portion, the film-attached frame portion comprising a glass-made frame portion having a through portion and a film formed on one end surface of the frame portion, The aforementioned manufacturing method of the film-attached frame part includes: a preparation procedure for preparing the frame part; and a film-forming procedure in which a target is sputtered in the chamber to form a film on one end surface of the frame part; The pressure in the room is 0.1~1.0Pa.

The lower limit of the pressure in the chamber during film formation is defined in this way so that the energy of the particles sputtered from the target colliding with the one end surface of the frame is suppressed. Therefore, the internal stress of the film formed on the one end surface of the frame portion is suppressed, and the warp of the film-attached frame portion can be reliably suppressed. Furthermore, setting the upper limit of the pressure in the chamber during film formation in this way can reduce the possibility that impurities in the chamber are mixed into the film formation to deteriorate the characteristics of the film.

(2) The configuration according to the above (1), wherein, preferably, the distance between the target and the frame is 50 to 200 mm in the film forming process.

By increasing the distance between the target and the frame in this way, the energy of the particles sputtered from the target colliding with the one end surface of the frame is suppressed. Therefore, the internal stress of the film formed on the one end surface of the frame portion is suppressed, and the warping of the film-attached frame portion can be more reliably suppressed.

(3) The configuration as described in (1) or (2) above, wherein, preferably, in the film forming process, oxygen gas is introduced into the chamber during film forming to react with the particles sputtered from the target, and the permeated The oxide obtained by this reaction is formed in the frame portion.

When the film is oxidized after film formation, oxygen is subsequently introduced into the film. For this reason, the density of the film increases, internal stress becomes high, and there is a possibility that the film-attached frame portion may warp. Therefore, it is preferable to form a film by forming a pre-oxidized oxide on the frame portion as in the above-mentioned configuration. As long as it is done in this way, it is difficult for the film to be oxidized due to the introduction of oxygen after film formation, and it is possible to more reliably suppress the warping of the film-attached frame.

(4) In the configurations of (1) to (3) above, preferably, the film is formed using atoms having an atomic radius of 0.230 nm or less in the film forming process.

The larger the atomic radius of the atoms forming the film, the higher the internal stress of the film tends to be. That is, the larger the atomic radius of the atoms forming the film is, the higher the possibility of warpage occurring in the film-attached frame portion. Therefore, it is preferable to specify the atomic radius of the atoms forming the film as in the above configuration. In addition, the atomic radius in the present invention refers to the radius of a single atom.

(5) The present invention, made in order to solve the above-mentioned problems, is a method of manufacturing a film-attached frame portion, wherein the film-attached frame portion includes a glass-made frame portion having a through portion and a film formed on one end surface of the frame portion, The aforementioned manufacturing method of the film-attached frame includes: a preparatory procedure for preparing the frame; and a film-forming procedure of sputtering the target in the chamber to form a film on one end surface of the frame; The distance between them is 50~200mm.

As long as it is done in this way, it is possible to enjoy the same function and effect as that of the above-mentioned corresponding configuration.

(6) The present invention, made in order to solve the above-mentioned problems, is a method of manufacturing a film-attached frame portion, the film-attached frame portion comprising a glass-made frame portion having a through portion and a film formed on one end surface of the frame portion, The aforementioned manufacturing method of the film-attached frame part includes: a preparation procedure for preparing the frame part; and a film forming procedure of sputtering a target in the chamber to form a film on one end surface of the frame part; Oxygen gas is introduced into the chamber to react with the particles sputtered from the target, and an oxide obtained through the reaction is formed on the frame portion.

As long as it is done in this way, it is possible to enjoy the same function and effect as that of the above-mentioned corresponding configuration.

(7) The present invention, made in order to solve the above-mentioned problems, is a method of manufacturing a film-attached frame portion, the film-attached frame portion comprising a glass-made frame portion having a through portion and a film formed on one end surface of the frame portion, The aforementioned manufacturing method of the film-attached frame includes: a preparation procedure for preparing the frame; and a film-forming procedure of sputtering a target in the chamber to form a film on one end surface of the frame; in the film-forming procedure, an atomic radius of 0.230 nm or less atoms to form the aforementioned film.

As long as it is done in this way, it is possible to enjoy the same function and effect as that of the above-mentioned corresponding configuration.

(8) In order to solve the above-mentioned problems, the present invention provides a method of manufacturing a protective cover, wherein the protective cover includes a frame made of glass having a penetrating portion and a cover made of glass that closes the penetrating portion, the protective cover The manufacturing method includes: a preparation procedure for preparing a film-attached frame part manufactured by the methods (1) to (7) above as a frame part; The other end face is joined to the cover part in such a way that the through part is blocked.

As long as it is done in this way, the warping of the film-attached frame portion is suppressed, so that the film-attached frame portion and the cover portion are reliably bonded. That is, a protective cover capable of maintaining high airtightness can be provided. [compared to the effect of prior art]

According to the present invention, warping of the film-attached frame portion in which a film is formed on one end surface by sputtering can be reliably suppressed.

FIG. 1 illustrates an electronic device 1 according to one embodiment of the present invention.

The electronic device 1 of the present embodiment includes an electronic component 2 , a base material 3 on which the electronic component 2 is mounted, and a protective cover 4 bonded to the base material 3 so as to accommodate the electronic component 2 inside. In addition, in the following description, for convenience, the side of the base material 3 is described as downward and the side of the protective cover 4 is described as upward, but the vertical direction is not limited to this.

The base material 3 and the protective cover 4 (frame portion 5 ) can be bonded by any method such as laser bonding, soldering, and glass frit bonding.

The electronic component 2 is not particularly limited, and examples include optical devices such as laser modules, LEDs, photosensors, imaging elements, and optical switches. In this embodiment, the electronic component 2 is an ultraviolet LED (light emitting element), and the electronic device 1 is a light emitting device.

The base material 3 is made of, for example, metal, metal oxide ceramics, LTCC or metal nitride ceramics. In terms of metals, for example, copper, metal silicon, etc. In terms of metal oxide ceramics, for example, alumina and the like. In terms of LTCC, for example, one that sinters composite powder containing crystalline glass and refractory filler. In terms of metal nitride ceramics, for example, aluminum nitride and the like. In this embodiment, the base material 3 is made of aluminum nitride.

In the present embodiment, the base material 3 is a plate-shaped body in which both the upper surface 3a and the lower surface 3b are formed of planes. Moreover, the base material 3 may provide the recessed part in the part where the electronic component 2 is mounted among the upper surface 3a.

The protective cover 4 includes a glass frame portion 5 having a through portion (through hole) H, and a glass cover portion 6 joined to the upper end surface 5 a of the frame portion 5 so as to close the through portion H.

The frame portion 5 and the cover portion 6 can be bonded by any method such as laser bonding or glass frit bonding.

In the present embodiment, the film 7 is formed on the lower end surface 5 b of the frame portion 5 . Similarly, the films 8 and 9 are also formed on the upper surface 6 a and the lower surface 6 b of the lid portion 6 . For the films 7, 8, and 9, various functional films can be used, and in this embodiment, it is an antireflection film (AR film). The antireflection film is composed of, for example, a dielectric multilayer film in which low-refractive-index layers with a relatively low refractive index and high-refractive-index layers with a relatively high refractive index are alternately laminated. The films 7, 8, 9 can be formed by eg sputtering. The thickness of the films 7, 8, and 9 is preferably 10 to 500 nm or 20 to 400 nm in order to avoid damage caused by the mismatch of the thermal expansion coefficients of the film and the substrate 3 or the cover 6 while maintaining the strength of the film. , especially preferably 120~230nm.

The frame portion 5 is a cylindrical body having a penetration portion H extending in the thickness direction (vertical direction) at the center. The frame part 5 surrounds the electronic component 2 accommodated in the space corresponding to the penetration part H. As shown in FIG.

In this embodiment, although the frame part 5 is comprised as a square tube, it may be other cylindrical shapes, such as a cylinder.

In this embodiment, although the inner wall surface 5c of the frame part 5 is a non-inclined surface (vertical surface), it is not limited to this. The inner wall surface 5c of the frame portion 5 may also be moved from the inside to the outside as it moves from the lower end surface 5b side of the frame portion 5 toward the upper end surface 5a side in order to improve the extraction efficiency of light (ultraviolet rays) passing through the cover portion 6. composed of inclined surfaces.

The penetration portion H can be formed by performing etching processing, laser processing, sandblasting, or the like on the original material of the frame portion 5 .

The thickness (dimension in the vertical direction) of the frame portion 5 is preferably larger than the electronic component 2, preferably 0.01-1 mm larger than the electronic component 2, more preferably 0.05-0.5 mm larger, most preferably 0.1-0.2 mm larger.

In this embodiment, the cover part 6 is a plate-shaped body which both the upper surface 6a and the lower surface 6b are comprised by the plane. In addition, the cover part 6 may be a curved surface shape in which the upper surface 6a side is convex.

The thickness (dimension in the vertical direction) of the cover portion 6 is 0.1 to 1.0 mm, 0.2 to 0.8 mm, preferably 0.3 to 0.6 mm.

The glass constituting the frame portion 5 and the cover portion 6 is not particularly limited, for example, 50-80% of SiO ₂ , 1-45% of Al ₂ O ₃ +B ₂ O ₃ , and 0-25% of Li ₂ are contained in mass % O+Na ₂ O+K ₂ O, 0~25% MgO+CaO+SrO+BaO.

Next, a method of manufacturing the electronic device 1 configured as above will be described.

As shown in FIG. 2 , the manufacturing method of the electronic device 1 includes: preparing the film-attaching frame portion preparation procedure S1 of the film-attaching frame portion 5 having the film 7 formed on the lower end surface 5b; The film-attached cover part preparation procedure S2 of the film-attached cover part 6 of the film 8, 9; the first joining procedure S3 of obtaining the protective cover 4 by joining the film-attached frame part 5 and the film-attached cover part 6; preparing the mounted electronic component 2 The electronic component-attached substrate preparation procedure S4 of the substrate 3; and the second bonding procedure S5 of obtaining the electronic device 1 by bonding the electronic component-attached substrate 3 and the protective cover 4 . Hereinafter, the film-attached frame portion preparation process (that is, the manufacturing method of the film-attached frame portion 5 ) S1 included in these processes will be described in detail.

The film-attached frame portion preparation procedure S1 includes: a preparation procedure for preparing a frame portion 5 not formed with a film; film-forming procedure S11.

In the film forming step S11 , the target 11 is sputtered in the chamber 10 to form the film 7 on the lower end surface 5 b of the frame portion 5 .

In the film forming procedure S11, the pressure in the chamber 10 during film formation is preferably 0.1-1.0 Pa, 0.2-0.9 Pa, 0.3-0.8 Pa, and more preferably 0.3-0.7 Pa.

The lower limit of the pressure in the chamber 10 during film formation is defined as described above so that the energy of the particles 12 sputtered from the target 11 colliding with the lower end surface 5b of the frame portion 5 is suppressed. Therefore, the internal stress of the film 7 formed on the lower end surface 5b of the frame portion 5 is suppressed, and the warpage of the film-attached frame portion 5 can be suppressed. On the other hand, by setting the upper limit of the pressure in the chamber 10 during film formation as described above, it is possible to reduce the contamination of impurities in the chamber 10 into the film formation.

In the film forming procedure S11, the distance D between the target 11 and the frame portion 5 is preferably 50-200 mm, 60-180 mm, 70-150 mm, more preferably 80-120 mm.

The lower limit of the distance D between the target 11 and the frame portion 5 is defined as described above so that the energy of the particles 12 sputtered from the target 11 colliding with the lower end surface 5 b of the frame portion 5 is suppressed. Therefore, the internal stress of the film 7 formed on the lower end surface 5b of the frame portion 5 is suppressed, and the warpage of the film-attached frame portion 5 can be suppressed. On the other hand, in the sputtering method, when the distance between the target and the object to be film-formed increases, the control of the thickness of the film may become difficult. Therefore, the upper limit of the distance D between the target 11 and the frame portion 5 is defined as described above to facilitate the control of the film thickness of the film 7 formed on the lower end surface 5 b of the frame portion 5 . In addition, the upper limit of the distance D between the target 11 and the frame part 5 is prescribed|regulated as mentioned above so that the avoidable chamber 10 may become larger than necessary.

In the film forming step S11, it is preferable to introduce oxygen gas into the chamber 10 during film formation to react with the particles 12 sputtered from the target 11, and to form oxides obtained by the reaction on the lower part of the frame part 5. End face 5b. That is, in the film forming procedure S11, it is preferable to use the reactive sputtering method.

When the film 7 is oxidized after film formation, oxygen is subsequently introduced into the film 7 . That is, the density of the film 7 increases accordingly, and the internal stress becomes high, and there is a possibility that the film-attached frame portion 5 is warped. For this purpose, it is preferable to form a pre-oxidized oxide on the lower end surface 5b of the frame portion 5 by using a reactive sputtering method. As long as it is done in this way, it is difficult to oxidize the film 7 following the introduction of oxygen after film formation, and it is possible to suppress the warpage of the film-attached frame portion 5 .

In the film-forming procedure S11, it is preferable to use atoms forming the film 7 having an atomic radius of 0.230 nm or less. The atomic radius of the atoms forming the film 7 is more preferably at most 0.220 nm, more preferably at most 0.200 nm, and most preferably at most 0.180 nm.

The larger the atomic radius of the atoms forming the film 7 is, the higher the internal stress of the film 7 tends to be. That is, the larger the atomic radius of the atoms forming the film 7 is, the higher the possibility of warpage occurring in the film-attached frame portion. For this reason, as described above, the upper limit of the atomic radius of the atoms forming the film 7 is preferably specified. The atomic radius of the atoms forming the film 7 can be measured through, for example, an X-ray diffraction device. The atomic radius of the atoms forming the film 7 can be adjusted by, for example, changing the film-forming material. As for the film-forming material (target), the atomic radius of the atoms forming the film 7 is 0.230 nm or less, for example, silicon, hafnium, niobium, or the like.

In addition, as long as the film-attached frame 5 is manufactured as above, the warping of the film-attached frame 5 is suppressed, so that the film-attached frame 5 and the lid 6 can be reliably bonded in the first joining step S3. That is, it is possible to provide the protective cover 4 that can maintain high airtightness. Therefore, a highly reliable electronic device 1 can be manufactured only by using such a protective cover 4 .

In addition, the present invention is not limited to the configuration of the above-mentioned embodiment, nor is it limited to the above-mentioned effects. Various changes can be made in this invention in the range which does not deviate from the summary of this invention.

In the above-mentioned embodiment, although the case where the film 7 is formed only on the lower end surface 5b of the frame portion 5 is described, the film 7 may be formed only on the upper end surface of the frame portion 5 as long as it is formed by a method satisfying the above-mentioned conditions. 5a is formed into a film, and the film may be formed on both the upper end surface 5a and the lower end surface 5b of the frame portion 5 .

In the above-mentioned embodiment, the film 9 on the lower surface 6 b of the cover part 6 may be formed only in the region other than the joint part between the cover part 6 and the frame part 5 . Alternatively, at least one of the films 8 and 9 on the upper surface 6a and the lower surface 6b of the cover portion 6 may be omitted.

In the above-described embodiment, a functional film such as an antireflection film may be formed on the inner wall surface 5 c of the frame portion 5 . [Example]

Hereinafter, although the present invention will be described in detail based on examples, the present invention is not limited to these examples. In addition, in both Examples and Comparative Examples, the frame portion before film formation was made into a square tube of 35 mm square, and the thickness thereof was 0.2 mm. In addition, the warpage of the film-attached frame portion was measured using a laser displacement meter-type warpage measuring device manufactured by Apollo Corporation. In addition, in the case of such a film-attached frame portion, the larger the warp of the frame portion is, the more likely it is to cause poor bonding between the film-attached frame portion and the cover portion.

(1) Pressure in the chamber It was measured how the warpage of the film-attached frame portion after film formation changes when the pressure in the chamber during film formation is changed. The results are shown in Table 1. Sample No.1-2 are examples, and sample No.3 is a comparative example. In any of samples No.1~3, the distance between the target and the frame is set to 80mm, and the film-forming material (target) is silicon and hafnium.

From Table 1, it can be confirmed that when the pressure in the chamber during film formation exceeds 0.05 Pa, the warpage of the film-attached frame portion decreases.

(2) Distance between target and frame How the warpage of the film-attached frame portion after film formation changes when the distance between the target and the frame portion during film formation is changed was measured. The results are shown in Table 2. Sample No.4-5 are examples, and sample No.6 is a comparative example. In any of samples No. 4 to 6, the pressure in the chamber during film formation was set to 0.30 Pa, and the film formation materials (targets) were silicon and hafnium.

From Table 2, it was confirmed that the warpage of the film-coated frame portion decreased when the distance between the target and the frame portion at the time of film formation exceeded 40 mm.

(3) Film forming method How the warpage of the film-attached frame portion after film formation changes when the film formation method is changed was measured. The results are shown in Table 3. Sample No. 7 is an example, and sample No. 8 is a comparative example. In sample No. 7 (Example), the following reactive sputtering method was used: during film formation, oxygen gas was introduced into the chamber to react with the particles sputtered from the target, and the obtained The oxide is formed on the frame portion. In sample No. 8 (comparative example), a non-reactive sputtering method in which particles sputtered from a target were formed on a frame portion was employed. In any of samples No.7~8, the pressure in the chamber during film formation was set to 0.30Pa, the distance between the target and the frame was set to 80mm, and the film-forming materials (targets) were silicon and hafnium.

From Table 3, it can be confirmed that the warpage of the film-attached frame portion was reduced by using one of the reactive sputtering methods.

(4) Film-forming materials It was measured how the warpage of the film-attached frame portion after film formation changed when the atomic radius of the atoms of the film formed on the film-attached frame portion was different due to the change of the film-forming material. The results are shown in Table 4. Sample No. 9 is an example, and sample No. 10 is a comparative example. In Sample No. 9 (Example), aluminum was used as a film-forming material (target). In sample No. 10 (comparative example), cesium was used as a film-forming material (target). In any of sample Nos. 9 to 10, the pressure in the chamber during film formation was 0.30 Pa, and the distance between the target and the frame was 80 mm.

From Table 4, it was confirmed that when the atomic radius of the atoms forming the film was less than 0.265 nm, the warpage of the film-attached frame portion was reduced.

1: Electronic device 2: Electronic parts 3: Substrate 4: Protective cover 5: frame 6: Cover 7: Membrane 8: Membrane 9: Membrane 10: chamber 11: target 12: Sputtering particles D: distance H: through part S1: Preparing procedures for the attached film frame S2: Preparation procedure for the membrane cap S3: the first bonding procedure (bonding of the frame portion with the film and the frame portion with the lid) S4: Attached electronic parts base material preparation procedure S5: Second bonding procedure (bonding of base material with electronic parts and protective cover) S11: Film forming procedure

[ Fig. 1 ] is a cross-sectional view illustrating an electronic device according to this embodiment. [ FIG. 2 ] is a flow chart illustrating a method of manufacturing an electronic device according to this embodiment. [ Fig. 3] Fig. 3 is a cross-sectional view illustrating a film forming process included in the film-attached frame preparation process of Fig. 2 .

5: frame

5a: Upper end face

5b: Lower end face

7: Membrane

10: chamber

11: target

12: Sputtering particles

D: distance

S11: Film forming procedure

Claims (8)

A method of manufacturing a film-attached frame, wherein the film-attached frame includes a glass frame having a through portion and a film formed on one end surface of the frame, and the manufacturing method of the film-attached frame includes: Prepare the preparatory procedures for the aforementioned frame; A film forming process of sputtering a target in a chamber to form the film on the one end surface of the frame; and In the aforementioned film forming process, the pressure in the aforementioned chamber during film forming is 0.1-1.0 Pa. The method of manufacturing a film-attached frame according to claim 1, wherein, in the film forming process, the distance between the target and the frame is 50-200 mm. The method of manufacturing a film-attached frame according to claim 1 or 2, wherein, in the film forming process, oxygen gas is introduced into the chamber during film formation to react with the particles sputtered from the target, and the transmitted The oxide obtained by this reaction is formed in the aforementioned frame portion. The method of manufacturing a film-attached frame according to any one of claims 1 to 3, wherein, in the film forming process, the film is formed using atoms with an atomic radius of 0.230 nm or less. A method of manufacturing a film-attached frame, wherein the film-attached frame includes a glass frame having a through portion and a film formed on one end surface of the frame, and the manufacturing method of the film-attached frame includes: Prepare the preparatory procedures for the aforementioned frame; and A film-forming procedure in which the target is sputtered in the chamber to form the aforementioned film on the aforementioned one end surface of the aforementioned frame portion; In the aforementioned film forming process, the distance between the aforementioned target and the aforementioned frame portion is 50-200 mm. A method of manufacturing a film-attached frame, wherein the film-attached frame includes a glass frame having a through portion and a film formed on one end surface of the frame, and the manufacturing method of the film-attached frame includes: Prepare the preparatory procedures for the aforementioned frame; and A film-forming procedure in which the target is sputtered in the chamber to form the aforementioned film on the aforementioned one end surface of the aforementioned frame portion; In the film forming step, oxygen gas is introduced into the chamber during film formation to react with particles sputtered from the target, and an oxide obtained by the reaction is formed on the frame portion. A method of manufacturing a film-attached frame, wherein the film-attached frame includes a glass frame having a through portion and a film formed on one end surface of the frame, and the manufacturing method of the film-attached frame includes: Prepare the preparatory procedures for the aforementioned frame; and A film-forming procedure in which the target is sputtered in the chamber to form the aforementioned film on the aforementioned one end surface of the aforementioned frame portion; In the film-forming procedure, the film is formed using atoms having an atomic radius of 0.230 nm or less. A method of manufacturing a protective cover. The protective cover includes a glass frame portion having a through portion and a glass cover portion closing the through portion. The manufacturing method of the protective cover includes: As the aforementioned frame portion, a preparation procedure for preparing the aforementioned film-attached frame portion manufactured by a method as in any one of claims 1 to 7; and A bonding process of bonding the cover portion to the other end surface of the film-attached frame portion on the opposite side to the one end surface on which the film is formed so that the penetration portion is blocked.

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