TW202313839A - 樹脂組合物、電子部件用黏合劑、其固化物以及電子部件 - Google Patents

樹脂組合物、電子部件用黏合劑、其固化物以及電子部件 Download PDF

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Publication number
TW202313839A
TW202313839A TW111132988A TW111132988A TW202313839A TW 202313839 A TW202313839 A TW 202313839A TW 111132988 A TW111132988 A TW 111132988A TW 111132988 A TW111132988 A TW 111132988A TW 202313839 A TW202313839 A TW 202313839A
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TW
Taiwan
Prior art keywords
resin composition
component
compound
groups
adhesive
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Application number
TW111132988A
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English (en)
Chinese (zh)
Inventor
上地宏樹
上杉陽平
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日商納美仕有限公司
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Application filed by 日商納美仕有限公司 filed Critical 日商納美仕有限公司
Publication of TW202313839A publication Critical patent/TW202313839A/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
    • C08G75/02—Polythioethers
    • C08G75/04—Polythioethers from mercapto compounds or metallic derivatives thereof
    • C08G75/045—Polythioethers from mercapto compounds or metallic derivatives thereof from mercapto compounds and unsaturated compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2170/00—Compositions for adhesives

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW111132988A 2021-09-15 2022-08-31 樹脂組合物、電子部件用黏合劑、其固化物以及電子部件 TW202313839A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-149897 2021-09-15
JP2021149897 2021-09-15

Publications (1)

Publication Number Publication Date
TW202313839A true TW202313839A (zh) 2023-04-01

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TW111132988A TW202313839A (zh) 2021-09-15 2022-08-31 樹脂組合物、電子部件用黏合劑、其固化物以及電子部件

Country Status (6)

Country Link
EP (1) EP4403596A4 (https=)
JP (1) JPWO2023042600A1 (https=)
KR (1) KR20240054979A (https=)
CN (1) CN117940488A (https=)
TW (1) TW202313839A (https=)
WO (1) WO2023042600A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202544138A (zh) * 2024-03-04 2025-11-16 日商納美仕有限公司 樹脂組成物、接著劑、密封材、硬化物、半導體裝置及電子零件

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5311744B2 (ja) 2007-01-29 2013-10-09 地方独立行政法人 大阪市立工業研究所 紫外線硬化性樹脂組成物、当該硬化物、およびこれらから誘導される各種物品
JP2010117545A (ja) 2008-11-13 2010-05-27 Asahi Kasei E-Materials Corp 感光性樹脂組成物及びその用途
JP4976575B1 (ja) * 2011-07-07 2012-07-18 ナミックス株式会社 樹脂組成物
JP6329030B2 (ja) * 2014-08-25 2018-05-23 ナミックス株式会社 接着剤
JP6699145B2 (ja) * 2015-11-30 2020-05-27 味の素株式会社 光および熱硬化性樹脂組成物
JP2019508549A (ja) * 2016-02-16 2019-03-28 ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング ナノ結晶エポキシチオール（メタ）アクリレート複合材料およびナノ結晶エポキシチオール（メタクリレート）複合フィルム
JP6864436B2 (ja) 2016-03-24 2021-04-28 ナミックス株式会社 樹脂組成物、接着剤、硬化物、半導体装置
JP6810659B2 (ja) 2017-06-06 2021-01-06 日本化薬株式会社 電子部品用樹脂組成物
US20200347227A1 (en) * 2018-01-30 2020-11-05 Namics Corporation Resin composition and cured material of same, adhesive, semiconductor device, and electronic component
CN111040644A (zh) * 2018-10-15 2020-04-21 烟台德邦科技有限公司 一种可光催化聚合的丙烯酸酯结构胶
JP7593042B2 (ja) * 2019-10-31 2024-12-03 味の素株式会社 硬化性組成物
JP7552221B2 (ja) * 2019-10-31 2024-09-18 味の素株式会社 硬化性組成物

Also Published As

Publication number Publication date
WO2023042600A1 (ja) 2023-03-23
KR20240054979A (ko) 2024-04-26
CN117940488A (zh) 2024-04-26
EP4403596A1 (en) 2024-07-24
EP4403596A4 (en) 2025-08-13
JPWO2023042600A1 (https=) 2023-03-23

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