TW202311346A - 聚馬來醯亞胺化合物、硬化性組成物、硬化物、預浸漬物、電路基板、增層薄膜、半導體封裝材料及半導體裝置 - Google Patents
聚馬來醯亞胺化合物、硬化性組成物、硬化物、預浸漬物、電路基板、增層薄膜、半導體封裝材料及半導體裝置 Download PDFInfo
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- TW202311346A TW202311346A TW111124209A TW111124209A TW202311346A TW 202311346 A TW202311346 A TW 202311346A TW 111124209 A TW111124209 A TW 111124209A TW 111124209 A TW111124209 A TW 111124209A TW 202311346 A TW202311346 A TW 202311346A
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- aromatic
- polymaleimide
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| WO2024090408A1 (ja) * | 2022-10-26 | 2024-05-02 | 三菱瓦斯化学株式会社 | 樹脂組成物、硬化物、プリプレグ、金属箔張積層板、樹脂複合シート、および、プリント配線板 |
| WO2024090409A1 (ja) * | 2022-10-27 | 2024-05-02 | 三菱瓦斯化学株式会社 | 樹脂組成物、硬化物、プリプレグ、金属箔張積層板、樹脂複合シート、および、プリント配線板 |
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| JP2633908B2 (ja) * | 1988-05-19 | 1997-07-23 | 三井東圧化学株式会社 | ポリマレイミド化合物およびその製造方法 |
| JP3033327B2 (ja) | 1992-03-06 | 2000-04-17 | 住友化学工業株式会社 | 熱硬化性樹脂組成物およびそれを用いた銅張り積層板 |
| JP2000053750A (ja) * | 1998-08-06 | 2000-02-22 | Mitsui Chemicals Inc | Ｎ−アリル化芳香族アミン樹脂、その製造方法および用途 |
| US20210284800A1 (en) * | 2018-09-12 | 2021-09-16 | Nipponkayaku Kabushiki Kaisha | Maleimide resin, curable resin composition, and cured product thereof |
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| JP7160151B1 (ja) | 2022-10-25 |
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