TWI847640B - 硬化性組成物、硬化物、預浸漬物、電路基板、增層薄膜、半導體封裝材料及半導體裝置 - Google Patents

硬化性組成物、硬化物、預浸漬物、電路基板、增層薄膜、半導體封裝材料及半導體裝置

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Publication number
TWI847640B
TWI847640B TW112112195A TW112112195A TWI847640B TW I847640 B TWI847640 B TW I847640B TW 112112195 A TW112112195 A TW 112112195A TW 112112195 A TW112112195 A TW 112112195A TW I847640 B TWI847640 B TW I847640B
Authority
TW
Taiwan
Prior art keywords
prepreg
build
film
circuit board
packaging material
Prior art date
Application number
TW112112195A
Other languages
English (en)
Other versions
TW202346407A (zh
Inventor
橋本慎太郎
青山和賢
下野智弘
Original Assignee
日商Ｄｉｃ股份有限公司
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Publication date
Application filed by 日商Ｄｉｃ股份有限公司 filed Critical 日商Ｄｉｃ股份有限公司
Publication of TW202346407A publication Critical patent/TW202346407A/zh
Application granted granted Critical
Publication of TWI847640B publication Critical patent/TWI847640B/zh

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TW112112195A 2022-03-31 2023-03-30 硬化性組成物、硬化物、預浸漬物、電路基板、增層薄膜、半導體封裝材料及半導體裝置 TWI847640B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-061372 2022-03-31
JP2022061372 2022-03-31

Publications (2)

Publication Number Publication Date
TW202346407A TW202346407A (zh) 2023-12-01
TWI847640B true TWI847640B (zh) 2024-07-01

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202000784A (zh) 2018-06-27 2020-01-01 日商三菱瓦斯化學股份有限公司 樹脂組成物及其應用

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202000784A (zh) 2018-06-27 2020-01-01 日商三菱瓦斯化學股份有限公司 樹脂組成物及其應用

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