TW202308920A - Transmission mechanism, testing equipment, detecting method, and handler using the same - Google Patents
Transmission mechanism, testing equipment, detecting method, and handler using the same Download PDFInfo
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Description
本發明提供一種可提高輸送使用效能之輸送機構。The invention provides a conveying mechanism capable of improving conveying efficiency.
在現今,電子元件測試裝置以移料器於輸送機構之入料載台取出待測之電子元件,並移入測試座而執行電性測試作業。然,入料載台以容置部承置電子元件,並輸送電子元件至測試座之側方,移料器由皮帶輪組及移載臂等帶動作Y方向位移,由測試區位移至入料載台上方以取出電子元件,再直接將電子元件移入測試座,令電子元件之接點與測試座之探針相接觸而執行電性測試作業。At present, electronic component testing devices use a material shifter to take out electronic components to be tested from the loading platform of the conveying mechanism, and move them into the test socket to perform electrical testing operations. However, the loading platform uses the accommodating part to hold the electronic components, and transports the electronic components to the side of the test seat. The material shifter is driven by the pulley set and the transfer arm to move in the Y direction, and moves from the testing area to the feeding The electronic components are taken out from the top of the stage, and then the electronic components are directly moved into the test socket, so that the contacts of the electronic components are in contact with the probes of the test socket to perform electrical testing.
惟,入料載台之容置部尺寸大於電子元件之尺寸,入料載台輸送電子元件之過程中,電子元件易於容置部內滑移,以致移料器拾取之電子元件的位置發生偏移問題;又移料器於移載電子元件之過程中,易因移動誤差或本身結構組裝誤差等因素,亦會發生移料器拾取之電子元件的位置偏移問題,基於前述問題,均無法使電子元件之接點與測試座之探針精準接觸,以致影響測試品質;尤其電子元件日趨精密微小,精準度要求相當高,若移料器移載之電子元件稍有偏移,即無法使電子元件準確執行測試作業而降低測試品質。However, the size of the accommodating part of the loading platform is larger than the size of the electronic components. During the process of conveying the electronic components on the loading platform, the electronic components are easy to slip in the accommodating part, so that the position of the electronic components picked up by the material shifter is shifted. Problem; In addition, in the process of transferring electronic components, the material shifter is prone to shifting the position of the electronic components picked up by the material shifter due to factors such as movement errors or structural assembly errors. Based on the aforementioned problems, it is impossible to use The contacts of the electronic components are in precise contact with the probes of the test socket, which affects the quality of the test; especially the electronic components are becoming more and more sophisticated, and the precision requirements are quite high. If the electronic components transferred by the material shifter are slightly shifted, the electronic Components perform test tasks accurately and reduce test quality.
本發明之目的一,提供一種輸送機構,包含至少一第一輸送器及至少一取像器,第一輸送器設有第一驅動源及第一載台,第一驅動源驅動第一載台沿第一路徑位移於第一作業區及第二作業區而供載送電子元件,取像器裝配於第一載台,並由第一載台載送至第二作業區,以供對第二作業區之移料器上的電子元件執行取像作業,而檢知電子元件是否偏移,以利移料器調整且精準移載電子元件,進而提高輸送使用效能。The first object of the present invention is to provide a conveying mechanism, including at least one first conveyer and at least one image picker, the first conveyer is provided with a first driving source and a first stage, and the first driving source drives the first stage Displaced along the first path in the first operation area and the second operation area for carrying electronic components, the image picker is assembled on the first stage, and is carried by the first stage to the second operation area for the second operation area The electronic components on the shifter in the second work area perform imaging operations to detect whether the electronic components are offset, so as to facilitate the adjustment of the shifter and accurately transfer the electronic components, thereby improving the efficiency of transportation.
本發明之目的二,提供一種輸送機構,其第一輸送器裝配取像器 ,於第一輸送器執行承載電子元件而位移至第二作業區之同時,可同步載送取像器至第二作業區,以有效縮減取像器驅動源之配置及簡化作動時序,進而有效節省機構成本及利於空間配置。 The second object of the present invention is to provide a conveying mechanism whose first conveyer is equipped with an image picker , while the first conveyor carries the electronic components and moves to the second working area, it can simultaneously carry the image picker to the second working area, so as to effectively reduce the configuration of the drive source of the image picker and simplify the sequence of actions, thereby effectively Save institutional costs and facilitate space allocation.
本發明之目的三,提供一種測試裝置,包含至少一測試器及本發明輸送機構,至少一測試器設有電性連接之傳輸件及電路板,以供測試電子元件,本發明輸送機構設有至少一第一輸送器及至少一取像器,更包含至少一移料器,至少一移料器可沿第二路徑位移至第二作業區而移載電子元件,第一輸送器沿第一路徑位移於第一作業區及第二作業區而供載送電子元件,取像器裝配於第一載台,並由第一載台載送至第二作業區,以供對第二作業區之移料器上的電子元件執行取像作業,而檢知電子元件是否偏移,以利移料器調整且精準移載電子元件,使電子元件之接點精準對位測試器之傳輸件,進而提高測試品質。The third object of the present invention is to provide a test device, including at least one tester and the conveying mechanism of the present invention, at least one tester is provided with an electrically connected transmission member and a circuit board for testing electronic components, and the conveying mechanism of the present invention is provided with At least one first conveyor and at least one image pickup device further include at least one material shifter, at least one material shifter can move to the second working area along the second path to transfer electronic components, the first conveyor moves along the first The path is located in the first work area and the second work area for carrying electronic components, and the image picker is assembled on the first stage, and is carried by the first stage to the second work area for the second work area The electronic components on the material shifter perform imaging operations to detect whether the electronic components are offset, so as to facilitate the adjustment of the material shifter and accurately transfer the electronic components, so that the contacts of the electronic components can be accurately aligned with the transmission parts of the tester. Thus improving the test quality.
本發明之目的四,提供一種檢知方法,包含拾料手段、輸送取像手段、待位承載手段及比對手段;拾料手段以移料器拾取電子元件;輸送取像手段以第一輸送器載送取像器位移至第二作業區,以取像移料器之電子元件;待位承載手段於取像器取像完畢後,第一輸送器位於第二作業區以供移料器移入或移出電子元件;比對手段以處理器接收取像器傳輸之電子元件取像資料,以判斷電子元件是否偏移,並補償調整電子元件之位置,使移料器精準移載電子元件。The fourth object of the present invention is to provide a detection method, including means for picking up materials, means for conveying images, means for holding positions and comparing means; means for picking up materials is to pick up electronic components with a material shifter; The carrier conveys the image picker to move to the second working area to pick up the electronic components of the material shifter; after the position-carrying means finishes taking the image of the image picker, the first conveyor is located in the second working area for the material shifter Moving in or out of electronic components; the comparison method uses the processor to receive the electronic component imaging data transmitted by the image picker to determine whether the electronic components are offset, and compensate and adjust the position of the electronic components, so that the material shifter can accurately transfer the electronic components.
本發明之目的五,提供一種檢知方法,更包含移料取像手段,移料取像手段以移料器沿第二路徑位移,並搭配第一輸送器載送取像器沿第一路徑位移,使取像器可取像電子元件之不同區塊,以供更精準分析電子元件之位置偏移值,進而更加提高檢知精準性。The fifth object of the present invention is to provide a detection method, which further includes a means for moving the material and taking the image. The means for moving the material and taking the image is displaced along the second path by the material shifter, and the first conveyor is used to carry the image picker along the first path. Displacement enables the imager to capture images of different blocks of electronic components for more accurate analysis of the positional offset of electronic components, thereby further improving detection accuracy.
本發明之目的六,提供一種作業機,包含機台、供料裝置、收料裝置、具本發明輸送機構之測試裝置及中央控制裝置,供料裝置配置於機台,並設有至少一供料容置器,以供容置至少一待測電子元件;收料裝置配置於機台,並設有至少一收料容置器,以供容置至少一已測電子元件;測試裝置配置於機台,並設有至少一測試器及本發明輸送機構,至少一測試器以供測試電子元件,本發明輸送機構設有至少一第一輸送器、至少一取像器及至少一移料器 ,移料器以供移載電子元件,第一輸送器及裝配其上之取像器,以供輸送電子元件及檢知移料器上之電子元件位置;中央控制裝置以控制及整合各裝置作動而執行自動化作業。 The sixth object of the present invention is to provide a working machine, which includes a machine platform, a feeding device, a material receiving device, a testing device with a conveying mechanism of the present invention, and a central control device. The feeding device is arranged on the machine platform and is provided with at least one supply A material container for accommodating at least one electronic component to be tested; the material receiving device is arranged on the machine table, and at least one material container is provided for accommodating at least one electronic component to be tested; the testing device is arranged in The machine platform is provided with at least one tester and the conveying mechanism of the present invention, at least one tester is used for testing electronic components, and the conveying mechanism of the present invention is provided with at least one first conveyer, at least one image picker and at least one material shifter , the material shifter is used to transfer electronic components, the first conveyor and the image picker mounted on it are used to transport electronic components and detect the position of electronic components on the material transfer device; the central control device is used to control and integrate various devices actuate to perform automated operations.
為使 貴審查委員對本發明作更進一步之瞭解,茲舉一較佳實施例並配合圖式,詳述如後:In order to make your review committee members have a further understanding of the present invention, hereby give a preferred embodiment and cooperate with the drawings, as follows in detail:
請參閱圖1,本發明之作業機包含機台10、供料裝置20、收料裝置30、具本發明輸送機構之測試裝置40及中央控制裝置(圖未示出)。Referring to Fig. 1, the working machine of the present invention includes a
供料裝置20配置於機台10,並設有至少一供料容置器21,以供容置至少一待測電子元件;收料裝置30配置於機台10,並設有至少一收料容置器31,以供容置至少一已測電子元件;中央控制裝置(圖未示出)以控制及整合各裝置作動而執行自動化作業。The
測試裝置40配置於機台10,並設有至少一測試器及本發明輸送機構;至少一測試器以供測試電子元件,更進一步,測試器具有電性連接之電路板及傳輸件(如探針),電路板本身可具有測試程式,或者電性連接一測試機;於本實施例,測試器設有電性連接之電路板41及具有複數支探針之測試座42,測試座42供承置及測試電子元件。The
再者,測試裝置40設置一測試室,以供測試器位於測試室內而執行測試作業;測試室可裝配至少一輸送管(圖未示出),以供輸送乾燥空氣至測試室,使電子元件(圖未示出)位於模擬日後使用環境溫度之測試室執行冷測作業。然依作業需求,於熱測作業時,測試室內可配置鼓風機(圖未示出),以供吹送熱風,使測試室之內部升溫,亦無不可。Furthermore, the
本發明輸送機構包含至少一第一輸送器43及至少一取像器44;第一輸送器43設有第一驅動源431及第一載台432,第一驅動源431驅動第一載台432沿第一路徑位移於第一作業區A1及第二作業區A2而供載送電子元件,取像器44裝配於第一載台432,並由第一載台432載送至第二作業區A2,以供對第二作業區A2之移料器上的電子元件執行取像作業,而檢知電子元件是否偏移,以利移料器調整且精準移載電子元件。The conveying mechanism of the present invention includes at least one
更進一步,第一輸送器43可承載已測電子元件、待測電子元件,或者承載已測電子元件及待測電子元件。第一路徑可位於測試座42之側方或上方;舉例第一路徑位於測試座42之側方,第一輸送器43沿第一路徑(如X方向)位移至測試座42之側方,以供移料器作Y-Z方向位移於第一輸送器43與測試座間移載取放電子元件;舉例第一路徑位於測試座42之上方,第一輸送器43沿第一路徑位移至測試座42之上方,以供測試座42上方之移料器作Z方向位移取放電子元件。Furthermore, the
更進一步,第一驅動源431可為線性馬達或包含馬達及至少一傳動組;舉例第一驅動源431包含馬達及一為皮帶輪組之傳動組,舉例第一驅動源431為線性馬達,線性馬達包含複數個定子及至少一轉子,以供轉子作線性位移
。第一載台432可為平板或具容置部(如凹槽)之台座,平板可具有定位部件(如吸孔),以定位電子元件;於本實施例,第一輸送器43供承載已測之電子元件,第一驅動源431為線性馬達,並配置於第一路徑(如X方向),而位於測試座42之側方,第一驅動源431連結驅動一具第一容置部4321之第一載台432沿第一路徑位移於第一作業區A1與第二作業區A2,使第一載台432以第一容置部4321於第二作業區A2供承置已測之電子元件。然,本實施例之第一作業區A1為出料區,第二作業區A2為位於測試座42側方之待位區,換言之,依作業需求,當第一載台432沿第一路徑位移至測試座42之上方,測試座42上方之區域即為第二作業區A2。
Furthermore, the
取像器44裝配於第一輸送器43之第一載台432,並由第一載台432載送至第二作業區A2,以供對第二作業區A2之移料器上的電子元件執行取像作業;更進一步,取像器44可裝配於第一載台432之非承置電子元件的任一部位,例如裝配於第一載台432之側方或頂面;更進一步,取像器44可直接由下向上取像移料器上的電子元件,或者搭配菱鏡使用而取像電子元件,亦無不可。於本實施例,取像器44為一CCD,並裝配於第一輸送器43之第一載台432的前側,以供由下向上取像移料器上的電子元件。The
依作業需求,輸送機構更包含至少一移料器,至少一移料器可沿第二路徑位移至第二作業區A2移載電子元件;再者,移料器更包含溫控單元( 圖未示出),溫控單元於移料器設置至少一溫控件,以供溫控電子元件;更進一步,溫控件可為加熱件、致冷晶片或具流體之座體。 According to operation requirements, the conveying mechanism further includes at least one material shifter, and at least one material shifter can be displaced along the second path to the second operation area A2 to transfer electronic components; moreover, the material shifter further includes a temperature control unit ( Not shown in the figure), the temperature control unit is provided with at least one temperature control on the material shifter for temperature control of electronic components; further, the temperature control can be a heating element, a cooling chip or a seat with fluid.
於本實施例,輸送機構更包含第二輸送器45、第一移料器46、第二移料器47及第三移料器48。In this embodiment, the conveying mechanism further includes a
第二輸送器45包含第二驅動源451及第二載台452,第二驅動源451驅動一具第二容置部4521之第二載台452沿第一路徑位移,並以第二容置部4521供承載待測之電子元件;更進一步,第二驅動源451及第一驅動源431可分別為獨立之驅動源,以分別帶動第二載台452或第一載台432各別獨立位移;或者第二驅動源451與第一驅動源431可為同一驅動源(例如同一驅動源為線性馬達
,線性馬達以複數個定子驅動二轉子作動,二轉子分別帶動第一載台432及第二載台452位移),以帶動第二載台452及第一載台432位移。再者,取像器44亦可裝配於第二輸送器45,於第二輸送器45沿第一路徑位移時,並帶動取像器44同步位移,使取像器44於第二作業區A2取像第二移料器47上之電子元件,亦無不可。
The
於本實施例,第二驅動源451為獨立之驅動源,並配置於第一路徑,而位於測試座42之側方,以連結驅動第二載台452沿第一路徑(如X方向)位移於第三作業區A3與第二作業區A2。然,本實施例之第三作業區A3為供料區
,換言之,依作業需求,當第一載台432沿第一路徑位移至測試座42之上方,測試座42側方之區域即為第一作業區A1及第三作業區A3,以供移入待測電子元件及取出已測電子元件。
In this embodiment, the
第一移料器46可作第一、二、三方向(如X-Y-Z方向)位移,以供於供料裝置20及位於第三作業區A3之第二輸送器45間移載待測之電子元件。第二移料器47可作第二、三方向(如Y-Z方向)位移,以供於測試座42與位於第二作業區A2之第一輸送器43或第二輸送器45移載待測電子元件或已測電子元件,第二移料器47上之待測電子元件並供位於第二作業區A2之取像器44執行取像作業
;更進一步,第二移料器47可視作業需求,而執行移載及壓接動作,以壓接電子元件於測試座42執行測試作業;又第二移料器47可視作業需求,更包含溫控單元(圖未示出),溫控單元於移料器設置至少一溫控件,以供溫控電子元件;於本實施例,第二移料器47可執行移載待測電子元件及已測電子元件,並壓接待測電子元件於測試座42執行測試作業。第三移料器48可作第一、二、三方向(如X-Y-Z方向)位移,以供於收料裝置30及位於第一作業區A1之第一輸送器43間移載已測之電子元件。
The
請參閱圖2~8,一種檢知方法,包含拾料手段、輸送取像手段、待位承載手段及比對手段;拾料手段以移料器拾取電子元件;輸送取像手段以第一輸送器載送取像器位移至第二作業區,以取像移料器之電子元件;待位承載手段於取像器取像完畢後,第一輸送器位於第二作業區以供移料器移入或移出電子元件;比對手段以處理器接收取像器傳輸之電子元件取像資料,以判斷電子元件是否偏移,並補償調整電子元件之位置,使移料器精準移載電子元件。Please refer to Figures 2 to 8, a detection method, including the means of picking up materials, the means of conveying images, the means of holding positions and the means of comparison; the means of picking up materials is to pick up electronic components with a material shifter; The carrier conveys the image picker to move to the second working area to pick up the electronic components of the material shifter; after the position-carrying means finishes taking the image of the image picker, the first conveyor is located in the second working area for the material shifter Moving in or out of electronic components; the comparison method uses the processor to receive the electronic component imaging data transmitted by the image picker to determine whether the electronic components are offset, and compensate and adjust the position of the electronic components, so that the material shifter can accurately transfer the electronic components.
承上述,更包含移料取像手段,移料取像手段以移料器作第二方向位移,並搭配第一輸送器載送取像器作第一方向位移,使取像器可取像電子元件之不同區塊,以供更精準分析電子元件之位置偏移值,進而提高檢知精準性。Based on the above, it also includes the material transfer and image acquisition means. The material transfer and image acquisition means uses the material transfer device for displacement in the second direction, and cooperates with the first conveyor to carry the image pickup device for displacement in the first direction, so that the image pickup device can capture electronic images. The different blocks of the components are used for more accurate analysis of the position offset value of the electronic components, thereby improving the detection accuracy.
於執行拾料手段前,本發明之檢知方法更包含前置供料手段,前置供料手段以第二輸送器45輸送待測之電子元件,以供移料器拾取待測之電子元件;於本實施例,第一移料器46作X-Y-Z方向位移,於供料裝置20之供料容置器21取出待測之電子元件,並移載至第三作業區A3,將待測之電子元件移入第二輸送器45之第二載台452的第二容置部4521,第二載台452沿第一路徑位移將待測之電子元件由第三作業區A3輸送至第二作業區A2,並位於測試座42之側方。Before performing the pick-up means, the detection method of the present invention further includes a pre-feeding means, and the pre-feeding means uses the
拾料手段以移料器拾取電子元件;於本實施例,第二移料器47作Y-Z方向位移,於第二輸送器45之第二載台452取出待測之電子元件,第二載台452作反向位移復位。輸送取像手段以第一輸送器載送取像器位移至第二作業區,以取像移料器之電子元件;更佳者,檢知方法具有移料取像手段,移料取像手段以移料器沿第二路徑位移,並搭配第一輸送器載送取像器沿第一路徑位移,使取像器可取像電子元件之不同區塊,以供更精準分析電子元件之位置偏移值,進而提高檢知精準性;於本實施例,輸送取像手段以第一輸送器43之第一驅動源431驅動第一載台432沿第一路徑位移,並帶動裝配於上之取像器44同步由第一作業區A1位移至第二作業區A2,由於取像器44裝配於第一載台432之前側,取像器44可先位移至第二作業區A2,以對第二移料器47拾取之電子元件執行取像作業;然取像器44作X方向位移,第二移料器47可搭配作Y方向位移,使取像器44由下向上取像電子元件之不同區塊,以獲得更多取像資料而供分析比對。The pick-up means picks up the electronic components with a material shifter; in this embodiment, the
待位承載手段於取像器取像完畢後,第一輸送器位於第二作業區A2以供移料器移入或移出電子元件;於本實施例,取像器44取像第二移料器47上之電子元件完畢後,第一輸送器43之第一驅動源431驅動第一載台432再沿第一路徑位移,令第一載台432空的第一容置部4231先行待位於第二移料器47之放料位置,以待第二移料器47作Y-Z位移而移入已測之電子元件;因此,第一載台432沿第一路徑位移而執行承載已測電子元件之動作前,可先行載送取像器44對第二移料器47上之電子元件執行取像作業,不僅縮減取像器驅動用元件,並有效簡化取像作動時序,進而節省成本及提高使用效能。After the position-carrying means finishes taking the image by the image picker, the first conveyor is located in the second operation area A2 for the material shifter to move in or out of the electronic components; in this embodiment, the
比對手段以處理器(圖未示出)接收取像器44傳輸之電子元件取像資料,以判斷電子元件是否偏移,並補償調整電子元件之位置,使移料器精準移載電子元件;於本實施例,比對手段以處理器接收取像器44傳輸之電子元件取像資料,將電子元件取像資料與一資料庫(圖未示出)內之電子元件樣本資料作比對,以判斷電子元件是否偏移,若偏移值為零,則毋需調整電子元件之位置,若偏移值非為零,則將偏移值補償調整電子元件之位置,第二移料器47調整電子元件之位置後,第二移料器47將電子元件移入且壓接於測試座42,使得電子元件之複數個接點精準對位測試座42之複數個探針而執行測試作業。The comparison method uses the processor (not shown in the figure) to receive the electronic component imaging data transmitted by the
由於第一輸送器43之第一載台432空的第一容置部4231已先行待位於第二移料器47之放料位置,於電子元件測試完畢,第二移料器47作Y-Z方向位移而移出測試座42之已測電子元件,並將已測電子元件移入第一載台432之第一容置部4231,第一輸送器43之第一驅動器431驅動一承載該已測電子元件之第一載台432及裝配其上之取像器44同步沿第一路徑作反向位移,由第二作業區A2位移至第一作業區A1(即出料區),取像器44離開第二作業區A2,第一載台432載出已測電子元件,第三移料器48作X-Y-Z方向位移至第一作業區A1(即出料區)
,並於第一載台432取出已測電子元件,依測試結果,將已測電子元件移載至收料裝置30之收料容置器31而分類收置。
Since the empty first accommodating part 4231 of the
10:機台 20:供料裝置 21:供料容置器 30:收料裝置 31:收料容置器 40:測試裝置 41:電路板 42:測試座 43:第一輸送器 431:第一驅動源 432:第一載台 4321:第一容置部 44:取像器 45:第二輸送器 451:第二驅動源 452:第二載台 4521:第二容置部 46:第一移料器 47:第二移料器 48:第三移料器 A1:第一作業區 A2:第二作業區 A3:第三作業區 10: machine 20: Feeding device 21: Feed container 30: Receiving device 31: Receiving container 40: Test device 41: circuit board 42: Test seat 43: First conveyor 431: The first driving source 432: The first platform 4321: The first container 44: image picker 45: Second conveyor 451: Second driving source 452:Second platform 4521: the second storage part 46: The first material shifter 47: Second shifter 48: The third shifter A1: The first work area A2: The second work area A3: The third work area
圖1:本發明應用於作業機之示意圖。 圖2:本發明檢知方法之示意圖。 圖3:本發明檢知電子元件之動作示意圖(一)。 圖4:本發明檢知電子元件之動作示意圖(二)。 圖5:本發明檢知電子元件之動作示意圖(三)。 圖6:本發明檢知電子元件之動作示意圖(四)。 圖7:本發明檢知電子元件之動作示意圖(五)。 圖8:本發明檢知電子元件之動作示意圖(六)。 Figure 1: A schematic diagram of the present invention applied to a working machine. Figure 2: Schematic diagram of the detection method of the present invention. Figure 3: Schematic diagram of the detection of electronic components in the present invention (1). Figure 4: Schematic diagram of the detection of electronic components in the present invention (2). Figure 5: Schematic diagram of the detection of electronic components of the present invention (3). Figure 6: Schematic diagram of the detection of electronic components in the present invention (4). Figure 7: Schematic diagram (5) of the action of detecting electronic components of the present invention. Figure 8: Schematic diagram of the detection of electronic components in the present invention (6).
10:機台 10: machine
20:供料裝置 20: Feeding device
21:供料容置器 21: Feed container
30:收料裝置 30: Receiving device
31:收料容置器 31: Receiving container
40:測試裝置 40: Test device
41:電路板 41: circuit board
42:測試座 42: Test seat
43:第一輸送器 43: First conveyor
431:第一驅動源 431: The first driving source
432:第一載台 432: The first platform
4321:第一容置部 4321: The first container
44:取像器 44: image picker
45:第二輸送器 45: Second conveyor
451:第二驅動源 451: Second driving source
452:第二載台 452:Second platform
4521:第二容置部 4521: the second storage part
46:第一移料器 46: The first material shifter
47:第二移料器 47: Second shifter
48:第三移料器 48: The third shifter
A1:第一作業區 A1: The first work area
A2:第二作業區 A2: The second work area
A3:第三作業區 A3: The third work area
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