TW202305385A - Handler for managing electronic components and method of setting teaching point thereof - Google Patents
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/344—Sorting according to other particular properties according to electric or electromagnetic properties
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/361—Processing or control devices therefor, e.g. escort memory
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/361—Processing or control devices therefor, e.g. escort memory
- B07C5/362—Separating or distributor mechanisms
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
- G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C2501/00—Sorting according to a characteristic or feature of the articles or material to be sorted
- B07C2501/0063—Using robots
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- General Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
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Abstract
Description
本發明涉及一種處理電子部件的分選機。The invention relates to a sorting machine for handling electronic components.
電子部件生產後經過多種處理程序(測試程序、分類程序、托盤重置程序等)之後而作為最終產品出庫。並且在這樣的多種處理程序中使用用於處理電子部件的電子部件處理用分選機。After the electronic components are produced, they go through various processing procedures (testing procedures, sorting procedures, pallet resetting procedures, etc.) before being released as final products. And the electronic component processing sorter for processing electronic components is used in such various processing programs.
電子部件處理用分選機為了處理電子部件的程序而具備用於移動電子部件的多種移動裝置。The electronic component processing sorter is equipped with various moving devices for moving electronic components in order to process electronic component processes.
圖1示出了在作為針對電子部件的各種處理程序中的一個的測試程序中使用的電子部件處理用分選機HR的例。FIG. 1 shows an example of a sorter HR for electronic component processing used in a test program as one of various processing programs for electronic components.
圖1的電子部件處理用分選機HR需要沿經裝載位置LP、測試位置TP以及卸載位置UP並重新連接至裝載位置LP的封閉的路徑C循環移動的測試托盤TT,並且包括裝載裝置LA、連接裝置CA以及卸載裝置UA。其中測試托盤TT是用於將多個電子部件一次性地供應至測試機(TESTER)的裝置要素。The electronic component processing sorter HR of FIG. 1 requires a test tray TT that circulates along a closed path C that passes through a loading position LP, a testing position TP, and an unloading position UP and reconnects to the loading position LP, and includes a loading device LA, Connecting device CA and unloading device UA. Among them, the test tray TT is a device element for supplying a plurality of electronic components to a tester (TESTER) at one time.
裝載裝置LA可以是用於將位於客戶托盤CT的將要測試的電子部件移動至位於裝載位置LP的測試托盤TT的移動裝置,並且可以為了提高裝置速度而如同韓國公開專利10-2011-0108204號地配備多個移動裝置。其中客戶托盤CT是用於向電子部件處理用分選機HR供應將要被測試的電子部件的裝載要素。The loading device LA may be a moving device for moving electronic components to be tested located on the customer tray CT to the test tray TT located at the loading position LP, and may be configured as in Korean Laid-Open Patent No. 10-2011-0108204 in order to increase the speed of the device. Equipped with multiple mobile devices. Among them, the customer tray CT is a loading element for supplying electronic components to be tested to the electronic component processing sorter HR.
連接裝置CA可以將裝載在位於測試位置TP的測試托盤TT的電子部件電連接於測試機,從而電子部件可以藉由測試機而被測試。The connection device CA can electrically connect the electronic components loaded on the test tray TT at the test position TP to the testing machine, so that the electronic components can be tested by the testing machine.
卸載裝置UA可以是將裝載在位於卸載位置UP的測試托盤TT的測試結束的電子部件卸載並按照測試等級分類之後將其移動至客戶托盤CT的移動裝置,相同地,為了提升卸載處理速度,可以在測試托盤TT分為被稱為分類器的移動裝置和被稱為移動器的裝置而配備。其中分類器可以是卸載位於測試托盤TT的電子部件並且按測試等級分類而將其移動至分揀台的移動裝置,其可以配備為多個。並且,移動器可以是將位於分揀台的電子部件移動至客戶托盤CT的移動裝置,而且根據實施方式可以配備為多個。The unloading device UA may be a mobile device that unloads the tested electronic components loaded on the test tray TT located at the unloading position UP and moves them to the customer tray CT after sorting them according to the test level. Similarly, in order to increase the unloading processing speed, it may be The test tray TT is equipped with a moving device called a sorter and a mover called a mover. The sorter may be a mobile device that unloads the electronic components located in the test tray TT and sorts them according to test levels to move them to the sorting table, and it may be equipped in multiples. Also, the mover may be a moving device that moves electronic components located on the sorting table to the customer tray CT, and may be provided in plural depending on the embodiment.
即,電子部件處理用分選機HR以如下方式形成:在需要的位置配備多個移動裝置,從而可以將電子部件從一側裝載要素(例如,客戶托盤、測試托盤、分揀台)移動至另一側裝載要素(例如,測試托盤、分揀台、客戶托盤)。作為參照,配備於電子部件處理用分選機HR的裝載要素除了在上文中所提及的要素以外還可以有用於臨時裝載電子部件的緩衝區或者其他裝載台等。That is, the sorting machine HR for electronic parts processing is formed in such a way that a plurality of moving devices are equipped at necessary positions so that electronic parts can be moved from one side loading elements (such as customer trays, test trays, sorting tables) to The other side is loaded with elements (e.g. test trays, sorting tables, customer trays). For reference, the loading elements equipped in the sorter HR for processing electronic components may include a buffer zone for temporarily loading electronic components or other loading stages in addition to the above-mentioned elements.
圖2是圖示移動裝置100的一例的示意圖。FIG. 2 is a schematic diagram illustrating an example of the
參照圖2,移動裝置100可以具備能夠拾取電子部件或者能夠解除拾取的具有8×2行列形態的佈置的16個拾取器P。即,圖2的移動裝置100具有8個被模組化為一組的2列的拾取器P。因此,拾取器P的列之間的間距可以被調整,然而拾取器P的行之間的間距不可以被調整。Referring to FIG. 2 , the
另外,為了電子部件處理用分選機HR的運用,拾取器P應在出發地點(將要移動的電子部件所在地點)準確地拾取電子部件,並且應在目標地點(要放置移動結束的電子部件的地點)準確地解除電子部件的拾取。最近,隨著電子部件的大小變小並且端子之間的距離也變得細微,這樣的問題正變得越來越重要。因此,當電子部件從出發地點移動至目標地點時,拾取器應當準確地位於用於拾取電子部件的拾取點(出發地點)或者用於解除電子部件的拾取的解除點(目標地點)。即,拾取器的拾取點或者解除點稱為示教點,若示教點設定不正確,則可能發生預料不到的問題。In addition, in order to operate the electronic component processing sorter HR, the picker P should accurately pick up electronic components at the starting point (where the electronic location) to accurately disarm electronic component pickups. Recently, such a problem is becoming more and more important as the size of electronic parts becomes smaller and the distance between terminals becomes finer. Therefore, when the electronic component is moved from the starting point to the target point, the picker should be accurately located at the pick-up point (start point) for picking up the electronic component or the release point (target point) for releasing the picking of the electronic component. That is, the pickup point or release point of the pickup is called the teaching point, and if the teaching point is not set correctly, unexpected problems may occur.
如果針對電子部件的拾取點的示教為不良,則由於拾取不良或者不完整的拾取而可能在移動途中出現並未意圖的拾取的解除。並且,在這樣的情況下,不僅可能發生電子部件的遺失,也可能由於拾取解除的電子部件或者受損的電子部件混入其他構成部件而引起誤操作。If the teaching of the pick-up point for the electronic component is poor, unintended release of pick-up may occur during movement due to poor pick-up or incomplete pick-up. In addition, in such a case, not only loss of electronic components may occur, but also misoperation may occur due to picking up and removing electronic components or damaged electronic components mixed with other components.
並且,在針對解除點的示教為不良的情況下,可能發生如下情形:電子部件無法在準確位置正常安置而脫離的現象、在同一位置重複裝載的現象、電子部件在安置為不良的狀態下與測試機電接觸而發生的測試不良、誤操作以及故障。In addition, when the teaching of the release point is defective, the following situations may occur: the phenomenon that the electronic part cannot be placed normally at the correct position and comes off, the phenomenon that the same position is repeatedly loaded, and the electronic part is placed in a bad state. Test failures, misoperations, and malfunctions that occur due to contact with the test machine.
因此,用於在構成拾取器P的下端並與電子部件接觸的墊1的中心與出發地點準確一致的狀態下使拾取器P拾取電子部件,或者用於在墊1的中心與目標地點(解除點)準確一致的狀態下使拾取器P接觸電子部件的拾取的示教點的精確的設定非常重要。Therefore, it is used to make the picker P pick up the electronic component in a state where the center of the
因此,當需要第一次啟動分選機時,或者需要將電子部件的規格變化而將拾取塊或者裝置要素替換為其他規格時,必須經過設定示教點的操作。Therefore, when it is necessary to start the sorter for the first time, or when it is necessary to change the specifications of electronic components and replace the picking blocks or device elements with other specifications, it is necessary to go through the operation of setting the teaching point.
通常,裝載要素具有能夠安置電子部件的容器,然而由於容器配備為以規格化的間距相隔,若知道針對任意一個容器的示教點的座標,則可以知道針對剩餘容器的示教點的座標。並且,由於在移動裝置構成的拾取器P之間的間距也被規格化,若知道針對任意一基準拾取器P的中心的座標,則也可以知道針對剩餘拾取器P的中心的座標。因此,根據準確地確認任意一個特定的基準容器的位置和任意一個特定的基準拾取器的位置,從而示教可以精確地設定示教點。Usually, a loading element has containers in which electronic components can be placed. However, since the containers are arranged at standardized intervals, if the coordinates of the teaching points for any one container are known, the coordinates of the teaching points for the remaining containers can be known. In addition, since the pitch between the pickers P configured in the mobile device is also standardized, if the coordinates of the center of any reference picker P are known, the coordinates of the centers of the remaining pickers P can also be known. Therefore, the teaching can precisely set the teaching point by accurately confirming the position of any specific reference container and the position of any specific reference picker.
在初期,拾取器P的示教點設定以手動方式實現。手動設定的一例是如下方式:單獨設置形成有示教孔的示教用夾具,並且將結合於作為基準的拾取器(以下稱為「基準拾取器」)P的示教銷插入於示教孔而捕捉其順利地進入的地點。然而,在像這樣手動調整示教點的情況下,將具有與較多數量的移動裝置相當的較多數量的示教點手動一一設定的工作所消耗的時間較多。並且,考慮到電子部件的小型化趨勢,由於操作者的熟練度或者視角,設定示教點的準確度下降,從而根據依肉眼辨識的操作而實現較精確的示教點設定更加困難。即,由於示教銷是否順利地插入於示教孔取決於操作者的視野和手的感覺,從而每個操作者的基準不同,並且根據操作者的熟練度而消耗的時間也參差不齊。而且由於操作空間的狹小導致操作的麻煩,並且由於操作者要將手臂等伸入電子部件處理用分選機HR的內部而進行作業,從而也需要承擔隨之伴隨的風險。因此,由於這樣的理由,設定操作平均需要消耗5小時左右。並且,當設定示教點時,由於各部件之間的剛性的差異,接觸的結構物之間的毀損較大,從而也產生費用浪費。此外,需要在設定示教點之後去除示教用夾具並安置符合電子部件的種類的裝載要素而運行裝備,而在此程序中,存在還需要考慮設置公差產生的情形的困難。In the initial stage, the setting of the teaching point of the pickup P is performed manually. An example of manual setting is a method in which a teaching jig in which a teaching hole is formed is provided separately, and a teaching pin coupled to a picker (hereinafter referred to as "reference picker") P as a reference is inserted into the teaching hole And capture the place where it enters smoothly. However, in the case of manually adjusting the teaching points like this, it takes a lot of time to manually set a large number of teaching points corresponding to a large number of mobile devices one by one. In addition, considering the miniaturization trend of electronic components, the accuracy of setting the teaching point decreases due to the operator's proficiency or viewing angle, so it is more difficult to achieve a more accurate setting of the teaching point according to the operation recognized by the naked eye. That is, whether the teaching pin is smoothly inserted into the teaching hole depends on the operator's field of vision and hand feeling, so the standard of each operator is different, and the time consumed varies according to the operator's proficiency. Furthermore, the operation is troublesome due to the narrowness of the operation space, and the operator needs to bear the accompanying risks because the operator has to put his arm or the like into the electronic component processing sorter HR to perform the work. Therefore, for such a reason, the setting operation takes about 5 hours on average. In addition, when setting the teaching point, due to the difference in rigidity among the parts, the damage between the contacting structures is relatively large, which also causes cost waste. In addition, after setting the teaching point, it is necessary to remove the teaching jig and place a loading element corresponding to the type of electronic component to operate the equipment. However, in this procedure, it is difficult to consider the occurrence of setting tolerances.
尤其,在電子部件相對較大的過去,如上的示教點設定的問題並不突出,然而隨著電子部件的大小逐漸變得更小,上述問題正在突出得更大。In particular, in the past when electronic parts were relatively large, the problem of the above teaching point setting was not prominent, but as the size of electronic parts gradually becomes smaller, the above-mentioned problem is becoming more prominent.
因此,研究了自動設定示教點的方法,並且開發了利用相機來設定示教點的多種技術。Therefore, a method of automatically setting a teaching point has been studied, and various techniques for setting a teaching point using a camera have been developed.
若利用相機設定示教點,則可以藉由自動化的流程而比較準確地、輕易地且較快地設定示教點,然而隨之伴隨的由於各種配件材料的設置或者拆解等的作業仍然可能伴隨,並且由於各種器械的設計或者設置公差(甚至是基準拾取器的設置公差或者成為基準的地點的歪曲),仍然可能發生歪曲的示教點的設定。即,到現在為止,所提出的利用相機的示教點設定方法忽視了在確認各種座標方面成為基準的基準點偏離的問題。 [現有技術文獻] [專利文獻] If the camera is used to set the teaching point, the teaching point can be set more accurately, easily and quickly through an automated process, but the accompanying operations due to the setting or dismantling of various accessories and materials are still possible Concomitantly, and due to design or setup tolerances of various instruments (even setup tolerances of fiducial pickers or distortions of locations to be fiducials), setting of distorted teaching points may still occur. That is, the teaching point setting method using a camera proposed so far ignores the problem of the deviation of the reference point used as a reference for confirming various coordinates. [Prior art literature] [Patent Document]
韓國公開專利公報 第10-2016-0120880號 韓國公開專利公報 第10-2016-0123502號 韓國公開專利公報 第10-2018-0041048號 Korean Patent Publication No. 10-2016-0120880 Korean Laid-Open Patent Publication No. 10-2016-0123502 Korean Patent Publication No. 10-2018-0041048
本發明從如下動機出發:最少化配件材料的數量,並且通過彼此相對性的比較而不是絕對的基準,儘管存在各種各樣的設計或者設置公差,但也要精確地設定示教點。The invention proceeds from the motivation of minimizing the amount of fitting material and precisely setting the teaching points despite various design or setting tolerances by comparing them relative to one another rather than with absolute references.
用於實現上述目的的根據本發明的電子部件處理用分選機,包括:移動裝置,在出發地點拾取電子部件之後移動至目標地點而接觸拾取,從而將電子部件從出發地點移動至目標地點;設定裝置,用於準確地設定拾取將要藉由所述移動裝置而被移動的電子部件的所述出發地點或者解除電子部件的拾取的所述目標地點;控制裝置,控制所述移動裝置以及設定裝置,以藉由設定裝置而設定所述出發地點和目標地點之後將電子部件從出發地點移動至目標地點,其中所述移動裝置包括:至少一個拾取器,用於將電子部件拾取或者解除拾取;升降器,使所述至少一個拾取器沿垂直方向升降,從而使其位於所述拾取器能夠將電子部件拾取或者解除拾取的高度;及水平移動器,將所述至少一個拾取器沿水平方向移動,其中所述設定裝置包括:第一相機,用於確認在所述至少一個拾取器中的基準拾取器的位置;第二相機,用於確認所述出發地點或者所述目標地點中的至少一個位置;及判斷器,根據來自所述第一相機的第一影像資訊判斷所述基準拾取器的位置,並根據來自所述第二相機的第二影像資訊判斷所述出發地點或者所述目標地點。A sorter for electronic component processing according to the present invention for achieving the above object, comprising: a moving device that picks up electronic components at a starting point and then moves to a target point for contact picking, thereby moving the electronic components from the starting point to the target point; setting means for accurately setting the starting point for picking up the electronic parts to be moved by the moving means or the target point for releasing the picking of the electronic parts; control means for controlling the moving means and setting means , to move the electronic components from the starting point to the target point after setting the starting point and the target point by a setting device, wherein the moving device includes: at least one picker, used to pick up or unpick up the electronic components; elevating a device for lifting and lowering the at least one picker in the vertical direction so that it is located at a height where the picker can pick up or release the electronic components; and a horizontal mover for moving the at least one picker in the horizontal direction, Wherein the setting device comprises: a first camera for confirming the position of the reference picker in the at least one picker; a second camera for confirming at least one position of the starting point or the target point and a judging unit, judging the position of the reference pickup according to the first image information from the first camera, and judging the starting point or the target point according to the second image information from the second camera.
還包括切換器,以使所述判斷器選擇性地接收所述第一影像資訊和所述第二影像資訊中的任意一個的方式進行切換,其中所述第一影像資訊和所述第二影像資訊是根據所述第一相機和所述第二相機的連續拍攝的影片資訊。A switcher is also included to switch in such a manner that the judger selectively receives any one of the first image information and the second image information, wherein the first image information and the second image information The information is video information based on continuous shooting by the first camera and the second camera.
還包括照明裝置,當利用所述第一相機拍攝位於上方的所述基準拾取器時,朝下方照射光。It also includes an illumination device for irradiating light downward when the reference pickup located above is photographed by the first camera.
所述第一相機和第二相機的透鏡被黏貼而使焦距固定。The lenses of the first camera and the second camera are glued to fix the focal length.
當所述第一相機和所述第二相機位於同一垂直線上或者至少拍攝中心位於同一垂直線上時,所述第一相機的第一焦距和所述第二相機的第二焦距之和比所述第一相機與所述第二相機之間的距離更長,從而需要用於確認所述第一相機與所述第二相機彼此之間的位置的確認夾具,所述確認夾具具有在藉由所述第一相機而確認的第一確認地點與藉由所述第二相機而確認的第二確認地點之間存在高度差的結構。When the first camera and the second camera are located on the same vertical line or at least the shooting centers are located on the same vertical line, the sum of the first focal length of the first camera and the second focal length of the second camera is greater than the The distance between the first camera and the second camera is longer, so that a confirmation jig for confirming the positions of the first camera and the second camera with each other is required, and the confirmation jig has A structure in which there is a height difference between the first confirmation point confirmed by the first camera and the second confirmation point confirmed by the second camera.
所述確認夾具還包括第三確認地點,所述第三確認地點藉由與所述至少一個拾取器一同移動的第二相機確認,並且沿水平方向與所述第二確認地點相隔,所述判斷器比較所述第二確認地點與所述第三確認地點的相互位置而確認所述確認夾具的設置狀態。The confirmation jig further includes a third confirmation location, the third confirmation location is confirmed by a second camera moving together with the at least one picker, and is separated from the second confirmation location in the horizontal direction, and the judgment The device compares the mutual positions of the second confirmation point and the third confirmation point to confirm the installation state of the confirmation jig.
並且,用於實現如上的目的的根據本發明的電子部件處理用分選機的示教點設定方法包括:第一確認步驟,藉由拍攝上方向的第一相機來確認用於將電子部件拾取或者解除拾取的基準容器的位置;第二確認步驟,確認所述第一相機與為了拍攝下方向而與所述基準拾取器一同移動的第二相機的相互位置,從而確認所述基準拾取器與所述第二相機的距離;第三確認步驟,藉由所述第二相機來確認基準示教點(用於拾取電子部件的出發地點或者用於解除電子部件的拾取的目標地點中的至少一個);及設定步驟,以在所述第三確認步驟中確認的基準示教點為基準設定其他示教點。And, the teaching point setting method of the sorting machine for electronic component processing according to the present invention for achieving the above purpose includes: a first confirmation step, confirming that the electronic component is picked up by the first camera in the upward direction Or release the position of the reference container picked up; the second confirming step is to confirm the mutual position of the first camera and the second camera moving together with the reference picker in order to photograph the downward direction, thereby confirming that the reference picker and the reference picker The distance of the second camera; the third confirming step is to confirm the reference teaching point (at least one of the starting point for picking up the electronic component or the target point for releasing the picking up of the electronic component) by the second camera ); and a setting step of setting other teaching points based on the reference teaching point confirmed in the third confirmation step.
第一確認步驟包括:拍攝步驟,在使所述基準拾取器位於所述第一相機的上方的狀態下,利用所述第一相機在逆光照明狀態下拍攝構成所述基準拾取器的下端的墊(拾取電子部件的部分);選擇步驟,從在所述拍攝步驟中拍攝的影像資訊選擇暗的任意點;第一描繪步驟,在所述選擇步驟中被選擇的任意的點中取捨選擇3個而畫出圓;第二描繪步驟,尋找在所述第一描繪步驟中描繪的圓的中心,並以該中心為基準畫出大於或小於在第一描繪步驟中畫出的圓的圓;記憶步驟,確認在所述第一描繪步驟和所述第二描繪步驟中畫出的圓之間存在任意的點最多的區域之後,記住該區域所構成的圓;重複步驟,將所述第一描繪步驟、所述第二描繪步驟以及所述記憶步驟對另外被取捨選擇的3個任意的點重複預設的多次;選定步驟,在重複步驟結束之後,從通過重複的所述記憶步驟而記住的圓中選定包括最多任意的點的圓;確定步驟,比較在所述選定步驟中選定的圓與實際墊的邊緣所應當具有的圓,從而確定與實際墊的邊緣最近似的圓;辨識步驟,將在所述確定步驟確定的圓的中心辨識為所述墊的中心。The first confirmation step includes a photographing step of photographing a pad constituting a lower end of the reference picker in a backlit state with the first camera in a state where the reference picker is positioned above the first camera. (picking up the part of the electronic component); a selection step of selecting dark arbitrary points from the image information captured in the shooting step; a first drawing step of selecting three arbitrary points selected in the selection step And draw a circle; The second drawing step is to find the center of the circle described in the first drawing step, and draw a circle larger or smaller than the circle drawn in the first drawing step with the center as a reference; memory step, after confirming that there is any area with the most points between the circles drawn in the first drawing step and the second drawing step, remember the circle formed by the area; The drawing step, the second drawing step and the memory step repeat the preset multiple times to the other three arbitrary points selected by selection; the selected step, after the repeating step ends, starts from the repeated memory step Selecting the circle comprising the most arbitrary points in the remembered circles; determining a step of comparing the circle selected in said selecting step with the circle that the edge of the actual pad should have, thereby determining the circle that is closest to the edge of the actual pad; A recognizing step of recognizing the center of the circle determined in the determining step as the center of the pad.
在設置有具有用於利用所述第一相機來確認的第一確認地點和用於利用所述第二相機來確認的第二確認地點的確認夾具的狀態下,所述第二確認步驟包括:第一搜索步驟,利用所述第一相機尋找所述第一確認地點;第二搜索步驟,在使所述第二相機位於所述第二確認地點的上方的狀態下尋找所述第二確認地點;及辨識步驟,藉由在所述第一搜索步驟和所述第二搜索步驟中獲取的結果物來確認所述第一相機與所述第二相機的相互位置,並且比較在所述第一確認步驟中獲取的所述基準拾取器的位置而辨識所述第二相機與所述基準拾取器的相互位置。In a state where a confirmation jig having a first confirmation place for confirmation with the first camera and a second confirmation place for confirmation with the second camera is provided, the second confirmation step includes: A first search step of searching for the first confirmation point using the first camera; a second search step of searching for the second confirmation point with the second camera positioned above the second confirmation point ; and a recognition step of confirming the mutual positions of the first camera and the second camera by the results acquired in the first search step and the second search step, and comparing the mutual positions of the first camera and the second camera in the first search step The mutual position of the second camera and the reference pickup is recognized by confirming the position of the reference pickup obtained in the step.
所述第三確認步驟包括:第一移動步驟,根據設計值將所述第二相機移動至位於裝載要素的基準容器的中心位置;拍攝步驟,利用所述第二相機拍攝所述基準容器;第二移動步驟,從所述拍攝步驟中獲取的圖像計算所述基準拾取器從圖像的中心隔開的程度,並將所述第二相機移動相當於計算的值,從而使所述基準容器位於所述圖像的中心;及辨識步驟,執行所述拍攝步驟和所述第二移動步驟至少一次,從而如果所述基準容器位於圖像的中心,則尋找位於所述基準容器的中心的標識而將該標識的位置辨識為所述基準容器的中心,其中所述設定步驟將在所述辨識步驟中辨識的所述基準容器的中心作為基準示教點而設定其他示教點。The third confirming step includes: a first moving step of moving the second camera to the center of the reference container where elements are loaded according to the design value; a photographing step of using the second camera to photograph the reference container; a moving step of calculating from the image acquired in said photographing step the extent to which said fiducial picker is spaced from the center of the image and moving said second camera by the calculated value so that said fiducial container located at the center of the image; and an identifying step of performing the photographing step and the second moving step at least once so as to find an identification located at the center of the reference container if the reference container is located at the center of the image The position of the mark is recognized as the center of the reference container, wherein the setting step uses the center of the reference container recognized in the recognition step as a reference teaching point to set other teaching points.
所述第三確認步驟包括:裝載步驟,將電子部件裝載到位於裝載要素的基準容器;第一移動步驟,根據設計值將所述第二相機移動至所述基準容器的上方;第一拍攝步驟,利用所述第二相機拍攝所述基準容器;計算步驟,從在所述第一拍攝步驟中獲取的圖像中尋找位於電子部件與構成裝載空間的壁面之間的間隙的暗的方環而計算所述基準容器的中心;去除步驟,將在所述裝載步驟中裝載的電子部件從所述基準容器去除;第二移動步驟,將第二相機移動至在所述計算步驟中計算出的所述基準容器的中心;第二拍攝步驟,利用藉由所述第二移動步驟而移動至所述基準容器的中心的第二相機來拍攝所述基準容器;及辨識步驟,從在第二拍攝步驟中拍攝的圖像尋找位於所述基準容器的中心的標識,從而將該標識的位置辨識為容器的中心,其中所述設定步驟將在所述辨識步驟中辨識的所述基準容器的中心作為基準示教點並設定其他示教點。The third confirming step includes: a loading step of loading electronic components into the reference container located at the loading element; a first moving step of moving the second camera above the reference container according to the design value; a first photographing step , using the second camera to photograph the reference container; a calculating step of searching for a dark square ring located in the gap between the electronic component and the wall constituting the loading space from the image acquired in the first photographing step calculating the center of the reference container; a removing step of removing the electronic components loaded in the loading step from the reference container; a second moving step of moving the second camera to the center of the reference container calculated in the calculating step the center of the reference container; a second photographing step of photographing the reference container with a second camera moved to the center of the reference container by the second moving step; searching for a mark located at the center of the reference container in an image captured in the image, thereby recognizing the position of the mark as the center of the container, wherein the setting step uses the center of the reference container recognized in the recognizing step as a reference Teach points and set other teach points.
根據本發明,具有如下效果。According to the present invention, there are the following effects.
第一,由於利用2個相機來獲取成為基準的地點之間的相對位置而設定示教點,從而儘管存在設計性的誤差,也會提升正常操作所需的示教點設定的精確性。First, since the teaching point is set by acquiring the relative position between the reference points using two cameras, the accuracy of setting the teaching point required for normal operation can be improved despite design errors.
第二,通過適用切換器而使判斷器選擇性地接收影像資訊,儘管相機的數量增加,然而判斷器的數量沒有增加,從而可以抑制生產單價的增加。Second, by using the switcher so that the decision unit selectively receives image information, the number of decision units does not increase despite the increase in the number of cameras, thereby suppressing an increase in the production unit price.
第三,因為沒有由於其他因素(操作者的失誤或者運行上的振動等)導致的透鏡的焦點距離變動的顧慮,從而能夠實現準確的確認,並且針對示教點設定的可靠性提升。Third, since there is no concern about the focal length of the lens changing due to other factors (operator's error, vibration during operation, etc.), accurate confirmation can be achieved, and the reliability of the teaching point setting can be improved.
第四,由於配件材料的設置最小化為確認夾具一個,從而複雜度大幅降低,並且由於反應確認夾具的設置狀態而設定示教點,從而設定的精確性非常高。Fourth, since the setting of the accessory material is minimized to one confirmation jig, the complexity is greatly reduced, and since the teaching point is set in response to the setting state of the confirmation jig, the setting accuracy is very high.
以下,對如前述的根據本發明的較佳實施例進行說明。為了說明的簡潔性,盡可能地省略或壓縮主要構成或者重複的說明。Hereinafter, preferred embodiments according to the present invention as described above will be described. For brevity of description, main components or repeated descriptions are omitted or compressed as much as possible.
<針對分選機的主要構成的示意性的說明><Schematic description of the main components of the sorting machine>
如圖3的方塊圖所示,根據本發明的一實施例的電子部件處理用分選機HR包括移動裝置100、設定裝置200、照明裝置300以及控制裝置400。當然,在實際電子部件處理用分選機HR可以配備有多個移動裝置100,然而為了便於說明,僅提取一個移動裝置100進行說明。As shown in the block diagram of FIG. 3 , the electronic component processing sorter HR according to an embodiment of the present invention includes a moving
移動裝置100在出發地點拾取電子部件之後將其移動至目標地點並解除拾取,從而將電子部件從出發地點移動至目標地點。為此,如圖4所示,移動裝置100具有16個拾取器P、升降器110、第一水平移動器120、第二水平移動器130。The
16個拾取器P按8個模組化而配備為2列。拾取器P的下端利用如橡膠或者矽膠的柔性的墊1構成,墊1的下表面是圓環形態。在本實施例中,為了一次移動16個電子部件,配備有16個拾取器P,然而根據實施方式配備至少一個拾取器P就足夠。作為參考,在圖4中,符號P
0是雖然具有與其他拾取器P相同的結構和作用,但是為了設定示教點而任意選擇的拾取器,因此為了方便將其稱為基準拾取器並以符號P
0標記。因此,在本說明中,當涉及所有拾取器時以符號P標記,然而當特別提及作為基準拾取器的功能時以符號P
0標記。
16 pickers P are arranged in 2 rows by 8 modules. The lower end of the pickup P is made of a
升降器110使拾取器P升降,從而使拾取器P可以位於能夠將電子部件拾取或解除拾取的高度或者能夠移動的高度。The
第一水平移動器120使拾取器P沿作為第一方向的左右方向移動,第二水平移動器130使拾取器P沿作為第二方向的前後方向移動。當然,根據移動裝置100的作用,也能夠省略第一水平移動器120和第二水平移動器130中的任意一個。The first
設定裝置200準確地設定需要拾取將要藉由移動裝置100而移動的電子部件的出發地點或者需要解除電子部件的拾取的目標地點。為此,如圖5的示意圖所示,設定裝置200配備有第一相機210、第二相機220、判斷器230以及切換器240。The
第一相機210為了確認基準拾取器P
0的位置而配備,並且以拍攝上方向的方式被設置為固定於基板BP等。
The
第二相機220為了確認作為示教點的出發地點或者目標地點的位置(更加具體地換句話說明,在裝載電子部件的裝載要素的容器的中心)而配備,並且以拍攝下方向的方式設置。如在圖4以及圖5所參照,這樣的第二相機220以能夠與拾取器P一同移動的方式設置於移動裝置100。因此,第一相機210需要位於第二相機220的下方。The
由於上述的第一相機210以及第二相機220需要連續產生圖像至在根據設計值的區域內找到準確的位置為止,因此配備為網路攝像頭的形式而通過連續拍攝產生影片資訊。並且,拍攝的影片即時提供至判斷器230。將相機210、220以上述方式配備為網路形態的原因在於,很難匹配按每個狀況的拍攝時點,並且若想要完善辨識狀況的感測器,則伴隨費用增加。針對如前述的第一相機210和第二相機220,後序將另設目錄進行更加詳細的說明。Since the above-mentioned
判斷器230根據來自第一相機210的第一影像資訊判斷基準拾取器P
0的位置,並根據來自第二相機220的第二影像資訊判斷示教點的位置。這樣的判斷器230配備為搭載有運算處理手段的小型電腦。
The
為了以判斷器230選擇性地接收第一影像資訊和第二影像資訊中的任意一個的方式進行切換,從而配備切換器240。據此,判斷器230從第一相機210或者第二相機220選擇性地接收第一影像資訊和第二影像資訊。其中切換器240可以配備為硬體,也可以配備為搭載於判斷器230的軟體。A
另外,在生產電子部件處理用分選機HR的生產者的立場上,由於作為小型電腦的判斷器230不是特別訂購製作的,因此只能購買市場上普及的式樣並設置。因此,若使判斷器230以低端式樣並且將其數量增加(例如,一個相機配備一個判斷器),則由於很難確保其空間,從而不僅電子部件處理用分選機HR的規模變大,而且在設計上也存在困難。雖然如此,若購買高端式樣的判斷器230,則雖然可以幾乎同時處理來自多個相機210、220的影片,然而電子部件處理用分選機HR的生產單價將大幅上升。如在背景技術中所述,當一個電子部件處理用分選機HR配備有5個至6個或者其以上的移動裝置100時,需要配備相當於其倍數的更多數量的判斷器230,在這方面上,上述問題會更加嚴重。In addition, from the standpoint of the manufacturer of the sorter HR for processing electronic components, since the
因此,在本實施例中配備上文中所提及的切換器240,從而使判斷器230選擇性地與第一相機210或者第二相機220連接。這是因為當尋找基準拾取器P
0的位置時僅需要第一相機210的影像資訊,當尋找示教點時僅需要第二相機220的影像資訊,並且尋找基準拾取器P
0的位置的操作與尋找示教點的操作並不會同時並行。
Therefore, in this embodiment, the
並且,更進一步,如圖6所示,還需要考慮在一個移動裝置100配備2個以上的第二相機220的情形。通常,由於電子部件處理用分選機HR結合有多個構成品,因此可能存在無法利用一個第二相機220確認的盲點。例如,在需要將電子部件從第一裝載要素移動至第二裝載要素的情況下,需要將第一裝載要素的示教點和第二裝載要素的示教點全部設定。其中第一裝載要素和第二裝載要素可以是在一體化的一個裝載台或者是客戶托盤上存在的2個地點,並且根據情況也可以是彼此不同的構成(例如,是裝載台的一個區域和客戶托盤的一部分區域)。Furthermore, as shown in FIG. 6 , it is also necessary to consider the case where one
雖然可以將一個第二相機220設計為均位於兩側示教點的垂直上方,然而也存在由於其他結構物或者壁等的障礙物H而導致一個第二相機220可能無法到達一側示教點的情形。因此,在這樣的情況下,有必要配備2個第二相機220。並且,當移動裝置100需要選擇性地將電子部件從第一裝載要素(例如,客戶托盤)移動至第二裝載要素(例如,測試托盤)或者第三裝載要素(例如,緩衝台)時,根據情況還可以充分考慮配備有4個以上的第二相機220的情況。在這樣的情況下,由於並不同時需要來自第一相機210和多個第二相機220的影像資訊,因此切換器240以連接拍攝當前所需的影像資訊的第二相機220與判斷器230的方式操作。並且,更進一步地,也有可能不同時需要藉由多個第二相機220的全部影像資訊,因此切換器240也可以以選擇性地僅將產生所需區域的影像資訊的特定第二相機220連接到判斷器230的方式操作。Although one
照明裝置300配備為當利用第一相機210拍攝基準拾取器P
0時朝向下方照射光。即,照明裝置300並非朝向基準拾取器P
0的墊1所在的區域從下方朝上方照射光,而是從基準拾取器P
0的上方朝下方照射光,從而在拍攝的圖像上使墊1的底面顯示為比其他部位更暗,並且使判斷器230利用演算法尋找較暗的墊1所在的位置。如此,使墊1的底面更暗,以使墊1可以與其他器械物部位明確地劃分,從而更加容易且準確地尋找墊1的中心。其中上方應當解釋為不僅表示墊1的垂直上方,還包括相對於垂直線傾斜一定角度的上側方向的總括性的含義。即,「上方」表示比墊1高的位置,照射光的光源位於比墊1高的位置而使光無法直接照射墊1的下表面就足夠。
The
控制裝置400以在藉由設定裝置200而設定示教點之後可以將電子部件從出發地點移動至目標地點的方式控制移動裝置100、設定裝置200以及照明裝置300。The
<針對相機的具體說明><Specific instructions for cameras>
市場上購買的相機可以通過旋轉透鏡而調整焦距。Commercially available cameras can adjust the focal length by rotating the lens.
然而,適用於根據本實施例的電子部件處理用分選機HR的第一相機210和第二相機220以固定焦距的狀態被設置。即,將購買的相機的透鏡黏合為禁止旋轉之後設置。此時,第一相機210的焦距(以下,第一焦距)設定為位於基準拾取器P
0的墊1的距離,第二相機220的焦距(以下,第二焦距)設定為到基準容器(在裝置要素的容器中被任意選擇而成為設定示教點的基準的容器,以下相同)的底面為止的距離。其原因在於,為了利用第一相機210清晰地觀察墊1,並且利用第二相機220清晰地觀察基準容器的底面。如此固定第一相機210和第二相機220的焦距的理由是為了去除當進行設置作業時或者當運行電子部件處理用分選機HR時由於振動或者並未意圖的干涉等導致焦距變更的問題。
However, the
作為參考,進入焦距的區域將會被非常清晰地看到,而超出焦距的區域將會被模糊地看到,因此與焦距僅存在細微的距離差也會在影像中形成鮮明對比,從而被分為清晰的區域與並未如此的區域。因此,可以清楚地看到想要看到的部分。As a point of reference, areas that are in focus will be seen very clearly, and areas that are out of focus will be seen blurry, so even a slight difference in distance from the focus will be contrasted in the image and thus be resolved. Areas that are clear and areas that are not. Therefore, the desired part can be seen clearly.
另外,較佳地,拾取器P設置為以在底面能夠移動的最小距離相隔。這對如下方面起到了貢獻:使電子部件處理用分選機HR的大小最小化,並且使拾取器P的升降距離最小化而減少誤差,而且提高速度。In addition, preferably, the pickers P are arranged to be separated by a minimum distance that can move on the bottom surface. This contributes to minimizing the size of the electronic component processing sorter HR, minimizing the lift distance of the picker P to reduce errors, and increasing the speed.
根據本發明,雖然會後述,但是將經過用於確認第一相機210與第二相機220的相對位置的程序。其目的在於,準確地確認第二相機220的位置,同時確認基準拾取器P
0的位置,從而獲知第二相機220與基準拾取器P
0之間的相對位置(座標)。即,基準拾取器P
0或者第二相機220也可能彼此無法以設計值準確地確定相對的位置而發生由於各種公差而導致的誤差,因此也需要確認第二相機220與基準拾取器P
0之間的相對位置。
According to the present invention, although it will be described later, a procedure for confirming the relative positions of the
然而,由於第二相機220與拾取器P一同移動,因此為了排除與其他器械物之間的衝突干涉等而需要比拾取器P的墊1更高地設置。由此,第二相機220無法位於第一相機210的第一焦距。即,由於基準拾取器P
0以及第二相機220為了進行拍攝而能夠下降的高度有極限,因此無法使需要與基準拾取器P
0一同下降的第二相機220下降至被固定為與墊1之間的距離的第一焦距為止。因此,無法利用第一相機210清晰地辨識第二相機220。並且,由於第一相機210設置於底板,因此會不在第二焦距之內,該第二焦距被設定為到向比底板高的位置被提供的裝載要素的基準容器的底面為止的距離,因此無法利用第二相機220清晰地辨識第一相機210。
However, since the
即,由於第一相機210與第二相機220的焦距被固定,因此無法利用第一相機210準確地獲取第二相機220的圖像,並且無法利用第二相機220準確地獲取第一相機210的圖像。That is, since the focal lengths of the
因此,額外需要引入用於確認第二相機220的位置的確認夾具。Therefore, it is additionally necessary to introduce a confirmation jig for confirming the position of the
如果,當第一相機210與第二相機220位於同一垂直線上而使拍攝中心位於同一垂直線上時,如圖7所示,如果第一焦距F1與第二焦距F2之和等於在第一相機210以及第二相機220位於能夠拍攝的位置的狀態下的兩相機210、220之間的距離,則只要配備平整的形態的確認夾具CJ’就足夠。當然,在確認夾具CJ’需要有用於確認位置的單獨的確認地點(孔或者標識等)CP。然而,如前述,由於使拾取器P的升降距離最小化,因此第一焦距F1與第二焦距F2之和如圖8所示地只能比兩相機210、220之間的沿垂直方向隔開的距離L長。由此,無法使用如圖7所示的平整的確認夾具CJ’,需要代替使用在第一確認地點CP
1與第二確認地點CP
2之間有高度差的結構的確認夾具CJ。當然,由於只要在第一確認地點CP
1與第二確認地點CP
2之間有高度差的結構就足夠,因此其形態無需限定為如圖8所示的形態。
If, when the
圖9是針對在圖8的確認夾具CJ的示意性的立體圖。FIG. 9 is a schematic perspective view of the confirmation jig CJ in FIG. 8 .
在確認夾具CJ具有需要藉由第一相機210而確認的第一確認地點CP
1和需要藉由第二相機220而確認的第二確認地點CP
2,第一確認地點CP
1和第二確認地點CP
2存在高度差。即,第一確認地點CP
1比第二確認地點CP
2位於更高的位置。進而,確認夾具CJ具有用於掌握確認夾具CJ的設置狀態的第三確認地點CP
3,第三確認地點CP
3位於與第二確認地點CP
2相同的高度上,並且與第二確認地點CP
2相隔而位於第二確認地點CP
2一側。當然,第一確認地點CP
1與第二確認地點CP
2之間的沿水平方向的距離和第二確認地點CP
2與第三確認地點CP
3之間的沿水平方向的距離被精確地設定,通過此可以準確地獲知第一相機210和第二相機220的相對位置。
The confirmation jig CJ has a first confirmation point CP 1 to be confirmed by the first camera 210 and a second confirmation point CP 2 to be confirmed by the second camera 220, the first confirmation point CP 1 and the second confirmation point CP 2 has a height difference. That is, the first confirmation point CP1 is located at a higher position than the second confirmation point CP2 . Furthermore, the confirmation jig CJ has a third confirmation point CP 3 for grasping the installation state of the confirmation jig CJ. The third confirmation point CP 3 is located at the same height as the second confirmation point CP 2 and is at the same height as the second confirmation point CP 2 . It is separated and located on the side of the second confirmation point CP2 . Of course, the distance in the horizontal direction between the first confirmation point CP1 and the second confirmation point CP2 and the distance in the horizontal direction between the second confirmation point CP2 and the third confirmation point CP3 are accurately set, Through this, the relative positions of the
作為參考,根據第一相機210的設置位置,拾取器P的墊1可能不會以第一相機210的第一焦距F1相隔。在這樣的情況下,可以將微距透鏡適用於第一相機210而在一定程度上調整第一焦距F1,然而微距透鏡的折射率按各個微距透鏡而略有不同,因此精度會降低,當黏附微距透鏡時,根據操作者而略有不同,從而存在無法呈現準確的第一焦距F1的問題。因此,如圖10所示,第一相機210被設置為朝向水平方向,而不是朝向上方,取而代之地構成反射鏡M,從而可以實現為使拾取器P的墊1位於相隔相當於第一相機210的第一焦距F1的距離的位置。For reference, depending on the installation position of the
<針對示教點設定方法的說明><Explanation on how to set the teaching point>
繼而,針對在具有上述構成的電子部件處理用分選機HR中實現的示教點設定方法進行觀察。Next, the teaching point setting method implemented in the sorter HR for electronic component processing which has the said structure is observed.
圖11是針對示教點設定方法的基本流程圖,以第一確認(S10)、第二確認(S20)、第三確認(S30)以及設定(S40)的順序構成。當然,在執行這樣的示教點設定方法之前,根據第一相機210的設計值的位置、根據基準拾取器P
0與第二相機220之間的設計值的相對位置、基準容器的位置等需要的資訊預先通過控制裝置400輸入至判斷器230。
1、第一確認(S10)
FIG. 11 is a basic flow chart of the teaching point setting method, which is composed in the order of first confirmation ( S10 ), second confirmation ( S20 ), third confirmation ( S30 ), and setting ( S40 ). Of course, before executing such a teaching point setting method, the position according to the design value of the
在步驟S10中,藉由第一相機210而確認基準拾取器P
0的位置。由於這樣的步驟S10利用第一相機210的影像資訊,因此切換器240連接第一相機210與判斷器230。
In step S10 , the position of the fiducial picker P 0 is confirmed by the
此時,理想的墊1的邊緣為圓形,但是實際上在注塑之後可能會由於扭曲等而成為接近於圓形但不是圓形的形狀,因此墊1的理想的中心需要經多種詳細的程序而尋找。因此,如圖12,第一確認步驟可以被分為詳細的程序。
(1)拍攝(S11)
At this time, the edge of the
控制裝置400在使基準拾取器P
0位於第一相機210的上方的狀態下利用第一相機210拍攝在基準拾取器P
0的底面的墊1。此時,控制裝置400操作照明裝置300而開啟照明,從而在逆光照明狀態下實現針對墊1的拍攝。
(2)選擇(S12)
The
判斷器230從步驟S11拍攝的影像資訊選擇較暗的任意點。此時,暗的程度可以以通過設定任意的基準亮度而將其以下的亮度辨識為暗點的方式實現。在此,任意的點也可以相當於一個像素。
(3)第一描繪(S13)
The
判斷器230從在步驟S12中被選擇的較多的任意的點中取捨選擇3個,並且,如在圖13所參照,畫出將3個點全部經過的圓。
(4)第二描繪(S14)
The
尋找在步驟S13中描繪的圓的中心,如在圖14所參照,將其中心為基準而畫出比在步驟S13描繪的圓大或者小的圓。其中畫出的圓的數量隨設定而不同,本實施例中,根據畫出約100個圓的例。 (5)記憶(S15) Find the center of the circle drawn in step S13, refer to FIG. 14, and draw a circle larger or smaller than the circle drawn in step S13 using the center as a reference. The number of drawn circles varies with settings, and in this embodiment, about 100 circles are drawn. (5) Memory (S15)
確認在步驟S14所描繪的圓之間存在任意的點最多的區域之後,記住該區域所構成的圓。 (6)重複(S16) After confirming that there is an arbitrary area with the most points among the circles drawn in step S14, memorize the circle formed by this area. (6) Repeat (S16)
將上述步驟S12至S15對另外被取捨選擇的3個任意的點重複預定的次數(數次至數十次)。 (7)選定(S17) The above-mentioned steps S12 to S15 are repeated a predetermined number of times (several times to tens of times) for the three arbitrary points selected in addition. (7) Selected (S17)
在步驟S16結束後,從通過重複的步驟S15而被記住的圓中,選定包括盡可能多個任意的點的圓。 (8)確定(S18) After step S16 ends, a circle including as many arbitrary points as possible is selected from the circles memorized by repeating step S15. (8) OK (S18)
將在步驟S17所選定的圓與實際墊1的邊緣所應當具有的理想的圓進行比較,從而確定與實際墊1的邊緣最為近似的圓。
(8)辨識(S18)
The circle selected in step S17 is compared with the ideal circle that the edge of the
將在步驟S18確定的圓的中心辨識為墊1的中心。
2、第二確認(S20)
The center of the circle determined at step S18 is recognized as the center of the
在步驟S20中確認第一相機210與第二相機220的相對位置,從而確認基準拾取器P
0與第二相機220的距離。這樣的步驟S20可以利用上文中所提及的確認夾具CJ而實現,並且,如圖15所示,可以分為更加詳細的程序。
(1)第一搜索(S21)
In step S20 , the relative positions of the
利用第一相機210尋找第一確認地點CP1。因此,可以獲知第一確認地點CP1從圖像的中心隔開何種程度等。在此程序中也利用第一影像資訊,從而切換器240將第一相機210與判斷器230連接。
(2)第二搜索(S22)
Use the
控制裝置400啟動移動裝置100,從而在使第二相機220大致位於第二確認地點CP
2的上方的狀態下尋找第二確認地點CP
2。在此,由於第二相機220能夠移動,因此可以使第二確認地點CP
2準確地位於圖像的中心。並且,在此程序中利用第二影像資訊,從而切換器240被轉換而將第二相機220與判斷器230連接。
The
並且,在S22步驟中同時尋找第三確認地點CP
3,並確認第二確認地點CP
2與第三確認地點CP
3之間的位置關係,從而確認夾具CJ的設置狀態(稍微傾斜地設置等的狀態)。當然,針對這樣確認的確認夾具CJ的設置狀態的資訊被考慮到用於確認第一相機210與第二相機220的相對位置的計算。
(3)辨識(S23)
And, in the step S22, the third confirmation point CP3 is searched at the same time, and the positional relationship between the second confirmation point CP2 and the third confirmation point CP3 is confirmed, thereby confirming the installation state of the jig CJ (the state of being installed at a slight inclination, etc.) ). Of course, the information on the installation state of the confirmation jig CJ confirmed in this way is taken into consideration for the calculation of the relative positions of the confirmation
藉由在步驟S21與S22中所獲取的結果物而確認第一相機210與第二相機220的彼此相對位置,並且比較計算在步驟S10中獲取的基準拾取器P
0的位置,從而辨識第二相機220與基準拾取器P
0的相對位置。
3、第三確認(S30)
The relative positions of the
控制裝置400啟動移動裝置100而使第二相機220大致位於基準容器GP的上方之後,並藉由第二相機220而確認基準示教點。在此,基準示教點表示針對基準容器的示教點。當然,如在上文中所提及,在裝載要素為多個的情況下,基準示教點可能有多個,因此這樣的步驟S30可以重複多次。After the
作為參考,步驟S30可以通過尋找在圖16中示意性的圖示的基準容器GP的底面中心的確認孔CH而執行。其中確認孔CH是為了當原來的電子部件降落時減少空氣阻力或者減少自身重量而形成的孔,其位於基準容器CP的中心。然而,在本發明中這樣的確認孔CH應用於作為尋找基準容器GP的中心(基準示教點)的標識的用途。For reference, step S30 may be performed by finding the confirmation hole CH at the center of the bottom surface of the reference container GP schematically illustrated in FIG. 16 . The confirmation hole CH is a hole formed to reduce air resistance or reduce its own weight when the original electronic component falls, and is located at the center of the reference container CP. However, in the present invention, such a confirmation hole CH is used as a mark for finding the center (reference teaching point) of the reference container GP.
相同地,如圖17所示,步驟S30可以被分為更詳細的程序。 (1)第一移動(S31) Likewise, as shown in FIG. 17, step S30 can be divided into more detailed procedures. (1) First move (S31)
控制裝置400根據設計值而啟動移動裝置100,從而將第二相機220移動至基準容器GP的中心位置。
(2)拍攝(S32)
The
利用第二相機220拍攝基準容器GP。
(3)第二移動(S33)
The reference container GP is photographed by the
從步驟S32所獲取的圖像計算圖像的中心與基準容器GP的中心相隔的程度,並移動第二相機220計算出的值,從而使基準容器GP的中心位於圖像的中心。
(4)辨識(S34)
The distance between the center of the image and the center of the reference container GP is calculated from the image acquired in step S32, and the value calculated by the
若將步驟S32和S33執行至少一次而使基準容器GP的中心位於圖像的中心,則尋找在基準容器GP的中心的確認孔CH而將該確認孔CH的位置辨識為基準容器GP的中心。其中為了在圖像中準確地確認確認孔CH,藉由照明的漫反射等可能會干擾上述確認,因此,較佳地,至少基準容器GP的底面進行無光處理。並且,構成確認孔CH的內壁面也具有其高度的厚度,較佳地,這樣的內壁面也進行無光處理。這是因為在由於藉由照明的漫反射而使內壁面與確認孔CH的邊緣彼此無法被區分的情況下,確認孔CH的邊緣變得模糊,從而可能難以確認基準容器GP的中心。因此,可以較佳考慮使底面與內壁面的顏色不同。 4、設定(S40) If steps S32 and S33 are executed at least once so that the center of the reference container GP is located at the center of the image, then the confirmation hole CH at the center of the reference container GP is searched to recognize the position of the confirmation hole CH as the center of the reference container GP. In order to accurately confirm the confirmation hole CH in the image, the above confirmation may be disturbed by the diffuse reflection of the illumination, so it is preferable that at least the bottom surface of the reference container GP be matte-treated. In addition, the inner wall surface constituting the confirmation hole CH also has a thickness as high as it is, and it is preferable that such an inner wall surface is also subjected to a matte treatment. This is because when the inner wall surface and the edge of the confirmation hole CH cannot be distinguished from each other due to diffuse reflection by illumination, the edge of the confirmation hole CH becomes blurred, and it may be difficult to confirm the center of the reference container GP. Therefore, it may be preferable to make the bottom surface and the inner wall surface different in color. 4. Setting (S40)
將步驟S30中確認的基準容器GP的中心設定為基準示教點,並利用根據設計值的計算而設定剩餘的示教點。例如,在裝置要素有多個容器,多個容器的每一個具有示教點。然而,由於容器之間的間距固定而能夠計算,從而如果尋找到基準容器GP的示教點,則剩餘示教點也可以被計算,據此可以設定在該裝載要素的所有示教點。如此,用於剩餘示教點的計算的資訊稱為設計資訊,操作者既可以直接將設計資訊輸入至分選機HR,或者也可以由分選機HR通過通訊從上位端(例如,上位的伺服器)下載設計資訊。 <第三確認的另一例> The center of the reference container GP confirmed in step S30 is set as a reference teaching point, and the remaining teaching points are set by calculation based on design values. For example, there are multiple containers in the device element, and each of the multiple containers has a teaching point. However, since the distance between the containers is fixed, it can be calculated, so if the teaching point of the reference container GP is found, the remaining teaching points can also be calculated, and all the teaching points of the loading element can be set accordingly. In this way, the information used for the calculation of the remaining teaching points is called design information. The operator can either directly input the design information to the sorting machine HR, or the sorting machine HR can communicate from the upper end (for example, the upper server) to download design information. <Another example of the third confirmation>
由於確認孔CH尺寸較小,如果第二相機220在從垂直上方稍微脫離的狀態下拍攝基準容器GP,則確認孔CH可能由於構成確認孔CH的壁面而無法在圖像中準確地被感測到。因此,在這樣的情況下,也可以充分地考慮利用電子部件而經如圖18所示的變形的程序。
(1)裝載(S31’)
Since the confirmation hole CH is small in size, if the
將電子部件裝載到裝載要素的基準容器GP。這樣的話,不管多麼被精緻地設計基準容器GP,電子部件與構成基準容器GP的裝置空間的壁面之間還是會發生間隙,並且該間隙在圖像中顯示得較暗。 (2)第一移動(S32’) Electronic components are loaded into the reference container GP of the loading element. In this case, no matter how delicately the reference container GP is designed, a gap occurs between the electronic component and the wall surface of the device space constituting the reference container GP, and the gap appears dark in the image. (2) First move (S32')
當裝載完電子部件,則控制裝置400啟動移動裝置100並根據設計值將第二相機220移動至基準容器GP的上方。
(3)第一拍攝(S33’)
When the electronic components are loaded, the
第二相機220拍攝基準容器GP。
(4)計算(S34’)
The
從在步驟S33’中獲取的圖像中尋找在電子部件與構成裝載空間的壁面之間的間隙的較暗的方環而計算基準容器GP的中心。其中基準容器GP的中心將是連接方環的對角拐角的2個直線相交的地點。作為參考,在本實施例中,預設為了四邊形形態的電子部件,從而尋找較暗的方環,然而如果是圓形形態的電子部件,則應當尋找較暗的圓環。 (5)去除(S34’) The center of the reference container GP is calculated by looking for a darker square ring in the gap between the electronic component and the wall constituting the loading space from the image acquired in step S33'. Wherein the center of the datum container GP will be the point where 2 straight lines connecting the diagonal corners of the square ring intersect. For reference, in this embodiment, a quadrilateral electronic component is preset, so a darker square ring is searched for; however, if it is a circular electronic component, a darker circular ring should be searched for. (5) Removal (S34')
將在步驟S31’中裝載的電子部件從基準容器GP去除。 (6)第二移動(S36’) The electronic components loaded in step S31' are removed from the reference container GP. (6) Second move (S36')
將第二相機220移動至在步驟S34’中計算出的基準容器GP的中心。
(7)第二拍攝(S37’)
The
利用藉由步驟S36’而移動至基準容器GP的中心的第二相機220來拍攝基準容器GP。
(8)辨識(S38’)
The reference container GP is photographed with the
從在步驟37’拍攝的圖像中尋找位於基準容器GP的中心的確認孔CH(或者可以是其他標識),從而將該位置辨識為基準容器GP的中心。From the image taken in step 37', find the confirmation hole CH (or other marks) located at the center of the reference container GP, so as to recognize this position as the center of the reference container GP.
作為參考,在上述內容中說明的示教點設定方法由各個移動裝置100同時執行,從而示教點的設定可以非常快且精確地進行。For reference, the teaching point setting method explained in the above content is executed simultaneously by each
另外,若以如前述的方法設定示教點,則提供實際電子部件而確認示教狀態,若確認為示教點設定得準確,則正常啟動電子部件處理用分選機HR。In addition, if the teaching point is set in the above-mentioned method, the actual electronic component is provided to confirm the teaching state, and if it is confirmed that the teaching point is set correctly, the electronic component processing sorter HR is normally activated.
如前述,根據本發明,即使第一相機210、第二相機220、基準拾取器P
0的中心、基準容器GP的中心並不在準確的設計值而具有誤差,由於確認彼此相對的位置而設定示教點,因此當運行實際電子部件處理用分選機HR時,移動裝置100可以藉由控制裝置400而準確地移動電子部件。
As mentioned above, according to the present invention, even if the center of the
另外,本發明包括記錄有可以在電腦上執行參照上述圖11至圖18而說明的示教點設定方法的程式的記錄媒介。In addition, the present invention includes a recording medium recording a program capable of executing the teaching point setting method described above with reference to FIGS. 11 to 18 on a computer.
如上,對於本發明的具體說明通過參照圖式的實施例而進行,但是上述的實施例僅僅為本發明的較佳實施例,因此不應理解為本發明局限於上述實施例,並且本發明的權利範圍應理解為申請專利範圍及其等同範圍。As above, the specific description of the present invention is carried out by referring to the embodiments of the drawings, but the above-mentioned embodiments are only preferred embodiments of the present invention, so it should not be understood that the present invention is limited to the above-mentioned embodiments, and the present invention The scope of rights should be understood as the scope of the patent application and its equivalent scope.
1:墊 100:移動裝置 110:升降器 120:第一水平移動器 130:第二水平移動器 200:設定裝置 210:第一相機 220:第二相機 230:判斷器 240:切換器 300:照明裝置 400:控制裝置 BP:基板 C:路徑 CA:連接裝置 CH:確認孔 CJ:確認夾具 CJ’:確認夾具 CP:確認地點 CP 1:第一確認地點 CP 2:第二確認地點 CP 3:第三確認地點 CT:客戶托盤 F1:第一焦距 F2:第二焦距 GP:基準容器 H:障礙物 HR:電子部件處理用分選機 L:距離 LA:裝載裝置 LP:裝載位置 M:反射鏡 P:拾取器 P 0:符號 P(P 0):基準拾取器 S10:第一確認 S11:拍攝 S12:選擇 S13:第一描繪 S14:第二描繪 S15:記憶 S16:重複 S17:選定 S18:確定 S19:辨識 S20:第二確認 S21:第一搜索 S22:第二搜索 S23:辨識 S30:第三確認 S31:第一移動 S31’:裝載 S32:拍攝 S32’:第一移動 S33:第二移動 S33’:第一拍攝 S34:辨識 S34’:計算 S35’:去除 S36’:第二移動 S37’:第二拍攝 S38’:辨識 S40:設定 TP:測試位置 TT:測試托盤 UA:卸載裝置 UP:卸載位置 1: Pad 100: Moving device 110: Elevator 120: First horizontal shifter 130: Second horizontal shifter 200: Setting device 210: First camera 220: Second camera 230: Judger 240: Switcher 300: Lighting Device 400: control device BP: substrate C: path CA: connecting device CH: confirmation hole CJ: confirmation jig CJ': confirmation jig CP: confirmation site CP 1 : first confirmation site CP 2 : second confirmation site CP 3 : second Three confirmation points CT: customer tray F1: first focal length F2: second focal length GP: reference container H: obstacle HR: sorter for electronic parts processing L: distance LA: loading device LP: loading position M: mirror P : Picker P 0 : Symbol P(P 0 ): Reference Picker S10: First Confirmation S11: Shooting S12: Selection S13: First Drawing S14: Second Drawing S15: Memory S16: Repeat S17: Select S18: Confirm S19 : Identification S20: Second Confirmation S21: First Search S22: Second Search S23: Identification S30: Third Confirmation S31: First Movement S31': Loading S32: Shooting S32': First Movement S33: Second Movement S33' : first shooting S34: identification S34': calculation S35': removal S36': second movement S37': second shooting S38': identification S40: setting TP: test position TT: test tray UA: unloading device UP: unloading position
圖1是針對適用於電子部件的測試的電子部件處理用分選機的示意性的平面圖。FIG. 1 is a schematic plan view of a sorter for processing electronic components suitable for testing electronic components.
圖2是針對適用於圖1的電子部件處理用分選機的移動裝置的示意圖。FIG. 2 is a schematic diagram of a moving device applied to the electronic component processing sorter of FIG. 1 .
圖3是針對根據本發明的一實施例的電子部件處理用分選機的方塊圖。FIG. 3 is a block diagram of a sorter for electronic component processing according to an embodiment of the present invention.
圖4是針對適用於圖3的電子部件處理用分選機的移動裝置的示意圖。FIG. 4 is a schematic diagram of a moving device applied to the electronic component processing sorter of FIG. 3 .
圖5是針對適用於圖3的電子部件處理用分選機的設定裝置的示意圖。FIG. 5 is a schematic view of a setting device applied to the electronic component processing sorter of FIG. 3 .
圖6是用於說明本發明的另一實施形態的參考圖。Fig. 6 is a reference diagram for explaining another embodiment of the present invention.
圖7至圖10是用於說明適用於圖5的設定裝置的第一相機和第二相機的參考圖。7 to 10 are reference diagrams for explaining a first camera and a second camera applicable to the setting device of FIG. 5 .
圖11至圖18是用於說明根據本發明的電子部件處理用分選機的示教點設定方法的參考圖。11 to 18 are reference diagrams for explaining a teaching point setting method of the electronic component processing sorter according to the present invention.
國內寄存資訊(請依寄存機構、日期、號碼順序註記) 無 國外寄存資訊(請依寄存國家、機構、日期、號碼順序註記) 無 Domestic deposit information (please note in order of depositor, date, and number) none Overseas storage information (please note in order of storage country, institution, date, and number) none
1:墊 1: Pad
100:移動裝置 100: mobile device
200:設定裝置 200: setting device
210:第一相機 210: First camera
220:第二相機 220: second camera
230:判斷器 230:Judger
240:切換器 240:Switcher
300:照明裝置 300: Lighting device
BP:基板 BP: Substrate
P0:符號 P 0 : sign
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