TW202302278A - Machining apparatus and machining method - Google Patents

Abstract

The present invention provides a machining apparatus and a machining method that make it possible to perform machining on a to-be-machined object at a high machining rate, with a rigidity equivalent to that of a conventional apparatus. This machining apparatus is provided with: a fixation part for fixing a to-be-machined object or the like; and a machining head for grinding/polishing the to-be-machined object with a machining material. The fixation part and/or the machining head is equipped with a motor and a cam mechanism that converts the rotational motion of the motor into a reciprocal linear motion, and performs grinding/polishing on the to-be-machined object by operating in a coordinated manner with the reciprocal linear motion converted by the cam mechanism.

Description

Processing device and processing method

The present invention relates to a processing device for grinding/grinding a workpiece.

Silicon has long been used as a semiconductor material. The surface of a semiconductor material can greatly affect the performance of a semiconductor device. Therefore, grinding/polishing of silicon has always been required to be performed with high precision. Grinding/grinding of silicon substrates is performed by fixing the substrate on a processing table, pressing the substrate with a processing head equipped with a processing material such as a whetstone, and rotating the processing table and processing head separately.

In recent years, as next-generation semiconductor materials, sapphire, GaN, SiC, and diamond systems have attracted attention instead of silicon. Compared with silicon, GaN, SiC, and diamond have a wider energy gap, excellent dielectric withstand voltage, and high thermal conductivity, so they have attracted special attention in recent years. Recently, for example, heterogeneous (hetero) epitaxial growth of diamonds by CVD (Chemical Vapor Deposition) has been able to manufacture diamond substrates of □5mm, and diamonds have also been noticed to be practical after GaN or SiC.

Although the crystalline quality of CVD single crystal diamonds is slightly inferior to that of diamonds grown by HPHT (High Pressure High Temperature) method, by improving the surface processing accuracy of the diamond substrate, it is better than that grown by high temperature and high pressure method. Diamonds can reach the same level or more. Therefore, various studies are being conducted on surface processing technologies for diamond substrates. For example, Patent Document 1 discloses a diamond grinding method, in which the grinding pad is pressed against the diamond surface and rotated to grind the surface of the diamond substrate. Prior Art Documents Patent Documents

Patent Document 1: Japanese Patent No. 6367815 Non-Patent Document

Non-Patent Document 1: Grodzinski, Paul, "Diamond Technology", N.A.G. Press, 1956 Non-Patent Document 2: Hironori Yamashida, Hidetoshi Takeda, Hideo Aida, "Planarization of brittle materials by laser assisted machining", International Conference on Planarization/CMP Technology・November 19-21, 2014 Kobe, 344-347.

The problem to be solved by the invention

According to the invention described in Patent Document 1, it is mentioned that diamond is extremely hard and chemically inactive, and therefore it is impossible to planarize a diamond substrate by conventional chemical mechanical polishing. In order to solve this unsolved problem, the inventions described in the literature focus on the particles or oxidizing agents in the slurry, so as to reduce the surface roughness and increase the polishing speed.

However, as mentioned above, the diamond substrate is extremely hard, so even if the particles of the slurry or the oxidizing agent are adjusted, it does not contribute to a fundamental improvement in the polishing rate. In addition, in order to press against the diamond substrate and perform processing while rotating, an extremely high pressing force is required. Therefore, a device that relies on rigidity to the extent that silicon substrates can be processed causes deformation of the device during processing, making it difficult to process diamond substrates with high precision. In addition, excessive pressure is applied to the diamond substrate, so the diamond substrate or the platform may be damaged. These unresolved problems may also arise when processing sapphire, GaN, and SiC with silicon substrate processing equipment.

In addition, the processing of diamonds is generally carried out by grinding with a cast iron disc (Scaife), lapping or polishing. This is to make the platform or processing table rotate, and the oxidation-reduction reaction occurs by the frictional heat generated when the diamond fixed on the processing head is pressed against the platform or processing table. This reaction is used for thermochemical grinding. method. However, high resisting force is required in grinding cast iron discs, and if the rigidity of the device is considered, only small-area substrates can be ground. For example, if the length of one side of a rectangular substrate is doubled, the area will be quadrupled, so the pressing force has to be quadrupled. Therefore, it is impractical to grind diamond substrates with cast iron disc grinding on large substrates.

In addition, in cast iron disc grinding, since a material with high hardness is pressurized, unevenness or a deteriorated layer on the surface of the material may be formed. In addition, diamond, sapphire, GaN, SiC, etc. are very hard, so it takes time to polish even cast iron disks, and it is difficult to obtain high-quality substrate materials.

In view of this, the problem to be solved by the present invention is to provide a processing device and a processing method, which can process a workpiece at a high processing rate with the rigidity of the conventional device, and suppress the deterioration of the quality of the processed object. technical means to solve problems

The grinding/grinding of the silicon substrate is to grind/grind the processing surface uniformly, so it is conventionally carried out by rotating the platform or the processing table or the processing head. This is because the hardness of silicon is lower than that of diamond, so even if the easy processing direction derived from the crystal orientation of silicon is not considered, a certain degree of processing rate can still be obtained. In addition, if the stage or the processing head is rotated to perform grinding/polishing, the homogenization of the substrate surface can be achieved. In the grinding/polishing of hard materials such as diamonds, as in the processing of silicon substrates, grinding/polishing has conventionally been performed by rotating a stage or a processing head.

However, in the grinding/grinding of hard materials, the table or the processing head is also rotated as conventionally. Therefore, as mentioned above, the processing rate is low, and the processing device relying on the silicon substrate has insufficient rigidity of the device.

The team of the present invention focused on the crystal structure of the material of the substrate. For example, in the case of sapphire, the c-plane is easier to process than the a-plane. Even in materials such as diamond, as described in Non-Patent Document 1, there are still easy-to-machine directions according to the crystal planes. In addition, if grinding/polishing can be performed in the easy-to-process direction of each material, it is expected that the processing rate will increase, and a high-hardness material can be ground with the rigidity of the device to the extent that silicon substrates can be processed.

However, in the conventional grinding device, the platform or the processing head is rotated while grinding, so the grinding cannot be performed in the direction of easy processing. If the substrate is small or the radius of rotation during grinding/polishing is large, it is considered that grinding/polishing can be roughly performed in the easy-to-process direction. However, it is difficult to process with a focus on the crystal structure by the conventional processing method, and the miniaturization of the substrate is taken as a reason, which is not in line with the actual situation of today's desire to increase the size of the substrate. In addition, even if grinding/polishing can be roughly performed in the easy-machining direction by chance, it is only grinding/polishing in a rough machining direction, and it is still grinding/polishing in a direction deviated from the easy-machining direction to some extent. Furthermore, the platform or processing head of the conventional grinding device rotates, so even if the substrate is made smaller and the radius of rotation is increased, the platform or processing head still rotates, so the processing direction will deviate greatly from the easy-to-process direction.

In view of this, the team of the present invention escaped from the conventional point of view of improving the rigidity of the device, and deliberately adopted the conventional point of view based on uniform grinding/grinding of the processing surface and avoided the use of reciprocating linear motion. In addition, in order to make the processing head reciprocate and linearly move toward the easy-to-process direction of each material, a cam mechanism is provided between the platform or the processing head and the motor. As a result, it was found that if at least one of the fixed portion such as the platform and the processing head performs reciprocating linear motion along the easy-to-process direction, even if the workpiece is not pressed too much, it can be processed at a high rate and at the same time. Grinding/grinding of hard materials with the same level of rigidity as conventional equipment. Along with this, it was found that even a large diamond substrate exceeding □5 mm can be easily ground/polished. Also, as shown in Non-Patent Document 2, even silicon can be processed with a lower rigidity of the device by grinding/polishing in the direction of easier processing than before, and it is possible to increase the processing rate more easily. Based on this insight, the present invention has been accomplished. The present invention based on these findings is as follows.

(1) A processing device comprising a fixing part for fixing a workpiece and the like, and a processing head for grinding/polishing the workpiece with a workpiece, wherein at least one of the fixing part and the processing head is characterized in that , equipped with a motor, and a cam mechanism that converts the rotational motion of the motor into a reciprocating linear motion, and performs grinding/grinding of the workpiece by interlocking with the reciprocating linear motion converted by the cam mechanism.

(2) The processing apparatus described in (1) above, wherein the workpiece is ground/polished with shear force generated between the workpiece and the workpiece as the main processing force.

(3) The processing device described in (1) or (2) above, wherein the motion speed of the reciprocating linear motion is 100 times/minute or more.

(4) The processing device according to any one of the above (1) to (3), wherein the workpiece is made of a glass material, an amorphous material, a single crystal material, or a material having a cleaved surface.

(5) The processing apparatus according to any one of (1) to (4) above, wherein the object to be processed is a substrate.

(6) The processing device described in any one of the above (1) to (5), wherein when one of the fixed part and the processing head performs grinding/grinding of the workpiece by reciprocating linear motion Next, the other party is fixed and does not move.

(7) The processing device described in any one of the above (1) to the above (5), wherein each of the fixed part and the processing head is provided with a motor, and a device for converting the rotational motion of the shaft of the motor into a reciprocating linear motion. The cam mechanism is interlocked with the reciprocating linear motion transformed by the cam mechanism.

(8) The processing device described in (7) above, wherein the fixing portion and the processing head perform linear reciprocating motions in opposite directions to each other.

(9) The processing device described in (7) above, wherein the fixed part and the processing head move at different speeds, and periodically repeat movements in opposite directions and in the same direction.

(10) The processing device described in any one of the above (1) to the above (5), wherein, when one of the fixed part and the processing head performs grinding/grinding of the aforementioned workpiece by reciprocating linear motion Next, the other side includes a motor, and rotates in conjunction with the rotation of the shaft of the motor.

(11) A processing method using the processing device described in any one of the above (1) to (10), the processing device includes a fixing part for fixing the workpiece, etc., and a processing material for processing the workpiece. A grinding/grinding processing head, the processing method is characterized in that at least one of the fixed part and the processing head is equipped with a motor and a cam mechanism for converting the rotational motion of the motor into a reciprocating linear motion, and the conversion is performed by and with the cam mechanism. The resulting reciprocating linear motion is linked to grind/grind the workpiece.

Embodiments of the present invention will be described in detail based on the drawings. The present invention is not limited to the following embodiments. The matters described in each embodiment can also be combined.

1. The composition of the processing device FIG. 1 is a perspective view showing an example of a processing apparatus 1 according to this embodiment. The processing device 1 includes a fixing unit 10 and a processing head 20 . The fixing unit 10 is fixed to an unillustrated platform on the pedestal 2 , and the machining head 20 is fixed to a cam mechanism 30 . The cam mechanism 30 is fixed to the shaft (not shown) of the motor 40 , and converts the rotational motion of the shaft of the motor 40 into a reciprocating linear motion by the power of the motor 40 . The motor 40 is fixed to the housing 3 . In addition, the processing device 1 is provided with a control panel (not shown) for controlling the rotational speed of the motor 40 and the processing time.

(1) Fixed part The fixing part 10 fixes the workpiece 11 and the like by the same conventional chuck mechanism. Examples of chuck mechanisms include dewaxing, vacuum chucks, electrostatic chucks, and the like. In order to avoid deviation of the workpiece 11 during grinding/grinding, the workpiece 11 can also be fixed with a jig.

The fixing part 10 is fixed to the base 2 in FIG. 1 , but like the machining head 20 in FIG. 1 , a platform (not shown) on which the fixing part 10 is fixed may be connected to a motor through a cam mechanism. In this case, the motor and the cam mechanism are provided in the pedestal 2, and are capable of reciprocating linear motion in the left-right direction 20a shown in FIG. 1 . The motor and the cam mechanism provided in the pedestal 2 are not particularly limited, but may also be the same as the cam mechanism 30 and the motor 40 in FIG. 1 . In addition, when the fixing part 10 is fixed to a platform not shown, the movement of the fixing part 10 is the movement of the platform, and the platform performs reciprocating linear motion.

When the fixing part 10 performs the reciprocating linear motion, the moving speed of the reciprocating linear motion depends on the rotation speed of the motor 40 . The movement speed is preferably above 100 times/minute, more preferably above 3000 times/minute. The upper limit is not particularly limited, but can be appropriately determined according to the performance of the cam mechanism 30 and the motor 40 . For example, it may be 100000 times/min, or 10000 times/min. The faster the movement speed, the more it is possible to grind/grind the workpiece 11 only by shear force.

In addition, in FIG. 1, the workpiece 11 is fixed to the fixing part 10 in the processing apparatus 1, However, The workpiece 11 may be fixed to the processing head mentioned later. In this case, a whetstone, a polishing pad, etc. may be fixed to the fixing part 10 as a processing material. As the whetstone, for example, diamond grit or CBN grit can be bonded with vitrified bond. In addition, it may also be designed to supply slurry, surface modifying chemicals, and abrasive grains between the fixed part 10 and the workpiece 11 as known.

(2) Processed object The processed object 11 processed by the processing device 1, for example, substrates of silicon, sapphire, GaN, alumina, SiC, and diamond, are preferably glass materials, amorphous materials, single crystal materials, or have cleavage (cleavage) surfaces. s material. The workpiece 11 may be a workpiece 11 having a form such as a crystal ingot, a single crystal block, or the like in addition to a substrate. The workpiece 11 is fixed to the fixed part 10 or the machining head 20 , but it is preferably fixed to the side that performs reciprocating linear motion so that grinding or grinding can be easily performed along the easy-to-process direction of the workpiece 11 .

In addition, although the rectangular to-be-processed object 11 is shown in FIG. 1, the shape of the to-be-processed object 11 is not specifically limited. In the present invention, the easy-to-machine direction is a direction obtained from the material of the workpiece 11 and its machined surface, and there are easy-to-machine directions in all surface orientations. For example, the easy-to-machine direction of diamond is the predetermined direction described in Non-Patent Document 1, and grinding/polishing can be performed more easily if it is a cleaved surface. The easy-to-process direction of silicon is a predetermined direction described in Non-Patent Document 2.

(3) Processing head The processing head 20 performs a reciprocating linear motion by using the rotary motion of the motor through the cam mechanism. For example, as shown in FIG. 1 , the motor 40 can be connected through the cam mechanism 30 , and the reciprocating linear motion can be performed through the cam mechanism 30 . The configuration of the cam mechanism 30 in the present invention is not particularly limited, but for example, the cam mechanism 30 shown in FIG. 1 can be used. The cam mechanism 30 includes an eccentric cylinder 31 and a concave member 32 . The eccentric cylinder 31 is connected to a shaft (not shown) of the motor 40 and has a drive pin 33 on the surface on the machining head 20 side. The driving pin 33 protrudes toward the recessed portion 32 a of the female member 32 . In addition, the concave member 32 moves only in the left-right direction 20a by an unillustrated guide provided in the left-right direction 20a shown in FIG. 1 . In addition, even when the above-mentioned fixed part 10 performs reciprocating linear motion, and for example, the cam mechanism 30 and the motor 40 are provided in the pedestal 2, by providing guides on the concave member 32 as described above, the concave member still only faces left and right. Action in direction 20a.

When the motor 40 rotates in the direction of the rotation direction 40a, the eccentric cylinder 31 also rotates in the same direction together with the shaft of the motor 40 which is not shown in figure. At this time, the driving pin 33 rotates in a circle, slides on the side wall of the recess 32a and is guided along the longitudinal direction of the recess 32a, and reciprocates linearly in the front-back direction 33a in the recess 32a.

Once the drive pin 33 rotates in a circle, the female member 32 makes a reciprocating linear motion in the left-right direction 20 a at a distance just corresponding to the diameter of the circle drawn by the drive pin 33 . Since the machining head 20 is fixed to the concave member 32, it performs linear reciprocating motion in the left-right direction 20a like the concave member 32. As shown in FIG. Therefore, the rotary motion of the motor 40 is converted into a reciprocating linear motion by the cam mechanism 30, and the processing head 20 performs a reciprocating linear motion on the surface of the workpiece 11 in conjunction with the converted reciprocating linear motion.

In the processing device 1 of the present embodiment, the processing head 20 is described to perform grinding/polishing of the workpiece 11 by reciprocating linear motion, but the processing head 20 may be directly fixed to the frame body 3 without moving, for example. In this case, grinding/grinding of the workpiece 11 can also be performed only by the reciprocating linear motion of the fixing part 10 . In order to make the fixing part 10 perform reciprocating linear motion, as mentioned above, for example, a cam mechanism 30 and a motor 40 can be provided in the base 2 like the processing head 20 .

When the processing head 20 performs reciprocating linear motion, the moving speed of the reciprocating linear motion is preferably above 100 times/minute, more preferably above 3000 times/minute. The upper limit is not particularly limited, but can be appropriately determined according to the performance of the cam mechanism 30 and the motor 40 , for example, it may be less than 100,000 times/min, or less than 50,000 times/min. The faster the movement speed, the more it is possible to grind/grind the workpiece 11 only by shear force.

In addition, among the known devices, in order to reduce grinding or grinding unevenness, some are provided with a mechanism that allows the rotating processing head to perform an oscillating motion. This unevenness is caused by the processing anisotropy of the workpiece. That is, when the grinding/grinding is performed by the rotation of the processing head, the processing amount in the easy-to-machine direction is large, and the processing amount in the difficult-to-machine direction is small, thus causing processing failures in the grinding/grinding caused by the rotational movement. all. In order to suppress such unevenness, some devices are equipped with a mechanism that performs rocking motion together with rotational motion.

However, even with the device equipped with this mechanism, the workpiece is not processed by rocking motion, but is still processed by the rotary motion of the processing head. In such a known device, the processing head rotates, so if the shaking movement is fast, it will cause unevenness. Therefore, the movement speed of the shaking movement is deliberately set to be slow, usually about 1-10 times/minute. Therefore, in known devices it is not possible to stop the rotational movement and rely only on the rocking movement for the grinding or lapping of the substrate. Like this, in the known device, although there are also those who perform the swinging motion of the processing head, the processing head performs the slow swinging motion while rotating, so this embodiment does not perform the rotary motion when performing the reciprocating linear motion with the processing head 20. The morphology of the processing device 1 is very different.

In addition, as a modified example of the present embodiment, the fixing part 10 may perform reciprocating linear motion together with the machining head 20 . In this case, each of the fixing part 10 and the processing head 20 is equipped with the aforementioned cam mechanism 30 and motor 40 . In addition, as described above, the female members 32 of the cam mechanism 30 each move only in the left-right direction 20a with guides not shown.

The reciprocating linear motion direction of each of the fixing part 10 and the processing head 20 may be the same direction or opposite directions. When the reciprocating linear motion direction of the processing head 20 and the reciprocating linear motion direction of the fixing part 10 are in opposite directions, the reciprocating linear motion speeds of each may be the same. When the speed of reciprocating linear motion is different, the same direction and the opposite direction will be repeated periodically.

When the fixed part 10 and the machining head 20 perform reciprocating linear motion at the same speed in opposite directions, the relative speed is doubled. Therefore, compared with the case where only one of them performs reciprocating linear motion, the processing rate can be increased. In addition, when grinding or polishing is performed in this manner, the relative speed is doubled, so the number of rotations of the motor 40 provided on the fixed part 10 and the processing head 20 can be halved, and the load on the motor 40 can be reduced. For example, in the processing device 1 shown in FIG. 1 in which only the processing head 20 performs reciprocating linear motion, it is assumed that the reciprocating linear motion speed is 1000 times/minute. And the device that uses the fixed part 10 and the processing head 20 to perform reciprocating linear motion at the same speed in opposite directions, if the substrate is to be processed at the same processing speed as the aforementioned device, the reciprocating linear motion speed of each is only 500 times/ minute.

In addition, if the reciprocating linear motion speeds of the fixed part 10 and the processing head 20 are different, and the actions in the opposite direction and the same direction are periodically repeated, grinding or grinding in the same direction will be carried out periodically, thus reducing the impact on The load applied by the workpiece 11 and the processing device 1 can realize higher-precision surface processing. The ratio of the reciprocating linear motion speed of the fixed part 10 to the processing head 20, within the range of the aforementioned reciprocating linear motion speed, can be V _{fixed part} : V _{processing head} = 1:10~10:1, more preferably 1 :5~5:1. If it falls within this range, the workpiece 11 can be processed gently, and the processing accuracy will be further improved.

In the present embodiment, the surface of the workpiece 11 is ground/polished with the shear force generated between the workpiece 11 and the workpiece as the main processing force. In conventional processing devices, grinding or lapping in the easy-to-process direction is not performed, so resisting force must be required in addition to shearing force. Therefore, especially in the case of processing high-hardness materials such as diamond or GaN, a high degree of device rigidity is required, and the processing rate cannot be increased. On the other hand, in this embodiment, the grinding/grinding of the workpiece 11 is mainly performed by shear force, and the pressing force by the machining head 20 hardly acts on the grinding or grinding. This is because, when the reciprocating linear motion of the fixing portion 10 or the processing head 20 is performed along the easy-to-process direction of the workpiece 11, grinding/grinding is particularly easy to perform with little pressing force. The resisting force can be less than 100kg/cm ² , more preferably less than 1kg/cm ² , or less than 0.1kg/cm ² , as long as there is a resisting force caused by the weight of the processing head 20 . The resisting force can be measured by, for example, a load cell.

The processing head 20 of the processing device 1 may be provided with a whetstone or a polishing pad (not shown) as a processing material on the surface of the workpiece 11 side. The whetstone, for example, can be formed by bonding diamond grains or CBN grains with a porcelain bond. In addition, the processing material does not have to be installed in the processing head 20, and may be a slurry containing abrasive grains, a chemical for surface grinding/polishing, and abrasive grain powder. Grinding/polishing may be performed while supplying these workpieces between the machining head 20 and the workpiece 11 . The workpiece 11 may also be fixed to the processing head 20 . In this case, when the processed material is a whetstone or a processing tool, they may also be fixed to the fixing portion 10 .

In the processing device 1 of this embodiment, at least one of the fixed part 10 and the processing head 20 performs a reciprocating linear motion while grinding/grinding the workpiece 11 . Compared with the case of grinding/grinding while rotating a machining head or table in a conventional machining device, grinding/grinding can be performed in the easy-to-process direction of the workpiece 11 . Therefore, the load on the processing device 1 is reduced, and even a high-hardness workpiece 11 such as diamond can be ground/polished at a high processing rate with the rigidity of a conventional device.

Also, as a modified example of the present embodiment, when one of the fixed part 10 and the processing head 20 performs reciprocating linear motion as described above, the other side may also be equipped with a motor like a known device, and the shaft of the motor may be Rotary motion is performed in conjunction with the rotary motion. When one side performs reciprocating linear motion and the other side performs rotational motion, the moving line of the workpiece on the workpiece 11 becomes a bellows shape. In this case, compared with the case where both the fixing part 10 and the processing head 20 perform reciprocating linear motion, the easy-to-process direction of the workpiece 11 deviates from the width of the mountain and valley of the bellows. However, since the moving speed of the reciprocating linear motion is linked to the rotational speed of the motor 40, it moves at high speed. Therefore, compared with the conventional device where both the fixed part 10 and the processing head 20 rotate, the workpiece 11 is generally processed in the easy-to-process direction, so compared with the conventional device, the rigidity of the device can be suppressed and a high processing rate can be obtained. . In this case, the deviation from the easy-to-process direction is greatly reduced compared to the conventional case where at least one side is rotated to perform grinding/grinding, so the rigidity of the device can be suppressed lower than the conventional one. , and the processing quality will also be improved.

In this way, in the form of rotating motion on one side, it is designed so that the processing direction of grinding/grinding is as close as possible to the easy-to-process direction of the workpiece 11, so the speed of the linear reciprocating motion on the other side is better. as fast as possible. The movement speed is preferably 1000~100000 times/minute, more preferably 10000~80000 times/minute.

When the fixed part 10 or the processing head 20 performs a rotary movement, the rotary mechanism can be a known device. In addition, the rotation speed can also be the same as the known device, but in order to approach the easy-processing direction of the workpiece 11 as much as possible, the rotation speed is preferably as slow as possible. The movement speed is below 1000rpm, more preferably below 500rpm, even more preferably below 100rpm.

Like this, the ratio of motion speed in the case where one side performs reciprocating linear motion and the other side performs rotational motion is preferably V _{reciprocating linear motion} : V _{rotary motion} = 1000: 1 ~ 1: 1, more preferably 1000: 1 ~ 160:1. If it is within this range, grinding or polishing can be performed in a direction as close as possible to the easy-to-process direction of the workpiece 11 even when one side is rotating.

According to the above, in this embodiment and the modified example, the fixing part 10 has three types of fixing, rotating motion, and reciprocating linear motion, and the processing head 20 also has three types of fixing, rotating motion, and reciprocating linear motion, and a total of nine types are included. In addition, since the workpiece 11 includes two types of being fixed to the fixing part 10 and being fixed to the processing head 20, a total of 18 operation modes are included.

2. Processing method The processing method of this embodiment can process using the processing apparatus 1 mentioned above, for example. In detail, an example of a processing method in which the fixing part 10 is fixed to the pedestal 2 without moving, and the diamond substrate as the workpiece 11 is ground by the reciprocating linear motion of the processing head 20 equipped with a diamond whetstone as the processing material is described using FIG. 2 .

Fig. 2 is a flow chart of the processing method of this embodiment. First, a diamond substrate of □5 to 7 mm in thickness of 50 μm to 2 mm produced by heteroepitaxial growth of diamond by, for example, CVD is prepared ( S1 ). Next, the adhesive tape for board|substrate fixing is attached to the fixing|fixed part 10 (S2). In S2 , when the diamond substrate is fixed to the processing head 20 , the substrate fixing tape is attached to the processing head 20 .

Next, the diamond substrate is fixed to the fixing part 10 (S3). In the case of grinding the (100) plane of the diamond substrate, ideally, the grinding is performed at an angle of 90°, 180°, or 270° by the reciprocating linear motion of the processing head 20 . For example, the diamond substrate is fixed by the fixing part 10 so that the angle of 90° with respect to the (100) plane of the manufactured diamond substrate becomes the direction of the reciprocating linear motion of the machining head 20 . Marks are provided on the diamond substrate in advance so as to know the easy-to-polish direction, so the diamond substrate is fixed to the fixing part 10 based on the marks.

Thereafter, before the processing head 20 starts to move, the processing head 20 is pressed against the processing surface of the workpiece 11 ( S4 ). The resisting force can be measured by a dynamometer, for example, the resisting force is below 100kg/cm ² . Generally speaking, the pressing force caused by the dead weight of the processing head 20 is sufficient.

Next, the rotation speed and processing time of the motor 40 are set on a control panel (not shown) provided in the processing device 1, and the reciprocating linear motion of the processing head 20 is started (S5), and the polishing of the diamond substrate is started. When there is no control panel, grinding or grinding can be performed while observing the workpiece 11 with an external monitor not shown and monitoring the processing amount. In order to confirm the grinding amount of the substrate, the movement of the processing head 20 may be stopped midway, and the grinding amount of the diamond substrate may be measured. The reciprocating linear motion speed of the processing head can be more than 100 times/minute, for example, it can be 3000~5000 times/minute. As another embodiment, as shown in FIG. 3 , S5 and S4 in FIG. 2 can also be reversed. That is, after the reciprocating linear motion of the processing head 20 starts, the processing head 20 may be pressed against the processing surface of the workpiece 11 . In addition, when the fixing part 10 also performs reciprocating linear motion, the timing of the fixing part 10 can be the same as that of the processing head 20 . Even when one of the fixed part 10 and the processing head 20 performs rotational motion, the timing of the motion may be the same as that of the other. After reaching the predetermined processing time or processing amount, the processing is terminated.

1: Processing device 2: Pedestal 3: frame 10: fixed part 11: Processed object 20: Processing head 20a: left and right direction 30: Cam mechanism 31: Eccentric cylinder 32: Concave member 32a: concave part 33: Drive pin 33a: Front and rear directions 40: motor 40a: Direction of rotation

[FIG. 1] FIG. 1 is a perspective view showing an example of the processing apparatus of this embodiment. [FIG. 2] FIG. 2 is a flow chart of the processing method of this embodiment. [FIG. 3] FIG. 3 is a flow chart of another processing method of this embodiment.

1: Processing device

2: Pedestal

3: frame

10: fixed part

11: Processed object

20: Processing head

20a: left and right directions

30: Cam mechanism

31: Eccentric cylinder

32: Concave member

32a: concave part

33: Drive pin

33a: Front and rear directions

40: motor

40a: Direction of rotation

Claims (11)

A processing device including a fixing part for fixing a workpiece and the like, and a processing head for grinding/grinding the workpiece with a workpiece, the processing device is characterized in that, At least one of the fixed part and the processing head is equipped with a motor and a cam mechanism that converts the rotational motion of the motor into a reciprocating linear motion, and the aforementioned reciprocating linear motion is performed by interlocking with the reciprocating linear motion converted by the cam mechanism. Grinding/grinding of workpieces. The processing device according to claim 1, wherein the workpiece is ground/grinded with shear force generated between the workpiece and the workpiece as the main processing force. The processing device according to claim 1 or 2, wherein the speed of the reciprocating linear motion is 100 times/minute or more. The processing device according to any one of claims 1 to 3, wherein the aforementioned workpiece is made of a glass material, an amorphous material, a single crystal material, or a material having a cleaved surface. The processing device according to any one of claims 1 to 4, wherein the object to be processed is a substrate. The processing device according to any one of Claims 1 to 5, wherein when one of the fixed part and the processing head performs grinding/grinding of the workpiece by the reciprocating linear motion, the other One side is fixed and does not move. The processing device according to any one of Claims 1 to 5, wherein each of the fixed part and the processing head includes a motor and a cam mechanism that converts the rotational motion of the shaft of the motor into a reciprocating linear motion, and The above-mentioned reciprocating linear motion is performed in conjunction with the reciprocating linear motion transformed by the aforementioned cam mechanism. The processing device according to claim 7, wherein the fixing part and the processing head perform linear reciprocating motions in opposite directions. The processing device as described in claim 7, wherein the moving speeds of the fixing part and the processing head are different, and the movements in opposite directions and in the same direction are periodically repeated. The processing device according to any one of Claims 1 to 5, wherein when one of the fixed part and the processing head performs grinding/grinding of the workpiece by the reciprocating linear motion, the other A motor is provided, and the rotational movement is performed in conjunction with the rotational movement of the shaft of the motor. A processing method using the processing device described in any one of Claims 1 to 10, the processing device having a fixing part for fixing a workpiece, etc., and a processing head for grinding/grinding the workpiece with a processing material , the processing method is characterized by, At least one of the fixed part and the processing head is provided with a motor and a cam mechanism for converting the rotational motion of the motor into a reciprocating linear motion, and the aforementioned processed object is performed by interlocking with the reciprocating linear motion converted by the cam mechanism. Grinding/grinding of objects.

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