JPWO2022210721A1 - - Google Patents

Info

Publication number
JPWO2022210721A1
JPWO2022210721A1 JP2023511384A JP2023511384A JPWO2022210721A1 JP WO2022210721 A1 JPWO2022210721 A1 JP WO2022210721A1 JP 2023511384 A JP2023511384 A JP 2023511384A JP 2023511384 A JP2023511384 A JP 2023511384A JP WO2022210721 A1 JPWO2022210721 A1 JP WO2022210721A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023511384A
Other languages
Japanese (ja)
Other versions
JP7411143B2 (en
JPWO2022210721A5 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022210721A1 publication Critical patent/JPWO2022210721A1/ja
Publication of JPWO2022210721A5 publication Critical patent/JPWO2022210721A5/ja
Application granted granted Critical
Publication of JP7411143B2 publication Critical patent/JP7411143B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00Component parts such as frames, beds, carriages, headstocks
    • B24B41/04Headstocks; Working-spindles; Features relating thereto
    • B24B41/047Grinding heads for working on plane surfaces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/24Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
JP2023511384A 2021-03-30 2022-03-29 Processing equipment and processing method Active JP7411143B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021057452 2021-03-30
JP2021057452 2021-03-30
PCT/JP2022/015477 WO2022210721A1 (en) 2021-03-30 2022-03-29 Machining apparatus and machining method

Publications (3)

Publication Number Publication Date
JPWO2022210721A1 true JPWO2022210721A1 (en) 2022-10-06
JPWO2022210721A5 JPWO2022210721A5 (en) 2023-06-16
JP7411143B2 JP7411143B2 (en) 2024-01-10

Family

ID=83456372

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023511384A Active JP7411143B2 (en) 2021-03-30 2022-03-29 Processing equipment and processing method

Country Status (3)

Country Link
JP (1) JP7411143B2 (en)
TW (1) TW202302278A (en)
WO (1) WO2022210721A1 (en)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5334024B2 (en) * 1974-03-13 1978-09-18
JPS56176146U (en) * 1980-05-31 1981-12-25
JP3652163B2 (en) 1999-03-15 2005-05-25 キヤノン株式会社 Polishing method
JP2001287153A (en) 2000-04-05 2001-10-16 Asahi Optical Co Ltd Polisher and controlling method therefor

Also Published As

Publication number Publication date
TW202302278A (en) 2023-01-16
JP7411143B2 (en) 2024-01-10
WO2022210721A1 (en) 2022-10-06

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