JPWO2022210721A1 - - Google Patents
Info
- Publication number
- JPWO2022210721A1 JPWO2022210721A1 JP2023511384A JP2023511384A JPWO2022210721A1 JP WO2022210721 A1 JPWO2022210721 A1 JP WO2022210721A1 JP 2023511384 A JP2023511384 A JP 2023511384A JP 2023511384 A JP2023511384 A JP 2023511384A JP WO2022210721 A1 JPWO2022210721 A1 JP WO2022210721A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/04—Headstocks; Working-spindles; Features relating thereto
- B24B41/047—Grinding heads for working on plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021057452 | 2021-03-30 | ||
| JP2021057452 | 2021-03-30 | ||
| PCT/JP2022/015477 WO2022210721A1 (en) | 2021-03-30 | 2022-03-29 | Machining apparatus and machining method |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022210721A1 true JPWO2022210721A1 (en) | 2022-10-06 |
| JPWO2022210721A5 JPWO2022210721A5 (en) | 2023-06-16 |
| JP7411143B2 JP7411143B2 (en) | 2024-01-10 |
Family
ID=83456372
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023511384A Active JP7411143B2 (en) | 2021-03-30 | 2022-03-29 | Processing equipment and processing method |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7411143B2 (en) |
| TW (1) | TW202302278A (en) |
| WO (1) | WO2022210721A1 (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5334024B2 (en) * | 1974-03-13 | 1978-09-18 | ||
| JPS56176146U (en) * | 1980-05-31 | 1981-12-25 | ||
| JP3652163B2 (en) | 1999-03-15 | 2005-05-25 | キヤノン株式会社 | Polishing method |
| JP2001287153A (en) | 2000-04-05 | 2001-10-16 | Asahi Optical Co Ltd | Polisher and controlling method therefor |
-
2022
- 2022-03-29 JP JP2023511384A patent/JP7411143B2/en active Active
- 2022-03-29 WO PCT/JP2022/015477 patent/WO2022210721A1/en active Application Filing
- 2022-03-30 TW TW111112169A patent/TW202302278A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW202302278A (en) | 2023-01-16 |
| JP7411143B2 (en) | 2024-01-10 |
| WO2022210721A1 (en) | 2022-10-06 |
Similar Documents
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