JPWO2022210721A5 - - Google Patents

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JPWO2022210721A5
JPWO2022210721A5 JP2023511384A JP2023511384A JPWO2022210721A5 JP WO2022210721 A5 JPWO2022210721 A5 JP WO2022210721A5 JP 2023511384 A JP2023511384 A JP 2023511384A JP 2023511384 A JP2023511384 A JP 2023511384A JP WO2022210721 A5 JPWO2022210721 A5 JP WO2022210721A5
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Prior art keywords
processing
diamond substrate
reciprocating linear
linear motion
motor
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JP2023511384A
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JP7411143B2 (en
JPWO2022210721A1 (en
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Priority claimed from PCT/JP2022/015477 external-priority patent/WO2022210721A1/en
Publication of JPWO2022210721A1 publication Critical patent/JPWO2022210721A1/ja
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Claims (9)

ダイヤモンド基板を固定する固定部と、加工材で前記ダイヤモンド基板の研削・研磨を行う加工ヘッドと、を備える加工装置であって、
前記加工ヘッドに設けられている加工材の面積は、前記ダイヤモンド基板の研磨面の面積より広く、
前記固定部および前記加工ヘッドの少なくとも一方は、モータ、および前記モータの回転運動を往復直線運動に変換するカム機構を備え、前記カム機構で変換された前記往復直線運動に連動することにより、へき開面を有する材料である前記ダイヤモンド基板の加工容易方向に沿って研削・研磨を行う
ことを特徴とする加工装置。 A processing apparatus comprising a fixing part for fixing a diamond substrate , and a processing head for grinding and polishing the diamond substrate with a processing material,
The area of the processing material provided in the processing head is larger than the area of the polishing surface of the diamond substrate,
At least one of the fixing part and the processing head includes a motor and a cam mechanism that converts the rotary motion of the motor into a reciprocating linear motion, and is interlocked with the reciprocating linear motion converted by the cam mechanism to perform cleaving . A processing apparatus for grinding and polishing along an easy-to-process direction of the diamond substrate, which is a material having a surface . 前記ダイヤモンド基板は、前記ダイヤモンド基板と前記加工材との間に発生するせん断力を主たる加工力として研削・研磨がなされる、請求項１に記載の加工装置。 2. The processing apparatus according to claim 1, wherein said diamond substrate is ground and polished using shearing force generated between said diamond substrate and said processing material as a main processing force. 前記往復直線運動の運動速度は、１００回／分以上である、請求項１または２に記載の加工装置。 3. The processing apparatus according to claim 1, wherein said reciprocating linear motion has a motion speed of 100 times/minute or more. 前記固定部および前記加工ヘッドのいずれか一方が前記往復直線運動により前記ダイヤモンド基板の研削・研磨を行う場合、他方は動かないように固定されている、請求項１～３のいずれか１項に記載の加工装置。 4. The apparatus according to any one of claims 1 to 3 , wherein one of said fixed part and said processing head is fixed so as not to move when either one of said fixed part and said processing head grinds and polishes said diamond substrate by said reciprocating linear motion. Processing equipment as described. 前記固定部および前記加工ヘッドの各々は、モータ、および前記モータの軸の回転運動を往復直線運動に変換するカム機構を備え、前記カム機構で変換された往復直線運動に連動して前記往復直線運動を行う、請求項１～３のいずれか１項に記載の加工装置。 Each of the fixed part and the processing head includes a motor and a cam mechanism that converts the rotational motion of the shaft of the motor into reciprocating linear motion, and the reciprocating linear motion is interlocked with the reciprocating linear motion converted by the cam mechanism. The processing device according to any one of claims 1 to 3 , which performs exercise. 前記固定部と前記加工ヘッドは、互いに反対方向に往復直線運動を行う、請求項５に記載の加工装置。 6. The processing apparatus according to claim 5 , wherein said fixed portion and said processing head perform reciprocating linear motion in directions opposite to each other. 前記固定部および前記加工ヘッドの運動速度は異なり、互いに周期的に反対方向および同一方向の運動を繰り返す、請求項５に記載の加工装置。 6. The processing apparatus according to claim 5 , wherein said fixed part and said processing head have different motion speeds, and periodically repeat motions in opposite directions and in the same direction. 前記固定部および前記加工ヘッドのいずれか一方が前記往復直線運動により前記ダイヤモンド基板の研削・研磨を行う場合、他方は、モータを備え、前記モータの軸の回転運動に連動して回転運動を行う、請求項１～３のいずれか１項に記載の加工装置。 When one of the fixed part and the processing head grinds and polishes the diamond substrate by the reciprocating linear motion, the other is provided with a motor and performs rotational motion in conjunction with the rotational motion of the shaft of the motor. The processing apparatus according to any one of claims 1 to 3 . ダイヤモンド基板を固定する固定部と、加工材で前記ダイヤモンド基板の研削・研磨を行う加工ヘッドと、を備える請求項１～８のいずれか１項に記載の加工装置を用いた加工方法であって、
前記加工ヘッドに設けられている前記加工材の面積は、前記ダイヤモンド基板の研磨面の面積より大きく、
前記固定部および前記加工ヘッドの少なくとも一方は、モータ、および前記モータの回転運動を往復直線運動に変換するカム機構を備え、前記カム機構で変換された往復直線運動に連動することにより、へき開面を有する材料である前記ダイヤモンド基板の加工容易方向に沿って研削・研磨を行う
ことを特徴とする加工方法。 A processing method using the processing apparatus according to any one of claims 1 to 8 , comprising a fixing portion for fixing a diamond substrate , and a processing head for grinding and polishing the diamond substrate with a processing material. ,
The area of the processing material provided in the processing head is larger than the area of the polished surface of the diamond substrate,
At least one of the fixing portion and the processing head includes a motor and a cam mechanism that converts the rotary motion of the motor into reciprocating linear motion. A processing method characterized in that grinding and polishing are performed along the direction of easy processing of the diamond substrate, which is a material having
JP2023511384A 2021-03-30 2022-03-29 Processing equipment and processing method Active JP7411143B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021057452 2021-03-30
JP2021057452 2021-03-30
PCT/JP2022/015477 WO2022210721A1 (en) 2021-03-30 2022-03-29 Machining apparatus and machining method

Publications (3)

Publication Number Publication Date
JPWO2022210721A1 JPWO2022210721A1 (en) 2022-10-06
JPWO2022210721A5 true JPWO2022210721A5 (en) 2023-06-16
JP7411143B2 JP7411143B2 (en) 2024-01-10

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JP2023511384A Active JP7411143B2 (en) 2021-03-30 2022-03-29 Processing equipment and processing method

Country Status (3)

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JP (1) JP7411143B2 (en)
TW (1) TW202302278A (en)
WO (1) WO2022210721A1 (en)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5334024B2 (en) * 1974-03-13 1978-09-18
JPS56176146U (en) * 1980-05-31 1981-12-25
JP3652163B2 (en) 1999-03-15 2005-05-25 キヤノン株式会社 Polishing method
JP2001287153A (en) 2000-04-05 2001-10-16 Asahi Optical Co Ltd Polisher and controlling method therefor

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