TW202300609A - 表面保護片材及處理方法 - Google Patents

表面保護片材及處理方法 Download PDF

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Publication number
TW202300609A
TW202300609A TW111105242A TW111105242A TW202300609A TW 202300609 A TW202300609 A TW 202300609A TW 111105242 A TW111105242 A TW 111105242A TW 111105242 A TW111105242 A TW 111105242A TW 202300609 A TW202300609 A TW 202300609A
Authority
TW
Taiwan
Prior art keywords
less
protection sheet
water
surface protection
weight
Prior art date
Application number
TW111105242A
Other languages
English (en)
Chinese (zh)
Inventor
熊倉健太
小坂尚史
島﨑雄太
本田哲士
Original Assignee
日商日東電工股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日東電工股份有限公司 filed Critical 日商日東電工股份有限公司
Publication of TW202300609A publication Critical patent/TW202300609A/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/022—Mechanical properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW111105242A 2021-03-25 2022-02-14 表面保護片材及處理方法 TW202300609A (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2021-052064 2021-03-25
JP2021052064 2021-03-25
JP2021-151206 2021-09-16
JP2021151206 2021-09-16
PCT/JP2022/003426 WO2022201858A1 (ja) 2021-03-25 2022-01-28 表面保護シートおよび処理方法
WOPCT/JP2022/003426 2022-01-28

Publications (1)

Publication Number Publication Date
TW202300609A true TW202300609A (zh) 2023-01-01

Family

ID=83396801

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111105242A TW202300609A (zh) 2021-03-25 2022-02-14 表面保護片材及處理方法

Country Status (3)

Country Link
JP (1) JPWO2022201858A1 (ko)
TW (1) TW202300609A (ko)
WO (1) WO2022201858A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024068717A (ja) * 2022-11-09 2024-05-21 日東電工株式会社 保護シート、及び、電子部品装置の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MX169921B (es) * 1988-10-26 1993-07-30 Kimberly Clark Co Mejoras a material de hoja con adhesivo sensible ala presion y desprendible con agua
US5284690A (en) * 1992-11-03 1994-02-08 Rohm And Haas Company Aqueous release coating composition for pressure sensitive adhesives
JP2006241264A (ja) * 2005-03-02 2006-09-14 Kuramoto Sangyo:Kk 粘着組成物及びそれを用いた温水剥離型粘着シート
JP2012514104A (ja) * 2008-12-31 2012-06-21 スリーエム イノベイティブ プロパティズ カンパニー 引き伸ばし剥離可能な接着テープ
CN112920738B (zh) * 2018-02-05 2022-08-16 日东电工株式会社 粘合片及粘合片剥离方法
JP2021024182A (ja) * 2019-08-02 2021-02-22 日東電工株式会社 積層体および剥離方法
JP7441012B2 (ja) * 2019-08-02 2024-02-29 日東電工株式会社 粘着シート

Also Published As

Publication number Publication date
JPWO2022201858A1 (ko) 2022-09-29
WO2022201858A1 (ja) 2022-09-29

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