TW202245919A - Wafer cleaning and drying device and wafer cleaning and drying method - Google Patents

Abstract

The invention provides a wafer cleaning and drying device and a wafer cleaning and drying method, and the device comprises a conveying belt which sequentially comprises a carrying-in section, a cleaning section and a carrying-out section in the conveying direction; a clamping part used for clamping and moving the wafer entering the cleaning section, wherein the clamping part can reciprocate in the first direction so as to clamp and move the wafer to a preset cleaning position, and the first direction is perpendicular to the bearing surface of the conveying belt; a blowing device used for blowing air to the surface of the wafer at the preset position, wherein the blowing device can move in a reciprocating mode in the first direction and/or the second direction so as to move in or move out of the wafer surface blowing operation position, and the second direction is perpendicular to the first direction; and a spraying brush used for cleaning the surface of the wafer, wherein the spraying brush at least can move back and forth in the first direction and/or the second direction so as to move into or out of the surface and inside cleaning operation position of the wafer. According to the wafer cleaning and drying device and the wafer cleaning and drying method provided by the invention, the cleaning and drying effect can be improved.

Description

Wafer cleaning and drying device and wafer cleaning and drying method

The invention belongs to the technical field of wafer processing, and in particular relates to a wafer cleaning and drying device and a wafer cleaning and drying method.

Semiconductor silicon materials are the main functional materials of the integrated circuit industry, and the processing technology of silicon wafers has gradually become an important driving force for the development of the electronic information industry. As the diameter of silicon wafers becomes larger and the feature size of integrated circuits becomes smaller and smaller, higher requirements are placed on the flatness and removal rate of the wafer surface. One of the most effective technical means of flatness. For the double-sided grinding technology, while accelerating the removal rate, an efficient and sufficient cleaning and drying process is of great significance and indispensable to ensure the quality of the wafer.

The cleaning and drying method used in the related technology is: after the wafer is double-sided grinding, first use a water pipe to spray water on both sides of the wafer, then start the brush to scrub for a period of time, then spray water to wash, and finally pass the air knife to complete the drying at one time.

This process takes a long time to wash, the efficiency is low, and the washing effect is not good; and the air knife is in a fixed position, and its fixed angle, position, distance, etc. will affect the drying effect. If the gap is too small, the wafer will shake during purging, and the surface of the wafer will be scratched by the air knife, causing the wafer to be scrapped.

It can be seen that the cleaning and drying effect after wafer grinding in the related art is not good.

The embodiment of the present invention provides a wafer cleaning and drying device and a wafer cleaning and drying method, which solve the defects of poor cleaning effect after wafer surface grinding, residual stains, incomplete drying and residual water stains, polluting test equipment, and long cleaning and drying time issues affecting productivity.

The technical scheme provided by the embodiments of the present invention is as follows: An embodiment of the present invention provides a wafer cleaning and drying device, including: Conveyor belt for transporting wafers, which sequentially includes a loading section, a cleaning section, and a loading section along the transmission direction; A clamping part for clamping and moving the wafer entering the cleaning section, the clamping part can reciprocate in a first direction to clamp and move the wafer to a predetermined cleaning position, the first direction is perpendicular to the carrying surface of the conveyor belt; a blower for blowing air on the wafer surface at the predetermined position, the blower can at least reciprocate in the first direction and/or the second direction to move into or out of the wafer surface blowing operation position, the second direction is perpendicular to the first direction; A spraying brush for cleaning the surface of the wafer at the predetermined position, the spraying brush can at least move back and forth in the first direction and/or the second direction to move into or out of the wafer surface Cleaning job location.

Exemplarily, the clamping component includes at least one first positioning column and at least one second positioning column, the first positioning column and the second positioning column are respectively arranged on opposite sides of the wafer, and can be positioned along the second Directions move towards each other to clamp the wafer, or towards each other to release the wafer; At least one side of the first positioning post facing the second positioning post is provided with a first locking groove for clamping one side edge of the wafer, and the second positioning post is provided at least on the side facing the first positioning post It is used to clamp the second slot on the edge of the other side of the wafer.

Exemplarily, the purger includes at least one set of purging units, and the purging units include: A blowing air knife, the blowing air knife is a strip-shaped air knife extending in a direction parallel to the surface of the wafer, and an air port is provided along the extending direction of the strip-shaped air knife; And, a rotating shaft, the axis of the rotating shaft is arranged along the first direction, and the rotating shaft drives the blowing air knife to rotate in a direction parallel to the wafer surface, so that the tuyere is blown from the wafer surface .

Exemplarily, the blowing direction of the tuyere faces the surface of the wafer, and the blowing direction of the tuyere and the surface of the wafer forms a predetermined angle α.

Exemplarily, the predetermined included angle α is 30-45°.

Exemplarily, the rotating shaft is connected to one end of the blowing air knife, the extension length of the tuyere of the blowing air knife is greater than the radius of the wafer, and when the blower is at the blowing operation position, the rotating shaft The axis of the axis is offset from the center of the wafer.

Exemplarily, the number of the spraying brushes is multiple, and is divided into at least one group of brushes, the same group of brushes is located on the same side of the wafer, and the same group of brushes includes at least two a spray brush.

The embodiment of the present invention also provides a wafer cleaning and drying method. The wafer cleaning and drying device provided in the embodiment of the present invention is used to clean and dry the wafer. The method includes: transporting the wafer from the previous step through the conveyor belt from the loading section to the cleaning section; being clamped by the clamping component and moving the wafer in the cleaning section along a first direction, so that the wafer is detached from the carrying surface of the conveyor belt and moved to a predetermined cleaning position; Moving the purger along the first direction and/or the second direction, so that the purger moves into the wafer surface purging operation position, and performs the first purging on the wafer surface; After the first purging operation is completed, the purger is moved out of the wafer surface purging operation position; Moving the spray brush in the first direction and/or the second direction, so that the spray brush moves into the wafer surface cleaning operation position, and sprays and cleans the wafer surface; After the spray cleaning operation is completed, the spray brush is moved out of the wafer surface cleaning operation position; Moving the purger along the first direction and/or the second direction, so that the purger moves into the wafer surface purging operation position, and performs a second purging on the wafer surface to dry the wafer surface ; The dried processed wafers are placed on the conveyor belt by the clamping part, and are transported from the cleaning section to the unloading section by the conveyor belt for the next step.

Exemplarily, the wafer cleaning and drying device adopts the aforementioned wafer cleaning and drying device. In this method, when the purger is used to perform the first and second purging of the wafer surface, the The rotation axis of the blower is offset to one side of the center of the wafer, and the blowing air knife is driven to rotate in a direction parallel to the surface of the wafer to clean the surface of the wafer; wherein, When purging for the first time, the purge gas is a dry inert gas with a temperature of 15~40°C; During the second purge, the purge gas is a dry inert gas with a temperature of 40~45°C.

Exemplarily, in this method, when the surface of the wafer is sprayed and cleaned, it specifically includes: using an alkaline solution as the cleaning solution for the first cleaning, wherein the volume ratio of the components of the alkaline solution is: the concentration is 10% NH ₄ OH: 15% H ₂ O ₂ : H ₂ O = (1:1:8), the cleaning time is 10 ~ 15 s, and the flow rate of the cleaning solution is controlled at 2 ~ 3 L/min; Ultrapure water was used as the cleaning solution for the second cleaning, the cleaning time was 15-20 s, and the flow rate of the cleaning solution was controlled at 20-25 L/min.

Exemplarily, in this method, when spraying and cleaning the surface of the wafer, in the same group of brushes located on the same side of the wafer, at least two spraying brushes rotate in opposite directions when cleaning the wafer.

The beneficial effects brought by the embodiments of the present invention are as follows: In the wafer cleaning and drying device and the wafer cleaning and drying method provided in the embodiments of the present invention, when cleaning and drying the wafer, the surface of the wafer can be purged for the first time with a purger to absorb the surface of the wafer. Remove the stains, and then use the spray brush to spray the liquid while rotating and scrubbing to fully scrub the surface of the wafer, and then use the blower to clean the surface of the wafer for a second time to quickly remove water stains , the whole process is convenient and efficient, and the cleaning and drying effect is excellent.

In order for the Ligui Examiner to understand the technical features, content and advantages of the present invention and the effects it can achieve, the present invention is hereby combined with the accompanying drawings and appendices, and is described in detail in the form of embodiments as follows, and the drawings used therein , the purpose of which is only for illustration and auxiliary instructions, and not necessarily the true proportion and precise configuration of the present invention after implementation, so it should not be interpreted based on the proportion and configuration relationship of the attached drawings, and limit the application of the present invention in actual implementation The scope is described first.

In the description of the embodiments of the present invention, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical ", "horizontal", "top", "bottom", "inner", "outer" and other indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying Describes, but does not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and operate in a specific orientation, and therefore should not be construed as limiting the invention.

In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of said features. In the description of the embodiments of the present invention, "plurality" means two or more, unless otherwise specifically defined.

In the embodiments of the present invention, terms such as "installation", "connection", "connection" and "fixation" should be interpreted in a broad sense unless otherwise clearly specified and limited. Disassembled connection, or integration; it can be mechanical connection or electrical connection; it can be direct connection or indirect connection through an intermediary, and it can be the internal communication of two components or the interaction relationship between two components. Those with ordinary knowledge in the art can understand the specific meanings of the above terms in the embodiments of the present invention according to specific situations.

The embodiment of the present invention provides a wafer cleaning and drying device and a wafer cleaning and drying method, which solve the defects of poor cleaning effect after wafer surface grinding, residual stains, incomplete drying and residual water stains, polluting test equipment, and long cleaning and drying time issues affecting productivity.

FIG. 1 and FIG. 2 are schematic structural diagrams of wafer cleaning and drying devices provided in some embodiments of the present invention. As shown in Figures 1 and 2, in some embodiments of the present invention, the wafer cleaning and drying device includes: a conveyor belt 100, a clamping component 200, a purging device 300, and a spray brush 400, and the conveyor belt 100 is used to transport wafers. Circle 10, the conveyor belt 100 sequentially includes a loading section A, a cleaning section B, and a loading section C (not shown in the figure) along the transmission direction; the clamping part 200 is used to clamp and move the wafer entering the cleaning section B 10. The clamping component 200 can reciprocate in a first direction Z to clamp and move the wafer 10 to a predetermined cleaning position, the first direction Z is perpendicular to the carrying surface of the conveyor belt 100; the blower 300 For blowing air on the surface of the wafer 10 at the predetermined position, the blower 300 can at least move back and forth in the first direction Z and/or the second direction X, so as to move into or out of the cleaning operation position on the surface of the wafer 10 , the second direction X is perpendicular to the first direction Z; the spray brush 400 is used to clean the surface of the wafer 10 at the predetermined position, and the spray brush 400 can at least move in the first direction Z and/or Or move back and forth in the second direction X to move in or out of the cleaning operation position for the front and back of the wafer 10 .

The wafer 10 cleaning and drying device provided in the embodiment of the present invention can, when the wafer 10 is cleaned and dried, enter the loading section of the conveyor belt 100 (shown in FIG. shown), and then enter the cleaning section B (shown in FIG. 2 ) from the loading section A through the conveyor belt 100. At this time, the wafer 10 is clamped by the clamping part 200, and the wafer 10 is moved along the first direction Z. That is, the lifting wafer 10 is clamped from the carrying surface of the conveyor belt 100, so that the wafer 10 rises to a set predetermined cleaning position. position; as shown in Figure 3, after the wafer 10 rises to the predetermined cleaning position, the purger 300 then moves into the purging operation position on the surface of the wafer 10, and the surface of the wafer 10 is purged for the first time, so as to Fully purge the stains adsorbed on both sides of the wafer 10; after the first purge is completed, the purger 300 moves away from the purge position on the surface of the wafer 10, as shown in Figure 5, the spray brush 400 moves to the wafer 10 Above and/or below, the spray brush 400 sprays out the cleaning liquid to clean the wafer 10. After the cleaning is completed, the spray brush 400 resets, and the purger 300 moves into the purging operation position again to clean the wafer 10. The second purge is to remove water stains on the surface of the wafer 10 and dry the wafer 10; after that, the clamping part 200 moves the wafer 10 down and releases the wafer 10, and the wafer 10 enters the unloading section C along with the conveyor belt 100, Proceed to the next step.

The wafer 10 cleaning and drying device provided in the embodiment of the present invention can be applied to the cleaning and drying of the wafer 10 after double-sided grinding, and can fully, quickly and efficiently clean and dry the surface of the wafer 10. The first purge was performed to remove stains, and the second purge was performed after the wafer 10 was cleaned. The stains were fully removed and the drying effect was good.

As shown in FIGS. 1 to 8 , in some embodiments, the clamping member 200 includes at least one first positioning post 210 and at least one second positioning post 220 , the first positioning post 210 and the second positioning post 220 They are respectively arranged on opposite sides of the wafer 10, and can move toward each other along the second direction X to clamp the wafer 10, or move oppositely to release the wafer 10; the first positioning column 210 is at least facing the second One side of the positioning column 220 is provided with a first clamping groove 211 for clamping one side edge of the wafer 10 , and the second positioning column 220 is provided with at least one side facing the first positioning column 210 for clamping the wafer 10 . Second card slot on the other edge.

In the above solution, the clamping component 200 may include at least two positioning columns. When the wafer 10 needs to be clamped, the first positioning column 210 and the second positioning column 220 move toward each other to reduce the distance between them. , while clamping the wafer 10; when the wafer 10 needs to be placed on the conveyor belt 100, the first positioning column 210 and the second positioning column 220 are controlled to move away from each other to increase the distance between the two, and release Wafer 10. It should be noted that, in the above solution, the first positioning column 210 and the second positioning column 220 can move in the first direction Z to lift the wafer 10, and at the same time move along the second direction parallel to the surface of the wafer 10. X movement to achieve opposite or opposite movement.

In addition, the structures of the first clamping slot 211 and the second clamping slot should match the chamfering structure of the edge of the wafer 10 to better clamp the wafer 10 and ensure that the wafer 10 is not damaged. For example, matching chamfering structures are also designed on the first card slot 211 and the second card slot, and the first card slot 211 and the second card slot can also be made of elastically deformable materials or the like.

It should also be noted that the clamping component 200 is not limited to the above method of using at least two positioning columns, for example, a manipulator may also be used, as long as the purpose of clamping and moving the wafer 10 can be achieved without interfering with the wafer 10. The blower 300 and the spray brush 400 only need to move.

In addition, as shown in Fig. 2, Fig. 3 and Fig. 4, in some exemplary embodiments, the blower 300 includes at least one set of blowing units, and the blowing unit includes: a blowing air knife 310 and a rotating shaft 320, the blowing air knife 310 is a strip-shaped air knife extending parallel to the surface of the wafer 10, and a tuyere 311 is provided along the extending direction of the strip-shaped air knife, and the blowing direction of the tuyere 311 faces the wafer 10 surface; the axis of the rotating shaft 320 is set along the first direction Z, and the rotating shaft 320 drives the blowing air knife 310 to rotate in a direction parallel to the surface of the wafer 10, so that the tuyere 311 is removed from the wafer 10 surface purge.

With the above solution, the number of the purging unit can be one or two, which can be set according to the actual cleaning requirements of the wafer 10 . When the quantity of purging unit is one, only one side surface of wafer 10 can be cleaned, or after one side surface cleaning is completed, the purging unit moves to the other side of wafer 10 for another surface cleaning; The number of sweeping units can also be two. As shown in the figure, when purging the wafer 10, a purging unit can be moved into the top and bottom of the wafer 10 respectively, and both sides of the wafer 10 can be purged at the same time.

In addition, in the above solution, the purger 300 is designed in such a way that the blowing knife edge can rotate on the surface of the wafer 10 for one revolution under the drive of the rotating shaft 320. In this way, it can effectively ensure that the purge area covers the entire surface of the wafer 10, and it is not easy to leave Purge the dead angle to ensure the purge effect.

In some embodiments, the rotating shaft 320 is connected to one end of the air blowing knife 310, and the air outlet 311 of the air blowing knife 310 extends longer than the radius of the wafer 10, for example, the air outlet of the air blowing knife 310 The extension length of 311 is about 5-10 mm greater than the radius of the wafer 10, and when the purger 300 is located at the purging operation position, the axis of the rotation axis 320 is offset from the center of the wafer 10, that is, The rotating shaft 320 is located directly above the wafer 10 to one side, so that it can be further ensured that when the blowing air knife 310 rotates, the blowing area completely covers the surface of the wafer 10 .

In addition, in some embodiments, as shown in FIG. 4 , the blowing direction of the tuyere 311 faces the surface of the wafer 10 , and the blowing direction of the tuyere 311 and the surface of the wafer 10 form a predetermined angle α. Exemplarily, the predetermined included angle α is 30-45°. By adopting the above scheme, the air flow direction on the surface of the wafer 10 is optimized to ensure the best purging effect.

In addition, the specific structure of the blowing air knife 310 can be various. For example, the blower 300 can have three specifications, and the tuyere 311 is designed as a point (as shown in a in FIG. 7 ) and an alternate arc (as shown in FIG. 7 b) and linear (c in Figure 7). Of course, it can be understood that the above is only an example, and the specific structure of the tuyere 311 is not limited thereto.

In addition, in some embodiments, as shown in FIG. 5 and FIG. 6 , the shower brush 400 includes a brush base 410 , bristles 420 and a shower head 430 disposed on the brush base 410 . The shower head 430 is located at the center of the bristles 420 . There are multiple spraying brushes 400, and they are divided into at least one group of brushes, the same group of brushes is located on the same side of the wafer 10, and the same group of brushes includes at least two spraying brushes. As for the shower brushes 400, at least two shower brushes 400 in the brush group of the same group rotate in opposite directions when cleaning the wafer 10.

With the above-mentioned scheme, the spraying brushes 400 in the same group of brushes on the same side of the wafer 10 surface rotate in opposite directions. Taking the direction shown in the figure as an example, the spraying brushes 400 located on the left side above the wafer 10 Quickly rotate clockwise for scrubbing, and the right side spray brush 400 quickly rotates counterclockwise for scrubbing. This scrubbing method facilitates the rapid flow of dirt and water from the surface of the wafer 10 .

The number of the brush group can be 1 or 2, which can be set according to the actual cleaning requirements of the wafer 10 . When the number of brush groups is one, only the surface on one side of the wafer 10 can be cleaned, or after the cleaning of one side surface is completed, the brush group moves to the other side of the wafer 10 to clean another surface; There can also be two brush groups. As shown in FIG. 5 , when the wafer 10 is cleaned, a brush group can be moved into the upper and lower sides of the wafer 10 to clean both sides of the wafer 10 at the same time.

In addition, the embodiment of the present invention also provides a method for cleaning and drying the wafer 10. The wafer 10 cleaning and drying device provided in the embodiment of the present invention is used to clean and dry the wafer 10. The method includes: Step S01, transferring the wafer 10 from the previous step from the loading section A to the cleaning section B through the conveyor belt 100; Step S02, clamping by the clamping part 200, and moving the wafer 10 in the cleaning section B along the first direction Z, so that the wafer 10 is detached from the carrying surface of the conveyor belt 100 and moved to a predetermined cleaning position; Step S03, moving the purger 300 along the first direction Z and/or the second direction X, so that the purger 300 moves into the cleaning operation position on the surface of the wafer 10, and blows the surface of the wafer 10 for the first time. sweep; Step S04, the first purge operation is completed, and the purger 300 is moved out of the surface purge operation position of the wafer 10; Step S05, moving the spraying brush 400 in the first direction Z and/or the second direction X, so that the spraying brush 400 moves into the cleaning operation position on the surface of the wafer 10, and cleans the surface of the wafer 10. spray cleaning; Step S06, the spray cleaning operation is completed, and the spray brush 400 is moved out of the surface cleaning operation position of the wafer 10; Step S07, moving the purger 300 along the first direction Z and/or the second direction X, so that the purger 300 moves into the cleaning operation position on the surface of the wafer 10, and blows the surface of the wafer 10 for the second time. Sweep to dry the surface of the wafer 10; Step S08 , place the dried wafer 10 on the conveyor belt 100 by the clamping part 200 , and transport it from the cleaning section B to the unloading section C by the conveyor belt 100 to proceed to the next step.

In the wafer 10 cleaning and drying method provided in the embodiment of the present invention, when the wafer 10 is cleaned and dried, the surface of the wafer 10 can be purged with the purger 300 for the first time, so as to absorb the surface of the wafer 10 Stains are removed, and then the spray brush 400 is used to spray the liquid while rotating and scrubbing, and the surface of the wafer 10 is fully scrubbed, and then the purging device 300 is used to clean the surface of the wafer 10 for the second time to quickly Remove water stains, the whole process is convenient and efficient, and the cleaning and drying effect is excellent.

In addition, in some exemplary embodiments, in this method, when using the purger 300 to perform the first purging and the second purging on the wafer surface, the rotation axis 320 of the purger 300 is offset Move to the center side of the wafer, drive the blowing air knife 310 to rotate in a direction parallel to the surface of the wafer 10, so as to blow the surface of the wafer 10; The purge gas is a dry inert gas with a temperature of 15~40°C; for the second purge, the purge gas is a dry inert gas with a temperature of 40~45°C.

In the above scheme, the purge gas used for the first purge is a dry inert gas at normal temperature, the purpose is to remove the grinding residue adsorbed on the surface of the wafer 10; The gas can be nitrogen, argon, etc., which are cheap and easy to obtain. The wafer 10 is not easily oxidized in these atmospheres. The temperature of the inert gas reaches 40~45 °C, which can accelerate the removal and volatilization of residual moisture on the surface of the wafer 10, and the pressure of the controlled gas is not low. At 40 KPa, it is ensured that when the gas is ejected, a planar strong airflow can be formed, and water stains on the surface of the wafer 10 can be fully removed.

It should be noted that when the temperature of the inert gas reaches 40-45°C during the second purge, a heater can be installed on the purger 300, and the temperature reaches 40-45°C after the gas passes through the heater.

In addition, in some embodiments, in the method, when the surface of the wafer 10 is sprayed and cleaned, it specifically includes: First, using an alkaline solution as the cleaning solution for the first cleaning, wherein the components of the alkaline solution are The volume ratio is: ammonium hydroxide NH ₄ OH with a concentration of 10%: hydrogen peroxide H ₂ O ₂ with a concentration of 15%: water H ₂ O = (1:1:8), and the cleaning time is 10 ~ 15 S , the flow rate of the cleaning solution is controlled at 2 ~ 3 L/min, which can promote the reaction of impurities and oxides and dissolve them in the alkaline cleaning solution; then, use ultrapure water as the cleaning solution for the second cleaning, and the cleaning time is 15 ~ 20 S, the flow rate of the cleaning solution is controlled at 20-25 L/min to ensure the cleaning effect.

In addition, in some embodiments, in this method, when the surface of the wafer 10 is sprayed and cleaned, at least two spray brushes 400 are located in the same group of brushes on the same side of the wafer 10 to clean the wafer 10 The direction of rotation is opposite. Taking the direction shown in the figure as an example, the spray brush 400 on the left side above the wafer 10 rotates rapidly clockwise to scrub, and the spray brush 400 on the right rotates rapidly counterclockwise to scrub. This scrubbing method is convenient for stains and The water flows out from the surface of the wafer 10 rapidly.

The following points need to be explained: (1) The drawings of the embodiment of the present invention are only related to the structure related to the embodiment of the present invention, other structures can refer to the general design; (2) For the sake of clarity, in the drawings used to describe the embodiments of the present invention, the thicknesses of layers or regions are enlarged or reduced, that is, these drawings are not drawn according to actual scale. It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "under" another element, that element can be "directly on" or "under" the other element. or there may be intermediate elements; (3) In the case of no conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other to obtain new embodiments.

The above are only preferred embodiments of the present invention, and are not used to limit the implementation scope of the present invention. If the present invention is modified or equivalently replaced without departing from the spirit and scope of the present invention, it shall be covered by the protection of the patent scope of the present invention. in the range.

10:Wafer 100: Conveyor belt 200: clamping parts 210: The first positioning column 211: The first card slot 220: the second positioning column 300:Purger 310: Blowing air knife 311: tuyere 320: rotating shaft 400: spray brush 410:Brush base 420: bristles 430: sprinkler head

Fig. 1 shows the top view of the wafer cleaning and drying device provided in the embodiment of the present invention, wherein the wafer is located at the input section of the conveyor belt; Fig. 2 shows the front view of the wafer cleaning and drying device provided in the embodiment of the present invention, wherein the wafer enters the cleaning section of the conveyor belt; Fig. 3 shows the front view when the wafer cleaning and drying device provided in the embodiment of the present invention is purging the wafer; 4 shows a schematic diagram of the working process of the purger in the wafer cleaning and drying device provided in the embodiment of the present invention; 5 shows a schematic diagram of the working process of the spray brush in the wafer cleaning and drying device provided in the embodiment of the present invention; FIG. 6 shows a schematic structural view of the spray brush in the wafer cleaning and drying device provided in the embodiment of the present invention; FIG. 7 shows a schematic diagram of three specifications of the tuyere structure of the purger in the wafer cleaning and drying device provided in the embodiment of the present invention; FIG. 8 shows a schematic structural view of the first positioning column in the clamping part of the wafer cleaning and drying device provided in the embodiment of the present invention.

10:Wafer

210: The first positioning column

220: the second positioning column

300:Purger

310: Blowing air knife

320: rotating shaft

400: spray brush

Claims (11)

A wafer cleaning and drying device, comprising: Conveyor belt for transporting wafers, which sequentially includes a loading section, a cleaning section, and a loading section along the transmission direction; A clamping part for clamping and moving the wafer entering the cleaning section, the clamping part can reciprocate in a first direction to clamp and move the wafer to a predetermined cleaning position, the first direction is perpendicular to the carrying surface of the conveyor belt; a blower for blowing air on the wafer surface at the predetermined position, the blower can at least reciprocate in the first direction and/or the second direction to move into or out of the wafer surface blowing operation position, the second direction is perpendicular to the first direction; A spraying brush for cleaning the surface of the wafer at the predetermined position, the spraying brush can at least move back and forth in the first direction and/or the second direction to move into or out of the wafer surface Cleaning job location. The wafer cleaning and drying device as described in Claim 1, wherein, The clamping component includes at least one first positioning column and at least one second positioning column, the first positioning column and the second positioning column are respectively arranged on opposite sides of the wafer, and can move toward each other along the second direction to Clamp the wafer, or move back and forth to release the wafer; At least one side of the first positioning post facing the second positioning post is provided with a first locking groove for clamping one side edge of the wafer, and the second positioning post is provided at least on the side facing the first positioning post It is used to clamp the second slot on the edge of the other side of the wafer. The wafer cleaning and drying device as described in Claim 2, wherein, The purger comprises at least one set of purging units comprising: A blowing air knife, the blowing air knife is a strip-shaped air knife extending in a direction parallel to the surface of the wafer, and an air port is provided along the extending direction of the strip-shaped air knife; And, a rotating shaft, the axis of the rotating shaft is arranged along the first direction, and the rotating shaft drives the blowing air knife to rotate in a direction parallel to the wafer surface, so that the tuyere is blown from the wafer surface . The wafer cleaning and drying device as described in claim 3, wherein, The blowing direction of the tuyere faces the surface of the wafer, and the blowing direction of the tuyere and the surface of the wafer form a predetermined angle α. The wafer cleaning and drying device as described in claim 4, wherein, The predetermined included angle α is 30-45°. The wafer cleaning and drying device as described in claim 3, wherein, The rotating shaft is connected to one end of the blowing air knife, and the extension length of the tuyere of the blowing air knife is greater than the radius of the wafer, and when the blower is at the blowing operation position, the axis of the rotating shaft is eccentric Move the center of the wafer. The wafer cleaning and drying device as described in Claim 1, wherein, There are multiple spraying brushes, and they are divided into at least one group of brushes, the same group of brushes is located on the same side of the wafer, and the same group of brushes includes at least two spraying brushes brush. A wafer cleaning and drying method, using the wafer cleaning and drying device described in any one of claims 1 to 7 to clean and dry the wafer, wherein the method includes: transporting the wafer from the previous step through the conveyor belt from the loading section to the cleaning section; the wafer in the cleaning section is clamped by the clamping component and moved along a first direction, so that the wafer is separated from the conveyor belt carrying surface and moved to a predetermined cleaning position; Moving the purger along the first direction and/or the second direction, so that the purger moves into the wafer surface purging operation position, and performs the first purging on the wafer surface; After the first purging operation is completed, the purger is moved out of the wafer surface purging operation position; Moving the spray brush in the first direction and/or the second direction, so that the spray brush moves into the wafer surface cleaning operation position, and sprays and cleans the wafer surface; After the spray cleaning operation is completed, the spray brush is moved out of the wafer surface cleaning operation position; Moving the purger along the first direction and/or the second direction, so that the purger moves into the wafer surface purging operation position, and performs a second purging on the wafer surface to dry the wafer surface ; The dried processed wafers are placed on the conveyor belt by the clamping part, and are transported from the cleaning section to the unloading section by the conveyor belt for the next step. The wafer cleaning and drying method as described in claim 8, wherein the wafer cleaning and drying device adopts the wafer cleaning and drying device as described in claim 6, and in this method, the wafer surface is cleaned by using the purger During the first purge and the second purge, the rotation axis of the blower is shifted to one side of the center of the wafer, and the purge air knife is driven to rotate in a direction parallel to the surface of the wafer, so as to The surface of the wafer is purged; where, When purging for the first time, the purge gas is a dry inert gas with a temperature of 15~40°C; During the second purge, the purge gas is a dry inert gas with a temperature of 40~45°C. The wafer cleaning and drying method as described in Claim 8, wherein, in the method, when spraying and cleaning the surface of the wafer, it specifically includes: using an alkaline solution as the cleaning solution for the first cleaning, wherein the alkaline The volume ratio of each component of the solution is: NH ₄ OH with a concentration of 10%: H ₂ O ₂ with a concentration of 15%: H ₂ O = (1:1:8), the cleaning time is 10 ~ 15 S, the cleaning solution The flow rate of the cleaning solution was controlled at 2-3 L/min; ultrapure water was used as the cleaning solution for the second cleaning, the cleaning time was 15-20 s, and the flow rate of the cleaning solution was controlled at 20-25 L/min. The wafer cleaning and drying method as described in claim 8, wherein the wafer cleaning and drying device as described in claim 7 is used, in this method, when the surface of the wafer is sprayed and cleaned, it is located on the same side of the wafer In the same brush group, at least two spray brushes rotate in opposite directions when cleaning the wafer.

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