TW202242061A - Temperature-sensitive adhesive and workpiece processing method - Google Patents

Temperature-sensitive adhesive and workpiece processing method Download PDF

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TW202242061A
TW202242061A TW111109883A TW111109883A TW202242061A TW 202242061 A TW202242061 A TW 202242061A TW 111109883 A TW111109883 A TW 111109883A TW 111109883 A TW111109883 A TW 111109883A TW 202242061 A TW202242061 A TW 202242061A
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temperature
sensitive adhesive
meth
melting point
crystalline polymer
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加藤卓
惠𨺓史
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日商霓塔股份有限公司
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
    • C09J133/06Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/062Copolymers with monomers not covered by C09J133/06
    • C09J133/066Copolymers with monomers not covered by C09J133/06 containing -OH groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10Esters
    • C08F220/12Esters of monohydric alcohols or phenols
    • C08F220/16Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C08F220/1807C7-(meth)acrylate, e.g. heptyl (meth)acrylate or benzyl (meth)acrylate
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10Esters
    • C08F220/26Esters containing oxygen in addition to the carboxy oxygen
    • C08F220/28Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/16Nitrogen-containing compounds
    • C08K5/22Compounds containing nitrogen bound to another nitrogen atom
    • C08K5/23Azo-compounds
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    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
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    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
    • C09J133/06Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
    • C09J133/14Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
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    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35Heat-activated
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    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38Pressure-sensitive adhesives [PSA]
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/40Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/50Additional features of adhesives in the form of films or foils characterized by process specific features
    • C09J2301/502Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/30Stacked capacitors

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)

Abstract

A temperature-sensitive adhesive of the present invention contains an ultraviolet curable side chain crystalline polymer that is a reaction product of a compound having a UV-curable functional group and a side-chain crystalline polymer, and exhibits fluidity at temperatures above its melting point, wherein the side-chain crystalline polymer includes a (meth) acrylate having a linear alkyl group having 16 or more carbon atoms, a (meth) acrylate having an alkyl group having 2 to 6 carbon atoms, and a (meth) acrylate having a hydroxyalkyl group as monomer components, and additionally, the (meth) acrylate having a hydroxyalkyl group is contained in the monomer component in a proportion of 6% by weight or more. A workpiece processing method of the present invention comprises a step of irradiating a pressure-sensitive adhesive layer in a temperature-sensitive adhesive tape with ultraviolet rays and peeling the workpiece from the temperature-sensitive adhesive tape at a temperature lower than the melting point.

Description

感溫性黏著劑及被加工物的加工方法 Temperature-sensitive adhesive and processing method of processed object

本發明係關於感溫性黏著劑及被加工物的加工方法。 The invention relates to a temperature-sensitive adhesive and a processing method for a processed object.

對應溫度變化而使黏著力變化的黏著劑已知有感溫性黏著劑。感溫性黏著劑被加工成帶等,在積層陶瓷電容器等之製造步驟中,被使用於臨時固定陶瓷胚片(Ceramic green sheet)積層體等之際(參照例如,專利文獻1)。 Temperature-sensitive adhesives are known as adhesives that change adhesive force in response to changes in temperature. The temperature-sensitive adhesive is processed into a tape or the like, and is used for temporarily fixing a ceramic green sheet laminate or the like in a manufacturing process of a laminated ceramic capacitor or the like (see, for example, Patent Document 1).

臨時固定用之黏著劑,係被要求加工陶瓷胚片積層體等之被加工物時的固定性、及剝離加工被加工物獲得的加工物時的易剝離性。 Adhesives for temporary fixation are required for fixability when processing workpieces such as ceramic green sheet laminates, and for ease of peeling when peeling processed workpieces obtained by processing the processed workpieces.

[先前技術文獻] [Prior Art Literature]

[專利文獻] [Patent Document]

[專利文獻1] 日本特開平9-251923號公報 [Patent Document 1] Japanese Patent Application Laid-Open No. 9-251923

本發明之課題係提供一種固定性及易剝離性優異的感溫性黏著劑及被加工物的加工方法。 The object of the present invention is to provide a temperature-sensitive adhesive excellent in fixability and easy peeling property and a processing method of a workpiece.

本發明之感溫性黏著劑係含有紫外線硬化型側鏈結晶性聚合物,該紫外線硬化型側鏈結晶性聚合物係具有紫外線硬化性官能基之化合物與側鏈結晶性聚合物的反應物,且於熔點以上之溫度顯示流動性;其中,前述側鏈結晶性聚合物係包含具有碳數16以上之直鏈狀烷基的(甲基)丙烯酸酯、具有碳數2至6之烷基的(甲基)丙烯酸酯及具有羥基烷基之(甲基)丙烯酸酯作為單體成分,並且在單體成分中以6重量%以上之比例包含前述具有羥基烷基之(甲基)丙烯酸酯。 The temperature-sensitive adhesive of the present invention contains a UV-curable side-chain crystalline polymer, and the UV-curable side-chain crystalline polymer is a reaction product of a compound having a UV-curable functional group and a side-chain crystalline polymer. And it shows fluidity at a temperature above the melting point; wherein, the above-mentioned side chain crystalline polymer is a (meth)acrylic acid ester having a straight-chain alkyl group having 16 or more carbons, or a (meth)acrylic acid ester having an alkyl group having 2 to 6 carbons. A (meth)acrylate and a (meth)acrylate having a hydroxyalkyl group are used as monomer components, and the above-mentioned (meth)acrylate having a hydroxyalkyl group is contained in a ratio of 6% by weight or more in the monomer component.

本發明之被加工物的加工方法具備:將感溫性黏著帶設為前述熔點以上之溫度而將感溫性黏著帶貼附於被加工物的步驟,將前述感溫性黏著帶設為未達前述熔點之溫度而將前述被加工物臨時固定的步驟,加工前述被加工物以獲得加工物的步驟,以及對前述感溫性黏著帶之前述黏著劑層照射紫外線,於未達前述熔點之溫度將前述加工物從前述感溫性黏著帶剝離的步驟。 The processing method of the workpiece according to the present invention includes the step of attaching the temperature-sensitive adhesive tape to the workpiece by setting the temperature-sensitive adhesive tape at a temperature above the melting point, and setting the temperature-sensitive adhesive tape to a temperature not higher than the melting point. The step of temporarily fixing the aforementioned object to be processed at a temperature reaching the aforementioned melting point, the step of processing the aforementioned object to be processed to obtain a processed object, and irradiating ultraviolet rays to the aforementioned adhesive layer of the aforementioned temperature-sensitive adhesive tape, before reaching the aforementioned melting point The step of peeling the aforementioned processed product from the aforementioned temperature-sensitive adhesive tape.

依據本發明,具有固定性及易剝離性優異的效果。 According to the present invention, there is an effect of being excellent in fixability and easy peelability.

1:感溫性黏著帶 1: Temperature sensitive adhesive tape

2:基材 2: Substrate

3:黏著劑層 3: Adhesive layer

100:陶瓷胚片積層體 100: ceramic green sheet laminate

110:原片 110: Original film

200:旋轉刀片 200: rotating blade

圖1(a)至(c)係顯示本發明之一實施型態之被加工物的加工方法之概略說明圖。 1 (a) to (c) are schematic explanatory diagrams showing a processing method of a processed object according to an embodiment of the present invention.

<感溫性黏著劑> <Temperature sensitive adhesive>

本實施型態之感溫性黏著含有紫外線(Ultra Violet:以下亦稱為「UV」)硬化型側鏈結晶性聚合物。UV硬化型側鏈結晶性聚合物係具有UV硬化性官能基之化合物與側鏈結晶性聚合物之反應物,且於熔點以上之溫度顯示流動性。該UV硬化型側鏈結晶性聚合物,除了具有藉由UV之照射而硬化的UV硬化性,亦具有因應溫度變化而可逆地引起結晶狀態及流動狀態的感溫性。 The temperature-sensitive adhesive of this embodiment contains an ultraviolet (Ultra Violet: hereinafter also referred to as "UV") curable side chain crystalline polymer. UV-curable side-chain crystalline polymer is a reaction product of a compound having a UV-curable functional group and a side-chain crystalline polymer, and exhibits fluidity at a temperature above the melting point. The UV-curable side-chain crystalline polymer has not only UV curability to be cured by UV irradiation, but also thermosensitivity to reversibly cause a crystalline state and a fluid state in response to temperature changes.

具體說明時,UV硬化型側鏈結晶性聚合物具有熔點。熔點意指藉由某種平衡過程,最初整合成有秩序的配列的聚合物之特定部分變成無秩序狀態的溫度,且藉由示差掃描量熱儀(DSC)以10℃/分鐘之測定條件測定而獲得的值。 When specifically described, the UV curable side chain crystalline polymer has a melting point. The melting point means the temperature at which a specific portion of a polymer initially integrated into an ordered arrangement becomes disordered by a certain equilibrium process, and is measured by a differential scanning calorimeter (DSC) at a measurement condition of 10°C/min. The value obtained.

UV硬化型側鏈結晶性聚合物於上述未達熔點之溫度結晶化,且在熔點以上之溫度中進行相轉移而顯示流動性。藉此,將感溫性黏著劑之溫度設為熔點以上的溫度時,UV硬化型側鏈結晶性聚合物顯示流動性,因此可將感溫性黏著劑貼附於被加工物。再者,UV硬化型側鏈結晶性聚合物顯示流動性時,感溫性黏著劑順應存在於被加工物表面的微細凹凸形狀。然後,將該狀態之感溫性黏著劑冷卻至未達熔點之溫度時,UV硬化型側鏈 結晶性聚合物藉由結晶化,而表現所謂的錨定效果,其結果,可臨時固定被加工物。 The UV-curable side-chain crystalline polymer crystallizes at a temperature below the melting point, and undergoes phase transition at a temperature above the melting point to exhibit fluidity. Thereby, when the temperature of the temperature-sensitive adhesive is set to a temperature higher than the melting point, the UV-curable side-chain crystalline polymer exhibits fluidity, so that the temperature-sensitive adhesive can be attached to the workpiece. Furthermore, when the UV-curable side-chain crystalline polymer exhibits fluidity, the temperature-sensitive adhesive conforms to the fine unevenness existing on the surface of the workpiece. Then, when the thermosensitive adhesive in this state is cooled to a temperature below the melting point, the UV curable side chain A crystalline polymer exhibits a so-called anchor effect by crystallization, and as a result, a workpiece can be temporarily fixed.

於此,將被加工物臨時固定之際,要求高固定力(固定性)。再者,將加工被加工物而得的加工物從感溫性黏著劑剝離之際,亦要求可容易地剝離(易剝離性)。關於剝離,雖亦考慮藉由將UV硬化型側鏈結晶性聚合物設為流動狀態而使固定力降低而對應,惟該對應中,必須有在熔點以上之溫度進行加熱的手續。 Here, when a workpiece is temporarily fixed, a high fixing force (fixability) is required. Furthermore, when the processed product obtained by processing the processed product is peeled from the temperature-sensitive adhesive, it is also required to be easily peelable (easily peelable). Regarding peeling, it is also conceivable to reduce the fixing force by making the UV-curable side-chain crystalline polymer into a fluid state, but in this response, a procedure of heating at a temperature higher than the melting point is necessary.

本實施型態中,側鏈結晶性聚合物係包含具有碳數16以上之直鏈狀烷基的(甲基)丙烯酸酯、具有碳數2至6之烷基的(甲基)丙烯酸酯及具有羥基烷基之(甲基)丙烯酸酯作為單體成分。又,側鏈結晶性聚合物係在單體成分中以6重量%以上之比例包含具有羥基烷基之(甲基)丙烯酸酯。 In this embodiment, the side chain crystalline polymer includes (meth)acrylate having a linear alkyl group having 16 or more carbons, (meth)acrylate having an alkyl group having 2 to 6 carbons, and A (meth)acrylate having a hydroxyalkyl group as a monomer component. Moreover, the side chain crystalline polymer contains the (meth)acrylate which has a hydroxyalkyl group in the ratio of 6 weight% or more in a monomer component.

藉由如此之構成,在未達熔點之溫度中,能夠以高固定力將被加工物臨時固定。再者,具有羥基烷基之(甲基)丙烯酸酯係與具有UV硬化性官能基之化合物進行反應。側鏈結晶性聚合物在單體成分中以6重量%以上之比例包含具有羥基烷基之(甲基)丙烯酸酯時,許多具有UV硬化性官能基之化合物進行反應,其結果,UV硬化型側鏈結晶性聚合物具有許多UV硬化性官能基。然後,UV照射時之硬化收縮變大,與加工物之密接力降低,錨定效果變得容易解除。因此,藉由UV之照射可使固定力充分地降低。故,剝離之際無需加熱至熔點以上之溫度,能夠藉由UV之照射以未達熔點之溫度容易地剝離加工物。 With such a configuration, the workpiece can be temporarily fixed with a high fixing force at a temperature below the melting point. Furthermore, the (meth)acrylate having a hydroxyalkyl group reacts with a compound having a UV curable functional group. When the side-chain crystalline polymer contains (meth)acrylate having a hydroxyalkyl group in a proportion of 6% by weight or more in the monomer component, many compounds having UV-curable functional groups react, and as a result, UV-curable The side chain crystalline polymer has many UV curable functional groups. Then, the hardening shrinkage at the time of UV irradiation increases, the adhesion force with the workpiece decreases, and the anchoring effect becomes easy to release. Therefore, the fixing force can be sufficiently reduced by UV irradiation. Therefore, it is not necessary to heat to a temperature higher than the melting point at the time of peeling, and the processed product can be easily peeled off at a temperature lower than the melting point by UV irradiation.

據此,根據本實施型態的感溫性黏著劑,可於未達熔點之溫度以高固定力臨時固定被加工物,且剝離加工物之際,不需加熱至熔點以 上之溫度的手續,而可發揮固定性及易剝離性優異的效果。亦即,本實施型態之感溫性黏著劑,於未達熔點之溫度將被加工物臨時固定,且藉由UV之照射於未達熔點之溫度將加工物剝離。 Accordingly, according to the temperature-sensitive adhesive of this embodiment, the workpiece can be temporarily fixed with a high fixing force at a temperature lower than the melting point, and when the workpiece is peeled off, it is not necessary to heat to a temperature above the melting point. The above temperature procedures can exert excellent effects of fixability and easy peeling property. That is, the temperature-sensitive adhesive of this embodiment temporarily fixes the processed object at a temperature lower than the melting point, and peels the processed object at a temperature lower than the melting point by UV irradiation.

感溫性黏著劑係以獲得UV硬化性及感溫性的比例含有UV硬化型側鏈結晶性聚合物。亦即,感溫性黏著劑係含有UV硬化型側鏈結晶性聚合物作為主成分。主成分意指在感溫性黏著劑中以重量比而言為含有最多的成分。 The temperature-sensitive adhesive contains a UV-curable side chain crystalline polymer in proportion to obtain UV curability and temperature sensitivity. That is, the temperature-sensitive adhesive contains a UV-curable side-chain crystalline polymer as a main component. The main component means the most contained component in terms of weight ratio in the temperature-sensitive adhesive.

UV硬化型側鏈結晶性聚合物之熔點係例如為23至50℃,較佳為40至50℃。將熔點設於40至50℃時,可在室溫中使UV硬化型側鏈結晶性聚合物結晶化,因此可在室溫中將被加工物以高固定力臨時固定並進行加工。再者,在室溫中亦可輕易地剝離所得的加工物。亦即,能夠在任何室溫中進行被加工物的加工與加工物之剝離。此外,室溫可意指23℃±5℃。 The melting point of the UV curable side chain crystalline polymer is, for example, 23 to 50°C, preferably 40 to 50°C. When the melting point is set at 40 to 50°C, the UV-curable side-chain crystalline polymer can be crystallized at room temperature, so the workpiece can be temporarily fixed with high fixing force at room temperature and processed. Furthermore, the obtained processed product can be easily peeled off at room temperature. That is, processing of the workpiece and peeling of the workpiece can be performed at any room temperature. Also, room temperature may mean 23°C±5°C.

熔點可藉由改變UV硬化型側鏈結晶性聚合物之組成等而調整。再者,熔點係有在UV照射前後無實質變化的傾向。亦即,UV硬化後之熔點係有與UV硬化前之熔點實質上呈相同之值的傾向。更且,UV硬化型側鏈結晶性聚合物,即使於UV硬化後亦於未達熔點之溫度結晶化,且於熔點以上之溫度顯示流動性。亦即,UV硬化型側鏈結晶性聚合物即使於UV照射前後之任何狀態中,亦可對應溫度變化而可逆地引起結晶狀態及流動狀態。 The melting point can be adjusted by changing the composition of the UV-curable side-chain crystalline polymer and the like. Furthermore, the melting point tends not to change substantially before and after UV irradiation. That is, the melting point after UV curing tends to have substantially the same value as the melting point before UV curing. Furthermore, the UV curable side chain crystalline polymer crystallizes at a temperature below the melting point even after UV curing, and exhibits fluidity at a temperature above the melting point. That is, even in any state before and after UV irradiation, the UV curable side chain crystalline polymer can reversibly cause a crystalline state and a fluid state in response to temperature changes.

具有碳數16以上之直鏈狀烷基的(甲基)丙烯酸酯,其碳數16以上之直鏈狀烷基係作為UV硬化型側鏈結晶性聚合物中之側鏈結晶性部 位發揮功能。亦即,UV硬化型側鏈結晶性聚合物為在側鏈具有碳數16以上之直鏈狀烷基的梳狀聚合物,該側鏈藉由分子間力等而整合成有秩序的配列進而結晶化。 (Meth)acrylic esters having a straight-chain alkyl group with 16 or more carbons, and the straight-chain alkyl group with 16 or more carbons is used as a side-chain crystalline part in a UV-curable side-chain crystalline polymer bit function. That is, the UV-curable side chain crystalline polymer is a comb-like polymer having a linear alkyl group having 16 or more carbon atoms in the side chain, and the side chains are integrated into an orderly arrangement by intermolecular forces and the like. crystallize.

具有碳數16以上之直鏈狀烷基的(甲基)丙烯酸酯可列舉例如:(甲基)丙烯酸十六烷基酯、(甲基)丙烯酸硬脂酯、(甲基)丙烯酸二十烷基酯、(甲基)丙烯酸二十二烷基酯等具有碳數16至22之線狀烷基的(甲基)丙烯酸酯。所例示之(甲基)丙烯酸酯可僅使用1種,亦可併用2種以上。(甲基)丙烯酸酯意指丙烯酸酯或甲基丙烯酸酯。 Examples of (meth)acrylates having a linear alkyl group having 16 or more carbon atoms include hexadecyl (meth)acrylate, stearyl (meth)acrylate, and eicosane (meth)acrylate. A (meth)acrylate having a linear alkyl group having 16 to 22 carbons, such as behenyl (meth)acrylate and behenyl (meth)acrylate. The (meth)acrylate shown as an example may use only 1 type, and may use 2 or more types together. (Meth)acrylate means acrylate or methacrylate.

具有碳數2至6之烷基的(甲基)丙烯酸酯可列舉例如:(甲基)丙烯酸乙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸己酯等。所例示之(甲基)丙烯酸酯可僅使用1種,亦可併用2種以上。 Examples of (meth)acrylates having an alkyl group having 2 to 6 carbon atoms include ethyl (meth)acrylate, n-butyl (meth)acrylate, hexyl (meth)acrylate, and the like. The (meth)acrylate shown as an example may use only 1 type, and may use 2 or more types together.

具有羥基烷基之(甲基)丙烯酸酯可列舉例如:(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸2-羥基己酯等。所例示之(甲基)丙烯酸酯可僅使用1種,亦可併用2種以上。 As (meth)acrylate which has a hydroxyalkyl group, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxyhexyl (meth)acrylate, etc. are mentioned, for example. The (meth)acrylate shown as an example may use only 1 type, and may use 2 or more types together.

如上所述,側鏈結晶性聚合物係在單體成分中以6重量%以上之比例包含具有羥基烷基之(甲基)丙烯酸酯。具有羥基烷基之(甲基)丙烯酸酯的比例較佳為8重量%以上,更佳為10重量%以上。具有羥基烷基之(甲基)丙烯酸酯之比例的上限值亦可為30重量%以下。 As mentioned above, the side chain crystalline polymer contains the (meth)acrylate which has a hydroxyalkyl group in the ratio of 6 weight% or more in a monomer component. The ratio of the (meth)acrylate having a hydroxyalkyl group is preferably at least 8% by weight, more preferably at least 10% by weight. The upper limit of the ratio of the (meth)acrylate which has a hydroxyalkyl group may be 30 weight% or less.

再者,側鏈結晶性聚合物亦可在單體成分中以相同比例包含具有碳數16以上之直鏈狀烷基的(甲基)丙烯酸酯及具有碳數2至6之烷基的(甲基)丙烯酸酯。 Furthermore, the side chain crystalline polymer may also contain (meth)acrylate having a linear alkyl group having 16 or more carbons and (meth)acrylate having an alkyl group having 2 to 6 carbons in the same ratio in the monomer component. meth)acrylate.

側鏈結晶性聚合物中,以重量比計,可以較具有碳數2至6之烷基的(甲基)丙烯酸酯,包含更多具有碳數16以上之直鏈狀烷基的(甲基)丙烯酸酯。此時,固定性優異。 In the side-chain crystalline polymer, the (meth)acrylic acid ester having a straight-chain alkyl group having 16 or more carbon atoms may contain more (meth)acrylic acid ester having a straight-chain alkyl group having 16 or more carbon atoms by weight ratio than the (meth)acrylic acid ester having an alkyl group having 2 to 6 carbon atoms. )Acrylate. In this case, fixability is excellent.

就側鏈結晶性聚合物之組成而言,例如,具有碳數16以上之直鏈狀烷基之(甲基)丙烯酸酯是10至90重量%,具有碳數2至6之烷基的(甲基)丙烯酸酯是4至60重量%,具有羥基烷基之(甲基)丙烯酸酯是6至30重量%。 In terms of the composition of the side chain crystalline polymer, for example, (meth)acrylate having a linear alkyl group having 16 or more carbons is 10 to 90% by weight, and (meth)acrylate having an alkyl group having 2 to 6 carbons ( Meth)acrylate is 4 to 60% by weight, and (meth)acrylate having a hydroxyalkyl group is 6 to 30% by weight.

單體之聚合方法可列舉例如:溶液聚合法、塊狀聚合法、懸濁聚合法、乳化聚合法等。採用溶液聚合法之情況中,將上述各單體混合於溶劑中,因應所需添加聚合起始劑等,於40至90℃左右攪拌2至10小時左右即可。 The polymerization method of the monomer includes, for example, a solution polymerization method, a bulk polymerization method, a suspension polymerization method, an emulsion polymerization method, and the like. In the case of solution polymerization, the above-mentioned monomers are mixed in a solvent, and polymerization initiators are added as needed, and stirred at about 40 to 90°C for about 2 to 10 hours.

側鏈結晶性聚合物之重量平均分子量係例如為100000以上,較佳為400000至800000。重量平均分子量係藉由凝膠滲透層析術(GPC)測定側鏈結晶性聚合物,並將獲得的測定值以聚苯乙烯換算的值。 The weight average molecular weight of the side chain crystalline polymer is, for example, 100,000 or more, preferably 400,000 to 800,000. The weight average molecular weight is a value obtained by measuring the side chain crystalline polymer by gel permeation chromatography (GPC) and converting the obtained measured value into polystyrene.

具有UV硬化性官能基之化合物中,所謂UV硬化性官能基意指藉由UV照射而硬化的官能基。UV硬化性官能基可列舉例如:(甲基)丙烯醯基、(甲基)丙烯醯基氧基、乙烯基、縮水甘油基等。 In the compound having a UV curable functional group, the term "UV curable functional group" means a functional group that is cured by UV irradiation. Examples of the UV curable functional group include (meth)acryl, (meth)acryloxy, vinyl, glycidyl and the like.

具有UV硬化性官能基之化合物,在與上述具有羥基烷基的(甲基)丙烯酸酯反應的狀況下,較佳是異氰酸酯化合物,可列舉例如:下述式(I)所示之2-甲基丙烯醯氧基乙基異氰酸酯、下述式(II)所示之2-丙烯醯基氧基乙基異氰酸酯、下述式(III)所示之1,1-雙(丙烯醯基氧基甲基)乙基異氰酸酯等。 The compound having a UV curable functional group is preferably an isocyanate compound in the case of reacting with the above-mentioned (meth)acrylic acid ester having a hydroxyalkyl group, for example: 2-methanone represented by the following formula (I) Acryloxyethyl isocyanate, 2-acryloxyethyl isocyanate represented by the following formula (II), 1,1-bis(acryloxymethyl) represented by the following formula (III) base) ethyl isocyanate, etc.

Figure 111109883-A0202-12-0008-1
Figure 111109883-A0202-12-0008-1

Figure 111109883-A0202-12-0008-2
Figure 111109883-A0202-12-0008-2

Figure 111109883-A0202-12-0008-3
Figure 111109883-A0202-12-0008-3

再者,具有式(I)至(III)以外之其他UV硬化性官能基的異氰酸酯化合物可列舉例如:2-(甲基)丙烯醯基氧基丙基異氰酸酯、2-(甲基)丙烯醯基氧基丁基異氰酸酯、(甲基)丙烯醯基異氰酸酯、1-(4-乙烯基苯基)-1-甲基乙基異氰酸酯等。所例示的異氰酸酯化合物可僅使用1種,亦可併用2種以上。 Furthermore, isocyanate compounds having other UV curable functional groups other than formulas (I) to (III) include, for example: 2-(meth)acryloxypropyl isocyanate, 2-(meth)acryl oxybutyl isocyanate, (meth)acryl isocyanate, 1-(4-vinylphenyl)-1-methylethyl isocyanate, and the like. The illustrated isocyanate compounds may be used alone or in combination of two or more.

具有UV硬化性官能基之化合物與側鏈結晶性聚合物的反應,例如,將兩者以預定比例混合後,因應所需添加抗氧化劑及觸媒等,並在設為氮氣等惰性氣體環境下,以40至80℃左右進行攪拌1至9小時左右即可。 The reaction between a compound having a UV curable functional group and a side-chain crystalline polymer, for example, after mixing the two in a predetermined ratio, adding an antioxidant and a catalyst as needed, and setting it under an inert gas environment such as nitrogen , stirring at about 40 to 80° C. for about 1 to 9 hours.

兩者之混合比例,例如,相對於側鏈結晶性聚合物中之羥基烷基,具有UV硬化性官能基之化合物為0.1至5莫耳當量,較佳為0.5至2莫耳當量。側鏈結晶性聚合物之含量較佳為較具有UV硬化性官能基之化合物的含量更多。 The mixing ratio of the two is, for example, 0.1 to 5 molar equivalents of the compound having a UV curable functional group, preferably 0.5 to 2 molar equivalents, relative to the hydroxyalkyl group in the side chain crystalline polymer. The content of the side chain crystalline polymer is preferably higher than the content of the compound having a UV curable functional group.

在UV硬化性官能基之硬化中,使用光聚合起始劑。光聚合起始劑,只要因應UV硬化性官能基之組成適當地選擇即可,並非特別限定者。再者,光聚合起始劑可使用市售品。市售之光聚合起始劑可列舉例如:IGM Resins公司製之「Omnirad500」等。相對於UV硬化型側鏈結晶性聚合物100重量份,光聚合起始劑之添加量係例如0.3至3重量份。 In the curing of the UV curable functional group, a photopolymerization initiator is used. The photopolymerization initiator is not particularly limited as long as it is appropriately selected according to the composition of the UV curable functional group. In addition, a commercial item can be used for a photoinitiator. As a commercially available photoinitiator, "Omnirad500" by IGM Resins company etc. are mentioned, for example. The amount of the photopolymerization initiator added is, for example, 0.3 to 3 parts by weight relative to 100 parts by weight of the UV-curable side chain crystalline polymer.

UV硬化型側鏈結晶性聚合物之重量平均分子量係例如為100000以上,較佳為600000至800000。重量平均分子量係藉由GPC測定UV硬化型側鏈結晶性聚合物,並將獲得的測定值以聚苯乙烯換算的值。 The weight average molecular weight of the UV curable side chain crystalline polymer is, for example, 100,000 or more, preferably 600,000 to 800,000. The weight average molecular weight is a value obtained by measuring the UV-curable side chain crystalline polymer by GPC and converting the obtained measured value into polystyrene.

感溫性黏著劑可更含有偶氮化合物。此時,UV照射時產生氣體,而獲得抬高加工物之效果,因此易剝離性更優異。 The temperature-sensitive adhesive may further contain an azo compound. At this time, gas is generated during UV irradiation, and the effect of raising the processed product is obtained, so the easy peelability is more excellent.

偶氮化合物可列舉例如:偶氮醯胺類、偶氮酯類等。偶氮醯胺類可列舉例如:2,2’-偶氮雙(N-丁基-2-甲基丙醯胺)(2,2’-Azobis(N-butyl-2-methylpropionamide))等。相對於UV硬化型側鏈結晶性聚合物100重量份,偶氮化合物之含量係例如5至15重量份。 Examples of the azo compound include azoamides, azo esters and the like. Examples of azoamides include 2,2'-azobis(N-butyl-2-methylpropionamide) (2,2'-Azobis(N-butyl-2-methylpropionamide)) and the like. The content of the azo compound is, for example, 5 to 15 parts by weight relative to 100 parts by weight of the UV-curable side chain crystalline polymer.

感溫性黏著劑可更含有交聯劑。交聯劑可列舉例如:金屬螯合物化合物、氮丙啶化合物、異氰酸酯化合物、環氧化合物等。相對於UV硬化型側鏈結晶性聚合物100重量份,交聯劑之含量係例如為0.1至5重量份。就交聯條件而言,加熱溫度為90至120℃左右,加熱時間為1分鐘至20分鐘左右。 The temperature-sensitive adhesive may further contain a crosslinking agent. As a crosslinking agent, a metal chelate compound, an aziridine compound, an isocyanate compound, an epoxy compound, etc. are mentioned, for example. The content of the crosslinking agent is, for example, 0.1 to 5 parts by weight relative to 100 parts by weight of the UV-curable side chain crystalline polymer. In terms of crosslinking conditions, the heating temperature is about 90 to 120° C., and the heating time is about 1 minute to 20 minutes.

感溫性黏著劑之對於聚對苯二甲酸乙二酯之180°剝離強度,在紫外線照射前之23℃中可為1.0N/25mm以上,較佳可為1.0至15N/25mm,再者,紫外線照射後之23℃中可為0.1N/25mm以下,較佳可 為0.01至0.1N/25mm。此時,對於被貼附面包含有機材料之被加工物,感溫性黏著劑具有優異的固定性與易剝離性。180°剝離強度係根據JIS Z0237所測定之值。 The 180°peel strength of the temperature-sensitive adhesive to polyethylene terephthalate can be above 1.0N/25mm at 23°C before ultraviolet irradiation, preferably 1.0 to 15N/25mm. Furthermore, It can be less than 0.1N/25mm at 23°C after ultraviolet irradiation, preferably 0.01 to 0.1N/25mm. At this time, the temperature-sensitive adhesive has excellent fixability and easy peeling property for a workpiece whose surface to be attached contains organic materials. The 180° peel strength is a value measured in accordance with JIS Z0237.

感溫性黏著劑之對於不銹鋼之180°剝離強度,在紫外線照射前之23℃中可為3.0N/25mm以上,較佳可為3.0至40N/25mm,再者,紫外線照射後之23℃中可為0.2N/25mm以下,較佳可為0.01至0.2N/25mm。此時,對於被貼附面包含無機材料之被加工物,感溫性黏著劑具有優異的固定性與易剝離性。 The 180°peel strength of the temperature-sensitive adhesive to stainless steel can be more than 3.0N/25mm at 23°C before ultraviolet irradiation, preferably 3.0 to 40N/25mm, and moreover, at 23°C after ultraviolet irradiation It can be 0.2N/25mm or less, preferably 0.01 to 0.2N/25mm. At this time, the temperature-sensitive adhesive has excellent fixability and easy peeling property for a workpiece whose surface to be attached contains inorganic materials.

感溫性黏著劑係例如可作為陶瓷部件製造用之臨時固定材使用。陶瓷部件可列舉例如:積層陶瓷電容器、陶瓷電感器、陶瓷壓敏電阻等。感溫性黏著劑亦可為陶瓷胚片積層體之臨時固定用者。 The temperature-sensitive adhesive can be used, for example, as a temporary fixing material for the manufacture of ceramic parts. Examples of ceramic components include multilayer ceramic capacitors, ceramic inductors, and ceramic varistors. The temperature-sensitive adhesive can also be used for temporary fixation of ceramic green sheet laminates.

感溫性黏著劑之使用型態並無特別限定,例如,可直接使用,或者如下述說明般,以黏著片、黏著帶等之型態使用。 The use form of the temperature-sensitive adhesive is not particularly limited. For example, it can be used directly, or as described below, in the form of an adhesive sheet, an adhesive tape, or the like.

<感溫性黏著片> <Thermosensitive Adhesive Sheet>

本實施型態之感溫性黏著片係包含上述感溫性黏著劑者,且為無基材之片狀。感溫性黏著片之厚度係例如10至400μm。 The temperature-sensitive adhesive sheet of this embodiment includes the above-mentioned temperature-sensitive adhesive and is in the form of a sheet without a base material. The thickness of the temperature-sensitive adhesive sheet is, for example, 10 to 400 μm.

感溫性黏著片之表面中,亦可積層離型膜。離型膜可列舉例如:在由聚對苯二甲酸乙二酯等所構成之膜的表面,塗佈聚矽氧等之離型劑者。離型膜之厚度係例如為5至500μm,較佳為25至250μm。離型膜係於感溫性黏著片之使用時剝離。 A release film can also be laminated on the surface of the temperature-sensitive adhesive sheet. As the release film, for example, the surface of a film made of polyethylene terephthalate or the like is coated with a release agent such as silicone. The thickness of the release film is, for example, 5 to 500 μm, preferably 25 to 250 μm. The release film is peeled off when the temperature-sensitive adhesive sheet is used.

<感溫性黏著帶> <Temperature sensitive adhesive tape>

本實施型態之感溫性黏著帶具備:膜狀之基材、及積層於基材之至少一面的黏著劑層。所謂膜狀並非僅限定於膜狀者,只要在不損害本實施型態之效果的限制下,亦包含膜狀或片狀的概念。 The temperature-sensitive adhesive tape of this embodiment includes: a film-like base material; and an adhesive layer laminated on at least one side of the base material. The so-called film shape is not limited to film shape, but also includes the concept of film shape or sheet shape as long as the effect of this embodiment is not impaired.

基材之構成材料可列舉例如:聚乙烯、聚對苯二甲酸乙二酯、聚丙烯、聚酯、聚醯胺、聚醯亞胺、聚碳酸酯、乙烯乙酸乙烯酯共聚物、乙烯丙烯酸乙酯共聚物、乙烯聚丙烯共聚物、聚氯乙烯等之合成樹脂。 The constituent materials of the substrate include, for example: polyethylene, polyethylene terephthalate, polypropylene, polyester, polyamide, polyimide, polycarbonate, ethylene vinyl acetate copolymer, ethylene acrylic acid Synthetic resins such as ester copolymer, ethylene polypropylene copolymer, polyvinyl chloride, etc.

基材之結構可為單層結構或多層結構之任一者。基材之厚度係例如為5至500μm,較佳為25至250μm。在提高對於黏著劑層之密接性的狀況下,可對基材實施表面處理。表面處理可列舉例如:電暈放電處理(電暈處理)、電漿處理、噴砂處理、化學蝕刻處理、底漆處理等。 The structure of the base material can be either a single-layer structure or a multi-layer structure. The thickness of the substrate is, for example, 5 to 500 μm, preferably 25 to 250 μm. In the case of improving the adhesion to the adhesive layer, surface treatment may be performed on the base material. Examples of the surface treatment include corona discharge treatment (corona treatment), plasma treatment, blasting treatment, chemical etching treatment, primer treatment and the like.

積層於基材之至少一面的黏著劑層係包含上述感溫性黏著劑者。將黏著劑層積層於基材之至少一面,係例如將溶劑添加至感溫性黏著劑而調製塗佈液,並將獲得的塗佈液以塗抹器、塗佈器等在基材之一面或兩面塗佈使其乾燥即可。塗抹器可列舉例如:BAKER式塗抹器等。塗佈器係例如:刮刀塗佈器、輥塗佈器、壓延塗佈器、逗號塗佈器、凹版塗佈器、棒式塗佈器等。 The adhesive layer laminated on at least one side of the substrate contains the above-mentioned temperature-sensitive adhesive. Laminating the adhesive on at least one side of the substrate is, for example, adding a solvent to the temperature-sensitive adhesive to prepare a coating solution, and applying the obtained coating solution to one side of the substrate or Just apply on both sides and let it dry. As an applicator, a baker type applicator etc. are mentioned, for example. The coater is, for example, a knife coater, a roll coater, a calender coater, a comma coater, a gravure coater, a bar coater, and the like.

黏著劑層之厚度係例如為5至300μm,較佳為10至300μm。 The thickness of the adhesive layer is, for example, 5 to 300 μm, preferably 10 to 300 μm.

在基材之兩面積層黏著劑層之情況中,一面之黏著劑層與另一面之黏著劑層,係彼此之組成及厚度等可相同亦可相異。再者,在一面之黏著劑層包含上述感溫性黏著劑的限制下,其他面的黏著劑層並無特別限定。其他面的黏著劑層係可由例如天然橡膠系黏著劑、合成橡膠系黏著劑、丙烯酸系黏著劑、聚矽氧系黏著劑、胺甲酸乙酯系黏著劑等所構成。 In the case of two layers of adhesive layers on the substrate, the adhesive layer on one side and the adhesive layer on the other side may be the same or different in composition and thickness. Furthermore, as long as the adhesive layer on one side contains the above-mentioned temperature-sensitive adhesive, the adhesive layer on the other side is not particularly limited. The adhesive layer on the other surface may be composed of, for example, natural rubber adhesives, synthetic rubber adhesives, acrylic adhesives, silicone adhesives, urethane adhesives, and the like.

黏著劑層之表面亦可積層離型膜。離型膜可列舉與由上述感溫性黏著片所例示相同者。離型膜係於感溫性黏著帶之使用時剝離。 A release film can also be laminated on the surface of the adhesive layer. As the release film, the same ones as those exemplified for the above-mentioned temperature-sensitive adhesive sheet can be mentioned. The release film is peeled off when the temperature-sensitive adhesive tape is used.

<被加工物的加工方法> <Processing method of workpiece>

接著,針對本發明之一實施型態之被加工物的加工方法,將被加工物屬於陶瓷胚片積層體之情況作為一例,並參照圖1進行詳細的說明。 Next, a method of processing a workpiece according to an embodiment of the present invention will be described in detail with reference to FIG. 1 , taking a case where the workpiece is a ceramic green sheet laminate as an example.

本實施型態之被加工物的加工方法,係使用上述感溫性黏著帶,並且具備下列(i)至(iv)步驟。 The processing method of the workpiece of this embodiment uses the above-mentioned temperature-sensitive adhesive tape, and has the following steps (i) to (iv).

(i)將感溫性黏著帶設為熔點以上之溫度而將感溫性黏著帶貼附於被加工物的步驟。 (i) A step of attaching the temperature-sensitive adhesive tape to the workpiece by setting the temperature-sensitive adhesive tape at a temperature higher than the melting point.

(ii)將感溫性黏著帶設為未達熔點之溫度而將被加工物臨時固定的步驟。 (ii) A step of temporarily fixing the workpiece by setting the temperature-sensitive adhesive tape at a temperature lower than the melting point.

(iii)加工被加工物以獲得加工物的步驟。 (iii) A step of processing a workpiece to obtain a processed product.

(iv)對感溫性黏著帶之黏著劑層照射紫外線,於未達熔點之溫度將加工物從感溫性黏著帶剝離的步驟。 (iv) A step of irradiating ultraviolet rays to the adhesive layer of the temperature-sensitive adhesive tape, and peeling the processed product from the temperature-sensitive adhesive tape at a temperature lower than the melting point.

具體說明時,如圖1(a)所示,本實施型態之感溫性黏著帶1具備:膜狀之基材2、及積層於基材2之一面且包含上述感溫性黏著劑的黏著劑層3。 When explaining specifically, as shown in FIG. 1(a), the temperature-sensitive adhesive tape 1 of this embodiment includes: a film-like base material 2, and a film layered on one side of the base material 2 and containing the above-mentioned temperature-sensitive adhesive. Adhesive layer 3.

(i)之步驟中,將感溫性黏著帶設為熔點以上之溫度而將感溫性黏著帶1貼附於屬於被加工物之陶瓷胚片積層體100。將感溫性黏著帶1設為熔點以上之溫度係例如使用加熱器等加熱手段即可。 In the step of (i), the temperature-sensitive adhesive tape 1 is attached to the ceramic green sheet laminate 100 which is a workpiece by setting the temperature of the temperature-sensitive adhesive tape at a temperature higher than the melting point. What is necessary is just to use heating means, such as a heater, to make the temperature-sensitive adhesive tape 1 into temperature more than a melting point, for example.

陶瓷胚片積層體100係例如將陶瓷粉末之漿體以刮刀薄薄地延伸以形成陶瓷胚片,在該陶瓷胚片之表面印刷複數個電極後,將複數個陶瓷胚片積層一體化而得。 The ceramic green sheet laminate 100 is obtained by, for example, thinly stretching the ceramic powder slurry with a doctor blade to form a ceramic green sheet, printing a plurality of electrodes on the surface of the ceramic green sheet, and then laminating and integrating the plurality of ceramic green sheets.

(ii)之步驟中,將感溫性黏著帶1設為未達熔點之溫度而將陶瓷胚片積層體100臨時固定。依據本實施型態,由於黏著劑層3包含上述感溫性黏著劑,因此可將陶瓷胚片積層體100以高固定力臨時固定。此外,將感溫性黏著帶1設為未達熔點之溫度係例如使用風扇等冷卻手段即可。 In the step of (ii), the ceramic green sheet laminate 100 is temporarily fixed by setting the temperature-sensitive adhesive tape 1 at a temperature lower than the melting point. According to this embodiment, since the adhesive layer 3 contains the above-mentioned temperature-sensitive adhesive, the ceramic green sheet laminate 100 can be temporarily fixed with a high fixing force. In addition, what is necessary is just to use cooling means, such as a fan, for example, to make the temperature-sensitive adhesive tape 1 into temperature less than a melting point.

(iii)之步驟中,加工陶瓷胚片積層體100以獲得加工物。加工方法可列舉例如:切削加工、研磨加工等。如圖1(b)所示,本實施型態之(iii)的步驟係所謂的切割加工。具體說明時,本實施型態之(iii)的步驟中,將陶瓷胚片積層體100以旋轉刀片200進行裁切,獲得複數個原片110作為加工物。 In the step (iii), the ceramic green sheet laminate 100 is processed to obtain a processed product. As a processing method, a cutting process, a grinding process, etc. are mentioned, for example. As shown in FIG. 1( b ), the step (iii) of this embodiment is a so-called cutting process. In the specific description, in the step (iii) of this embodiment, the ceramic green sheet laminate 100 is cut by the rotary blade 200 to obtain a plurality of original sheets 110 as processed products.

(iv)之步驟中,如圖1(c)所示,對感溫性黏著帶1之黏著劑層3照射UV,於未達熔點之溫度將複數個原片110從感溫性黏著帶1剝離。UV照射量係例如0.5至3J/cm2In step (iv), as shown in Figure 1(c), the adhesive layer 3 of the temperature-sensitive adhesive tape 1 is irradiated with UV light, and a plurality of original sheets 110 are removed from the temperature-sensitive adhesive tape 1 at a temperature lower than the melting point. peel off. The amount of UV irradiation is, for example, 0.5 to 3 J/cm 2 .

本實施型態中,由於黏著劑層3包含上述感溫性黏著劑,因此只要對黏著劑層3照射UV,則可於未達熔點之溫度充分地降低固定力。因此,可於未達熔點之溫度容易地將複數個原片110從感溫性黏著帶1剝離,且可獲得良好良率的獲得複數個原片110。 In this embodiment, since the adhesive layer 3 contains the above-mentioned temperature-sensitive adhesive, the fixing force can be sufficiently reduced at a temperature lower than the melting point by irradiating UV to the adhesive layer 3 . Therefore, the plurality of original sheets 110 can be easily peeled off from the temperature-sensitive adhesive tape 1 at a temperature lower than the melting point, and the plurality of original sheets 110 can be obtained with good yield.

只要熔點設為40至50℃,則在(ii)之步驟中,可在室溫將陶瓷胚片積層體100以高固定力臨時固定。再者,(iii)之步驟中,可將陶瓷胚 片積層體100在室溫進行切割加工。(iv)之步驟中,可容易地在室溫從感溫性黏著帶1剝離複數個原片110。 As long as the melting point is set at 40 to 50° C., in the step (ii), the ceramic green sheet laminate 100 can be temporarily fixed at room temperature with a high fixing force. Furthermore, in the step of (iii), the ceramic embryo can be The sheet laminate 100 is cut at room temperature. In the step of (iv), the plurality of original sheets 110 can be easily peeled off from the temperature-sensitive adhesive tape 1 at room temperature.

燒製所得的原片110時,可獲得陶瓷晶片。再者,在所得的陶瓷晶片之端面形成外部電極,則可獲得積層陶瓷電容器。 When the obtained green sheet 110 is fired, a ceramic wafer can be obtained. Furthermore, a multilayer ceramic capacitor can be obtained by forming external electrodes on the end faces of the obtained ceramic wafer.

以上,針對本發明之實施型態進行例示,惟本發明並非限定於上述實施型態者,只要不脫離本發明之主旨,當然可為任意者。 As mentioned above, although the embodiment of this invention was illustrated, this invention is not limited to the said embodiment, As long as it does not deviate from the gist of this invention, it can be arbitrary.

例如,上述實施型態中之被加工物的加工方法中,被加工物係陶瓷胚片積層體100,惟本實施型態之被加工物的加工方法,除了陶瓷胚片積層體100以外,亦可適用於例如製造陶瓷電感器、陶瓷壓敏電阻等之其他陶瓷部件時的被加工物。 For example, in the processing method of the processed object in the above-mentioned embodiment, the processed object is the ceramic green sheet laminate 100, but the processing method of the processed object in this embodiment, in addition to the ceramic green sheet laminate 100, also For example, it can be applied to workpieces in the manufacture of other ceramic components such as ceramic inductors and ceramic varistors.

再者,被加工物的加工方法中之(i)的步驟中,亦可將感溫性黏著帶1之基材2固定於台座。將基材2固定於台座之方法可列舉例如:在基材2與台座之間隔著預定的黏著劑或接著劑而固定之方法、及採用具備吸附機構等固定手段的台座之方法等。再者,感溫性黏著帶1之構成係在基材2之兩面積層有黏著劑層3之兩面帶之情況下,可隔著與將陶瓷胚片積層體100固定之一面之黏著劑層3相對的其他面之黏著劑層3而固定於台座。 Furthermore, in the step (i) of the processing method of the workpiece, the base material 2 of the temperature-sensitive adhesive tape 1 may also be fixed to the stand. The method of fixing the base material 2 to the base includes, for example, a method of fixing the base material 2 and the base through a predetermined adhesive or adhesive, and a method of using a base equipped with fixing means such as an adsorption mechanism. Furthermore, the composition of the temperature-sensitive adhesive tape 1 is that in the case where both surfaces of the base material 2 have the adhesive layer 3 on both sides, the adhesive layer 3 on the side that fixes the ceramic green sheet laminate 100 can be interposed. The adhesive layer 3 on the opposite side is fixed on the pedestal.

再者,被加工物的加工方法中之(iii)的步驟中,亦可取代利用旋轉刀片200進行之裁切,例如可使用藉由切斷刀片進行之推切。 Furthermore, in the step (iii) of the processing method of the workpiece, instead of cutting by the rotary blade 200 , for example, push cutting by a cutting blade can be used.

以下,列舉合成例及實施例詳細地說明本發明,惟本發明並非僅限定於下列合成例及實施例者。 Hereinafter, the present invention will be described in detail with reference to synthesis examples and examples, but the present invention is not limited to the following synthesis examples and examples.

(合成例1至2) (Synthesis Examples 1 to 2)

首先,將丙烯酸二十二酯、丙烯酸正丁酯及2-羥基丙烯酸乙酯以表1所示之比例混合,以獲得單體混合物。 First, behenyl acrylate, n-butyl acrylate and 2-hydroxyethyl acrylate were mixed in the ratio shown in Table 1 to obtain a monomer mixture.

其次,相對於單體混合物100重量份,將作為聚合起始劑之日油公司製之「PERBUTYL ND」以0.3重量份之比例混合,使用乙酸乙酯:庚烷=7:3(重量比)之混合溶劑,以固形份成為32重量%之方式調整,而獲得混合液。 Next, "PERBUTYL ND" manufactured by NOF Corporation as a polymerization initiator was mixed in a ratio of 0.3 parts by weight with respect to 100 parts by weight of the monomer mixture, using ethyl acetate:heptane=7:3 (weight ratio) The mixed solvent was adjusted so that the solid content became 32% by weight, and a mixed solution was obtained.

其次,將獲得的混合液於55℃攪拌4小時後,相對於單體混合物100重量份,將作為追加聚合起始劑之日油公司製之「PERBUTYL PV」以0.5重量份之比例混合,藉由於80℃進一步攪拌2小時使各單體共聚合,而獲得側鏈結晶性聚合物的溶液。 Next, after stirring the obtained mixed solution at 55° C. for 4 hours, with respect to 100 parts by weight of the monomer mixture, “PERBUTYL PV” manufactured by NOF Corporation as an additional polymerization initiator was mixed in a ratio of 0.5 parts by weight. Each monomer was copolymerized by further stirring at 80° C. for 2 hours to obtain a solution of a side chain crystalline polymer.

將獲得的側鏈結晶性聚合物的溶液以固形份換算為100重量份,具有上述式(I)所示之2-甲基丙烯醯氧基乙基異氰酸酯(昭和電工(股)製之UV硬化性官能基的化合物「Karenz MOI」)10.5重量份(相對於側鏈結晶性聚合物中之羥基烷基為0.8莫耳當量)、及作為觸媒之四乙醯丙酮鋯(Matsumoto Fine Chemical(股)製之「ORGATIX ZC-150」)0.1重量份之比例混合,在氮氣環境下於50℃攪拌8小時使其反應,而獲得UV硬化型側鏈結晶性聚合物的溶液。 The solution of the obtained side-chain crystalline polymer is converted to 100 parts by weight in terms of solid content, and has 2-methacryloxyethyl isocyanate (UV curable product manufactured by Showa Denko Co., Ltd.) represented by the above formula (I). 10.5 parts by weight of the compound "Karenz MOI" of the sexual functional group (0.8 mole equivalent relative to the hydroxyalkyl group in the side chain crystalline polymer), and zirconium tetraacetylacetonate (Matsumoto Fine Chemical Co., Ltd. ) made "ORGATIX ZC-150") in a ratio of 0.1 parts by weight, stirred at 50° C. for 8 hours under nitrogen atmosphere, and allowed to react to obtain a solution of UV-curable side-chain crystalline polymer.

(比較合成例1) (comparative synthesis example 1)

首先,以丙烯酸二十二酯45重量%、丙烯酸甲酯50重量%及2-羥基丙烯酸乙酯5重量%之比例混合,而獲得單體混合物。 First, 45% by weight of behenyl acrylate, 50% by weight of methyl acrylate, and 5% by weight of ethyl 2-hydroxyacrylate were mixed to obtain a monomer mixture.

其次,除了使用該單體混合物以外,其餘與合成例1至2同樣地使各單體共聚合,而獲得側鏈結晶性聚合物的溶液。然後,除了使用 該側鏈結晶性聚合物之溶液,並且將2-甲基丙烯醯氧基乙基異氰酸酯之比例設為5.3重量份(相對於側鏈結晶性聚合物中之羥基烷基0.8莫耳當量)以外,其餘與合成例1至2同樣地使其反應,而獲得UV硬化型側鏈結晶性聚合物的溶液。 Next, except that this monomer mixture was used, each monomer was copolymerized in the same manner as in Synthesis Examples 1 and 2 to obtain a solution of a side chain crystalline polymer. Then, instead of using The solution of the side chain crystalline polymer, and the ratio of 2-methacryloxyethyl isocyanate is set to 5.3 parts by weight (0.8 molar equivalent to the hydroxyalkyl group in the side chain crystalline polymer) , and the rest were reacted in the same manner as in Synthesis Examples 1 to 2 to obtain a solution of a UV-curable side chain crystalline polymer.

(比較合成例2) (comparative synthesis example 2)

首先,以丙烯酸二十二酯45重量%、丙烯酸正丁酯50重量%及2-羥基丙烯酸乙酯5重量%之比例混合,而獲得單體混合物。 First, 45% by weight of behenyl acrylate, 50% by weight of n-butyl acrylate, and 5% by weight of ethyl 2-hydroxyacrylate were mixed to obtain a monomer mixture.

其次,除了使用該單體混合物以外,其餘與合成例1至2同樣地使各單體共聚合,而獲得側鏈結晶性聚合物的溶液。然後,除了使用該側鏈結晶性聚合物之溶液,並且將2-甲基丙烯醯氧基乙基異氰酸酯之比例設為5.3重量份(相對於側鏈結晶性聚合物中之羥基烷基0.8莫耳當量)以外,其餘與合成例1至2同樣地使其反應,而獲得UV硬化型側鏈結晶性聚合物的溶液。 Next, except that this monomer mixture was used, each monomer was copolymerized in the same manner as in Synthesis Examples 1 and 2 to obtain a solution of a side chain crystalline polymer. Then, in addition to using the solution of the side chain crystalline polymer, and setting the ratio of 2-methacryloxyethyl isocyanate to 5.3 parts by weight (relative to 0.8 mol of the hydroxyalkyl group in the side chain crystalline polymer ear equivalent), the rest were reacted in the same manner as in Synthesis Examples 1 and 2 to obtain a solution of a UV-curable side chain crystalline polymer.

將於合成例1至2及比較合成例1至2獲得的各UV硬化型側鏈結晶性聚合物之重量平均分子量及熔點顯示於表1。此外,重量平均分子量係將使用GPC進行測定而獲得的測定值以聚苯乙烯換算的值。熔點係使用DSC於10℃/分鐘之測定條件進行測定的值。 Table 1 shows the weight average molecular weight and melting point of each UV curable side chain crystalline polymer obtained in Synthesis Examples 1 to 2 and Comparative Synthesis Examples 1 to 2. In addition, the weight average molecular weight is the value which converted the measured value obtained by the measurement using GPC to polystyrene conversion. The melting point is a value measured using DSC under the measurement conditions of 10° C./min.

[表1]

Figure 111109883-A0202-12-0017-4
[Table 1]
Figure 111109883-A0202-12-0017-4

[實施例1至7及比較例1至2] [Examples 1 to 7 and Comparative Examples 1 to 2]

<感溫性黏著帶之製作> <Production of Temperature Sensitive Adhesive Tape>

首先,將於合成例1至2及比較合成例1至2獲得的各UV硬化型側鏈結晶性聚合物之溶液以固形份換算100重量份,將IGM Resins公司製之光聚合起始劑「Omnirad500」以固形份換算1重量份,並將交聯劑及偶氮化合物以表2所示之比例各別混合,而獲得塗佈液。 First, the photopolymerization initiator manufactured by IGM Resins Co., Ltd. " Omnirad500" was calculated as 1 part by weight in terms of solid content, and a crosslinking agent and an azo compound were respectively mixed in the ratio shown in Table 2 to obtain a coating liquid.

此外,表2所示之交聯劑及偶氮化合物的比例係以固形份換算,相對於UV硬化型側鏈結晶性聚合物100重量份的值。所使用的交聯劑及偶氮化合物係如下所述。 In addition, the ratios of the crosslinking agent and the azo compound shown in Table 2 are values relative to 100 parts by weight of the UV curable side chain crystalline polymer in terms of solid content. The crosslinking agent and azo compound used are as follows.

交聯劑:日本聚胺甲酸乙酯工業公司製的異氰酸酯化合物「Coronate L-45E」 Cross-linking agent: Isocyanate compound "Coronate L-45E" manufactured by Nippon Polyurethane Industry Co., Ltd.

偶氮化合物:2,2'-偶氮雙(N-丁基-2-甲基丙醯胺) Azo compound: 2,2'-azobis(N-butyl-2-methylpropionamide)

其次,將獲得的塗佈液塗佈於基材之一面並使其乾燥,而獲得在基材之一面積層有厚度40μm之黏著劑層的感溫性黏著帶。所使用的基材、塗佈條件及乾燥條件(交聯條件)係如下所述。 Next, the obtained coating solution was applied to one side of the substrate and dried to obtain a temperature-sensitive adhesive tape having an adhesive layer with a thickness of 40 μm on one surface of the substrate. The substrates used, coating conditions, and drying conditions (crosslinking conditions) are as follows.

基材:使用由一面經電暈處理之厚度100μm的聚對苯二甲酸乙二酯所構成之膜狀的基材。 Substrate: A film-like substrate composed of polyethylene terephthalate with a thickness of 100 μm that has been corona-treated on one side was used.

塗佈條件:藉由塗抹器將塗佈液塗佈在基材之電暈處理面。 Coating conditions: apply the coating solution on the corona-treated surface of the substrate with an applicator.

乾燥條件:100℃之乾燥機內乾燥5分鐘。 Drying conditions: Dry in a dryer at 100°C for 5 minutes.

<評估> <assessment>

針對於實施例1至7及比較例1至2獲得的各感溫性黏著帶評估180°剝離強度。評估方法係示於下,並將其結果示於表2。 The 180° peel strength was evaluated for each temperature-sensitive adhesive tape obtained in Examples 1 to 7 and Comparative Examples 1 to 2. The evaluation method is shown below, and the result is shown in Table 2.

(180°剝離強度) (180°peel strength)

針對獲得的感溫性黏著帶,在UV照射前及UV照射後之23℃的環境溫度中,測定相對於聚對苯二甲酸乙二酯(PET)及不銹鋼(SUS)的180°剝離強度。180°剝離強度係根據JIS Z0237而測定。具體而言,以下列條件將感溫性黏著帶各別貼附於PET及SUS後,使用測力器以300mm/分鐘之速度進行180°剝離。 About the obtained temperature-sensitive adhesive tape, the 180 degree peel strength with respect to polyethylene terephthalate (PET) and stainless steel (SUS) was measured at the ambient temperature of 23 degreeC before UV irradiation and after UV irradiation. The 180° peel strength is measured in accordance with JIS Z0237. Specifically, the temperature-sensitive adhesive tape was attached to PET and SUS respectively under the following conditions, and then peeled off at 180° at a speed of 300 mm/min using a dynamometer.

[UV照射前23℃] [23°C before UV irradiation]

在60℃之環境溫度將感溫性黏著帶各別貼附於PET及SUS,在該環境溫度靜置20分鐘後,將環境溫度降溫至23℃,在該環境溫度靜置20分鐘後,進行180°剝離。 At an ambient temperature of 60°C, attach the temperature-sensitive adhesive tape to PET and SUS respectively. After standing at the ambient temperature for 20 minutes, lower the ambient temperature to 23°C. After standing at the ambient temperature for 20 minutes, carry out 180°peeling.

[UV照射後23℃] [23°C after UV irradiation]

在60℃之環境溫度將感溫性黏著帶各別貼附於PET及SUS,在該環境溫度靜置20分鐘後,將環境溫度降溫至23℃,在該環境溫度靜置20分鐘後,對黏著劑層照射UV。 At an ambient temperature of 60°C, attach the temperature-sensitive adhesive tape to PET and SUS respectively. After standing at the ambient temperature for 20 minutes, lower the ambient temperature to 23°C. After standing at the ambient temperature for 20 minutes, the The adhesive layer is irradiated with UV.

UV照射條件係如下所述。 The UV irradiation conditions are as follows.

裝置:帶式UV照射裝置 Device: Belt UV irradiation device

光源:高壓汞燈UV照射量:1J/cm2 Light source: high pressure mercury lamp UV radiation: 1J/cm 2

照射UV後,在23℃之環境溫度靜置20分鐘後,進行180°剝離。 After irradiating UV, it was left to stand at an ambient temperature of 23° C. for 20 minutes, and then peeled at 180°.

此外,PET係使用厚度0.25mm之膜狀,且表面未處理者。SUS係使用板狀之SUS304。對於PET及SUS之感溫性黏著帶的貼附,係藉由於感溫性黏著帶上使2kg之輥來回5次而進行。 In addition, PET is used in the form of a film with a thickness of 0.25mm and the surface is not treated. SUS uses plate-shaped SUS304. The temperature-sensitive adhesive tape of PET and SUS is attached by making a 2kg roller back and forth 5 times on the temperature-sensitive adhesive tape.

[表2]

Figure 111109883-A0202-12-0020-7
[Table 2]
Figure 111109883-A0202-12-0020-7

從表2明顯可知,在實施例1至7中,對於PET及SUS之任一者,皆顯示在UV照射前之23℃中之180°剝離強度之值高,且UV照射後之23℃中之180°剝離強度之值低的結果。因此,在實施例1至7中,可 謂於未達熔點之溫度將被加工物臨時固定,且於未達熔點之溫度藉由UV之照射剝離加工物。 As is apparent from Table 2, in Examples 1 to 7, any of PET and SUS showed a high value of 180° peel strength at 23° C. before UV irradiation, and at 23° C. after UV irradiation The result of the low value of the 180° peel strength. Therefore, in Embodiments 1 to 7, it is possible to It means that the processed object is temporarily fixed at a temperature below the melting point, and the processed object is peeled off by UV irradiation at a temperature below the melting point.

在比較例1中,於23℃之環境溫度容易從PET及SUS剝離,因而無法測定UV照射前之23℃中之180°剝離強度,而顯示固定性不佳的結果。此外,作為參考例,將UV照射前之80℃中之180°剝離強度的值顯示於表2中之「UV照射前23℃」的欄。 In Comparative Example 1, it was easy to peel from PET and SUS at an ambient temperature of 23° C., so the 180° peel strength at 23° C. before UV irradiation could not be measured, showing poor fixability. In addition, as a reference example, the value of the 180° peel strength at 80° C. before UV irradiation is shown in the column of “23° C. before UV irradiation” in Table 2.

在比較例2中,對於PET及SUS之任一者,皆顯示UV照射後之23℃中之180°剝離強度之值高,UV照射後之未達熔點之溫度中之剝離性不佳的結果。 In Comparative Example 2, both PET and SUS showed a high value of 180° peel strength at 23°C after UV irradiation, and poor peelability at a temperature below the melting point after UV irradiation. .

1:感溫性黏著帶 1: Temperature sensitive adhesive tape

2:基材 2: Substrate

3:黏著劑層 3: Adhesive layer

100:陶瓷胚片積層體 100: ceramic green sheet laminate

Claims (8)

一種感溫性黏著劑,係含有紫外線硬化型側鏈結晶性聚合物,該紫外線硬化型側鏈結晶性聚合物為具有紫外線硬化性官能基之化合物與側鏈結晶性聚合物的反應物,且於熔點以上之溫度顯示流動性;其中, A temperature-sensitive adhesive, which contains a UV-curable side-chain crystalline polymer, the UV-curable side-chain crystalline polymer is a reaction product of a compound having a UV-curable functional group and a side-chain crystalline polymer, and Show fluidity at a temperature above the melting point; where, 前述側鏈結晶性聚合物係含有具有碳數16以上之直鏈狀烷基的(甲基)丙烯酸酯、具有碳數2至6之烷基的(甲基)丙烯酸酯及具有羥基烷基之(甲基)丙烯酸酯作為單體成分,並且在單體成分中以6重量%以上之比例包含前述具有羥基烷基之(甲基)丙烯酸酯。 The above-mentioned side chain crystalline polymers are (meth)acrylates containing linear alkyl groups having 16 or more carbons, (meth)acrylates having alkyl groups having 2 to 6 carbons, and (meth)acrylates having hydroxyalkyl groups. (Meth)acrylate is a monomer component, and the above-mentioned (meth)acrylate which has a hydroxyalkyl group is contained in the ratio of 6 weight% or more in a monomer component. 如請求項1所述之感溫性黏著劑,係於未達前述熔點之溫度臨時固定被加工物,且藉由紫外線之照射於未達前述熔點之溫度剝離加工物。 The temperature-sensitive adhesive described in claim 1 temporarily fixes the workpiece at a temperature lower than the aforementioned melting point, and peels the processed object at a temperature lower than the aforementioned melting point by irradiation of ultraviolet rays. 如請求項1或2所述之感溫性黏著劑,係更含有偶氮化合物。 The temperature-sensitive adhesive as described in claim 1 or 2 further contains an azo compound. 如請求項3所述之感溫性黏著劑,其中,相對於前述紫外線硬化型側鏈結晶性聚合物100重量份,前述偶氮化合物之含量係5至15重量份。 The temperature-sensitive adhesive according to claim 3, wherein the content of the azo compound is 5 to 15 parts by weight relative to 100 parts by weight of the ultraviolet curable side chain crystalline polymer. 如請求項1至4中任一項所述之感溫性黏著劑,係陶瓷胚片積層體之臨時固定用者。 The temperature-sensitive adhesive as described in any one of Claims 1 to 4 is used for temporary fixation of ceramic green sheet laminates. 一種感溫性黏著片,係包含請求項1至5中任一項所述之感溫性黏著劑。 A temperature-sensitive adhesive sheet comprising the temperature-sensitive adhesive described in any one of Claims 1 to 5. 一種感溫性黏著帶,係具備膜狀之基材及黏著劑層,其中, A temperature-sensitive adhesive tape comprising a film-like substrate and an adhesive layer, wherein, 該黏著劑層係積層在前述基材之至少一面且包含請求項1至5中任一項所述之感溫性黏著劑。 The adhesive layer is laminated on at least one side of the substrate and includes the temperature-sensitive adhesive described in any one of Claims 1-5. 一種被加工物的加工方法,係具備下列步驟: A processing method for a processed product comprises the following steps: 將請求項7所述之感溫性黏著帶設為前述熔點以上之溫度而將前述感溫性黏著帶貼附於被加工物的步驟, A step of attaching the temperature-sensitive adhesive tape to the workpiece by setting the temperature-sensitive adhesive tape described in claim 7 at a temperature above the melting point, 將前述感溫性黏著帶設為未達前述熔點之溫度而將前述被加工物臨時固定的步驟, The step of temporarily fixing the aforementioned workpiece by setting the aforementioned temperature-sensitive adhesive tape at a temperature lower than the aforementioned melting point, 加工前述被加工物以獲得加工物的步驟,以及 a step of processing the aforementioned workpiece to obtain a processed product, and 對前述感溫性黏著帶之前述黏著劑層照射紫外線,於未達前述熔點之溫度將前述加工物從前述感溫性黏著帶剝離的步驟。 A step of irradiating ultraviolet rays to the adhesive layer of the temperature-sensitive adhesive tape, and peeling the processed product from the temperature-sensitive adhesive tape at a temperature lower than the melting point.
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