TW202240342A - Thermal module - Google Patents

Abstract

A thermal module includes a base seat, at least two heat pipes and multiple heat dissipation units. Each heat pipe has a heat absorption end and a heat dissipation end outward extending from the heat absorption end. The heat absorption ends are disposed on the base seat. The heat dissipation ends of the at least two heat pipes are positioned above the base seat at different heights and misaligned from each other. The multiple heat dissipation units are connected with the heat dissipation ends of the heat pipes and arranged at intervals. By means of arranging the multiple heat dissipation unit at intervals as multiple layers, the heat dissipation areas is enlarged to prevent the airflow from being interrupted so as to effectively greatly enhance the heat dissipation efficiency.

Description

Cooling module

The invention relates to a heat dissipation module, in particular to a heat dissipation module which can avoid airflow obstruction and increase heat dissipation area to effectively improve heat dissipation efficiency.

Many electronic devices (such as computers) are increasing and their performance is improving, so that the electronic components in the electronic devices will generate high heat. It is necessary to dissipate heat through a radiator to reduce the temperature in order to maintain work efficiency and reduce the chance of damage to electronic components. The existing general radiators are divided into aluminum extruded fins or fastened stacked fins, but the distance and height of each fin of these radiators are fixed and consistent, so that each fin passes through each radiator. The airflow above and below the cooling fins and the spacing will be restricted to be the same and the length of the airflow passing through will be the same, so when the existing heat sink is attached to a heat source (such as a central processing unit or a graphics processing chip) to export When the heat energy is dissipated through the upper heat dissipation fins, the air flow blowing on the upper and lower sides of the heat dissipation fins is restricted the same, and the heat energy taken away is relatively limited so that it is easy to cause the problem of heat accumulation . As the wattage and performance of electronic components increase, it is necessary to increase the heat dissipation area by increasing the number of heat dissipation fins and increasing the heat dissipation fins of the existing heat sink. However, the only heat sink that can be placed in the limited space of the electronic device is Under the same area, if more heat dissipation area is required, the number of heat dissipation fins must be increased. For example, although a lot of heat dissipation fins are added in an area of 10 cm x 10 cm, the more the number of fins, the more adjacent The spacing between the cooling fins (airflow channel) will be narrower (that is, the spacing between two adjacent cooling fins will be reduced), so that the resistance (flow field impedance) of the airflow flowing through the cooling fins will be reduced. ) is relatively large, and the air volume entering the space between the heat dissipation fins is also greatly reduced, resulting in poor heat dissipation efficiency. If the heat dissipation fins are increased and elongated, it is easy to cause deformation or damage due to the thin thickness of each heat dissipation fin. If the thickness of each heat dissipation fin is increased, the number of heat dissipation fins will be reduced. , which in turn leads to the problem of reducing the heat dissipation area. So how to use the space above the radiator to increase the heat dissipation area under the same area of the radiator in a limited space, which makes the industry think of directly stacking or lapping two independent radiators in double layers. The method is combined to obtain more heat dissipation area, but another problem is extended, that is, because one heat sink is directly pressed against the part where the other heat sink is provided with heat dissipation fins, and the heat sink stacked on the top has a considerable weight, so that the cooling fins arranged on the lower radiator cannot bear the weight of the upper radiator and be deformed (or damaged), resulting in poor heat dissipation efficiency. Therefore, the cooling fin structure The strength issue is still unresolved and is one of the problems that the industry still has to work hard to overcome. Therefore, how to solve the above-mentioned conventional problems and deficiencies is the direction that the inventor of this case and the relevant manufacturers engaged in this industry want to study and improve urgently.

An object of the present invention is to provide a heat dissipation module that can increase the heat dissipation area and avoid airflow obstruction to effectively improve heat dissipation efficiency. In order to achieve the above object, the present invention provides a heat dissipation module, including a base, at least two heat pipes and a plurality of heat dissipation units, the at least two heat pipes are provided with a heat-absorbing end and a heat-radiating end extending outward from the heat-absorbing end, the heat-absorbing end The heat dissipation ends of the at least two heat pipes are located above the base and arranged in a high and low staggered manner. A plurality of heat dissipation units are combined with the heat dissipation ends of the heat pipes, and the plurality of heat dissipation units are arranged at intervals from each other. . The present invention further provides a heat dissipation module, including a base, at least one heat pipe and at least one heat dissipation unit, the base has a top surface and a bottom surface, the top surface is provided with a plurality of base fins, and the at least one heat pipe is provided with There is a heat-absorbing end and a heat-dissipating end extending outward from the heat-absorbing end, the heat-absorbing end is arranged on the base, the base and the heat-dissipating end located above are arranged high and low, and the heat-dissipating unit and the plurality of bases The seat fins have a pitch. Therefore, through layered and/or staggered interval configuration design to adjust the high, low or front and rear multiple heat dissipation fins or the multiple heat dissipation fins and the multiple base fins to set the position, in addition to increasing the heat dissipation area and avoiding airflow blocked, so as to effectively improve the heat dissipation efficiency. The aforementioned base has a top side and a bottom side, and the bottom side of the base has a plurality of grooves. The base of the seat is even. An upper side of the heat-absorbing end of the at least two heat pipes contacts the bottom side of the base, and at least one of the heat-absorbing ends of the at least two heat pipes is attached to a heating element. Each of the aforementioned heat dissipation units has a plurality of heat dissipation fins, and an airflow channel is defined between two pairs of heat dissipation fins. The airflow channels of the plurality of heat dissipation fins on the heat dissipation ends of the at least two heat pipes are the same or different. The aforementioned base is a uniform temperature plate, a hot plate, a heat conduction block or a radiator. The width of the airflow passages of the plurality of heat dissipation fins on the heat dissipation end of the at least one heat pipe is greater than, equal to or smaller than the width of the air flow passages of the plurality of heat dissipation fins on the heat dissipation end of the at least one other heat pipe. The aforementioned heat dissipation module further includes at least one fan, which is selected to be arranged on one side of the base or one side or the center of the plurality of heat dissipation fins, and is used to guide an airflow to flow to the plurality of heat dissipation fins for heat dissipation. exchange. The heat dissipation ends of the at least two heat pipes are located above the base and arranged staggered front and back. The aforementioned heat dissipation unit includes a plurality of heat dissipation fins and a two-phase flow heat dissipation structure, one side of the plurality of heat dissipation fins is attached to an upper side of the two-phase flow heat dissipation structure, and the heat dissipation end of the heat pipe is connected to the two-phase flow heat dissipation structure. The lower side of the structure is in contact with or directly communicated with a chamber of the two-phase flow heat dissipation structure. The two-phase flow cooling structure is a uniform temperature plate or a hot plate.

The above-mentioned purpose of the present invention and its structural and functional characteristics will be described based on the preferred embodiments of the accompanying drawings. The present invention provides a heat dissipation module, referring to Figures 1 and 2, the heat dissipation module 1 includes a base 11, at least two heat pipes 12 and a plurality of heat dissipation units 14, the base 11 can be selected as a vapor chamber, a heat sink plate, a heat conduction block or a heat sink, the base 11 in this embodiment is selected as a heat conduction block made of metal material (such as copper, aluminum, titanium, stainless steel or alloy material), but it is not limited to this. The base 11 has a top side 111, a bottom side 112 and a plurality of grooves 113, the plurality of grooves 113 are concavely formed on the bottom side 112 of the base 11, and the plurality of grooves 113 are used for accommodating A heat-absorbing end 121 of the plurality of heat pipes 12 is combined, and each heat pipe 12 is provided with the aforementioned heat-absorbing end 121 and a heat-dissipating end 122 extending outward from the heat-absorbing end 121, and the heat-absorbing end 121 is located at the bottom of the base 11 side 112 , and is flush with the bottom side 112 of the base 11 , and the shape of each groove 113 is matched with the shape of each heat pipe 12 . In a feasible embodiment, the groove 113 can be omitted, and the heat-absorbing ends 121 of the plurality of heat pipes 12 are directly connected to the base 11, or the heat-absorbing ends 121 of the plurality of heat pipes 12 are selected to be attached to the base. The seat 11 is in contact on either the top side 111 or the bottom side 112 . In another embodiment, the base 11 can have a chamber (such as a vapor chamber or a hot plate; not shown in the figure) for the gas-liquid phase change, and the heat-absorbing ends 121 of the plurality of heat pipes 12 are connected to the chamber The connection can be connected or disconnected. The heat dissipation ends 122 of the at least two heat pipes 12 are located above the top side 111 of the base 11 and arranged in a high and low staggered manner. In this embodiment, the plurality of heat pipes 12 are arranged on the opposite side of the base 11, but it is not limited Here, in real time and in different applications, the number of heat pipes 12 can be more than two heat pipes 12 arranged on the same side of the base 11 (as shown in Figures 3A and 4) or on different sides, and multiple heat pipes The heat dissipation end 122 of the base 12 is disposed on the top side 111 of the base 11 in a multi-layer manner, which is high, low and/or front and rear alternately arranged. And an upper side of the heat-absorbing end 121 of the plurality of heat pipes 12 is then contacted and attached to the bottom side 112 of the base 11, and the lower side of the heat-absorbing end 121 of the two heat pipes 12 in the plurality of heat pipes 12 is directly connected to a heating element 3 ( For example, a central processing unit or a graphics processing unit or a single chip or other electronic components) are placed in contact with each other, and the cooling ends 122 of the plurality of heat pipes 12 are located above the base 11 to form high and low layers separated from each other. For the convenience of description, the radiating ends 122 of the upper two heat pipes 12 among the plurality of heat pipes 12 are referred to as the upper (higher) two radiating ends 122 for short, and the radiating ends 122 of the other two heat pipes 12 below are referred to as the lower (lower) for short. lower layer) two heat dissipation ends 122. The plurality of heat dissipation units 14 are combined with the heat dissipation ends 122 of the plurality of heat pipes 12 (such as the upper two heat dissipation ends 122 and the lower floor two heat dissipation ends 122), and the plurality of heat dissipation units 114 are arranged at intervals with each other, and each heat dissipation unit 14 includes a plurality of The heat dissipation fins 141 define an airflow channel 15 between two pairs of heat dissipation fins 14 , and the airflow channel 15 is used to guide an external airflow to take away more heat from the heat dissipation unit 14 for heat exchange. The plurality of cooling units 14 in the lower layer are respectively separated from the upper cooling unit 14 and the base 11 by a distance 116, and the distance 116 is used for external airflow (such as natural convection or forced convection) to pass through the plurality of heat dissipation fins of the heat dissipation units. The fins 141 are used to avoid airflow obstruction and increase heat exchange efficiency. The airflow passages 15 of the plurality of heat dissipation fins 141 of the heat dissipation units 14 are the same or different. The air flow passage 15 of the heat dissipation unit 14 on the upper heat dissipation end 122 of the present embodiment is selected to be different from the air flow passage 15 of the heat dissipation unit 14 on the second heat dissipation end 122 of the lower floor, that is, the plural heat dissipation of the upper heat dissipation unit 14 The width of the airflow channels 15 of the fins 141 is greater than the width of the airflow channels 15 of the plurality of heat dissipation fins 141 of the lower heat dissipation unit 14 . In this embodiment, there are more cooling fins in the hotter area of the lower layer, so that the airflow channels 15 between the lower layer cooling fins 141 are narrower, while the air flow channels 15 between the upper layer cooling fins 141 are wider to allow airflow Pass through quickly and increase the flow rate of the airflow. With this design, the flow field of the passing airflow can be changed to improve or guide the airflow to perform heat exchange to the heat dissipation unit more smoothly. In addition, whether it is to increase the width of the airflow channel 15 between the cooling fins 141 to increase the flow rate of the airflow, or to reduce the width of the airflow channel between the cooling fins 141 in exchange for more number of cooling fins 141 to increase the heat dissipation area, can be beneficial to effectively improve heat exchange efficiency, and the upper and lower heat dissipation units 14 of the present invention can provide multiple design combinations at the same time, so this case is compared with the conventional heat sink, no matter the channel between the fins or the number of fins All are fixed and cannot be changed, so the design of the present invention provides more flexible fin configuration options. Therefore, through the design of increasing the heat dissipation area above the application space of the heat dissipation module 1 of the present invention, the plurality of heat dissipation units 14 are used to change the height of the layer interval (ie, the height difference) on the base 11 to obtain more heat dissipation fins. 141 to increase the heat dissipation area, and by staggering the plurality of heat dissipation units 14 with high and low design (such as front and rear stagger or left and right stagger) to avoid airflow obstruction, so as to effectively increase the flow through the heat dissipation fins 141 and achieve Improve the overall heat dissipation performance of the heat dissipation module 1 . And the heat dissipation module 1 of the present invention can be applied in an electronic device (such as a computer, a communication device or a server; not shown in the figure), so as to achieve a better heat dissipation effect on the heating element 3 in the electronic device in a limited space . In some other embodiments, the width of the airflow channel 15 of the plurality of heat dissipation fins 14 of the upper (higher) heat dissipation unit 14 is smaller than or equal to the airflow passage of the plurality of heat dissipation fins 14 of the lower (lower level) heat dissipation unit 14 15 in width. In some other embodiments, the plurality of heat dissipation units 14 (such as the upper heat dissipation unit 14 and/or the lower heat dissipation unit 14) are located at the heat dissipation end 12 of the heat pipe 12 (such as the upper heat dissipation end 122 and/or the lower heat dissipation end 122). Any one or any two of the front, middle and rear sections of the cooling end can be selected to be arranged in sections on the section. In some other embodiments, the bottom side of the plurality of heat dissipation units 14 (such as the upper heat dissipation unit 14 and/or the lower heat dissipation unit 14) is attached to the upper side of a temperature uniform plate (or heat plate), and the heat dissipation end 12 of the heat pipe 12 (such as the upper heat dissipation end 122 and/or the lower heat dissipation end 122) are connected to the lower side of the vapor chamber (or hot plate). In another alternative embodiment, referring to Figures 3A and 3B, the heat dissipation module 1 further includes at least one fan 2 (such as an axial flow fan or a centrifugal fan), and the fan 2 is optionally arranged on one side of the base 11 or One side or the center of the plurality of cooling fins 141 is used to guide the air flow to the plurality of cooling fins 141 for heat exchange to achieve forced cooling. On the side, an air outlet of the fan 2 discharges the airflow toward the airflow channel 15 direction of the plurality of heat dissipation fins 141 of the upper and lower layers (higher and lower layers), and flows through the plurality of heat dissipation fins 141 of the upper layer (higher layer). The air flow resistance (flow field resistance) of the lower layer (lower layer) is more than the air flow resistance (flow field resistance) of the plurality of cooling fins 141 in the lower layer (lower layer). But not limited thereto, in yet another alternative embodiment, the airflow flow resistance (or heat dissipation area) flowing through the plurality of heat dissipation fins 141 in the upper layer can also be designed to be less than the airflow flow resistance (or heat dissipation area) of the plurality of heat dissipation fins 141 in the lower layer. Cooling area). In another alternative embodiment, referring to FIG. 5, the base 11 further includes a plurality of base fins 115, and the plurality of base fins 115 are integrally arranged on the top side 111 of the base 11 to form a heat sink. Here, instead of implementing the heat pipe 12 and the heat dissipation unit 14, a single heat pipe 12 and a single heat dissipation unit 14 are selected. The high and low intervals are arranged, and there is another interval 116 between the cooling unit 14 and the plurality of base fins 115 . And the heat dissipation unit 14 further includes a two-phase flow heat dissipation structure 143 (such as a vapor chamber or a hot plate), one side of the plurality of heat dissipation fins 141 is attached to an upper side of the two-phase flow heat dissipation structure 143, the The heat dissipation end 122 of the heat pipe 12 is in contact with the lower side of the two-phase flow heat dissipation structure 143, or directly communicates with the chamber of the two-phase flow heat dissipation structure 143, so through the heat dissipation unit 14 and the plurality of base fins The concept of 115 layers and intervals is used to adjust the heat dissipation area and airflow resistance of the upper and lower layers, so as to effectively increase the heat dissipation area and avoid airflow obstruction, so as to effectively improve the heat dissipation efficiency.

1: cooling module 11: Base 111: top side 112: bottom side 113: Groove 115: base fins 116: Spacing 12: heat pipe 121: Heat-absorbing end 122: cooling end 14: cooling unit 141: cooling fins 143: Two-phase flow cooling structure 15: Airflow channel 2: fan 3: heating element

Fig. 1 is an exploded perspective view of an embodiment of the present invention. Fig. 2 is a combined cross-sectional schematic diagram of an embodiment of the present invention. FIG. 3A is a schematic diagram of the implementation of the cooling module and the fan of the present invention. FIG. 3B is a schematic diagram of an embodiment in which the airflow discharged from the fan of the present invention flows to the upper layer and the lower layer of multiple cooling fins with different air flow rates. Fig. 4 is another implementation schematic diagram of the combined stereo of an embodiment of the present invention. Fig. 5 is a combined perspective view of other alternative embodiments of the present invention.

1: cooling module

11: Base

111: top side

116: Spacing

12: heat pipe

121: Heat-absorbing end

122: cooling end

14: cooling unit

141: cooling fins

15: Airflow channel

Claims (11)

A cooling module, comprising: a base; At least two heat pipes are provided with a heat-absorbing end and a heat-dissipating end extending outward from the heat-absorbing end. The heat-absorbing end is arranged on the base, and the heat-dissipating ends of the at least two heat pipes are located above the base and are staggered high and low. settings; and A plurality of heat dissipation units are combined with the heat dissipation ends of the at least two heat pipes, and the plurality of heat dissipation units are spaced apart from each other. As the heat dissipation module described in item 1 of the patent scope of the application, wherein the base has a top side and a bottom side, the bottom side of the base has a plurality of grooves, and the plurality of grooves can accommodate and combine the at least The heat-absorbing ends of the two heat pipes are arranged so that the heat-absorbing ends of the at least two heat pipes are flush with the bottom surface of the base. The heat dissipating module as described in item 1 of the patent scope of the application, wherein an upper side of the heat-absorbing end of the at least two heat pipes is in contact with the bottom side of the base, and the lower side of at least one of the heat-absorbing ends of the at least two heat pipes is in contact with the bottom side of the base. A heating element is arranged adjacently. As the heat dissipation module described in item 1 of the patent scope of the application, each of the heat dissipation units has a plurality of heat dissipation fins, and an airflow channel is defined between the two heat dissipation fins, and the plurality of heat dissipation ends of the at least two heat pipes The airflow channels of the cooling fins are the same or different. The heat dissipation module described in item 1 of the scope of the patent application, wherein the base is a vapor chamber, a hot plate, a heat conducting block or a radiator. The heat dissipation module as described in item 4 of the patent scope of the application, wherein the width of the airflow channel of the plurality of heat dissipation fins on the heat dissipation end of the at least one heat pipe is greater than, equal to or smaller than the heat dissipation end of the other at least one heat pipe on the heat dissipation module. The width of the airflow channels of the plurality of cooling fins. The heat dissipation module described in item 4 of the scope of the patent application further includes at least one fan, and the fan is selected to be arranged on one side of the base or one side or the center of the plurality of heat dissipation fins for guiding An air flow flows to the plurality of cooling fins for heat exchange. According to the heat dissipation module described in item 1 of the scope of the patent application, the heat dissipation ends of the at least two heat pipes are located above the base and arranged staggered front and back. A cooling module, comprising: a base having a top surface and a bottom surface, the top surface being provided with a plurality of base fins; and At least one heat pipe is provided with a heat-absorbing end and a heat-dissipating end extending outward from the heat-absorbing end, the heat-absorbing end is arranged on the base, and the base and the heat-dissipating end located above are arranged in a high and low position; At least one heat dissipation unit is combined on the heat dissipation end, and there is a distance between the heat dissipation unit and the plurality of base fins. The heat dissipation module described in item 9 of the scope of the patent application, wherein the heat dissipation unit includes a plurality of heat dissipation fins and a two-phase flow heat dissipation structure, one side of the plurality of heat dissipation fins is in contact with an upper side of the two-phase flow heat dissipation structure Attached, the heat dissipation end of the heat pipe is in contact with the lower side of the two-phase flow heat dissipation structure or directly communicates with a chamber of the two-phase flow heat dissipation structure. The heat dissipation module as described in item 10 of the patent application, wherein the two-phase flow heat dissipation structure is a uniform temperature plate or a hot plate.

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