TW202239867A - 樹脂組成物及電氣電子零件封裝體 - Google Patents

樹脂組成物及電氣電子零件封裝體 Download PDF

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Publication number
TW202239867A
TW202239867A TW111102089A TW111102089A TW202239867A TW 202239867 A TW202239867 A TW 202239867A TW 111102089 A TW111102089 A TW 111102089A TW 111102089 A TW111102089 A TW 111102089A TW 202239867 A TW202239867 A TW 202239867A
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TW
Taiwan
Prior art keywords
resin composition
resin
polyester resin
polyester
present
Prior art date
Application number
TW111102089A
Other languages
English (en)
Chinese (zh)
Inventor
村上雄基
浜崎亮
Original Assignee
日商東洋紡股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商東洋紡股份有限公司 filed Critical 日商東洋紡股份有限公司
Publication of TW202239867A publication Critical patent/TW202239867A/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • C08L67/03—Polyesters derived from dicarboxylic acids and dihydroxy compounds the dicarboxylic acids and dihydroxy compounds having the carboxyl- and the hydroxy groups directly linked to aromatic rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
    • C08L77/08—Polyamides derived from polyamines and polycarboxylic acids from polyamines and polymerised unsaturated fatty acids
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW111102089A 2021-01-20 2022-01-19 樹脂組成物及電氣電子零件封裝體 TW202239867A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-007426 2021-01-20
JP2021007426 2021-01-20

Publications (1)

Publication Number Publication Date
TW202239867A true TW202239867A (zh) 2022-10-16

Family

ID=82548897

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111102089A TW202239867A (zh) 2021-01-20 2022-01-19 樹脂組成物及電氣電子零件封裝體

Country Status (3)

Country Link
JP (1) JPWO2022158384A1 (https=)
TW (1) TW202239867A (https=)
WO (1) WO2022158384A1 (https=)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001064506A (ja) * 1999-08-25 2001-03-13 Kuraray Co Ltd 熱可塑性ポリウレタン組成物
JP2004083918A (ja) * 2001-09-18 2004-03-18 Toyobo Co Ltd モールディング用ポリエステル樹脂、樹脂組成物及びそれを用いた成型品
JP4423533B2 (ja) * 2003-03-14 2010-03-03 東洋紡績株式会社 光学的特性を有する電気電子部品のモールディング用ポリエステル樹脂組成物、電気電子部品および電気電子部品の製造方法
JP2012180385A (ja) * 2011-02-28 2012-09-20 Toyobo Co Ltd 樹脂組成物、該樹脂組成物を用いた電気電子部品封止体ならびにその製造方法
JP2013060539A (ja) * 2011-09-14 2013-04-04 Toyobo Co Ltd 樹脂組成物、及びそれを用いてなる金属被覆体
JP6183083B2 (ja) * 2012-09-13 2017-08-23 東洋紡株式会社 金属被覆用樹脂組成物
JP7007950B2 (ja) * 2018-03-05 2022-01-25 東洋鋼鈑株式会社 パール調光沢フィルム
WO2020059834A1 (ja) * 2018-09-21 2020-03-26 三菱エンジニアリングプラスチックス株式会社 樹脂金属複合体及びその製造方法
KR102243744B1 (ko) * 2020-04-13 2021-04-23 한양대학교 산학협력단 발광성 도펀트를 구비하는 멀티쉘 구조 기반의 양자점

Also Published As

Publication number Publication date
JPWO2022158384A1 (https=) 2022-07-28
WO2022158384A1 (ja) 2022-07-28

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