JPWO2022158384A1 - - Google Patents

Info

Publication number
JPWO2022158384A1
JPWO2022158384A1 JP2022534330A JP2022534330A JPWO2022158384A1 JP WO2022158384 A1 JPWO2022158384 A1 JP WO2022158384A1 JP 2022534330 A JP2022534330 A JP 2022534330A JP 2022534330 A JP2022534330 A JP 2022534330A JP WO2022158384 A1 JPWO2022158384 A1 JP WO2022158384A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022534330A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022158384A1 publication Critical patent/JPWO2022158384A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • C08L67/03—Polyesters derived from dicarboxylic acids and dihydroxy compounds the dicarboxylic acids and dihydroxy compounds having the carboxyl- and the hydroxy groups directly linked to aromatic rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
    • C08L77/08—Polyamides derived from polyamines and polycarboxylic acids from polyamines and polymerised unsaturated fatty acids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2022534330A 2021-01-20 2022-01-14 Pending JPWO2022158384A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021007426 2021-01-20
PCT/JP2022/001088 WO2022158384A1 (ja) 2021-01-20 2022-01-14 樹脂組成物および電気電子部品封止体

Publications (1)

Publication Number Publication Date
JPWO2022158384A1 true JPWO2022158384A1 (ja) 2022-07-28

Family

ID=82548897

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022534330A Pending JPWO2022158384A1 (ja) 2021-01-20 2022-01-14

Country Status (3)

Country Link
JP (1) JPWO2022158384A1 (ja)
TW (1) TW202239867A (ja)
WO (1) WO2022158384A1 (ja)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004083918A (ja) * 2001-09-18 2004-03-18 Toyobo Co Ltd モールディング用ポリエステル樹脂、樹脂組成物及びそれを用いた成型品
JP4423533B2 (ja) * 2003-03-14 2010-03-03 東洋紡績株式会社 光学的特性を有する電気電子部品のモールディング用ポリエステル樹脂組成物、電気電子部品および電気電子部品の製造方法
JP2012180385A (ja) * 2011-02-28 2012-09-20 Toyobo Co Ltd 樹脂組成物、該樹脂組成物を用いた電気電子部品封止体ならびにその製造方法
JP2013060539A (ja) * 2011-09-14 2013-04-04 Toyobo Co Ltd 樹脂組成物、及びそれを用いてなる金属被覆体
JP6183083B2 (ja) * 2012-09-13 2017-08-23 東洋紡株式会社 金属被覆用樹脂組成物

Also Published As

Publication number Publication date
WO2022158384A1 (ja) 2022-07-28
TW202239867A (zh) 2022-10-16

Similar Documents

Publication Publication Date Title
BR112023005462A2 (ja)
BR112023012656A2 (ja)
BR112021014123A2 (ja)
BR112022024743A2 (ja)
BR102021018859A2 (ja)
BR102021015500A2 (ja)
BR112022009896A2 (ja)
BR112023011738A2 (ja)
JPWO2022209609A1 (ja)
BR112023016292A2 (ja)
JPWO2022158385A1 (ja)
JPWO2022158384A1 (ja)
BR112023004146A2 (ja)
BR112023011610A2 (ja)
BR112023011539A2 (ja)
BR112023008976A2 (ja)
BR112023009656A2 (ja)
BR112023006729A2 (ja)
BR102021020147A2 (ja)
BR102021018926A2 (ja)
BR102021018167A2 (ja)
BR102021017576A2 (ja)
BR102021016837A2 (ja)
BR102021016551A2 (ja)
BR102021016375A2 (ja)

Legal Events

Date Code Title Description
A711 Notification of change in applicant

Free format text: JAPANESE INTERMEDIATE CODE: A712

Effective date: 20230414