TW202228241A - Non-cassette wafer rotating mechanism capable of solving contamination problem of transmission mechanism - Google Patents

Abstract

A non-cassette wafer rotating mechanism comprises: an etching tank, a rotary column, an impeller member, and a pump, wherein the rotary column is provided with a plurality of rotary column carrying grooves arranged in parallel along the axial direction. The impeller member is disposed at one end of the rotary column; the pump has an liquid inlet and a liquid outlet, wherein the liquid inlet is communicated with an input port of the etching tank, and the input port is adjacent to the impeller member, so that the impeller member is pushed for rotating by the chemical liquid driven by the pump. The non-cassette wafer rotating mechanism of the present invention may solve the contamination problem of transmission mechanism.

Description

Boatless wafer rotation mechanism

The present invention relates to a wet etching machine, more particularly to a boatless wafer rotating mechanism.

The etching process in the semiconductor field can be divided into dry etching and wet etching. Among them, wet etching has good etching selectivity and is widely used in the fields of oxide cleaning, residue removal, and surface layer peeling of wafers. During the etching process, 25 or 50 wafers are usually immersed in an etching solution (such as hydrofluoric acid) in an etching tank. Considering the uniformity of etching, the wet etching machine will stir the etching solution as much as possible and rotate the wafer.

However, the traditional mechanical transmission is prone to generate particles, which in turn contaminate the chemical liquid and the wafer. If magnetic transmission is used, it is easily affected by temperature and becomes unstable, and the thickness of the etched tank body will also limit the magnetic transmission.

Therefore, in order to solve various problems of the conventional wet etching machine, the present invention provides a boatless wafer rotating mechanism.

In order to achieve the above purpose and other purposes, the present invention provides a boatless wafer rotating mechanism, which includes: an etching groove; a column carrying groove; at least one impeller member disposed at one end of the spin column; and a pump having a liquid inlet and a liquid outlet, wherein the liquid outlet communicates with an input port of the etching tank, the input port is adjacent to the In the impeller member, the impeller member and the spin column are pushed and rotated by the liquid medicine driven by the pump.

In an embodiment of the present invention, the peripheral edge of the bottom of the spin column bearing groove is not equidistant from the rotation center of the spin column to form at least one thrust angle.

In one embodiment of the present invention, the cross section of the spin column bearing groove along the radial direction of the spin column has a plurality of circular arc segments and a plurality of straight segments, and the circular arc segments and the straight segments are staggered. set to form the push angle.

In an embodiment of the present invention, the cross section of the spin column bearing groove along the radial direction of the spin column has four arc segments and four straight segments.

In an embodiment of the present invention, the number of the impeller components is two, which are respectively disposed at opposite ends of the spin column.

In an embodiment of the present invention, the etching tank has two input ports, which are respectively disposed adjacent to the impeller members.

In an embodiment of the present invention, the etching tank further has a return port, which is communicated with the liquid inlet.

In one embodiment of the present invention, at least two supporting columns are further included, the supporting columns are disposed parallel to both sides of the spin column, and the supporting columns respectively have a plurality of spin column bearing grooves arranged in parallel along the axial direction.

In an embodiment of the present invention, it further includes a carrier body, the spin column and the impeller member are disposed in the carrier rack body, and the carrier rack body is disposed in the etching groove.

Thereby, the boatless wafer rotating mechanism of the present invention uses the chemical used in the etching itself to push the impeller member, so that the wafer evenly contacts the chemical, and will not be caused by uneven concentration of the chemical in the etching tank. or other speed factors, resulting in deviations in the etch rate everywhere within a single wafer. Therefore, the etching uniformity of the wafer can be improved. The way that the liquid medicine pushes the impeller components does not produce particle pollution, and the stability is not affected by the temperature and the thickness of the tank body.

In order to fully understand the present invention, the present invention is described in detail by the following specific embodiments and the accompanying drawings. Those skilled in the art can understand the objects, features and effects of the present invention from the contents disclosed in this specification. It should be noted that the present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the spirit of the present invention. The following embodiments will further describe the related technical content of the present invention in detail, but the disclosed content is not intended to limit the scope of the patent application of the present invention. The description is as follows:

As shown in FIG. 1 , a boatless wafer rotating mechanism 100 according to an embodiment of the present invention includes an etching tank 1 , a spin column 2 , at least one impeller member 3 and a pump 4 . Boatless means that there is no need to rely on a boat to load wafers.

The etching tank 1 is a tank body with an opening above. The etching liquid can be injected into the tank, and the wafer P or other substrates to be etched are placed.

The spin column 2 is disposed in the etching groove 1 . As shown in FIG. 2 , the spin column 2 has a plurality of spin column bearing grooves 21 arranged in parallel along the axial direction. The wafers P can be placed in parallel in these spin column bearing grooves 21 and soaked in the etching groove 1 with a certain distance. Due to the plurality of spin columns supporting the grooves 21 of the spin column 2 , the wafer P does not need to be placed in a cassette, but can be directly placed in the etching groove 1 .

At least one impeller member 3 is arranged at one end of the spin column 2 . In this embodiment, there are two impeller members 3 , which are respectively disposed at opposite ends of the spin column 2 .

As shown in FIG. 1 , the pump 4 is outside the etching tank 1 . The pump 4 includes a pump housing 41 having a liquid inlet 411 and a liquid outlet 412 .

The fluid (including the etching liquid) enters the pump housing 41 from the liquid inlet 411 , and the pump 4 provides power to push the fluid to flow out from the liquid outlet 412 , which is connected to an input port 11 of the etching tank 1 . The input port 11 is adjacent to the impeller member 3 , so that the impeller member 3 is pushed and rotated by the liquid medicine driven by the pump 4 . The rotation of the impeller member 3 drives the spin column 2 to rotate, so the wafer P in the etching tank 1 rotates along with the spin column 2 in the tank, so as to contact the chemical liquid evenly, and will not be affected by the chemical liquid in the etching tank 1. Due to uneven concentration, precipitation or other factors, the etching rate varies from place to place in a single wafer P. Therefore, the etching uniformity of the wafer P can be improved.

To sum up, the boatless wafer rotating mechanism 100 of the present invention utilizes the used etching liquid to push the impeller member 3 , so that the transmission process does not cause particle pollution and also helps the wafer P to be etched uniformly.

FIG. 3A is a schematic cross-sectional view along the line A-A of FIG. 2 . Further, as shown in FIG. 2 and FIG. 3A , in the present embodiment, the peripheral edge of the bottom of the spin column bearing groove 21 is not equidistant from the rotation center C of the spin column 2 to form at least one push angle 211 . In other words, the peripheral edge of the bottom of the spin column carrying groove 21 has a cam-like structure. During the rotation of the spin column 2, the wafer P alternately contacts the periphery of the bottom of the spin column bearing groove 21, and the push angle 211 can push the wafer P up and down again, so that the wafer P can move back and forth along the Z-axis direction. , and increase the flow of chemical liquid near the bottom of the wafer (ie, the position in contact with the spin column carrying groove 21 ).

Further, as shown in FIG. 3A , in this embodiment, the cross section of the spin column bearing groove 21 along the radial direction of the spin column 2 has a plurality of arc segments 22 and a plurality of straight segments 23 . These arc segments 22 and the straight sections 23 are alternately arranged to form a push angle 211 .

Further, as shown in FIG. 3A , in this embodiment, the cross section of the spin column bearing groove 21 along the radial direction of the spin column 2 has four arc segments 22 and four straight segments 23 . The arc segment 22 and the straight segment 23 form a quadruple symmetry, and have eight thrust angles 211 . However, the present invention is not limited thereto, and the number and arrangement of the circular arc segments 22 and the straight segments 23 can be changed to other numbers and forms.

Further, as shown in FIG. 3B , in this embodiment, the cross section of the spin column bearing groove 21 along the radial direction of the spin column 2 is octagonal, and has eight thrust angles 211 . However, the present invention is not limited thereto, and the cross-section of the spin column bearing groove 21 along the radial direction of the spin column 2 may be any other number of polygons.

Further, as shown in FIG. 1 , in this embodiment, the etching tank 1 has two input ports 11 , which are respectively disposed adjacent to the two impeller members 3 . The fluid medicine output from the liquid outlet 412 enters the tank body from both ends of the etching tank 1 respectively, so that the impeller members 3 at both ends of the spin column 2 are driven to balance the force.

Further, in this embodiment, the etching tank 1 further has a return port 12 connected to the liquid inlet 411 . The return port 12 can return the etching chemical liquid to the liquid inlet 411 to form a circulation loop. However, the present invention is not limited to this, and the return port 12 can also directly discharge the etching chemical solution, while the liquid inlet 411 is filled with fresh etching chemical solution.

Further, in this embodiment, the boatless wafer rotating mechanism 100 further includes at least two support columns 5 , and these support columns 5 are arranged parallel to both sides of the spin column 2 and are slightly higher than the spin column 2 in the Z-axis direction. , to support both sides of the wafer P. The support column 5 can also have a plurality of parallel-arranged spin column bearing grooves for placing the wafer P. As shown in FIG.

Further, in this embodiment, the boatless wafer rotating mechanism 100 further includes a carrier body 6 , and the spin column 2 , the support columns 5 and the impeller members 3 are disposed on the carrier body 6 . The frame body 6 is arranged in the etching groove 1 . Thereby, the spin column 2 , the support columns 5 and the impeller members 3 can be suspended in the etching groove 1 by the carrier frame 6 .

The present invention has been disclosed by embodiments above, but those skilled in the art should understand that the embodiments are only used to describe the present invention, and should not be construed as limiting the scope of the present invention. It should be noted that all changes and substitutions equivalent to this embodiment should be considered to be included within the scope of the present invention. Therefore, the protection scope of the present invention should be defined by the scope of the patent application.

100: Waferless wafer rotation mechanism 1: Etching groove 11: Input port 12: Return port 2: Spin column 21: Spin column bearing groove 211: Push angle 22: Arc segment 23: Straight section 3: Impeller components 4: Pump 41: Pump housing 411: Liquid inlet 412: Liquid outlet 5: Support column 6: Bearing frame C: center of rotation P: Wafer

FIG. 1 is a schematic perspective view of a boatless wafer rotating mechanism according to an embodiment of the present invention. FIG. 2 is a three-dimensional schematic diagram of a spin column according to an embodiment of the present invention. FIG. 3A is a schematic cross-sectional view along the line A-A of FIG. 2 . FIG. 3B is a schematic diagram of another aspect of FIG. 3A .

100: Waferless wafer rotation mechanism

1: Etching groove

11: Input port

12: Return port

2: Spin column

3: Impeller components

4: Pump

41: Pump housing

411: Liquid inlet

412: Liquid outlet

5: Support column

6: Bearing frame

P: Wafer

Claims (9)

A boatless wafer rotating mechanism, comprising: an etching groove; a spin column disposed in the etching groove, the spin column has a plurality of spin column bearing grooves arranged in parallel along the axial direction; at least one impeller member disposed at one end of the spin column; and a pump having a liquid inlet and a liquid outlet, Wherein, the liquid outlet is connected to an input port of the etching tank, and the input port is adjacent to the impeller member, and the impeller member and the spin column are pushed and rotated by the liquid medicine driven by the pump. The boatless wafer rotating mechanism as claimed in claim 1, wherein the peripheral edge of the bottom of the spin column bearing groove is not equidistant from the rotation center of the spin column to form at least one push angle. The boatless wafer rotating mechanism as claimed in claim 2, wherein the cross section of the spin column bearing groove along the radial direction of the spin column has a plurality of arc segments and a plurality of straight segments, the arc segments and The straight sections are staggered to form the push angle. The boatless wafer rotating mechanism according to claim 3, wherein the cross section of the spin column bearing groove along the radial direction of the spin column has four arc segments and four straight segments. The boatless wafer rotating mechanism as claimed in claim 1, wherein the number of the impeller members is two, which are respectively disposed at two opposite ends of the spin column. The boatless wafer rotating mechanism of claim 5, wherein the etching tank has two input ports, which are respectively disposed adjacent to the impeller members. The boatless wafer rotating mechanism according to claim 1, wherein the etching tank further has a return port, which is communicated with the liquid inlet. The boatless wafer rotating mechanism as claimed in claim 1, further comprising at least two support columns, the support columns are arranged on both sides of the spin column in parallel, and the support columns respectively have a plurality of spin columns arranged in parallel along the axial direction The column carries the groove. The boatless wafer rotating mechanism as claimed in claim 1 further comprises a carrier body, the spin column and the impeller member are arranged on the carrier body, and the carrier body is arranged in the etching groove.

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