TW202220950A - 感放射線性樹脂組成物及抗蝕劑圖案的形成方法 - Google Patents
感放射線性樹脂組成物及抗蝕劑圖案的形成方法 Download PDFInfo
- Publication number
- TW202220950A TW202220950A TW110138985A TW110138985A TW202220950A TW 202220950 A TW202220950 A TW 202220950A TW 110138985 A TW110138985 A TW 110138985A TW 110138985 A TW110138985 A TW 110138985A TW 202220950 A TW202220950 A TW 202220950A
- Authority
- TW
- Taiwan
- Prior art keywords
- group
- carbon atoms
- hydrocarbon group
- monovalent
- radiation
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Materials For Photolithography (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020-196137 | 2020-11-26 | ||
| JP2020196137 | 2020-11-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW202220950A true TW202220950A (zh) | 2022-06-01 |
Family
ID=81754400
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW110138985A TW202220950A (zh) | 2020-11-26 | 2021-10-21 | 感放射線性樹脂組成物及抗蝕劑圖案的形成方法 |
Country Status (3)
| Country | Link |
|---|---|
| JP (2) | JPWO2022113663A1 (https=) |
| TW (1) | TW202220950A (https=) |
| WO (1) | WO2022113663A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW202346263A (zh) * | 2022-05-23 | 2023-12-01 | 日商Jsr 股份有限公司 | 感放射線性樹脂組成物及圖案形成方法 |
| TW202346264A (zh) * | 2022-05-23 | 2023-12-01 | 日商Jsr股份有限公司 | 感放射線性樹脂組成物及圖案形成方法 |
| CN119768738A (zh) * | 2022-11-30 | 2025-04-04 | Jsr株式会社 | 感放射线性树脂组合物、图案形成方法及感放射线性酸产生剂 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5750272B2 (ja) * | 2010-02-18 | 2015-07-15 | 東京応化工業株式会社 | レジストパターン形成方法 |
| JP5793331B2 (ja) * | 2011-04-05 | 2015-10-14 | 東京応化工業株式会社 | レジスト組成物及びレジストパターン形成方法 |
-
2021
- 2021-10-21 TW TW110138985A patent/TW202220950A/zh unknown
- 2021-11-02 WO PCT/JP2021/040335 patent/WO2022113663A1/ja not_active Ceased
- 2021-11-02 JP JP2022565165A patent/JPWO2022113663A1/ja active Pending
-
2026
- 2026-01-19 JP JP2026006565A patent/JP2026065160A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2022113663A1 (https=) | 2022-06-02 |
| WO2022113663A1 (ja) | 2022-06-02 |
| JP2026065160A (ja) | 2026-04-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP7605266B2 (ja) | 感放射線性樹脂組成物及びレジストパターンの形成方法 | |
| US12517429B2 (en) | Radiation-sensitive resin composition and method for forming pattern | |
| TW202222780A (zh) | 感放射線性樹脂組成物、圖案形成方法及鎓鹽化合物 | |
| JP7622654B2 (ja) | 感放射線性樹脂組成物及びレジストパターンの形成方法 | |
| JP2017181697A (ja) | 感放射線性樹脂組成物及びレジストパターン形成方法 | |
| TW202126609A (zh) | 感放射線性樹脂組成物及圖案形成方法 | |
| TW202140420A (zh) | 感放射線性樹脂組成物及使用其的抗蝕劑圖案的形成方法、基板的加工方法、金屬膜圖案的製造方法、以及磺酸鹽化合物及包含其的感放射線性酸產生劑 | |
| JP2026065160A (ja) | 化合物及び感放射線性酸発生剤 | |
| TW202437008A (zh) | 感放射線性組成物、圖案形成方法及感放射線性酸產生劑 | |
| TW202346264A (zh) | 感放射線性樹脂組成物及圖案形成方法 | |
| TW202233570A (zh) | 感放射線性樹脂組成物及圖案形成方法 | |
| JP7323865B2 (ja) | 感放射線性樹脂組成物及びパターン形成方法 | |
| TW202525965A (zh) | 感放射線性組成物、圖案形成方法及感放射線性酸產生劑 | |
| TW202515846A (zh) | 感放射線性組成物、圖案形成方法及化合物 | |
| US20240393687A1 (en) | Radiation-sensitive resin composition and pattern formation method | |
| TWI869618B (zh) | 感放射線性樹脂組成物、圖案形成方法及鎓鹽化合物 | |
| TW202513528A (zh) | 感放射線性組成物、圖案形成方法及鎓鹽 | |
| TW202449515A (zh) | 感放射線性組成物、圖案形成方法及鎓鹽化合物 | |
| TW202449514A (zh) | 感放射線性組成物、圖案形成方法及鎓鹽化合物 | |
| TW202146390A (zh) | 感放射線性樹脂組成物、圖案形成方法及鎓鹽化合物 | |
| TW202346261A (zh) | 感放射線性樹脂組成物及圖案形成方法 | |
| TW202346263A (zh) | 感放射線性樹脂組成物及圖案形成方法 | |
| TWI887523B (zh) | 感放射線性樹脂組成物、抗蝕劑圖案的形成方法、聚合物及化合物 | |
| TW202229368A (zh) | 感放射線性樹脂組成物、抗蝕劑圖案的形成方法及撥水性改善劑 | |
| TW202231626A (zh) | 感放射線性樹脂組成物及使用其的抗蝕劑圖案的形成方法、以及鋶鹽化合物及包含鋶鹽化合物的感放射線性酸產生劑 |