TW202215196A - Heat dissipating device - Google Patents

Abstract

A heat dissipating device is provided to solve the problem of conventional ceiling fan control device with poor heat dissipating and the limitation of assembly spaces. This heat dissipating device includes an outer case, a main board, a substrate and a heat dissipating fin. The outer case has the first lid and the second lid, the first lid is detachably attached to the second lid, and the bottom of the first lid has an engaging groove. The outer case is accommodating the main board. The main board has an engaging portion. The substrate has an engaging portion on the edge of substrate. The engaging portion is vertically and detachably attached to the engaging portion of main board. The surface of substrate has wires to electrically connect at least one heating element. The heat dissipating fin is disposed in the engaging groove of the first lid.

Description

heat sink

The present invention relates to a heat dissipation device, in particular to a heat dissipation device for a ceiling fan control device to improve heat dissipation efficiency and save assembly space.

With the technological development of electronic technology, it is the future trend to miniaturize electronic components and at the same time improve the operation speed and effect of electronic components, and electronic products are used in a wide range of fields. Among them, ceiling fans are one of the most common applications in daily life. When the ceiling fan is running, because the ceiling fan controller is often placed in a closed box, the electronic components in the ceiling fan controller are prone to accumulate excessive heat energy per unit area, resulting in more serious heat dissipation problems, and further causing electronic components. The performance of the operation becomes poor, and even the whole device is burned down. At present, in order to make the electronic components operate normally, the heat sinks used in the ceiling fan controllers are mainly attached to the electronic components on the circuit board or the motherboard, and then the heat sinks are used to discharge the heat energy.

However, if the conventional heat dissipation device is assembled in an electronic control device with a large number of electronic components or a relatively complex electronic control device, the heat dissipation effect may be limited in a limited installation space, resulting in poor heat dissipation effect or even damage.

In view of this, it is still necessary to improve the conventional heat dissipation device.

In order to solve the above problems, the purpose of the present invention is to provide a heat dissipation device, which can improve the heat dissipation effect.

Another object of the present invention is to provide a heat dissipation device that can save installation space.

The directional or similar terms used throughout this disclosure, such as "front", "back", "left", "right", "top (top)", "bottom (bottom)", "inside", "outside" , "side surface", etc., mainly refer to the directions of the attached drawings, each directionality or its similar terms are only used to assist the description and understanding of the various embodiments of the present invention, and are not intended to limit the present invention.

The use of the quantifier "a" or "an" for the elements and components described throughout the present invention is only for convenience and provides a general meaning of the scope of the present invention; in the present invention, it should be construed as including one or at least one, and a single The concept of also includes the plural case unless it is obvious that it means otherwise.

Similar terms such as "combined", "combined" or "assembled" mentioned in the whole text of the present invention mainly include the components that can be separated without destroying the components after the connection, or the components can not be separated after being connected, which are common knowledge in the field. It can be selected according to the material of the components to be connected or the assembly requirements.

The heat dissipation device of the present invention may include: a casing having a first casing and a second casing, the first casing and the second casing are detachably assembled, and the bottom of the first casing has a a groove; a main board, which is accommodated in the casing, the main board has a joint part; a main board has an engaging part from the peripheral surface, the clip part is vertically combined with the joint part of the main board, the board A surface of the fuselage is provided with circuits to electrically connect at least one heating element; and a heat dissipation fin is arranged in the groove of the first casing.

Accordingly, in the heat dissipation device of the present invention, heating elements such as heating transistors are arranged on a surface of the substrate, and the substrate is vertically engaged with the motherboard, so that the space occupied by the substrate can be reduced. , and the end face of the engaging portion of the substrate can abut the heat dissipation fins of the casing to directly conduct heat energy to the heat dissipation fins, which can improve the heat dissipation area. In addition, the other surface of the substrate can also be provided with the first Two heat dissipation fins, so that the second heat dissipation fin can also absorb the heat energy generated by the heating element, so as to dissipate a large amount of heat energy. In this way, the overall heat dissipation efficiency can be improved, and the installation space of the motherboard can be increased, which has the advantages of improving the efficiency of heat dissipation. Heat dissipation and the effect of increasing the use of space.

Wherein, the groove of the first casing may have a slot hole, the engaging portion of the substrate passes through the slot hole, and the end surface of the engaging portion abuts on the surface of the heat dissipation fin. In this way, the heat energy of the heating element can be directly transmitted to the heat dissipation fin, which has the effect of improving the heat dissipation area and the heat conductivity.

Wherein, the substrate is made of aluminum metal material. In this way, the substrate can achieve high thermal conductivity, which has the effect of improving thermal conductivity.

Wherein, the substrate and the main board are combined by soldering. In this way, the substrate and the main board can be firmly combined and electrically connected, which has the effect of improving structural stability and circuit conduction.

Wherein, several circuit patterns can be arranged on the engaging portion of the substrate, so that the heating element of the substrate is electrically connected to the main board. In this way, the heating element of the base plate and the main board can be easily electrically connected, which has the effect of improving the conduction of the circuit.

Wherein, there may be a thermally conductive insulating layer between the contact surfaces of the substrate and the main board, so as to cover the circuit to form electrical insulation. In this way, electrical insulation and thermal conductivity can be formed at the same time, and the heat dissipation effect of the heating element can also be improved, which has the effects of avoiding short circuit and improving heat conduction.

Wherein, the thermally conductive insulating layer is made of aluminum oxide, silicon carbide or boron nitride material. In this way, the substrate and the main board can form electrical insulation and have good thermal conductivity, which has the effect of avoiding short circuit and improving thermal conductivity.

Wherein, the size of the heat dissipation fin can be close to the size of the motherboard. In this way, the heat energy of the motherboard can be largely dispersed and the heat dissipation area can be increased, which has the effect of improving the heat dissipation efficiency and dispersing the heat energy.

Wherein, the heat dissipation fins are made of copper, aluminum, nickel or alloy metal materials. In this way, it can have high thermal conductivity, so as to achieve better heat dissipation effect, which has the effect of improving heat dissipation.

Wherein, the heat dissipation device may further have a second heat dissipation fin, and the second heat dissipation fin is combined with the other surface of the substrate. In this way, the heat source generated by the heating element of the substrate can be directly conducted to the second heat dissipation fin to dissipate the heat energy, which has the effect of improving heat dissipation and uniform heat dissipation.

In order to make the above-mentioned and other objects, features and advantages of the present invention more obvious and easy to understand, the preferred embodiments of the present invention are exemplified below, and are described in detail as follows in conjunction with the accompanying drawings:

Please refer to FIG. 1, which is the first embodiment of the present invention, which includes a casing 1, a main board 2, a base plate 3 and a heat dissipation fin 4, the main board 2 is accommodated in the casing 1, the base plate 3 is combined with the motherboard 2 , and the heat dissipation fins 4 are connected to the surface of the casing 1 .

The casing 1 has a first casing 1a and a second casing 1b, and the first casing 1a and the second casing 1b are detachably assembled. In this embodiment, the first casing 1a can be a base and made of metal material, and the second casing 1b can be an upper cover matching the first casing 1a. The bottom of the first casing 1a may have a groove 11 , and the groove 11 has a slot 12 . The casing 1 may have several heat dissipation holes 13 , which can dissipate the heat energy in the casing 1 and have the function of assisting heat dissipation.

The main board 2 is a printed circuit board for arranging several electronic components 21 . The main board 2 is connected to the lower casing 11, and the connection method can be locking or clamping, which is not limited in the present invention. The main board 2 may have a joint portion 22 so that the board 3 can be combined with the main board 2 .

The substrate 3 can be made of a thermally conductive material, and the substrate 3 is preferably made of aluminum metal, which has the characteristics of low thermal resistance. The base plate 3 can be in the shape of an elongated plate to be combined in the space of the main board 2 , and the number or shape of the base plate 3 is not limited in the present invention. The peripheral surface of the base plate 3 has a protruding engaging portion 31 , so that the engaging portion 31 can be connected to the connecting portion 22 of the main board 2 upright. A surface of the substrate 3 has lines that can be electrically connected to at least one heating element 32 , and the heat source of the heating element 32 can be conducted to the substrate 3 . The heating element 32 may be an active element (such as a transistor) or a control element, the heating element 32 refers to an electronic element that generates heat in an electronic device, and the number of the heating element 32 is not limited in the present invention. In this embodiment, the substrate 3 is connected to six heating elements 32 , and the heating elements 32 are connected to the substrate 3 through a surface adhesive method.

Referring to FIG. 2 , after the engaging portion 31 of the substrate 3 is coupled to the coupling portion 22 of the motherboard 2 , a solder portion P can be used to bond the substrate 3 and the motherboard 2 together. In this embodiment, the engaging portion 31 of the substrate 3 is provided with several circuit patterns. Through the bonding between the substrate 3 and the mainboard 2, the heating element 32 of the substrate 3 can be electrically connected to the mainboard 2. In order to avoid circuit short circuit caused by the contact between the substrate 3 and the main board 2 , a thermally conductive insulating layer 33 is preferably provided between the contact surfaces of the substrate 3 and the main board 2 to cover the circuit formation on the substrate 3 . Electrical insulation. The thermally conductive insulating layer 33 can be made of aluminum oxide, silicon carbide, or boron nitride, etc., which have insulating properties and high thermal conductivity, and can improve the heat dissipation effect of the heating element 32 .

Referring to FIGS. 1 and 2 , the heat dissipation fins 4 are disposed in the grooves 11 of the first casing 1 a to dissipate heat in the casing 1 . The heat dissipation fins 4 can be clamped, fitted or bonded to be disposed in the grooves 11 , which is not limited in the present invention. The heat dissipation fins 4 can be made of metal materials such as copper, aluminum, nickel or alloy, which have high thermal conductivity and can achieve better heat dissipation. The present invention does not limit the material and size of the heat dissipation fins 4 . In this embodiment, the size of the heat dissipation fins 4 is slightly close to that of the main board 2 , and has a rectangular plate-shaped structure, which can evenly disperse heat energy and increase the heat dissipation area. In addition, after the engaging portion 31 of the base plate 3 is combined with the engaging portion 22 of the motherboard 2 , the engaging portion 31 can preferably pass through the slot 12 in the groove 11 , so that the end surface of the engaging portion 31 can contact with the surface of the heat dissipation fin 4 (as shown in FIG. 2 ). In this way, the heat energy of the substrate 3 can be directly conducted to the heat dissipation fins 4, which has the effect of improving the heat conduction speed and the heat dissipation efficiency.

The heat dissipation device of this embodiment can be applied to a ceiling fan control device. First, the heating element 32 is disposed on the base plate 3. Since the base plate 3 is vertically engaged with the main board 2, the base plate 3 can be prevented from occupying the base plate 3. The space of the main board 2 can further increase the space for the main board 2 to arrange the electronic components 21, and the heat energy generated by the heating element 32 during operation can be directly transferred to the heat dissipation fins 4. In addition, the heat energy of the main board 2 can be Absorbed by the casing 1, and then conducts heat energy to the heat dissipation fins 4, and dissipates the waste heat to the heat dissipation fins 4 through the heat dissipation holes 13 of the casing 1. The size of the heat dissipation fins 4 is preferably similar to the motherboard. 2 is a rectangular plate shape, so that the overall heat dissipation area can be increased to dissipate heat evenly, thereby reducing the accumulation of waste heat on the motherboard 2 , which can prevent the entire device from burning out and prolong the service life of the heating element 32 .

Please refer to FIG. 3, which is a second embodiment of the heat dissipation device of the present invention. Compared with the first embodiment, in this embodiment, the heat dissipation device may further have a second heat dissipation fin 4'. The second heat dissipation fins 4 ′ can be disposed on the other surface of the substrate 3 . The second heat dissipation fins 4 ′ can be made of metal materials such as copper, aluminum, nickel, or alloys, and have high thermal conductivity properties, which can reduce thermal resistance to a minimum, so that the heat source generated by the heating element 32 of the substrate 3 can be directly Conducted to the second heat dissipation fin 4', the present invention does not limit the material and size of the second heat dissipation fin 4'. In this embodiment, the size of the second heat dissipation fin 4' is preferably slightly close to the size of the substrate 3, so as to effectively dissipate heat energy. In this way, the second heat dissipation fins 4' can increase the heat dissipation area of the substrate 3 to dissipate heat energy, which has the effect of improving heat dissipation.

To sum up, in the heat dissipation device of the present invention, heating elements such as heating transistors are arranged on a surface of the substrate, and the substrate is vertically clamped to the main board, so that the occupation of the main board by the substrate can be reduced. space, and the end face of the engaging portion of the substrate can abut the heat dissipation fins of the casing to directly conduct heat energy to the heat dissipation fins, which can improve the heat dissipation area. In addition, the other surface of the substrate can also be provided with The second heat dissipation fin enables the second heat dissipation fin to absorb the heat energy generated by the heating element to dissipate a large amount of heat energy. In this way, the overall heat dissipation efficiency can be improved, and the installation space of the motherboard can be increased. It has the effect of improving heat dissipation and increasing the use of space.

Although the present invention has been disclosed by the above-mentioned preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make various changes and modifications relative to the above-mentioned embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the patent application attached hereto.

1: Shell 1a: first shell 1b: Second shell 11: Groove 12: Slotted hole 13: cooling holes 2: Motherboard 21: Electronic Components 22: Joint 3: Substrate 31: Engagement part 32: heating element 33: Thermal insulation layer 4: cooling fins 4': Second cooling fin P: Solder part

[FIG. 1] An exploded perspective view of the first embodiment of the present invention. [FIG. 2] A combined cross-sectional view of the first embodiment of the present invention. [FIG. 3] A partially exploded perspective view of the second embodiment of the present invention.

1: Shell

1a: first shell

1b: Second shell

11: Groove

12: Slotted hole

13: cooling holes

2: Motherboard

21: Electronic Components

22: Joint

3: Substrate

31: Engagement part

32: heating element

4: cooling fins

Claims (10)

A heat sink, comprising: a shell, which has a first shell and a second shell, the first shell and the second shell are detachably assembled, and the bottom of the first shell has a groove; a mainboard, accommodated in the casing, the mainboard has a joint; a base plate, the circumferential surface of which has an engaging portion, the engaging portion is vertically connected to the connecting portion of the main board, and a surface of the base plate has a circuit for electrically connecting at least one heating element; and A heat dissipation fin is arranged in the groove of the first casing. The heat dissipation device of claim 1, wherein the groove of the first casing has a slot hole, the engaging portion of the substrate passes through the slot hole, and the end surface of the engaging portion abuts on the surface of the heat dissipation fin . The heat dissipation device of claim 1, wherein the substrate is made of aluminum metal. The heat dissipation device of claim 1, wherein the substrate and the motherboard are combined by soldering. The heat dissipation device of claim 1, wherein a plurality of circuit patterns are arranged on the engaging portion of the substrate, so that the heating element of the substrate is electrically connected to the main board. The heat dissipation device of claim 1, wherein a thermally conductive insulating layer is provided between the contact surfaces of the substrate and the main board, so as to cover the circuit to form electrical insulation. The heat dissipation device of claim 6, wherein the thermally conductive insulating layer is made of aluminum dioxide, silicon carbide or boron nitride. The heat dissipation device of claim 1, wherein the size of the heat dissipation fin is close to the size of the motherboard. The heat dissipation device of claim 1, wherein the heat dissipation fins are made of copper, aluminum, nickel or alloy metal materials. The heat dissipation device of claim 1, wherein the heat dissipation device further has a second heat dissipation fin, and the second heat dissipation fin is combined with the other surface of the substrate.

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