TW202213823A - 色彩轉換固態裝置 - Google Patents
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Abstract
本揭示案係關於藉由整合功能調諧材料來建立不同的功能微裝置且係關於建立封囊以保護此等材料。本揭示案亦係關於一種固態裝置及一種用以將一發光裝置之一色彩轉換成另一色彩的方法。
Description
本發明係關於色彩轉換層至顯示基板中之整合。更特定而言,本發明係關於提供封囊以保護色彩轉換層免受環境因素影響。
可藉由將不同微裝置整合至系統基板中來增強系統效能。挑戰為不同微裝置可具有不同效能且亦使用不同材料系統。此等材料系統通常對環境因素(例如,氧氣或水)敏感。因此,期望提供對此等材料之保護以增強系統效能。
根據一個實施例,本發明係關於一種經啟用以將發光裝置之色彩轉換成另一色彩的固態裝置,該裝置包括以下各者:背板;發光裝置,其在背板之頂部上;光分佈層,其在發光裝置之頂部上;及色彩轉換層,其在光分佈層之頂部上。
根據另一實施例,給出一種用以將發光裝置之色彩轉換成另一色彩的方法,該方法包含:形成背板;在背板之頂部上形成發光裝置;在發光裝置之頂部上形成光分佈層;在光分佈層之頂部上形成色彩轉換層;及將發光裝置之色彩轉換成不同於發光裝置之原始色彩的另一色彩。
一種用以改善系統效能之方法為將不同微裝置整合至系統基板中。挑戰為不同微裝置可具有不同效能且亦使用不同材料系統。本發明係關於藉由整合功能調諧材料(例如,色彩轉換層)來建立不同功能微裝置(例如,紅色、綠色、藍色LED或來自單個藍色LED之感測器)。功能調諧材料通常對環境因素(例如,氧氣或水)敏感。
本發明之另一態樣為建立封囊以保護此等材料。
在本揭示案中,使用微型LED及色彩轉換層描述結構。然而,類似結構可與其他微裝置及其他功能調諧材料一起使用。
用於實施例中之光源的形狀係出於說明之目的,且裝置可具有不同形狀。光源裝置可在將接觸接收器基板之一側上具有一個或多個襯墊。襯墊可為機械襯墊、電襯墊或兩者之組合。一個或多個襯墊可連接至共同電極或列/行電極。電極可為透明或不透明的。光源可具有不同層。光源可由不同材料製成,諸如有機材料、無機材料或其組合。
參看圖1,製造像素電路之方法包含:步驟102,例如根據系統基板圖案在供體基板上製作微裝置之至少一個群組;步驟104,例如用色彩轉換層及/或彩色濾光片覆蓋微裝置之光輸出(輸入)表面;及步驟106,例如將群組中之微裝置中之至少一者轉移至系統基板。
參看圖2,製造像素電路之方法包含:步驟202,例如根據系統基板圖案在供體基板上製作微裝置之至少一個群組;步驟204,例如用不透明或反射材料(例如,光衰減器)覆蓋或阻擋自微裝置之不期望的光路徑;步驟206,例如用色彩轉換層及/或彩色濾光片覆蓋微裝置之光輸出(輸入)表面;及步驟208,例如將群組中之微裝置中之至少一者轉移至系統基板。
參看圖3,製造像素電路之方法包含:步驟302,例如根據系統基板圖案在供體基板上製作微裝置之至少一個群組;步驟304,例如用不透明或反射材料(例如,光衰減器)覆蓋或阻擋自微裝置之不期望的光路徑;步驟306,例如用色彩轉換層及/或彩色濾光片覆蓋微裝置之光輸出(輸入)表面;步驟308,在色彩轉換層之前及/或之後沈積層以用於封裝及/或熱耗散;及步驟310,例如將群組中之微裝置中之至少一者轉移至系統基板。
參看圖4,製造像素電路之方法包含:步驟402,例如根據系統基板圖案在供體基板上製作微裝置之至少一個群組;步驟404,例如用不透明或反射材料(例如,光衰減器)覆蓋或阻擋自微裝置之不期望的光路徑;步驟406,例如用色彩轉換層及/或彩色濾光片覆蓋微裝置之光輸出(輸入)表面,其中色彩轉換層可包括介電層以用於鈍化;步驟408,在色彩轉換層之前及/或之後沈積層以用於封裝及/或熱耗散;及步驟410,例如將群組中之微裝置中之至少一者轉移至系統基板。
參看圖5,製造像素電路之方法包含:步驟502,例如根據系統基板圖案在供體基板上製作微裝置之至少一個群組;步驟504,例如用不透明或反射材料(例如,光衰減器)覆蓋或阻擋自微裝置之不期望的光路徑;步驟506,例如用色彩轉換層及/或彩色濾光片覆蓋微裝置之光輸出(輸入)表面,其中色彩轉換層或光衰減器中之一者可包括充當微裝置之電極的導電層;步驟508,在色彩轉換層之前及/或之後沈積層以用於封裝及/或熱耗散;及步驟510,例如將群組中之微裝置中之至少一者轉移至系統基板。
參看圖6A至圖6C,說明轉移程序,其中供體基板602最初包括三個微裝置604。微裝置604中之每一者包括電極606,其可為透明的,但理想地包含提供光衰減器功能之不透明或反射材料。中間微裝置604包括,例如塗佈有用於將自微裝置604發射之光轉換成不同色彩的第一色彩轉換或濾光片層608。左方微裝置604包括,例如塗佈有用於將自微裝置604發射之光轉換成第三色彩的第二色彩轉換或濾光片層610。三個微裝置604一起可包含形成顯示裝置之像素所需的三種不同色彩,例如紅色、綠色及藍色。吾人可將備用微裝置添加至與系統基板中之像素相關的裝置之每一集合。在測試供體(盒)基板上之微裝置之後,吾人可重新映射用於每一微裝置之功能調諧材料以確保對於系統基板中之不同像素,存在可接受數目個微裝置。舉例而言,若被分配綠色轉換之裝置不起作用,則可將備用的紅色及綠色轉換分配至原始裝置及備用裝置中之兩個裝置。
在第一實施例中,三個微裝置604被轉移至盒基板(cartridge substrate),且具備安裝於微裝置604之相對末端上的第二電極616作為電極606。第二電極616可包括用於將來自微裝置604之任何光重導向回穿過任何光分佈材料、圍繞任何光衰減器結構且穿過任何色彩轉換層608或610的不透明或反射材料。微裝置604中之每一者接著安裝於接收器基板612上之襯墊614上(圖6B),其中第二電極616與襯墊614電接觸。
替代地,如圖6C中所說明,三個微裝置604可直接轉移至接收器基板612,其中電極606與襯墊614接觸。在此實施例中,接收器基板612及襯墊614對於自微裝置604發射之光及任何後續轉換可為透明的。
圖7A展示嵌入於功能調諧/更改/修改材料710中之微裝置700,作為實例,該等材料在本說明書之其餘部分中被稱作色彩轉換層。此處,複數個半導體層形成/轉移至基板中,以形成頂表面700-1及底表面700-2。複數個半導體層在形成微裝置(作為實例展示微裝置700)之不同區域中藉由至少一個側表面700-3(或700-4)隔離。此處,微裝置700可在裝置之至少一側(或僅一側)上具有至少一個接點(通孔) 702、704。接點702、704將裝置700連接至襯墊706、708。微裝置700可具有不同層之堆疊,諸如包夾於電荷阻擋層與摻雜層之間的作用層。圍繞微裝置700形成的空間係藉由光學耦合至至少一個側表面700-3(或700-4)之至少一個覆蓋層建立。圍繞裝置形成的空間/外殼結構由一個或多個蓋壁712、714、716及718組成。頂部及底部蓋壁(層)712、714延伸超出微裝置700之至少一個側表面700-3、700-4。功能調諧材料(例如,色彩轉換材料) 710在外殼結構內部。蓋壁712、714、716及718可為封裝層以保護色彩轉換材料免受氧氣及濕氣影響。色彩轉換材料可為磷光體或量子點。此外,蓋壁可包括具有一些光學性質之光學增強層以增強至色彩轉換材料中之光耦合。在一種狀況下,蓋壁712或716可為反射層以將光反射至色彩轉換材料中。在另一種狀況下,蓋壁712或716經設計以僅反射小波長(例如,小於450 nm),同時其允許較長波長穿過。此允許轉換後的光穿過壁。在另一種狀況下,壁714增強自微裝置700至色彩轉換材料710中之光提取。在一個實例中,壁718具有反射性以將光反射回。在另一種狀況下,壁718為透明的,從而允許至少一些波長穿過。
參看圖7B,蓋壁712或716可具有兩個部分:反射部分720及透明部分。反射層720在裝置700之頂側上延伸(或可延伸至底側)。在一種狀況下,透明部分亦可能僅對波長之一部分透明,以阻擋微裝置光不經過轉換而直接射出。
在圖7C中所展示之另一種狀況下,彩色濾光片層722可沈積於壁中之至少一者上以進一步防止一些波長離開結構/裝置700或自外部進入色彩轉換材料710中。
圖8A展示在頂側或底側上具有接點802、804之微裝置800。襯墊806可經由接點中例如頂側處之接點802的至少一者耦接至裝置800。在一種狀況下,可為電介質之層812覆蓋裝置表面之未由接點802覆蓋的部分。可存在可具有不同功能之側表面814,諸如鈍化層、光學增強層或封裝層。此處,緩衝層或犧牲層832處於微裝置800與基板830之間。
圖8B展示其中形成封裝壁812A及812B。封裝層812A可與側表面814相同。此等側表面814可藉由諸如印刷、蒸發、印刷、濺鍍或更多的不同手段沈積。側壁層可藉由傳統的光微影、剝離或印刷來圖案化。
圖8C展示其中色彩轉換材料形成於封裝壁812B之頂部上。色彩轉換層810可覆蓋裝置800之不面向基板830的側。
圖8D展示形成覆蓋壁816及818以將色彩轉換材料圍封於壁818、812及816之間。
在另一實施例中,如圖8E中所展示,該等壁可具有具不同功能之不同層的堆疊。在一種狀況下,該等壁可包括反射(例如,全部或選擇性)層812C及封裝層812B。
在另一實施例中,色彩轉換層可在微裝置800之頂表面或底表面上。在如圖8F中所展示之一個實例中,若在同一表面上存在接點,則接點804之高度將增加以延伸超出彼表面上之色彩轉換層。有可能添加壁820以覆蓋接點804之側面及微裝置800之該表面。
在圖9A中所展示之另一實施例中,表面中之一者上的接點904A可經由跡線904B連接至裝置800之相對側上的接點802區域。跡線可藉由介電層與裝置分離。跡線需要在一些區域處為透明的,以允許光穿過且與色彩轉換層耦接。在另一種狀況下,跡線僅覆蓋微裝置之側面的部分,使得光可穿過其他區域。為了更好的封裝,在跡線904B之後形成用於封裝之壁層812A及812B。
在另一實施例中,色彩轉換層可在微裝置800之頂表面或底表面上。在如圖9B中所展示之一個實例中,若在同一表面上存在接點,則接點904A藉由跡線904B被轉移至另一區域上之另一接點904C。此處,壁可覆蓋接點904A、跡線904B及用於光學或封裝功能之微裝置的表面。
在以上實施例中,頂表面及底表面上之蓋壁及側面上之蓋壁可彼此延伸以提供更好的保護。在另一種狀況下,用於側面上之蓋壁(層)可在底部或頂部蓋壁(層)上方延伸。
根據一個實施例,提供一種光電子裝置。該光電子裝置包含:複數個半導體層,其形成於基板上,從而形成頂表面及底表面,其中該複數個半導體層具有形成至少一個側表面之隔離區域;一個或多個覆蓋層,其圍繞光學耦合至至少一個側表面之隔離區域而形成空間;及功能調諧材料,其安置於由一個或多個覆蓋層形成之空間中。
根據其他實施例,一個或多個覆蓋層包含以下各者中之一者或多者:鈍化層、介電層、光學增強層、封裝層、反射層及彩色濾光片層,且功能調諧材料包含色彩轉換材料。
根據一些實施例,該等功能調諧材料進一步安置於以下各者中的一者上:光電子裝置之頂表面及底表面。
根據另一實施例,至少一個接點安置於以下各者中之至少一者上:光電子裝置之頂表面及底表面,且襯墊經由至少一個接點耦接至光電子裝置。
根據另一實施例,至少一個接點之高度可延伸超過安置於至少一個接點之同一側上的功能調諧材料,且其中至少一個接點在以下各者中的一者上:光電子裝置之頂表面及底表面經由跡線連接至光電子裝置之另一表面上的至少另一接點。該跡線藉由介電層與光電子裝置分離。
根據一些實施例,封裝層保護色彩轉換材料免受氧氣及濕氣影響,光學增強層將光反射至色彩轉換材料中,反射層增強至色彩轉換材料中之光耦合,且反射層在以下各者中的一者上延伸:光電子裝置之頂表面及底表面。反射層包含反射部分及透明部分。
根據其他實施例,複數個覆蓋層係藉由以下各者中的一者沈積:印刷、蒸發、印刷及濺鍍,且藉由以下各者中的一者圖案化:光微影、剝離及印刷。
根據其他實施例,一個或多個覆蓋層將功能調諧材料包圍在至少一個側表面與一個或多個覆蓋層之間。
圖10A及圖10B展示光分佈層至發光裝置與色彩轉換層之組合中的整合。色彩轉換層將發光裝置之色彩轉換成不同於發光裝置之原始色彩的另一色彩。此處,發光裝置1000可為形成或轉移至背板或基板1030中之微型LED。背板或基板1030可具有控制發光裝置1000及諸如平坦化層1032及接觸層1034之其他層的電路系統。光分佈層1014形成於發光裝置1030之頂部上。此處,光分佈層1014之形狀愈靠近發光裝置1030可能愈厚。光分佈層可為分散於聚合物溶液中之諸如銀奈米粒子、銀奈米線等的反射奈米粒子的組合。為了進一步增加光分佈層之有效性,發光裝置1030可直接地或間接地在反射層上。此外,可調整反射粒子之分佈以增加光均勻性。此可藉由不同乾燥方法以及不同溶液來達成。乾燥之一個實例可為在控制蒸汽壓之控制環境中使反射層乾燥。此可控制溶液自層蒸發之速度。蒸發之速度可導致邊緣首先乾燥,且因此材料會集中在中心處並形成圓頂形狀,其導致在中心處更厚。在另一種狀況下,材料可經衝壓以形成圓頂形狀。色彩轉換層1040及1042接著形成於光分佈層1014上。色彩轉換層1040及1042可在光分佈層1014上方延伸。在一種狀況下,色彩轉換層1040及1042為量子點(QD)。在另一種狀況下,彩色濾光片形成於色彩轉換層1040及1042之頂部上。在另一種狀況下,另一光分佈層1044形成於色彩轉換層之頂部上,以藉由將光傳遞回至色彩轉換層來進一步增加轉換效率。此處,可設定內部反射使得更多地反射原始光。可在色彩轉換層之後或在彩色濾光片層之後使用封裝層1046,以用於改善層之可靠性。色彩轉換層中之一些在曝露於諸如氧氣及濕氣之一些材料下可傾向於降解。封裝層1046可保護彼等層免受氧氣及濕氣影響。此外,封裝可提供對微裝置1000之進一步機械支撐。
在另一種狀況下,修改光分佈層之厚度以增加裝置之頂部上方的光反射率。圖10B展示此結構之例示性實施例。此處,在發光裝置1000之頂部上,光分佈層1014看起來像圓頂形狀(其可為發光裝置結構1000之後的另一形狀)。由裝置1000產生之光1002藉由反射粒子1016反射,且因此分佈於薄膜1014中。在光1002逸出薄膜1014之後,其藉由色彩轉換層1040轉換成另一色彩且作為另一光1004發射。
圖10C展示自光分佈層1030之表面至邊緣的反射粒子之有效濃度比。如可見,更多反射粒子位於結構之中心處,或實質上安置於結構之中心處。可調變反射粒子之濃度以使光朝向光分佈層之邊緣延伸。
方法態樣
本發明揭示一種用以將發光裝置之色彩轉換成另一色彩的方法。該方法包含形成以下各者:背板;發光裝置,其在背板之頂部上;光分佈層,其在發光裝置之頂部上;色彩轉換層,其在光分佈層之頂部上;及將發光裝置之色彩轉換成不同於發光裝置之原始色彩的另一色彩。此處,背板包含用以控制該發光裝置之電路系統。又,背板具有在頂部上之平坦化層,且發光裝置在反射層之頂部上。此外,光分佈層反射粒子在聚合物內部,且反射粒子實質上安置於光分佈層之中心處。又,調變反射粒子之濃度以使光朝向光分佈層之邊緣延伸。可藉由不同乾燥方法以及不同溶液來調整反射粒子之分佈以增加光均勻性。另外,光分佈層之形狀愈靠近發光裝置愈厚,且色彩轉換層為量子點並在光分佈層上方延伸。接下來,在色彩轉換層之頂部上存在另一光分佈層以藉由將光傳遞回至色彩轉換層來增加轉換效率,該色彩轉換層之頂部上具有彩色濾光片。最後,在色彩轉換層之後使用封裝層以改善層之可靠性,且發光裝置為形成或轉移至背板或基板中之微型LED。
出於說明及描述之目的,已呈現本發明之一個或多個實施例的前述描述。其並不意欲為窮盡的或將本發明限於所揭示之精確形式。鑒於上述教示,許多修改及變化係可能的。希望本發明之範圍並不被此實施方式限制,而被隨附在此之申請專利範圍限制。
102:步驟
104:步驟
106:步驟
202:步驟
204:步驟
206:步驟
208:步驟
302:步驟
304:步驟
306:步驟
308:步驟
310:步驟
402:步驟
404:步驟
406:步驟
408:步驟
410:步驟
502:步驟
504:步驟
506:步驟
508:步驟
510:步驟
602:供體基板
604:微裝置
606:電極
608:第一色彩轉換或濾光片層
610:第二色彩轉換或濾光片層
612:接收器基板
614:襯墊
616:第二電極
700:微裝置
700-1:頂表面
700-2:底表面
700-3:側表面
700-4:側表面
702:接點
704:接點
706:襯墊
708:襯墊
710:功能調諧/更改/修改材料/色彩轉換材料
712:蓋壁
714:蓋壁
716:蓋壁
718:蓋壁
720:反射部分/反射層
722:彩色濾光片層
800:微裝置
802:接點
804:接點
806:襯墊
810:色彩轉換層
812:層/壁
812A:封裝壁/封裝層/壁層
812B:封裝壁/封裝層/壁層
812C:反射層
814:側表面
816:蓋壁
818:蓋壁
820:壁
830:基板
832:緩衝層或犧牲層
904A:接點
904B:跡線
904C:接點
1000:發光裝置/發光裝置結構
1002:光
1004:光
1014:光分佈層/薄膜
1016:反射粒子
1030:背板或基板
1032:平坦化層
1034:接觸層
1040:色彩轉換層
1042:色彩轉換層
1044:光分佈層
1046:封裝層
在閱讀以下實施方式之後且在參看圖式之後,本揭示案之前述及其他優點將變得顯而易見。
圖1說明根據實施例之方法的流程圖。
圖2說明根據實施例之替代方法的流程圖。
圖3說明根據實施例之替代方法的流程圖。
圖4說明根據實施例之替代方法的流程圖。
圖5說明根據實施例之替代方法的流程圖。
圖6說明本發明之各種實施例。
圖7A至圖7C說明根據實施例之微裝置與色彩轉換層之整合的橫截面圖。
圖8A說明根據實施例之微裝置與色彩轉換層及接點之整合的橫截面圖。
圖8B說明根據實施例之微裝置與色彩轉換層及封裝壁之整合的橫截面圖。
圖8C說明根據實施例之微裝置與色彩轉換層之整合的橫截面圖。
圖8D說明根據實施例之微裝置與色彩轉換層之整合的橫截面圖。
圖9A說明根據實施例之微裝置與色彩轉換層之整合的橫截面圖。
圖9B說明根據實施例之微裝置與色彩轉換層之整合的橫截面圖。
圖10A及圖10B展示光分佈層至發光裝置與色彩轉換層之組合中的整合。
圖10C展示自光分佈層之表面至邊緣的反射粒子之有效濃度比。
雖然本公開易受各種修改及替代形式影響,但在圖式中已作為實例展示特定實施例或實施方案,且將在本文中對其進行詳細描述。然而,應理解,本揭示案並不意欲限於所揭示之特定形式。相反,本揭示案將涵蓋屬於如由隨附申請專利範圍界定之本發明之精神及範圍內的所有修改、等效物及替代例。
1000:發光裝置/發光裝置結構
1002:光
1004:光
1014:光分佈層/薄膜
1016:反射粒子
1030:背板或基板
1032:平坦化層
1034:接觸層
1040:色彩轉換層
Claims (28)
- 一種固態裝置,其包括以下各者: 一背板; 一發光裝置,其在該背板之頂部上; 一光分佈層,其在該發光裝置之頂部上;及 一色彩轉換層,其在該光分佈層之頂部上。
- 如請求項1之固態裝置,其中該背板包含用以控制該發光裝置之電路系統。
- 如請求項1之固態裝置,其中該背板在頂部上具有一平坦化層。
- 如請求項1之固態裝置,其中該發光裝置在一反射層之頂部上。
- 如請求項1之固態裝置,其中該等發光裝置為形成或轉移至一背板或基板中之微型LED。
- 如請求項1之固態裝置,其中光分佈層反射粒子在一聚合物內部。
- 如請求項5之固態裝置,其中反射粒子實質上安置於該光分佈層之一中心處。
- 如請求項1之固態裝置,其中該色彩轉換層在該光分佈層上方延伸。
- 如請求項1之固態裝置,其中該色彩轉換層為一量子點。
- 如請求項1之固態裝置,其中該光分佈層之一形狀愈靠近該發光裝置愈厚。
- 如請求項1之固態裝置,其中在該色彩轉換層之頂部上存在另一光分佈層。
- 如請求項1之固態裝置,其中在該色彩轉換層之頂部上存在一彩色濾光片。
- 如請求項1之固態裝置,其中該等發光裝置為形成或轉移至該背板或一基板中之微型LED。
- 一種用以將一發光裝置之一色彩轉換成另一色彩的方法,該方法包含: 形成一背板; 在該背板之頂部上形成一發光裝置; 在該發光裝置之頂部上形成一光分佈層; 在該光分佈層之頂部上形成一色彩轉換層;及 將該發光裝置之該色彩轉換成不同於該發光裝置之原始色彩的另一色彩。
- 如請求項14之方法,其中該背板包含用以控制該發光裝置之電路系統。
- 如請求項14之方法,其中該背板在頂部上具有一平坦化層。
- 如請求項14之方法,其中該發光裝置在一反射層之頂部上。
- 如請求項14之方法,其中光分佈層反射粒子在一聚合物內部。
- 如請求項18之方法,其中該等反射粒子實質上安置於該光分佈層之一中心處。
- 如請求項18之方法,其中調變該等反射粒子之一濃度以使光朝向該光分佈層之一邊緣延伸。
- 如請求項18之方法,其中可藉由不同乾燥方法以及不同溶液來調整該等反射粒子之一分佈以增加光均勻性。
- 如請求項14之方法,其中該光分佈層之一形狀愈靠近該發光裝置愈厚。
- 如請求項14之方法,其中該色彩轉換層在該光分佈層上方延伸。
- 如請求項14之方法,其中該色彩轉換層為一量子點。
- 如請求項14之方法,其中在該色彩轉換層之頂部上存在另一光分佈層,以藉由將光傳遞回至該色彩轉換層來增加一轉換效率。
- 如請求項14之方法,其中在該色彩轉換層之頂部上存在一彩色濾光片。
- 如請求項14之方法,其中在該色彩轉換層之後使用一封裝層以改善該等層之可靠性。
- 如請求項14之方法,其中該等發光裝置為形成或轉移至該背板或一基板中之微型LED。
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US9287469B2 (en) * | 2008-05-02 | 2016-03-15 | Cree, Inc. | Encapsulation for phosphor-converted white light emitting diode |
US8125127B2 (en) * | 2009-02-11 | 2012-02-28 | Anthony Mo | Reflective device for area lighting using narrow beam light emitting diodes |
US8415692B2 (en) * | 2009-07-06 | 2013-04-09 | Cree, Inc. | LED packages with scattering particle regions |
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