TW202211746A - 電路基板的製造方法 - Google Patents
電路基板的製造方法 Download PDFInfo
- Publication number
- TW202211746A TW202211746A TW110112834A TW110112834A TW202211746A TW 202211746 A TW202211746 A TW 202211746A TW 110112834 A TW110112834 A TW 110112834A TW 110112834 A TW110112834 A TW 110112834A TW 202211746 A TW202211746 A TW 202211746A
- Authority
- TW
- Taiwan
- Prior art keywords
- hole
- plating
- circuit board
- layer
- manufacturing
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 60
- 238000007747 plating Methods 0.000 claims abstract description 221
- 239000000758 substrate Substances 0.000 claims abstract description 62
- 238000000034 method Methods 0.000 claims description 65
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 43
- 229910052802 copper Inorganic materials 0.000 claims description 31
- 239000010949 copper Substances 0.000 claims description 31
- 239000000463 material Substances 0.000 claims description 16
- 229910000365 copper sulfate Inorganic materials 0.000 claims description 3
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 abstract description 5
- 239000010410 layer Substances 0.000 description 223
- 229910052751 metal Inorganic materials 0.000 description 32
- 239000002184 metal Substances 0.000 description 32
- 230000017525 heat dissipation Effects 0.000 description 25
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 11
- 239000011889 copper foil Substances 0.000 description 11
- 238000009713 electroplating Methods 0.000 description 11
- 229910000679 solder Inorganic materials 0.000 description 9
- 238000005530 etching Methods 0.000 description 8
- 239000010408 film Substances 0.000 description 8
- 239000000945 filler Substances 0.000 description 7
- 238000005240 physical vapour deposition Methods 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 7
- 238000005229 chemical vapour deposition Methods 0.000 description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 6
- 229910052737 gold Inorganic materials 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 3
- -1 For example Chemical compound 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000011247 coating layer Substances 0.000 description 3
- 229910001431 copper ion Inorganic materials 0.000 description 3
- 238000007772 electroless plating Methods 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 3
- 239000011265 semifinished product Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000011800 void material Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000002076 thermal analysis method Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000001947 vapour-phase growth Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2020/016815 WO2021210150A1 (ja) | 2020-04-17 | 2020-04-17 | 回路基板の製造方法 |
| WOPCT/JP2020/016815 | 2020-04-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW202211746A true TW202211746A (zh) | 2022-03-16 |
Family
ID=78083864
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW110112834A TW202211746A (zh) | 2020-04-17 | 2021-04-09 | 電路基板的製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2021210150A1 (enrdf_load_stackoverflow) |
| TW (1) | TW202211746A (enrdf_load_stackoverflow) |
| WO (1) | WO2021210150A1 (enrdf_load_stackoverflow) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0241873Y2 (enrdf_load_stackoverflow) * | 1985-09-19 | 1990-11-08 | ||
| JP2000064088A (ja) * | 1998-08-11 | 2000-02-29 | Ebara Yuujiraito Kk | プリント基板のめっき装置 |
| JP2005286299A (ja) * | 2004-03-03 | 2005-10-13 | Mitsubishi Paper Mills Ltd | 回路基板の製造方法 |
| JP2013243293A (ja) * | 2012-05-22 | 2013-12-05 | Shimada Phys & Chem Ind Co Ltd | プリント配線板及びその製造方法 |
| JPWO2014087470A1 (ja) * | 2012-12-03 | 2017-01-05 | 株式会社メイコー | 回路基板及びこの回路基板の製造方法 |
| JP6667982B2 (ja) * | 2014-01-27 | 2020-03-18 | 住友金属鉱山株式会社 | フレキシブル配線板 |
-
2020
- 2020-04-17 WO PCT/JP2020/016815 patent/WO2021210150A1/ja active Application Filing
- 2020-04-17 JP JP2021513931A patent/JPWO2021210150A1/ja active Pending
-
2021
- 2021-04-09 TW TW110112834A patent/TW202211746A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2021210150A1 (ja) | 2021-10-21 |
| JPWO2021210150A1 (enrdf_load_stackoverflow) | 2021-10-21 |
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