JPWO2021210150A1 - - Google Patents

Info

Publication number
JPWO2021210150A1
JPWO2021210150A1 JP2021513931A JP2021513931A JPWO2021210150A1 JP WO2021210150 A1 JPWO2021210150 A1 JP WO2021210150A1 JP 2021513931 A JP2021513931 A JP 2021513931A JP 2021513931 A JP2021513931 A JP 2021513931A JP WO2021210150 A1 JPWO2021210150 A1 JP WO2021210150A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021513931A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Publication of JPWO2021210150A1 publication Critical patent/JPWO2021210150A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP2021513931A 2020-04-17 2020-04-17 Pending JPWO2021210150A1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/016815 WO2021210150A1 (ja) 2020-04-17 2020-04-17 回路基板の製造方法

Publications (1)

Publication Number Publication Date
JPWO2021210150A1 true JPWO2021210150A1 (ja) 2021-10-21

Family

ID=78083864

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021513931A Pending JPWO2021210150A1 (ja) 2020-04-17 2020-04-17

Country Status (3)

Country Link
JP (1) JPWO2021210150A1 (ja)
TW (1) TW202211746A (ja)
WO (1) WO2021210150A1 (ja)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62118479U (ja) * 1985-09-19 1987-07-28
JP2000064088A (ja) * 1998-08-11 2000-02-29 Ebara Yuujiraito Kk プリント基板のめっき装置
JP2005286299A (ja) * 2004-03-03 2005-10-13 Mitsubishi Paper Mills Ltd 回路基板の製造方法
JP2013243293A (ja) * 2012-05-22 2013-12-05 Shimada Phys & Chem Ind Co Ltd プリント配線板及びその製造方法
WO2014087470A1 (ja) * 2012-12-03 2014-06-12 株式会社メイコー 回路基板及びこの回路基板の製造方法
JP2015141950A (ja) * 2014-01-27 2015-08-03 住友金属鉱山株式会社 フレキシブル配線板

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62118479U (ja) * 1985-09-19 1987-07-28
JP2000064088A (ja) * 1998-08-11 2000-02-29 Ebara Yuujiraito Kk プリント基板のめっき装置
JP2005286299A (ja) * 2004-03-03 2005-10-13 Mitsubishi Paper Mills Ltd 回路基板の製造方法
JP2013243293A (ja) * 2012-05-22 2013-12-05 Shimada Phys & Chem Ind Co Ltd プリント配線板及びその製造方法
WO2014087470A1 (ja) * 2012-12-03 2014-06-12 株式会社メイコー 回路基板及びこの回路基板の製造方法
JP2015141950A (ja) * 2014-01-27 2015-08-03 住友金属鉱山株式会社 フレキシブル配線板

Also Published As

Publication number Publication date
WO2021210150A1 (ja) 2021-10-21
TW202211746A (zh) 2022-03-16

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