TW202211337A - Testing apparatus - Google Patents

Abstract

The present application provides a testing apparatus. The testing apparatus includes a base; a first printed circuit board, disposed above the base; a stiffener, disposed above the base, located at a center of the base and passing through the first printed circuit board; a second printed circuit board, disposed at a center of the stiffener; and a probe card, one part thereof disposed below the stiffener and the other part thereof passing through the base, the first printed circuit board, the stiffener and the second printed circuit board. The base, the stiffener and the second printed circuit board are integrated and the base carries the first circuit board.

Description

test device

The present disclosure relates to a testing device. Especially about a test device.

Generally speaking, semiconductor devices (eg, integrated circuit chips) on a wafer must be tested for their electronic properties first, so as to determine whether the functions of the integrated circuit chips are good. Good IC chips will be selected for the subsequent packaging process, and defective products will be discarded to avoid additional packaging costs. The packaged integrated circuit chip must undergo another electrical test to screen out defective packaged products, thereby improving the final product yield. In other words, during the manufacturing process of the integrated circuit chip, several electrical tests must be performed.

Please refer to FIG. 1 , a testing system 10' of the prior art is used to test a device under test 31' (eg, a semiconductor device, an integrated circuit chip). The test system 10' includes a housing 11' (defining a test chamber 13'), a bracket 17' located in the housing 11', a base 30' located on the bracket 17' and receiving the component to be tested 31', Headboard 15' (with opening 19') on 11', test card 40' on headboard 15'. The device under test 31' is placed on a base 30' having a heater 33'.

The test card 40' includes a circuit board 41', a support 45' disposed on the circuit board 41', and a plurality of probes 43' fixed on the support 45' with epoxy resin 47'. The circuit board 41' has a first surface 42A' and a second surface 42B', and the front end of the probe 43' can form an electrical connection with the device under test 31' facing the second surface 42B'. The tail end of the probe 43' is electrically connected to the wire 53' on the first surface 42A' of the circuit board 42' through a conductive channel 51' inside the circuit board 41'.

During testing, the base 30' rises so that the front end of the probe 43' forms electrical contact with the pad 35' of the device under test 31', thereby establishing an electrical path between the test card 40' and the device under test 31'. During the test, the test signal is transmitted to the device under test 31' through the probe 43' of the test card 40', and the response signal of the device under test 31' is transmitted to the outside of the test card 40' through the probe 43' for analysis. The electrical test of the device under test 31' is realized.

However, since the circuit board 41' is directly connected to the probes 43' of the test card 40', and the circuit board 41' is used as a carrier, the larger the volume of the circuit board 41' at different temperatures, the more The greater the amount of variation, the more the connection between the circuit board 41' and the test card 40' is easily affected by temperature changes, resulting in distorted or erroneous test results; 'The deformation is large, and the tip of the probe 43' has a large displacement, which leads to deviation from the pad 35' of the component under test 31', resulting in distortion or error of the test result.

The above description of "prior art" is for background only, and does not acknowledge that the above description of "prior art" discloses the subject matter of the present disclosure, does not constitute the prior art of the present disclosure, and any description of the above "prior art" shall not be part of this case.

An embodiment of the present disclosure provides a testing device. The testing device includes a base plate; a first circuit board arranged on the base plate; a reinforcing member arranged on the base plate and located at the center of the base plate, and is disposed through the first circuit board; a first Two circuit boards, disposed at the center of the reinforcing member; and a test card, a part of which is located under the reinforcing member, and the other part is disposed through the bottom plate, the first circuit board, the reinforcing member and the second circuit board .

In some embodiments of the present disclosure, the bottom plate is substantially circular, a first concave portion is recessed in the center of the bottom plate for accommodating the reinforcing member, and the center of the first concave portion penetrates A first through hole is provided.

In some embodiments of the present disclosure, a second through hole is formed in the center of the first circuit board, and the second through hole is disposed corresponding to the first concave portion of the bottom plate.

In some embodiments of the present disclosure, a second concave portion is recessed in the center of the reinforcing member for accommodating the second circuit board, and a third concave portion passes through the center of the second concave portion. through hole.

In some embodiments of the present disclosure, a fourth through hole is formed in the center of the second circuit board, and the fourth through hole, the third through hole, the second through hole and the first through hole communicate with each other, for the other part of the test card to pass through.

In some embodiments of the present disclosure, the test card has a body portion and a plurality of probes, the body portion is below the reinforcing member, and the plurality of probes pass through the bottom plate, the first circuit board, and the reinforcing member and the second circuit board arrangement.

In some embodiments of the present disclosure, the first through hole of the base plate is substantially a square with rounded corners.

In some embodiments of the present disclosure, a protruding portion is protruded downward from the center of the reinforcing member, and the protruding portion is disposed correspondingly through the first through hole of the bottom plate.

In some embodiments of the present disclosure, the protruding portion has an outline corresponding to the outline of the first through hole of the base plate.

In some embodiments of the present disclosure, the surface of the first circuit board has a first circuit pattern, the surface of the second circuit board has a second circuit pattern, and the first circuit pattern and the second circuit pattern penetrate more A bonding wire is electrically connected to each other.

In some embodiments of the present disclosure, the test card has a body portion and a plurality of probes, the body portion is below the reinforcing member, and the plurality of probes pass through the first through hole, the first through hole of the base plate The second through hole of the circuit board, the third through hole of the reinforcing member and the fourth through hole of the second circuit board are arranged and electrically connected to the second circuit pattern of the second circuit board.

In some embodiments of the present disclosure, the surface of the bottom plate has a first positioning mark, and the surface of the reinforcing member has a third positioning mark. When the reinforcing member is assembled on the bottom plate, the third positioning mark of the reinforcing member is The markings are arranged in alignment with the first positioning markings of the base plate.

In some embodiments of the present disclosure, the second circuit board has a second positioning mark, and when the first circuit board is disposed on the bottom plate, the second positioning mark of the first circuit board is aligned with the reinforcing member The third positioning mark setting of .

In some embodiments of the present disclosure, the bottom plate, the reinforcing member and the second circuit board are integrally formed.

According to some embodiments of the present disclosure, a testing device is provided. The test device has a base plate, a first circuit board, a reinforcing member, a second circuit board and a test card, wherein the base plate, the reinforcing member and the second circuit board can be integrally formed and supported by the base plate the first circuit board. As a result of this structure, the first circuit board can be prevented from being directly connected to the probes of the test card, and the first circuit board can be supported by the base plate, so that the base plate, the The temperature change of the material of the reinforcement and the second circuit board is close to that of the test card, and the probes of the test card are not directly connected to the first circuit board, so that the first circuit board is connected to the test card. The amount of variation between the probes of the test card is reduced, thereby avoiding distortion or error in test results, and improving yield.

The foregoing has outlined rather broadly the technical features and advantages of the present disclosure in order that the detailed description of the present disclosure that follows may be better understood. Additional technical features and advantages that form the subject of the scope of the present disclosure are described below. It should be understood by those skilled in the art to which this disclosure pertains that the concepts and specific embodiments disclosed below can be readily utilized to modify or design other structures or processes to achieve the same purposes of the present disclosure. Those skilled in the art to which the present disclosure pertains should also understand that such equivalent constructions cannot depart from the spirit and scope of the present disclosure as defined by the appended claims.

Specific examples of components and configurations are described below to simplify embodiments of the present disclosure. Of course, these embodiments are for illustration only, and are not intended to limit the scope of the present disclosure. For example, in the description where the first part is formed on the second part, it may include embodiments where the first and second parts are in direct contact, and may also include additional parts formed between the first and second parts, Embodiments so that the first and second parts are not in direct contact. Additionally, embodiments of the present disclosure may repeat reference numerals and/or letters in many instances. These repetitions are for the purpose of simplicity and clarity and do not in themselves represent a specific relationship between the various embodiments and/or the configurations discussed, unless the context specifically indicates otherwise.

Furthermore, this application may use spatially corresponding words, such as "below", "below", "lower", "above", "higher" and other similar words, to describe a The relationship of an element or feature to another element or feature. Spatially corresponding terms are used to include different orientations in use or operation of the device in addition to the orientations described in the figures. The device may either be oriented (rotated 90 degrees or otherwise) and the spatially corresponding descriptions used in this application interpreted accordingly. It will be appreciated that when a feature is formed on another feature or substrate, other features may be present therebetween. Furthermore, this application may use spatially corresponding words, such as "below", "below", "lower", "above", "higher" and other similar words, to describe a The relationship of an element or feature to another element or feature. Spatially corresponding terms are used to include different orientations in use or operation of the device in addition to the orientations described in the figures. The device may either be oriented (rotated 90 degrees or otherwise) and the spatially corresponding descriptions used in this application interpreted accordingly.

The test device 100 disclosed in the present disclosure can be applied to the test system 10 ′ shown in FIG. 1 ; that is, the test device 100 disclosed in the present disclosure can replace the test card 40 ′ in FIG. 1 , and the present disclosure will be described below. The test device 100 shown in FIG. 1 will be described in detail, and if necessary, supplementary descriptions may be provided with some components in FIG. 1 .

2 is a schematic exploded top view of a testing device according to some embodiments of the present disclosure. 3 is a schematic exploded bottom view of the testing device according to some embodiments of the present disclosure. FIG. 4 is a schematic diagram of the assembly of the testing device according to some embodiments of the present disclosure. FIG. 5 is a schematic cross-sectional view of one half of the testing device according to an embodiment of the present disclosure. FIG. 6 is a schematic cross-sectional view of three-quarters of a testing device according to an embodiment of the present disclosure.

Please refer to FIGS. 2 to 6 , the test device 100 of the present disclosure includes a base plate 1 , a first circuit board 2 , a reinforcing member 3 , a second circuit board 4 and a test card 5 ; wherein, the test card 5 A part of the test card 5 is located under the reinforcement member 3 , and the other part of the test card 5 is arranged through the base plate 1 , the first circuit board 2 , the reinforcement member 3 and the second circuit board 4 .

Referring to FIGS. 2 and 3 , in some embodiments of the present disclosure, the bottom plate 1 is substantially circular, and a first concave portion 11 is recessed in the center of the bottom plate 1 for accommodating the reinforcing member 3 , and A first through hole 12 is formed in the center of the first concave portion 11 .

Please refer to FIG. 2 to FIG. 6 , the first circuit board 2 is disposed on the bottom plate 1 . In some embodiments of the present disclosure, a second through hole 21 is formed in the center of the first circuit board 2 , and the second through hole is disposed corresponding to the first concave portion 11 of the bottom plate 1 . Referring to FIG. 2 , in some embodiments of the present disclosure, the surface of the first circuit board 2 has a first circuit pattern 22 .

Referring to FIGS. 2 to 6 , the reinforcing member 3 is disposed on the bottom plate 1 , at the center of the bottom plate 1 , and is disposed through the first circuit board 2 at the same time. Referring to FIG. 2 and FIG. 3 , in some embodiments of the present disclosure, a second concave portion 31 is recessed at the center of the reinforcing member 3 for accommodating the second circuit board 4 , and the second recess is A third through hole 32 is formed in the center of the connecting portion 31 .

Referring to FIGS. 2 to 6 , in some embodiments of the present disclosure, the center of the reinforcing member 3 protrudes downward with a convex portion 33 , and the convex portion 33 is disposed corresponding to the first through hole 12 passing through the bottom plate 1 . . In some embodiments of the present disclosure, the first through hole 12 of the base plate 1 is substantially a square with rounded corners, and the protruding portion 33 has an outline corresponding to the outline of the first through hole 12 of the base plate 1 . In other words, the outline of the convex portion 33 is a square with rounded corners.

Referring to FIGS. 2 to 3 , in some embodiments of the present disclosure, the second circuit board 4 is disposed at the center of the reinforcing member 3 . In some embodiments of the present disclosure, a fourth through hole 41 is formed in the center of the second circuit board 4 , and the fourth through hole 41 of the second circuit board 4 , the third through hole 32 of the reinforcing member 3 , the first The second through hole 21 of the circuit board 2 and the first through hole 12 of the base plate 1 communicate with each other, so that the other part of the test card 5 can be passed through. Referring to FIGS. 2 and 3 again, in some embodiments of the present disclosure, the surface of the second circuit board 4 has a second circuit pattern 42 . The first circuit pattern 22 of the first circuit board 2 and the second circuit pattern 42 of the second circuit board 4 are electrically connected to each other through a plurality of bonding wires (not shown).

Referring to FIGS. 2 to 6 , in some embodiments of the present disclosure, the test card 5 has a body portion 51 and a plurality of probes 52 . The body portion 51 may have a circuit board (not shown), and the body portion 51 is located under the reinforcement member 3, and the plurality of probes 52 pass through the first through hole 12 of the base plate 1, the second through hole 21 of the first circuit board 2, the third through hole 32 of the reinforcement member 3 and the second circuit The fourth through hole 41 of the board 4 is disposed and electrically connected to the second circuit pattern 42 of the second circuit board 4 .

Referring again to FIGS. 2 and 4 , in some embodiments of the present disclosure, the surface of the bottom plate 1 has a first positioning mark 13 , such as the triangular arrow shown in FIG. 2 , and the surface of the reinforcing member 3 has a first positioning mark 13 . Three positioning marks 34 , such as the triangular arrows shown in FIG. 2 . When the reinforcement member 3 is assembled on the base plate 1 , the third positioning mark 34 of the reinforcement member 3 is aligned with the first positioning mark 13 of the base plate 1 . In some embodiments of the present disclosure, the second circuit board 2 has a second positioning mark 23 , such as a triangular arrow shown in FIG. 2 . When the first circuit board 2 is disposed on the bottom plate 1 , the second positioning mark 23 of the first circuit board 2 is aligned with the third positioning mark 34 of the reinforcing member 3 .

In addition, please refer to FIG. 4 to FIG. 6 , in some embodiments of the present disclosure, the bottom plate 1 , the reinforcing member 3 and the second circuit board 4 are integrally formed.

In combination with the above structure, please refer to FIG. 1 in conjunction with FIG. 2 to FIG. 6 of the present disclosure. During the test, the base is raised so that the front end of the probe 52 of the present disclosure is in electrical contact with the pad of the device to be tested. Thus, an electrical path is established between the test card 50 and the device under test. During the testing process, the test signal is transmitted to the device under test through the probe 52 of the test card 50 , and the response signal of the device under test is transmitted to the outside of the test card 50 through the probe 52 for analysis, so as to realize the electrical test of the device under test. .

With the above structure, the test device 100 of the present disclosure has a base plate 1 , a first circuit board 2 , a reinforcing member 3 , a second circuit board 4 and a test card 5 , wherein the base plate 1 , the reinforcing member 3 , the first The two circuit boards 4 can be integrally formed, and the bottom plate 1 supports the first circuit board 2 . As a result of this structure, it can be avoided that the larger the volume of the first circuit board 2 at different temperatures, the greater the amount of variation generated, thereby making the connection between the first circuit board 2 and the test card 5 easier. Affected by temperature changes, the test results are distorted or erroneous; in other words, due to the large temperature change in the test chamber, the deformation of the first circuit board 2 is large, and the displacement of the tip of the probe 52 is large, which is directly supported by the base plate 1 The first circuit board 2, so that the first circuit board 2 is not directly connected with the test card 5, can avoid causing the pads 35' to deviate from the component 31' to be tested, thereby causing distortion or errors in the test results; The temperature change of the material of the bottom plate 1 , the reinforcing member 3 and the second circuit board 4 is close to the temperature change of the test card 5 , and the probes 52 of the test card 5 are not directly connected to the first circuit board 2 . The connection reduces the variation between the probes 52 of the first circuit board 2 and the test card 5 , thereby avoiding distortion or error in the test results, and improving yield.

Furthermore, the first through hole 12 of the bottom plate 1 is substantially a square with rounded corners, and the convex portion 33 has a contour corresponding to the contour of the first through hole 12 of the bottom plate 1 . In other words, the convex portion 33 has an outline. The contour is a square with rounded corners; the surface of the bottom plate 1 has a first positioning mark 13, such as the triangular arrow shown in FIG. 1, and the surface of the reinforcing member 3 has a third positioning mark 34, such as shown in FIG. 1 When the reinforcing member 3 is assembled on the base plate 1, the third positioning mark 34 is aligned with the first positioning mark 13; and the second circuit board 2 has a second positioning mark 23, such as the one shown in FIG. 1 . The triangular arrow, when the first circuit board 2 is set on the bottom plate 1, the second positioning mark 23 of the first circuit board 2 is aligned with the third positioning mark 34 of the reinforcing member 3, thereby avoiding assembly errors and preventing assembly errors. Staying effect.

An embodiment of the present disclosure provides a testing device. The testing device includes a base plate; a first circuit board arranged on the base plate; a reinforcing member arranged on the base plate and located at the center of the base plate, and is disposed through the first circuit board; a first Two circuit boards, disposed at the center of the reinforcing member; and a test card, a part of which is located under the reinforcing member, and the other part is disposed through the bottom plate, the first circuit board, the reinforcing member and the second circuit board .

Although the present disclosure and its advantages have been described in detail, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the disclosure as defined by the scope of the claims. For example, many of the processes described above may be implemented in different ways and replaced by other processes or combinations thereof.

Furthermore, the scope of this application is not limited to the specific embodiments of the processes, machines, manufacture, compositions of matter, means, methods and steps described in the specification. Those skilled in the art can understand from the disclosure of the present disclosure that existing or future development processes, machines, manufactures, processes, machines, manufactures, etc. that have the same functions or achieve substantially the same results as the corresponding embodiments described herein can be used in accordance with the present disclosure. A composition of matter, means, method, or step. Accordingly, such processes, machines, manufactures, compositions of matter, means, methods, or steps are included within the scope of the claims of this application.

1: Bottom plate 2: The first circuit board 3: Reinforcement 4: Second circuit board 5: Test card 10': Test System 11: The first concave part 11': shell 12: The first through hole 13: The first positioning mark 13’: Test room 15': Headboard 17': Bracket 19': opening 21: Second through hole 22: The first circuit pattern 23: Second positioning mark 30': Pedestal 31: Second concave part 31': Component to be tested 32: Third through hole 33: convex joint 33': heater 34: The third positioning mark 40': Test Card 41: Fourth through hole 41': circuit board 42: Second circuit pattern 42A': first surface 42B': second surface 43': Probe 45': Support 47': Epoxy 51: body part 51': Conductive channel 52: Probe 53': wire 100: Test device

A more complete understanding of the disclosure of the present application can be obtained by referring to the embodiments and the scope of the application in conjunction with the drawings, and the same reference numerals in the drawings refer to the same elements. FIG. 1 is a test system illustrating a prior art. 2 is a schematic exploded top view of a testing device according to some embodiments of the present disclosure. 3 is a schematic exploded bottom view of the testing device according to some embodiments of the present disclosure. FIG. 4 is a schematic diagram of the assembly of the testing device according to some embodiments of the present disclosure. FIG. 5 is a schematic cross-sectional view of one half of the testing device according to an embodiment of the present disclosure. FIG. 6 is a schematic cross-sectional view of three-quarters of a testing device according to an embodiment of the present disclosure.

1: Bottom plate

2: The first circuit board

3: Reinforcement

4: Second circuit board

5: Test card

11: The first concave part

12: The first through hole

13: The first positioning mark

21: Second through hole

22: The first circuit pattern

31: Second concave part

32: Third through hole

34: The third positioning mark

41: Fourth through hole

42: Second circuit pattern

51: body part

52: Probe

100: Test device

Claims (14)

A test device comprising: a bottom plate; a first circuit board, arranged on the base plate; A reinforcing piece is arranged on the bottom plate and is located at the center of the bottom plate, and is arranged through the first circuit board at the same time; a second circuit board disposed at the center of the reinforcement; and A test card, a part of which is located under the reinforcing member, and the other part is disposed through the bottom plate, the first circuit board, the reinforcing member and the second circuit board. The testing device as claimed in claim 1, wherein the bottom plate is substantially circular, a first concave portion is concavely formed in the center portion of the bottom plate for accommodating the reinforcing member, and the center of the first concave portion is recessed. A first through hole is penetrated there. The testing device according to claim 2, wherein a second through hole is formed in the center of the first circuit board, and the second through hole is disposed corresponding to the first concave portion of the base plate. The test device as claimed in claim 3, wherein a second concave portion is recessed in the center of the reinforcing member for accommodating the second circuit board, and a center of the second concave portion penetrates third through hole. The testing device according to claim 4, wherein a fourth through hole is formed in the center of the second circuit board, and the fourth through hole, the third through hole, the second through hole and the first through hole are mutually communicated for the other portion of the test card to pass through. The test device as claimed in claim 1, wherein the test card has a body portion and a plurality of probes, the body portion is below the reinforcing member, and the plurality of probes pass through the bottom plate, the first circuit board, the The reinforcing member and the second circuit board are arranged and electrically connected with the second circuit board. The test device of claim 5, wherein the first through hole of the base plate is substantially a square with rounded corners. The testing device as claimed in claim 7, wherein a center of the reinforcing member protrudes downwardly with a protruding portion, and the protruding portion is disposed correspondingly through the first through hole of the base plate. The testing device of claim 8, wherein the protruding portion has an outline corresponding to the outline of the first through hole of the base plate. The testing device of claim 5, wherein the surface of the first circuit board has a first circuit pattern, the surface of the second circuit board has a second circuit pattern, the first circuit pattern and the second circuit pattern They are electrically connected to each other through a plurality of bonding wires. The test device according to claim 10, wherein the test card has a body portion and a plurality of probes, the body portion is below the reinforcing member, and the plurality of probes pass through the first through hole of the base plate, the probe The second through hole of the first circuit board, the third through hole of the reinforcing member, and the fourth through hole of the second circuit board are arranged and electrically connected to the second circuit pattern of the second circuit board connect. The testing device according to claim 5, wherein the surface of the base plate has a first positioning mark, the surface of the reinforcing member has a third positioning mark, and when the reinforcing member is assembled on the base plate, the first positioning mark of the reinforcing member is The three positioning marks are arranged in alignment with the first positioning mark of the base plate. The testing device of claim 12, wherein the second circuit board has a second positioning mark, and when the first circuit board is disposed on the base plate, the second positioning mark of the first circuit board is aligned with the The third positioning mark of the reinforcement is provided. The test device as claimed in claim 1, wherein the bottom plate, the reinforcing member and the second circuit board are integrally formed.

Images