CN212391574U - Testing device - Google Patents
Testing device Download PDFInfo
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- CN212391574U CN212391574U CN202021921228.1U CN202021921228U CN212391574U CN 212391574 U CN212391574 U CN 212391574U CN 202021921228 U CN202021921228 U CN 202021921228U CN 212391574 U CN212391574 U CN 212391574U
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- circuit board
- hole
- bottom plate
- stiffener
- testing device
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- Measuring Leads Or Probes (AREA)
Abstract
The utility model provides a testing device. The testing device comprises a bottom plate, a first circuit board, a reinforcing piece, a second circuit board and a testing card. A first circuit board arranged on the bottom plate; a reinforcing member disposed on the base plate and located at the center of the base plate and penetrating through the first circuit board; a second circuit board arranged at the central part of the reinforcing member; one part of the test card is positioned below the reinforcing piece, and the other part of the test card penetrates through the bottom plate, the first circuit board, the reinforcing piece and the second circuit board; the bottom plate, the reinforcement member and the second circuit board are integrally formed, and the bottom plate is used for bearing the first circuit board.
Description
Technical Field
The utility model relates to a testing device. In particular to a testing device.
Background
Generally, semiconductor devices (e.g., integrated circuit chips) on a wafer must first be tested for their electrical characteristics to determine whether the integrated circuit chips are functioning properly. Good ic chips are selected for subsequent packaging processes, while defective chips are discarded to avoid additional packaging costs. The packaged integrated circuit chip must be subjected to another electrical test to select a packaging defective product, thereby improving the yield of the final finished product. In other words, the integrated circuit chip must be electrically tested several times during the manufacturing process.
Referring to fig. 1, a test system 10 'of the prior art is used for testing a device under test 31' (e.g., a semiconductor device, an integrated circuit chip). The test system 10 ' includes a housing 11 ' (defining a test chamber 13 '), a rack 17 ' within the housing 11 ', a base 30 ' on the rack 17 ' and receiving an element to be tested 31 ', a head plate 15 ' (having an opening 19 ') on the housing 11 ', a test card 40 ' on the head plate 15 '. The element to be measured 31 ' is placed on a base 30 ' having a heater 33 '.
The test card 40 ' includes a circuit board 41 ', a support 45 ' disposed on the circuit board 41 ', and a plurality of probes 43 ' secured to the support 45 ' with epoxy 47 '. The circuit board 41 'has a first surface 42A' and a second surface 42B ', and the front ends of the probes 43' can be electrically connected to the dut 31 'facing the second surface 42B'. The tail end of the probe 43 'is electrically connected to a lead 53' on the first surface 42A 'of the circuit board 42' via a conductive path 51 'inside the circuit board 41'.
During testing, the base 30 'is raised so that the front ends of the probes 43' are in electrical contact with the pads 35 'of the device under test 31', thereby establishing an electrical path between the test card 40 'and the device under test 31'. In the testing process, the testing signal is transmitted to the device 31 ' through the probe 43 ' of the test card 40 ', and the response signal of the device 31 ' is transmitted to the outside of the test card 40 ' through the probe 43 ' for analysis, so as to realize the electrical testing of the device 31 ' to be tested.
However, since the circuit board 41 ' is directly connected to the probe 43 ' of the test card 40 ' and the circuit board 41 ' is used as a carrier, the larger the volume of the circuit board 41 ' is at different temperatures, the more the variation is generated, and the connection between the circuit board 41 ' and the test card 40 ' is easily affected by the temperature change, which results in distortion or error of the test result; in other words, the temperature change of the test chamber 13 ' is large, the deformation of the circuit board 41 ' is large, and the tip displacement of the probe 43 ' is large, which causes the probe to deviate from the pad 35 ' of the dut 31 ', resulting in distortion or error of the test result.
The above "prior art" description merely provides background, and does not acknowledge that the above "prior art" description discloses embodiments of the present invention, does not constitute prior art of the present invention, and any description of the above "prior art" should not be taken as any part of the present invention.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a testing arrangement to solve above-mentioned at least one problem.
An embodiment of the utility model provides a testing arrangement. The testing device comprises a bottom plate, a first circuit board, a reinforcing piece, a second circuit board and a testing card. A first circuit board arranged on the bottom plate; a reinforcing member disposed on the base plate and located at the center of the base plate and penetrating through the first circuit board; a second circuit board arranged at the central part of the reinforcing member; one part of a test card is positioned below the reinforcing piece, and the other part of the test card penetrates through the bottom plate, the first circuit board, the reinforcing piece and the second circuit board.
In some embodiments of the present invention, the bottom plate is circular, a first concave portion is concavely disposed at a central portion of the bottom plate for accommodating the stiffener, and a first through hole is formed at a central portion of the first concave portion.
In some embodiments of the present invention, a second through hole is formed through the center of the first circuit board, and the second through hole is disposed corresponding to the first concave portion of the bottom plate.
In some embodiments of the present invention, a second concave portion is concavely disposed at a center of the stiffener for accommodating the second circuit board, and a third through hole is formed at a center of the second concave portion.
In some embodiments of the present invention, a fourth through hole is formed through the center of the second circuit board, and the fourth through hole, the third through hole, the second through hole and the first through hole are communicated with each other for the other portion of the test card to pass through.
In some embodiments of the present invention, the test card has a body portion and a plurality of probes, the body portion is located below the stiffener, and the plurality of probes pass through the bottom plate, the first circuit board, the stiffener and the second circuit board.
In some embodiments of the present invention, the first through hole of the bottom plate is a square with rounded corners.
In some embodiments of the present invention, a protruding portion is disposed at the center of the stiffener and protrudes downward, and the protruding portion is disposed corresponding to the first through hole penetrating through the bottom plate.
In some embodiments of the present invention, the protruding portion has a contour corresponding to a contour of the first through hole of the bottom plate.
In some embodiments of the present invention, the surface of the first circuit board has a first circuit pattern, the surface of the second circuit board has a second circuit pattern, and the first circuit pattern and the second circuit pattern are electrically connected to each other through a plurality of bonding wires.
In some embodiments of the present invention, the test card has a body portion and a plurality of probes, the body portion is located below the stiffener, and the plurality of probes pass through the first through hole of the bottom plate, the second through hole of the first circuit board, the third through hole of the stiffener and the fourth through hole of the second circuit board, and are electrically connected to the second circuit pattern of the second circuit board.
In some embodiments of the present invention, the surface of the bottom plate has a first positioning mark, the surface of the stiffener has a third positioning mark, and the third positioning mark of the stiffener aligns with the first positioning mark of the bottom plate when the stiffener is assembled on the bottom plate.
In some embodiments of the present invention, the second circuit board has a second positioning mark, and when the first circuit board is disposed on the bottom plate, the second positioning mark of the first circuit board is aligned with the third positioning mark of the stiffener.
In some embodiments of the present invention, the bottom plate, the stiffener and the second circuit board are integrally formed.
According to some embodiments of the present invention, a testing device is provided. The testing device is provided with a bottom plate, a first circuit board, a reinforcing piece, a second circuit board and a testing card, wherein the bottom plate, the reinforcing piece and the second circuit board can be integrally formed, and the bottom plate is used for bearing the first circuit board. The structure can avoid the direct connection of the first circuit board and the probes of the test card, and the bottom board can bear the first circuit board, so that when the temperature is different, the temperature variation of the materials of the bottom board, the reinforcing piece and the second circuit board is close to the temperature variation of the test card, and the probes of the test card are not directly connected with the first circuit board, so that the variation between the probes of the first circuit board and the test card is reduced, the distortion or error of the test result is avoided, and the yield is improved.
Drawings
A more complete understanding of the present disclosure may be derived by referring to the embodiments when considered in conjunction with the following claims, wherein like reference numbers refer to similar elements throughout the figures.
Fig. 1 is a diagram illustrating a test system of the prior art.
Fig. 2 is an exploded top view of a testing device according to some embodiments of the present invention.
Fig. 3 is an exploded bottom view of the testing device according to some embodiments of the present invention.
Fig. 4 is a schematic diagram of an assembly of the testing device according to some embodiments of the present invention.
Fig. 5 is a schematic cross-sectional view of one half of a testing apparatus according to an embodiment of the present invention.
Fig. 6 is a schematic cross-sectional view of three-quarters of a test apparatus according to an embodiment of the present invention.
The reference numbers are as follows:
1: bottom plate
2: first circuit board
3 reinforcing member
4: second circuit board
5, test card
10' testing system
11 first concave connection part
11' shell
12 first through hole
13 first positioning indication
13' testing chamber
15' head plate
17' support
19'. opening
21 second through hole
22 first circuit pattern
23 second positioning indication
30' base
31 second concave part
31' component to be tested
32 third through hole
33: a convex connection part
33'. Heater
34 third location mark
40' test card
41 fourth through hole
41' circuit board
42 second circuit pattern
42A' first surface
42B' second surface
43' probe
45' support
47' epoxy resin
51 body part
51' conductive vias
52 probe
53' lead wire
100 testing device
Detailed Description
Specific examples of components and arrangements are described below to simplify the present disclosure. Of course, these examples are merely illustrative and are not intended to limit the scope of the present invention. For example, the formation of a first feature over a second feature in the description that follows may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features may be formed intermediate the first and second features such that the first and second features may not be in direct contact. In addition, embodiments of the present invention may repeat reference numerals and/or letters in the various examples. These repetitions are for simplicity and clarity and do not, in themselves, represent a particular relationship between the various embodiments and/or configurations discussed, unless specifically stated in the context.
Furthermore, the present invention may use spatially corresponding terms, such as "lower," "upper," "lower," and the like, for descriptive purposes and relationships of one element or feature to another element or feature in the figures. Spatially corresponding terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be oriented (rotated 90 degrees or at other orientations) and the spatially corresponding descriptions used herein may be interpreted accordingly. It is understood that when a feature is formed in another feature or substrate, other features may be present therebetween. Furthermore, the present invention may use spatially corresponding terms, such as "lower," "upper," "lower," and the like, for descriptive purposes and relationships of one element or feature to another element or feature in the figures. Spatially corresponding terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be oriented (rotated 90 degrees or at other orientations) and the spatially corresponding descriptions used herein may be interpreted accordingly.
The testing device 100 disclosed in the present invention can be applied to the testing system 10' shown in fig. 1; that is, the testing device 100 of the present invention can replace the testing card 40' in fig. 1, and the testing device 100 of the present invention will be described in detail below, and if necessary, some elements of fig. 1 can be added for supplementary description.
Fig. 2 is an exploded top view of a testing device according to some embodiments of the present invention. Fig. 3 is an exploded bottom view of the testing device according to some embodiments of the present invention. Fig. 4 is a schematic diagram of an assembly of the testing device according to some embodiments of the present invention. Fig. 5 is a schematic cross-sectional view of one half of a testing apparatus according to an embodiment of the present invention. Fig. 6 is a schematic cross-sectional view of three-quarters of a test apparatus according to an embodiment of the present invention.
Referring to fig. 2 to 6, the testing device 100 of the present invention includes a bottom plate 1, a first circuit board 2, a stiffener 3, a second circuit board 4 and a testing card 5; wherein one part of the test card 5 is positioned below the stiffener 3, and the other part of the test card 5 is arranged through the bottom plate 1, the first circuit board 2, the stiffener 3 and the second circuit board 4.
Referring to fig. 2 and 3, in some embodiments of the present invention, the bottom plate 1 is substantially circular, and a first concave portion 11 is recessed in a central portion of the bottom plate 1 for accommodating the stiffener 3, and a first through hole 12 is formed through the center of the first concave portion 11.
Referring to fig. 2 to 6, the first circuit board 2 is disposed on the bottom plate 1. In some embodiments of the present invention, a second through hole 21 is formed through the center of the first circuit board 2, and the second through hole is disposed corresponding to the first concave portion 11 of the bottom plate 1. Referring to fig. 2, in some embodiments of the present invention, the surface of the first circuit board 2 has a first circuit pattern 22.
Referring to fig. 2 to 6, the stiffener 3 is disposed on the bottom plate 1 and located at a central portion of the bottom plate 1, and penetrates through the first circuit board 2. Referring to fig. 2 and 3, in some embodiments of the present invention, a second concave portion 31 is concavely disposed at a center of the stiffener 3 for accommodating the second circuit board 4, and a third through hole 32 is disposed at a center of the second concave portion 31.
Referring to fig. 2 to 6, in some embodiments of the present invention, a protruding portion 33 is protruded downward from the center of the stiffener 3, and the protruding portion 33 is disposed corresponding to the first through hole 12 penetrating through the bottom plate 1. In some embodiments of the present invention, the first through hole 12 of the bottom plate 1 is substantially square with rounded corners, and the protruding portion 33 has a contour corresponding to the contour of the first through hole 12 of the bottom plate 1. In other words, the contour of the convex portion 33 is a square with rounded corners.
Referring to fig. 2 to 3, in some embodiments of the present invention, the second circuit board 4 is disposed at a central portion of the stiffener 3. In some embodiments of the present invention, a fourth through hole 41 is formed through the center of the second circuit board 4, and the fourth through hole 41 of the second circuit board 4, the third through hole 32 of the stiffener 3, the second through hole 21 of the first circuit board 2 and the first through hole 12 of the bottom plate 1 are communicated with each other, so that the other portion of the test card 5 can be disposed through the through hole. Referring to fig. 2 and 3 again, in some embodiments of the present invention, the surface of the second circuit board 4 has a second circuit pattern 42. The first circuit pattern 22 of the first circuit board 2 and the second circuit pattern 42 of the second circuit board 4 are electrically connected to each other by a plurality of bonding wires (not shown).
Referring to fig. 2 to 6, in some embodiments of the present invention, the test card 5 has a body 51 and a plurality of probes 52, the body 51 may have a circuit board (not shown), the body 51 is located below the stiffener 3, and the plurality of probes 52 are disposed through the first through hole 12 of the bottom plate 1, the second through hole 21 of the first circuit board 2, the third through hole 32 of the stiffener 3, and the fourth through hole 41 of the second circuit board 4, and electrically connected to the second circuit pattern 42 of the second circuit board 4.
Referring to fig. 2 and 4 again, in some embodiments of the present invention, the surface of the bottom plate 1 has a first positioning mark 13, such as the triangular arrow shown in fig. 2, and the surface of the reinforcing member 3 has a third positioning mark 34, such as the triangular arrow shown in fig. 2. When the reinforcing member 3 is assembled on the base plate 1, the third positioning mark 34 of the reinforcing member 3 is aligned with the first positioning mark 13 of the base plate 1. In some embodiments of the present invention, the second circuit board 2 has a second positioning mark 23, such as the triangular arrow shown in fig. 2. When the first circuit board 2 is disposed on the base plate 1, the second positioning mark 23 of the first circuit board 2 is disposed in alignment with the third positioning mark 34 of the stiffener 3.
In addition, referring to fig. 4 to 6, in some embodiments of the present invention, the bottom plate 1, the reinforcing member 3 and the second circuit board 4 are integrally formed.
With the above structure, referring to fig. 1 and with reference to fig. 2 to 6 of the present invention, when testing, the base rises to make the front end of the probe 52 of the present invention electrically contact with the pad of the device under test, so that an electrical path is established between the test card 50 and the device under test. During the testing process, the testing signal is transmitted to the device under test through the probe 52 of the test card 50, and the response signal of the device under test is transmitted to the outside of the test card 50 through the probe 52 for analysis, so as to realize the electrical testing of the device under test.
Through the above structure, the testing device 100 of the present invention has a bottom plate 1, a first circuit board 2, a reinforcement 3, a second circuit board 4 and a testing card 5, wherein the bottom plate 1, the reinforcement 3, the second circuit board 4 can be formed integrally, and the bottom plate 1 is used to carry the first circuit board 2. As a result of the structure, the problem that the connection between the first circuit board 2 and the test card 5 is easily affected by temperature change to cause distortion or error of the test result due to the fact that the larger the volume of the first circuit board 2 is at different temperatures, the more the variation is generated; in other words, because the temperature change of the test chamber is large, the deformation of the first circuit board 2 is large, the displacement of the tip of the probe 52 is large, and the first circuit board 2 is directly loaded through the bottom plate 1, so that the first circuit board 2 is not directly connected with the test card 5, and the deviation from the pad 35 'of the device 31' to be tested, which leads to the distortion or error of the test result, can be avoided; therefore, when the temperature is different, the temperature variation of the materials of the bottom plate 1, the stiffener 3 and the second circuit board 4 is close to the temperature variation of the test card 5, and the probes 52 of the test card 5 are not directly connected to the first circuit board 2, so that the variation between the first circuit board 2 and the probes 52 of the test card 5 is reduced, thereby avoiding the distortion or error of the test result and improving the yield.
Furthermore, the first through hole 12 passing through the bottom plate 1 is substantially square with rounded corners, and the convex portion 33 has a contour corresponding to the contour of the first through hole 12 of the bottom plate 1, in other words, the contour of the convex portion 33 is square with rounded corners; the surface of the base plate 1 has a first positioning mark 13, such as the triangular arrow shown in fig. 1, and the surface of the stiffener 3 has a third positioning mark 34, such as the triangular arrow shown in fig. 1, when the stiffener 3 is assembled on the base plate 1, the third positioning mark 34 is aligned with the first positioning mark 13; and the second circuit board 2 has a second positioning mark 23, such as a triangular arrow shown in fig. 1, when the first circuit board 2 is disposed on the bottom plate 1, the second positioning mark 23 of the first circuit board 2 is aligned with the third positioning mark 34 of the stiffener 3, thereby avoiding assembly errors and achieving fool-proof effect.
An embodiment of the utility model provides a testing arrangement. The testing device comprises a bottom plate; the first circuit board is arranged on the bottom plate; the reinforcing piece is arranged on the bottom plate, is positioned at the central part of the bottom plate and penetrates through the first circuit board; a second circuit board disposed at a central portion of the reinforcement member; and one part of the test card is positioned below the reinforcing piece, and the other part of the test card penetrates through the bottom plate, the first circuit board, the reinforcing piece and the second circuit board.
The foregoing outlines features of several embodiments so that those skilled in the art may better understand the aspects of the present disclosure. Those skilled in the art should appreciate that they may readily use the present invention as a basis for designing or modifying other operations and structures for carrying out the same purposes and/or achieving the same advantages of the specific embodiments taught herein. Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they may make various changes, substitutions, and alterations herein without departing from the spirit and scope of the present disclosure.
Moreover, the scope of the present application is not intended to be limited to the particular embodiments of the process, machine, manufacture, composition of matter, means, methods and steps described in the specification. As one of ordinary skill in the art will readily appreciate from the disclosure of the present invention, processes, machines, manufacture, compositions of matter, means, methods, or steps, presently existing or later to be developed that perform substantially the same function or achieve substantially the same result as the corresponding embodiments described herein may be utilized according to the present invention. Accordingly, the appended claims are intended to include within their scope such processes, machines, manufacture, compositions of matter, means, methods, or steps.
Claims (14)
1. A test apparatus, comprising:
a base plate;
the first circuit board is arranged on the bottom plate;
the reinforcing piece is arranged on the bottom plate, is positioned at the central part of the bottom plate and penetrates through the first circuit board;
a second circuit board disposed at a central portion of the reinforcement member; and
one part of the test card is positioned below the reinforcing piece, and the other part of the test card penetrates through the bottom plate, the first circuit board, the reinforcing piece and the second circuit board.
2. The testing device as claimed in claim 1, wherein the bottom plate is circular, a first concave portion is concavely formed at a central portion of the bottom plate for receiving the stiffener, and a first through hole is formed through a center of the first concave portion.
3. The testing device as claimed in claim 2, wherein a second through hole is formed through the first circuit board at a center thereof, and the second through hole is disposed corresponding to the first recess of the base plate.
4. The testing device as claimed in claim 3, wherein a second recessed portion is recessed at a center of the stiffener for receiving the second circuit board, and a third through hole is formed through a center of the second recessed portion.
5. The testing device as claimed in claim 4, wherein a fourth through hole is formed through the center of the second circuit board, and the fourth through hole, the third through hole, the second through hole and the first through hole are communicated with each other for the other portion of the test card to pass through.
6. The testing apparatus as claimed in claim 1, wherein the test card has a body portion and a plurality of probes, the body portion is located under the stiffener, and the plurality of probes are disposed through the bottom plate, the first circuit board, the stiffener and the second circuit board and electrically connected to the second circuit board.
7. The testing device as claimed in claim 5, wherein the first through hole of the base plate has a square shape with rounded corners.
8. The testing apparatus as claimed in claim 7, wherein the stiffener has a protrusion protruding downward from a center thereof, the protrusion corresponding to the first through hole penetrating through the bottom plate.
9. The testing device as claimed in claim 8, wherein the protrusion has a profile corresponding to a profile of the first through hole of the base plate.
10. The testing device as claimed in claim 5, wherein the first circuit board has a first circuit pattern on a surface thereof, the second circuit board has a second circuit pattern on a surface thereof, and the first circuit pattern and the second circuit pattern are electrically connected to each other by a plurality of bonding wires.
11. The testing device as claimed in claim 10, wherein the test card has a body portion and a plurality of probes, the body portion is located under the stiffener, the plurality of probes are disposed through the first through hole of the chassis, the second through hole of the first circuit board, the third through hole of the stiffener, and the fourth through hole of the second circuit board, and are electrically connected to the second circuit pattern of the second circuit board.
12. The testing apparatus of claim 5, wherein the surface of the base plate has a first alignment mark, and the surface of the stiffener has a third alignment mark, the third alignment mark of the stiffener being aligned with the first alignment mark of the base plate when the stiffener is assembled to the base plate.
13. The testing apparatus as claimed in claim 12, wherein the second circuit board has a second alignment mark, and the second alignment mark of the first circuit board is aligned with the third alignment mark of the stiffener when the first circuit board is disposed on the base plate.
14. The testing device as claimed in claim 1, wherein the base plate, the stiffener and the second circuit board are integrally formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021921228.1U CN212391574U (en) | 2020-09-04 | 2020-09-04 | Testing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021921228.1U CN212391574U (en) | 2020-09-04 | 2020-09-04 | Testing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212391574U true CN212391574U (en) | 2021-01-22 |
Family
ID=74254083
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021921228.1U Active CN212391574U (en) | 2020-09-04 | 2020-09-04 | Testing device |
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| CN (1) | CN212391574U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113471103A (en) * | 2021-06-09 | 2021-10-01 | 上海华虹宏力半导体制造有限公司 | Probe module |
| CN114137384A (en) * | 2020-09-04 | 2022-03-04 | 思达科技股份有限公司 | Testing device |
-
2020
- 2020-09-04 CN CN202021921228.1U patent/CN212391574U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114137384A (en) * | 2020-09-04 | 2022-03-04 | 思达科技股份有限公司 | Testing device |
| CN113471103A (en) * | 2021-06-09 | 2021-10-01 | 上海华虹宏力半导体制造有限公司 | Probe module |
| CN113471103B (en) * | 2021-06-09 | 2023-10-20 | 上海华虹宏力半导体制造有限公司 | Probe module |
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