TW202210964A - Ball mounting mask and method for manufacturing same - Google Patents
Ball mounting mask and method for manufacturing same Download PDFInfo
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- TW202210964A TW202210964A TW110131237A TW110131237A TW202210964A TW 202210964 A TW202210964 A TW 202210964A TW 110131237 A TW110131237 A TW 110131237A TW 110131237 A TW110131237 A TW 110131237A TW 202210964 A TW202210964 A TW 202210964A
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- opening pattern
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- 238000000034 method Methods 0.000 title claims description 39
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 238000009713 electroplating Methods 0.000 claims description 94
- 238000007747 plating Methods 0.000 claims description 70
- 229910001220 stainless steel Inorganic materials 0.000 claims description 28
- 239000010935 stainless steel Substances 0.000 claims description 28
- 239000000463 material Substances 0.000 claims description 26
- 230000002093 peripheral effect Effects 0.000 claims description 23
- 230000015572 biosynthetic process Effects 0.000 claims description 11
- 239000010953 base metal Substances 0.000 claims description 2
- 101100269850 Caenorhabditis elegans mask-1 gene Proteins 0.000 description 10
- 239000000758 substrate Substances 0.000 description 9
- 230000000694 effects Effects 0.000 description 4
- 230000004907 flux Effects 0.000 description 2
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/757—Means for aligning
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/81001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector involving a temporary auxiliary member not forming part of the bonding apparatus
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Pens And Brushes (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Abstract
Description
本發明係關於一種用於搭載導電性球之球搭載用遮罩以及其製造方法。The present invention relates to a ball mounting mask for mounting conductive balls and a method for manufacturing the same.
在球搭載用遮罩中,當作防止用於固定被設於基板等被搭載對象物的電極上之導電性球之助焊劑等,附著於遮罩內面之情事之目的,係使用於遮罩本體的內側,而且,形成有導電性球所通過之多數開口部之開口圖形周邊,形成有凹部之球搭載用遮罩。形成此凹部之方法,有例如在板厚較厚之遮罩本體的內側,抑制包圍開口圖形之凹部的緣部之電鍍突出之遮罩係被知曉(例如參照專利文獻1)。又,其他之球搭載用遮罩,也有使用並非於膜厚較厚之遮罩本體的內側,形成凹部之方法,而在遮罩本體的內側,使分離獨立之圓柱形或橢圓形之突起部,形成多數個之方法(例如參照專利文獻2)。 [專利文獻]In the mask for ball mounting, it is used for the purpose of preventing a flux or the like for fixing conductive balls provided on electrodes of objects to be mounted, such as a substrate, from adhering to the inner surface of the mask. In the inner side of the cover body, the periphery of the opening pattern of a plurality of openings through which the conductive balls pass, and the ball-mounting cover with recesses are formed. As a method of forming such a recess, for example, a mask which suppresses the protrusion of the plating on the edge of the recess surrounding the opening pattern on the inner side of the mask body having a relatively thick plate thickness is known (for example, refer to Patent Document 1). In addition, in other ball-mounting masks, instead of forming a concave portion on the inner side of the mask body with a relatively thick film thickness, separate cylindrical or elliptical protrusions are used on the inner side of the mask body. , a method of forming a plurality of them (for example, refer to Patent Document 2). [Patent Literature]
[專利文獻1]日本特開2010-247500號公報 〔專利文獻2〕日本特開2017-5023號公報[Patent Document 1] Japanese Patent Application Laid-Open No. 2010-247500 [Patent Document 2] Japanese Patent Application Laid-Open No. 2017-5023
在先前之專利文獻1所述之球搭載用遮罩中,係形成有凹部,使得以較厚之電鍍皮膜,完全包圍開口圖形周邊,所以,有水平方向之張力不施加於開口圖形周邊的凹部,在重要之開口圖形部產生撓曲或變形,變得較容易產生搭載不良之問題。又,在此製造方法中,係必須於工序中,為了在進行二次電鍍之前,形成凹部,而去除成為不需要之開口圖形部的一次電鍍電著層之工序(捨棄電鍍去除工序),但是,必須於複數個之各開口圖形,去除成為不需要之一次電鍍電著層,所以,為了適應量產而有時很費工時,而較難採用於量產。又,在專利文獻2所述之球搭載用遮罩中,在組裝到版框時,當由紗網所引起之張力施加於遮罩本體時,分離獨立之突起部可往力量施加之方向位移,所以,具有張力也作用於開口圖形部,在開口圖形部較難產生變形,被維持於水平方向之優點,但是,在其反面,因為遮罩本體的大部分係成為較薄之構造,所以,具有當作遮罩之耐久性,或因為施加於遮罩之張力,而較容易產生開口圖形部之經時變形或位置精度之偏移之問題。In the ball mounting mask described in the
本發明係為了解決如上述之課題所研發出者,其目的係在於提供一種在用於使遮罩內面之厚膜較厚之凸部,分離獨立之鄰接之開口圖形部間,形成膜厚般薄之凹槽,使得不以較厚之電鍍皮膜,完全包圍開口圖形部周邊,水平方向之張力作用於開口圖形部,以持續控制開口圖形部之變形或鬆弛,實現提高當作遮罩之耐久性,與開口圖形部之位置精度之球搭載用遮罩以及其製造方法。The present invention has been developed in order to solve the above-mentioned problems, and its object is to provide a convex portion for making the thick film on the inner surface of the mask thicker and the adjacent opening pattern portions separated and independent to form a film thickness. The thin groove makes it impossible to completely surround the periphery of the opening pattern with a thicker electroplating film. The tension in the horizontal direction acts on the opening pattern to continuously control the deformation or relaxation of the opening pattern, so as to improve the performance of the mask. Durability, positional accuracy of the opening pattern part of the ball mounting mask and its manufacturing method.
在本發明之球搭載用遮罩中,係包括:遮罩本體,由電鍍所形成,形成有被植入之導電性球所通過之多數開口部之開口圖形部,係在縱向及橫向上,配置有複數個,鄰接於開口圖形部之上下左右或傾斜上下左右,或者,上下、左右、傾斜上下左右之一部份之任一者之開口圖形部間,係藉連結凹槽連結;以及複數凸部,彼此分離獨立,由電鍍所形成,往並非導電性球被植入之側,而成為與搭載導電性球之被搭載物的電極相向之側之遮罩本體內面的開口圖形部以外,局部性地突出;分離獨立之複數凸部,係比開口圖形部及連結凹槽之板厚還要厚,而提高遮罩本體之耐久性,分離獨立之複數凸部,係其周緣邊緣部被形成為具有圓度之R形。In the ball-mounting mask of the present invention, it includes: a mask body formed by electroplating, an opening pattern part formed with a plurality of openings through which the implanted conductive balls pass, and which are fastened in the longitudinal direction and the lateral direction, There are a plurality of them, which are adjacent to the upper, lower, left and right or inclined up, down, left and right of the opening pattern portion, or between the opening pattern portions of any one of the up and down, left and right, inclined up, down, left and right parts, and are connected by connecting grooves; and a plurality of The protrusions are separated and independent from each other, formed by electroplating, and are not on the side where the conductive balls are implanted, but on the side opposite to the electrode of the object on which the conductive balls are mounted. , locally protruding; the separate and independent plural convex parts are thicker than the plate thickness of the opening pattern part and the connecting groove, so as to improve the durability of the mask body, and the isolated and independent plural convex parts are the peripheral edge parts It is formed into an R shape with roundness.
分離獨立之複數凸部係由內部凸部及外部凸部所構成,該內部凸部係藉第1電鍍層,被形成於與被搭載物無接觸之側,呈突出形狀,該外部凸部係一體形成於內部凸部的表面,使得藉與第1電鍍層不同之第2電鍍層,覆蓋內部凸部的周側面及被搭載物側下表面,成為與被搭載物的電極相向之側,分離獨立之複數凸部,係比開口圖形部及連結凹槽之板厚還要厚,以提高遮罩本體之耐久性。A plurality of separate and independent convex portions are composed of an inner convex portion and an outer convex portion. The inner convex portion is formed on the side not in contact with the object to be mounted by the first plating layer, and has a protruding shape. The outer convex portion is a protruding portion. It is integrally formed on the surface of the inner convex portion, so that the peripheral side surface of the inner convex portion and the lower surface of the object to be mounted are covered by a second plating layer different from the first plating layer, and the side facing the electrode of the object to be mounted is separated. The independent plural convex parts are thicker than the plate thickness of the opening pattern part and the connecting groove, so as to improve the durability of the mask body.
又,在本發明之球搭載用遮罩之製造方法中,係包括:遮罩本體,由電鍍所形成,形成有被植入之導電性球所通過之多數開口部之開口圖形部,係在縱向及橫向上,配置有複數個,鄰接於開口圖形部之上下左右或傾斜上下左右,或者,上下、左右、傾斜上下左右之一部份之任一者之開口圖形部間,係藉連結凹槽連結;以及複數凸部,彼此分離獨立,由電鍍所形成,往並非導電性球被植入之側,而是往成為與搭載導電性球之被搭載物的電極相向之側之遮罩本體內面的開口圖形部以外,局部性地突出;分離獨立之複數凸部,係由內部凸部及外部凸部所構成,該內部凸部係由藉第1電鍍層,被形成於與被搭載物無接觸之側之未被剝離地殘留之殘留電鍍部分所構成,該外部凸部,係一體形成於內部凸部的表面,藉與第1電鍍層不同之第2電鍍層,覆蓋內部凸部的周側面及被搭載物側下表面,成為與被搭載物的電極相向之側,遮罩本體係藉第2電鍍層,與外部凸部一體形成,第1電鍍層的殘留電鍍部分與第2電鍍層相重疊所形成之分離獨立之複數凸部,比開口圖形部及連結凹槽之板厚還要厚,以提高遮罩本體之耐久性,分離獨立之複數凸部,係其周緣邊緣部被形成為具有圓度之R形,其中,其包括:在不銹鋼母材上,形成凸部形成用之感光膜層之工序;電鍍於不銹鋼母材上,使得凸部成為既定之高度,藉此,形成一次電鍍層之工序;如果一次電鍍層之形成結束後,去除凸部形成用之感光膜層之工序;去除由一次電鍍層所形成,未剝離地殘留之一次殘留電鍍部分,所構成之內部凸部形成部分以外的開口圖形部及連結開口圖形部間的全部之連結凹槽的形成部分的一次電鍍層,在不銹鋼母材上,殘留由一次殘留電鍍層所做之內部凸部之工序;在不銹鋼母材上的內部凸部間,形成複數之開口部形成用之感光膜層之工序;電鍍於不銹鋼母材上及內部凸部上,使得遮罩本體成為指定之厚度,藉此,一體形成由二次電鍍層所做之開口圖形部、連結凹槽、及外部凸部之工序;如果二次電鍍層之形成結束後,去除複數之開口部形成用之感光膜層之工序;以及自不銹鋼母材,剝離由成為遮罩本體之一次電鍍層的殘留電鍍部分所構成之內部凸部、及由二次電鍍層所構成之外部凸部、該開口圖形部及連結部之工序。Further, in the method of manufacturing a ball-mounting mask of the present invention, the mask body is formed by electroplating, and an opening pattern portion having a plurality of openings through which the implanted conductive balls pass is formed, and the mask body is formed on the Vertically and horizontally, there are a plurality of them, which are adjacent to the top, bottom, left, right, or inclined up, down, left, and right of the opening pattern portion, or between the open pattern portions of any one of the up and down, left, right, and inclined top, bottom, left, and right portions, by connecting concave portions. The grooves are connected; and a plurality of protrusions, separated and independent from each other, are formed by electroplating, and are not on the side where the conductive balls are implanted, but on the side that faces the electrodes of the mounted object on which the conductive balls are mounted. In addition to the opening pattern part on the inner surface, it protrudes locally; a plurality of separate and independent convex parts are composed of an inner convex part and an outer convex part, and the inner convex part is formed by the first electroplating layer on and mounted on. It consists of a residual plating portion that is not peeled off and remains on the non-contact side. The outer convex portion is integrally formed on the surface of the inner convex portion, and the inner convex portion is covered by a second plating layer different from the first plating layer. The peripheral side surface and the lower surface of the object to be mounted become the side facing the electrode of the object to be mounted, and the mask body is formed integrally with the external convex part by the second plating layer, and the residual plating part of the first plating layer is connected with the second plating layer. The separate and independent protruding parts formed by the overlapping of the electroplating layers are thicker than the plate thickness of the opening pattern part and the connecting groove to improve the durability of the mask body. The separate and independent protruding parts are the peripheral edge parts It is formed into an R shape with roundness, which includes: a process of forming a photosensitive film layer for forming a convex portion on a stainless steel base material; electroplating on the stainless steel base material so that the convex portion has a predetermined height, thereby , the process of forming a primary electroplating layer; if the formation of the primary electroplating layer is completed, the process of removing the photosensitive film layer for forming the convex portion; A process in which the primary plating layer of the opening pattern part other than the inner convex part forming part and the connecting groove forming part connecting all the opening pattern parts is left on the stainless steel base material by the inner convex part made by the primary residual plating layer ; The process of forming a plurality of photosensitive film layers for the formation of openings between the internal convex parts on the stainless steel base material; Electroplating on the stainless steel base material and the internal convex parts, so that the mask body has a specified thickness, thereby, The process of integrally forming the opening pattern portion, the connecting groove, and the external convex portion by the secondary plating layer; if the formation of the secondary plating layer is completed, the process of removing the photosensitive film layer for forming the plurality of openings; and The process of peeling off the inner convex portion composed of the residual plating portion of the primary plating layer that becomes the mask body, the outer convex portion composed of the secondary plating layer, the opening pattern portion and the connecting portion from the stainless steel base material.
又,由電鍍所形成,形成有被植入之導電性球所通過之多數開口部之開口圖形部,係在縱向及橫向上,配置有複數個,鄰接於開口圖形部之上下或左右,或者,傾斜上下左右之任一者之開口圖形部的一部份,係藉連結凹槽連結,其中,其包括去除由以一次電鍍層而形成之未剝離以殘留之一次殘留電鍍部分,所構成之內部凸部形成部分以外的開口圖形部及連結開口圖形部間的一部份之連結凹槽的形成部分的一次電鍍層,在不銹鋼母材上,殘留由一次殘留電鍍層所做之內部凸部之工序。 [發明效果]In addition, an opening pattern portion formed by electroplating and formed with a plurality of opening portions through which the implanted conductive balls pass, is arranged in a plurality of vertical and horizontal directions, and is adjacent to the upper and lower or left and right of the opening pattern portion, or , a part of the opening pattern part of any one of the top, bottom, left, right, and left is connected by connecting grooves, wherein, it includes removing the primary residual electroplating part formed by the primary electroplating layer that is not peeled off to remain, and is constituted by The primary plating layer of the opening pattern part other than the inner convex part forming part and the connecting groove forming part connecting part of the opening pattern part, on the stainless steel base material, the inner convex part made of the primary residual plating layer remains process. [Inventive effect]
當依據本發明時,可形成用於分離獨立遮罩內面之厚膜較厚之凸部之膜厚般薄之凹槽,使得不以較厚之電鍍皮膜,完全包圍開口圖形部周邊地,往版框組裝時,由紗網所造成之水平方向之張力係作用於在開口圖形部,而可持續控制開口圖形部之變形或鬆弛,實現提高當作遮罩之耐久性與開口圖形部之位置精度。According to the present invention, it is possible to form a groove as thin as a thick film for separating the thick film on the inner surface of the independent mask and the convex part with a thick film thickness, so that the perimeter of the opening pattern part is not completely surrounded by the thick electroplating film. When assembling the frame, the tension in the horizontal direction caused by the gauze acts on the opening pattern part, and the deformation or relaxation of the opening pattern part can be controlled continuously, so as to improve the durability of the mask and the relationship between the opening pattern part. position accuracy.
實施例1.
針對本發明之實施例1中之球搭載用遮罩之構造,係藉圖1~圖4以說明之。
本發明之球搭載用遮罩1,當俯視觀之時,係使形成有導電性球(未圖示)所通過之多數之開口部2之四角形之開口圖形部3,在縱向及橫向上,很規則地排列配置之球搭載用遮罩。在此實施例中,係表示使四角形之開口圖形部3,在上下之垂直方向上,有4列,在左右之水平方向上,有7列,合計配置有28個之情形。而且,彼此鄰接之四角形之開口圖形部3,係藉在上下左右之四邊之各中央部,往上下之垂直方向及左右之水平方向延伸之連結凹槽4,連結開口圖形部間。此四角形之開口圖形部3與連結凹槽4,彼此被連結為一連串之情事,係在敘述於後之製造方法中,於被剝離以去除之一次電鍍層(捨棄電鍍)之剝離作業時,具有重要之意義。四角形之開口圖形部3與連結凹槽4,係藉由以較薄之板厚所構成之二次電鍍層所做之第2電鍍層,連結形成。球搭載用遮罩1之四角形之開口圖形部3及連結凹槽4以外的部分,係被形成為板厚比四角形之開口圖形部3及連結凹槽4還要厚之彼此分離獨立之複數之凸部5。此分離獨立之複數之凸部5,係由內部凸部及外部凸部所構成,該內部凸部係由藉第1電鍍層,而未被剝離地殘留之殘留電鍍層所構成,該外部凸部係由覆蓋內部凸部的外周全表面之第2電鍍層所形成,往成為與被搭載物的電極相向之側之遮罩本體的被搭載物面側,突出形成者。而且,藉此分離獨立之複數之凸部5之存在,做為球搭載用遮罩1之強度係被提高。在此實施例中,係表示使分離獨立之複數之凸部5,在上下之垂直方向上,有5列,在左右之水平方向上,有8列,合計配置有40個之情形。分離獨立之複數之凸部5之中,被配置於中央部之垂直方向之3列,水平方向之6列,合計18個之凸部5a,係在俯視時,呈十字形。此十字形之凸部5a,係上下左右4個之開口圖形部3之四角形中之一角,係吃入上下左右之四個角落部。又,分離獨立之複數之凸部5之中,除去四個角落部,被配置於上下左右邊之周緣部之18個之凸部5b,係在俯視時,呈「凸」字形。此18個之「凸」字形之凸部5b之中,於上側邊,被配置於水平方向上之6個之凸部5b,係上部左右兩個之開口圖形部3之四角形中之一角,吃入下部左右兩側之兩個角落部。此18個之「凸」字形之凸部5b之中,於下側邊,被配置於水平方向上之6個之凸部5b,係下部左右兩個之開口圖形部3之四角形中之一角,吃入上部左右兩側之兩個角落部。此18個之「凸」字形之凸部5b之中,於右側邊,被配置於垂直方向上之三個之凸部5b,係右部上下兩個之開口圖形部3之四角形中之一角,吃入左部上下兩側之兩個角落部。此18個之「凸」字形之凸部5b之中,於左側邊,被配置於垂直方向上之三個之凸部5b,係左部上下之兩個之開口圖形部3之四角形中之一角,吃入左部上下兩側之兩個角落部。分離獨立之複數之凸部5之中,被配置於四個角落部之4個之凸部5c,係在俯視中,呈L字形。此L字形之凸部5c之中,被配置於上部左右兩個之角落部之兩個之凸部5c,係上部之開口圖形部3之四角形中之一角,吃入下部左側或下部右側之角落部。此L字形之凸部5c之中,被配置於下部左右兩個之角落部之兩個之凸部5c,係下部之開口圖形部3之四角形中之一角,吃入上部左側或上部右側之角落部。又,分離獨立之40個之凸部5的尖端部,如圖2及圖3所示,係周緣邊緣部被形成為具有圓度之R形。而且,在圖2所示之剖面圖中,為了簡化,係省略在四角形之開口圖形部3,形成有多數個之開口部2。Example 1.
The structure of the ball-mounting mask in
藉圖5說明本發明之實施例1中之球搭載用遮罩之製造方法。首先,貼合感光膜到不銹鋼母材6上,進行需要之曝光及顯影處理,於不銹鋼母材6上,局部性地形成凸部形成用之感光膜層7(參照圖5(a))。而且,雖然在本發明之專利說明書中,係使用底片式感光膜,但是,使用之感光膜也可以係液體感光膜。此凸部形成用之感光膜層7,雖然係例如突條、線狀等,但是,也可以係多角形等,並不侷限於突條、線狀。接著,藉電鍍於不銹鋼母材6上的全體,而例如形成一次電鍍層8,使得厚度成為約20~30μm(參照圖5(b))。此時,被形成之一次電鍍層8,係被分為一次殘留電鍍部分8a及一次捨棄電鍍部分8b,一次殘留電鍍部分8a係成為分離獨立之複數之凸部5的基礎(基底),一次捨棄電鍍部分8b係在下一工序中,被剝離以去除。而且,如果一次電鍍層8之形成結束後,去除凸部形成用之感光膜層7(參照圖5(c))。而且,在此狀態中,當俯視時,彼此鄰接之四角形之開口圖形部3,係藉在上下左右之四邊之各中央部,往上下垂直方向及左右水平方向延伸之連結凹槽4而被連結,此四角形之開口圖形部3與連結凹槽4,係彼此被連結為一連串,藉此,一次電鍍層8係可一次全部,僅剝離成為分離獨立之複數之凸部5的基礎(基底)之一次殘留電鍍部分8a以外之被剝離去除之一次捨棄電鍍部分8b(參照圖5(d))。接著,全部去除成為分離獨立之複數之凸部5的基礎(基底)之一次殘留電鍍部分8a以外的一次捨棄電鍍部分8b,在不銹鋼母材6上,僅殘留成為分離獨立之複數之凸部5的基礎(基底)之一次殘留電鍍部分8a,形成由第1電鍍層所構成之厚度約20~30μm之內部凸部(參照圖5(e))。而且,雖然省略圖示及詳細說明,但是,於不銹鋼母材6上之四角形之開口圖形部3之形成位置,貼合周知之開口部形成用之感光膜,進行圖形曝光及顯影等之處理,形成導電性球所通過之開口部2用之感光膜。接著,電鍍於不銹鋼母材6上及成為分離獨立之複數凸部的基礎(基底)之一次殘留電鍍部分8a上,使得遮罩本體成為指定之厚度,例如約30μm,藉此,形成二次電鍍層9(參照圖5(f))。藉此,形成由覆蓋內部凸部的外周全表面之第2電鍍層所構成之外部凸部。最後,自不銹鋼母材6剝離遮罩本體,該遮罩本體係包括成為分離獨立之複數之凸部5的基礎(基底)之一次殘留電鍍部分8a、及由二次電鍍層9所構成之四角形之開口圖形部3、及被形成為比連結凹槽4還要厚(例如厚度50~60μm)之彼此分離獨立之複數之凸部5(參照圖5(g))。藉此,完成球搭載用遮罩,該球搭載用遮罩係包括被形成為比本發明之四角形之開口圖形部3及連結凹槽4還要厚之彼此分離獨立之複數之凸部5。形成有導電性球所貫穿之複數之開口部2a之四角形之開口圖形部3,係球搭載領域。而且,完成之球搭載用遮罩1之分離獨立之複數之凸部5的尖端部,係其周緣邊緣部不成為角形,而成為具有圓度之R形。Referring to FIG. 5 , a method of manufacturing the ball-mounting mask in
由二次電鍍層9之厚度(例如約30μm)所構成之連結凹槽4,雖然不必連結開口圖形部3的全部,但是,當考慮到來自紗網之張力,最大限度作用於開口圖形部3之效果,或於一次電鍍後,成為不需要之捨棄電鍍去除作業之工時時,最好即使僅至少上下(縱向)或左右(橫向),或者,傾斜上下左右之任一方向,也以凹槽加工連結鄰接之全部之開口圖形部。Although the connecting
在遮罩本體的圖形區域外周的非圖形區域,施做僅以二次電鍍層之厚度所形成之較薄之板厚部分,藉此,也可確認到形成有開口部之圖形區域內,作用更多水平方向之張力之效果,所以,即使在遮罩本體上的非圖形區域,故意形成僅以二次電鍍層所形成之膜厚般薄之部分,也沒關係。In the non-pattern area of the outer periphery of the pattern area of the mask body, a relatively thin plate thickness formed only by the thickness of the secondary plating layer is applied, thereby, it can also be confirmed in the pattern area where the opening is formed. There is more effect of tension in the horizontal direction, so even if the non-pattern area on the mask body is deliberately formed as thin as the film thickness formed by the secondary plating layer, it does not matter.
為了防止附著助焊劑,在遮罩本體的被搭載物面側(內側),係存在有形成複數圓柱或橢圓形之突起之導電性球搭載用遮罩,但是,遮罩用圖檔係需要配置這些複數突起到開口圖形周邊部之圖檔處理作業。導電性球搭載用遮罩的圖形,係一點一樣地存在有各種大小之圖形,所以,如專利文獻2所示,配置分離獨立之複數突起到遮罩圖檔之作業係很煩雜。相對於此,本發明之導電性球搭載用遮罩,係凸部形成用之圖檔非常地單純且被簡化,所以,具有可大幅縮短花費於圖檔處理作業之作業時間之優點,在製作圖檔之面,也可期待謀求提高作業效率之效果。In order to prevent the adhesion of flux, there is a mask for mounting conductive balls that forms a plurality of cylindrical or elliptical protrusions on the surface of the object to be mounted (inside) of the mask body. However, a mask image file is required. The image processing operation of these plural protrusions to the peripheral portion of the opening pattern. The pattern of the mask for mounting a conductive ball has patterns of various sizes uniformly, so as shown in
實施例2.
藉圖6~圖9,說明本發明之實施例2中之球搭載用遮罩之構造。
本發明之球搭載用遮罩1,當俯視時,係使形成有導電性球(未圖示)所通過之多數開口部2之四角形之開口圖形部3,在縱向及橫向上,規則地排列配置之球搭載用遮罩,在此實施例中,係表示使四角形之開口圖形部3,在上下之垂直方向有8列,在左右之水平方向有6列,合計配置有48個之情形。而且,在左右之水平方向上,彼此鄰接之四角形之開口圖形部3,係藉在左右兩邊的各中央部,於左右之水平方向上延伸之連結凹槽4而連結。在於此左右之水平方向上,彼此鄰接之四角形之開口圖形部3與連結凹槽4,彼此被連結成一連串之情事,係與實施例1同樣之製造方法中,係在被剝離以去除之一次電鍍(捨棄電鍍)之剝離作業時,具有重要之意味。四角形之開口圖形部3與連結凹槽4,係藉以較薄之板厚所構成之二次電鍍層,而連結形成。球搭載用遮罩1之四角形之開口圖形部3及連結凹槽4以外的部分,係被形成為比四角形之開口圖形部3及連結凹槽4還要厚之彼此分離獨立之複數(9個)之凸部5。藉此分離獨立之複數之凸部5之存在,當作球搭載用遮罩1之強度係被提高。在此實施例中,係表示使分離獨立以在水平方向上延伸之凸部5,在上下方向上,隔開既定間隔以配置有9列情形。分離獨立之複數之凸部5之中,被配置於中央部之在水平方向上延伸之7個之凸部5d,係寬度比被配置於上端部及下端部之被配置於水平方向之兩個之凸部5e,還要窄之構造。分離獨立之複數之凸部5之中,被配置於中央部之於水平方向上延伸之7個之凸部5d,係在俯視時,上下邊係分別與四角形之開口圖形部3及連結凹槽4相接,中央部上下邊係成鋸齒狀。又,分離獨立之複數之凸部5之中,被配置於上端部及下端部之在水平方向上延伸之兩個之較寬之凸部5e,係在俯視時,上端部之較寬之凸部5e的中央部下邊及下端部之較寬之凸部5e的中央部上邊,係分別與四角形之開口圖形部3及連結凹槽4相接,中央部下邊或上邊係成鋸齒狀。又,分離獨立之9個之凸部5的尖端部,如圖7及圖8所示,周緣邊緣部係被形成為具有圓度之R形。Example 2.
With reference to FIGS. 6 to 9 , the structure of the ball mounting mask in the second embodiment of the present invention will be described.
In the
在上述實施例1中之球搭載用遮罩之製造方法中,係說明使彼此鄰接之四角形之開口圖形部3,與在上下左右之四邊之各中央部,於上下垂直方向及左右水平方向上延伸之連結凹槽4,彼此連結,僅一次全部剝離成為分離獨立之複數之凸部5的基礎(基底)之一次殘留電鍍部分8a以外的被剝離以去除之一次捨棄電鍍部分8b之情事。在本發明之實施例2中之球搭載用遮罩之製造方法中,於左右之水平方向上,彼此鄰接之四角形之開口圖形部3,係僅藉在左右之兩邊之各中央部,於左右之水平方向上延伸之連結凹槽4而連結,鄰接於上下之垂直方向等之開口圖形部3,係未藉連結凹槽4連結,但是,使僅以由與連結凹槽同等薄度所構成之二次電鍍層所形成之區域,設於遮罩本體的圖形區域外周部,以連結凹槽連接此圖形區域外周部與開口圖形部,與實施例1同樣地,即使係僅一個方向之連結,也可以一次全部剝離成為分離獨立之複數之凸部5的基礎(基底)之一次殘留電鍍部分8a以外的被剝離以去除之一次捨棄電鍍部分8b全部。又,與實施例2同樣地,例如即使僅以上下垂直方向之一個方向,彼此鄰接之開口圖形部被連結時,如果設置只有二次電鍍層之較薄板厚之區域,於遮罩本體的圖形區域外周部,以連結凹槽連接此圖形區域外周部與開口圖形部時,捨棄電鍍部分8b係可一次全部一起剝離。In the manufacturing method of the ball-mounting mask in the above-mentioned
實施例3.
藉圖10說明本發明之實施例3中之球搭載用遮罩之構造。
本發明之球搭載用遮罩1,係大概構成與實施例2同樣,當俯視時,係使形成有導電性球(未圖示)所通過之多數之開口部2之四角形之開口圖形部3,在縱向及橫向上,規則地排列配置之球搭載用遮罩,在此實施例中,係表示使四角形之開口圖形部3,在上下之垂直方向上有4列,在左右之水平方向上有7列,合計配置有28個之情形。而且,在左右之水平方向上,彼此鄰接之四角形之開口圖形部3,係藉在左右兩邊的各中央部,於左右之水平方向上延伸之連結凹槽4而被連結。四角形之開口圖形部3與連結凹槽4,係藉以較薄之板厚所構成之二次電鍍層而連結形成。球搭載用遮罩1之四角形之開口圖形部3及連結凹槽4以外的部分,係被形成為成為比四角形之開口圖形部3及連結凹槽4還要厚之板厚之彼此分離獨立之複數(5個)之凸部5。藉此分離獨立之複數之凸部5之存在,當作球搭載用遮罩1之強度係被提高。在此實施例中,係表示使分離獨立以在水平方向上延伸之凸部5,在上下方向上,隔開既定間隔以配置有5列之情形。分離獨立之複數之凸部5之中,被配置於中央部之在水平方向上延伸之三個之凸部5d,係寬度比被配置於上端部及下端部之被配置於水平方向上之兩個之凸部5e還要寬一些之構造。分離獨立之複數之凸部5之中,被配置於中央部之於水平方向上延伸之三個之凸部5d,係當俯視時,上下邊係分別與四角形之開口圖形部3及連結凹槽4相接,中央部上下邊係成為鋸齒狀。又,分離獨立之複數之凸部5之中,被配置於上端部及下端部之於水平方向上延伸之兩個之窄一些之凸部5e,係當俯視時,上端部的凸部5e的中央部下邊及下端部的凸部5e的中央部上邊,係分別與四角形之開口圖形部3及連結凹槽4相接,中央部下邊或上邊係成為鋸齒狀。又,分離獨立之5個之凸部5的尖端部,係周緣邊緣部被形成為具有圓度之R形。在此實施例3中,係故意在位於彼此分離獨立之複數(5個)之凸部5之更外周之部分(遮罩本體的圖形區域外周的非圖形區域),形成僅以二次電鍍層形成之膜厚般薄之部分。Example 3.
Referring to FIG. 10, the structure of the mask for ball mounting in the third embodiment of the present invention will be described.
The ball-mounting
實施例4.
藉圖11說明本發明之實施例4中之球搭載用遮罩之構造。
本發明之球搭載用遮罩1,當俯視時,係使形成有導電性球(未圖示)所通過之多數之開口部2之四角形之開口圖形部3,在縱向及橫向上,規則地排列配置之球搭載用遮罩,在此實施例中,係表示使四角形之開口圖形部3,在上下之垂直方向上有4列,左右之水平方向上有6列,合計配置有24個之情形。在上下之垂直方向上,彼此鄰接之四角形之開口圖形部3,係藉在開口圖形部3的左右兩側端部的兩處,於上下之垂直方向上延伸之連結凹槽4而被連結。四角形之開口圖形部3與連結凹槽4,係藉由較薄之板厚所構成之二次電鍍層,而連結形成。球搭載用遮罩1之四角形之開口圖形部3及連結凹槽4以外的部分,係被形成為成為比四角形之開口圖形部3及連結凹槽4還要厚之彼此分離獨立之複數(37個)之凸部5。藉此分離獨立之複數之凸部5之存在,當作球搭載用遮罩1之強度係被提高。在此實施例中,係表示分離獨立之複數之凸部5之中,使在上下之垂直方向上連續延伸之縱長之凸部5f,在左右之水平方向上,隔開既定間隔以配置7個(7列),分離獨立之複數之凸部5之中,使於縱長之凸部5f之間,而且使開口圖形部3配置於中間部,於上下之垂直方向上,被間歇性地配置之5個之四角形之凸部5g,配置有6列之情形。分離獨立之複數之凸部5之中,於上下之垂直方向上延伸之7個之縱長之凸部5f,當俯視時,內側之4個之左右兩側端部,係分別與四角形之開口圖形部3及連結凹槽4相接,縱長之凸部5f之中,被配置於左右兩側端部之兩個,係右側端部或左側端部,分別與四角形之開口圖形部3及連結凹槽4相接。又,於縱長之凸部5f之間,而且配置開口圖形部3於中間部,以在上下之垂直方向上,被間歇性地配置之5個之四角形之凸部5g之中,中央部的三個,在俯視時,係左右兩側端部及上下兩端部,分別與四角形之開口圖形部3及連結凹槽4相接。又,於縱長之凸部5f之間,而且配置開口圖形部3於中間部,以在上下之垂直方向上,被間歇性地配置之5個之四角形之凸部5g之中,上下端部的兩個,在俯視時,係左右兩側端部及下端部或上端部,分別與四角形之開口圖形部3及連結凹槽4相接。又,分離獨立之37個之凸部5之尖端部,係周緣邊緣部被形成為具有圓度之R形。Example 4.
Referring to FIG. 11, the structure of the ball-mounting mask according to the fourth embodiment of the present invention will be described.
The ball-mounting
實施例5.
藉圖12說明本發明之實施例5中之球搭載用遮罩之構造。
本發明之球搭載用遮罩1係當俯視時,使形成有導電性球(未圖示)所通過之多數之開口部2之四角形之開口圖形部3,在縱向及橫向上,規則地排列配置之球搭載用遮罩,在此實施例中,係表示使四角形之開口圖形部3,在上下之垂直方向上有4列,左右之水平方向上有7列,合計配置有28個之情形。而且,彼此鄰接之四角形之開口圖形部3之中,於左側端部或右側端部,各配置有4個之四角形之開口圖形部3,係藉在上下之兩邊之各中央部,於上下之垂直方向上延伸之連結凹槽4,上下鄰接之開口圖形部3間之全部係被連結。又,彼此鄰接之四角形之開口圖形部3之中,中央部的被配置成縱5列之20個之四角形之開口圖形部3,係藉在上下之兩邊的各中央部及下邊中央部或上邊中央部,於上下之垂直方向上延伸之連結凹槽4,上下鄰接之開口圖形部3間的全部係被連結。彼此鄰接之四角形之開口圖形部3之中,被配置於最上側端部之7個之開口圖形部3,與被配置於最下側端部之7個之開口圖形部3,係藉於左右之水平方向上延伸之連結凹槽4,被連結於開口圖形部3的中央側邊。在此四角形之開口圖形部3與連結凹槽4,彼此被連結為一連串之情事,詳述於後之製造方法中,於被剝離以去除之一次電鍍層(捨棄電鍍)之剝離作業時,係具有重要之意味。四角形之開口圖形部3與連結凹槽4,係藉以較薄之板厚所構成之二次電鍍層所做之第2電鍍層,而被連結形成。球搭載用遮罩1之四角形之開口圖形部3及連結凹槽4以外的部分,係被形成為比四角形之開口圖形部3及連結凹槽4還要厚之彼此分離獨立之複數之凸部5。此分離獨立之複數之凸部5,係由內部凸部及外部凸部所構成,該內部凸部係由藉第1電鍍層,未被剝離地殘留之殘留電鍍層所構成,該外部凸部係由覆蓋內部凸部的外周全表面之第2電鍍層所形成,往成為與被搭載物的電極相向之側之遮罩本體的被搭載物面側,突出形成。而且,藉此分離獨立之複數之凸部5之存在,當作球搭載用遮罩1之強度係被提高。在此實施例中,係表示使分離獨立之複數之凸部5,在上下兩端部有兩個,在左右兩端部有兩個,在中央部有6個,合計配置有10個之情形。分離獨立之複數之凸部5之中,被配置於左右兩端部之垂直方向之兩個之凸部5h,在俯視時,彼此相向之側係呈鋸齒狀。分離獨立之複數之凸部5之中,被配置於上下兩端部之水平方向之兩個之凸部5h,在俯視時,彼此相向之側係呈鋸齒狀。又,分離獨立之複數之凸部5之中,被配置於中央部之6列,6個之凸部5i,在俯視時,係做成三層構造。又,分離獨立之10個之凸部5的尖端部,周緣邊緣部係被形成為具有圓度之R形。Example 5.
Referring to FIG. 12, the structure of the mask for ball mounting in the fifth embodiment of the present invention will be described.
In the
而且,在上述之實施例中,成為分離獨立之複數凸部的基礎(基底)之內部凸部之形成方法,有使在一次電鍍後,被去除之捨棄電鍍部以外的不銹鋼母材上,突出殘存之殘留電鍍部分,應用於內部凸部,但是,內部凸部之形成方法,並不只有剝離去除捨棄電鍍之做法。例如有以感光膜膜等,被覆成為內部凸部之部分以外,以一次電鍍,僅電鍍積層內部凸部部分之方法。又,也可以藉一次電鍍,而形成既定板厚之電鍍層之後,以感光膜膜等,被覆欲當作內部凸部以殘留之部分,以氯化鐵等之蝕刻,腐蝕此外之欲去除部分,而形成內部凸部。但是,當考慮到遮罩本體之板厚精度時,期望係如實施例所示,藉以一次電鍍去除捨棄電鍍之方法,而形成內部凸部,一體形成分離獨立之複數凸部,使得以由二次電鍍所做之第2電鍍層,覆蓋該內部凸部的外周之方法。Furthermore, in the above-mentioned embodiment, the method of forming the inner convex portion that is the base (base) of the separate and independent plural convex portions is to make the stainless steel base material other than the discarded plating portion removed after the primary plating to protrude. The remaining residual plating portion is applied to the inner convex portion, but the method of forming the inner convex portion is not only the method of peeling, removing and discarding the plating. For example, there is a method of coating only the inner convex portion with a photosensitive film or the like, and then plating only the inner convex portion by one-time electroplating. In addition, it is also possible to form an electroplating layer with a predetermined thickness by one electroplating, and then cover the part to be used as an internal convex part to remain with a photosensitive film, etc., and etch the other part to be removed by etching with ferric chloride or the like. , forming an internal convex portion. However, when considering the thickness accuracy of the mask body, as shown in the embodiment, it is desirable to use a method of removing electroplating by one time plating to form internal convex parts, and integrally form a plurality of separate and independent convex parts, so that two separate convex parts are formed. A method of covering the outer periphery of the inner convex portion with the second plating layer formed by the secondary plating.
1:球搭載用遮罩
2:開口部
3:開口圖形部
4:連結凹槽
5:分離獨立之複數凸部
5a:十字形之凸部
5b:凸字形之凸部
5c:L字形之凸部
5d:窄幅或寬幅之凸部
5e:寬幅或窄幅之凸部
5f:縱長之凸部
5g:四角形之凸部
5h:凸字形之凸部
5i:L字形之凸部
6:不銹鋼母材
7:凸部形成用之感光膜層
8:一次電鍍層
8a:一次殘留電鍍部分
8b:一次捨棄電鍍部分
9:二次電鍍層1: Mask for ball mounting
2: Opening
3: Opening graphic part
4: Connect the groove
5: Separate independent plural
〔圖1〕係表示本發明實施例1中之球搭載用遮罩之俯視圖。 〔圖2〕係表示本發明實施例1中之球搭載用遮罩之沿著圖1之A-A線之剖面圖。 〔圖3〕係表示本發明實施例1中之球搭載用遮罩之沿著圖1之B-B線之剖面圖。 〔圖4〕係表示本發明實施例1中之球搭載用遮罩之沿著圖1之C-C線之剖面圖。 〔圖5〕係以工序順序,表示本發明實施例1中之球搭載用遮罩之製造方法之剖面圖。 〔圖6〕係表示本發明實施例2中之球搭載用遮罩之俯視圖。 〔圖7〕係表示本發明實施例2中之球搭載用遮罩之沿著圖6之D-D線之剖面圖。 〔圖8〕係表示本發明實施例2中之球搭載用遮罩之沿著圖6之E-E線之剖面圖。 〔圖9〕係表示本發明實施例2中之球搭載用遮罩之沿著圖6之F-F線之剖面圖。 〔圖10〕係表示本發明實施例3中之球搭載用遮罩之俯視圖。 〔圖11〕係表示本發明實施例4中之球搭載用遮罩之俯視圖。 〔圖12〕係表示本發明實施例5中之球搭載用遮罩之俯視圖。[FIG. 1] is a plan view showing a ball mounting mask in Example 1 of the present invention. [Fig. 2] is a cross-sectional view taken along the line A-A in Fig. 1, showing the ball-mounting mask in Example 1 of the present invention. [FIG. 3] is a cross-sectional view taken along the line B-B of FIG. 1 of the ball mounting mask in Example 1 of the present invention. [ Fig. 4 ] is a cross-sectional view taken along line C-C of Fig. 1 of the ball-mounting mask according to the first embodiment of the present invention. [ Fig. 5 ] is a cross-sectional view showing, in order of steps, a method of manufacturing a ball-mounting mask in Example 1 of the present invention. [ Fig. 6 ] is a plan view showing a ball mounting mask in Example 2 of the present invention. [ Fig. 7 ] is a cross-sectional view taken along the line D-D in Fig. 6 of the ball mounting mask according to the second embodiment of the present invention. [ Fig. 8 ] is a cross-sectional view taken along the line E-E of Fig. 6 showing the ball mounting mask in the second embodiment of the present invention. [ Fig. 9 ] is a cross-sectional view taken along the line F-F of Fig. 6 of the ball mounting mask according to the second embodiment of the present invention. [ Fig. 10 ] is a plan view showing a ball mounting mask in Example 3 of the present invention. [ Fig. 11 ] is a plan view showing a ball mounting mask in Example 4 of the present invention. [ Fig. 12 ] is a plan view showing a ball mounting mask in Example 5 of the present invention.
1:球搭載用遮罩 1: Mask for ball mounting
2:開口部 2: Opening
3:開口圖形部 3: Opening graphic part
4:連結凹槽 4: Connect the groove
5a:十字形之凸部 5a: The convex part of the cross
5b:凸字形之凸部 5b: The convex part of the convex shape
5c:L字形之凸部 5c: L-shaped convex part
Claims (5)
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