JPWO2022045073A5 - - Google Patents
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- JPWO2022045073A5 JPWO2022045073A5 JP2022544591A JP2022544591A JPWO2022045073A5 JP WO2022045073 A5 JPWO2022045073 A5 JP WO2022045073A5 JP 2022544591 A JP2022544591 A JP 2022544591A JP 2022544591 A JP2022544591 A JP 2022544591A JP WO2022045073 A5 JPWO2022045073 A5 JP WO2022045073A5
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- Prior art keywords
- plating layer
- plating
- forming
- opening pattern
- convex portion
- Prior art date
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Claims (2)
前記分離独立した複数の凸部は、第１のメッキ層により前記被搭載物とは接触しない側に形成される、剥がされずに残留された残留メッキ部分からなる内部凸部と、前記内部凸部の表面に前記第１のメッキ層とは別の第２のメッキ層により前記内部凸部の周側面及び前記被搭載物側下面を覆うように一体的に形成され、前記被搭載物の電極と対向する側となる外部凸部とからなり、
前記マスク本体は、前記第２のメッキ層により前記外部凸部と一体的に形成されており、前記第１のメッキ層の残留メッキ部分と第２のメッキ層とが重なって形成された前記分離独立した複数の凸部は、前記開口パターン部及び前記連結溝の板厚よりも厚くなってマスク本体の耐久性を高めており、前記分離独立した複数の凸部は、その周縁エッジ部が丸味を持ったＲ形状に形成されるボール搭載用マスクの製造方法であって、
ＳＵＳ母材上に前記凸部形成用のレジスト層を形成する工程と、
前記凸部が所定の高さとなるようにＳＵＳ母材上にメッキすることにより、一次メッキ層を形成する工程と、
一次メッキ層の形成が終わったら、凸部形成用のレジスト層を除去する工程と、
一次メッキ層により形成され、剥がさずに残留させる一次残留メッキ部分からなる内部凸部形成部分以外の前記開口パターン部及び開口パターン部間の全てを連結する連結溝の形成部分の一次メッキ層を取り除き、ＳＵＳ母材上に一次残留メッキ層による内部凸部を残す工程と、
前記ＳＵＳ母材上の前記内部凸部間に複数の開口部形成用のレジスト層を形成する工程と、
前記マスク本体が指定の厚さとなるようにＳＵＳ母材上及び前記内部凸部上にメッキすることにより、二次メッキ層による開口パターン部、連結溝、及び外部凸部を一体的に形成する工程と、
二次メッキ層の形成が終わったら、前記複数の開口部形成用のレジスト層を除去する工程と、
前記ＳＵＳ母材からマスク本体となる前記一次メッキ層の残留メッキ部分からなる内部凸部、二次メッキ層からなる外部凸部、前記開口パターン部及び連結部を剥離する工程と、
を備えたことを特徴とするボール搭載用マスクの製造方法。 A plurality of opening pattern portions formed by plating and having a large number of opening portions through which the thrown conductive balls pass are arranged in the vertical direction and the horizontal direction, and the opening pattern portions are adjacent to the upper, lower, left, right, or diagonally upper, lower, left, and right, Alternatively, a mask main body in which opening pattern portions in any of upper, lower, left, right, or oblique upper, lower, left, and right portions are connected by connecting grooves, is formed by plating, and the conductive balls are mounted instead of the side on which the conductive balls are thrown. a plurality of projections that are separated and independent of each other and that partially protrude from the back surface of the mask body other than the opening pattern portion on the side facing the electrode of the object to be mounted,
The plurality of separated and independent protrusions are an internal protrusion formed by a first plating layer on a side not in contact with the mounted object and formed of a residual plating portion that is not peeled off and remains, and the internal protrusion. A second plated layer different from the first plated layer is integrally formed on the surface of the to cover the peripheral side surface of the inner convex portion and the lower surface on the side of the mounted object, and the electrode of the mounted object and the Consists of an external convex portion on the opposite side,
The mask main body is integrally formed with the external convex portion by the second plating layer, and the separation is formed by overlapping the residual plating portion of the first plating layer and the second plating layer. The plurality of independent projections are thicker than the plate thickness of the opening pattern portion and the connecting groove to enhance the durability of the mask body, and the plurality of separated and independent projections have rounded peripheral edge portions. A method for manufacturing a ball mounting mask formed in an R shape with
a step of forming a resist layer for forming the convex portion on the SUS base material;
a step of forming a primary plating layer by plating the SUS base material so that the convex portion has a predetermined height;
a step of removing the resist layer for forming the projections after the formation of the primary plating layer;
The primary plating layer is removed from the formation portion of the connecting groove connecting all of the opening pattern portions and the opening pattern portions other than the inner convex portion forming portion composed of the primary residual plating portion which is formed by the primary plating layer and remains without being peeled off. , a step of leaving an internal convex portion due to the primary residual plating layer on the SUS base material;
forming a resist layer for forming a plurality of openings between the inner protrusions on the SUS base material;
A step of integrally forming opening pattern portions, connecting grooves, and external projections by a secondary plating layer by plating the SUS base material and the internal projections so that the mask body has a specified thickness. and,
After finishing the formation of the secondary plating layer, removing the resist layer for forming the plurality of openings;
a step of peeling off an inner convex portion composed of a residual plated portion of the primary plating layer, an outer convex portion composed of a secondary plating layer, the opening pattern portion, and the connecting portion from the SUS base material;
A method of manufacturing a ball mounting mask, comprising:
前記分離独立した複数の凸部は、第１のメッキ層により前記被搭載物とは接触しない側に形成される、剥がされずに残留された残留メッキ部分からなる内部凸部と、前記内部凸部の表面に前記第１のメッキ層とは別の第２のメッキ層により前記内部凸部の周側面及び前記被搭載物側下面を覆うように一体的に形成され、前記被搭載物の電極と対向する側となる外部凸部とからなり、
前記マスク本体は、前記第２のメッキ層により前記外部凸部と一体的に形成されており、前記第１のメッキ層の残留メッキ部分と第２のメッキ層とが重なって形成された前記分離独立した複数の凸部は、前記開口パターン部及び前記連結溝の板厚よりも厚くなってマスク本体の耐久性を高めており、前記分離独立した複数の凸部は、その周縁エッジ部が丸味を持ったＲ形状に形成されるボール搭載用マスクの製造方法であって、
ＳＵＳ母材上に前記凸部形成用のレジスト層を形成する工程と、
前記凸部が所定の高さとなるようにＳＵＳ母材上にメッキすることにより、一次メッキ層を形成する工程と、
一次メッキ層の形成が終わったら、凸部形成用のレジスト層を除去する工程と、
一次メッキ層により形成され、剥がさずに残留させる一次残留メッキ部分からなる内部凸部形成部分以外の前記開口パターン部及び開口パターン部間の一部を連結する連結溝の形成部分の一次メッキ層を取り除き、ＳＵＳ母材上に一次残留メッキ層による内部凸部を残す工程と、
前記ＳＵＳ母材上の前記内部凸部間に複数の開口部形成用のレジスト層を形成する工程と、
前記マスク本体が指定の厚さとなるようにＳＵＳ母材上及び前記内部凸部上にメッキすることにより、二次メッキ層による開口パターン部、連結溝、及び外部凸部を一体的に形成する工程と、
二次メッキ層の形成が終わったら、前記複数の開口部形成用のレジスト層を除去する工程と、
前記ＳＵＳ母材からマスク本体となる前記一次メッキ層の残留メッキ部分からなる内部凸部、二次メッキ層からなる外部凸部、前記開口パターン部及び連結部を剥離する工程と、
を備えたことを特徴とするボール搭載用マスクの製造方法。 A plurality of opening pattern portions formed by plating and having a large number of opening portions through which spun-in conductive balls pass are arranged in the vertical direction and the horizontal direction, and part of the opening pattern portions adjacent to the opening pattern portions The mask main body connected by the connecting groove, and the opening pattern portion formed by plating on the back surface of the mask main body, which is not the side on which the conductive balls are thrown, but the side facing the electrodes of the mounted object on which the conductive balls are mounted. A plurality of protrusions partially protruded in addition to each other and separated and independent from each other,
The plurality of separated and independent protrusions are an internal protrusion formed by a first plating layer on a side not in contact with the mounted object and formed of a residual plating portion that is not peeled off and remains, and the internal protrusion. A second plated layer different from the first plated layer is integrally formed on the surface of the to cover the peripheral side surface of the inner convex portion and the lower surface on the side of the mounted object, and the electrode of the mounted object and the Consists of an external convex portion on the opposite side,
The mask main body is integrally formed with the external convex portion by the second plating layer, and the separation is formed by overlapping the residual plating portion of the first plating layer and the second plating layer. The plurality of independent projections are thicker than the plate thickness of the opening pattern portion and the connecting groove to enhance the durability of the mask body, and the plurality of separated and independent projections have rounded peripheral edge portions. A method for manufacturing a ball mounting mask formed in an R shape with
a step of forming a resist layer for forming the convex portion on the SUS base material;
a step of forming a primary plating layer by plating the SUS base material so that the convex portion has a predetermined height;
a step of removing the resist layer for forming the projections after the formation of the primary plating layer;
The primary plating layer is formed of the primary plating layer, and the primary plating layer is formed of the connecting groove forming portion that connects the opening pattern portion and the portion between the opening pattern portions other than the inner convex portion forming portion composed of the primary residual plating portion that is left without being peeled off. A step of removing and leaving an internal convex portion due to the primary residual plating layer on the SUS base material;
forming a resist layer for forming a plurality of openings between the inner protrusions on the SUS base material;
A step of integrally forming opening pattern portions, connecting grooves, and external projections by a secondary plating layer by plating the SUS base material and the internal projections so that the mask body has a specified thickness. and,
After finishing the formation of the secondary plating layer, removing the resist layer for forming the plurality of openings;
a step of peeling off an inner convex portion composed of a residual plated portion of the primary plating layer, an outer convex portion composed of a secondary plating layer, the opening pattern portion, and the connecting portion from the SUS base material;
A method for manufacturing a ball mounting mask, comprising:
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020142553 | 2020-08-26 | ||
| JP2020142553 | 2020-08-26 | ||
| PCT/JP2021/030829 WO2022045073A1 (en) | 2020-08-26 | 2021-08-23 | Ball mounting mask and method for manufacturing same |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022045073A1 JPWO2022045073A1 (en) | 2022-03-03 |
| JPWO2022045073A5 true JPWO2022045073A5 (en) | 2023-02-24 |
| JP7348693B2 JP7348693B2 (en) | 2023-09-21 |
Family
ID=80353365
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022544591A Active JP7348693B2 (en) | 2020-08-26 | 2021-08-23 | Ball mounting mask and its manufacturing method |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7348693B2 (en) |
| KR (1) | KR20230028498A (en) |
| CN (1) | CN116235284A (en) |
| TW (1) | TWI776652B (en) |
| WO (1) | WO2022045073A1 (en) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4512772B2 (en) * | 2004-02-23 | 2010-07-28 | 株式会社プロセス・ラボ・ミクロン | Method for manufacturing conductive ball mounting mask |
| JP2009182068A (en) * | 2008-01-30 | 2009-08-13 | Kyushu Hitachi Maxell Ltd | Mask for array and method of manufacturing the same |
| JP2010247500A (en) | 2009-04-20 | 2010-11-04 | Sonocom Co Ltd | Mask and method of manufacturing the same |
| JP2011029311A (en) * | 2009-07-23 | 2011-02-10 | Bonmaaku:Kk | Ball loading mask, ball suction mask, sieve gauze, and method of manufacturing the same |
| JP6492988B2 (en) | 2015-06-05 | 2019-04-03 | 富士ゼロックス株式会社 | Holding device, conveying device, component conveying method, and substrate device manufacturing method |
| JP6302430B2 (en) * | 2015-06-08 | 2018-03-28 | 株式会社ボンマーク | Method for manufacturing mask for ball array |
| US10593629B2 (en) * | 2018-07-09 | 2020-03-17 | Powertech Technology Inc. | Semiconductor package with a conductive casing for heat dissipation and electromagnetic interference (EMI) shield and manufacturing method thereof |
| JP6713154B1 (en) * | 2019-12-12 | 2020-06-24 | アテネ株式会社 | Ball array mask |
-
2021
- 2021-08-23 JP JP2022544591A patent/JP7348693B2/en active Active
- 2021-08-23 CN CN202180057736.0A patent/CN116235284A/en active Pending
- 2021-08-23 WO PCT/JP2021/030829 patent/WO2022045073A1/en active Application Filing
- 2021-08-23 KR KR1020237002801A patent/KR20230028498A/en not_active Application Discontinuation
- 2021-08-24 TW TW110131237A patent/TWI776652B/en active
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