TW202210842A - Probe assembly - Google Patents

Abstract

A probe assembly adapted to test high speed signal transmission lines of printed circuit boards. The probe assembly includes two pogo-pins for providing high-frequency differential test signals, and there is no metal layer (grounding layer) at both sides of the pogo-pins. Experiments have demonstrated that when two pogo-pins are subjected to test the DUT, the test signal will be coupled to the metal layers at both sides of the pogo-pins to induce a radiation resonance, resulting in an energy loss on a specific frequency band, which in turn reduces the effective bandwidth of the probe assembly. In the present invention, the metal layer on both sides of the pogo-pins of the probe assembly of the present invention is appropriately reduced, so that the aforementioned radiation resonance phenomenon can be eliminated.

Description

Probe Assembly

The present invention relates to a probe assembly, in particular to a probe assembly used for high-speed differential signal testing.

The probe structure of traditional differential signal measurement is to set multiple probes on the printed circuit board. The probes are arranged in the form of GSS, SSG, SGS, GSSG and GSGSG, where G represents the ground probe and S represents the signal probe. As the layout design of printed circuit boards becomes more and more compact and diverse, it may happen in the future that the test contacts of the DUT do not include ground points, resulting in the above-mentioned probe structure including ground probes are not available. In other words, there is no probe design scheme based on the SS architecture in the prior art.

In view of this, the present invention provides a probe assembly comprising a dielectric layer, a first signal line, a second signal line, a first pogo pin, a second pogo pin, a first upper ground layer, a second upper ground layer, and lower ground plane.

The dielectric layer includes an upper surface, a lower surface, a first side surface, a second side surface and a third side surface, the first side surface and the second side surface are opposite to each other, and the third side surface is located between the first side surface and the second side surface. The upper surface of the dielectric layer includes a first upper blank area, a second upper blank area, a first upper connection area and a second upper connection area, and the lower surface of the dielectric layer includes a first lower blank area and a second lower blank area . The first signal line is disposed on the upper surface of the dielectric layer, the first signal line includes a first header section and a first tail section, one end of the first header section is connected to the first tail section, and the first header section The other end of the section points to the third side. The first upper blank area and the first lower blank area are located between the first header section and the first side surface. The first upper ground region is located between the first tail section and the first side. The second signal line is arranged on the upper surface of the dielectric layer and is spaced apart from the first signal line. The second signal line includes a second head section and a second tail section, one end of the second head section is connected to the second tail section, and the other end of the second head section points to the third side surface. The second upper blank area and the second lower blank area are located between the second head section and the second side surface. The second upper ground region is located between the second tail section and the second side. The first pogo pin is arranged on the first head section. The second pogo pin is arranged on the second head section. The first upper ground layer is arranged on the first upper ground area, the second upper ground layer is arranged on the second upper ground area, and the lower ground layer is arranged on the lower surface of the dielectric layer but does not pass through the first lower blank area and the second upper ground layer. blank space below.

The present invention also provides a probe assembly including a dielectric layer, a first signal line, a second signal line, a first pogo pin, a second pogo pin, an upper ground layer and a lower ground layer. The dielectric layer includes a body portion and a protruding portion, wherein the protruding portion protrudes from a side surface of the body portion along a first direction toward a direction away from the side surface. The first signal line is arranged on the upper surface of the dielectric layer, the first signal line includes a first head section and a first tail section, the first head section is arranged on the protruding part, and the first tail section is arranged on the In the body part, one end of the first head section is connected to the first tail section, and the other end of the first head section points to an end surface of the protruding part. The second signal line is disposed on the upper surface of the dielectric layer and is spaced apart from the first signal line. The second signal line includes a second head section and a second tail section, wherein the second head section is disposed on the protruding portion of the dielectric layer, and the second tail section is disposed on the body portion of the dielectric layer. One end of the second head section is connected to the second tail section, and the other end points to the end face of the protruding part. The first pogo pin is arranged on the first head section. The second pogo pin is arranged on the second head section. The upper ground layer is arranged on the upper surface of the body portion of the dielectric layer, and the lower ground layer is arranged on the lower surface of the body portion of the dielectric layer and the lower surface of the protruding portion.

One of the features of the present invention is that it does not include grounding probes, so it can be applied to the device under test whose test contacts do not have a grounding point. Another feature of the present invention is that the ground layers (metal layers) on both sides of the pogo pin are reduced, so during the testing process, the test signal will not be coupled to the ground layers on both sides to generate radiation resonance, which increases the effective bandwidth of the probe assembly decline.

In the description of the present application and the scope of the patent application, "up" or "down" is only used to describe the orientation shown in the drawings, and does not limit the actual orientation.

The relative size and thickness of each element in the drawings are only examples, and do not limit the actual relative size relationship of each element.

Referring to FIG. 1 and FIG. 2 , there are respectively a three-dimensional schematic diagram (1) and a three-dimensional schematic diagram (2) of the first embodiment of the present invention, which illustrate a probe assembly 100 . The probe assembly 100 includes a dielectric layer 11 , a first signal line 12 , a second signal line 13 , a first pogo pin 123 , a second pogo pin 133 , a first upper ground layer 141 , a second upper ground layer 142 and a lower connection Formation 16. The probe assembly 100 can be suitable for differential signal testing of high-speed signal transmission lines of printed circuit boards, and is especially suitable for printed circuit boards whose test contacts do not have a ground point.

The dielectric layer 11 includes an upper surface 111 , a lower surface 112 , a first side 113 , a second side 114 and a third side 115 . The first side 113 and the second side 114 are opposite to each other, and the third side 115 is located between the first side 113 and the third side 115 . between the second side surfaces 114 . The upper surface 111 of the dielectric layer 11 includes a first upper blank area 111A, a second upper blank area 111B, a first upper connection area 111G1 and a second upper connection area 111G2, and the lower surface 112 of the dielectric layer 11 includes a first lower area The blank area 112A and the second lower blank area 112B.

The first signal line 12 is disposed on the upper surface 111 of the dielectric layer 11 , and includes a first head section 121 and a first tail section 122 . One end of the first head section 121 is connected to the first tail section 122 , and the other end is directed to the third side surface 115 . The first upper blank area 111A and the first lower blank area 112A are located between the first header section 121 and the first side surface 113 . Further, the first lower blank area 112A is arranged on the lower surface 112 and corresponds to the position of the first upper blank area 111A of the upper surface 111 , that is, the first lower blank area 112A is arranged on the lower surface 112 and corresponds to the position of the first upper blank area 111A of the upper surface 111 . The area between the first head section 121 and the first side surface 113 . The first upper ground region 111G1 is located between the first tail section 122 and the first side surface 113 of the dielectric layer 11 , and the first upper ground layer 141 is disposed on the first upper ground region 111G1 .

The second signal line 13 is disposed on the upper surface 111 of the dielectric layer 11 and is spaced apart from the first signal line 12 . The second signal line 13 includes a second head section 131 and a second tail section 132 , wherein one end of the second head section 131 is connected to the second tail section 132 and the other end of the second head section 131 Then it points to the third side surface 115 . The second upper blank area 111B and the second lower blank area 112B are located between the second head section 131 and the second side surface 114 . Further, the second lower blank area 112B is disposed on the lower surface 112 and corresponds to the position of the second upper blank area 111B of the upper surface 111 , that is, the second lower blank area 112B is disposed on the lower surface 112 and corresponds to the position of the second upper blank area 111B on the upper surface 111 . The area between the second head section 131 and the second side surface 114 . The second upper ground region 111G2 is located between the second tail section 132 and the second side surface 114, and the second upper ground layer 142 is disposed on the second upper ground region 111G2.

The first pogo pin 123 is disposed on the first head section 121 of the first signal line 12 . In some embodiments, the first pogo pin 123 is disposed on the first header section 121 of the first signal line 12 by soldering. The first pogo pin 123 includes a body portion 123B and a telescopic portion 123T. The telescopic portion 123T is located at one end of the body portion 123B, and the telescopic portion 123T protrudes from the third side surface 115 of the dielectric layer 11 in a free state. The second pogo pin 133 is disposed on the second head section 131 of the second signal line 13 . In some embodiments, the second pogo pin 133 is disposed on the second head section 131 of the second signal line 13 by soldering. The second pogo pin 133 includes a body portion 133B and a telescopic portion 133T. The telescopic portion 133T is located at one end of the body portion 133B, and the telescopic portion 133T protrudes from the third side surface 115 of the dielectric layer 11 in a free state. During the testing process, the retractable portion 123T of the first pogo pin 123 and the retractable portion 133T of the second pogo pin 133 are in contact with the two differential signal test contacts of the device under test respectively, so as to transmit the differential test signal It is transmitted to the device under test and the device under test is tested. In some embodiments, the retractable parts 123T and 133T protrude from the third side surface 115 of the dielectric layer 11 in the free state, and the retractable part 123T is located at one end of the needle body part 123B and the retractable part 133T is located at the needle body part 133B. The position can be aligned with the third side 115 of the dielectric layer 11 , or disposed on the upper surface 111 of the dielectric layer 11 but not aligned with the third side 115 , or beyond the third side 115 and protruding from the third side 115, and is not limited. That is to say, the telescopic portion 123T is located at one end of the needle body portion 123B and the telescopic portion 133T is located at the relative position of the needle body portion 133B and the third side surface 115, and one end of the needle body portions 123B and 133B may be aligned with the third side surface. 115 , or the side of the third side 115 facing or away from the upper surface 111 of the dielectric layer 11 , and there is no particular limitation.

The lower ground layer 16 is disposed on the lower surface 112 of the dielectric layer 11 and covers the area other than the first lower blank area 112A and the second lower blank area 112B of the lower surface 112 . It should be noted here that the lower ground layer 16 will cover the bottom of the needle body 123B of the first pogo pin 123 and the needle body 133B of the second pogo pin 133 , that is, it will cover the first lower blank area 112A and the second lower blank area 112A. The portion between the blank areas 112B. In this way, the impedance matching of the entire first signal line 12 and the second signal line 13 can be extended to almost contact with the device under test.

In this embodiment, the first upper ground layer 141 , the second upper ground layer 142 and the lower ground layer 16 do not cover the needle body portion 123B of the first pogo pin 123 and the needle body portion 133B of the second pogo pin 133 along it. The parts on the two sides in the length direction, so when the probe assembly 100 of this embodiment is used to test the differential signal of the printed circuit board, the test signal will not be coupled to the two sides of the first pogo pin 123 and the second pogo pin 133 The ground plane can effectively avoid the generation of radiation resonance.

In some embodiments, the first upper ground layer 141 , the second upper ground layer 142 and the lower ground layer 16 are grounded in common. In some embodiments, the upper surface 111 of the dielectric layer 11 further includes a third upper ground region 111G3 located between the first tail section 122 and the second tail section 132 . The probe assembly 100 further includes a third upper ground layer 143, which is disposed in the third upper ground region 111G3, and the first upper ground layer 141, the second upper ground layer 142, the third upper ground layer 143, and the lower ground layer 16 are connected to each other. common ground.

In some embodiments, the dielectric layer 11 is provided with a plurality of conductive vias 119 , wherein at least one conductive via 119 is electrically connected to the first upper ground layer 141 and the lower ground layer 16 , and at least one conductive via 119 is electrically connected The second upper ground layer 142 and the lower ground layer 16 , and at least one conductive via 119 is electrically connected to the third upper ground layer 143 and the lower ground layer 16 . In this way, the first upper ground layer 141 , the second upper ground layer 142 , the third upper ground layer 143 and the lower ground layer 16 can be grounded together through the conductive vias 119 .

In some embodiments, the first head section 121 extends along a first direction (eg, the X-axis direction in the figure) and has a length L1 . The first upper blank area 111A has a width W1 along the first direction (X-axis direction), and the first lower blank area 112A has a width W2 along the first direction (X-axis direction). In some embodiments, the width W1 is substantially equal to the width W2, and the widths W1 and W2 are substantially equal to the length L1. In addition, in some embodiments, the second head section 131 extends along the first direction (X-axis direction) to have a length L2. The second upper blank area 111B has a width W3 along the first direction (X-axis direction), and the second lower blank area 112B has a width W4 along the first direction (X-axis direction). In some embodiments, the width W3 is substantially equal to W4, and the widths W3 and W4 are substantially equal to the length L2.

In some embodiments, the projection of the first upper blank area 111A along the normal direction of the upper surface 111 completely coincides with the projection of the first lower blank area 112A along the normal direction of the lower surface 112 , and the second upper blank area 111B is along the The projection of the normal direction of the upper surface 111 also coincides with the projection of the second lower blank area 112B along the normal direction of the lower surface 112 . It should be noted that all processing procedures have a certain degree of processing error. The projection of the first upper blank area 111A along the normal direction of the upper surface 111 and the projection of the first lower blank area 112A along the normal direction of the lower surface 112 are different. There may still be slight differences caused by machining errors. For those with ordinary knowledge in the technical field, the above-mentioned slight differences are purely due to machining errors rather than design differences, so they should still be regarded as overlapping. Similarly, the same is true between the projection of the second upper blank area 111B along the normal direction of the upper surface 111 and the projection of the second lower blank area 112B along the normal direction of the lower surface 112 .

Referring to FIG. 3 and FIG. 4 , which are respectively a schematic perspective view (1) and a schematic perspective view (2) of the second embodiment of the present invention, a probe assembly 200 is shown. In this embodiment, the length of the needle body 123B of the first pogo pin 123 is equal to the length L1 of the first head section 121 along the X-axis direction, but the first upper blank area 111A and the first lower blank area 112A are along the X axis The width W1 and the width W2 in the axial direction are smaller than L1. In addition, the length of the needle body 133B of the second pogo pin 133 is equal to the length L2 of the second head section 131 along the X-axis direction, but the width of the second upper blank area 111B and the second lower blank area 112B along the X-axis direction W3 and W4 are smaller than L2. Referring further to Figures 9 to 11, insertion loss versus test frequency for W1=W2=W3=W4=0 mm, W1=W2=W3=W4=0.5 mm, and W1=W2=W3=W4=0.8 mm, respectively curve graph. As shown in FIG. 9 , when W1=W2=W3=W4=0 mm, it is equivalent to the ground plane on both sides of the needle body 123B of the first pogo pin 123 and the needle body 133B of the second pogo pin 133 . At a certain frequency (15GHz shown in the figure) there is energy loss due to the aforementioned radiative resonance. As shown in FIG. 10 , when W1=W2=W3=W4=0.5 mm, the ground planes on both sides of the needle body 123B of the first pogo pin 123 and the needle body 133B of the second pogo pin 133 decrease, resulting in the phenomenon of radiation resonance. reduced, so the energy loss around a certain frequency is greatly reduced. As shown in FIG. 11, when W1, W2, W3 and W4 are further increased from 0.5mm to 0.8mm, the contacts on both sides of the needle body 123B of the first pogo pin 123 and the needle body 133B of the second pogo pin 133 are The formation was reduced even further, at which point the effect of radiative resonance had approached zero, and no significant energy loss was found at all frequencies tested. In the same way, the ground layers on both sides of the first pogo pin 123 and the second pogo pin 133 of the probe assembly 100 of the first embodiment are more reduced than the above-mentioned state of W1=W2=W3=W4=0.8 mm, and the radiation The influence of resonance is also close to zero, so the graph of the insertion loss of the probe assembly 100 of the first embodiment versus the test frequency will not show significant energy loss at all test frequencies as shown in FIG. 11 . It should be noted that, in this embodiment, only the widths W1, W2, W3 and W4 of the first upper blank area 111A, the first lower blank area 112A, the second upper blank area 111B and the second lower blank area 112B need to be considered for the radiation resonance. It is not necessary to particularly consider the lengths of the needle body portion 123B of the first pogo pin 123 and the needle body portion 133B of the second pogo pin 133 .

It should be noted here that W1=W2=W3=W4 in the above embodiment is only a special case, W1, W2, W3 and W4 can be different from each other, as long as W1≧0.8 mm, W2≧0.8 mm, W3≧0.8 mm And W4≧0.8 mm can achieve the effect of avoiding radiation resonance.

Referring to FIG. 5 and FIG. 6 , which are respectively a three-dimensional schematic diagram (1) and a three-dimensional schematic diagram (2) of the third embodiment of the present invention, which illustrate a probe assembly 300 . The probe assembly 300 includes a dielectric layer 21 , a first signal line 22 , a second signal line 23 , a first pogo pin 223 , a second pogo pin 233 , an upper ground layer 24 and a lower ground layer 26 . The probe assembly 300 is also suitable for performing differential signal testing on high-speed signal transmission lines of a printed circuit board, and is especially suitable for a printed circuit board whose test contacts do not have a ground point.

As shown in the figure, the dielectric layer 21 includes an upper surface 211 and a lower surface 212 , and the dielectric layer 21 can be divided into a body portion 21A and a protruding portion 21B. The body portion 21A has a side surface 215 , and the protruding portion 21B extends and protrudes from the side surface 215 of the body portion 21A along a first direction (eg, the X-axis direction in the figure) away from the side surface 215 . In some embodiments, the protruding portion 21B extends and protrudes from the center of the side surface 215 of the main body portion 21A along the first direction (X-axis direction) toward the direction away from the side surface 215 .

The first signal line 22 is disposed on the upper surface 211 of the dielectric layer 21 , wherein the first signal line 22 includes a first head section 221 and a first tail section 222 . The first head section 221 is disposed on the protruding portion 21B of the dielectric layer 21 , and the first tail section 222 is disposed on the body portion 21A of the dielectric layer 21 . One end of the first head section 221 is connected to the first tail section 222, and the other end is directed to an end surface 21B1 of the protruding portion 21B.

The second signal line 23 is disposed on the upper surface 211 of the dielectric layer 21 and is spaced apart from the first signal line 22 . The second signal line 23 includes a second head section 231 and a second tail section 232 , wherein the second head section 231 is disposed on the protruding portion 21B of the dielectric layer 21 , and the second tail section 232 is disposed between the The body portion 21A of the electrical layer 21 is formed. One end of the second head section 231 is connected to the second tail section 232 , and the other end thereof points to the end surface 21B1 of the protruding portion 21B.

The first pogo pin 223 is disposed on the first head section 221 of the first signal line 22 . The first pogo pin 223 includes a needle body portion 223B and a telescopic portion 223T. The telescopic portion 223T is located at one end of the needle body portion 223B, and the telescopic portion 223T protrudes from the end surface of the protruding portion 21B of the dielectric layer 21 in a free state. 21B1. The second pogo pin 233 is disposed on the second head section 231 of the second signal line 23 . The second pogo pin 233 includes a body portion 233B and a telescopic portion 233T, the telescopic portion 233T is located at one end of the body portion 233B, and the telescopic portion 233T protrudes from the protruding portion 21B of the dielectric layer 21 in a free state End face 21B1.

The upper ground layer 24 is disposed on the upper surface of the body portion 21A of the dielectric layer 21 , and the lower ground layer 26 is disposed on the lower surface of the body portion 21A and the lower surface of the protruding portion 21B of the dielectric layer 21 . In this embodiment, the impedance matching of the entire first signal line 22 and the second signal line 23 can also extend to almost contact with the device under test.

As shown in FIG. 5 , the probe assembly 300 includes three upper ground layers 24 , which are respectively located between the first tail section 222 of the first signal line 22 and the edge of the dielectric layer 21 adjacent to the first signal line 22 . between the first tail section 222 of the signal line 22 and the second tail section 232 of the second signal line 23 , and between the second tail section 232 of the second signal line 23 and the dielectric adjacent to the second signal line 23 between the edges of layer 21. In some embodiments, the upper ground layer 24 and the lower ground layer 26 share a ground. In some embodiments, the dielectric layer 21 further includes at least one conductive via 219 , and the conductive via 219 is electrically connected to the upper ground layer 24 and the lower ground layer 26 , so that the upper ground layer 24 and the lower ground layer 26 are Common ground can be achieved through conductive vias 219 .

In some embodiments, the body portion 223B of the first pogo pin 223 and the body portion 233B of the second pogo pin 233 have lengths L3 and L4 along the first direction (X-axis direction), respectively. The upper ground layer 24 has a first edge 241 and a second edge 242 . The first edge 241 and the second edge 242 are respectively located on both sides of the protruding portion 21B of the dielectric layer 21 and are adjacent to the body of the dielectric layer 21 . Side 215 of portion 21A. The lower ground layer 26 has a third edge 261 and a fourth edge 262 . The third edge 261 and the fourth edge 262 are respectively located on both sides of the protruding portion 21B of the dielectric layer 21 and are adjacent to the body of the dielectric layer 21 . Side 215 of portion 21A. There is a first distance D1 between the first edge 241 and the end surface 21B1 of the protruding portion 21B along the first direction (X-axis direction), and there is a first distance D1 between the second edge 242 and the end surface 21B1 of the protruding portion 21B along the first direction (X-axis direction). axis direction) has a second distance D2, there is a third distance D3 along the first direction (X-axis direction) between the third edge 261 and the end surface 21B1 of the protruding portion 21B, the fourth edge 262 and the protruding portion 21B have a third distance D3. There is a fourth distance D4 between the end surfaces 21B1 along the first direction (X-axis direction). Where D1=D2=D3=D4. In some embodiments, L3=L4=D1=D2=D3=D4.

In some embodiments, the body portion 21A and the protruding portion 21B are formed by machining a single dielectric layer. For example, an L-shaped cut is performed on two corners on the same side of a rectangular dielectric layer. After the two corners are cut off, the portion of the dielectric layer between the two cut portions is the protruding portion 21B, and the portion of the dielectric layer outside the protruding portion 21B is the body portion 21A.

Referring to FIG. 7 and FIG. 8 , which are respectively a perspective view (1) and a perspective view (2) of the fourth embodiment of the present invention, which illustrate a probe assembly 400 . The main difference between this embodiment and the third embodiment is that D1 , D2 , D3 and D4 are all smaller than the length L3 of the body 223B of the first pogo pin 223 and/or the length L4 of the body 233B of the second pogo pin 233 . Referring to FIGS. 9 to 11 , the insertion loss at the time of D1=D2=D3=D4=0 mm, D1=D2=D3=D4=0.5 mm and D1=D2=D3=D4=0.8 mm with respect to the test frequency Graph. As shown in FIG. 9 , when D1=D2=D3=D4=0 mm, it is equivalent to the ground plane on both sides of the needle body 223B of the first pogo pin 223 and the needle body 233B of the second pogo pin 233 . At a certain frequency (15GHz shown in the figure) there is energy loss due to the aforementioned radiative resonance. As shown in FIG. 10 , when D1=D2=D3=D4= 0.5 mm, the ground planes on both sides of the needle body 223B of the first pogo pin 223 and the needle body 233B of the second pogo pin 233 are reduced, resulting in the phenomenon of radiation resonance. reduced, so the energy loss around a certain frequency is greatly reduced. As shown in FIG. 11, when D1, D2, D3 and D4 are further increased from 0.5 mm to 0.8 mm, the contacts on both sides of the needle body 223B of the first pogo pin 223 and the needle body 233B of the second pogo pin 233 are The formation was reduced even further, at which point the effect of radiative resonance had approached zero, and no significant energy loss was found at all frequencies tested. Similarly, the ground layers on both sides of the needle body 223B of the first pogo pin 223 and the needle body 233B of the second pogo pin 233 of the probe assembly 300 of the third embodiment are compared to the above D1=D2=D3=D4= The shape at 0.8 mm is further reduced, and the influence of radiation resonance also approaches zero. Therefore, the curve of the insertion loss of the probe assembly 300 of the third embodiment versus the test frequency is also shown in FIG. 11. No significant energy loss was found at any test frequency. It should be noted that, in this embodiment, it is only necessary to pay attention to the size of D1=D2=D3=D4, and it is not necessary to pay special attention to the size of the needle body 223B of the first pogo pin 223 and the needle body 233B of the second pogo pin 233. length.

It should be noted here that D1=D2=D3=D4 in the above embodiment is only a special case, D1, D2, D3 and D4 can be different from each other, as long as D1≧0.8 mm, D2≧0.8 mm, D3≧0.8 mm And D4≧0.8 mm can achieve the effect of avoiding radiation resonance. In addition, the distance along the first direction (X-axis direction) of the dielectric layer 21 between the side surface 215 of the body portion 21A and the end surface 21B1 of the protruding portion 21B is not limited to be equal to D1, D2, D3 and D4. In some embodiments, the distance from the side surface 215 to the end surface 21B1 may be smaller than D1 , D2 , D3 and D4 , but it can still be considered that the first edge 241 and the second edge 242 are adjacent to the side surface 215 of the body portion 21A of the dielectric layer 21 , the third edge 261 and the fourth edge 262 are adjacent to the side surface 215 of the body portion 21A of the dielectric layer 21 .

Referring to FIGS. 5 and 7 , in some embodiments, considering the convenience of processing and the mechanical strength of the protruding portion 21B, a portion is reserved between the needle body 223B of the first pogo pin 223 and the side edge of the protruding portion 21B In the area 21B7, a partial area 21B9 is also reserved between the needle body 233B of the second pogo pin 233 and the side edge of the protruding portion 21B. In some embodiments, the partial area 21B7 and the partial area 21B9 may not be reserved under the premise that the machining accuracy allows and the mechanical strength meets the actual application requirements.

In some embodiments, an upper ground layer and a lower ground layer may be formed on two surfaces of a rectangular dielectric layer, respectively, and then the first signal line 22 , the second signal line 23 , the first pogo pin 223 and the The second pogo pin 233 is formed on one of the surfaces of the dielectric layer. Subsequently, only two corners on the same side of the dielectric layer are L-cut to remove the dielectric layer portion and the ground layer portion, and so on. The probe assembly 200 can be formed.

It should be emphasized again here that the probe assembly of the present invention is a brand-new design, that is, it does not include a grounding probe, so it can be applied to the device under test whose test contact does not have a grounding point. In addition, the ground layers (metal layers) on both sides of the first pogo pin and the second pogo pin for providing the differential signal in the present invention are properly cut, so that the test signal will not be coupled to the ground planes on both sides during the testing process. Radiation resonance occurs in the formation. It is only necessary to specify that the ground layer (metal layer) on both sides of the first pogo pin and the second pogo pin needs to be appropriately reduced to avoid the influence of radiation resonance. The radiation resonance is related to the length of the first pogo pin and the second pogo pin. It doesn't matter.

Although the present invention has been disclosed by the above examples, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the invention shall be determined by the scope of the appended patent application.

100, 200: Probe assembly 11: Dielectric layer 111: Upper surface 111A: First upper blank area 111B: Second upper blank area 111G1: The first touch-up area 111G2: Second touch-up area 111G3: The third pick-up area 112: Lower surface 112A: First lower blank area 112B: Second lower blank area 113: The first side 114: Second side 115: Third side 119: Conductive vias 12: The first signal line 121: first header section 122: First tail section 123: First pogo pin 123B: Needle body 123T: Telescopic part 13: The second signal line 131: Second head section 132: Second tail section 133: Second pogo pin 133B: Needle body 133T: Telescopic part 141: The first upper ground plane 142: Second upper ground plane 143: The third upper ground plane 16: Lower ground plane 300, 400: Probe assembly 21: Dielectric layer 21A: Body part 21B: Protruding part 21B1: End face 21B7: Local area 21B9: Local area 211: Upper surface 212: Lower Surface 215: Side 219: Conductive Vias 22: The first signal line 221: first header segment 222: First tail section 223: First pogo pin 223B: Needle body 223T: Telescopic part 23: The second signal line 231: Second header section 232: Second tail section 233: Second pogo pin 233B: Needle body 233T: Telescopic part 24: Upper ground plane 241: First Edge 242: Second Edge 26: Lower ground plane 261: Third Edge 262: Fourth Edge D1: first distance D2: Second distance D3: The third distance D4: Fourth distance L1: length L2: length L3: length L4: length W1: width W2: width W3: width W4: width

[FIG. 1] is a three-dimensional schematic diagram (1) of the first embodiment of the present invention. [FIG. 2] is a three-dimensional schematic diagram (2) of the first embodiment of the present invention. [FIG. 3] is a three-dimensional schematic diagram (1) of the second embodiment of the present invention. [FIG. 4] is a perspective view (2) of the second embodiment of the present invention. [FIG. 5] is a three-dimensional schematic diagram (1) of the third embodiment of the present invention. [FIG. 6] is a three-dimensional schematic diagram (2) of the third embodiment of the present invention. [FIG. 7] is a perspective view (1) of the fourth embodiment of the present invention. [FIG. 8] is a perspective view (2) of the fourth embodiment of the present invention. [Fig. 9] is the width W1/W2/W3/W4 of the blank area or the first distance D1/second distance D2/third distance D3/th Graph of the insertion loss of the probe assembly versus the test frequency when the four-distance D4 is 0 mm. [Fig. 10] When the width W1/W2/W3/W4 of the blank area or the first distance D1/second distance D2/third distance D3/fourth distance D4 is 0.5 mm, the insertion loss of the probe assembly is relative to the test Frequency graph. [Fig. 11] When the width W1/W2/W3/W4 of the blank area or the first distance D1/second distance D2/third distance D3/fourth distance D4 is 0.8 mm, the insertion loss of the probe assembly relative to the test Frequency graph.

100: Probe Assembly

11: Dielectric layer

111: Upper surface

111A: First upper blank area

111B: Second upper blank area

111G1: The first touch-up area

111G2: Second touch-up area

111G3: The third pick-up area

113: The first side

114: Second side

115: Third side

119: Conductive vias

12: The first signal line

121: first header section

122: First tail section

123: First pogo pin

123B: Needle body

123T: Telescopic part

13: The second signal line

131: Second head section

132: Second tail section

133: Second pogo pin

133B: Needle body

133T: Telescopic part

141: The first upper ground plane

142: Second upper ground plane

143: The third upper ground plane

L1: length

L2: length

W1: width

W3: width

Claims (10)

A probe assembly comprising: A dielectric layer includes an upper surface, a lower surface, a first side, a second side and a third side, the first side and the second side are opposite to each other, and the third side is located between the first side and the Between the second side surfaces, the upper surface includes a first upper blank area, a second upper blank area, a first upper connection area and a second upper connection area, and the lower surface includes a first lower blank area with a second lower blank area; a first signal line disposed on the upper surface, the first signal line includes a first head section and a first tail section, one end of the first head section is connected to the first tail section , the other end of the first head section points to the third side face, the first upper blank area and the first lower blank area are located between the first head section and the first side face, the first upper blank area a grounding region is located between the first tail section and the first side surface; a second signal line, disposed on the upper surface and spaced from the first signal line, the second signal line includes a second head section and a second tail section, the second head section is One end is connected to the second tail section, the other end of the second head section points to the third side surface, the second upper blank area and the second lower blank area are located on the second head section and the first between the two side surfaces, the second upper ground area is located between the second tail section and the second side surface; a first pogo pin, disposed on the first head section, the first pogo pin includes a body part and a telescopic part; a second pogo pin, disposed on the second head section, the second pogo pin includes a body part and a telescopic part; a first upper ground layer disposed on the first upper ground area; a second upper ground layer disposed on the second upper ground region; and A lower ground layer is disposed on the lower surface but does not pass through the first lower blank area and the second lower blank area. The probe assembly of claim 1, wherein the first upper ground layer, the second upper ground layer and the lower ground layer share a ground. The probe assembly of claim 2, wherein the dielectric layer further includes a third upper ground region between the first tail section and the second tail section, the probe assembly further includes a first Three upper ground layers are disposed in the third upper ground region, wherein the first upper ground layer, the second upper ground layer, the third upper ground layer and the lower ground layer share the ground. The probe assembly according to claim 3, wherein the dielectric layer further comprises a plurality of conductive vias, at least one of the conductive vias electrically connects the first upper ground layer and the lower ground layer, and at least one of the conductive vias The second upper ground layer and the lower ground layer are electrically connected, and at least one of the conductive vias is electrically connected to the third upper ground layer and the lower ground layer. The probe assembly of claim 1, wherein the first upper blank area has a width W1 along a first direction, the first lower blank area has a width W2 along the first direction, and the second upper blank area The second lower blank area has a width W4 along the first direction, wherein W1≧0.8 mm, W2≧0.8 mm, W3≧0.8 mm, and W4≧0.8 mm. The probe assembly according to any one of claims 1 to 5, wherein the projection of the first upper blank area along the normal direction of the upper surface and the projection of the first lower blank area along the normal direction of the lower surface and the projection of the second upper blank area along the normal direction of the upper surface also coincides with the projection of the second lower blank area along the normal direction of the lower surface. A probe assembly comprising: a dielectric layer including a body portion and a protruding portion, the protruding portion protruding from a side surface of the body portion along a first direction toward a direction away from the side surface; A first signal line is disposed on the upper surface of the dielectric layer, the first signal line includes a first head section and a first tail section, and the first head section is disposed on the protruding portion , the first tail section is arranged on the body part, one end of the first head section is connected to the first tail section, and the other end of the first head section points to an end face of the protruding part; a second signal line, disposed on the upper surface of the dielectric layer and spaced from the first signal line, the second signal line includes a second header section and a second tail section, the second header A section is arranged on the protruding part, the second tail section is arranged on the body part, one end of the second head section is connected to the second tail section, and the other end of the second head section to the end face; a first pogo pin, disposed on the first head section, the first pogo pin includes a body part and a telescopic part; a second pogo pin, disposed on the second head section, the second pogo pin includes a body part and a telescopic part; an upper ground layer disposed on the upper surface of the body portion; and A lower ground layer is disposed on the lower surface of the body portion and the lower surface of the protruding portion. The probe assembly of claim 7, wherein the upper ground layer and the lower ground layer share a ground. The probe assembly as claimed in claim 8, wherein the dielectric layer further comprises a conductive via electrically connecting the upper ground layer and the lower ground layer. The probe assembly of claim 7, wherein the upper ground layer has a first edge and a second edge, the first edge and the second edge are respectively located on both sides of the protruding portion and adjacent to the protruding portion the side surface of the body part; the lower ground layer has a third edge and a fourth edge, the third edge and the fourth edge are respectively located on both sides of the protruding part and adjacent to the side surface of the body part; the first edge There is a first distance D1 along the first direction between the edge and the end surface, a second distance D2 along the first direction between the second edge and the end surface, and a second distance D2 between the third edge and the end surface along the first direction The first direction has a third distance D3, and the fourth edge and the end face have a fourth distance D4 along the first direction, wherein D1≧0.8 mm, D2≧0.8 mm, D3≧0.8 mm, and D4≧ 0.8 mm.

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