CN116707559A - Interconnection structure and radio frequency system - Google Patents
Interconnection structure and radio frequency system Download PDFInfo
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- CN116707559A CN116707559A CN202310861589.3A CN202310861589A CN116707559A CN 116707559 A CN116707559 A CN 116707559A CN 202310861589 A CN202310861589 A CN 202310861589A CN 116707559 A CN116707559 A CN 116707559A
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- matching network
- radio frequency
- multilayer board
- microwave
- connector
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- 230000005540 biological transmission Effects 0.000 claims description 20
- 239000002184 metal Substances 0.000 claims description 18
- 238000003466 welding Methods 0.000 claims description 14
- 229910000679 solder Inorganic materials 0.000 claims description 9
- 239000003566 sealing material Substances 0.000 claims description 5
- 238000004088 simulation Methods 0.000 claims description 5
- 238000005476 soldering Methods 0.000 claims description 5
- 239000003990 capacitor Substances 0.000 claims description 3
- 230000008054 signal transmission Effects 0.000 abstract description 14
- 238000004891 communication Methods 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 27
- 239000000463 material Substances 0.000 description 14
- 230000000694 effects Effects 0.000 description 5
- 238000003780 insertion Methods 0.000 description 5
- 230000037431 insertion Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
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- 239000011358 absorbing material Substances 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 230000005570 vertical transmission Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
Abstract
The embodiment of the invention provides an interconnection structure and a radio frequency system, and relates to the technical field of wireless communication. The radio frequency connector is used for being grounded and interconnected with the microwave multilayer board and is connected with the microstrip line through signals, and the matching network is connected between the radio frequency connector and the microstrip line and used for realizing impedance matching, so that the reliability of signal transmission is improved.
Description
Technical Field
The invention relates to the technical field of wireless communication, in particular to an interconnection structure and a radio frequency system.
Background
With the development of wireless communication systems, the working frequency of signals is higher and higher, and for radio frequency systems, the performance of the interconnection structure between each component and between signal transmission cables directly affects the performance of the whole radio frequency system. In a radio frequency system, a connector is a key device for interconnection of all functional subsystems, and interconnection transition between the connector and radio frequency influences system indexes such as standing waves, insertion loss and the like of signals. Today, the interconnection structure between the microwave multilayer board and the connector is to be improved.
Disclosure of Invention
The object of the present invention consists, for example, in providing an interconnection structure and a radio frequency system which are capable of improving the reliability of the signal transmission.
Embodiments of the invention may be implemented as follows:
in a first aspect, the present embodiment provides an interconnection structure, including a microwave multi-layer board, a radio frequency connector, and a matching network;
the radio frequency connector is used for being grounded and interconnected with the microwave multi-layer board and connected with the microstrip line signal;
the matching network is connected between the radio frequency connector and the microstrip line and is used for realizing impedance matching.
In an alternative implementation manner, the microwave multilayer board is m layers, and m is an even number greater than or equal to 2;
the microwave multilayer board is provided with a grounding hole, and the microwave multilayer board connects the ground between the signals of each layer together based on the grounding hole, so that the ground between the layers of the microwave multilayer board is interconnected;
the radio frequency connector is vertically arranged on the microwave multilayer board through the grounding pad, and the grounding part of the radio frequency connector is welded in the grounding hole of the microwave multilayer board.
In an alternative implementation manner, the radio frequency connector comprises a grounding shell, and the grounding shell is vertically arranged on the microwave multilayer board through a grounding pad;
a space exists between the grounding pad and the grounding structure, and the space is obtained based on the electrical safety space;
a distance exists between the matching network and the ground structure, which distance is based on the electrical safety distance.
In an alternative implementation manner, the radio frequency connector further comprises a welding pin, wherein the welding pin is positioned in the grounding shell and is vertically fixed on the microwave multilayer board through a radio frequency welding pad;
the length of the radio frequency bonding pad is the length which is obtained through simulation and matched with the impedance of the welding needle.
In an optional implementation manner, the plurality of matching networks comprises a first matching network and a second matching network;
the transmission line width of the first matching network is larger than the microstrip line width, and the transmission line width of the second matching network is smaller than the microstrip line width.
In an alternative implementation manner, the first matching network is equivalent to a capacitor in a radio frequency system; the second matching network is equivalent to an inductor in a radio frequency system;
the first matching network and the second matching network form a capacitance-inductance network on a transmission line path of the radio frequency connector and the microstrip line.
In an optional implementation manner, one end of a capacitance inductance network formed by the first matching network and the second matching network is connected with a welding pin of the radio frequency connector, and the other end of the capacitance inductance network is connected with a microstrip line;
the first matching network, the second matching network and the microstrip line are arranged along the surface of the microwave multilayer board.
In an optional implementation manner, the plurality of grounding holes are distributed on the microwave multilayer board, the region where the radio frequency connector projects is located, and two sides of the region where the first matching network, the second matching network and the microstrip line project are located.
In an alternative implementation, the interconnection structure further includes a metal shield, and the metal shield is welded to the microwave multilayer board through a metal shield welding pad;
the radio frequency connector is located in the metal shielding cover, and sealing materials are filled in the metal shielding cover.
The beneficial effects of the embodiment of the invention include, for example: by additionally arranging the matching network between the radio frequency connector and the microstrip line, adverse effects on signal transmission caused by impedance mismatch can be reduced, and the signal transmission reliability is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a first view angle of an interconnection structure according to the present embodiment;
fig. 2 is a schematic structural diagram of a second view angle of an interconnection structure according to the present embodiment;
fig. 3 is a schematic structural diagram of a first view of an interconnection structure according to the present embodiment;
fig. 4 is a schematic structural diagram of a third view angle of an interconnection structure according to the present embodiment.
Icon: 100-interconnection structure; 110-microwave multilayer board; 111-a ground hole; 112-a ground surface layer; 113-medium; 114-ground floor; a 120-radio frequency connector; 121-a ground pad; 122-a grounded enclosure; 123-welding pins; 124-radio frequency pads; 130-a matching network; 131-a first matching network; 132-a second matching network; 140-microstrip lines; 150-a metal shield; 151-metallic shield bond pads.
Detailed Description
Nowadays, the interconnection structure between the microwave multilayer board and the radio frequency connector (simply called connector) is to be improved. For example, in the rf field, microwave multi-layer boards are interconnected with connectors, typically by soldering in a horizontal direction, and external devices are plugged into the soldered connectors to effect connection between the subsystems. For another example, the interconnection structure between the existing connector and the microwave multilayer board is that the pins of the connector are directly soldered to the leads of the microwave multilayer board.
Through researches, the problems of large loss, large reflection, narrow working bandwidth and the like exist in the signal transmission process by adopting the interconnection mode, and the problem of difficult layout exists in part of structures. Causes of the corresponding problems include: by adopting the interconnection mode, impedance mismatch is easy to occur between the microwave multilayer board and the connector, and the quality of signal transmission is further affected.
In view of the above, an embodiment of the present invention provides an improved interconnection structure of a radio frequency connector and a microwave multi-layer board, which at least partially improves at least one of the above technical problems by providing a multi-stage matching network.
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. The components of the embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the invention, as presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.
In the description of the present invention, it should be noted that, if the terms "upper", "lower", "inner", "outer", and the like indicate an azimuth or a positional relationship based on the azimuth or the positional relationship shown in the drawings, or the azimuth or the positional relationship in which the inventive product is conventionally put in use, it is merely for convenience of describing the present invention and simplifying the description, and it is not indicated or implied that the apparatus or element referred to must have a specific azimuth, be configured and operated in a specific azimuth, and thus it should not be construed as limiting the present invention.
Furthermore, the terms "first," "second," and the like, if any, are used merely for distinguishing between descriptions and not for indicating or implying a relative importance.
It should be noted that the features of the embodiments of the present invention may be combined with each other without conflict.
Referring to fig. 1, the present embodiment provides an interconnection structure 100, which includes a microwave multi-layer board 110, a radio frequency connector 120, and a matching network 130.
The rf connector 120 is configured to be grounded to the microwave multi-layer board 110 and connected to a microstrip line 140. The matching network 130 is connected between the rf connector 120 and the microstrip line 140 for impedance matching.
Compared with the implementation structure without any impedance matching design in the prior art, the signal transmission reliability is improved by adding the matching network 130, so that the signal can be transmitted with low loss and large bandwidth.
The microwave multilayer board 110 may be formed by laminating a plurality of high-frequency materials and adhesive films, and can meet the requirement of high-performance and low-loss transmission of signals at high frequency. The layout layer number of the microwave multilayer board 110 can be m layers, m is an even number greater than or equal to 2, and the dielectric materials of each layer of the microwave multilayer board 110 can be flexibly selected according to different working frequency bands. For example, in the low frequency range, FR4 material may be used. Also for example, in the high frequency range, a material having a stable dielectric constant, such as Rogowski 4350B, TSM-DS3, etc., may be used. The dielectric constants of different high-frequency materials are different, the conductor loss is different, and the conductor loss can be flexibly selected according to specific use environments and requirements.
For example, referring to fig. 2 in combination, the microwave multilayer board 110 may be a two-layer board, such as a 5880 soft substrate made of a high frequency material. The microwave multilayer board 110 may include a ground plane layer 112, a dielectric 113, a ground plane layer 114, and the like.
Referring to fig. 3, the microwave multi-layer board 110 is provided with a grounding hole 111. The microwave multilayer board 110 connects the grounds between the signals of each layer together based on the ground holes 111, so that the grounds between the layers of the microwave multilayer board 110 are interconnected. The rf connector 120 is vertically disposed on the microwave multi-layer board 110 through a grounding pad 121, and the grounding of the rf connector 120 is welded in the grounding hole 111 of the microwave multi-layer board 110.
The radio frequency connector 120 is relatively vertical to the microwave multi-layer board 110, for example, vertical, and the matching network 130 enables the vertical interconnection structure between the radio frequency connector 120 and the microwave multi-layer board 110 to have the advantages of low insertion loss, wide bandwidth, sealability and the like.
The grounding pad 121 of the rf connector 120 is a grounding welding surface where the rf connector 120 and the microwave multilayer board 110 are interconnected, which can strengthen the connection between the rf connector 120 and the microwave multilayer board 110, and meanwhile, as the grounding signal of the rf connector 120 and the rf signal of the microwave multilayer board 110, good welding has the advantage of continuous grounding. Based on the grounding pad 121 of the radio frequency connector 120, the grounding of the radio frequency connector 120 can be welded in the grounding hole 111 of the microwave multilayer board 110, so as to realize fixation.
By arranging the grounding hole 111 on the microwave multilayer board 110, the signal ground is continuous during vertical transmission of the microwave signal, the reflected echo is less during signal transmission, and the transmission quality is stable.
In one implementation, the rf connector 120 includes a grounded enclosure 122, and the grounded enclosure 122 is vertically disposed on the microwave multilayer board 110 through a ground pad 121. As shown in fig. 3, the grounding shell 122 may be circular arc-shaped.
There is a spacing between the ground pads 121 and the ground structure, which is based on the electrical safety spacing. There is a spacing between the matching network 130 and the ground structure, which is based on the electrical safety spacing. The grounding structure is a structure of grounding in the microwave multilayer board 110 and the radio frequency connector 120. The space between the grounding pad 121 of the rf connector 120 and the ground is above the electrical safety space, and the size and structure of the grounding pad 121 can be calculated based on the high-frequency material selected by the microwave multilayer board 110 and the high-frequency software, so that the rf signal has good transmission characteristics. The distance between the matching network 130 and the ground can be a safe electrical distance for processing, for example, a relatively conventional distance can be selected, so that the matching network is applicable to a main flow printed board processing factory, difficulty in manufacturing the main flow printed board processing factory is avoided, and the matching network has the advantage of mass production.
With continued reference to fig. 2 and 3, the rf connector 120 further includes a solder pin 123 (also called an insulator pin), the solder pin 123 is located in the grounding shell 122, and the solder pin 123 is vertically fixed to the microwave multilayer board 110 through a rf bonding pad 124. The length of the rf pad 124 is a length that is obtained by simulation and is matched with the impedance of the bonding pin 123.
Based on the rf bonding pad 124 (also called an insulator pin bonding pad), the bonding pins 123 of the rf connector 120 are interconnected by soldering, and the soldering length of the rf bonding pad 124 can be obtained by high-frequency simulation software, and the bonding pad length matched with the impedance of the bonding pins 123 is selected.
The rf bonding pad 124 is a bonding joint between the bonding pin 123 of the rf connector 120 and the microwave multi-layer board 110, and through reasonable selection of the bonding pad length, standing waves and loss of signal transmission are reduced. To ensure solder reliability, the width of the solder pad should not be too narrow to reduce the probability of solder pad drop.
In this embodiment, the matching network 130 can be flexibly selected, so long as impedance matching can be achieved, and standing waves and losses of signal transmission can be reduced. In one implementation, the matching network 130 is a plurality, and the plurality of matching networks 130 includes a first matching network 131 and a second matching network 132. The transmission line width of the first matching network 131 is greater than the width of the microstrip line 140, and the transmission line width of the second matching network 132 is less than the width of the microstrip line 140.
The first matching network 131 is equivalent to a capacitor in a radio frequency system; the second matching network 132 is equivalent to an inductor in a radio frequency system. The first matching network 131 and the second matching network 132 form a capacitive-inductive network on the transmission line paths of the rf connector 120 and the microstrip line 140. One end of the capacitive/inductive network formed by the first matching network 131 and the second matching network 132 is connected to the welding pin 123 of the rf connector 120, and the other end is connected to the microstrip line 140. The first matching network 131, the second matching network 132 and the microstrip line 140 are disposed along the surface of the microwave multilayer board 110.
Correspondingly, the plurality of grounding holes 111 are distributed on the microwave multilayer board 110, the region where the radio frequency connector 120 projects, and two sides of the region where the first matching network 131, the second matching network 132 and the microstrip line 140 project.
In this embodiment, the microstrip line 140 may be flexibly selected according to different scenes. Taking a 50 ohm microstrip line as an example, in a microwave system, the input/output interface of each system can be set to be 50 ohms, so as to be convenient for interconnection with other systems, the impedance of a transmission line is usually 50 ohms in a printed board, and the line width of the 50 ohm microstrip line can be determined through simulation after the dielectric constant of a high-frequency material is determined. Similarly, the spacing between the ground pads 121 and the ground structure, the spacing between the matching network 130 and the ground structure, the length and width of the first matching network 131, the second matching network 132, and the radio frequency pads 124 may be adjusted according to the specific electromagnetic simulation effect when designing.
The width of the 50 ohm microstrip line can be flexibly set, and the widths of the 50 ohm microstrip lines corresponding to different dielectric materials are different, so that the line width of the 50 ohm microstrip line can be determined according to the actual material selection. For example: the thickness of the TSM-DS3 material of 0.127mm is different from that of the TSM-DS3 material of 0.254mm, the corresponding line widths of the 50 ohm microstrip lines are different, the line width of the TSM-DS3 material of 0.127mm corresponds to the 50 ohm microstrip line width of 0.27mm, and the line width of the TSM-DS3 material of 0.254mm corresponds to the 50 ohm microstrip line width of 0.54mm.
Compared with the conventional interconnection structure 100 of the rf connector 120 and the microwave multi-layer board 110, the matching is generally not performed, and the rf connector 120 is directly interconnected with a 50 ohm microstrip line, resulting in poor signal transmission characteristics. For example, in this embodiment, the rf connector 120 and the microwave multi-layer board 110 are vertically interconnected, and there may be a problem of large parasitic inductance during the signal transmission process, resulting in poor signal continuity, and large loss, standing wave difference, and the like. Through setting up a plurality of matching networks 130, like above-mentioned electric capacity inductance matching network, a plurality of matching networks 130 can be with the impedance matching of signal to the suitable position, and impedance matching is good when making the welding pin 123 of radio frequency connector 120 and microwave multiply wood 110 interconnection, has the advantage that can low insertion loss transmission, bandwidth are wide to better transmission signal.
The interval between the ground pad 121 of the rf connector 120 and the ground forms a region, which can prevent a short circuit between the rf signal and the ground signal, and by designing the region to have different sizes, the impedance matching function can be achieved, the bandwidth of signal operation can be expanded, and the flatness of the signal within the operation bandwidth can be improved.
The space between the matching network 130 and the ground is a safe space between the radio frequency signal and the ground, which can prevent short circuit and perform the function of impedance matching, and meanwhile, the width of the space is generally larger than the width corresponding to the line width of the 50 ohm microstrip line, so as to avoid resonance of the transmission structure of the microstrip line 140.
Through setting up first matching network 131, second matching network 132, when the perpendicular interconnection between radio frequency connector 120 and microwave multiply wood 110, there is the discontinuous condition that causes impedance mismatch of radio frequency signal, through setting up first matching network 131 to transmission line width be greater than 50 ohm transmission line width, equivalent is electric capacity in the radio frequency system, set up second matching network 132 to transmission line width be less than 50 ohm transmission line width, equivalent is electric inductance in the radio frequency system, constitute capacitive inductance network (LC network) on the transmission line route, thereby make matching network 130 can extend working bandwidth, reduce insertion loss.
It will be appreciated that other variations of the interconnect structure 100 are possible in this embodiment. For example, the multi-stage matching network 130 may be extended, for example, three stages, four stages or more, and the circuit structure of the matching network 130 is not limited to a serial structure, and may be a parallel open branch.
Referring to fig. 4 in combination, the interconnection structure 100 may further include a metal shield 150, where the metal shield 150 is soldered to the microwave multilayer board 110 by a metal shield soldering pad 151. Wherein the radio frequency connector 120 is located in the metal shielding case 150, and the metal shielding case 150 is filled with a sealing material. The sealing effect can be achieved by welding the metal shield 150 to the microwave multilayer board 110 and simultaneously filling the metal shield 150 with a sealing material.
In this embodiment, the metal shielding can 150 can be made of various materials. For example, a shielding material having an effect of insulating a microwave signal and air may be selected. As another example, a solderable wave absorbing material or the like may be used. The purpose is to enable microwave signals to be transmitted within the rf connector 120, which serves as a wrap and tie.
On the basis of the foregoing, the present embodiment further provides a radio frequency system, which includes the interconnection structure 100 described above.
In summary, the embodiment of the invention provides an interconnection structure and a radio frequency system, the radio frequency connector and the microwave multi-layer board are designed into a vertical interconnection structure, and the vertical interconnection structure between the radio frequency connector and the microwave multi-layer board has the advantages of low insertion loss, wide bandwidth and easiness in processing through a multi-stage matching network, meanwhile, a weldable metal shielding cover is added, and a structure capable of being encapsulated is realized by filling sealing materials in the metal shielding cover, so that the reliability of the structure is improved, and signals can be transmitted with low loss and large bandwidth.
The foregoing is merely illustrative of the present invention, and the present invention is not limited thereto, and any changes or substitutions easily contemplated by those skilled in the art within the scope of the present invention should be included in the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. The interconnection structure is characterized by comprising a microwave multilayer board, a radio frequency connector and a matching network;
the radio frequency connector is used for being grounded and interconnected with the microwave multi-layer board and connected with the microstrip line signal;
the matching network is connected between the radio frequency connector and the microstrip line and is used for realizing impedance matching.
2. The interconnect structure of claim 1, wherein the microwave multilayer board is m layers, m being an even number greater than or equal to 2;
the microwave multilayer board is provided with a grounding hole, and the microwave multilayer board connects the ground between the signals of each layer together based on the grounding hole, so that the ground between the layers of the microwave multilayer board is interconnected;
the radio frequency connector is vertically arranged on the microwave multilayer board through the grounding pad, and the grounding part of the radio frequency connector is welded in the grounding hole of the microwave multilayer board.
3. The interconnect structure of claim 2, wherein the radio frequency connector comprises a grounded enclosure vertically disposed on the microwave multilayer board through a ground pad;
a space exists between the grounding pad and the grounding structure, and the space is obtained based on the electrical safety space;
a distance exists between the matching network and the ground structure, which distance is based on the electrical safety distance.
4. The interconnect structure of claim 3 wherein said rf connector further comprises a solder pin, said solder pin being located within said grounded enclosure, said solder pin being vertically secured to said microwave multilayer board by a rf pad;
the length of the radio frequency bonding pad is the length which is obtained through simulation and matched with the impedance of the welding needle.
5. The interconnect structure of claim 2, wherein the plurality of matching networks includes a first matching network and a second matching network;
the transmission line width of the first matching network is larger than the microstrip line width, and the transmission line width of the second matching network is smaller than the microstrip line width.
6. The interconnect structure of claim 5, wherein the first matching network is equivalent to a capacitor in a radio frequency system; the second matching network is equivalent to an inductor in a radio frequency system;
the first matching network and the second matching network form a capacitance-inductance network on a transmission line path of the radio frequency connector and the microstrip line.
7. The interconnection structure of claim 6, wherein one end of a capacitive-inductive network formed by the first matching network and the second matching network is connected to a welding pin of the radio frequency connector, and the other end of the capacitive-inductive network is connected to a microstrip line;
the first matching network, the second matching network and the microstrip line are arranged along the surface of the microwave multilayer board.
8. The interconnect structure of claim 7, wherein the plurality of ground holes are distributed on the microwave multi-layer board, the region where the rf connector projects, and both sides of the region where the first matching network, the second matching network, and the microstrip line project.
9. The interconnect structure of any one of claims 1 to 8, further comprising a metallic shield that is soldered to the microwave multilayer board by a metallic shield soldering pad;
the radio frequency connector is located in the metal shielding cover, and sealing materials are filled in the metal shielding cover.
10. A radio frequency system comprising the interconnect structure of any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310861589.3A CN116707559A (en) | 2023-07-13 | 2023-07-13 | Interconnection structure and radio frequency system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310861589.3A CN116707559A (en) | 2023-07-13 | 2023-07-13 | Interconnection structure and radio frequency system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116707559A true CN116707559A (en) | 2023-09-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310861589.3A Pending CN116707559A (en) | 2023-07-13 | 2023-07-13 | Interconnection structure and radio frequency system |
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| Country | Link |
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| CN (1) | CN116707559A (en) |
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2023
- 2023-07-13 CN CN202310861589.3A patent/CN116707559A/en active Pending
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