TW202210224A - Processing device capable of accurately detecting a depth at which a cutting blade cuts into a workpiece - Google Patents

Processing device capable of accurately detecting a depth at which a cutting blade cuts into a workpiece Download PDF

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Publication number
TW202210224A
TW202210224A TW110131849A TW110131849A TW202210224A TW 202210224 A TW202210224 A TW 202210224A TW 110131849 A TW110131849 A TW 110131849A TW 110131849 A TW110131849 A TW 110131849A TW 202210224 A TW202210224 A TW 202210224A
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unit
cutting
holding surface
holding
light
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TW110131849A
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木佐貫誠
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日商迪思科股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0064Devices for the automatic drive or the program control of the machines
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00Other grinding machines or devices
    • B24B27/06Grinders for cutting-off
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00Other grinding machines or devices
    • B24B27/06Grinders for cutting-off
    • B24B27/0683Accessories therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00Component parts such as frames, beds, carriages, headstocks
    • B24B41/06Work supports, e.g. adjustable steadies
    • B24B41/068Table-like supports for panels, sheets or the like
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00Drives or gearings; Equipment therefor
    • B24B47/10Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
    • B24B47/12Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/14Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the temperature during grinding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B51/00Arrangements for automatic control of a series of individual steps in grinding a workpiece
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304Mechanical treatment, e.g. grinding, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Dicing (AREA)
  • Machine Tool Sensing Apparatuses (AREA)

Abstract

An object of the present invention is to provide a processing device capable of accurately detecting a depth at which a cutting blade cuts into a workpiece. The solution of the present invention is to provide a processing device comprising a setup unit for detecting a tip position of a cutting blade by using the light emitted by a light emitting portion and received by a light-receiving portion; a correction unit for detecting the position of the holding surface and storing the difference between the tip position of the cutting blade detected by the setup unit and the Z direction of the holding surface position as a compensation; and a control unit. When the change amount of the temperature measured by the temperature measuring device has exceeded the threshold value from an arbitrary time point, the control unit detects the position of the holding surface and updates the compensation value by the correction unit, and detects the tip position of the cutting blade by the setup unit again. The processing device further comprises a holding work table having a holding surface for holding the workpiece; a cutting unit using the cutting blade to cut the workpiece held by the holding work table; a Z feed unit for moving the cutting unit in a Z direction perpendicular to the holding surface; a temperature measuring device disposed in the processing device for measuring the temperature; and a camera unit for shooting the workpiece held by the holding work table. The correction unit moves the cutting unit in the Z direction and detects the position of the cutting unit in the Z direction when electrically connected with the holding work table as the height of the holding surface. The correction unit stores the height of the camera unit in the Z direction as the height of the holding surface when the camera unit is focused on the holding surface.

Description

加工裝置Processing device

本發明是有關於一種加工裝置。The present invention relates to a processing device.

已知有一種藉由切削刀片和保持工作台之通電來檢測切削刀片接觸於保持工作台的保持面時的基準位置之方法(參照例如專利文獻1)。又,已知有一種以下之方法:空出供切削刀片侵入之寬度來設置發光部與受光部,且藉由受光部所接收之光來檢測切削刀片的前端位置,藉此求出切削刀片的基準位置(參照例如專利文獻2)。 先前技術文獻 專利文獻There is known a method of detecting a reference position when the cutting insert contacts the holding surface of the holding table by energizing the cutting insert and the holding table (see, for example, Patent Document 1). In addition, there is known a method in which a light-emitting portion and a light-receiving portion are provided with a width in which the cutting insert penetrates, and the tip position of the cutting insert is detected by the light received by the light-receiving portion, thereby obtaining the cutting insert. Reference position (see, for example, Patent Document 2). prior art literature Patent Literature

專利文獻1:日本實用新案登錄第2597808號公報 專利文獻2 :日本特許第4590058號公報Patent Document 1: Japanese Utility Model Registration No. 2597808 Patent Document 2: Japanese Patent No. 4590058

發明欲解決之課題The problem to be solved by the invention

然而,在藉由切削刀片與保持工作台的通電來檢測的方法中,由於會以切削刀片切削保持工作台,因此有以下問題:產生切削刀片的堵塞之疑慮、或因為和使用受光部以及發光部的方法相比較,在基準位置的檢測上較花費時間而導致生產性降低。於是,在以往會進行如下之稱為感測器對位設置(set up)的動作:於保持工作台的更換時藉由切削刀片與保持工作台的通電來檢測出保持面的高度之後,以受光部與發光部來檢測切削刀片的切刃的前端的位置,並檢測保持面與發光部以及受光部之位置關係。並且,在之後的加工中只要未再次更換保持工作台,就將以感測器對位設置方式所檢測出的位置關係設成固定,而僅以由發光部與受光部所進行之檢測來檢測以及控制切削刀片對被加工物之切入深度。但是,實際上會因為加工裝置內的溫度的變動,而導致發光部以及受光部的位置與保持面的位置之相對的位置關係變動之情形,伴隨於這種情形已有以下問題:僅藉由發光部與受光部所進行之檢測並無法正確地檢測以及控制切削刀片切入被加工物之深度。However, in the method of detecting by energization between the cutting insert and the holding table, since the holding table is cut with the cutting insert, there are problems such as the possibility of clogging of the cutting insert, or the use of the light-receiving portion and light emission. Compared with the part method, the detection of the reference position takes time and reduces productivity. Therefore, conventionally, an operation called sensor set up has been performed. When the holding table is replaced, the height of the holding surface is detected by energizing the cutting insert and the holding table, and then the holding surface is energized. The light-receiving part and the light-emitting part detect the position of the front end of the cutting edge of the cutting insert, and detect the positional relationship between the holding surface, the light-emitting part, and the light-receiving part. In addition, as long as the holding table is not replaced again in the subsequent processing, the positional relationship detected by the sensor alignment setting method is fixed, and only the detection by the light-emitting part and the light-receiving part is used for detection. And control the cutting depth of the cutting insert to the workpiece. However, in practice, the relative positional relationship between the positions of the light-emitting portion and the light-receiving portion and the position of the holding surface varies due to temperature fluctuations in the processing apparatus, and the following problems have been associated with this situation. The detection performed by the light-emitting part and the light-receiving part cannot accurately detect and control the depth of the cutting insert cutting into the workpiece.

本發明是有鑒於所述之問題點而作成的發明,其目的在於提供一種可以正確地檢測切削刀片切入被加工物之深度的加工裝置。 用以解決課題之手段The present invention has been made in view of the above-mentioned problems, and an object thereof is to provide a machining apparatus capable of accurately detecting the depth of the cutting insert into a workpiece. means of solving problems

為了解決上述之課題並達成目的,本發明之加工裝置具備:保持工作台,具有保持被加工物之保持面;切削單元,以切削刀片對已保持在該保持工作台之被加工物進行切削;Z進給單元,使該切削單元在相對於該保持面垂直的Z方向上移動;設置單元,具有空出供該切削刀片侵入之寬度而設置之發光部與受光部,且藉由該受光部所接收之光來檢測該切削刀片的前端位置;補正單元,檢測該保持面的Z方向的位置,並將該設置單元所檢測出的該切削刀片的前端位置與該保持面的Z方向之差記憶為補正值;溫度測定器,設置於該加工裝置內,並測定溫度;拍攝單元,拍攝已保持在該保持工作台之被加工物;及控制部,驅動各單元, 該控制部在自任意的時間點起算,該溫度測定器所測定的溫度的變動量已超過閾值的情況下,會再次進行:藉由該補正單元檢測該保持面的高度且進行該補正值的更新之動作、及藉由該設置單元所進行之該切削刀片的前端位置的檢測。In order to solve the above-mentioned problems and achieve the object, the processing apparatus of the present invention includes: a holding table having a holding surface for holding a workpiece; a cutting unit for cutting the workpiece held on the holding table with a cutting blade; A Z feeding unit moves the cutting unit in the Z direction perpendicular to the holding surface; a setting unit has a light-emitting part and a light-receiving part provided to leave a width for the cutting insert to penetrate, and the light-receiving part is provided by the light-receiving part. The received light detects the position of the front end of the cutting insert; the correction unit detects the position of the Z direction of the holding surface, and calculates the difference between the front end position of the cutting insert detected by the setting unit and the Z direction of the holding surface The memory is the correction value; the temperature measuring device is installed in the processing device and measures the temperature; the photographing unit is used to photograph the workpiece that has been held on the holding table; and the control unit is driven by each unit, When the amount of fluctuation of the temperature measured by the temperature measuring device has exceeded a threshold value from an arbitrary point in time, the control unit performs again the process of detecting the height of the holding surface by the correction unit and performing the correction value. The operation of updating, and the detection of the front end position of the cutting insert by the setting unit.

該補正單元亦可將使該切削單元朝Z方向移動並且檢測出和該保持工作台的電導通時的該切削單元的Z方向的位置,檢測為該保持面的高度。The correction unit may move the cutting unit in the Z direction, and detect the position of the cutting unit in the Z direction when electrical continuity with the holding table is performed, and detect it as the height of the holding surface.

該補正單元亦可將已使該拍攝單元的焦點聚焦於該保持面時的該拍攝單元的Z方向的高度記憶為該保持面的高度。 發明效果The correction unit may also memorize the height of the photographing unit in the Z direction when the focus of the photographing unit has been focused on the holding surface as the height of the holding surface. Invention effect

本發明可以正確地檢測切削刀片切入被加工物之深度。The present invention can accurately detect the depth of the cutting insert cutting into the workpiece.

用以實施發明之形態Form for carrying out the invention

針對用於實施本發明之形態(實施形態),一面參照圖式一面詳細地說明。本發明並非因以下的實施形態所記載之內容而受到限定之發明。又,在以下所記載之構成要素中,包含所屬技術領域中具有通常知識者可以容易地設想得到的構成要素、實質上相同的構成要素。此外,以下所記載之構成是可適當組合的。又,在不脫離本發明之要旨的範圍內,可進行構成之各種省略、置換或變更。The form (embodiment) for implementing this invention is demonstrated in detail, referring drawings. The present invention is not limited by the contents described in the following embodiments. In addition, the components described below include components that can be easily assumed by those skilled in the art, and components that are substantially the same. In addition, the configurations described below can be appropriately combined. In addition, various omissions, substitutions, or changes in the configuration can be made without departing from the gist of the present invention.

[實施形態1] 依據圖式來說明本發明的實施形態1之加工裝置1。圖1是顯示實施形態1之加工裝置1的構成例的立體圖。圖2是顯示圖1之設置單元40的構成例的剖面圖。圖3是顯示圖1之補正單元50的構成例的剖面圖。圖4是顯示圖1之保持工作台10、切削單元20以及設置單元40的位置關係之一例的剖面圖。[Embodiment 1] The processing apparatus 1 of Embodiment 1 of this invention is demonstrated based on drawing. FIG. 1 is a perspective view showing a configuration example of a processing apparatus 1 according to the first embodiment. FIG. 2 is a cross-sectional view showing a configuration example of the setting unit 40 of FIG. 1 . FIG. 3 is a cross-sectional view showing a configuration example of the correction unit 50 of FIG. 1 . FIG. 4 is a cross-sectional view showing an example of the positional relationship between the holding table 10 , the cutting unit 20 , and the setting unit 40 of FIG. 1 .

如圖1所示,加工裝置1具備保持工作台10、切削單元20、Z進給單元30、設置單元40、補正單元50、溫度測定器61、62、63、拍攝單元70與控制部80。As shown in FIG. 1 , the processing apparatus 1 includes a holding table 10 , a cutting unit 20 , a Z feed unit 30 , a setting unit 40 , a correction unit 50 , temperature measuring devices 61 , 62 , and 63 , an imaging unit 70 , and a control unit 80 .

實施形態1之加工裝置1的加工對象即被加工物100是例如以矽、藍寶石、碳化矽(SiC)、砷化鎵等作為母材之圓板狀的半導體晶圓或光器件晶圓等。被加工物100在平坦的正面的藉由形成為格子狀的複數條分割預定線所區劃出的區域中形成有晶片尺寸的器件。在實施形態1中,雖然被加工物100如圖1所示,在正面的背側之背面貼附黏著膠帶101,且在黏著膠帶101的外緣部裝設有環狀的框架102,但在本發明中並非限定於此。又,在本發明中,被加工物100亦可為具有複數個被樹脂所密封的器件之矩形狀的封裝基板、陶瓷板、或玻璃板等。The workpiece 100 , which is the object to be processed by the processing apparatus 1 of the first embodiment, is, for example, a disk-shaped semiconductor wafer or an optical device wafer using silicon, sapphire, silicon carbide (SiC), gallium arsenide, or the like as a base material. The workpiece 100 is formed with wafer-sized devices in a region defined by a plurality of predetermined dividing lines formed in a grid shape on the flat front surface. In Embodiment 1, as shown in FIG. 1 , the adhesive tape 101 is attached to the back side of the front side and the back side of the workpiece 100, and the annular frame 102 is attached to the outer edge of the adhesive tape 101. The present invention is not limited to this. Moreover, in this invention, the to-be-processed object 100 may be a rectangular package board|substrate, a ceramic board, a glass board, etc. which have a plurality of devices sealed with resin.

保持工作台10具備形成有凹部之圓板狀的框體11、與嵌入於凹部內之圓板狀的吸附部12。框體11以具有導電性的材料所形成,且在實施形態1中是以不鏽鋼所形成。保持工作台10的吸附部12是由具備有多數個多孔(porous)孔的多孔陶瓷等所形成,且已透過未圖示之真空吸引路徑來和未圖示之真空吸引源連接。如圖1所示,保持工作台10的吸附部12的上表面是保持已被載置之被加工物100的保持面14。保持面14與保持工作台10的框體11的上表面13配置在同一平面上,且平行於水平面即XY平面地形成。保持工作台10藉由未圖示之X進給單元而在水平方向的一個方向即X方向上移動自如,且藉由未圖示之旋轉驅動源而繞著和為鉛直方向且為相對於保持面14垂直之Z方向平行之軸心旋轉自如地設置。The holding table 10 includes a disk-shaped frame body 11 having a recessed portion formed therein, and a disk-shaped suction portion 12 fitted into the recessed portion. The frame body 11 is formed of a material having conductivity, and in Embodiment 1, it is formed of stainless steel. The suction part 12 holding the table 10 is formed of porous ceramics having a plurality of porous holes or the like, and is connected to a vacuum suction source (not shown) through a vacuum suction path (not shown). As shown in FIG. 1, the upper surface of the adsorption|suction part 12 which holds the table 10 is the holding surface 14 which holds the workpiece 100 placed. The holding surface 14 is arranged on the same plane as the upper surface 13 of the frame body 11 holding the table 10 , and is formed parallel to the XY plane, which is a horizontal plane. The holding table 10 is freely movable in the X direction, which is one direction of the horizontal direction, by an X feeding unit (not shown), and is revolved by a rotation driving source (not shown) in the vertical direction and is relative to the holding table 10 . The axis parallel to the vertical Z direction of the surface 14 is rotatably provided.

如圖1所示,切削單元20具有切削刀片21與主軸22。切削刀片21裝設於主軸22的前端,且被施加繞著和為水平方向的另一方向且為正交於X軸方向之Y軸方向平行之軸心的旋轉動作,而對已保持在保持工作台10之被加工物100進行切削。切削單元20可相對於保持工作台10所保持之被加工物100,藉由Y進給單元而在Y方向上移動自如地設置,且藉由Z進給單元30而在Z方向上移動自如地設置。As shown in FIG. 1 , the cutting unit 20 includes a cutting insert 21 and a main shaft 22 . The cutting insert 21 is installed at the front end of the main shaft 22, and is subjected to a rotational motion around an axis that is the other direction of the horizontal direction and is parallel to the Y-axis direction orthogonal to the X-axis direction. The workpiece 100 of the table 10 is cut. With respect to the workpiece 100 held by the holding table 10 , the cutting unit 20 can be movably installed in the Y direction by the Y feed unit, and can be freely moved in the Z direction by the Z feed unit 30 . set up.

切削刀片21具有環狀的切刃,前述切刃由鑽石或CBN(立方氮化硼,Cubic Boron Nitride)等之磨粒、與金屬或樹脂等之黏結材(結合材)所構成且形成為預定厚度。切削刀片21具有導電性。切削刀片21會藉由隨著進行切削磨耗切刃來產生自發刃,而始終維持一定以上的鋒利程度。主軸22具有導電性,且會在前端和切削刀片21電導通。The cutting insert 21 has an annular cutting edge, and the cutting edge is formed of abrasive grains such as diamond or CBN (Cubic Boron Nitride), and a bonding material (bonding material) such as metal or resin, and is formed to be predetermined. thickness. The cutting insert 21 has conductivity. The cutting insert 21 always maintains a certain sharpness or higher by generating a spontaneous edge by abrading the cutting edge as the cutting progresses. The main shaft 22 is electrically conductive, and is electrically connected to the cutting insert 21 at the front end.

加工裝置1藉由X進給單元、Y進給單元以及Z進給單元30來將切削刀片21相對於已保持在保持工作台10之被加工物100設置(set)在預定的位置,並使切削刀片21一邊旋轉一邊沿著分割預定線相對地移動,藉此以切削刀片21對被加工物100進行切削加工來形成沿著分割預定線之切削溝。The machining apparatus 1 sets the cutting insert 21 at a predetermined position with respect to the workpiece 100 held on the holding table 10 by the X feeding unit, the Y feeding unit, and the Z feeding unit 30, and causes the cutting insert 21 to be set at a predetermined position. The cutting insert 21 relatively moves along the planned dividing line while rotating, whereby the workpiece 100 is cut with the cutting insert 21 to form a cutting groove along the planned dividing line.

X進給單元、Y進給單元以及Z進給單元30分別設置有檢測保持工作台10的X方向的位置之未圖示的X方向位置檢測單元、檢測切削單元20的Y方向的位置之未圖示的Y方向位置檢測單元、以及檢測切削單元20的Z方向的位置之Z方向位置檢測單元31。X方向位置檢測單元、Y方向位置檢測單元以及Z方向位置檢測單元31會各自將檢測出的位置輸出至控制部80。又,Z方向位置檢測單元31會將所檢測出的位置輸出至後述之設置單元40的前端位置檢測部48、以及後述之補正單元50的保持面位置檢測部55。The X-feed unit, the Y-feed unit, and the Z-feed unit 30 are respectively provided with an X-direction position detection unit (not shown) for detecting the position of the holding table 10 in the X-direction, and a position detection unit in the Y-direction of the cutting unit 20 , respectively. The illustrated Y-direction position detection means and the Z-direction position detection means 31 that detect the Z-direction position of the cutting means 20 are shown. The X-direction position detection unit, the Y-direction position detection unit, and the Z-direction position detection unit 31 each output the detected position to the control unit 80 . Further, the Z-direction position detection unit 31 outputs the detected position to the front end position detection unit 48 of the setting unit 40 described later and the holding surface position detection unit 55 of the correction unit 50 described later.

X方向位置檢測單元、Y方向位置檢測單元以及Z方向位置檢測單元31可以藉由線性標度尺與讀取頭來構成,前述線性標度尺分別和X方向、Y方向或Z方向平行,前述讀取頭藉由X進給單元、Y進給單元或Z進給單元30而在X軸方向、Y軸方向或Z軸方向上移動自如地設置,且讀取線性標度尺的刻度。再者,X方向位置檢測單元、Y方向位置檢測單元以及Z方向位置檢測單元31在本發明中並不限定於具有線性標度尺與讀取頭的構成,亦可分別為設置於X進給單元、Y進給單元或Z進給單元30的馬達之編碼器。The X-direction position detection unit, the Y-direction position detection unit, and the Z-direction position detection unit 31 may be constituted by a linear scale and a reading head. The linear scales are respectively parallel to the X direction, the Y direction, or the Z direction. The pickup head is movably installed in the X-axis direction, the Y-axis direction, or the Z-axis direction by the X-feed unit, the Y-feed unit, or the Z-feed unit 30, and reads the scale of the linear scale. Furthermore, the X-direction position detection unit, the Y-direction position detection unit, and the Z-direction position detection unit 31 are not limited to the configuration having a linear scale and a reading head in the present invention, and they may be respectively provided in the X feed. Encoder for the motor of the unit, Y feed unit or Z feed unit 30.

如圖2所示,設置單元40具有溝構件41、發光部42、受光部43、光源44、光電轉換部45、基準電壓設定部46、電壓比較部47與前端位置檢測部48。As shown in FIG. 2 , the setting unit 40 includes a groove member 41 , a light-emitting portion 42 , a light-receiving portion 43 , a light source 44 , a photoelectric conversion portion 45 , a reference voltage setting portion 46 , a voltage comparison portion 47 , and a tip position detection portion 48 .

如圖2所示,溝構件41具有基台41-1、及從基台41-1豎立設置的一對側壁部41-2。一對側壁部41-2是在切削刀片21的旋轉軸的方向即Y方向上空出間隔而配置,且相互之間的間隔具有比切削刀片21的切刃的厚度更寬的寬度。一對側壁部41-2在相互之間形成有溝41-3,前述溝41-3可供旋轉的切削刀片21的切刃的下側的前端25侵入。As shown in FIG. 2 , the groove member 41 has a base 41-1 and a pair of side wall portions 41-2 erected from the base 41-1. The pair of side wall portions 41 - 2 are arranged with an interval in the Y direction, which is the direction of the rotation axis of the cutting insert 21 , and the interval therebetween has a width wider than the thickness of the cutting edge of the cutting insert 21 . A groove 41-3 is formed between the pair of side wall portions 41-2, and the front end 25 of the lower side of the cutting edge of the cutting insert 21 in which the groove 41-3 is rotatable penetrates.

如圖2所示,發光部42設置於一邊的側壁部41-2,且朝向另一邊的側壁部41-2發出光。發光部42藉由光纖等對光源44進行光連接,並發出來自光源44之光。As shown in FIG. 2 , the light-emitting portion 42 is provided on one side wall portion 41-2, and emits light toward the other side wall portion 41-2. The light-emitting portion 42 is optically connected to the light source 44 by an optical fiber or the like, and emits light from the light source 44 .

如圖2所示,受光部43在另一邊的側壁部41-2設置在於Y方向上和發光部42面對的位置,並接收來自發光部42之光。受光部43藉由光纖等來對受光元件進行光連接,而以受光元件來檢測到達受光部43之光。受光部43藉由光纖等來對光電轉換部45進行光連接,而將從發光部42所接收到之光傳送至光電轉換部45。As shown in FIG. 2 , the light receiving portion 43 is provided at a position facing the light emitting portion 42 in the Y direction on the other side wall portion 41 - 2 , and receives light from the light emitting portion 42 . The light-receiving portion 43 is optically connected to the light-receiving element by an optical fiber or the like, and the light-receiving element detects the light reaching the light-receiving portion 43 . The light receiving unit 43 is optically connected to the photoelectric conversion unit 45 by an optical fiber or the like, and transmits the light received from the light emitting unit 42 to the photoelectric conversion unit 45 .

光電轉換部45會將和從受光部43所傳送來之光的光量對應之電壓輸出至電壓比較部47。當隨著切削刀片21的切刃的前端25侵入溝41-3,而使切削刀片21的切刃遮蔽發光部42與受光部43之間的量增加時,來自光電轉換部45的輸出電壓會逐漸地減少。在實施形態1中,光電轉換部45在受光部43的受光量相對於發光部42的發光量之比率即受光率為100%時會輸出5V(最大電壓)之電壓,在受光率為0%時會輸出0V(最小電壓)之電壓。光電轉換部45是設定成在受光部43的受光量成為預定光量時,亦即切削刀片21的切刃的前端25已到達發光部42與受光部43之間的預定位置時,輸出電壓會成為預定的基準電壓(在實施形態1中為3V)。The photoelectric conversion unit 45 outputs a voltage corresponding to the light amount of the light transmitted from the light receiving unit 43 to the voltage comparison unit 47 . When the cutting edge of the cutting insert 21 shields the space between the light-emitting portion 42 and the light-receiving portion 43 by increasing the amount by which the cutting edge of the cutting insert 21 penetrates into the groove 41-3, the output voltage from the photoelectric conversion portion 45 increases. gradually decrease. In Embodiment 1, the photoelectric conversion unit 45 outputs a voltage of 5V (maximum voltage) when the light receiving rate is 100%, which is the ratio of the light receiving amount of the light receiving unit 43 to the light emitting amount of the light emitting unit 42, and when the light receiving rate is 0% It will output a voltage of 0V (minimum voltage). The photoelectric conversion unit 45 is set so that when the light receiving amount of the light receiving unit 43 becomes a predetermined light amount, that is, when the front end 25 of the cutting edge of the cutting insert 21 reaches a predetermined position between the light emitting unit 42 and the light receiving unit 43, the output voltage becomes A predetermined reference voltage (3V in Embodiment 1).

基準電壓設定部46會將所設定之預定的基準電壓輸出至電壓比較部47。如上述,預定的基準電壓在實施形態1中為3V。電壓比較部47會比較來自光電轉換部45的輸出電壓與藉由基準電壓設定部46所設定之基準電壓,並在來自光電轉換部45的輸出電壓達到基準電壓時,將表示該意旨之訊號輸出至前端位置檢測部48。前端位置檢測部48會在從電壓比較部47輸出上述訊號的時間點,從Z方向位置檢測單元31取得切削單元20的Z方向的位置。前端位置檢測部48會將此取得之切削單元20的Z方向的位置檢測為切削刀片21的切刃的前端25的位置(圖4的前端位置Z1),並將檢測出之切削刀片21的前端位置Z1輸出至控制部80。The reference voltage setting unit 46 outputs the set predetermined reference voltage to the voltage comparison unit 47 . As described above, the predetermined reference voltage is 3V in the first embodiment. The voltage comparison unit 47 compares the output voltage from the photoelectric conversion unit 45 with the reference voltage set by the reference voltage setting unit 46, and when the output voltage from the photoelectric conversion unit 45 reaches the reference voltage, outputs a signal indicating that to the front end position detection unit 48 . The tip position detection unit 48 acquires the Z-direction position of the cutting unit 20 from the Z-direction position detection unit 31 at the timing when the above-mentioned signal is output from the voltage comparison unit 47 . The leading end position detection unit 48 detects the acquired position in the Z direction of the cutting unit 20 as the position of the leading end 25 of the cutting edge of the cutting insert 21 (the leading end position Z1 in FIG. 4 ), and detects the leading end of the cutting insert 21 . The position Z1 is output to the control unit 80 .

在實施形態1中,設置單元40包含電腦系統。設置單元40具有運算處理裝置、記憶裝置與輸入輸出介面裝置,前述運算處理裝置具有如CPU(中央處理單元,Central Processing Unit)之微處理器,前述記憶裝置具有如ROM(唯讀記憶體,Read Only Memory)或RAM(隨機存取記憶體,Random Access Memory)之記憶體。在實施形態1中,光電轉換部45、基準電壓設定部46、電壓比較部47以及前端位置檢測部48的各個功能,可藉由設置單元40所包含之電腦系統的運算處理裝置執行已記憶於設置單元40所包含之電腦系統的記憶裝置之電腦程式來實現。In Embodiment 1, the setting unit 40 includes a computer system. The setting unit 40 has an arithmetic processing device, a memory device, and an input/output interface device. The aforementioned arithmetic processing device has a microprocessor such as a CPU (Central Processing Unit), and the aforementioned memory device has a ROM (Read Only Memory, Read Only Memory) device. Only Memory) or RAM (Random Access Memory, Random Access Memory). In the first embodiment, the functions of the photoelectric conversion unit 45 , the reference voltage setting unit 46 , the voltage comparison unit 47 and the tip position detection unit 48 can be executed by the arithmetic processing device of the computer system included in the setting unit 40 and stored in the It is realized by the computer program of the memory device of the computer system included in the setting unit 40 .

如圖3所示,補正單元50具有電氣回路51、開關52、電源53、電流計54、保持面位置檢測部55與補正值計算部56。As shown in FIG. 3 , the correction unit 50 includes an electric circuit 51 , a switch 52 , a power supply 53 , a current meter 54 , a holding surface position detection unit 55 , and a correction value calculation unit 56 .

電氣回路51是使保持工作台10的框體11的下方側、與切削單元20的主軸22的基端側導通之回路。開關52、電源53以及電流計54設置在電氣回路51上。開關52會在閉合狀態與斷開狀態之間切換,前述閉合狀態是透過電氣回路51將框體11與主軸22電導通之狀態,前述斷開狀態是讓透過電氣回路51之框體11與主軸22的電導通切斷之狀態。電源53會對電氣回路51施加電壓。電流計54會檢測在電氣回路51流動之電流值,並將電流值的檢測結果輸出至保持面位置檢測部55。The electrical circuit 51 is a circuit that conducts conduction between the lower side of the frame body 11 holding the table 10 and the proximal end side of the main shaft 22 of the cutting unit 20 . The switch 52 , the power source 53 and the ammeter 54 are provided on the electrical circuit 51 . The switch 52 switches between a closed state and an open state. The closed state is a state in which the frame body 11 and the main shaft 22 are electrically connected through the electrical circuit 51 , and the open state is a state in which the frame body 11 and the main shaft through the electrical circuit 51 are electrically connected 22 is the state where the electrical conduction is cut off. The power supply 53 applies a voltage to the electrical circuit 51 . The ammeter 54 detects the current value flowing in the electrical circuit 51 and outputs the detection result of the current value to the holding surface position detection unit 55 .

電氣回路51在開關52為閉合狀態的情況下,當切削刀片21的切刃的前端25接觸於框體11的上表面13而電導通時,會因為和框體11、切削刀片21以及主軸22一起形成閉合回路,所以會根據藉由電源53所施加之電壓而使電流在內部流動。另一方面,電氣回路51在開關52為斷開狀態的情況、或切削刀片21的切刃的前端25未接觸於框體11的上表面13的情況下,由於未形成閉合回路,因此電流不會在內部流動。When the electrical circuit 51 is in the closed state of the switch 52, when the front end 25 of the cutting edge of the cutting insert 21 contacts the upper surface 13 of the frame body 11 and is electrically connected, the electric circuit 51 is electrically connected to the frame body 11, the cutting insert 21 and the main shaft 22. Together, a closed loop is formed, so current flows internally according to the voltage applied by the power source 53 . On the other hand, in the electrical circuit 51, when the switch 52 is turned off, or when the front end 25 of the cutting edge of the cutting insert 21 is not in contact with the upper surface 13 of the casing 11, since a closed circuit is not formed, the current does not flow. will flow internally.

保持面位置檢測部55會在電流計54所檢測出的電流值達到預定的閾值以上的時間點,從Z方向位置檢測單元31取得切削單元20的Z方向的位置(高度)。保持面位置檢測部55會將此已取得之切削單元20的Z方向的位置,檢測為依據切削刀片21的切刃的前端25所計測出的保持面14的Z方向的位置(保持面14的高度,圖4的保持面位置Z2),並將檢測出的保持面位置Z2輸出至控制部80。The holding surface position detection unit 55 acquires the Z-direction position (height) of the cutting unit 20 from the Z-direction position detection unit 31 when the current value detected by the ammeter 54 reaches a predetermined threshold value or more. The holding surface position detection unit 55 detects the acquired Z-direction position of the cutting unit 20 as the Z-direction position of the holding surface 14 measured from the tip end 25 of the cutting edge of the cutting insert 21 (the position of the holding surface 14 height, the holding surface position Z2 in FIG. 4 ), and the detected holding surface position Z2 is output to the control unit 80 .

補正值計算部56會從控制部80取得設置單元40的前端位置檢測部48所檢測出的切削刀片21的前端位置Z1。補正值計算部56會取得保持面位置檢測部55所檢測出的保持面位置Z2。補正值計算部56會計算切削刀片21的前端位置Z1與保持面位置Z2的Z方向之差,並將此差作為補正值ΔZ(參照圖4)來輸出到控制部80並記憶。補正值ΔZ是表示發光部42以及受光部43與保持面14的Z方向的位置關係之參數。補正值計算部56在更換保持工作台10後,必定會實施一次補正值ΔZ的計算。在此,由於加工裝置1在切削刀片21的前端位置Z1與保持面位置Z2的Z方向之差沒有變動的情況下不需要更新補正值ΔZ,因此為了提升生產性以及為了減少切削刀片21切入保持面14而堵塞之疑慮,可在不進行保持面位置Z2的檢測動作的情形下藉由設置單元40來檢測切削刀片21的前端位置Z1,而對切削刀片21的切刃的前端25的Z方向(切入方向)之位置進行再調整。The correction value calculation unit 56 acquires the distal end position Z1 of the cutting insert 21 detected by the distal end position detection unit 48 of the setting unit 40 from the control unit 80 . The correction value calculation unit 56 acquires the holding surface position Z2 detected by the holding surface position detection unit 55 . The correction value calculation unit 56 calculates the difference in the Z direction between the tip position Z1 of the cutting insert 21 and the holding surface position Z2 , and outputs the difference as a correction value ΔZ (see FIG. 4 ) to the control unit 80 and stores the difference. The correction value ΔZ is a parameter indicating the positional relationship between the light-emitting portion 42 and the light-receiving portion 43 and the holding surface 14 in the Z direction. The correction value calculation unit 56 always calculates the correction value ΔZ once after the holding table 10 is replaced. Here, since the machining apparatus 1 does not need to update the correction value ΔZ when the difference in the Z direction between the front end position Z1 of the cutting insert 21 and the holding surface position Z2 does not change, in order to improve productivity and reduce the cutting and holding of the cutting insert 21 If there is a concern that the surface 14 is blocked, the setting unit 40 can detect the front end position Z1 of the cutting insert 21 without performing the detection operation of the holding surface position Z2, and the Z direction of the front end 25 of the cutting edge of the cutting insert 21 can be detected. (cut-in direction) position to readjust.

在實施形態1中,補正單元50會包含和設置單元40同樣的電腦系統。補正單元50具有和設置單元40同樣的運算處理裝置、記憶裝置與輸入輸出介面裝置。在實施形態1中,保持面位置檢測部55以及補正值計算部56的各個功能,可藉由補正單元50所包含的電腦系統的運算處理裝置執行已記憶於補正單元50所包含的電腦系統的記憶裝置之電腦程式來實現。In Embodiment 1, the correction unit 50 includes the same computer system as the setting unit 40 . The correction unit 50 has the same arithmetic processing device, memory device, and input/output interface device as the setting unit 40 . In the first embodiment, the respective functions of the holding surface position detection unit 55 and the correction value calculation unit 56 can be executed by the arithmetic processing device of the computer system included in the correction unit 50 and stored in the computer system included in the correction unit 50. The computer program of the memory device is realized.

在實施形態1中,溫度測定器61是如圖1及圖4所示,設置在支撐保持工作台10之構件的內部,並測定保持工作台10以及保持工作台10附近的溫度T1。在本發明中,溫度測定器61並非限定於此,亦可設置於保持工作台10的內部,亦可接觸於保持台10的外部來設置。溫度測定器61會將所測定到的溫度T1輸出至控制部80。In Embodiment 1, as shown in FIGS. 1 and 4 , the temperature measuring device 61 is installed inside the member supporting and holding the table 10 , and measures the temperature T1 of the holding table 10 and the vicinity of the holding table 10 . In the present invention, the temperature measuring device 61 is not limited to this, and may be installed inside the holding table 10 or may be installed in contact with the outside of the holding table 10 . The temperature measuring device 61 outputs the measured temperature T1 to the control unit 80 .

在實施形態1中,溫度測定器62是如圖1及圖4所示,設置於切削單元20的主軸22的附近,並測定切削單元20以及切削單元20附近的溫度T2。在本發明中,溫度測定器62並非限定於此,亦可接觸於切削單元20的外部來設置,亦可設置於支撐切削單元20的構件的內部。溫度測定器62會將所測定到的溫度T2輸出至控制部80。In Embodiment 1, the temperature measuring device 62 is installed in the vicinity of the main shaft 22 of the cutting unit 20 as shown in FIGS. 1 and 4 , and measures the temperature T2 of the cutting unit 20 and the vicinity of the cutting unit 20 . In the present invention, the temperature measuring device 62 is not limited to this, and may be provided in contact with the outside of the cutting unit 20 , or may be provided inside a member that supports the cutting unit 20 . The temperature measuring device 62 outputs the measured temperature T2 to the control unit 80 .

在實施形態1中,如圖1及圖4所示,溫度測定器63是設置於支撐設置單元40的構件的內部,並測定設置單元40及設置單元40附近的溫度T3。在本發明中,溫度測定器63並非限定於此,亦可設置於設置單元40的內部,亦可接觸於設置單元40的外部來設置。溫度測定器63會將所測定到的溫度T3輸出至控制部80。In Embodiment 1, as shown in FIGS. 1 and 4 , the temperature measuring device 63 is installed inside the member supporting the installation unit 40 , and measures the temperature T3 of the installation unit 40 and the vicinity of the installation unit 40 . In the present invention, the temperature measuring device 63 is not limited to this, and may be installed inside the installation unit 40 or may be installed in contact with the outside of the installation unit 40 . The temperature measuring device 63 outputs the measured temperature T3 to the control unit 80 .

在實施形態1中,溫度測定器61、62、63會在加工裝置1的主電源成為開啟(ON)時,連續地或每隔一定時間地測定溫度T1、T2、T3。在實施形態1中,溫度測定器61、62、63可使用依據雙金屬之變形來測定溫度之熱電偶、或依據電阻的變化來測定溫度之電溫度計。在實施形態1中,雖然將溫度測定器61、62、63設置在加工裝置1內溫度的變動較大,而且在加工裝置1內溫度對切削刀片21的前端位置Z1、保持面位置Z2以及補正值ΔZ的變動所帶來的影響較大之構成要素即保持工作台10、切削單元20以及設置單元40的附近或支撐這些構成要素之構件等處,但在本發明中並非限定於此,亦可設置於加工裝置1內的任意位置。又,在實施形態1中,雖然將溫度測定器61、62、63設置在加工裝置1內的3處,但在本發明中並非限定於此,亦可在設置在1處,亦可設置在2處,亦可設置在4處以上。In Embodiment 1, the temperature measuring devices 61, 62, and 63 measure the temperatures T1, T2, and T3 continuously or at regular intervals when the main power supply of the processing apparatus 1 is turned on. In Embodiment 1, the temperature measuring devices 61, 62, and 63 can use a thermocouple that measures temperature based on deformation of a bimetal, or an electric thermometer that measures temperature based on a change in resistance. In Embodiment 1, although the temperature measuring devices 61 , 62 , and 63 are installed in the processing apparatus 1 , the temperature fluctuation is large, and the temperature in the processing apparatus 1 is affected by the temperature at the tip position Z1 of the cutting insert 21 , the holding surface position Z2 , and the correction. The components that are greatly affected by the fluctuation of the value ΔZ are the vicinity of the holding table 10 , the cutting unit 20 and the setting unit 40 or the members supporting these components, etc., but the present invention is not limited to this, and It can be installed at any position in the processing apparatus 1 . In addition, in Embodiment 1, although the temperature measuring devices 61, 62, and 63 are installed at three places in the processing apparatus 1, the present invention is not limited to this, and may be installed at one place or may be installed at 2 locations, but also 4 or more locations.

在實施形態1中,已將拍攝單元70固定於切削單元20,以和切削單元20一體地移動。拍攝單元70具備有對已保持在保持工作台10之切削加工前的被加工物100的正面以及分割預定線進行拍攝之拍攝元件。拍攝元件可為例如CCD(電荷耦合器件,Charge-Coupled Device)拍攝元件或CMOS(互補式金屬氧化物半導體,Complementary MOS)拍攝元件。拍攝單元70會對已保持在保持工作台10之切削加工前的被加工物100的正面等進行拍攝,而得到用於完成校準等之圖像,並將所得到的圖像輸出至控制部80,其中前述校準是進行被加工物100與切削刀片21的對位。In Embodiment 1, the imaging unit 70 is fixed to the cutting unit 20 so as to move integrally with the cutting unit 20 . The imaging unit 70 is provided with an imaging element for imaging the front surface of the workpiece 100 before the cutting process held on the holding table 10 and the planned dividing line. The imaging element may be, for example, a CCD (Charge-Coupled Device) imaging element or a CMOS (Complementary MOS) imaging element. The imaging unit 70 captures an image of the front surface of the workpiece 100 held on the holding table 10 before cutting to obtain an image for performing calibration and the like, and outputs the obtained image to the control unit 80 , wherein the aforementioned calibration is to perform the alignment of the workpiece 100 and the cutting insert 21 .

控制部80是以下之構成:分別控制加工裝置1的各構成要素,而使加工裝置1實施對被加工物100之有關於切削加工處理等的各動作。控制部80具有位置資訊記憶部81。控制部80會使位置資訊記憶部81記憶位置資訊資料200(參照圖5)。控制部80會參照已記憶於位置資訊記憶部81之位置資訊資料200,而在任意的時間點對從溫度測定器61、62、63所取得的溫度T1、T2、T3、與已記憶為位置資訊資料200的溫度T1、T2、T3進行比較,並判定自已記憶為位置資訊資料200的時間點起算,溫度T1、T2、T3的變動量是否已超過閾值。在此,溫度T1、T2、T3的變動量是在任意的時間點從溫度測定器61、62、63所取得的溫度T1、T2、T3、與已記憶為位置資訊資料200的溫度T1、T2、T3之差。又,溫度T1、T2、T3的變動量之判定基準即閾值,是依據設置有溫度測定器61、62、63的構成要素的Z方向的位置移動±1μm左右時,例如支撐這些構成要素的構件膨脹或收縮±1μm左右時的溫度上升量或溫度下降量來事先適當決定,可為例如±1℃。再者,溫度T1、T2、T3的變動量之判定基準即閾值可為相互相同,亦可為各自不同。控制部80亦可例如在更換保持工作台10時取得包含在位置資訊資料200之各資訊。The control part 80 is a structure which controls each component of the processing apparatus 1 individually, and makes the processing apparatus 1 perform each operation|movement related to cutting processing etc. with respect to the to-be-processed object 100. The control unit 80 has a position information storage unit 81 . The control unit 80 causes the position information storage unit 81 to store the position information data 200 (see FIG. 5 ). The control unit 80 refers to the position information data 200 stored in the position information storage unit 81, and compares the temperatures T1, T2, T3 acquired from the temperature measuring devices 61, 62, and 63, and the stored positions as positions at an arbitrary time point. The temperatures T1 , T2 , and T3 of the information data 200 are compared, and it is determined whether the variation of the temperatures T1 , T2 , and T3 has exceeded a threshold since the time point when the information data 200 was memorized as the position information data 200 . Here, the fluctuation amounts of the temperatures T1, T2, and T3 are the temperatures T1, T2, and T3 acquired from the temperature measuring devices 61, 62, and 63 at arbitrary time points, and the temperatures T1, T2 memorized as the position information data 200. , T3 difference. The threshold value, which is a criterion for determining the amount of fluctuation of the temperatures T1, T2, and T3, is based on, for example, a member that supports the components in which the temperature measuring devices 61, 62, and 63 are placed in the Z-direction when their positions in the Z direction move by about ±1 μm. The amount of temperature increase or the amount of temperature decrease at the time of expansion or contraction of about ±1 μm is appropriately determined in advance, and may be, for example, ±1°C. In addition, the threshold value which is the judgment criterion of the fluctuation amount of temperature T1, T2, T3 may mutually be the same, and may be different from each other. The control part 80 may acquire each information contained in the position information data 200, for example, when the holding table 10 is replaced.

圖5是顯示圖1的位置資訊記憶部81所記憶之位置資訊資料200之一例的圖。在實施形態1中,位置資訊記憶部81是如圖5所示,將以下資料相互建立對應來記憶為位置資訊資料200:控制部80從溫度測定器61、62、63所取得的溫度T1、T2、T3、從前端位置檢測部48所取得的切削刀片21的前端位置Z1、從保持面位置檢測部55所取得的保持面位置Z2、與從補正值計算部56所取得的補正值ΔZ。FIG. 5 is a diagram showing an example of the position information data 200 stored in the position information storage unit 81 of FIG. 1 . In the first embodiment, as shown in FIG. 5 , the position information storage unit 81 stores the following data in correspondence with each other as the position information data 200 : the temperature T1 obtained by the control unit 80 from the temperature measuring devices 61 , 62 , and 63 , T2 and T3, the leading end position Z1 of the cutting insert 21 obtained from the leading end position detecting unit 48 , the holding surface position Z2 obtained from the holding surface position detecting unit 55 , and the correction value ΔZ obtained from the correction value calculating unit 56 .

控制部80在實施形態1中,包含和設置單元40以及補正單元50同樣的電腦系統。控制部80具有和設置單元40以及補正單元50同樣的運算處理裝置、記憶裝置與輸入輸出介面裝置。在實施形態1中,控制部80的功能,可藉由控制部80所包含的電腦系統的運算處理裝置執行已記憶於控制部80所包含的電腦系統的記憶裝置之電腦程式來實現。在實施形態1中,位置資訊記憶部81的功能可藉由控制部80所包含的電腦系統的記憶裝置來實現。The control unit 80 includes the same computer system as the setting unit 40 and the correction unit 50 in the first embodiment. The control unit 80 has the same arithmetic processing device, memory device, and input/output interface device as the setting unit 40 and the correction unit 50 . In Embodiment 1, the function of the control unit 80 can be realized by the arithmetic processing device of the computer system included in the control unit 80 executing a computer program stored in the memory device of the computer system included in the control unit 80 . In the first embodiment, the function of the position information storage unit 81 can be realized by a storage device of a computer system included in the control unit 80 .

加工裝置1更具備片匣載置台91、洗淨單元92與未圖示的搬送單元。片匣載置台91是載置用於容置複數個被加工物100之容置器即片匣95的載置台,且使所載置之片匣95在Z軸方向上升降。洗淨單元92將切削加工後的被加工物100洗淨,並將附著於被加工物100的切削屑等的異物去除。未圖示之搬送單元會將切削加工前的被加工物100從片匣95內搬送至保持工作台10上,並將切削加工後的被加工物100從保持工作台10上搬送至洗淨單元92,且將洗淨後的被加工物100從洗淨單元92搬送至片匣95內。The processing apparatus 1 further includes a cassette mounting table 91, a cleaning unit 92, and a transfer unit not shown. The cassette mounting table 91 is a mounting table for mounting the cassettes 95 , which are containers for accommodating a plurality of workpieces 100 , and moves the mounted cassettes 95 up and down in the Z-axis direction. The cleaning unit 92 cleans the workpiece 100 after cutting, and removes foreign matter such as chips adhering to the workpiece 100 . The transfer unit (not shown) transfers the workpiece 100 before cutting from the cassette 95 to the holding table 10, and transfers the workpiece 100 after cutting from the holding table 10 to the cleaning unit 92 , and the cleaned workpiece 100 is transported from the cleaning unit 92 to the cassette 95 .

接著,本說明書將依據圖式來說明實施形態1之加工裝置1的動作處理之一例。圖6是顯示實施形態1之加工裝置1的動作處理的程序之一例的流程圖。Next, this specification will describe an example of the operation processing of the processing apparatus 1 of Embodiment 1 based on the drawings. FIG. 6 is a flowchart showing an example of a program of operation processing of the processing apparatus 1 according to the first embodiment.

加工裝置1在將主電源從關閉(OFF)切換成開啟(ON)而被起動時、更換保持工作台10或切削刀片21時、或者在受理來自加工裝置1的管理人員或作業人員的預定的操作指令時,會為了在開始被加工物100的切削處理之前校正切削刀片21的前端位置Z1、保持面位置Z2及補正值ΔZ,而實施圖6的步驟1001至步驟1006。When the processing apparatus 1 is activated by switching the main power supply from OFF to ON, when the holding table 10 or the cutting insert 21 is replaced, or when an order is received from an administrator or operator of the processing apparatus 1 . At the time of the operation command, steps 1001 to 1006 in FIG. 6 are executed in order to correct the tip position Z1 , the holding surface position Z2 and the correction value ΔZ of the cutting insert 21 before starting the cutting process of the workpiece 100 .

加工裝置1的溫度測定器61、62、63會測定溫度T1、T2、T3,並將測定結果輸出至控制部80(圖6的步驟1001)。加工裝置1會藉由Z進給單元30使切削單元20下降而使切削刀片21的切刃的前端25侵入設置單元40的溝41-3,且藉由設置單元40的前端位置檢測部48來檢測切削刀片21的前端位置Z1,並輸出至控制部80(圖6之步驟1002)。The temperature measuring devices 61, 62, and 63 of the processing apparatus 1 measure the temperatures T1, T2, and T3, and output the measurement results to the control unit 80 (step 1001 in FIG. 6 ). The machining apparatus 1 lowers the cutting unit 20 by the Z feed unit 30 so that the leading end 25 of the cutting edge of the cutting insert 21 penetrates into the groove 41 - 3 of the setting unit 40 , and is detected by the leading end position detection unit 48 of the setting unit 40 . The tip position Z1 of the cutting insert 21 is detected and output to the control unit 80 (step 1002 in FIG. 6 ).

加工裝置1會藉由Z進給單元30使切削單元20下降,而使切削刀片21的切刃的前端25接觸於保持工作台10的框體11的上表面13,並藉由補正單元50的保持面位置檢測部55檢測保持面位置Z2,且輸出至控制部80(圖6之步驟1003)。The machining device 1 lowers the cutting unit 20 by the Z feed unit 30 , so that the front end 25 of the cutting edge of the cutting insert 21 contacts the upper surface 13 of the frame body 11 holding the table 10 , and the correction unit 50 moves. The holding surface position detection unit 55 detects the holding surface position Z2 and outputs it to the control unit 80 (step 1003 in FIG. 6 ).

加工裝置1會藉由補正單元50的補正值計算部56,並依據在步驟1002中所檢測出的切削刀片21的前端位置Z1、與在步驟1003中所檢測出的保持面位置Z2,來計算補正值ΔZ並輸出至控制部80(圖6之步驟1004)。The machining apparatus 1 calculates the correction value calculation unit 56 of the correction unit 50 based on the tip position Z1 of the cutting insert 21 detected in step 1002 and the holding surface position Z2 detected in step 1003 . The correction value ΔZ is output to the control unit 80 (step 1004 in FIG. 6 ).

再者,在本發明中,加工裝置1只要在步驟1002以及步驟1003之後實施步驟1004,則無論以何種順序來實施步驟1001到步驟1004皆可。Furthermore, in the present invention, as long as the processing apparatus 1 executes the step 1004 after the step 1002 and the step 1003, the step 1001 to the step 1004 may be executed in any order.

加工裝置1的控制部80會讓以下資料相互建立對應而作為位置資訊資料200來記憶於位置資訊記憶部81:在步驟1001中所測定到的溫度T1、T2、T3、在步驟1002中所檢測出的切削刀片21的前端位置Z1、在步驟1003中所檢測出的保持面位置Z2、與在步驟1004中所計算出的補正值ΔZ(圖6的步驟1005)。The control unit 80 of the processing apparatus 1 associates the following data with each other and stores them in the position information memory unit 81 as the position information data 200 : the temperatures T1 , T2 , T3 measured in step 1001 , the temperatures T1 , T2 , and T3 detected in step 1002 The detected tip position Z1 of the cutting insert 21, the holding surface position Z2 detected in step 1003, and the correction value ΔZ calculated in step 1004 (step 1005 in FIG. 6 ).

加工裝置1將被加工物100搬送至保持工作台10的保持面14上,並以保持工作台10吸引保持被加工物100,且以拍攝單元70拍攝保持工作台10上的被加工物100的正面等而完成校準,其中前述校準是進行被加工物100與切削刀片21的對位。加工裝置1在校準的完成後,會參照已在步驟1005中記憶於位置資訊記憶部81之位置資訊資料200,並藉由Z進給單元30來調整切削刀片21的切刃的前端25的Z方向(切入方向)的位置(圖6的步驟1006)。The processing apparatus 1 conveys the workpiece 100 to the holding surface 14 of the holding table 10 , sucks and holds the workpiece 100 by the holding table 10 , and captures the image of the workpiece 100 on the holding table 10 with the imaging unit 70 . The calibration is completed by facing the front surface, etc., wherein the above-mentioned calibration is to perform the alignment of the workpiece 100 and the cutting insert 21 . After the calibration is completed, the processing device 1 will refer to the position information data 200 stored in the position information memory unit 81 in step 1005 , and adjust the Z of the front end 25 of the cutting edge of the cutting insert 21 by the Z feed unit 30 . The position of the direction (cut-in direction) (step 1006 of FIG. 6 ).

加工裝置1會藉由已在步驟1006中調整Z方向的位置之切削刀片21來開始被加工物100的切削加工(圖6的步驟1007)。加工裝置1會讓已在步驟1006中調整Z方向的位置之切削刀片21旋轉,並且藉由Y進給單元將切削刀片21的Y方向(分度進給方向)的位置調整到分割預定線上,藉由X進給單元使切削刀片21與保持工作台10上的被加工物100沿著分割預定線在X方向(加工進給方向)上相對地移動,來沿著分割預定線對被加工物100進行切削加工。The machining apparatus 1 starts cutting of the workpiece 100 with the cutting insert 21 whose position in the Z direction has been adjusted in step 1006 (step 1007 in FIG. 6 ). The machining device 1 rotates the cutting insert 21 whose position in the Z direction has been adjusted in step 1006, and adjusts the position of the cutting insert 21 in the Y direction (indexing feed direction) to the dividing line by the Y feed unit, By the X feed unit, the cutting insert 21 and the workpiece 100 on the holding table 10 are relatively moved in the X direction (machining feed direction) along the line to be divided, so that the workpiece is aligned along the line to be divided. 100 for cutting.

加工裝置1的溫度測定器61、62、63在被加工物100的切削加工的開始(步驟1007)後也會是連續地或每隔一定時間地測定溫度T1、T2、T3,並將測定結果輸出至控制部80。加工裝置1的控制部80在每次從溫度測定器61、62、63輸出溫度T1、T2、T3時,會對所輸出的溫度T1、T2、T3、與已在緊接在前的步驟1005中記憶為位置資訊資料200的溫度T1、T2、T3進行比較,而判定自緊接在前的步驟1005的時間點起算,溫度T1、T2、T3的變動量是否已超過閾值(圖6的步驟1008)。The temperature measuring devices 61 , 62 , and 63 of the processing apparatus 1 also measure the temperatures T1 , T2 , and T3 continuously or at regular intervals after the start of the machining of the workpiece 100 (step 1007 ), and use the measurement results. output to the control unit 80 . Each time the temperature T1, T2, T3 is output from the temperature measuring devices 61, 62, and 63, the control unit 80 of the processing apparatus 1 compares the output temperatures T1, T2, T3 with the immediately preceding step 1005. The temperature T1, T2, T3 stored in the position information data 200 is compared, and it is determined whether the fluctuation amount of the temperature T1, T2, T3 has exceeded the threshold value since the time point of the immediately preceding step 1005 (the step of FIG. 6 ). 1008).

加工裝置1在自緊接在前的步驟1005的時間點起算,溫度T1、T2、T3的至少任一個的變動量超過閾值的情況下(在步驟1008中為「是」),會讓切削刀片21從被加工物100退避而中斷被加工物100的切削加工(圖6的步驟1009),並將已在緊接在前的步驟1008中所測定到的溫度T1、T2、T3視為在步驟1001中所測定到者,而再次實施步驟1002至步驟1006,且更新切削刀片21的前端位置Z1、保持面位置Z2以及補正值ΔZ,而對切削刀片21的切刃的前端25之Z方向(切入方向)的位置進行再調整。When the amount of fluctuation of at least any one of the temperatures T1, T2, and T3 exceeds the threshold value from the time point in the immediately preceding step 1005 (Yes in the step 1008 ), the machining device 1 causes the cutting insert to be 21 Retract from the workpiece 100 to interrupt the machining of the workpiece 100 (step 1009 in FIG. 6 ), and regard the temperatures T1, T2, T3 measured in the immediately preceding step 1008 as the step Steps 1002 to 1006 are carried out again, and the front end position Z1, the holding surface position Z2 and the correction value ΔZ of the cutting insert 21 are updated, and the Z direction ( Readjust the position of the cut-in direction).

加工裝置1在自緊接在前的步驟1005的時間點起算,溫度T1、T2、T3的任一個變動量都未超過閾值的情況下(在步驟1008中為「否」),會繼續被加工物100的切削加工(圖6的步驟1010)。加工裝置1在結束被加工物100的切削加工以前(在圖6的步驟1011中為「否」),會重複步驟1008,當結束被加工物100的切削加工時(在圖6的步驟1011中為「是」),即結束一連串的動作處理。The processing apparatus 1 continues to be processed if none of the fluctuations in the temperatures T1, T2, and T3 exceeds the threshold value from the time point in the immediately preceding step 1005 (NO in step 1008 ). The cutting process of the object 100 (step 1010 of FIG. 6 ). The processing apparatus 1 repeats step 1008 until the cutting of the workpiece 100 is completed (NO in step 1011 in FIG. 6 ), and when the cutting of the workpiece 100 is completed (in step 1011 in FIG. 6 ) "Yes"), that is, a series of action processing is ended.

又,加工裝置1在已將主電源設為開啟(ON)的狀態下不更換保持工作台10或切削刀片21,而在例如對和之前所切削加工之被加工物100相同種類的被加工物100再度進行切削加工之類的情況等之下,控制部80會對溫度測定器61、62、63所測定到的溫度T1、T2、T3、與最後記憶為位置資訊資料200的溫度T1、T2、T3進行比較,來判定自最後記憶為位置資訊資料200的時間點起算,溫度T1、T2、T3的變動量是否超過閾值。加工裝置1在自最後記憶為位置資訊資料200的時間點起算,溫度T1、T2、T3的至少任一個的變動量已超過閾值的情況下,會再次實施和上述之步驟1002至步驟1006同樣的動作處理,並更新切削刀片21的前端位置Z1、保持面位置Z2以及補正值ΔZ,而對切削刀片21的切刃的前端25之Z方向(切入方向)的位置進行再調整。另一方面,加工裝置1在自最後記憶為位置資訊資料200的時間點起算,溫度T1、T2、T3的任一個的變動量都未超過閾值的情況下,會僅考慮因切削刀片21的切刃的磨耗所造成之前端位置Z1的變動,而僅實施由設置單元40所進行之切削刀片21的前端位置Z1的檢測,並藉由控制部80,使用最後記憶為位置資訊資料200的補正值ΔZ來計算切削加工時的切削刀片21的基準位置即保持面位置Z2,並依據此計算出的保持面位置Z2來調整切削刀片21的切刃的前端25之Z方向(切入方向)的位置。In addition, the processing apparatus 1 does not replace the holding table 10 or the cutting insert 21 in a state where the main power is turned ON, but, for example, applies the same kind of workpiece to the workpiece 100 previously cut. When the 100 performs cutting processing again, the control unit 80 compares the temperatures T1 , T2 , T3 measured by the temperature measuring devices 61 , 62 , and 63 and the temperatures T1 , T2 last memorized as the position information data 200 . , and T3 are compared to determine whether the fluctuations of the temperatures T1 , T2 , and T3 exceed the threshold value since the time point last memorized as the position information data 200 . The processing device 1 performs the same steps as the above-mentioned steps 1002 to 1006 again when the amount of variation of at least any one of the temperatures T1, T2, and T3 has exceeded the threshold value since the time point that was last memorized as the position information data 200. After the operation process, the tip position Z1, the holding surface position Z2, and the correction value ΔZ of the cutting insert 21 are updated, and the position in the Z direction (cutting direction) of the tip 25 of the cutting edge of the cutting insert 21 is readjusted. On the other hand, the machining apparatus 1 considers only the cutting due to the cutting insert 21 when the fluctuation amount of any one of the temperatures T1 , T2 , and T3 does not exceed the threshold value since the last time point stored as the position information data 200 . For the change of the leading end position Z1 caused by the wear of the blade, only the detection of the leading end position Z1 of the cutting insert 21 by the setting unit 40 is carried out, and the correction value finally memorized as the position information data 200 is used by the control unit 80 . The holding surface position Z2, which is the reference position of the cutting insert 21 during cutting, is calculated by ΔZ, and the position of the front end 25 of the cutting edge of the cutting insert 21 in the Z direction (cutting direction) is adjusted based on the calculated holding surface position Z2.

再者,在實施形態1中,雖然控制部80是依據自最後記憶為位置資訊資料200的時間點起算之溫度T1、T2、T3的變動量是否超過閾值的判定結果,來決定是否再次實施藉由設置單元40所進行之切削刀片21的前端位置Z1的檢測動作、與藉由補正單元50所進行之保持面位置Z2的檢測動作以及補正值ΔZ的更新動作,但在本發明中並非限定於此,亦可依據自任意的時間點起算之溫度T1、T2、T3的變動量是否超過閾值的判定結果,來決定是否再次實施這些檢測動作或更新動作。Furthermore, in Embodiment 1, although the control unit 80 determines whether or not to execute the borrowing again based on the result of the determination as to whether the fluctuations of the temperatures T1, T2, and T3 from the time point last memorized as the position information data 200 exceed the threshold value or not. The detection operation of the front end position Z1 of the cutting insert 21 by the setting unit 40, the detection operation of the holding surface position Z2 by the correction unit 50, and the update operation of the correction value ΔZ are not limited in the present invention. Here, it is also possible to determine whether to perform the detection operation or the update operation again based on the determination result of whether the fluctuation amounts of the temperatures T1 , T2 , and T3 from an arbitrary time point exceed the threshold value.

具有如以上之構成的實施形態1之加工裝置1,由於可做到:控制部80會在溫度測定器61、62、63所測定的溫度T1、T2、T3的變動量已超過閾值的情況下,進行切削刀片21的前端位置Z1與保持面位置Z2之差即補正值ΔZ的更新,並依據已更新之補正值ΔZ來調整切削刀片21的切刃的前端25之Z方向(切入方向)的位置,因此會發揮以下的作用效果:依據因應於溫度T1、T2、T3的變動量而適當更新之補正值ΔZ,可以正確地檢測以及控制切削刀片21切入被加工物100之深度。The processing apparatus 1 according to the first embodiment having the above-described configuration can make it possible for the control unit 80 to detect when the fluctuation amounts of the temperatures T1, T2, and T3 measured by the temperature measuring devices 61, 62, and 63 have exceeded the threshold value. , the correction value ΔZ, which is the difference between the front end position Z1 of the cutting insert 21 and the holding surface position Z2, is updated, and the Z direction (cutting direction) of the front end 25 of the cutting edge of the cutting insert 21 is adjusted according to the updated correction value ΔZ. Therefore, according to the correction value ΔZ appropriately updated according to the fluctuations of the temperatures T1, T2, and T3, the depth of the cutting insert 21 cutting into the workpiece 100 can be accurately detected and controlled.

又,實施形態1之加工裝置1在溫度測定器61、62、63所測定的溫度T1、T2、T3的變動量未超過閾值的情況下,會原樣直接採用緊接在前所計算並已記憶之補正值ΔZ,且僅實施由設置單元40所進行之切削刀片21的前端位置Z1的檢測,來調整切削刀片21的切刃的前端25之Z方向(切入方向)的位置。以往所進行的則是以下之感測器對位設置:在保持工作台的更換時接觸於保持面來進行保持面位置的檢測後,藉由發光部以及受光部來檢測刀片的前端位置,且記憶保持面與發光部以及受光部的位置關係。並且,以往因為會假定之後該等位置關係不會改變,而僅利用藉由發光部以及受光部所進行之檢測來調整切削刀片的切刃的前端之Z方向(切入方向)的位置,所以在保持面與發光部以及受光部的位置關係已因溫度變化而改變的情況下,會無法正確地檢測以及控制切削刀片切入被加工物之切入深度。於是,由於實施形態1之加工裝置1在溫度測定器61、62、63所測定之溫度T1、T2、T3的變動量已超過閾值的情況下,會再次檢測保持面14的高度(保持面位置Z2)與由設置單元40所檢測之切削刀片21的高度(前端位置Z1)並更新補正值ΔZ,因此可以比以往更正確地檢測以及控制切削刀片21對被加工物100之切入深度。又,實施形態1之加工裝置1由於僅在溫度T1、T2、T3的變動量超過閾值的情況下,為了進行補正值ΔZ的更新而實施由補正單元50所進行之保持面位置Z2的檢測處理,因此可以將使切削刀片21接觸於保持工作台10的框體11的上表面13之機會設到最小限度,而降低切削刀片21的堵塞的產生之疑慮。In addition, in the processing apparatus 1 of the first embodiment, when the fluctuations of the temperatures T1, T2, and T3 measured by the temperature measuring devices 61, 62, and 63 do not exceed the thresholds, the values calculated immediately before are used as they are and stored in the memory. The correction value ΔZ, and only the detection of the front end position Z1 of the cutting insert 21 by the setting unit 40 is performed to adjust the position of the front end 25 of the cutting edge of the cutting insert 21 in the Z direction (cutting direction). In the past, the following sensor alignment was performed: after the position of the holding surface was detected by contacting the holding surface when the holding table was replaced, the tip position of the blade was detected by the light-emitting part and the light-receiving part, and The positional relationship between the holding surface and the light-emitting part and the light-receiving part is memorized. Furthermore, in the past, it was assumed that the positional relationship would not change in the future, and only the detection by the light-emitting part and the light-receiving part was used to adjust the position of the tip of the cutting edge in the Z direction (cutting direction) of the cutting insert. If the positional relationship between the holding surface and the light-emitting portion and the light-receiving portion has changed due to temperature changes, it is impossible to accurately detect and control the depth of penetration of the cutting insert into the workpiece. Therefore, since the processing apparatus 1 of the first embodiment detects the height of the holding surface 14 (the position of the holding surface) again when the fluctuation amounts of the temperatures T1, T2, and T3 measured by the temperature measuring devices 61, 62, and 63 have exceeded the threshold value. Z2) and the height (tip position Z1) of the cutting insert 21 detected by the setting unit 40 are updated with the correction value ΔZ, so that the depth of penetration of the cutting insert 21 into the workpiece 100 can be detected and controlled more accurately than before. In addition, in the processing apparatus 1 according to the first embodiment, the correction unit 50 executes the detection process of the holding surface position Z2 by the correction unit 50 to update the correction value ΔZ only when the fluctuation amounts of the temperatures T1, T2, and T3 exceed the threshold values. Therefore, the chance of the cutting insert 21 coming into contact with the upper surface 13 of the frame body 11 holding the table 10 can be minimized, thereby reducing the possibility of clogging of the cutting insert 21 .

又,實施形態1之加工裝置1是補正單元50將在讓切削單元20朝Z方向移動並且檢測出和保持工作台10之電導通時之切削單元20的Z方向的位置,檢測為保持面14的高度(保持面位置Z2)。因此,實施形態1之加工裝置1可以正確地檢測以及控制切削刀片21對被加工物100之切入深度。In addition, in the machining apparatus 1 of the first embodiment, the correction unit 50 detects the position of the cutting unit 20 in the Z direction when the cutting unit 20 is moved in the Z direction and the electrical continuity between the table 10 is detected and held as the holding surface 14 . height (holds face position Z2). Therefore, the machining apparatus 1 according to the first embodiment can accurately detect and control the depth of penetration of the cutting insert 21 into the workpiece 100 .

[實施形態2] 說明本發明之實施形態2的加工裝置1。實施形態2之加工裝置1實質上使和切削單元20一體地移動之拍攝單元70實施在實施形態1中補正單元50所實施之檢測保持面位置Z2之功能。具體而言,在實施形態2中,拍攝單元70會從Z方向位置檢測單元31取得已使拍攝單元70的焦點聚焦於和保持面14在相同平面上之保持工作台10的框體11的上表面13時的切削單元20的Z方向的位置,並且將此取得之切削單元20的Z方向的位置輸出至控制部80。[Embodiment 2] A processing apparatus 1 according to Embodiment 2 of the present invention will be described. In the processing apparatus 1 of the second embodiment, the imaging unit 70 that moves integrally with the cutting unit 20 substantially performs the function of detecting the holding surface position Z2 performed by the correction unit 50 in the first embodiment. Specifically, in Embodiment 2, the imaging unit 70 acquires from the Z-direction position detection unit 31 that the imaging unit 70 has been focused on the upper frame 11 holding the table 10 on the same plane as the holding surface 14 . The Z-direction position of the cutting unit 20 at the surface 13 is output, and the obtained Z-direction position of the cutting unit 20 is output to the control unit 80 .

在此,由於可以藉由考慮切削單元20與拍攝單元70的Z方向的位置之差來計算拍攝單元70的Z方向的高度,因此已使此拍攝單元70的焦點聚焦於上表面13時之切削單元20的Z方向的位置會相當於拍攝單元70的Z方向的高度之檢測值。又,由於可以藉由進一步考慮依據拍攝單元70的焦點所計算之拍攝單元70與保持工作台10的框體11的上表面13之距離,來計算保持面位置Z2,因此已使此拍攝單元70的焦點聚焦於上表面13時之切削單元20的Z方向的位置會相當於保持面位置Z2之檢測值。有鑒於此,控制部80可以將已使拍攝單元70的焦點聚焦於上表面13時之切削單元20的Z方向的位置,看待成實質上和保持面位置Z2同等。Here, since the height of the photographing unit 70 in the Z direction can be calculated by considering the difference between the positions of the cutting unit 20 and the photographing unit 70 in the Z direction, the cutting when the focus of the photographing unit 70 is focused on the upper surface 13 The position of the unit 20 in the Z direction corresponds to the detected value of the height of the imaging unit 70 in the Z direction. Also, since the holding surface position Z2 can be calculated by further considering the distance between the photographing unit 70 and the upper surface 13 of the frame body 11 holding the table 10, which is calculated according to the focus of the photographing unit 70, the photographing unit 70 has been The position of the cutting unit 20 in the Z direction when the focal point is focused on the upper surface 13 corresponds to the detected value of the holding surface position Z2. In view of this, the control unit 80 may regard the position in the Z direction of the cutting unit 20 when the focus of the imaging unit 70 has been focused on the upper surface 13 as substantially the same as the holding surface position Z2.

實施形態2之加工裝置1由於將已使拍攝單元70的焦點聚焦於保持面14的高度時之切削單元20的Z方向的位置看待成和保持面位置Z2同等,因此和實施形態1比較,可以藉由避免使切削刀片21接觸於保持工作台10的框體11的上表面13之作法,來進一步防止切削刀片21的堵塞的產生之疑慮並且使生產性提升。又,實施形態2之加工裝置1會和實施形態1同樣地進行並發揮以下的作用效果:在保持工作台10的更換時,相較於對保持面14的框體11切入切削刀片21來檢測保持面14的高度(保持面位置Z2)之後,僅以由發光部以及受光部所進行之檢測來調整切削刀片對被加工物之切入深度的以往裝置,可以正確地檢測以及控制切削刀片21對被加工物100之切入深度。In the processing apparatus 1 of the second embodiment, the position in the Z direction of the cutting unit 20 when the focal point of the imaging unit 70 has been focused on the height of the holding surface 14 is regarded as the same as the holding surface position Z2. Therefore, compared with the first embodiment, it can be By avoiding contact of the cutting inserts 21 with the upper surface 13 of the frame body 11 holding the table 10, the possibility of clogging of the cutting inserts 21 is further prevented and productivity is improved. In addition, the processing apparatus 1 of the second embodiment performs the same operation as the first embodiment, and has the following effect: when the holding table 10 is replaced, the cutting insert 21 is detected by cutting into the frame body 11 of the holding surface 14 . After the height of the holding surface 14 (holding surface position Z2), the conventional device that adjusts the depth of penetration of the cutting insert into the workpiece only by detection by the light-emitting portion and the light-receiving portion can accurately detect and control the cutting insert 21 pair. The cutting depth of the workpiece 100.

再者,本發明並非限定於上述實施形態之發明。亦即,在不脫離本發明之要點的範圍內,可以進行各種變形來實施。In addition, this invention is not limited to the invention of the said embodiment. That is, various deformation|transformation can be carried out in the range which does not deviate from the summary of this invention.

1:加工裝置 10:保持工作台 11:框體 12:吸附部 13:上表面 14:保持面 20:切削單元 21:切削刀片 22:主軸 25:切刃的前端 30:Z進給單元 31:Z方向位置檢測單元 40:設置單元 41:溝構件 41-1:基台 41-2:側壁部 41-3:溝 42:發光部 43:受光部 44:光源 45:光電轉換部 46:基準電壓設定部 47:電壓比較部 48:前端位置檢測部 50:補正單元 51:電氣回路 52:開關 53:電源 54:電流計 55:保持面位置檢測部 56:補正值計算部 61,62,63:溫度測定器 70:拍攝單元 80:控制部 81:位置資訊記憶部 91:片匣載置台 92:洗淨單元 95:片匣 100:被加工物 101:黏著膠帶 102:框架 200:位置資訊資料 1001~1011:步驟 T1,T2,T3:溫度 X,Y,Z:方向 Z1:切削刀片的前端位置 Z2:保持面位置 ΔZ:補正值1: Processing device 10: Keep the workbench 11: Frame 12: Adsorption part 13: Upper surface 14: Keep Faces 20: Cutting unit 21: Cutting inserts 22: Spindle 25: Front end of cutting edge 30: Z feed unit 31: Z direction position detection unit 40: Setup Unit 41: Groove member 41-1: Abutment 41-2: Side wall part 41-3: Ditch 42: Light-emitting part 43: Light Receiver 44: Light source 45: Photoelectric conversion department 46: Reference voltage setting section 47: Voltage comparison part 48: Front end position detection section 50: Correction unit 51: Electrical circuit 52: switch 53: Power 54: Galvanometer 55: Holding surface position detection section 56: Correction value calculation section 61, 62, 63: Thermometer 70: Shooting unit 80: Control Department 81: Location Information Memory Department 91: Cassette stage 92: Washing unit 95: cassette 100: processed object 101: Adhesive tape 102: Frames 200: Location information data 1001~1011: Steps T1, T2, T3: temperature X,Y,Z: direction Z1: Front end position of cutting insert Z2: keep face position ΔZ: correction value

圖1是顯示實施形態1之加工裝置的構成例的立體圖。 圖2是顯示圖1之設置單元之構成例的剖面圖。 圖3是顯示圖1之補正單元的構成例的剖面圖。 圖4是顯示圖1之保持工作台、切削單元以及設置單元的位置關係之一例的剖面圖。 圖5是顯示圖1之位置資訊記憶部所記憶之位置資訊資料之一例的圖。 圖6是顯示實施形態1之加工裝置的動作處理的程序之一例的流程圖。FIG. 1 is a perspective view showing a configuration example of a processing apparatus according to Embodiment 1. FIG. FIG. 2 is a cross-sectional view showing a configuration example of the installation unit of FIG. 1 . FIG. 3 is a cross-sectional view showing a configuration example of the correction unit of FIG. 1 . FIG. 4 is a cross-sectional view showing an example of the positional relationship between the holding table, the cutting unit, and the setting unit in FIG. 1 . FIG. 5 is a diagram showing an example of position information data stored in the position information storage unit of FIG. 1 . FIG. 6 is a flowchart showing an example of a program of operation processing of the processing apparatus according to Embodiment 1. FIG.

10:保持工作台10: Keep the workbench

14:保持面14: Keep Faces

20:切削單元20: Cutting unit

21:切削刀片21: Cutting inserts

22:主軸22: Spindle

25:切刃的前端25: Front end of cutting edge

30:Z進給單元30: Z feed unit

31:Z方向位置檢測單元31: Z direction position detection unit

40:設置單元40: Setup Unit

61,62,63:溫度測定器61, 62, 63: Thermometer

T1,T2,T3:溫度T1, T2, T3: temperature

X,Y,Z:方向X,Y,Z: direction

Z1:切削刀片的前端位置Z1: Front end position of cutting insert

Z2:保持面位置Z2: keep face position

△Z:補正值△Z: correction value

Claims (3)

一種加工裝置,具備: 保持工作台,具有保持被加工物之保持面; 切削單元,以切削刀片對已保持在該保持工作台之被加工物進行切削; Z進給單元,使該切削單元在相對於該保持面垂直的Z方向上移動; 設置單元,具有空出供該切削刀片侵入之寬度而設置之發光部與受光部,且藉由該受光部所接收之光來檢測該切削刀片的前端位置; 補正單元,檢測該保持面的Z方向的位置,並將該設置單元所檢測出的該切削刀片的前端位置與該保持面的Z方向之差記憶為補正值; 溫度測定器,設置於該加工裝置內,並測定溫度; 拍攝單元,拍攝已保持在該保持工作台之被加工物;及 控制部,驅動各單元, 該控制部在自任意的時間點起算,該溫度測定器所測定之溫度的變動量已超過閾值的情況下,會再次進行:藉由該補正單元檢測該保持面的高度且進行該補正值的更新之動作、及藉由該設置單元所進行之該切削刀片的前端位置的檢測。A processing device, comprising: The holding table has a holding surface for holding the processed object; a cutting unit, which uses a cutting blade to cut the workpiece that has been held on the holding table; The Z feed unit moves the cutting unit in the Z direction perpendicular to the holding surface; a setting unit, which has a light-emitting part and a light-receiving part arranged to leave a width for the cutting insert to penetrate, and detects the front end position of the cutting insert by the light received by the light-receiving part; The correction unit detects the position in the Z direction of the holding surface, and memorizes the difference between the front end position of the cutting insert detected by the setting unit and the Z direction of the holding surface as a correction value; A temperature measuring device, which is arranged in the processing device and measures the temperature; A photographing unit for photographing the processed objects that have been held on the holding table; and The control unit drives each unit, When the amount of fluctuation of the temperature measured by the temperature measuring device has exceeded a threshold value from an arbitrary point in time, the control unit performs again: the height of the holding surface is detected by the correction unit and the correction value is performed. The operation of updating, and the detection of the front end position of the cutting insert by the setting unit. 如請求項1之加工裝置,其中該補正單元會將使該切削單元朝Z方向移動並且檢測出和該保持工作台的電導通時的該切削單元的Z方向的位置,檢測為該保持面的高度。The processing apparatus of claim 1, wherein the correction unit moves the cutting unit in the Z direction and detects the position of the cutting unit in the Z direction when electrical continuity with the holding table is detected as the position of the holding surface. high. 如請求項1之加工裝置,其中該補正單元會將已使該拍攝單元的焦點聚焦於該保持面時的該拍攝單元的Z方向的高度記憶為該保持面的高度。The processing device of claim 1, wherein the correction unit memorizes the height of the photographing unit in the Z direction when the focal point of the photographing unit is focused on the holding surface as the height of the holding surface.
TW110131849A 2020-09-04 2021-08-27 Processing device capable of accurately detecting a depth at which a cutting blade cuts into a workpiece TW202210224A (en)

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