TW202209536A - Substrate processing apparatus - Google Patents

Substrate processing apparatus Download PDF

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TW202209536A
TW202209536A TW110126441A TW110126441A TW202209536A TW 202209536 A TW202209536 A TW 202209536A TW 110126441 A TW110126441 A TW 110126441A TW 110126441 A TW110126441 A TW 110126441A TW 202209536 A TW202209536 A TW 202209536A
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space
stage
substrate
conveyance
transfer
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TW110126441A
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TWI793680B (en
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河原啓之
菊本憲幸
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日商斯庫林集團股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
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    • H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
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    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
    • H—ELECTRICITY
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path
    • H—ELECTRICITY
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks

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  • Engineering & Computer Science (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
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  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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Abstract

The present invention provides a substrate processing apparatus. A substrate processing apparatus (1) includes a first transport section (6a) and a second transport section (6b). The second transport section (6b) is located below the first transport section (6a). The first transport section (6a) includes a first transport space (61a), first transport FFUs (11 and 12), and a first floor section (71). The first transport FFUs (11 and 12) are located above the first transport space (61a). The first floor section (71) has a plurality of first through holes. The first floor section (71) is located below the first transport space (61a). The second transport section (6b) includes a second transport space (61b), second transport FFUs (13 and 14), a second floor section (72), and an exhaust fan (73). The second transport FFUs (13 and 14) are located below the first floor section (71). The second floor section (72) has a plurality of through holes. The second floor section (72) is located below the second transport space (61b). The exhaust fan (73) is located blow the second floor section (72.).

Description

基板處理裝置Substrate processing equipment

本發明係關於一種基板處理裝置。The present invention relates to a substrate processing apparatus.

已知一種基板處理裝置，其具備上段之處理塊與下段之處理塊(例如，參照專利文獻1)。上段之處理塊及下段之處理塊分別具有處理基板之處理單元，基板處理裝置具備將基板搬送至上段側之處理單元之搬送裝置、及將基板搬送至下段側之處理單元之搬送裝置。上段側之搬送裝置於與上段之處理塊鄰接之搬送空間內移行，下段側之搬送裝置於與下段之處理塊鄰接之搬送空間內移行。上段側之搬送空間與下段側之搬送空間由間隔壁等區隔。  [先前技術文獻]  [專利文獻]A substrate processing apparatus is known which includes an upper processing block and a lower processing block (for example, refer to Patent Document 1). The processing block in the upper stage and the processing block in the lower stage each have a processing unit for processing the substrate, and the substrate processing apparatus includes a transport device for transporting the substrate to the processing unit on the upper stage side, and a transport device for transporting the substrate to the processing unit on the lower stage side. The conveying device on the upper stage moves in the conveying space adjacent to the processing block in the upper stage, and the conveying device on the lower stage moves in the conveying space adjacent to the processing block in the lower stage. The conveyance space on the upper stage side and the conveyance space on the lower stage side are partitioned by a partition wall or the like. [Prior Art Literature] [Patent Literature]

[專利文獻1]日本專利特開2016-201526號公報[Patent Document 1] Japanese Patent Laid-Open No. 2016-201526

[發明所欲解決之問題][Problems to be Solved by Invention]

然而，搬送裝置於上段側之搬送空間內移行有時會使上段側之搬送空間內之氣流混亂。同樣地，搬送裝置於下段側之搬送空間內移行有時會使下段側之搬送空間內之氣流混亂。因此，必須抑制上段側之搬送空間內之氣流混亂。同樣地，必須抑制下段側之搬送空間內之氣流混亂。However, the movement of the conveying device in the conveying space on the upper stage side may disturb the airflow in the conveying space on the upper stage side. Similarly, the movement of the conveying device in the conveying space on the lower stage side may disturb the airflow in the conveying space on the lower stage side. Therefore, it is necessary to suppress the disturbance of the airflow in the conveyance space on the upper stage side. Likewise, it is necessary to suppress disturbance of the airflow in the conveyance space on the lower stage side.

本發明係鑒於上述問題而完成者，其目的在於提供一種能抑制上段側之搬送空間內之氣流混亂、及下段側之搬送空間內之氣流混亂之基板處理裝置。  [解決問題之技術手段]The present invention has been made in view of the above problems, and an object of the present invention is to provide a substrate processing apparatus capable of suppressing disturbance of airflow in the conveying space on the upper stage side and disturbance of airflow in the conveying space on the lower stage side. [Technical means to solve problems]

根據本發明之一態樣，基板處理裝置處理基板。該基板處理裝置具備處理部、第1搬送部及第2搬送部。上述處理部處理上述基板。上述第1搬送部與上述處理部鄰接。上述第2搬送部與上述處理部鄰接，設置於上述第1搬送部之下方。上述第1搬送部具有第1基板搬送部、第1搬送空間、第1搬送風扇過濾單元及第1底部。上述第1基板搬送部搬送上述基板。於上述第1搬送空間內，收容上述第1基板搬送部。上述第1搬送風扇過濾單元設置於上述第1搬送空間之上方，自上述第1搬送空間之上方朝向下方供給氣體。上述第1底部具有複數個第1通過孔。上述第1底部設置於上述第1搬送空間之下方。上述第2搬送部具有第2基板搬送部、第2搬送空間、第2搬送風扇過濾單元、第2底部及排氣風扇。上述第2基板搬送部搬送上述基板。於上述第2搬送空間內，收容上述第2基板搬送部。上述第2搬送風扇過濾單元設置於上述第1底部之下方，自上述第2搬送空間之上方朝向下方供給氣體。上述第2底部具有複數個第2通過孔。上述第2底部設置於上述第2搬送空間之下方。上述排氣風扇設置於上述第2底部之下方。上述排氣風扇將通過上述複數個第2通過孔之氣體排出。According to an aspect of the present invention, a substrate processing apparatus processes a substrate. This substrate processing apparatus includes a processing unit, a first conveyance unit, and a second conveyance unit. The said processing part processes the said board|substrate. The said 1st conveyance part is adjacent to the said processing part. The said 2nd conveyance part is adjacent to the said process part, and is provided below the said 1st conveyance part. The said 1st conveyance part has a 1st board|substrate conveyance part, a 1st conveyance space, a 1st conveyance fan filter unit, and a 1st bottom part. The said 1st board|substrate conveyance part conveys the said board|substrate. The said 1st board|substrate conveyance part is accommodated in the said 1st conveyance space. The said 1st conveyance fan filter unit is provided in the upper direction of the said 1st conveyance space, and gas is supplied toward the downward direction from the upper direction of the said 1st conveyance space. The first bottom portion has a plurality of first passage holes. The said 1st bottom part is provided below the said 1st conveyance space. The said 2nd conveyance part has a 2nd board|substrate conveyance part, a 2nd conveyance space, a 2nd conveyance fan filter unit, a 2nd bottom part, and an exhaust fan. The said 2nd board|substrate conveyance part conveys the said board|substrate. The said 2nd board|substrate conveyance part is accommodated in the said 2nd conveyance space. The said 2nd conveyance fan filter unit is installed below the said 1st bottom part, and supplies gas toward the downward direction from the upper direction of the said 2nd conveyance space. The second bottom portion has a plurality of second passage holes. The said 2nd bottom part is provided below the said 2nd conveyance space. The said exhaust fan is provided below the said 2nd bottom part. The exhaust fan discharges the gas passing through the plurality of second passage holes.

某實施方式中，上述第1搬送部進而具有與上述處理部鄰接之第1側壁部。上述第2搬送部進而具有與上述處理部鄰接之第2側壁部。上述第2側壁部設置於上述第1側壁部之下方。上述第1側壁部與上述第2側壁部中之至少一者進而具有間隙形成部。上述間隙形成部於上述第1側壁部與上述第2側壁部之間形成間隙。In one Embodiment, the said 1st conveyance part further has the 1st side wall part adjacent to the said processing part. The said 2nd conveyance part further has the 2nd side wall part adjacent to the said processing part. The second side wall portion is provided below the first side wall portion. At least one of the said 1st side wall part and the said 2nd side wall part further has a clearance gap formation part. The gap forming portion forms a gap between the first side wall portion and the second side wall portion.

某實施方式中，上述第1搬送部與上述第2搬送部中之至少一者進而具有開口率調整構件。上述開口率調整構件調整上述間隙之開口率。In one Embodiment, at least one of the said 1st conveyance part and the said 2nd conveyance part further has an aperture ratio adjustment member. The aperture ratio adjusting member adjusts the aperture ratio of the gap.

某實施方式中，上述第1搬送部具有複數個上述第1搬送風扇過濾單元。In one Embodiment, the said 1st conveyance part has a some said 1st conveyance fan filter unit.

某實施方式中，上述第1基板搬送部包含在上述第1搬送空間內移動之第1搬送機器人。上述複數個第1搬送風扇過濾單元以覆蓋上述第1搬送機器人之移動範圍之方式配置。In one Embodiment, the said 1st board|substrate conveyance part contains the 1st conveyance robot which moves in the said 1st conveyance space. The plurality of first conveyance fan filter units are arranged so as to cover the moving range of the first conveyance robot.

某實施方式中，上述第2搬送部具有複數個上述第2搬送風扇過濾單元。In one Embodiment, the said 2nd conveyance part has a some said 2nd conveyance fan filter unit.

某實施方式中，上述第2基板搬送部包含在上述第2搬送空間內移動之第2搬送機器人。上述複數個第2搬送風扇過濾單元以覆蓋上述第2搬送機器人之移動範圍之方式配置。In one Embodiment, the said 2nd board|substrate conveyance part contains the 2nd conveyance robot which moves in the said 2nd conveyance space. The said plural 2nd conveyance fan filter unit is arrange|positioned so that the movement range of the said 2nd conveyance robot may be covered.

某實施方式中，上述第1搬送部進而具有設置於上述第1底部之第1整流部。上述第1整流部對通過上述複數個第1通過孔之氣體進行整流。In one Embodiment, the said 1st conveyance part further has the 1st rectification|straightening part provided in the said 1st bottom part. The first rectifying portion rectifies the gas passing through the plurality of first passage holes.

某實施方式中，上述第2搬送風扇過濾單元具有風扇、箱狀構件及第2整流部。上述箱狀構件支持上述風扇。上述第2整流部設置於上述箱狀構件。上述第2整流部對通過上述複數個第1通過孔之氣體進行整流。In one Embodiment, the said 2nd conveyance fan filter unit has a fan, a box-shaped member, and a 2nd rectification|straightening part. The box-shaped member supports the fan. The said 2nd rectification|straightening part is provided in the said box-shaped member. The second rectifying portion rectifies the gas passing through the plurality of first passage holes.

某實施方式中，上述第2搬送部進而具有頂部與第3整流部。於上述頂部設置上述第2搬送風扇過濾單元。上述第3整流部設置於上述頂部。上述第3整流部對通過上述複數個第1通過孔之氣體進行整流。In one Embodiment, the said 2nd conveyance part further has a top part and a 3rd rectification|straightening part. The said 2nd conveyance fan filter unit is installed in the said top part. The said 3rd rectification|straightening part is provided in the said top part. The third rectifying portion rectifies the gas passing through the plurality of first passage holes.

某實施方式中，上述基板處理裝置進而具備傳載部、第1路徑部及第2路徑部。上述傳載部進行上述基板之搬入及搬出。上述第1路徑部設置於上述傳載部與上述第1搬送部之間。於上述第1路徑部，暫時載置上述基板。上述第2路徑部設置於上述傳載部與上述第2搬送部之間。於上述第2路徑部，暫時載置上述基板。上述傳載部具有傳載搬送部、傳載空間及傳載風扇過濾單元部。上述傳載搬送部進行上述基板之搬入及搬出。於上述傳載空間內，收容上述傳載搬送部。上述傳載風扇過濾單元部設置於上述傳載空間之上方，自上述傳載空間之上方朝向下方供給氣體。In one embodiment, the substrate processing apparatus further includes a transfer unit, a first path unit, and a second path unit. The carrying part carries out the carrying in and carrying out of the board. The said 1st path part is provided between the said conveyance part and the said 1st conveyance part. On the said 1st path part, the said board|substrate is temporarily mounted. The said 2nd path part is provided between the said conveyance part and the said 2nd conveyance part. The said board|substrate is temporarily mounted on the said 2nd path part. The said carrying part has a carrying conveying part, a carrying space, and a carrying fan filter unit part. The above-mentioned carrying and conveying part carries out the carrying-in and carrying-out of the above-mentioned board|substrate. In the said conveyance space, the said conveyance conveyance part is accommodated. The said carrier fan filter unit part is provided above the said carrier space, and the gas is supplied from the upper side of the said carrier space toward the downward direction.

某實施方式中，上述傳載風扇過濾單元部具有第1傳載風扇過濾單元與第2傳載風扇過濾單元。上述第1傳載風扇過濾單元配置於與上述第1路徑部及上述第2路徑部側相反之側。上述第2傳載風扇過濾單元配置於上述第1路徑部及上述第2路徑部側。In one embodiment, the above-mentioned carrier fan filter unit includes a first carrier fan filter unit and a second carrier fan filter unit. The said 1st transmission fan filter unit is arrange|positioned at the side opposite to the said 1st path part and the said 2nd path part side. The said 2nd transmission fan filter unit is arrange|positioned at the side of the said 1st path part and the said 2nd path part.

某實施方式中，上述傳載部進而具有第1開口與第2開口。上述第1開口與上述第1路徑部連通。上述第2開口與上述第2路徑部連通。上述第2開口設置於上述第1開口之下方。上述傳載風扇過濾單元部進而具有第3傳載風扇過濾單元。上述第3傳載風扇過濾單元於自正面觀察上述第1開口及上述第2開口時，配置於上述第1傳載風扇過濾單元及上述第2傳載風扇過濾單元之一側方。In one Embodiment, the said transmission part further has a 1st opening and a 2nd opening. The first opening communicates with the first path portion. The second opening communicates with the second path portion. The second opening is provided below the first opening. The said carrier fan filter unit part further has a 3rd carrier fan filter unit. The third transmission fan filter unit is disposed on one side of the first transmission fan filter unit and the second transmission fan filter unit when the first opening and the second opening are viewed from the front.

某實施方式中，上述傳載空間包含第1傳載空間與第2傳載空間。上述第2傳載空間於自正面觀察上述第1開口及上述第2開口時，位於上述第1傳載空間之一側方。上述第1傳載空間之最上部位於較上述第2傳載空間之最上部更靠上方。上述第1傳載風扇過濾單元及上述第2傳載風扇過濾單元自上述第1傳載空間之上方朝向下方供給氣體。上述第3傳載風扇過濾單元自上述第2傳載空間之上方朝向下方供給氣體。In one embodiment, the above-mentioned transmission space includes a first transmission space and a second transmission space. The said 2nd carrying space is located in one side of the said 1st carrying space when the said 1st opening and the said 2nd opening are seen from the front. The uppermost part of the said 1st carrying space is located above the uppermost part of the said 2nd carrying space. The said 1st carrier fan filter unit and the said 2nd carrier fan filter unit supply gas toward the downward direction from the upper direction of the said 1st carrier space. The said 3rd carrier fan filter unit supplies gas toward the downward direction from the upper direction of the said 2nd carrier space.

某實施方式中，上述傳載搬送部包含傳載搬送機器人與導軌。上述傳載搬送機器人搬送上述基板。上述導軌於上下方向上引導上述傳載搬送機器人。上述第3傳載風扇過濾單元於自正面觀察上述第1開口及上述第2開口時，配置於與上述導軌側相反之側。In one embodiment, the transfer unit includes a transfer robot and a guide rail. The above-mentioned transfer robot conveys the above-mentioned substrate. The said guide rail guides the said transfer robot in an up-down direction. The said 3rd transmission fan filter unit is arrange|positioned at the side opposite to the said guide rail side, when the said 1st opening and the said 2nd opening are seen from the front.

某實施方式中，上述排氣風扇產生自上述傳載空間經由上述第2路徑部流向上述第2搬送空間之氣流。  [發明之效果]In one Embodiment, the said exhaust fan generates the airflow which flows into the said 2nd conveyance space via the said 2nd path part from the said conveyance space. [Effect of invention]

根據本發明之基板處理裝置，能抑制上段側之搬送空間內之氣流混亂、及下段側之搬送空間內之氣流混亂。According to the substrate processing apparatus of the present invention, it is possible to suppress the disturbance of the airflow in the conveyance space on the upper stage side and the disturbance of the airflow in the conveyance space on the lower stage side.

以下，參照圖式(圖1～圖13)，對本發明之基板處理裝置之實施方式進行說明。但是，本發明並不限定於以下實施方式。再者，針對說明重複之部位，有時會適當省略說明。又，圖中，對相同或相當之部分標註相同之參考符號，不重複進行說明。Hereinafter, embodiments of the substrate processing apparatus of the present invention will be described with reference to the drawings ( FIGS. 1 to 13 ). However, the present invention is not limited to the following embodiments. In addition, regarding the part where description is repeated, description may be abbreviate|omitted suitably. In addition, in the drawings, the same or corresponding parts are denoted by the same reference numerals, and the description thereof will not be repeated.

本說明書中，為了便於理解，有時記載相互正交之X方向、Y方向及Z方向。典型而言，X方向及Y方向與水平方向平行，Z方向與鉛直方向平行。但是，並不意圖藉由該等方向之定義，來限定本發明之基板處理裝置於使用時之朝向。In this specification, in order to facilitate understanding, the X direction, the Y direction, and the Z direction which are orthogonal to each other may be described. Typically, the X direction and the Y direction are parallel to the horizontal direction, and the Z direction is parallel to the vertical direction. However, it is not intended that the orientation of the substrate processing apparatus of the present invention in use is limited by the definitions of these directions.

本實施方式中之「基板」能應用半導體晶圓、光罩用玻璃基板、液晶顯示用玻璃基板、電漿顯示用玻璃基板、FED(Field Emission Display，場發射顯示器)用基板、光碟用基板、磁碟用基板及磁光碟用基板等各種基板。以下，主要採用圓盤狀半導體晶圓之處理中所使用之基板處理裝置為例對本實施方式進行說明，但亦能同樣地應用於以上所例示之各種基板之處理中。又，基板之形狀亦能應用各種形狀。The "substrate" in this embodiment can be applied to semiconductor wafers, glass substrates for masks, glass substrates for liquid crystal displays, glass substrates for plasma displays, substrates for FED (Field Emission Display), substrates for optical discs, Various substrates such as substrates for magnetic disks and substrates for magneto-optical disks. Hereinafter, the present embodiment will be described mainly by taking a substrate processing apparatus used for processing a disk-shaped semiconductor wafer as an example, but the present embodiment can be similarly applied to the processing of various substrates exemplified above. In addition, various shapes can be applied to the shape of the substrate.

[實施方式1]  以下，參照圖1～圖11，對本發明之實施方式1進行說明。首先，參照圖1，對本實施方式之基板處理裝置1進行說明。圖1係表示本實施方式之基板處理裝置1之整體構成之立體圖。基板處理裝置1處理基板W。如圖1所示，基板處理裝置1具備傳載塊3、路徑塊4、處理塊5、搬送塊6及多功能塊7。[Embodiment 1] Hereinafter, Embodiment 1 of the present invention will be described with reference to FIGS. 1 to 11 . First, with reference to FIG. 1, the substrate processing apparatus 1 of this embodiment is demonstrated. FIG. 1 is a perspective view showing the overall configuration of a substrate processing apparatus 1 according to the present embodiment. The substrate processing apparatus 1 processes the substrate W. As shown in FIG. 1 , the substrate processing apparatus 1 includes a carrier block 3 , a path block 4 , a processing block 5 , a transfer block 6 , and a multifunctional block 7 .

傳載塊3具備載具載置部31。本實施方式中，傳載塊3具備4個載具載置部31。於載具載置部31，載置載具C。載具C將複數片(例如，25片)基板W以積層之方式收納。載具C例如為FOUP(Front Opening Unified Pod，前開式晶圓傳送盒)。以下，將載置於載具載置部31之載具C記載為「載具C」。The carrier block 3 includes a carrier mounting portion 31 . In the present embodiment, the transfer block 3 includes four carrier mounting portions 31 . The carrier C is mounted on the carrier mounting portion 31 . The carrier C accommodates a plurality of (for example, 25) substrates W in a stacked manner. The carrier C is, for example, a FOUP (Front Opening Unified Pod). Hereinafter, the carrier C mounted on the carrier mounting portion 31 will be described as "carrier C".

傳載塊3將收納於載具C之處理前之基板W搬入至傳載塊3之內部空間。又，傳載塊3將處理後之基板W自傳載塊3之內部空間搬出至外部。具體而言，傳載塊3將處理後之基板W收納於載具C。傳載塊3係傳載部之一例。The carrier block 3 carries the pre-processed substrate W accommodated in the carrier C into the inner space of the carrier block 3 . Moreover, the transfer block 3 carries out the processed substrate W from the inner space of the transfer block 3 to the outside. Specifically, the carrier block 3 accommodates the processed substrate W in the carrier C. As shown in FIG. The transfer block 3 is an example of the transfer unit.

路徑塊4設置於傳載塊3與搬送塊6之間。傳載塊3、路徑塊4及搬送塊6沿X方向配置。具體而言，路徑塊4配置於傳載塊3之-X側，搬送塊6配置於路徑塊4之-X側。The path block 4 is provided between the transfer block 3 and the transfer block 6 . The transfer block 3, the path block 4, and the transfer block 6 are arranged along the X direction. Specifically, the path block 4 is arranged on the -X side of the transfer block 3 , and the transfer block 6 is arranged on the -X side of the path block 4 .

於路徑塊4中，暫時載置處理前之基板W及處理後之基板W。傳載塊3將處理前之基板W自載具C搬送至路徑塊4。又，傳載塊3將處理後之基板W自路徑塊4搬送至載具C。再者，路徑塊4亦可具備使基板W之正面及背面翻轉之機構。In the path block 4, the substrate W before processing and the substrate W after processing are temporarily placed. The carrier block 3 transfers the substrate W before processing from the carrier C to the path block 4 . In addition, the transfer block 3 transfers the processed substrate W to the carrier C from the routing block 4 . Furthermore, the path block 4 may also be provided with a mechanism for inverting the front and back surfaces of the substrate W. As shown in FIG.

搬送塊6與處理塊5鄰接。搬送塊6將處理前之基板W自路徑塊4搬送至處理塊5。又，搬送塊6將處理後之基板W自處理塊5搬送至路徑塊4。The transfer block 6 is adjacent to the processing block 5 . The transfer block 6 transfers the substrate W before processing from the path block 4 to the processing block 5 . In addition, the transfer block 6 transfers the processed substrate W from the processing block 5 to the path block 4 .

處理塊5處理基板W。處理塊5例如將基板W洗淨。處理塊5係處理部之一例。多功能塊7將處理液供給至處理塊5。處理液包含藥液。處理液亦可進而包含DIW(deionized water，去離子水)。多功能塊7亦可進一步將例如氮氣或空氣等氣體供給至處理塊5。The processing block 5 processes the substrate W. The processing block 5 cleans the substrate W, for example. The processing block 5 is an example of a processing unit. The multifunctional block 7 supplies the processing liquid to the processing block 5 . The treatment liquid contains a chemical liquid. The treatment liquid may further include DIW (deionized water, deionized water). The multifunctional block 7 may further supply gas such as nitrogen or air to the processing block 5 .

本實施方式之基板處理裝置1具有2個處理塊5。2個處理塊5與搬送塊6鄰接。詳細而言，2個處理塊5中之一個相對於搬送塊6配置於-Y側，2個處理塊5中之另一個相對於搬送塊6配置於+Y側。以下，將相對於搬送塊6配置於-Y側之處理塊5記載為「-Y側之處理塊5」，將相對於搬送塊6配置於+Y側之處理塊5記載為「+Y側之處理塊5」。The substrate processing apparatus 1 of the present embodiment includes two processing blocks 5 . The two processing blocks 5 are adjacent to the conveying block 6 . Specifically, one of the two processing blocks 5 is arranged on the -Y side with respect to the conveying block 6 , and the other of the two processing blocks 5 is arranged on the +Y side with respect to the conveying block 6 . Hereinafter, the processing block 5 arranged on the -Y side with respect to the transport block 6 will be described as "the processing block 5 on the -Y side", and the processing block 5 arranged on the +Y side with respect to the transport block 6 will be described as "+Y side" processing block 5".

繼而，參照圖2，進一步對本實施方式之基板處理裝置1進行說明。圖2係本實施方式之基板處理裝置1之分解立體圖。Next, referring to FIG. 2 , the substrate processing apparatus 1 of the present embodiment will be further described. FIG. 2 is an exploded perspective view of the substrate processing apparatus 1 of the present embodiment.

如圖2所示，2個處理塊5分別包含塔單元TW，該塔單元TW包含於上下方向(Z方向)上積層之複數個處理單元2。本實施方式中，-Y側之處理塊5包含2個塔單元TW1、TW3，+Y側之處理塊5包含2個塔單元TW2、TW4。2個塔單元TW1、TW3沿X方向配置。具體而言，塔單元TW3配置於塔單元TW1之-X側。2個塔單元TW2、TW4亦同樣，沿X方向配置。具體而言，塔單元TW4配置於塔單元TW2之-X側。As shown in FIG. 2 , each of the two processing blocks 5 includes a tower unit TW including a plurality of processing units 2 stacked in the vertical direction (Z direction). In this embodiment, the processing block 5 on the -Y side includes two tower units TW1 and TW3, and the processing block 5 on the +Y side includes two tower units TW2 and TW4. The two tower units TW1 and TW3 are arranged along the X direction. Specifically, the tower unit TW3 is arranged on the -X side of the tower unit TW1. Similarly, the two tower units TW2 and TW4 are arranged in the X direction. Specifically, the tower unit TW4 is arranged on the -X side of the tower unit TW2.

本實施方式中，各塔單元TW1～TW4具有4個處理單元2。以下，有時將4個塔單元TW1～TW4分別記載為「第1塔單元TW1～第4塔單元TW4」。In the present embodiment, each of the tower units TW1 to TW4 has four processing units 2 . Hereinafter, the four tower units TW1 to TW4 may be referred to as "the first tower unit TW1 to the fourth tower unit TW4", respectively.

繼而，參照圖3，進一步對本實施方式之基板處理裝置1進行說明。圖3係表示本實施方式之基板處理裝置1之內部構成之側視圖。詳細而言，圖3表示自+Y側觀察時之基板處理裝置1之內部構成。首先，參照圖3對傳載塊3及路徑塊4進行說明。Next, referring to FIG. 3 , the substrate processing apparatus 1 of the present embodiment will be further described. FIG. 3 is a side view showing the internal structure of the substrate processing apparatus 1 of the present embodiment. Specifically, FIG. 3 shows the internal configuration of the substrate processing apparatus 1 when viewed from the +Y side. First, the carrier block 3 and the path block 4 will be described with reference to FIG. 3 .

如圖3所示，傳載塊3具備傳載空間3a與傳載搬送部32。路徑塊4具備上段路徑部41與下段路徑部42。上段路徑部41設置於下段路徑部42之上方(+Z側)。As shown in FIG. 3 , the carrier block 3 includes a carrier space 3 a and a carrier transfer portion 32 . The path block 4 includes an upper path portion 41 and a lower path portion 42 . The upper path portion 41 is provided above (+Z side) the lower path portion 42 .

於上段路徑部41，暫時載置處理前之基板W與處理後之基板W。同樣地，於下段路徑部42，暫時載置處理前之基板W與處理後之基板W。再者，上段路徑部41亦可具備使基板W之正面及背面翻轉之機構。同樣地，下段路徑部42亦可具備使基板W之正面及背面翻轉之機構。上段路徑部41係第1路徑部之一例，下段路徑部42係第2路徑部之一例。On the upper path portion 41, the substrate W before processing and the substrate W after processing are temporarily placed. Similarly, the substrate W before processing and the substrate W after processing are temporarily placed on the lower path portion 42 . In addition, the upper-stage path part 41 may be equipped with the mechanism which reverses the front surface and the back surface of the board|substrate W. Similarly, the lower path portion 42 may be provided with a mechanism for inverting the front and rear surfaces of the substrate W. As shown in FIG. The upper path portion 41 is an example of the first path portion, and the lower path portion 42 is an example of the second path portion.

傳載搬送部32收容於傳載空間3a。傳載搬送部32將收納於載具C之處理前之基板W搬入傳載空間3a。又，傳載搬送部32將處理後之基板W自傳載空間3a搬出至外部。具體而言，傳載搬送部32將處理後之基板W收納於載具C。The transfer conveyance part 32 is accommodated in the transfer space 3a. The carrying and conveying part 32 carries the substrate W before processing which is accommodated in the carrier C into the carrying space 3a. In addition, the carrying and conveying part 32 carries out the processed board|substrate W from the carrying space 3a to the outside. Specifically, the transfer unit 32 accommodates the processed substrate W in the carrier C. As shown in FIG.

又，傳載搬送部32將處理前之基板W搬送至上段路徑部41及下段路徑部42。傳載搬送部32將處理後之基板W自上段路徑部41及下段路徑部42搬送至載具C。Moreover, the conveyance conveyance part 32 conveys the substrate W before processing to the upper stage path part 41 and the lower stage path part 42 . The transfer unit 32 transfers the processed substrate W to the carrier C from the upper path portion 41 and the lower path portion 42 .

更具體而言，傳載搬送部32具有搬送基板W之傳載搬送機器人33、及導軌34。導軌34將傳載搬送機器人33於上下方向(Z方向)上引導。More specifically, the transfer unit 32 includes a transfer robot 33 that transfers the substrate W, and a guide rail 34 . The guide rails 34 guide the transfer robot 33 in the up-down direction (Z direction).

傳載搬送機器人33沿導軌34升降。詳細而言，傳載搬送機器人33於能進出載具C之位置、能進出上段路徑部41之位置、及能進出下段路徑部42之位置之間升降。The transfer robot 33 ascends and descends along the guide rails 34 . Specifically, the transfer robot 33 ascends and descends between a position where it can enter and exit the carrier C, a position where it can enter and exit the upper path portion 41 , and a position where it can enter and exit the lower path portion 42 .

傳載搬送機器人33移動至能進出載具C之位置，自載具C取出處理前之基板W。又，傳載搬送機器人33移動至能進出載具C之位置，將處理後之基板W收納於載具C。The transfer robot 33 moves to a position where it can enter and exit the carrier C, and takes out the substrate W before processing from the carrier C. As shown in FIG. Moreover, the transfer robot 33 moves to the position which can enter and exit the carrier C, and accommodates the processed board|substrate W in the carrier C. As shown in FIG.

傳載搬送機器人33移動至能進出上段路徑部41之位置，將處理前之基板W載置於上段路徑部41。又，傳載搬送機器人33移動至能進出上段路徑部41之位置，將處理後之基板W自上段路徑部41取出。The transfer robot 33 is moved to a position where it can enter and exit the upper path portion 41 , and the substrate W before processing is placed on the upper path portion 41 . In addition, the transfer robot 33 moves to a position where it can enter and exit the upper path portion 41 , and takes out the processed substrate W from the upper path portion 41 .

傳載搬送機器人33移動至能進出下段路徑部42之位置，將處理前之基板W載置於下段路徑部42。又，傳載搬送機器人33移動至能進出下段路徑部42之位置，將處理後之基板W自下段路徑部42取出。The transfer robot 33 is moved to a position where it can enter and exit the lower path portion 42 , and the substrate W before processing is placed on the lower path portion 42 . Furthermore, the transfer robot 33 moves to a position where it can enter and exit the lower path portion 42 , and takes out the processed substrate W from the lower path portion 42 .

繼而，參照圖3，進一步對路徑塊4及搬送塊6進行說明。如圖3所示，搬送塊6包含上段搬送部6a與下段搬送部6b。下段搬送部6b設置於上段搬送部6a之下方(-Z側)。上段路徑部41設置於傳載塊3與上段搬送部6a之間。下段路徑部42設置於傳載塊3與下段搬送部6b之間。Next, referring to FIG. 3 , the path block 4 and the transfer block 6 will be further described. As shown in FIG. 3 , the conveyance block 6 includes an upper conveyance portion 6a and a lower conveyance portion 6b. The lower-stage conveyance part 6b is provided below the upper-stage conveyance part 6a (-Z side). The upper path portion 41 is provided between the transfer block 3 and the upper conveyance portion 6a. The lower path portion 42 is provided between the transfer block 3 and the lower conveyance portion 6b.

如參照圖1所說明，搬送塊6與處理塊5鄰接。因此，上段搬送部6a及下段搬送部6b與處理塊5鄰接。上段搬送部6a係第1搬送部之一例，下段搬送部6b係第2搬送部之一例。As described with reference to FIG. 1 , the transfer block 6 is adjacent to the processing block 5 . Therefore, the upper-stage conveyance part 6a and the lower-stage conveyance part 6b are adjacent to the processing block 5. FIG. The upper-stage conveyance part 6a is an example of a 1st conveyance part, and the lower-stage conveyance part 6b is an example of a 2nd conveyance part.

詳細而言，上段搬送部6a與第1塔單元TW1之上兩個處理單元2、及第3塔單元TW3之上兩個處理單元2鄰接。上段搬送部6a亦與第2塔單元TW2之上兩個處理單元2(參照圖2)、及第4塔單元TW4之上兩個處理單元2(參照圖2)鄰接。以下，有時將第1塔單元TW1～第4塔單元TW4所包含之上兩個處理單元2記載為「上段之處理單元2」。Specifically, the upper conveyance part 6a is adjacent to the two processing units 2 above the first tower unit TW1 and the two processing units 2 above the third tower unit TW3. The upper conveyance part 6a is also adjacent to the two processing units 2 (see FIG. 2 ) above the second tower unit TW2 (see FIG. 2 ) and the two processing units 2 (see FIG. 2 ) above the fourth tower unit TW4. Hereinafter, the upper two processing units 2 included in the first column unit TW1 to the fourth column unit TW4 may be described as "the upper processing unit 2".

下段搬送部6b與第1塔單元TW1之下兩個處理單元2、及第3塔單元TW3之下兩個處理單元2鄰接。下段搬送部6b亦與第2塔單元TW2之下兩個處理單元2(參照圖2)、及第4塔單元TW4之下兩個處理單元2(參照圖2)鄰接。以下，有時將第1塔單元TW1～第4塔單元TW4所包含之下兩個處理單元2記載為「下段之處理單元2」。The lower conveyance part 6b is adjacent to the two processing units 2 below the first tower unit TW1 and the two processing units 2 below the third tower unit TW3. The lower conveyance part 6b is also adjacent to the two processing units 2 (refer to FIG. 2 ) below the second tower unit TW2 and the two processing units 2 (refer to FIG. 2 ) below the fourth tower unit TW4. Hereinafter, the next two processing units 2 included in the first column unit TW1 to the fourth column unit TW4 may be described as "the lower processing unit 2".

上段搬送部6a具有搬送基板W之上段基板搬送部50a、及上段搬送空間61a。上段基板搬送部50a收容於上段搬送空間61a。上段基板搬送部50a於上段之處理單元2各者與上段路徑部41之間搬送基板W。上段基板搬送部50a係第1基板搬送部之一例，上段搬送空間61a係第1搬送空間之一例。The upper stage conveyance part 6a has the upper stage board|substrate conveyance part 50a which conveys the board|substrate W, and the upper stage conveyance space 61a. The upper-stage board conveyance part 50a is accommodated in the upper-stage conveyance space 61a. The upper-stage substrate conveyance unit 50 a conveys the substrate W between each of the upper-stage processing units 2 and the upper-stage path section 41 . The upper-stage board conveyance part 50a is an example of a 1st board|substrate conveyance part, and the upper-stage conveyance space 61a is an example of a 1st conveyance space.

上段基板搬送部50a具有上段搬送機器人51a、固定框52a及可動框53a。上段搬送機器人51a於上段搬送空間61a內移動。詳細而言，上段搬送機器人51a以能進出所有上段之處理單元2與上段路徑部41之方式，由固定框52a及可動框53a支持而移動自如。具體而言，固定框52a將可動框53a，使其於X方向上移動自如，可動框53a支持上段搬送機器人51a，使其於上下方向(Z方向)上移動自如。因此，上段搬送機器人51a於X方向及Z方向(上下方向)上移動。上段搬送機器人51a係第1搬送機器人之一例。The upper-stage board conveyance unit 50a includes an upper-stage conveyance robot 51a, a fixed frame 52a, and a movable frame 53a. The upper-stage conveyance robot 51a moves in the upper-stage conveyance space 61a. Specifically, the upper-stage transfer robot 51a is supported by the fixed frame 52a and the movable frame 53a so as to be able to move in and out of all the upper-stage processing units 2 and the upper-stage path portion 41 . Specifically, the fixed frame 52a movably moves the movable frame 53a in the X direction, and the movable frame 53a supports the upper transfer robot 51a so as to be movable in the vertical direction (Z direction). Therefore, the upper-stage transfer robot 51a moves in the X direction and the Z direction (vertical direction). The upper-stage transfer robot 51a is an example of the first transfer robot.

下段搬送部6b具有搬送基板W之下段基板搬送部50b、及下段搬送空間61b。下段基板搬送部50b收容於下段搬送空間61b。下段基板搬送部50b於下段之處理單元2各者與下段路徑部42之間搬送基板W。下段基板搬送部50b係第2基板搬送部之一例，下段搬送空間61b係第2搬送空間之一例。The lower stage conveyance part 6b has the lower stage board|substrate conveyance part 50b which conveys a board|substrate W, and the lower stage conveyance space 61b. The lower-stage board conveyance part 50b is accommodated in the lower-stage conveyance space 61b. The lower-stage substrate conveyance unit 50 b conveys the substrate W between each of the lower-stage processing units 2 and the lower-stage path portion 42 . The lower-stage board conveyance part 50b is an example of a second board conveyance part, and the lower-stage conveyance space 61b is an example of a 2nd conveyance space.

下段基板搬送部50b具有下段搬送機器人51b、固定框52b及可動框53b。下段搬送機器人51b於下段搬送空間61b內移動。詳細而言，下段搬送機器人51b以能進出所有下段之處理單元2、與下段路徑部42之方式，由固定框52b及可動框53b支持而移動自如。具體而言，固定框52b支持可動框53b，使其於X方向上移動自如，可動框53b支持下段搬送機器人51b，使其於上下方向(Z方向)上移動自如。因此，下段搬送機器人51b於X方向及Z方向(上下方向)上移動。下段搬送機器人51b係第2搬送機器人之一例。The lower-stage board conveyance unit 50b includes a lower-stage conveyance robot 51b, a fixed frame 52b, and a movable frame 53b. The lower-stage conveyance robot 51b moves in the lower-stage conveyance space 61b. Specifically, the lower transfer robot 51b is supported by the fixed frame 52b and the movable frame 53b so as to be able to move in and out of all the lower processing units 2 and the lower path portion 42 . Specifically, the fixed frame 52b supports the movable frame 53b so as to be movable in the X direction, and the movable frame 53b supports the lower transfer robot 51b so as to be movable in the vertical direction (Z direction). Therefore, the lower-stage transfer robot 51b moves in the X direction and the Z direction (vertical direction). The lower-stage transfer robot 51b is an example of the second transfer robot.

繼而，參照圖3，對上段搬送機器人51a及下段搬送機器人51b進行說明。上段搬送機器人51a具有基台部54、回轉基座55及臂56。基台部54支持於可動框53a。回轉基座55相對於基台部54於水平面內回轉自如地支持於基台部54。臂56相對於回轉基座55於水平面內進退自如地支持於回轉基座55。下段搬送機器人51b亦與上段搬送機器人51a同樣地，具有基台部54、回轉基座55及臂56。下段搬送機器人51b之構成與上段搬送機器人51a同樣，因此省略其說明。Next, with reference to FIG. 3, the upper-stage conveyance robot 51a and the lower-stage conveyance robot 51b are demonstrated. The upper-stage transfer robot 51 a includes a base portion 54 , a revolving base 55 , and an arm 56 . The base portion 54 is supported by the movable frame 53a. The swivel base 55 is rotatably supported by the base portion 54 in a horizontal plane with respect to the base portion 54 . The arm 56 is supported by the swivel base 55 so as to be able to advance and retreat in a horizontal plane with respect to the swivel base 55 . The lower-stage transfer robot 51b also has a base portion 54, a revolving base 55, and an arm 56 similarly to the upper-stage transfer robot 51a. The configuration of the lower-stage transfer robot 51b is the same as that of the upper-stage transfer robot 51a, so the description thereof is omitted.

繼而，參照圖4，進一步對本實施方式之基板處理裝置1進行說明。圖4係表示本實施方式之基板處理裝置1之內部構成之俯視圖。詳細而言，圖4表示自+Z側觀察時之基板處理裝置1之內部構成。首先，參照圖4對傳載搬送部32進行說明。Next, referring to FIG. 4 , the substrate processing apparatus 1 of the present embodiment will be further described. FIG. 4 is a plan view showing the internal structure of the substrate processing apparatus 1 according to the present embodiment. Specifically, FIG. 4 shows the internal configuration of the substrate processing apparatus 1 when viewed from the +Z side. First, the transfer unit 32 will be described with reference to FIG. 4 .

如圖4所示，導軌34配置於路徑塊4之附近。詳細而言，導軌34配置於Y方向上之路徑塊4之中心之側方。本實施方式中，導軌34相對於Y方向上之路徑塊4之中心配置於+Y側。更具體而言，導軌34於自載具載置部31側(+X側)觀察之情形時，配置於路徑塊4中不與基板W之載置位置重疊之位置。As shown in FIG. 4 , the guide rail 34 is arranged near the path block 4 . Specifically, the guide rail 34 is arranged on the side of the center of the path block 4 in the Y direction. In this embodiment, the guide rail 34 is arranged on the +Y side with respect to the center of the path block 4 in the Y direction. More specifically, the guide rail 34 is disposed at a position in the path block 4 that does not overlap with the placement position of the substrate W when viewed from the carrier placement portion 31 side (+X side).

傳載搬送機器人33具有基台部35、多關節臂36及手37。基台部35由導軌34支持而於上下方向(Z方向)上升降自如。基台部35沿導軌34於上下方向(Z方向)上升降。多關節臂36支持於基台部35。手37支持於多關節臂36之前端。多關節臂36使手37於X方向及Y方向上移動。The transfer robot 33 has a base unit 35 , a multi-joint arm 36 and a hand 37 . The base portion 35 is supported by the guide rails 34 so as to be movable up and down in the vertical direction (Z direction). The base portion 35 ascends and descends in the vertical direction (Z direction) along the guide rail 34 . The articulated arm 36 is supported by the base portion 35 . The hand 37 is supported on the front end of the multi-joint arm 36 . The articulated arm 36 moves the hand 37 in the X direction and the Y direction.

繼而，參照圖4對處理單元2進行說明。如圖4所示，處理單元2例如具備吸盤(suction chuck)21、擋板23及處理噴嘴25。吸盤21藉由抽真空而吸附基板W。吸盤21藉由未圖示之電動馬達而旋轉驅動。藉此，基板W於水平面內旋轉。處理噴嘴25藉由對基板W供給處理液，而對基板W進行處理。擋板23以包圍吸盤21之方式，配置於吸盤21之周圍。擋板23防止自處理噴嘴25供給至基板W之處理液向周圍飛散。Next, the processing unit 2 will be described with reference to FIG. 4 . As shown in FIG. 4 , the processing unit 2 includes, for example, a suction chuck 21 , a shutter 23 , and a processing nozzle 25 . The suction pad 21 sucks the substrate W by vacuuming. The suction cup 21 is rotationally driven by an electric motor not shown. Thereby, the substrate W rotates in the horizontal plane. The processing nozzle 25 processes the substrate W by supplying the processing liquid to the substrate W. As shown in FIG. The baffle plate 23 is arranged around the suction cup 21 so as to surround the suction cup 21 . The baffle 23 prevents the processing liquid supplied to the substrate W from the processing nozzle 25 from scattering around.

繼而，參照圖5，進一步對本實施方式之基板處理裝置1進行說明。圖5係表示基板處理裝置1之搬送塊6之內部構成之側視圖。詳細而言，圖5表示自+Y側觀察時之搬送塊6之內部構成。再者，圖5中，為了便於理解，未圖示上段基板搬送部50a及下段基板搬送部50b。Next, referring to FIG. 5 , the substrate processing apparatus 1 of the present embodiment will be further described. FIG. 5 is a side view showing the internal structure of the transfer block 6 of the substrate processing apparatus 1 . In detail, FIG. 5 shows the internal structure of the conveyance block 6 seen from the +Y side. In addition, in FIG. 5, the upper stage board|substrate conveyance part 50a and the lower stage board|substrate conveyance part 50b are not shown in figure for easy understanding.

如圖5所示，上段搬送部6a進而具有2個上段FFU(風扇過濾單元)11、12及複數個上段沖孔板71。又，下段搬送部6b進而具有2個下段FFU13、14、複數個下段沖孔板72及複數個排氣風扇73。As shown in FIG. 5 , the upper conveyance unit 6 a further includes two upper FFUs (fan filter units) 11 and 12 and a plurality of upper punching plates 71 . Moreover, the lower-stage conveyance part 6b further has two lower-stage FFUs 13 and 14 , a plurality of lower-stage punching plates 72 , and a plurality of exhaust fans 73 .

2個上段FFU11、12設置於上段搬送空間61a之上方。2個上段FFU11、12沿X方向配置。具體而言，2個上段FFU11、12以覆蓋參照圖3所說明之上段搬送機器人51a之移動範圍之方式配置。詳細而言，2個上段FFU11、12以覆蓋X方向上之上段搬送機器人51a之移動範圍之方式配置。The two upper stage FFUs 11 and 12 are provided above the upper stage conveyance space 61a. The two upper stage FFUs 11 and 12 are arranged along the X direction. Specifically, the two upper stage FFUs 11 and 12 are arranged so as to cover the moving range of the upper stage transfer robot 51a described with reference to FIG. 3 . Specifically, the two upper stage FFUs 11 and 12 are arranged so as to cover the moving range of the upper stage transfer robot 51a in the X direction.

2個上段FFU11、12自上段搬送空間61a之上方朝向下方供給氣體，而於上段搬送空間61a內產生降流。具體而言，2個上段FFU11、12抽吸設置基板處理裝置1之無塵室中之空氣，供給至上段搬送空間61a。因上段搬送空間61a內產生降流，而上段搬送空間61a中之風速之均勻性提高。結果，上段搬送空間61a之潔淨度提高。2個上段FFU11、12係第1搬送風扇過濾單元之一例。更詳細而言，2個上段FFU11、12分別具有風扇112、箱狀構件111及過濾器。風扇112支持於箱狀構件111之上部。風扇112抽吸無塵室中之空氣。風扇112所抽吸之空氣於箱狀構件111之內部空間中擴散，經由過濾器自箱狀構件111流出。The two upper-stage FFUs 11 and 12 supply gas from above to the downward direction of the upper-stage conveyance space 61a, and a downflow is generated in the upper-stage conveyance space 61a. Specifically, the two upper-stage FFUs 11 and 12 suck the air in the clean room in which the substrate processing apparatus 1 is installed, and supply it to the upper-stage conveyance space 61a. The uniformity of the wind speed in the upper-stage conveyance space 61a is improved due to the generation of downflow in the upper-stage conveyance space 61a. As a result, the cleanliness of the upper conveyance space 61a is improved. The two upper stage FFUs 11 and 12 are examples of the first conveyance fan filter unit. More specifically, the two upper-stage FFUs 11 and 12 each have a fan 112, a box-shaped member 111, and a filter. The fan 112 is supported on the upper part of the box-shaped member 111 . The fan 112 sucks the air in the clean room. The air sucked by the fan 112 is diffused in the inner space of the box-shaped member 111 and flows out from the box-shaped member 111 through the filter.

複數個上段沖孔板71設置於上段搬送空間61a之下方。上段沖孔板71具有於上下方向貫通上段沖孔板71之複數個通過孔。自2個上段FFU11、12供給至上段搬送空間61a之氣體於上段搬送空間61a內自上方流向下方，然後通過上段沖孔板71之通過孔。複數個上段沖孔板71係第1底部之一例，上段沖孔板71之通過孔係第1通過孔之一例。A plurality of upper-stage punching plates 71 are provided below the upper-stage conveyance space 61a. The upper-stage punching plate 71 has a plurality of through holes penetrating the upper-stage punching plate 71 in the up-down direction. The gas supplied from the two upper-stage FFUs 11 and 12 to the upper-stage conveyance space 61 a flows from the upper part to the lower part in the upper-stage conveyance space 61 a , and then passes through the passage holes of the upper-stage punching plate 71 . The plurality of upper-stage punching plates 71 are examples of the first bottom portion, and the passage holes of the upper-stage punching plates 71 are examples of the first passage holes.

2個下段FFU13、14設置於下段搬送空間61b之上方。2個下段FFU13、14沿X方向配置。具體而言，2個下段FFU13、14以覆蓋參照圖3所說明之下段搬送機器人51b之移動範圍之方式配置。詳細而言，2個下段FFU13、14以覆蓋X方向上之下段搬送機器人51b之移動範圍之方式配置。The two lower-stage FFUs 13 and 14 are provided above the lower-stage conveyance space 61b. The two lower stage FFUs 13 and 14 are arranged along the X direction. Specifically, the two lower-stage FFUs 13 and 14 are arranged so as to cover the moving range of the lower-stage transfer robot 51b described with reference to FIG. 3 . Specifically, the two lower stage FFUs 13 and 14 are arranged so as to cover the moving range of the upper and lower stage transfer robot 51b in the X direction.

2個下段FFU13、14自下段搬送空間61b之上方朝向下方供給氣體，而於下段搬送空間61b內產生降流。具體而言，2個下段FFU13、14抽吸通過複數個上段沖孔板71之通過孔之氣體，供給至下段搬送空間61b。因下段搬送空間61b內產生降流，而下段搬送空間61b中之風速之均勻性提高。結果，下段搬送空間61b之潔淨度提高。又，下段FFU13、14自上段搬送空間61a向下段搬送空間61b排出氣體。因此，能於不使用設置基板處理裝置1之工廠之排氣資源之情形時，自上段搬送空間61a排出氣體。2個下段FFU13、14係第2搬送風扇過濾單元之一例。再者，2個下段FFU13、14分別與上段FFU11、12同樣地，具有風扇、箱狀構件及過濾器。下段FFU13、14之構成與上段FFU11、12同樣，因此省略此處之說明。The two lower-stage FFUs 13 and 14 supply gas from above to the lower side of the lower-stage conveyance space 61b, and a downflow is generated in the lower-stage conveyance space 61b. Specifically, the two lower-stage FFUs 13 and 14 suck the gas passing through the passage holes of the plurality of upper-stage punching plates 71, and supply the gas to the lower-stage conveyance space 61b. The uniformity of the wind speed in the lower conveyance space 61b is improved due to the generation of downflow in the lower conveyance space 61b. As a result, the cleanliness of the lower conveyance space 61b is improved. Moreover, the lower-stage FFUs 13 and 14 discharge gas from the upper-stage conveyance space 61a to the lower-stage conveyance space 61b. Therefore, the gas can be exhausted from the upper conveyance space 61a without using the exhaust gas resources of the factory in which the substrate processing apparatus 1 is installed. The two lower stage FFUs 13 and 14 are examples of the second conveyance fan filter unit. In addition, the two lower-stage FFUs 13 and 14 have a fan, a box-like member, and a filter, respectively, similarly to the upper-stage FFUs 11 and 12 . The configurations of the lower-stage FFUs 13 and 14 are the same as those of the upper-stage FFUs 11 and 12 , so the description here is omitted.

複數個下段沖孔板72設置於下段搬送空間61b之下方。下段沖孔板72具有於上下方向貫通下段沖孔板72之複數個通過孔。自2個下段FFU13、14供給至下段搬送空間61b之氣體於下段搬送空間61b內自上方流向下方，然後通過下段沖孔板72之通過孔。複數個下段沖孔板72係第2底部之一例，下段沖孔板72之通過孔係第2通過孔之一例。A plurality of lower-stage punching plates 72 are provided below the lower-stage conveyance space 61b. The lower punching plate 72 has a plurality of through holes penetrating the lower punching plate 72 in the up-down direction. The gas supplied from the two lower-stage FFUs 13 and 14 to the lower-stage conveyance space 61b flows in the lower-stage conveyance space 61b from above to below, and passes through the passage holes of the lower-stage punching plate 72 . The plurality of lower-stage punching plates 72 are examples of the second bottom portion, and the passage holes of the lower-stage punching plates 72 are examples of the second passage holes.

複數個排氣風扇73設置於複數個下段沖孔板72之下方，將通過複數個下段沖孔板72之通過孔之氣體排出至搬送塊6之外部。更具體而言，複數個排氣風扇73將氣體排出至基板處理裝置1之外部。因此，能於不使用設置基板處理裝置1之工廠之排氣資源之情形時，自下段搬送空間61b排出氣體。The plurality of exhaust fans 73 are provided below the plurality of lower punching plates 72 , and discharge the gas passing through the passage holes of the plurality of lower punching plates 72 to the outside of the conveying block 6 . More specifically, the plurality of exhaust fans 73 exhaust air to the outside of the substrate processing apparatus 1 . Therefore, the gas can be exhausted from the lower conveyance space 61b when the exhaust gas resource of the factory in which the substrate processing apparatus 1 is installed is not used.

根據本實施方式，上段FFU11、12於上段搬送空間61a內產生之降流(氣流)經由上段沖孔板71被下段FFU13、14抽吸，因此即使上段搬送機器人51a於上段搬送空間61a內移動，亦能抑制上段搬送空間61a內產生之降流(氣流)因上段搬送機器人51a之移動而混亂。同樣地，下段FFU13、14於下段搬送空間61b內產生之降流(氣流)經由下段沖孔板72被排氣風扇73抽吸，因此即使下段搬送機器人51b於下段搬送空間61b內移動，亦能抑制下段搬送空間61b中產生之降流(氣流)因下段搬送機器人51b之移動而混亂。According to the present embodiment, the downflow (air flow) generated by the upper-stage FFUs 11 and 12 in the upper-stage conveyance space 61a is sucked by the lower-stage FFUs 13 and 14 through the upper-stage punching plate 71. Therefore, even if the upper-stage conveyance robot 51a moves in the upper-stage conveyance space 61a, It is also possible to suppress the downflow (air flow) generated in the upper conveyance space 61a from being disturbed by the movement of the upper conveyance robot 51a. Similarly, the downflow (air flow) generated by the lower-stage FFUs 13 and 14 in the lower-stage conveyance space 61b is sucked by the exhaust fan 73 through the lower-stage punching plate 72. Therefore, even if the lower-stage conveyance robot 51b moves in the lower-stage conveyance space 61b, it can be The downflow (air flow) generated in the lower conveyance space 61b is suppressed from being disturbed by the movement of the lower conveyance robot 51b.

又，根據本實施方式，上段搬送部6a具備2個上段FFU11、12，因此能於上段搬送空間61a之較廣範圍內穩定地產生降流。同樣地，下段搬送部6b具備2個下段FFU13、14，因此能於下段搬送空間61b之較廣範圍內穩定地產生降流。Moreover, according to this embodiment, since the upper-stage conveyance part 6a is provided with two upper-stage FFUs 11 and 12, it is possible to stably generate downflow in a wide range of the upper-stage conveyance space 61a. Similarly, since the lower-stage conveyance part 6b is provided with two lower-stage FFUs 13 and 14, it is possible to stably generate downflow in a wide range of the lower-stage conveyance space 61b.

又，根據本實施方式，2個上段FFU11、12以覆蓋上段搬送機器人51a之移動範圍之方式配置，因此能進一步抑制上段搬送空間61a內產生之降流(氣流)混亂。同樣地，2個下段FFU13、14以覆蓋下段搬送機器人51b之移動範圍之方式配置，因此能進一步抑制下段搬送空間61b內產生之降流(氣流)混亂。Moreover, according to this embodiment, since the two upper stage FFUs 11 and 12 are arranged so as to cover the moving range of the upper stage transfer robot 51a, it is possible to further suppress disturbance of downflow (air flow) generated in the upper stage transfer space 61a. Similarly, since the two lower-stage FFUs 13 and 14 are arranged so as to cover the moving range of the lower-stage transfer robot 51b, it is possible to further suppress disturbance of downflow (airflow) generated in the lower-stage transfer space 61b.

繼而，參照圖6～圖8，進一步對本實施方式之基板處理裝置1進行說明。圖6係表示基板處理裝置1之傳載塊3及路徑塊4之立體圖。Next, the substrate processing apparatus 1 of the present embodiment will be further described with reference to FIGS. 6 to 8 . FIG. 6 is a perspective view showing the carrier block 3 and the path block 4 of the substrate processing apparatus 1 .

如圖6所示，傳載塊3進而具備傳載FFU部15。傳載FFU部15配置於參照圖3所說明之傳載空間3a之上方。傳載FFU部15自傳載空間3a之上方朝向下方供給氣體，而於傳載空間3a內產生降流。As shown in FIG. 6 , the transfer block 3 further includes a transfer FFU unit 15 . The carrier FFU portion 15 is arranged above the carrier space 3a described with reference to FIG. 3 . The carrier FFU portion 15 supplies gas from the upper side of the carrier space 3a to the lower side, thereby generating a downflow in the carrier space 3a.

更具體而言，傳載FFU部15具有第1傳載FFU16、第2傳載FFU17及第3傳載FFU18。第1傳載FFU16及第2傳載FFU17抽吸設置基板處理裝置1之無塵室中之空氣，供給至傳載空間3a。再者，第1傳載FFU16、第2傳載FFU17及第3傳載FFU18分別與上段FFU11、12同樣地，具有風扇112、箱狀構件111及過濾器。第1傳載FFU16、第2傳載FFU17及第3傳載FFU18之構成與上段FFU11、12相同，因此省略其說明。More specifically, the transmission FFU unit 15 includes a first transmission FFU 16 , a second transmission FFU 17 , and a third transmission FFU 18 . The first carrier FFU 16 and the second carrier FFU 17 suck the air in the clean room in which the substrate processing apparatus 1 is installed, and supply it to the carrier space 3a. In addition, the 1st carrier FFU16, the 2nd carrier FFU17, and the 3rd carrier FFU18 are equipped with the fan 112, the box-shaped member 111, and a filter similarly to the upper stage FFU11, 12, respectively. The configurations of the first transmission FFU 16 , the second transmission FFU 17 , and the third transmission FFU 18 are the same as those of the above-mentioned FFUs 11 and 12 , and therefore their descriptions are omitted.

第1傳載FFU16配置於與路徑塊4側相反之側，第2傳載FFU17配置於路徑塊4側。換言之，第1傳載FFU16配置於與參照圖3所說明之上段路徑部41及下段路徑部42相反之側。第2傳載FFU17配置於參照圖3所說明之上段路徑部41及下段路徑部42側。關於第3傳載FFU18，參照圖8於下文中敍述。The first carrier FFU 16 is arranged on the side opposite to the path block 4 side, and the second carrier FFU 17 is arranged on the path block 4 side. In other words, the first carrier FFU 16 is arranged on the opposite side to the upper path portion 41 and the lower path portion 42 described with reference to FIG. 3 . The second transmission FFU 17 is arranged on the side of the upper path portion 41 and the lower path portion 42 described with reference to FIG. 3 . The third transmission FFU 18 will be described later with reference to FIG. 8 .

圖7係表示本實施方式之基板處理裝置1之內部構成之另一側視圖。詳細而言，圖7表示自+Y側觀察時之基板處理裝置1之內部構成。再者，於圖7中，為了便於理解，未圖示傳載搬送部32、上段基板搬送部50a及下段基板搬送部50b。FIG. 7 is another side view showing the internal structure of the substrate processing apparatus 1 according to the present embodiment. Specifically, FIG. 7 shows the internal configuration of the substrate processing apparatus 1 when viewed from the +Y side. In addition, in FIG. 7, the conveyance conveyance part 32, the upper stage board|substrate conveyance part 50a, and the lower stage board|substrate conveyance part 50b are not shown in figure for easy understanding.

如圖6及圖7所示，上段路徑部41具有上段開口41a與上段路徑空間41b，下段路徑部42具有下段開口42a與下段路徑空間42b。上段路徑空間41b經由上段開口41a與上段搬送空間61a連通。下段路徑空間42b經由下段開口42a與下段搬送空間61b連通。As shown in FIGS. 6 and 7 , the upper path portion 41 has an upper opening 41a and an upper path space 41b, and the lower path portion 42 has a lower opening 42a and a lower path space 42b. The upper passage space 41b communicates with the upper conveyance space 61a via the upper opening 41a. The lower passage space 42b communicates with the lower conveyance space 61b through the lower opening 42a.

又，如圖7所示，傳載塊3具有第1開口3b與第2開口3c。第1開口3b與上段路徑部41之上段路徑空間41b連通。因此，傳載空間3a經由第1開口3b與上段路徑空間41b連通。第2開口3c設置於第1開口3b之下方，與下段路徑部42之下段路徑空間42b連通。因此，傳載空間3a經由第2開口3c與下段路徑空間42b連通。Moreover, as shown in FIG. 7, the transfer block 3 has the 1st opening 3b and the 2nd opening 3c. The first opening 3b communicates with the upper passage space 41b of the upper passage portion 41 . Therefore, the transmission space 3a communicates with the upper path space 41b via the first opening 3b. The second opening 3 c is provided below the first opening 3 b and communicates with the lower passage space 42 b of the lower passage portion 42 . Therefore, the transfer space 3a communicates with the lower passage space 42b via the second opening 3c.

根據本實施方式，傳載塊3具備第1傳載FFU16及第2傳載FFU17，因此於傳載空間3a內，可於載具載置部31側與路徑塊4側產生降流。又，藉由利用第2傳載FFU17於路徑塊4側產生降流，可產生經由上段路徑空間41b及下段路徑空間42b自傳載空間3a流向上段搬送空間61a及下段搬送空間61b之氣流。According to the present embodiment, since the carrier block 3 includes the first carrier FFU 16 and the second carrier FFU 17 , downflow can be generated on the carrier mounting portion 31 side and the path block 4 side in the carrier space 3 a. In addition, by generating downflow on the path block 4 side by the second carrier FFU 17, the airflow that flows from the carrier space 3a to the upper conveyance space 61a and the lower conveyance space 61b via the upper path space 41b and the lower path space 42b can be generated.

繼而，參照圖7，進一步對排氣風扇73進行說明。本實施方式中，排氣風扇73以抽吸下段路徑部42之下段路徑空間42b內之氣體之排氣量驅動。因此，藉由排氣風扇73之驅動，而下段路徑部42之下段路徑空間42b內之氣體流向下段搬送空間61b。結果，氣體經由下段路徑空間42b自傳載空間3a流向下段搬送空間61b。亦即，排氣風扇73產生經由下段路徑空間42b自傳載空間3a流向下段搬送空間61b之氣流。根據本實施方式，能更確實地產生經由下段路徑空間42b自傳載空間3a流向下段搬送空間61b之氣流。Next, the exhaust fan 73 will be further described with reference to FIG. 7 . In the present embodiment, the exhaust fan 73 is driven by the exhaust volume for sucking the gas in the lower passage space 42 b of the lower passage portion 42 . Therefore, by the drive of the exhaust fan 73, the gas in the lower passage space 42b of the lower passage portion 42 flows into the lower conveyance space 61b. As a result, the gas flows from the transfer space 3a to the lower conveyance space 61b via the lower path space 42b. That is, the exhaust fan 73 generates an air flow that flows from the transfer space 3a to the lower conveyance space 61b via the lower path space 42b. According to this embodiment, the airflow which flows into the lower conveyance space 61b from the carrying space 3a via the lower path space 42b can be generated more reliably.

繼而，參照圖6及圖8，進一步對傳載FFU部15進行說明。圖8係表示基板處理裝置1之傳載塊3之內部構成之前視圖。詳細而言，圖8表示自+X側觀察時之傳載塊3之內部構成。再者，圖8中，為了便於理解，未圖示傳載搬送機器人33。Next, with reference to FIGS. 6 and 8 , the transfer FFU unit 15 will be further described. FIG. 8 is a front view showing the internal structure of the carrier block 3 of the substrate processing apparatus 1 . Specifically, FIG. 8 shows the internal structure of the transfer block 3 when viewed from the +X side. In addition, in FIG. 8, the transfer robot 33 is not shown in figure for easy understanding.

如圖6及圖8所示，第3傳載FFU18設置於傳載塊3之內部。具體而言，第3傳載FFU18於自正面觀察第1開口3b及第2開口3c時，配置於第1傳載FFU16及第2傳載FFU17之一側方(-Y側)。因此，根據本實施方式，藉由傳載FFU部15，能於傳載空間3a之較廣範圍內產生降流。As shown in FIGS. 6 and 8 , the third carrier FFU 18 is provided inside the carrier block 3 . Specifically, the third carrier FFU 18 is disposed on one side (-Y side) of the first carrier FFU 16 and the second carrier FFU 17 when the first opening 3b and the second opening 3c are viewed from the front. Therefore, according to the present embodiment, the downflow can be generated in a wide range of the transfer space 3a by the transfer FFU unit 15 .

詳細而言，傳載塊3進而具備電氣零件群38。又，傳載空間3a包含第1傳載空間3a1與第2傳載空間3a2。Specifically, the transfer block 3 further includes an electrical component group 38 . In addition, the transmission space 3a includes a first transmission space 3a1 and a second transmission space 3a2.

電氣零件群38包含複數個電氣零件。電氣零件群38於自正面觀察第1開口3b及第2開口3c時，設置於第1開口3b及第2開口3c之一側方(-Y側)。The electrical component group 38 includes a plurality of electrical components. The electrical component group 38 is provided in one side (-Y side) of the 1st opening 3b and the 2nd opening 3c, when the 1st opening 3b and the 2nd opening 3c are seen from the front.

第2傳載空間3a2為電氣零件群38下方之空間，第1傳載空間3a1為其餘空間。因此，第2傳載空間3a2於自正面觀察第1開口3b及第2開口3c時，位於第1傳載空間3a1之一側方(-Y側)，第1傳載空間3a1之最上部位於較第2傳載空間3a2之最上部更靠上方。The second transmission space 3a2 is the space below the electrical component group 38, and the first transmission space 3a1 is the remaining space. Therefore, the second transmission space 3a2 is located on one side (-Y side) of the first transmission space 3a1 when the first opening 3b and the second opening 3c are viewed from the front, and the uppermost part of the first transmission space 3a1 is located at the side of the first transmission space 3a1. It is higher than the uppermost part of the 2nd carrying space 3a2.

第1傳載FFU16及第2傳載FFU17設置於第1傳載空間3a1之上方。第1傳載FFU16及第2傳載FFU17自第1傳載空間3a1之上方朝向下方供給氣體，而於第1傳載空間3a1內產生降流。The first carrier FFU 16 and the second carrier FFU 17 are disposed above the first carrier space 3a1. The first carrier FFU 16 and the second carrier FFU 17 supply gas from the upper side of the first carrier space 3a1 to the lower side, and a downflow is generated in the first carrier space 3a1.

藉由第1傳載FFU16及第2傳載FFU17而產生之氣流(降流)難以到達電氣零件群38下方之空間(第2傳載空間3a2)。第3傳載FFU18配置於電氣零件群38之下方。上述第3傳載FFU18自第2傳載空間3a2之上方朝向下方供給氣體，而於第2傳載空間3a2內產生降流。It is difficult for the airflow (downflow) generated by the first carrier FFU 16 and the second carrier FFU 17 to reach the space below the electrical component group 38 (the second carrier space 3a2). The third carrier FFU 18 is arranged below the electrical component group 38 . The above-mentioned third carrier FFU 18 supplies gas from the upper side of the second carrier space 3a2 to the downward direction, and a downflow is generated in the second carrier space 3a2.

根據本實施方式，傳載塊3具備第3傳載FFU18，因此能夠於傳載空間3a中之藉由第1傳載FFU16及第2傳載FFU17而產生之氣流(降流)難以到達之空間(第2傳載空間3a2)內，更確實地產生降流。According to the present embodiment, since the carrier block 3 includes the third carrier FFU 18 , it is possible in the carrier space 3 a where the airflow (downflow) generated by the first carrier FFU 16 and the second carrier FFU 17 is difficult to reach. In (2nd carrying space 3a2), a downflow is generated more reliably.

又，本實施方式中，自正面觀察第1開口3b及第2開口3c時，第3傳載FFU18配置於與導軌34相反之側。具體而言，如圖8所示，導軌34於自正面觀察第1開口3b及第2開口3c時，以與第1開口3b及第2開口3c之一(+Y側之)端重疊之方式設置。導軌34沿上下方向(Z方向)延伸，因此藉由第1傳載FFU16及第2傳載FFU17而產生之氣流容易沿導軌34於上下方向(Z方向)流動。另一方面，於第2傳載空間3a2(與導軌34相反之側之空間)內，即使藉由第1傳載FFU16及第2傳載FFU17而產生之氣流流入，氣流亦會擴散，而難以產生降流。Moreover, in this embodiment, when the 1st opening 3b and the 2nd opening 3c are seen from the front, the 3rd carrier FFU18 is arrange|positioned at the opposite side to the guide rail 34. As shown in FIG. Specifically, as shown in FIG. 8 , when the first opening 3b and the second opening 3c are viewed from the front, the guide rail 34 overlaps with one (+Y side) end of the first opening 3b and the second opening 3c set up. Since the guide rails 34 extend in the vertical direction (Z direction), the airflow generated by the first carrier FFU 16 and the second carrier FFU 17 easily flows along the guide rails 34 in the vertical direction (Z direction). On the other hand, in the second carrying space 3a2 (the space on the opposite side of the guide rail 34), even if the air flow generated by the first carrying FFU 16 and the second carrying FFU 17 flows in, the air flow is diffused, and it is difficult to produce downflow.

根據本實施方式，由於第3傳載FFU18於第2傳載空間3a2內產生降流，故而於傳載空間3a內，能減少難以產生降流之空間。According to the present embodiment, since the third carrier FFU 18 generates downflow in the second carrier space 3a2, the space in which downflow is difficult to occur in the carrier space 3a can be reduced.

繼而，參照圖5、圖7及圖9～圖11，進一步對本實施方式之基板處理裝置1進行說明。圖9係表示基板處理裝置1之搬送塊6之立體圖。如圖9所示，上段搬送部6a具有上段側壁部611，下段搬送部6b具有下段側壁部612。下段側壁部612設置於上段側壁部611之下方，上段側壁部611及下段側壁部612與參照圖1及圖2所說明之處理塊5鄰接。上段側壁部611係第1側壁部之一例，下段側壁部612係第2側壁部之一例。更具體而言，上段側壁部611包含+Y側之上段側壁部611與-Y側之上段側壁部611。+Y側之上段側壁部611構成上段搬送部6a之+Y側之側壁，-Y側之上段側壁部611構成上段搬送部6a之-Y側之側壁。同樣地，下段側壁部612包含+Y側之下段側壁部612與-Y側之下段側壁部612。+Y側之下段側壁部612構成下段搬送部6b之+Y側之側壁，-Y側之下段側壁部612構成下段搬送部6b之-Y側之側壁。Next, the substrate processing apparatus 1 of the present embodiment will be further described with reference to FIGS. 5 , 7 , and 9 to 11 . FIG. 9 is a perspective view showing the transfer block 6 of the substrate processing apparatus 1 . As shown in FIG. 9 , the upper-stage conveyance portion 6 a has an upper-stage side wall portion 611 , and the lower-stage conveyance portion 6 b has a lower-stage side wall portion 612 . The lower sidewall portion 612 is disposed below the upper sidewall portion 611 , and the upper sidewall portion 611 and the lower sidewall portion 612 are adjacent to the processing block 5 described with reference to FIGS. 1 and 2 . The upper-stage side wall portion 611 is an example of the first side wall portion, and the lower-stage side wall portion 612 is an example of the second side wall portion. More specifically, the upper stage side wall portion 611 includes a +Y side upper stage side wall portion 611 and a −Y side upper stage side wall portion 611 . The +Y side upper side wall portion 611 constitutes the +Y side side wall of the upper transport portion 6a, and the −Y side upper side wall portion 611 constitutes the −Y side side wall of the upper transport portion 6a. Similarly, the lower-stage side wall portion 612 includes a +Y-side lower-stage side wall portion 612 and a −Y-side lower-stage side wall portion 612 . The +Y side lower side wall portion 612 constitutes the +Y side side wall of the lower transport portion 6b, and the −Y side lower side wall portion 612 constitutes the −Y side side wall of the lower transport portion 6b.

圖10(a)係表示上段側壁部611及下段側壁部612之剖面之圖。詳細而言，圖10(a)表示+Y側之上段側壁部611之剖面及+Y側之下段側壁部612之剖面。FIG. 10( a ) is a view showing a cross section of the upper side wall portion 611 and the lower side side wall portion 612 . Specifically, FIG. 10( a ) shows the cross section of the upper side wall portion 611 on the +Y side and the cross section of the lower side wall portion 612 on the +Y side.

如圖10(a)所示，上段側壁部611具有上段間隙形成部611a，下段側壁部612具有下段間隙形成部612a。上段間隙形成部611a與下段間隙形成部612a於上下方向(Z方向)上對向，於上段間隙形成部611a與下段間隙形成部612a之間形成間隙63。間隙63與配置參照圖5所說明之下段FFU13、14之空間連通。又，間隙63與搬送塊6之外部連通。詳細而言，間隙63經由搬送塊6與處理塊5之間隙，與基板處理裝置1之外部連通。As shown in FIG. 10( a ), the upper-stage side wall portion 611 has an upper-stage gap forming portion 611 a , and the lower-stage side wall portion 612 has a lower-stage gap forming portion 612 a . The upper gap forming portion 611a and the lower gap forming portion 612a face each other in the vertical direction (Z direction), and a gap 63 is formed between the upper gap forming portion 611a and the lower gap forming portion 612a. The gap 63 communicates with the space in which the lower stages FFU 13 and 14 are arranged as described with reference to FIG. 5 . In addition, the gap 63 communicates with the outside of the transfer block 6 . Specifically, the gap 63 communicates with the outside of the substrate processing apparatus 1 via the gap between the transfer block 6 and the processing block 5 .

更具體而言，+Y側之上段側壁部611具有複數個上段間隙形成部611a，+Y側之下段側壁部612具有複數個下段間隙形成部612a。同樣地，-Y側之上段側壁部611具有複數個上段間隙形成部611a，-Y側之下段側壁部612具有複數個下段間隙形成部612a。+Y側之複數個上段間隙形成部611a及+Y側之複數個下段間隙形成部612a沿X方向設置。-Y側之複數個上段間隙形成部611a及-Y側之複數個下段間隙形成部612a亦同樣，沿X方向設置。More specifically, the +Y-side upper-stage side wall portion 611 has a plurality of upper-stage gap forming portions 611a, and the +Y-side lower-stage side wall portion 612 has a plurality of lower-stage gap forming portions 612a. Similarly, the upper-stage side wall portion 611 on the -Y side has a plurality of upper-stage gap forming portions 611a, and the lower-stage side wall portion 612 on the -Y side has a plurality of lower-stage gap forming portions 612a. The plurality of upper-stage gap forming portions 611a on the +Y side and the plurality of lower-stage gap forming portions 612a on the +Y side are provided along the X direction. The plurality of upper-stage gap forming portions 611a on the -Y side and the plurality of lower-stage gap forming portions 612a on the -Y side are also provided in the X direction in the same manner.

根據本實施方式，能使自上段搬送空間61a流入配置下段FFU13、14之空間內之氣體之一部分，經由複數個間隙63逸出至搬送塊6之外部。結果，氣體容易自參照圖7所說明之上段路徑空間41b流向上段搬送空間61a，氣體不易滯留於上段路徑空間41b內。因此，能更確實地產生經由上段路徑空間41b自傳載空間3a流向上段搬送空間61a之氣流。According to the present embodiment, a part of the gas flowing into the space where the lower-stage FFUs 13 and 14 are arranged from the upper-stage conveyance space 61 a can escape to the outside of the conveyance block 6 through the plurality of gaps 63 . As a result, the gas tends to flow from the upper passage space 41b described with reference to FIG. 7 to the upper conveyance space 61a, and the gas does not easily stay in the upper passage space 41b. Therefore, the airflow which flows into the upper conveyance space 61a from the carrying space 3a via the upper path space 41b can be generated more reliably.

進而，本實施方式中，如圖9所示，上段搬送部6a具有複數個開口率調整構件62。複數個開口率調整構件62與複數個間隙63一一對應。開口率調整構件62調整對應之間隙63之開口率。Furthermore, in this embodiment, as shown in FIG. 9, the upper conveyance part 6a has the several aperture ratio adjustment member 62. As shown in FIG. The plurality of aperture ratio adjustment members 62 are in one-to-one correspondence with the plurality of gaps 63 . The aperture ratio adjusting member 62 adjusts the aperture ratio of the corresponding gap 63 .

具體而言，開口率調整構件62各者以從Y方向觀察時與對應之間隙63之重疊狀態改變之方式，相對於上段側壁部611於上下方向(Z方向)滑動自如地被支持於上段側壁部611上。藉由使開口率調整構件62滑動，可調整對應之間隙63之開口率。例如，作業人員使開口率調整構件62於上下方向(Z方向)滑動，而調整對應之間隙63之開口率。Specifically, each of the aperture ratio adjusting members 62 is supported by the upper side wall slidably in the up-down direction (Z direction) with respect to the upper side wall portion 611 so that the overlapping state with the corresponding gap 63 when viewed from the Y direction is changed. section 611. By sliding the aperture ratio adjusting member 62, the aperture ratio of the corresponding gap 63 can be adjusted. For example, the operator slides the aperture ratio adjusting member 62 in the up-down direction (Z direction) to adjust the aperture ratio of the corresponding gap 63 .

圖10(b)係表示開口率調整構件62之立體圖。詳細而言，圖10(b)表示使間隙63開放一半之開口率調整構件62。再者，圖10(a)亦同樣表示使間隙63開放一半之開口率調整構件62。FIG. 10( b ) is a perspective view showing the aperture ratio adjusting member 62 . In detail, FIG.10(b) shows the aperture ratio adjustment member 62 which opened the clearance gap 63 by half. In addition, FIG.10(a) also shows the aperture ratio adjustment member 62 which opened the clearance gap 63 by half similarly.

如圖10(b)所示，開口率調整構件62具有板部62a與遮蔽部62b。板部62a沿Z方向延伸。遮蔽部62b沿X方向延伸。遮蔽部62b連接於板部62a之下端。As shown in FIG.10(b), the aperture ratio adjustment member 62 has the plate part 62a and the shield part 62b. The plate portion 62a extends in the Z direction. The shielding portion 62b extends in the X direction. The shielding portion 62b is connected to the lower end of the plate portion 62a.

開口率調整構件62於間隙63之上方藉由未圖示之固定部而固定於上段側壁部611。於固定部設置有於Z方向上貫通之貫通孔，開口率調整構件62之板部62a滑動自如地插入固定部之貫通孔。The aperture ratio adjusting member 62 is fixed to the upper side wall portion 611 by a fixing portion (not shown) above the gap 63 . A through hole penetrating in the Z direction is provided in the fixing portion, and the plate portion 62a of the aperture ratio adjusting member 62 is slidably inserted into the through hole of the fixing portion.

於固定部例如亦可設置用於將板部62a固定於貫通孔之螺絲機構。或者，亦可於板部62a設置正齒輪，於固定部設置齒輪，藉由板部62a與固定部，構成所謂之齒條與小齒輪機構。於該情形時，亦可藉由手動或馬達使設置於固定部之齒輪旋轉，而使開口率調整構件62於Z方向上滑動。For example, the fixing part may be provided with a screw mechanism for fixing the plate part 62a to the through hole. Alternatively, a spur gear may be provided in the plate portion 62a, a gear may be provided in the fixing portion, and a so-called rack and pinion mechanism may be configured by the plate portion 62a and the fixing portion. In this case, the aperture ratio adjustment member 62 can also be slid in the Z direction by rotating the gear provided in the fixed portion manually or by a motor.

固定部理想為設置於如下位置，即，藉由使板部62a相對於固定部滑動，能使自Y方向觀察時遮蔽部62b與間隙63之重疊情況更大幅度地變化的位置。例如，理想為以如下方式配置固定部，即，於開口率調整構件62為某一狀態之情形時，自Y方向觀察時遮蔽部62b完全遮蔽間隙63，於開口率調整構件62為另一狀態之情形時，遮蔽部62b使間隙63完全開放。The fixing portion is preferably provided at a position where the overlap between the shielding portion 62b and the gap 63 when viewed from the Y direction can be more greatly changed by sliding the plate portion 62a relative to the fixing portion. For example, it is desirable to arrange the fixing portion so that when the aperture ratio adjusting member 62 is in a certain state, the shielding portion 62b completely shields the gap 63 when viewed from the Y direction, and when the aperture ratio adjusting member 62 is in another state In this case, the shielding portion 62b completely opens the gap 63.

圖11(a)係表示上段側壁部611及下段側壁部612之剖面之另一圖。圖11(b)係表示開口率調整構件62之另一狀態之立體圖。詳細而言，圖11(a)表示將間隙63封閉之開口率調整構件62。圖11(b)亦同樣，表示將間隙63封閉之開口率調整構件62。FIG. 11( a ) is another view showing the cross section of the upper-stage side wall portion 611 and the lower-stage side wall portion 612 . FIG. 11( b ) is a perspective view showing another state of the aperture ratio adjusting member 62 . Specifically, FIG. 11( a ) shows the aperture ratio adjusting member 62 that closes the gap 63 . Similarly, FIG. 11( b ) shows the aperture ratio adjusting member 62 that closes the gap 63 .

如圖10(a)及圖10(b)所示，開口率調整構件62使間隙63開放，藉此氣體經由間隙63自配置下段FFU13、14之空間(參照圖5)向搬送塊6之外部流出。另一方面，如圖11(a)及圖11(b)所示，開口率調整構件62遮斷間隙63，藉此經由間隙63之氣體流出被阻止。As shown in FIGS. 10( a ) and 10 ( b ), the aperture ratio adjusting member 62 opens the gap 63 , whereby the gas passes through the gap 63 from the space where the lower-stage FFUs 13 and 14 are arranged (see FIG. 5 ) to the outside of the transfer block 6 outflow. On the other hand, as shown in FIGS. 11( a ) and 11 ( b ), the aperture ratio adjusting member 62 blocks the gap 63 , thereby preventing the outflow of gas through the gap 63 .

根據本實施方式，搬送塊6具備開口率調整構件62，藉此能調整間隙63之開口率，而調整氣體自配置下段FFU13、14之空間向搬送塊6外部之流出容易度。因此，能調整氣體每單位時間自配置下段FFU13、14之空間向搬送塊6外部之流出量。藉此，能調整間隙63之開口率，而更確實地產生經由上段路徑空間41b自傳載空間3a流向上段搬送空間61a之氣流。According to the present embodiment, the conveying block 6 is provided with the aperture ratio adjusting member 62, whereby the aperture ratio of the gap 63 can be adjusted, and the ease of gas flow from the space where the lower FFUs 13 and 14 are arranged to the outside of the conveying block 6 can be adjusted. Therefore, the outflow amount of the gas per unit time from the space where the lower-stage FFUs 13 and 14 are arranged to the outside of the transfer block 6 can be adjusted. Thereby, the opening ratio of the clearance gap 63 can be adjusted, and the airflow which flows into the upper conveyance space 61a from the carrying space 3a via the upper path space 41b can be generated more reliably.

以上，參照圖1～圖11對本發明之實施方式1進行說明。根據本實施方式，能抑制上段搬送空間61a內產生之降流(氣流)混亂、及下段搬送空間61b內產生之降流(氣流)混亂。In the above, Embodiment 1 of the present invention has been described with reference to FIGS. 1 to 11 . According to the present embodiment, disturbance of the descending flow (airflow) generated in the upper conveyance space 61a and disturbance of the descending flow (airflow) generated in the lower conveyance space 61b can be suppressed.

再者，本實施方式中，上段側壁部611具有上段間隙形成部611a，下段側壁部612具有下段間隙形成部612a，但亦可僅使上段側壁部611具有形成間隙63之結構或形狀，還可僅使下段側壁部612具有形成間隙63之結構或形狀。Furthermore, in this embodiment, the upper side wall portion 611 has an upper gap forming portion 611a, and the lower side wall portion 612 has a lower gap forming portion 612a, but only the upper side wall portion 611 may have a structure or shape for forming the gap 63, or Only the lower side wall portion 612 has a structure or shape for forming the gap 63 .

又，本實施方式中，搬送塊6具有複數個間隙63，但搬送塊6亦可具有1個間隙63。In addition, in this embodiment, although the conveyance block 6 has a plurality of gaps 63, the conveyance block 6 may have one gap 63.

又，本實施方式中，搬送塊6於+Y側及-Y側這兩側具有間隙63，但搬送塊6亦可僅於+Y側及-Y側中之一側具有間隙63。Furthermore, in this embodiment, the conveying block 6 has the gap 63 on both sides of the +Y side and the -Y side, but the conveying block 6 may have the gap 63 only on one of the +Y side and the -Y side.

又，本實施方式中，開口率調整構件62於上下方向上滑動，但開口率調整構件62滑動之方向並不限定於上下方向。開口率調整構件62只要能以可調整對應之間隙63之開口率之方式滑動即可。例如，開口率調整構件62亦可由上段側壁部611支持而於X方向上滑動自如。In addition, in this embodiment, although the aperture ratio adjustment member 62 slides in an up-down direction, the sliding direction of the aperture ratio adjustment member 62 is not limited to an up-down direction. The aperture ratio adjusting member 62 only needs to be slidable in such a way that the aperture ratio of the corresponding gap 63 can be adjusted. For example, the aperture ratio adjusting member 62 may be supported by the upper side wall portion 611 so as to be slidable in the X direction.

又，本實施方式中，上段搬送部6a具有開口率調整構件62，但亦可使下段搬送部6b具有開口率調整構件62，還可使上段搬送部6a及下段搬送部6b兩者具有開口率調整構件62。In addition, in this embodiment, the upper conveying part 6a has the aperture ratio adjusting member 62, but the lower conveying part 6b may have the aperture ratio adjusting member 62, and both the upper conveying part 6a and the lower conveying part 6b may have the aperture ratio Adjustment member 62 .

[實施方式2]  繼而，參照圖12及圖13對本發明之實施方式2進行說明。但是，對與實施方式1不同之事項進行說明，省略對於與實施方式1相同之事項之說明。實施方式2與實施方式1不同，於搬送塊6中設置第1整流部81～第3整流部83。[Embodiment 2] Next, Embodiment 2 of the present invention will be described with reference to FIGS. 12 and 13 . However, the different matters from the first embodiment will be described, and the description of the same matters as those of the first embodiment will be omitted. The second embodiment is different from the first embodiment in that the conveying block 6 is provided with the first to third rectifying parts 81 to 83 .

圖12係將本實施方式之基板處理裝置1所具備之搬送塊6之一部分放大來表示之圖。詳細而言，圖12係將自+Y側觀察時之搬送塊6之一部分放大來表示。如圖12所示，本實施方式中，上段搬送部6a進而具有設置於上段沖孔板71之第1整流部81。第1整流部81自上段沖孔板71向下方突出。第1整流部81亦可由上段沖孔板71之框體之彎折部構成。FIG. 12 is an enlarged view showing a part of the transfer block 6 included in the substrate processing apparatus 1 of the present embodiment. Specifically, FIG. 12 shows a part of the conveying block 6 when viewed from the +Y side in an enlarged manner. As shown in FIG. 12 , in the present embodiment, the upper conveying portion 6 a further includes a first rectifying portion 81 provided on the upper punching plate 71 . The first rectifying portion 81 protrudes downward from the upper punching plate 71 . The first rectifying portion 81 may also be constituted by a bent portion of the frame of the upper punching plate 71 .

第1整流部81將通過上段沖孔板71之通過孔之氣體整流。詳細而言，第1整流部81以使通過上段沖孔板71之通過孔之氣體朝向下段FFU13或下段FFU14流動之方式，將通過上段沖孔板71之通過孔之氣體整流。因此，根據本實施方式，下段FFU13及下段FFU14能高效率地抽吸通過上段沖孔板71之通過孔之氣體。The first rectifying portion 81 rectifies the gas passing through the passage hole of the upper punching plate 71 . Specifically, the first rectifying portion 81 rectifies the gas passing through the passage hole of the upper punching plate 71 so that the gas passing through the passage hole of the upper punching plate 71 flows toward the lower FFU13 or the lower FFU14. Therefore, according to the present embodiment, the lower-stage FFU 13 and the lower-stage FFU 14 can efficiently suck the gas passing through the passage holes of the upper-stage punching plate 71 .

本實施方式中，下段FFU13、14進而具有第2整流部82。具體而言，下段FFU13、14分別具有風扇112、箱狀構件111、第2整流部82及過濾器。第2整流部82設置於箱狀構件111。第2整流部82自箱狀構件111向上方突出。In the present embodiment, the lower-stage FFUs 13 and 14 further include the second rectifying portion 82 . Specifically, the lower-stage FFUs 13 and 14 respectively have the fan 112 , the box-shaped member 111 , the second rectifying portion 82 , and the filter. The second rectifying portion 82 is provided on the box-shaped member 111 . The second rectifying portion 82 protrudes upward from the box-shaped member 111 .

第2整流部82將通過上段沖孔板71之通過孔之氣體整流。詳細而言，第2整流部82以使通過上段沖孔板71之通過孔之氣體朝向風扇112流動之方式，將通過上段沖孔板71之通過孔之氣體整流。因此，根據本實施方式，下段FFU13及下段FFU14能高效率地抽吸通過上段沖孔板71之通過孔之氣體。The second rectifying portion 82 rectifies the gas passing through the passage hole of the upper punching plate 71 . Specifically, the second rectifying portion 82 rectifies the gas passing through the passage hole of the upper punching plate 71 so that the gas passing through the passage hole of the upper punching plate 71 flows toward the fan 112 . Therefore, according to the present embodiment, the lower-stage FFU 13 and the lower-stage FFU 14 can efficiently suck the gas passing through the passage holes of the upper-stage punching plate 71 .

再者，箱狀構件111支持風扇112。具體而言，風扇112支持於箱狀構件111之上部。過濾器收容於箱狀構件111之內部。風扇112所抽吸之空氣於箱狀構件111之內部空間中擴散，經由過濾器自箱狀構件111流出。Furthermore, the box-shaped member 111 supports the fan 112 . Specifically, the fan 112 is supported by the upper part of the box-shaped member 111 . The filter is accommodated inside the box-shaped member 111 . The air sucked by the fan 112 is diffused in the inner space of the box-shaped member 111 and flows out from the box-shaped member 111 through the filter.

圖13係將本實施方式之搬送塊6之一部分放大來表示之另一圖。詳細而言，圖13將自-X側觀察時之搬送塊6之一部分放大來表示。如圖13所示，下段搬送部6b進而具有頂部613及第3整流部83。於頂部613，設置有下段FFU13、14及第3整流部83。FIG. 13 is another diagram showing a part of the conveying block 6 of the present embodiment in an enlarged manner. Specifically, FIG. 13 shows a part of the conveying block 6 when viewed from the -X side in an enlarged manner. As shown in FIG. 13 , the lower-stage conveyance portion 6b further includes a top portion 613 and a third rectifying portion 83 . On the top portion 613, the lower-stage FFUs 13 and 14 and the third rectifying portion 83 are provided.

第3整流部83將通過上段沖孔板71之通過孔之氣體整流。詳細而言，第3整流部83以使通過上段沖孔板71之通過孔之氣體朝向下段FFU13、14流動之方式，將通過上段沖孔板71之通過孔之氣體整流。因此，根據本實施方式，下段FFU13及下段FFU14能高效率地抽吸通過上段沖孔板71之通過孔之氣體。The third rectifying portion 83 rectifies the gas passing through the passage hole of the upper punching plate 71 . Specifically, the third rectifying portion 83 rectifies the gas passing through the passage holes of the upper punching plate 71 so that the gas passing through the passage holes of the upper punching plate 71 flows toward the lower FFUs 13 and 14 . Therefore, according to the present embodiment, the lower-stage FFU 13 and the lower-stage FFU 14 can efficiently suck the gas passing through the passage holes of the upper-stage punching plate 71 .

以上，參照圖12及圖13對本發明之實施方式2進行說明。根據本實施方式，下段FFU13及下段FFU14能高效率地抽吸通過上段沖孔板71之通過孔之氣體。In the above, Embodiment 2 of the present invention has been described with reference to FIGS. 12 and 13 . According to the present embodiment, the lower-stage FFU 13 and the lower-stage FFU 14 can efficiently suck the gas passing through the passage holes of the upper-stage punching plate 71 .

再者，本實施方式中，於搬送塊6中設置有第1整流部81～第3整流部83，但亦可將第1整流部81～第3整流部83中之1個或2個設置於搬送塊6中。Furthermore, in the present embodiment, the conveying block 6 is provided with the first rectifying portion 81 to the third rectifying portion 83 , but one or two of the first rectifying portion 81 to the third rectifying portion 83 may be provided. in the transfer block 6.

以上，參照圖式(圖1～圖13)對本發明之實施方式進行說明。但是，本發明並不限定於上述實施方式，可於不脫離其主旨之範圍內以各種方式實施。又，能適當改變上述實施方式所揭示之複數個構成要素。例如，亦可將某實施方式所示之全部構成要素中之某一構成要素追加為另一實施方式之構成要素，或者亦可將某實施方式所示之全部構成要素中之若干構成要素自實施方式中刪除。The embodiments of the present invention have been described above with reference to the drawings ( FIGS. 1 to 13 ). However, the present invention is not limited to the above-described embodiments, and can be implemented in various forms without departing from the gist of the present invention. In addition, a plurality of constituent elements disclosed in the above-described embodiments can be appropriately changed. For example, one of all the components shown in a certain embodiment may be added as a component of another embodiment, or some of all the components shown in a certain embodiment may be self-implemented way to delete.

圖式係為了便於理解發明，而以各構成要素為主體模式性地表示，圖示之各構成要素之厚度、長度、個數、間隔等有時為了便於製作圖式而與實物不同。又，上述實施方式所示之各構成要素之構成係一例，並無特別限定，當然能於實質上不脫離本發明之效果之範圍內進行各種變更。In order to facilitate the understanding of the invention, the drawings schematically show each component as the main body, and the thickness, length, number, interval, etc. of each component shown in the drawings may be different from the actual product for the convenience of drawing. In addition, the structure of each component shown in the above-mentioned embodiment is an example, and it does not specifically limit, It is needless to say that various changes can be added in the range which does not deviate substantially from the effect of this invention.

例如，於參照圖1～圖13所說明之實施方式中，上段搬送部6a具備2個上段FFU11、12，但上段搬送部6a亦可具備1個上段FFU，還可具備3個以上之上段FFU。同樣地，下段搬送部6b具備2個下段FFU13、14，但下段搬送部6b亦可具備1個下段FFU，還可具備3個以上之下段FFU。For example, in the embodiment described with reference to FIGS. 1 to 13 , the upper conveying unit 6a includes two upper FFUs 11 and 12, but the upper conveying unit 6a may include one upper FFU, or may include three or more upper FFUs . Similarly, the lower-stage conveyance portion 6b includes two lower-stage FFUs 13 and 14, but the lower-stage conveyance portion 6b may include one lower-stage FFU, or may include three or more lower-stage FFUs.

又，於參照圖1～圖13所說明之實施方式中，上段搬送部6a具備複數個上段沖孔板71，但上段搬送部6a亦可具備1個上段沖孔板。同樣地，下段搬送部6b具備複數個下段沖孔板72，但下段搬送部6b亦可具備1個下段沖孔板。In addition, in the embodiment described with reference to FIGS. 1 to 13 , the upper conveyance section 6a includes a plurality of upper punch plates 71, but the upper conveyance section 6a may include one upper punch plate. Similarly, although the lower-stage conveyance part 6b is equipped with the several lower-stage punching plate 72, the lower-stage conveyance part 6b may be equipped with one lower-stage punching plate.

又，於參照圖1～圖13所說明之實施方式中，下段搬送部6b具備2個排氣風扇73，但下段搬送部6b亦可具備1個排氣風扇73，還可具備3個以上之排氣風扇73。  [產業上之可利用性]Moreover, in the embodiment described with reference to FIGS. 1 to 13 , the lower conveyance unit 6b includes two exhaust fans 73, but the lower conveyance unit 6b may include one exhaust fan 73, or may include three or more exhaust fans 73. Exhaust fan 73 . [Industrial availability]

本發明可用於處理基板之裝置。The present invention can be used in an apparatus for processing substrates.

1:基板處理裝置2:處理單元3:傳載塊3a:傳載空間3a1:第1傳載空間3a2:第2傳載空間3b:第1開口3c:第2開口4:路徑塊5:處理塊6:搬送塊6a:上段搬送部6b:下段搬送部7:多功能塊11:上段FFU12:上段FFU13:下段FFU14:下段FFU15:傳載FFU部16:第1傳載FFU17:第2傳載FFU18:第3傳載FFU21:吸盤23:擋板25:處理噴嘴31:載具載置部32:傳載搬送部33:傳載搬送機器人34:導軌35:基台部36:多關節臂37:手38:電氣零件群41:上段路徑部41a:上段開口41b:上段路徑空間42:下段路徑部42a:下段開口42b:下段路徑空間50a:上段基板搬送部50b:下段基板搬送部51a:上段搬送機器人51b:下段搬送機器人52a:固定框52b:固定框53a:可動框53b:可動框54:基台部55:回轉基座56:臂61a:上段搬送空間61b:下段搬送空間62:開口率調整構件62a:板部62b:遮蔽部63:間隙71:上段沖孔板72:下段沖孔板73:排氣風扇81:第1整流部82:第2整流部83:第3整流部111:箱狀構件112:風扇611:上段側壁部611a:上段間隙形成部612:下段側壁部612a:下段間隙形成部613:頂部C:載具TW,TW1,TW2,TW3,TW4:塔單元W:基板1: Substrate processing apparatus 2: Processing unit 3: Transfer block 3a: Transfer space 3a1: First transfer space 3a2: Second transfer space 3b: First opening 3c: Second opening 4: Path block 5: Processing Block 6: Transport block 6a: Upper transport section 6b: Lower transport section 7: Multifunctional block 11: Upper stage FFU12: Upper stage FFU13: Lower stage FFU14: Lower stage FFU15: Transfer FFU section 16: First transfer FFU17: Second transfer FFU18: 3rd carrier FFU21: Suction cup 23: Baffle plate 25: Processing nozzle 31: Carrier mounting portion 32: Carrier transfer portion 33: Carrier transfer robot 34: Guide rail 35: Base portion 36: Articulated arm 37 : Hand 38 : Electrical component group 41 : Upper path portion 41 a : Upper opening 41 b : Upper path space 42 : Lower path portion 42 a : Lower opening 42 b : Lower path space 50 a : Upper board conveyance portion 50 b : Lower board conveyance portion 51 a : Upper stage Transfer robot 51b: Lower transfer robot 52a: Fixed frame 52b: Fixed frame 53a: Movable frame 53b: Movable frame 54: Base part 55: Swivel base 56: Arm 61a: Upper transfer space 61b: Lower transfer space 62: Opening ratio Adjustment member 62a: plate part 62b: shielding part 63: gap 71: upper punching plate 72: lower punching plate 73: exhaust fan 81: first rectifying part 82: second rectifying part 83: third rectifying part 111: Box-like member 112: Fan 611: Upper-stage side wall portion 611a: Upper-stage gap forming portion 612: Lower-stage side wall portion 612a: Lower-stage gap forming portion 613: Top C: Carriers TW, TW1, TW2, TW3, TW4: Tower unit W: Substrate

圖1係表示本發明之實施方式1之基板處理裝置之整體構成的立體圖。  圖2係本發明之實施方式1之基板處理裝置之分解立體圖。  圖3係表示本發明之實施方式1之基板處理裝置之內部構成的側視圖。  圖4係表示本發明之實施方式1之基板處理裝置之內部構成的俯視圖。  圖5係表示基板處理裝置之搬送塊之內部構成之側視圖。  圖6係表示基板處理裝置之傳載塊及路徑塊之立體圖。  圖7係表示本發明之實施方式1之基板處理裝置之內部構成的另一側視圖。  圖8係表示基板處理裝置之傳載塊之內部構成之前視圖。  圖9係表示基板處理裝置之搬送塊之立體圖。  圖10中，(a)係表示上段側壁部及下段側壁部之剖面之圖。(b)係表示開口率調整構件之立體圖。  圖11中，(a)係表示上段側壁部及下段側壁部之剖面之另一圖。(b)係表示開口率調整構件之另一狀態之立體圖。  圖12係將本發明之實施方式2之基板處理裝置所具備之搬送塊之一部分放大來表示之圖。  圖13係將本發明之實施方式2之基板處理裝置所具備之搬送塊之一部分放大來表示之另一圖。FIG. 1 is a perspective view showing the overall configuration of a substrate processing apparatus according to Embodiment 1 of the present invention. FIG. 2 is an exploded perspective view of the substrate processing apparatus according to Embodiment 1 of the present invention. Fig. 3 is a side view showing the internal structure of the substrate processing apparatus according to Embodiment 1 of the present invention. FIG. 4 is a plan view showing the internal structure of the substrate processing apparatus according to Embodiment 1 of the present invention. Fig. 5 is a side view showing the internal structure of the transfer block of the substrate processing apparatus. FIG. 6 is a perspective view showing the carrier block and the path block of the substrate processing apparatus. FIG. 7 is another side view showing the internal structure of the substrate processing apparatus according to Embodiment 1 of the present invention. FIG. 8 is a front view showing the internal structure of the carrier block of the substrate processing apparatus. FIG. 9 is a perspective view showing a transfer block of the substrate processing apparatus. In Fig. 10, (a) is a view showing the cross section of the upper side wall portion and the lower side side wall portion. (b) is a perspective view showing an aperture ratio adjustment member. In Fig. 11, (a) is another view showing the cross section of the upper side wall portion and the lower side side wall portion. (b) is a perspective view showing another state of the aperture ratio adjusting member. FIG. 12 is an enlarged view showing a part of a transfer block included in the substrate processing apparatus according to Embodiment 2 of the present invention. Fig. 13 is another view showing a part of a transfer block included in the substrate processing apparatus according to Embodiment 2 of the present invention in an enlarged manner.

1:基板處理裝置 1: Substrate processing device

6:搬送塊 6: transport block

6a:上段搬送部 6a: Upper conveying section

6b:下段搬送部 6b: Lower conveying section

11:上段FFU 11: Upper FFU

12:上段FFU 12: Upper FFU

13:下段FFU 13: Lower FFU

14:下段FFU 14: Lower FFU

61a:上段搬送空間 61a: Upper conveying space

61b:下段搬送空間 61b: Lower transport space

71:上段沖孔板 71: Upper punching plate

72:下段沖孔板 72: Lower punching plate

73:排氣風扇 73: Exhaust Fan

111:箱狀構件 111: Box Components

112:風扇 112: Fan

Claims (16)

一種基板處理裝置，其係處理基板者，且具備：  處理部，其處理上述基板；  第1搬送部，其與上述處理部鄰接；及  第2搬送部，其與上述處理部鄰接，設置於上述第1搬送部之下方；且  上述第1搬送部具有：  第1基板搬送部，其搬送上述基板；  第1搬送空間，其收容上述第1基板搬送部；  第1搬送風扇過濾單元，其設置於上述第1搬送空間之上方，自上述第1搬送空間之上方朝向下方供給氣體；及  第1底部，其具有複數個第1通過孔，設置於上述第1搬送空間之下方；  上述第2搬送部具有：  第2基板搬送部，其搬送上述基板；  第2搬送空間，其收容上述第2基板搬送部；  第2搬送風扇過濾單元，其設置於上述第1底部之下方，自上述第2搬送空間之上方朝向下方供給氣體；  第2底部，其具有複數個第2通過孔，設置於上述第2搬送空間之下方；及  排氣風扇，其設置於上述第2底部之下方，將通過上述複數個第2通過孔之氣體排出。A substrate processing apparatus, which processes a substrate, and includes: a processing unit that processes the substrate; a first conveying unit that is adjacent to the processing unit; and a second conveying unit that is adjacent to the processing unit and provided on the Below the first conveying part; and The first conveying part has: A first substrate conveying part, which conveys the substrate; A first conveying space, which accommodates the first substrate conveying part; A first conveying fan filter unit, which is provided in Above the above-mentioned first conveying space, gas is supplied from above the above-mentioned first conveying space toward the downward; It has: a second substrate conveying part, which conveys the substrate; a second conveying space, which accommodates the second substrate conveying part; The upper part supplies gas downward; The second bottom part, which has a plurality of second passage holes, is arranged below the above-mentioned second conveying space; The gas from the second passage hole is exhausted. 如請求項1之基板處理裝置，其中上述第1搬送部進而具有與上述處理部鄰接之第1側壁部，  上述第2搬送部進而具有與上述處理部鄰接且設置於上述第1側壁部之下方之第2側壁部，且  上述第1側壁部與上述第2側壁部之至少一者進而具有於上述第1側壁部與上述第2側壁部之間形成間隙的間隙形成部。The substrate processing apparatus according to claim 1, wherein the first conveying portion further has a first side wall portion adjacent to the processing portion, and the second conveying portion further has a side adjacent to the processing portion and disposed below the first side wall portion The second side wall portion, and at least one of the first side wall portion and the second side wall portion further has a gap forming portion that forms a gap between the first side wall portion and the second side wall portion. 如請求項2之基板處理裝置，其中上述第1搬送部與上述第2搬送部之至少一者進而具有調整上述間隙之開口率的開口率調整構件。The substrate processing apparatus according to claim 2, wherein at least one of the first conveyance unit and the second conveyance unit further includes an aperture ratio adjustment member for adjusting an aperture ratio of the gap. 如請求項1至3中任一項之基板處理裝置，其中上述第1搬送部具有複數個上述第1搬送風扇過濾單元。The substrate processing apparatus according to any one of claims 1 to 3, wherein the first conveyance unit has a plurality of the first conveyance fan filter units. 如請求項4之基板處理裝置，其中上述第1基板搬送部包含在上述第1搬送空間內移動之第1搬送機器人，且  上述複數個第1搬送風扇過濾單元以覆蓋上述第1搬送機器人之移動範圍之方式配置。The substrate processing apparatus according to claim 4, wherein the first substrate transfer unit includes a first transfer robot that moves in the first transfer space, and the plurality of first transfer fan filter units cover the movement of the first transfer robot range configuration. 如請求項1至3中任一項之基板處理裝置，其中上述第2搬送部具有複數個上述第2搬送風扇過濾單元。The substrate processing apparatus according to any one of claims 1 to 3, wherein the second conveyance section includes a plurality of the second conveyance fan filter units. 如請求項6之基板處理裝置，其中上述第2基板搬送部包含在上述第2搬送空間內移動之第2搬送機器人，且  上述複數個第2搬送風扇過濾單元以覆蓋上述第2搬送機器人之移動範圍之方式配置。The substrate processing apparatus of claim 6, wherein the second substrate transfer unit includes a second transfer robot that moves in the second transfer space, and the plurality of second transfer fan filter units cover the movement of the second transfer robot range configuration. 如請求項1至3中任一項之基板處理裝置，其中上述第1搬送部進而具有設置於上述第1底部之第1整流部，且  上述第1整流部對通過上述複數個第1通過孔之氣體進行整流。The substrate processing apparatus according to any one of claims 1 to 3, wherein the first conveying portion further has a first rectifying portion provided on the first bottom portion, and the pair of the first rectifying portion passes through the plurality of first passage holes The gas is rectified. 如請求項1至3中任一項之基板處理裝置，其中上述第2搬送風扇過濾單元具有風扇、支持上述風扇之箱狀構件、及設置於上述箱狀構件之第2整流部，且  上述第2整流部對通過上述複數個第1通過孔之氣體進行整流。The substrate processing apparatus according to any one of claims 1 to 3, wherein the second conveyance fan filter unit has a fan, a box-shaped member supporting the fan, and a second rectifying portion provided on the box-shaped member, and the first 2. The rectifying part rectifies the gas passing through the plurality of first passage holes. 如請求項1至3中任一項之基板處理裝置，其中上述第2搬送部進而具有：  頂部，其供設置上述第2搬送風扇過濾單元；及  第3整流部，其設置於上述頂部；且  上述第3整流部對通過上述複數個第1通過孔之氣體進行整流。The substrate processing apparatus according to any one of claims 1 to 3, wherein the second conveying portion further comprises: a top portion for disposing the second conveying fan filter unit; and a third rectifying portion disposed on the top portion; and The third rectifying portion rectifies the gas passing through the plurality of first passage holes. 如請求項1至3中任一項之基板處理裝置，其進而具備：  傳載部，其進行上述基板之搬入及搬出；  第1路徑部，其設置於上述傳載部與上述第1搬送部之間，暫時載置上述基板；以及  第2路徑部，其設置於上述傳載部與上述第2搬送部之間，暫時載置上述基板；且  上述傳載部具有：  傳載搬送部，其進行上述基板之搬入及搬出；  傳載空間，其收容上述傳載搬送部；以及  傳載風扇過濾單元部，其設置於上述傳載空間之上方，自上述傳載空間之上方朝向下方供給氣體。The substrate processing apparatus according to any one of Claims 1 to 3, further comprising: a transfer unit for carrying in and out of the substrate; a first path unit provided on the transfer unit and the first transfer unit Between the above-mentioned substrates are temporarily placed; and The second path portion is provided between the above-mentioned transfer portion and the above-mentioned second transfer portion, and the above-mentioned substrates are temporarily placed; and The above-mentioned transfer portion has: Carrying out the loading and unloading of the above-mentioned substrate; the carrying space, which accommodates the above-mentioned carrying and carrying part; and the carrying fan filter unit part, which is arranged above the above-mentioned carrying space, and supplies gas from above the above-mentioned carrying space toward the bottom. 如請求項11之基板處理裝置，其中上述傳載風扇過濾單元部具有：  第1傳載風扇過濾單元，其配置於與上述第1路徑部及上述第2路徑部側相反之側；及  第2傳載風扇過濾單元，其配置於上述第1路徑部及上述第2路徑部側。The substrate processing apparatus of claim 11, wherein the carrier fan filter unit portion has: a first carrier fan filter unit disposed on the opposite side to the first path portion and the second path portion side; and a second path portion A transmission fan filter unit is arranged on the side of the first path portion and the second path portion. 如請求項12之基板處理裝置，其中上述傳載部進而具有：  第1開口，其與上述第1路徑部連通；及  第2開口，其設置於上述第1開口之下方，與上述第2路徑部連通；且  上述傳載風扇過濾單元部進而具有第3傳載風扇過濾單元，自正面觀察上述第1開口及上述第2開口時，上述第3傳載風扇過濾單元配置於上述第1傳載風扇過濾單元及上述第2傳載風扇過濾單元之一側方。The substrate processing apparatus of claim 12, wherein the transfer portion further has: a first opening communicated with the first path portion; and a second opening disposed below the first opening and connected to the second path and the above-mentioned transmission fan filter unit part further has a third transmission fan filter unit, when viewing the above-mentioned first opening and the above-mentioned second opening from the front, the above-mentioned third transmission fan filter unit is arranged on the above-mentioned first transmission fan filter unit A side of the fan filter unit and the above-mentioned second carrier fan filter unit. 如請求項13之基板處理裝置，其中上述傳載空間包含：  第1傳載空間；及  第2傳載空間，其於自正面觀察上述第1開口及上述第2開口時，位於上述第1傳載空間之一側方；且  上述第1傳載空間之最上部位於較上述第2傳載空間之最上部更靠上方，  上述第1傳載風扇過濾單元及上述第2傳載風扇過濾單元自上述第1傳載空間之上方朝向下方供給氣體，  上述第3傳載風扇過濾單元自上述第2傳載空間之上方朝向下方供給氣體。The substrate processing apparatus of claim 13, wherein the carrying space comprises: a first carrying space; and a second carrying space, which is located in the first carrying space when the first opening and the second opening are viewed from the front. A side of the carrying space; and the uppermost part of the first carrying space is located above the uppermost part of the second carrying space, and the first carrying fan filter unit and the second carrying fan filter unit are automatically The above-mentioned first carrier space supplies gas downward from the upper side, and the third carrier fan filter unit supplies gas from the upper side of the second carrier space to the lower side. 如請求項13之基板處理裝置，其中上述傳載搬送部包含：  傳載搬送機器人，其搬送上述基板；及  導軌，其於上下方向上引導上述傳載搬送機器人；且  上述第3傳載風扇過濾單元於自正面觀察上述第1開口及上述第2開口時，配置於與上述導軌側相反之側。The substrate processing apparatus of claim 13, wherein the carrying and conveying portion comprises: a carrying and carrying robot that carries the substrate; and a guide rail that guides the carrying and carrying robot in an up-down direction; and the third carrying fan filter The unit is disposed on the side opposite to the rail side when the first opening and the second opening are viewed from the front. 如請求項11之基板處理裝置，其中上述排氣風扇產生自上述傳載空間經由上述第2路徑部流向上述第2搬送空間之氣流。The substrate processing apparatus of claim 11, wherein the exhaust fan generates an air flow that flows from the transfer space to the second transfer space via the second path portion.
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