TWI841206B - Substrate processing apparatus - Google Patents

Abstract

The present invention provides a substrate processing apparatus. A substrate processing apparatus (1) includes a first transport section (6a) and a second transport section (6b). The second transport section (6b) is located below the first transport section (6a). The first transport section (6a) includes a first transport space (61a), first transport FFUs (11 and 12), and a first floor section (71). The first transport FFUs (11 and 12) are located above the first transport space (61a). The first floor section (71) has a plurality of first through holes. The first floor section (71) is located below the first transport space (61a). The second transport section (6b) includes a second transport space (61b), second transport FFUs (13 and 14), a second floor section (72), and an exhaust fan (73). The second transport FFUs (13 and 14) are located below the first floor section (71). The second floor section (72) has a plurality of through holes. The second floor section (72) is located below the second transport space (61b). The exhaust fan (73) is located blow the second floor section (72.)

Description

Substrate processing equipment

The present invention relates to a substrate processing device.

A substrate processing device is known, which has an upper processing block and a lower processing block (for example, refer to patent document 1). The upper processing block and the lower processing block respectively have processing units for processing substrates, and the substrate processing device has a conveying device for conveying substrates to the processing unit on the upper side, and a conveying device for conveying substrates to the processing unit on the lower side. The conveying device on the upper side moves in a conveying space adjacent to the upper processing block, and the conveying device on the lower side moves in a conveying space adjacent to the lower processing block. The conveying space on the upper side and the conveying space on the lower side are separated by a partition wall or the like. [Prior art document] [Patent document]

[Patent Document 1] Japanese Patent Publication No. 2016-201526

[The problem the invention is trying to solve]

However, the movement of the conveying device in the conveying space on the upper side may sometimes cause the airflow in the conveying space on the upper side to be disturbed. Similarly, the movement of the conveying device in the conveying space on the lower side may sometimes cause the airflow in the conveying space on the lower side to be disturbed. Therefore, it is necessary to suppress the airflow disturbance in the conveying space on the upper side. Similarly, it is necessary to suppress the airflow disturbance in the conveying space on the lower side.

The present invention is made in view of the above-mentioned problem, and its purpose is to provide a substrate processing device that can suppress the airflow disorder in the upper section side conveying space and the airflow disorder in the lower section side conveying space. [Technical means for solving the problem]

According to one aspect of the present invention, a substrate processing device processes a substrate. The substrate processing device includes a processing unit, a first conveying unit, and a second conveying unit. The processing unit processes the substrate. The first conveying unit is adjacent to the processing unit. The second conveying unit is adjacent to the processing unit and is disposed below the first conveying unit. The first conveying unit has a first substrate conveying unit, a first conveying space, a first conveying fan filter unit, and a first bottom. The first substrate conveying unit conveys the substrate. The first substrate conveying unit is accommodated in the first conveying space. The first conveying fan filter unit is disposed above the first conveying space and supplies gas from the top of the first conveying space to the bottom. The first bottom has a plurality of first through holes. The first bottom is disposed below the first conveying space. The second conveying part comprises a second substrate conveying part, a second conveying space, a second conveying fan filter unit, a second bottom and an exhaust fan. The second substrate conveying part conveys the substrate. The second substrate conveying part is accommodated in the second conveying space. The second conveying fan filter unit is disposed below the first bottom and supplies gas from the top of the second conveying space to the bottom. The second bottom comprises a plurality of second through holes. The second bottom is disposed below the second conveying space. The exhaust fan is disposed below the second bottom. The exhaust fan exhausts the gas passing through the plurality of second through holes.

In one embodiment, the first conveying section further comprises a first side wall portion adjacent to the processing section. The second conveying section further comprises a second side wall portion adjacent to the processing section. The second side wall portion is disposed below the first side wall portion. At least one of the first side wall portion and the second side wall portion further comprises a gap forming portion. The gap forming portion forms a gap between the first side wall portion and the second side wall portion.

In one embodiment, at least one of the first conveying unit and the second conveying unit further comprises an opening ratio adjusting member. The opening ratio adjusting member adjusts the opening ratio of the gap.

In one embodiment, the first conveying section includes a plurality of first conveying fan filter units.

In one embodiment, the first substrate transport unit includes a first transport robot that moves in the first transport space. The plurality of first transport fan filter units are arranged to cover a moving range of the first transport robot.

In one embodiment, the second conveying unit includes a plurality of second conveying fan filter units.

In one embodiment, the second substrate transport unit includes a second transport robot that moves in the second transport space. The plurality of second transport fan filter units are arranged to cover the moving range of the second transport robot.

In one embodiment, the first conveying unit further includes a first rectifying unit provided at the first bottom portion. The first rectifying unit rectify the gas passing through the plurality of first passage holes.

In one embodiment, the second transport fan filter unit comprises a fan, a box-shaped member, and a second rectifying portion. The box-shaped member supports the fan. The second rectifying portion is provided on the box-shaped member. The second rectifying portion rectify the gas passing through the plurality of first through holes.

In one embodiment, the second conveying part further comprises a top and a third rectifying part. The second conveying fan filter unit is disposed at the top. The third rectifying part is disposed at the top. The third rectifying part rectify the gas passing through the plurality of first through holes.

In a certain embodiment, the substrate processing device further includes a carrier part, a first conveying part and a second conveying part. The carrier part carries out the loading and unloading of the substrate. The first conveying part is disposed between the carrier part and the first conveying part. The substrate is temporarily placed on the first conveying part. The second conveying part is disposed between the carrier part and the second conveying part. The substrate is temporarily placed on the second conveying part. The carrier part includes a carrier and conveying part, a carrier space and a carrier fan filter unit. The carrier and conveying part carries out the loading and unloading of the substrate. The carrier and conveying part is accommodated in the carrier space. The carrier fan filter unit is disposed above the carrier space to supply gas from the top of the carrier space to the bottom.

In one embodiment, the carrier fan filter unit has a first carrier fan filter unit and a second carrier fan filter unit. The first carrier fan filter unit is disposed on the side opposite to the first transmission part and the second transmission part. The second carrier fan filter unit is disposed on the side of the first transmission part and the second transmission part.

In a certain embodiment, the above-mentioned carrier part further has a first opening and a second opening. The above-mentioned first opening is connected to the above-mentioned first transmission part. The above-mentioned second opening is connected to the above-mentioned second transmission part. The above-mentioned second opening is arranged below the above-mentioned first opening. The above-mentioned carrier fan filter unit part further has a third carrier fan filter unit. The above-mentioned third carrier fan filter unit is arranged on one side of the above-mentioned first carrier fan filter unit and the above-mentioned second carrier fan filter unit when observing the above-mentioned first opening and the above-mentioned second opening from the front.

In a certain embodiment, the transfer space includes a first transfer space and a second transfer space. The second transfer space is located on one side of the first transfer space when the first opening and the second opening are observed from the front. The uppermost portion of the first transfer space is located higher than the uppermost portion of the second transfer space. The first transfer fan filter unit and the second transfer fan filter unit supply gas from the upper side of the first transfer space to the lower side. The third transfer fan filter unit supplies gas from the upper side of the second transfer space to the lower side.

In one embodiment, the carrier and transport section includes a carrier and transport robot and a guide rail. The carrier and transport robot transports the substrate. The guide rail guides the carrier and transport robot in a vertical direction. The third carrier fan filter unit is disposed on a side opposite to the guide rail side when the first opening and the second opening are viewed from the front.

In one embodiment, the exhaust fan generates an airflow from the transfer space through the second transfer section to the second transfer space. [Effect of the Invention]

According to the substrate processing apparatus of the present invention, it is possible to suppress airflow disturbance in the transfer space on the upper stage side and airflow disturbance in the transfer space on the lower stage side.

Hereinafter, the implementation of the substrate processing device of the present invention will be described with reference to the drawings (FIG. 1 to FIG. 13). However, the present invention is not limited to the following implementation. Furthermore, for the parts that are described repeatedly, the description will sometimes be appropriately omitted. In addition, in the drawings, the same reference symbols are marked for the same or equivalent parts, and the description is not repeated.

In this specification, for ease of understanding, mutually orthogonal X, Y, and Z directions are sometimes described. Typically, the X and Y directions are parallel to the horizontal direction, and the Z direction is parallel to the vertical direction. However, the definition of these directions is not intended to limit the orientation of the substrate processing device of the present invention when in use.

The "substrate" in this embodiment can be applied to various substrates such as semiconductor wafers, glass substrates for masks, glass substrates for liquid crystal displays, glass substrates for plasma displays, substrates for FED (Field Emission Display), substrates for optical disks, substrates for magnetic disks, and substrates for magneto-optical disks. In the following, this embodiment is mainly described using a substrate processing device used in processing a disk-shaped semiconductor wafer as an example, but it can also be similarly applied to the processing of various substrates exemplified above. In addition, the shape of the substrate can also be applied to various shapes.

[Implementation method 1] Below, with reference to Figures 1 to 11, implementation method 1 of the present invention is described. First, with reference to Figure 1, a substrate processing device 1 of the present implementation method is described. Figure 1 is a three-dimensional diagram showing the overall structure of the substrate processing device 1 of the present implementation method. The substrate processing device 1 processes a substrate W. As shown in Figure 1, the substrate processing device 1 has a carrier block 3, a transfer block 4, a processing block 5, a transport block 6 and a multi-function block 7.

The carrier block 3 has a carrier placement portion 31. In the present embodiment, the carrier block 3 has four carrier placement portions 31. Carriers C are placed on the carrier placement portions 31. Carriers C store a plurality of substrates W (for example, 25) in a stacked manner. Carrier C is, for example, a FOUP (Front Opening Unified Pod). Hereinafter, carriers C placed on the carrier placement portions 31 are referred to as "carriers C".

The carrier block 3 carries the substrate W before processing stored in the carrier C into the inner space of the carrier block 3. Also, the carrier block 3 carries the processed substrate W out of the inner space of the carrier block 3. Specifically, the carrier block 3 stores the processed substrate W in the carrier C. The carrier block 3 is an example of a carrier unit.

The conveying block 4 is disposed between the carrier block 3 and the conveying block 6. The carrier block 3, the conveying block 4 and the conveying block 6 are arranged along the X direction. Specifically, the conveying block 4 is arranged on the -X side of the carrier block 3, and the conveying block 6 is arranged on the -X side of the conveying block 4.

The substrate W before processing and the substrate W after processing are temporarily placed in the conveying block 4. The conveying block 3 transfers the substrate W before processing from the carrier C to the conveying block 4. Also, the conveying block 3 transfers the substrate W after processing from the conveying block 4 to the carrier C. Furthermore, the conveying block 4 may also have a mechanism for turning the front and back sides of the substrate W.

The transfer block 6 is adjacent to the processing block 5. The transfer block 6 transfers the substrate W before processing from the transfer block 4 to the processing block 5. Also, the transfer block 6 transfers the substrate W after processing from the processing block 5 to the transfer block 4.

The processing block 5 processes the substrate W. The processing block 5 cleans the substrate W, for example. The processing block 5 is an example of a processing unit. The multifunctional block 7 supplies a processing liquid to the processing block 5. The processing liquid includes a chemical solution. The processing liquid may further include DIW (deionized water). The multifunctional block 7 may further supply a gas such as nitrogen or air to the processing block 5.

The substrate processing apparatus 1 of the present embodiment has two processing blocks 5. The two processing blocks 5 are adjacent to the conveying block 6. Specifically, one of the two processing blocks 5 is arranged on the -Y side relative to the conveying block 6, and the other of the two processing blocks 5 is arranged on the +Y side relative to the conveying block 6. Hereinafter, the processing block 5 arranged on the -Y side relative to the conveying block 6 is recorded as "the processing block 5 on the -Y side", and the processing block 5 arranged on the +Y side relative to the conveying block 6 is recorded as "the processing block 5 on the +Y side".

Next, the substrate processing apparatus 1 of the present embodiment will be further described with reference to Fig. 2. Fig. 2 is an exploded perspective view of the substrate processing apparatus 1 of the present embodiment.

As shown in FIG2 , the two processing blocks 5 each include a tower unit TW, and the tower unit TW includes a plurality of processing units 2 stacked in the up-down direction (Z direction). In this embodiment, the processing block 5 on the -Y side includes two tower units TW1 and TW3, and the processing block 5 on the +Y side includes two tower units TW2 and TW4. The two tower units TW1 and TW3 are arranged along the X direction. Specifically, the tower unit TW3 is arranged on the -X side of the tower unit TW1. The two tower units TW2 and TW4 are also arranged along the X direction. Specifically, the tower unit TW4 is arranged on the -X side of the tower unit TW2.

In the present embodiment, each of the tower units TW1 to TW4 has four processing units 2. Hereinafter, the four tower units TW1 to TW4 may be respectively described as "first tower unit TW1 to fourth tower unit TW4".

Next, referring to FIG3 , the substrate processing apparatus 1 of the present embodiment will be further described. FIG3 is a side view showing the internal structure of the substrate processing apparatus 1 of the present embodiment. Specifically, FIG3 shows the internal structure of the substrate processing apparatus 1 when viewed from the +Y side. First, referring to FIG3 , the carrier block 3 and the transfer block 4 will be described.

As shown in Fig. 3, the carrier block 3 includes a carrier space 3a and a carrier conveying portion 32. The conveying block 4 includes an upper conveying portion 41 and a lower conveying portion 42. The upper conveying portion 41 is disposed above the lower conveying portion 42 (on the +Z side).

The upper conveyor 41 temporarily places substrates W before and after processing. Similarly, the lower conveyor 42 temporarily places substrates W before and after processing. Furthermore, the upper conveyor 41 may also have a mechanism for turning over the front and back sides of the substrate W. Similarly, the lower conveyor 42 may also have a mechanism for turning over the front and back sides of the substrate W. The upper conveyor 41 is an example of a first conveyor, and the lower conveyor 42 is an example of a second conveyor.

The carrier transport unit 32 is stored in the carrier space 3a. The carrier transport unit 32 carries the substrate W stored in the carrier C before processing into the carrier space 3a. In addition, the carrier transport unit 32 carries the processed substrate W out of the carrier space 3a. Specifically, the carrier transport unit 32 stores the processed substrate W in the carrier C.

Furthermore, the carrier transport unit 32 transports the substrate W before processing to the upper transport unit 41 and the lower transport unit 42. The carrier transport unit 32 transports the substrate W after processing from the upper transport unit 41 and the lower transport unit 42 to the carrier C.

More specifically, the carrier transport section 32 includes a carrier transport robot 33 that transports the substrate W, and a guide rail 34. The guide rail 34 guides the carrier transport robot 33 in the up-down direction (Z direction).

The carrier transport robot 33 moves up and down along the guide rail 34. Specifically, the carrier transport robot 33 moves up and down between a position where it can enter and exit the carrier C, a position where it can enter and exit the upper conveyor 41, and a position where it can enter and exit the lower conveyor 42.

The carrier transfer robot 33 moves to a position where it can enter and exit the carrier C, and takes out the substrate W before being processed from the carrier C. Also, the carrier transfer robot 33 moves to a position where it can enter and exit the carrier C, and stores the substrate W after being processed in the carrier C.

The carrier transport robot 33 moves to a position where it can enter and exit the upper conveyor 41, and places the substrate W before processing on the upper conveyor 41. Also, the carrier transport robot 33 moves to a position where it can enter and exit the upper conveyor 41, and takes the substrate W after processing out of the upper conveyor 41.

The carrier transport robot 33 moves to a position where it can enter and exit the lower conveyor 42, and places the substrate W before processing on the lower conveyor 42. Also, the carrier transport robot 33 moves to a position where it can enter and exit the lower conveyor 42, and takes the substrate W after processing out of the lower conveyor 42.

Next, referring to FIG3 , the conveying block 4 and the conveying block 6 are further described. As shown in FIG3 , the conveying block 6 includes an upper conveying section 6a and a lower conveying section 6b. The lower conveying section 6b is disposed below the upper conveying section 6a (-Z side). The upper conveying section 41 is disposed between the conveying block 3 and the upper conveying section 6a. The lower conveying section 42 is disposed between the conveying block 3 and the lower conveying section 6b.

As described with reference to Fig. 1, the conveying block 6 is adjacent to the processing block 5. Therefore, the upper conveying section 6a and the lower conveying section 6b are adjacent to the processing block 5. The upper conveying section 6a is an example of a first conveying section, and the lower conveying section 6b is an example of a second conveying section.

Specifically, the upper conveying section 6a is adjacent to the two processing units 2 above the first tower unit TW1 and the two processing units 2 above the third tower unit TW3. The upper conveying section 6a is also adjacent to the two processing units 2 above the second tower unit TW2 (see FIG. 2 ) and the two processing units 2 above the fourth tower unit TW4 (see FIG. 2 ). Hereinafter, the two processing units 2 included in the first tower unit TW1 to the fourth tower unit TW4 are sometimes described as "the processing units 2 of the upper stage".

The lower conveying section 6b is adjacent to the two processing units 2 below the first tower unit TW1 and the two processing units 2 below the third tower unit TW3. The lower conveying section 6b is also adjacent to the two processing units 2 below the second tower unit TW2 (see FIG. 2 ) and the two processing units 2 below the fourth tower unit TW4 (see FIG. 2 ). Hereinafter, the two processing units 2 below included in the first tower unit TW1 to the fourth tower unit TW4 are sometimes described as "lower stage processing units 2".

The upper transfer unit 6a includes an upper substrate transfer unit 50a for transferring the substrate W, and an upper transfer space 61a. The upper substrate transfer unit 50a is accommodated in the upper transfer space 61a. The upper substrate transfer unit 50 a transfers the substrate W between each of the upper processing units 2 and the upper transfer unit 41 . The upper substrate transfer unit 50a is an example of a first substrate transfer unit, and the upper transfer space 61a is an example of a first transfer space.

The upper stage substrate transporting part 50a has an upper stage transporting robot 51a, a fixed frame 52a and a movable frame 53a. The upper stage transporting robot 51a moves in the upper stage transporting space 61a. In detail, the upper stage transporting robot 51a is supported by the fixed frame 52a and the movable frame 53a in such a manner that it can enter and exit all the upper stage processing units 2 and the upper stage conveying part 41 and can move freely. Specifically, the fixed frame 52a supports the movable frame 53a so that it can move freely in the X direction, and the movable frame 53a supports the upper stage transporting robot 51a so that it can move freely in the up and down direction (Z direction). Therefore, the upper stage transporting robot 51a moves in the X direction and the Z direction (up and down direction). The upper stage transporting robot 51a is an example of the first transporting robot.

The lower stage conveying section 6b includes a lower stage substrate conveying section 50b for conveying substrates W, and a lower stage conveying space 61b. The lower stage substrate conveying section 50b is accommodated in the lower stage conveying space 61b. The lower stage substrate conveying section 50b conveys substrates W between each of the lower stage processing units 2 and the lower stage conveying section 42. The lower stage substrate conveying section 50b is an example of a second substrate conveying section, and the lower stage conveying space 61b is an example of a second conveying space.

The lower stage substrate transporting part 50b has a lower stage transporting robot 51b, a fixed frame 52b and a movable frame 53b. The lower stage transporting robot 51b moves in the lower stage transporting space 61b. In detail, the lower stage transporting robot 51b is supported by the fixed frame 52b and the movable frame 53b in such a manner that it can enter and exit all the lower stage processing units 2 and the lower stage conveying part 42 and can move freely. Specifically, the fixed frame 52b supports the movable frame 53b so that it can move freely in the X direction, and the movable frame 53b supports the lower stage transporting robot 51b so that it can move freely in the up and down direction (Z direction). Therefore, the lower stage transporting robot 51b moves in the X direction and the Z direction (up and down direction). The lower stage transporting robot 51b is an example of a second transporting robot.

Next, referring to FIG. 3 , the upper transport robot 51a and the lower transport robot 51b are described. The upper transport robot 51a has a base portion 54, a rotating base 55, and an arm 56. The base portion 54 is supported by the movable frame 53a. The rotating base 55 is supported by the base portion 54 so as to be able to rotate freely in a horizontal plane relative to the base portion 54. The arm 56 is supported by the rotating base 55 so as to be able to move forward and backward freely in a horizontal plane relative to the rotating base 55. The lower transport robot 51b also has a base portion 54, a rotating base 55, and an arm 56, similarly to the upper transport robot 51a. The structure of the lower transport robot 51b is the same as that of the upper transport robot 51a, so its description is omitted.

Next, referring to FIG. 4 , the substrate processing apparatus 1 of this embodiment will be further described. FIG. 4 is a top view showing the internal structure of the substrate processing apparatus 1 of this embodiment. Specifically, FIG. 4 shows the internal structure of the substrate processing apparatus 1 when viewed from the +Z side. First, referring to FIG. 4 , the carrier transport unit 32 will be described.

As shown in FIG4 , the guide rail 34 is arranged near the conveying block 4. Specifically, the guide rail 34 is arranged on the side of the center of the conveying block 4 in the Y direction. In the present embodiment, the guide rail 34 is arranged on the +Y side relative to the center of the conveying block 4 in the Y direction. More specifically, the guide rail 34 is arranged at a position in the conveying block 4 that does not overlap with the placement position of the substrate W when viewed from the carrier placement portion 31 side (+X side).

The carrier transport robot 33 has a base 35, a multi-joint arm 36 and a hand 37. The base 35 is supported by a guide rail 34 and can be raised and lowered in the vertical direction (Z direction). The base 35 is raised and lowered in the vertical direction (Z direction) along the guide rail 34. The multi-joint arm 36 is supported by the base 35. The hand 37 is supported by the front end of the multi-joint arm 36. The multi-joint arm 36 allows the hand 37 to move in the X direction and the Y direction.

Next, the processing unit 2 is described with reference to FIG4 . As shown in FIG4 , the processing unit 2 includes, for example, a suction chuck 21, a baffle 23, and a processing nozzle 25. The suction chuck 21 adsorbs the substrate W by vacuuming. The suction chuck 21 is rotationally driven by an electric motor (not shown). Thereby, the substrate W rotates in a horizontal plane. The processing nozzle 25 processes the substrate W by supplying a processing liquid to the substrate W. The baffle 23 is arranged around the suction chuck 21 in a manner of surrounding the suction chuck 21. The baffle 23 prevents the processing liquid supplied to the substrate W from the processing nozzle 25 from scattering around.

Next, referring to FIG5 , the substrate processing apparatus 1 of the present embodiment will be further described. FIG5 is a side view showing the internal structure of the conveying block 6 of the substrate processing apparatus 1. Specifically, FIG5 shows the internal structure of the conveying block 6 when viewed from the +Y side. Furthermore, in FIG5 , for ease of understanding, the upper substrate conveying unit 50a and the lower substrate conveying unit 50b are not shown.

As shown in FIG5 , the upper conveying section 6a further includes two upper FFUs (fan filter units) 11 and 12 and a plurality of upper perforated plates 71. The lower conveying section 6b further includes two lower FFUs 13 and 14, a plurality of lower perforated plates 72 and a plurality of exhaust fans 73.

The two upper FFUs 11 and 12 are arranged above the upper transport space 61a. The two upper FFUs 11 and 12 are arranged along the X direction. Specifically, the two upper FFUs 11 and 12 are arranged in a manner to cover the moving range of the upper transport robot 51a described with reference to FIG. 3. Specifically, the two upper FFUs 11 and 12 are arranged in a manner to cover the moving range of the upper transport robot 51a in the X direction.

The two upper FFUs 11 and 12 supply gas from the upper part of the upper transfer space 61a to the lower part, and generate a downflow in the upper transfer space 61a. Specifically, the two upper FFUs 11 and 12 suck the air in the clean room where the substrate processing device 1 is installed, and supply it to the upper transfer space 61a. Since a downflow is generated in the upper transfer space 61a, the uniformity of the wind speed in the upper transfer space 61a is improved. As a result, the cleanliness of the upper transfer space 61a is improved. The two upper FFUs 11 and 12 are an example of the first transfer fan filter unit. In more detail, the two upper FFUs 11 and 12 respectively have a fan 112, a box-shaped component 111 and a filter. The fan 112 is supported on the upper part of the box-shaped component 111. The fan 112 sucks the air in the clean room. The air sucked by the fan 112 diffuses in the inner space of the box-shaped component 111 and flows out of the box-shaped component 111 through the filter.

A plurality of upper perforated plates 71 are disposed below the upper transfer space 61a. The upper perforated plates 71 have a plurality of through holes that penetrate the upper perforated plates 71 in the up-down direction. The gas supplied from the two upper FFUs 11 and 12 to the upper transfer space 61a flows from the top to the bottom in the upper transfer space 61a, and then passes through the through holes of the upper perforated plates 71. The plurality of upper perforated plates 71 is an example of the first bottom portion, and the through holes of the upper perforated plates 71 are an example of the first through holes.

The two lower section FFUs 13 and 14 are arranged above the lower section transport space 61b. The two lower section FFUs 13 and 14 are arranged along the X direction. Specifically, the two lower section FFUs 13 and 14 are arranged in a manner to cover the moving range of the lower section transport robot 51b described with reference to FIG. 3. Specifically, the two lower section FFUs 13 and 14 are arranged in a manner to cover the moving range of the lower section transport robot 51b in the X direction.

The two lower FFUs 13 and 14 supply gas from the upper part of the lower transfer space 61b toward the lower part, and generate a downflow in the lower transfer space 61b. Specifically, the two lower FFUs 13 and 14 suck the gas that passes through the holes of the plurality of upper perforated plates 71 and supply it to the lower transfer space 61b. Since a downflow is generated in the lower transfer space 61b, the uniformity of the wind speed in the lower transfer space 61b is improved. As a result, the cleanliness of the lower transfer space 61b is improved. In addition, the lower FFUs 13 and 14 exhaust gas from the upper transfer space 61a to the lower transfer space 61b. Therefore, the gas can be exhausted from the upper transfer space 61a without using the exhaust resources of the factory where the substrate processing device 1 is installed. The two lower FFUs 13 and 14 are examples of the second conveying fan filter unit. The two lower FFUs 13 and 14 respectively have fans, box-shaped components and filters like the upper FFUs 11 and 12. The configuration of the lower FFUs 13 and 14 is the same as that of the upper FFUs 11 and 12, so the description here is omitted.

A plurality of lower perforated plates 72 are disposed below the lower transport space 61b. The lower perforated plates 72 have a plurality of through holes that penetrate the lower perforated plates 72 in the up-down direction. The gas supplied from the two lower FFUs 13 and 14 to the lower transport space 61b flows from the top to the bottom in the lower transport space 61b, and then passes through the through holes of the lower perforated plates 72. The plurality of lower perforated plates 72 is an example of the second bottom portion, and the through holes of the lower perforated plates 72 are an example of the second through holes.

A plurality of exhaust fans 73 are disposed below the plurality of lower perforated plates 72 to exhaust the gas passing through the holes of the plurality of lower perforated plates 72 to the outside of the transfer block 6. More specifically, the plurality of exhaust fans 73 exhaust the gas to the outside of the substrate processing apparatus 1. Therefore, the gas can be exhausted from the lower transfer space 61b without using the exhaust resources of the factory where the substrate processing apparatus 1 is installed.

According to the present embodiment, the downflow (airflow) generated by the upper FFU11, 12 in the upper transport space 61a is sucked by the lower FFU13, 14 through the upper perforated plate 71. Therefore, even if the upper transport robot 51a moves in the upper transport space 61a, the downflow (airflow) generated in the upper transport space 61a can be prevented from being disturbed by the movement of the upper transport robot 51a. Similarly, the downflow (airflow) generated by the lower FFU13 and 14 in the lower transport space 61b is sucked by the exhaust fan 73 through the lower perforated plate 72. Therefore, even if the lower transport robot 51b moves in the lower transport space 61b, the downflow (airflow) generated in the lower transport space 61b can be prevented from being disturbed by the movement of the lower transport robot 51b.

Moreover, according to this embodiment, the upper conveying section 6a has two upper FFUs 11 and 12, so that the downward flow can be stably generated in a wide range of the upper conveying space 61a. Similarly, the lower conveying section 6b has two lower FFUs 13 and 14, so that the downward flow can be stably generated in a wide range of the lower conveying space 61b.

Furthermore, according to the present embodiment, the two upper FFUs 11 and 12 are arranged to cover the moving range of the upper transport robot 51a, thereby further suppressing the downflow (airflow) turbulence generated in the upper transport space 61a. Similarly, the two lower FFUs 13 and 14 are arranged to cover the moving range of the lower transport robot 51b, thereby further suppressing the downflow (airflow) turbulence generated in the lower transport space 61b.

Next, the substrate processing apparatus 1 of the present embodiment will be further described with reference to Fig. 6 to Fig. 8. Fig. 6 is a perspective view showing the carrier block 3 and the transfer block 4 of the substrate processing apparatus 1.

As shown in Fig. 6, the carrier block 3 further includes a carrier FFU unit 15. The carrier FFU unit 15 is disposed above the carrier space 3a described with reference to Fig. 3. The carrier FFU unit 15 supplies gas from the top to the bottom of the carrier space 3a, thereby generating a downflow in the carrier space 3a.

More specifically, the carrier FFU section 15 includes a first carrier FFU 16, a second carrier FFU 17, and a third carrier FFU 18. The first carrier FFU 16 and the second carrier FFU 17 suck air in the clean room of the substrate processing apparatus 1 and supply the air to the carrier space 3a. Furthermore, the first carrier FFU 16, the second carrier FFU 17, and the third carrier FFU 18 respectively include a fan 112, a box-shaped member 111, and a filter, similarly to the upper stage FFU 11 and 12. The configurations of the first carrier FFU 16, the second carrier FFU 17, and the third carrier FFU 18 are the same as those of the upper stage FFU 11 and 12, and thus their description is omitted.

The first carrier FFU 16 is arranged on the side opposite to the conveying block 4, and the second carrier FFU 17 is arranged on the side of the conveying block 4. In other words, the first carrier FFU 16 is arranged on the side opposite to the upper conveying section 41 and the lower conveying section 42 described with reference to FIG. 3. The second carrier FFU 17 is arranged on the side of the upper conveying section 41 and the lower conveying section 42 described with reference to FIG. 3. The third carrier FFU 18 will be described below with reference to FIG. 8.

FIG7 is another side view showing the internal structure of the substrate processing apparatus 1 of the present embodiment. Specifically, FIG7 shows the internal structure of the substrate processing apparatus 1 when viewed from the +Y side. In addition, in FIG7, for ease of understanding, the carrier conveyor 32, the upper substrate conveyor 50a, and the lower substrate conveyor 50b are not shown.

As shown in Fig. 6 and Fig. 7, the upper conveying part 41 has an upper opening 41a and an upper conveying space 41b, and the lower conveying part 42 has a lower opening 42a and a lower conveying space 42b. The upper conveying space 41b is connected to the upper conveying space 61a through the upper opening 41a. The lower conveying space 42b is connected to the lower conveying space 61b through the lower opening 42a.

As shown in FIG7 , the carrier block 3 has a first opening 3b and a second opening 3c. The first opening 3b is connected to the upper conveying space 41b of the upper conveying section 41. Therefore, the carrier space 3a is connected to the upper conveying space 41b via the first opening 3b. The second opening 3c is provided below the first opening 3b and is connected to the lower conveying space 42b of the lower conveying section 42. Therefore, the carrier space 3a is connected to the lower conveying space 42b via the second opening 3c.

According to the present embodiment, the carrier block 3 has the first carrier FFU 16 and the second carrier FFU 17, so that in the carrier space 3a, a downflow can be generated on the carrier placement portion 31 side and the conveying block 4 side. In addition, by using the second carrier FFU 17 to generate a downflow on the conveying block 4 side, an airflow can be generated from the carrier space 3a to the upper conveying space 61a and the lower conveying space 61b via the upper conveying space 41b and the lower conveying space 42b.

Next, referring to FIG. 7 , the exhaust fan 73 is further described. In the present embodiment, the exhaust fan 73 is driven by the exhaust volume of the gas in the lower transfer space 42b of the lower transfer section 42. Therefore, by driving the exhaust fan 73, the gas in the lower transfer space 42b of the lower transfer section 42 flows to the lower transfer space 61b. As a result, the gas flows from the carrying space 3a to the lower transfer space 61b via the lower transfer space 42b. That is, the exhaust fan 73 generates an airflow that flows from the carrying space 3a to the lower transfer space 61b via the lower transfer space 42b. According to the present embodiment, an airflow that flows from the carrying space 3a to the lower transfer space 61b via the lower transfer space 42b can be generated more reliably.

Next, the carrier FFU unit 15 is further described with reference to FIG6 and FIG8. FIG8 is a front view showing the internal structure of the carrier block 3 of the substrate processing apparatus 1. Specifically, FIG8 shows the internal structure of the carrier block 3 when viewed from the +X side. In FIG8, for ease of understanding, the carrier transfer robot 33 is not shown.

As shown in FIG6 and FIG8, the third carrier FFU 18 is disposed inside the carrier block 3. Specifically, the third carrier FFU 18 is disposed on one side (-Y side) of the first carrier FFU 16 and the second carrier FFU 17 when the first opening 3b and the second opening 3c are viewed from the front. Therefore, according to this embodiment, the carrier FFU section 15 can generate a downflow in a wider range of the carrier space 3a.

Specifically, the carrier block 3 further includes an electrical component group 38. In addition, the carrier space 3a includes a first carrier space 3a1 and a second carrier space 3a2.

The electrical component group 38 includes a plurality of electrical components and is disposed on one side (-Y side) of the first opening 3b and the second opening 3c when the first opening 3b and the second opening 3c are viewed from the front.

The second transfer space 3a2 is the space below the electrical component group 38, and the first transfer space 3a1 is the remaining space. Therefore, when the first opening 3b and the second opening 3c are viewed from the front, the second transfer space 3a2 is located on one side (-Y side) of the first transfer space 3a1, and the uppermost portion of the first transfer space 3a1 is located higher than the uppermost portion of the second transfer space 3a2.

The first carrier FFU 16 and the second carrier FFU 17 are disposed above the first carrier space 3a1. The first carrier FFU 16 and the second carrier FFU 17 supply gas from the top to the bottom of the first carrier space 3a1, thereby generating a downflow in the first carrier space 3a1.

The airflow (downflow) generated by the first carrier FFU 16 and the second carrier FFU 17 is difficult to reach the space (second carrier space 3a2) below the electrical component group 38. The third carrier FFU 18 is arranged below the electrical component group 38. The third carrier FFU 18 supplies gas from the top to the bottom of the second carrier space 3a2, and generates a downflow in the second carrier space 3a2.

According to the present embodiment, the carrier block 3 is provided with the third carrier FFU18, so that the downflow can be more reliably generated in the space (the second carrier space 3a2) in the carrier space 3a where the airflow (downflow) generated by the first carrier FFU16 and the second carrier FFU17 is difficult to reach.

In addition, in the present embodiment, when the first opening 3b and the second opening 3c are observed from the front, the third carrier FFU 18 is arranged on the side opposite to the guide rail 34. Specifically, as shown in FIG8 , the guide rail 34 is arranged to overlap with one end (on the +Y side) of the first opening 3b and the second opening 3c when the first opening 3b and the second opening 3c are observed from the front. The guide rail 34 extends in the up-down direction (Z direction), so the airflow generated by the first carrier FFU 16 and the second carrier FFU 17 easily flows in the up-down direction (Z direction) along the guide rail 34. On the other hand, in the second carrier space 3a2 (the space on the opposite side of the guide rail 34), even if the airflow generated by the first carrier FFU 16 and the second carrier FFU 17 flows in, the airflow will diffuse and it will be difficult to generate a downward flow.

According to the present embodiment, since the third carrier FFU 18 generates a downflow in the second carrier space 3a2, the space in which it is difficult to generate a downflow can be reduced in the carrier space 3a.

Next, the substrate processing device 1 of the present embodiment is further described with reference to Fig. 5, Fig. 7, and Fig. 9 to Fig. 11. Fig. 9 is a three-dimensional view showing the conveying block 6 of the substrate processing device 1. As shown in Fig. 9, the upper conveying portion 6a has an upper side wall portion 611, and the lower conveying portion 6b has a lower side wall portion 612. The lower side wall portion 612 is disposed below the upper side wall portion 611, and the upper side wall portion 611 and the lower side wall portion 612 are adjacent to the processing block 5 described with reference to Fig. 1 and Fig. 2. The upper side wall portion 611 is an example of the first side wall portion, and the lower side wall portion 612 is an example of the second side wall portion. More specifically, the upper side wall portion 611 includes an upper side wall portion 611 on the +Y side and an upper side wall portion 611 on the -Y side. The upper side wall portion 611 on the +Y side constitutes the side wall on the +Y side of the upper conveying portion 6a, and the upper side wall portion 611 on the -Y side constitutes the side wall on the -Y side of the upper conveying portion 6a. Similarly, the lower side wall portion 612 includes a lower side wall portion 612 on the +Y side and a lower side wall portion 612 on the -Y side. The lower side wall portion 612 on the +Y side constitutes the side wall on the +Y side of the lower conveying portion 6b, and the lower side wall portion 612 on the -Y side constitutes the side wall on the -Y side of the lower conveying portion 6b.

Fig. 10(a) is a diagram showing a cross section of the upper side wall portion 611 and the lower side wall portion 612. Specifically, Fig. 10(a) shows a cross section of the upper side wall portion 611 on the +Y side and a cross section of the lower side wall portion 612 on the +Y side.

As shown in FIG10( a), the upper side wall portion 611 has an upper gap forming portion 611a, and the lower side wall portion 612 has a lower gap forming portion 612a. The upper gap forming portion 611a and the lower gap forming portion 612a are opposite to each other in the up-down direction (Z direction), and a gap 63 is formed between the upper gap forming portion 611a and the lower gap forming portion 612a. The gap 63 is connected to the space of the lower FFU 13 and 14 described with reference to FIG5 . In addition, the gap 63 is connected to the outside of the conveying block 6. Specifically, the gap 63 is connected to the outside of the substrate processing device 1 via the gap between the conveying block 6 and the processing block 5.

More specifically, the upper section side wall portion 611 on the +Y side has a plurality of upper section gap forming portions 611a, and the lower section side wall portion 612 on the +Y side has a plurality of lower section gap forming portions 612a. Similarly, the upper section side wall portion 611 on the -Y side has a plurality of upper section gap forming portions 611a, and the lower section side wall portion 612 on the -Y side has a plurality of lower section gap forming portions 612a. The plurality of upper section gap forming portions 611a on the +Y side and the plurality of lower section gap forming portions 612a on the +Y side are arranged along the X direction. The plurality of upper section gap forming portions 611a on the -Y side and the plurality of lower section gap forming portions 612a on the -Y side are also arranged along the X direction.

According to the present embodiment, a part of the gas flowing from the upper transfer space 61a into the space where the lower FFUs 13 and 14 are arranged can escape to the outside of the transfer block 6 through the plurality of gaps 63. As a result, the gas can easily flow from the upper transfer space 41b described with reference to FIG. 7 to the upper transfer space 61a, and the gas is not easily retained in the upper transfer space 41b. Therefore, the airflow flowing from the carrying space 3a to the upper transfer space 61a through the upper transfer space 41b can be more reliably generated.

Furthermore, in this embodiment, as shown in Fig. 9 , the upper conveying section 6a has a plurality of opening ratio adjusting members 62. The plurality of opening ratio adjusting members 62 correspond one to one with the plurality of gaps 63. The opening ratio adjusting members 62 adjust the opening ratio of the corresponding gaps 63.

Specifically, each of the opening ratio adjusting members 62 is supported on the upper side wall portion 611 so as to be able to slide freely in the vertical direction (Z direction) relative to the upper side wall portion 611 in such a manner that the overlapping state with the corresponding gap 63 when viewed from the Y direction changes. By sliding the opening ratio adjusting member 62, the opening ratio of the corresponding gap 63 can be adjusted. For example, the operator slides the opening ratio adjusting member 62 in the vertical direction (Z direction) to adjust the opening ratio of the corresponding gap 63.

Fig. 10(b) is a perspective view showing the opening ratio adjusting member 62. Specifically, Fig. 10(b) shows the opening ratio adjusting member 62 with the gap 63 opened halfway. Fig. 10(a) also shows the opening ratio adjusting member 62 with the gap 63 opened halfway.

As shown in FIG. 10( b ), the opening ratio adjustment member 62 includes a plate portion 62 a and a shielding portion 62 b . The plate portion 62 a extends along the Z direction. The shielding portion 62 b extends along the X direction. The shielding portion 62 b is connected to the lower end of the plate portion 62 a .

The opening ratio adjustment member 62 is fixed to the upper side wall portion 611 by a fixing portion (not shown) above the gap 63. A through hole is provided in the fixing portion to penetrate in the Z direction, and the plate portion 62a of the opening ratio adjustment member 62 is slidably inserted into the through hole of the fixing portion.

For example, a screw mechanism for fixing the plate portion 62a to the through hole may be provided at the fixing portion. Alternatively, a spur gear may be provided at the plate portion 62a, and a gear may be provided at the fixing portion, so that the plate portion 62a and the fixing portion form a so-called rack and pinion mechanism. In this case, the gear provided at the fixing portion may be rotated manually or by a motor to slide the opening ratio adjustment member 62 in the Z direction.

The fixing portion is preferably disposed at a position where the overlap between the shielding portion 62b and the gap 63 can be changed more significantly when viewed from the Y direction by sliding the plate portion 62a relative to the fixing portion. For example, the fixing portion is preferably arranged in such a manner that when the opening ratio adjusting member 62 is in a certain state, the shielding portion 62b completely shields the gap 63 when viewed from the Y direction, and when the opening ratio adjusting member 62 is in another state, the shielding portion 62b completely opens the gap 63.

Fig. 11(a) is another view showing the cross section of the upper side wall portion 611 and the lower side wall portion 612. Fig. 11(b) is a three-dimensional view showing another state of the opening ratio adjustment member 62. Specifically, Fig. 11(a) shows the opening ratio adjustment member 62 closing the gap 63. Fig. 11(b) also shows the opening ratio adjustment member 62 closing the gap 63.

As shown in Fig. 10(a) and Fig. 10(b), the opening ratio adjusting member 62 opens the gap 63, whereby the gas flows out from the space where the lower stage FFU 13 and 14 are arranged (see Fig. 5) to the outside of the conveying block 6 through the gap 63. On the other hand, as shown in Fig. 11(a) and Fig. 11(b), the opening ratio adjusting member 62 blocks the gap 63, whereby the gas outflow through the gap 63 is prevented.

According to the present embodiment, the conveying block 6 has an opening ratio adjustment member 62, by which the opening ratio of the gap 63 can be adjusted, and the ease of gas outflow from the space where the lower FFUs 13 and 14 are arranged to the outside of the conveying block 6 can be adjusted. Therefore, the amount of gas outflow per unit time from the space where the lower FFUs 13 and 14 are arranged to the outside of the conveying block 6 can be adjusted. In this way, the opening ratio of the gap 63 can be adjusted, and the airflow from the carrier space 3a to the upper conveying space 61a via the upper conveying space 41b can be more reliably generated.

The first embodiment of the present invention has been described above with reference to Fig. 1 to Fig. 11. According to this embodiment, it is possible to suppress the downflow (airflow) turbulence generated in the upper transfer space 61a and the downflow (airflow) turbulence generated in the lower transfer space 61b.

Furthermore, in the present embodiment, the upper side wall portion 611 has an upper gap forming portion 611a, and the lower side wall portion 612 has a lower gap forming portion 612a, but only the upper side wall portion 611 may have a structure or shape for forming the gap 63, or only the lower side wall portion 612 may have a structure or shape for forming the gap 63.

Furthermore, in the present embodiment, the conveying block 6 has a plurality of gaps 63 , but the conveying block 6 may also have one gap 63 .

Furthermore, in the present embodiment, the conveying block 6 has the gap 63 on both the +Y side and the -Y side, but the conveying block 6 may have the gap 63 only on one of the +Y side and the -Y side.

In addition, in the present embodiment, the opening ratio adjustment member 62 slides in the vertical direction, but the sliding direction of the opening ratio adjustment member 62 is not limited to the vertical direction. The opening ratio adjustment member 62 can slide in a manner that can adjust the opening ratio of the corresponding gap 63. For example, the opening ratio adjustment member 62 can also be supported by the upper side wall portion 611 and slide freely in the X direction.

In the present embodiment, the upper conveying section 6a has the opening ratio adjusting member 62, but the lower conveying section 6b may also have the opening ratio adjusting member 62, or both the upper conveying section 6a and the lower conveying section 6b may have the opening ratio adjusting member 62.

[Implementation method 2] Next, implementation method 2 of the present invention is described with reference to Figures 12 and 13. However, matters different from implementation method 1 are described, and descriptions of matters the same as implementation method 1 are omitted. Implementation method 2 is different from implementation method 1 in that the first rectifying section 81 to the third rectifying section 83 are provided in the conveying block 6.

FIG. 12 is a diagram showing a part of the conveying block 6 provided in the substrate processing apparatus 1 of the present embodiment in an enlarged manner. Specifically, FIG. 12 is a diagram showing a part of the conveying block 6 when viewed from the +Y side in an enlarged manner. As shown in FIG. 12, in the present embodiment, the upper conveying portion 6a further includes a first rectifying portion 81 disposed on the upper perforated plate 71. The first rectifying portion 81 protrudes downward from the upper perforated plate 71. The first rectifying portion 81 may also be formed by a bent portion of the frame of the upper perforated plate 71.

The first rectifying section 81 rectify the gas passing through the holes of the upper perforated plate 71. Specifically, the first rectifying section 81 rectify the gas passing through the holes of the upper perforated plate 71 so that the gas passing through the holes of the upper perforated plate 71 flows toward the lower FFU 13 or the lower FFU 14. Therefore, according to this embodiment, the lower FFU 13 and the lower FFU 14 can efficiently suck the gas passing through the holes of the upper perforated plate 71.

In this embodiment, the lower FFU 13, 14 further includes a second rectifying portion 82. Specifically, the lower FFU 13, 14 includes a fan 112, a box-shaped member 111, a second rectifying portion 82, and a filter. The second rectifying portion 82 is provided in the box-shaped member 111. The second rectifying portion 82 protrudes upward from the box-shaped member 111.

The second rectifying section 82 rectify the gas passing through the holes of the upper perforated plate 71. Specifically, the second rectifying section 82 rectify the gas passing through the holes of the upper perforated plate 71 so that the gas passing through the holes of the upper perforated plate 71 flows toward the fan 112. Therefore, according to this embodiment, the lower FFU 13 and the lower FFU 14 can efficiently suck the gas passing through the holes of the upper perforated plate 71.

Furthermore, the box-shaped member 111 supports the fan 112. Specifically, the fan 112 is supported on the upper portion of the box-shaped member 111. The filter is accommodated inside the box-shaped member 111. The air sucked by the fan 112 diffuses in the inner space of the box-shaped member 111 and flows out of the box-shaped member 111 through the filter.

FIG. 13 is another diagram showing a part of the conveying block 6 of the present embodiment in an enlarged manner. Specifically, FIG. 13 shows a part of the conveying block 6 when viewed from the -X side in an enlarged manner. As shown in FIG. 13 , the lower conveying section 6b further has a top section 613 and a third rectifying section 83. The lower FFUs 13 and 14 and the third rectifying section 83 are provided at the top section 613.

The third rectifying section 83 rectify the gas passing through the holes of the upper perforated plate 71. Specifically, the third rectifying section 83 rectify the gas passing through the holes of the upper perforated plate 71 so that the gas passing through the holes of the upper perforated plate 71 flows toward the lower FFUs 13 and 14. Therefore, according to this embodiment, the lower FFUs 13 and 14 can efficiently suck the gas passing through the holes of the upper perforated plate 71.

The second embodiment of the present invention is described above with reference to Fig. 12 and Fig. 13. According to the present embodiment, the lower FFU 13 and the lower FFU 14 can efficiently suck the gas passing through the holes of the upper perforated plate 71.

Furthermore, in the present embodiment, the first to third rectifying sections 81 to 83 are provided in the conveying block 6 , but one or two of the first to third rectifying sections 81 to 83 may be provided in the conveying block 6 .

The embodiments of the present invention are described above with reference to the drawings (FIG. 1 to FIG. 13). However, the present invention is not limited to the above embodiments, and can be implemented in various ways within the scope of the gist thereof. In addition, the plurality of constituent elements disclosed in the above embodiments can be appropriately changed. For example, a certain constituent element among all constituent elements shown in a certain embodiment can be added as a constituent element of another embodiment, or some constituent elements among all constituent elements shown in a certain embodiment can be deleted from the embodiment.

The drawings are mainly schematic representations of the components for the purpose of facilitating the understanding of the invention. The thickness, length, number, spacing, etc. of the components shown in the drawings may be different from the actual objects for the convenience of drawing. In addition, the configuration of the components shown in the above-mentioned embodiments is an example and is not particularly limited. Various changes can be made within the scope of the effects of the invention.

For example, in the embodiment described with reference to Fig. 1 to Fig. 13, the upper conveying section 6a has two upper FFUs 11 and 12, but the upper conveying section 6a may also have one upper FFU, or may have three or more upper FFUs. Similarly, the lower conveying section 6b has two lower FFUs 13 and 14, but the lower conveying section 6b may also have one lower FFU, or may have three or more lower FFUs.

In the embodiment described with reference to Fig. 1 to Fig. 13, the upper conveying part 6a has a plurality of upper punching plates 71, but the upper conveying part 6a may also have one upper punching plate. Similarly, the lower conveying part 6b has a plurality of lower punching plates 72, but the lower conveying part 6b may also have one lower punching plate.

Furthermore, in the embodiment described with reference to FIGS. 1 to 13 , the lower conveying section 6 b has two exhaust fans 73 , but the lower conveying section 6 b may also have one exhaust fan 73 , or may have three or more exhaust fans 73 . [Industrial Applicability]

The present invention can be used in a device for processing a substrate.

1: substrate processing device 2: processing unit 3: carrier block 3a: carrier space 3a1: first carrier space 3a2: second carrier space 3b: first opening 3c: second opening 4: transfer block 5: processing block 6: transport block 6a: upper transport unit 6b: lower transport unit 7: multi-function block 11: upper FFU 12: upper FFU 13: lower FFU 14: lower FFU 15: carrier FFU unit 16: first carrier FFU 17: second carrier FFU 18: third carrier FFU 21: suction cup 23: baffle 25: processing nozzle 31: carrier placement unit 32: carrier transport unit 33: carrier transport robot 34: Guide rail 35: Base 36: Multi-joint arm 37: Hand 38: Electric parts group 41: Upper conveying part 41a: Upper opening 41b: Upper conveying space 42: Lower conveying part 42a: Lower opening 42b: Lower conveying space 50a: Upper substrate conveying part 50b: Lower substrate conveying part 51a: Upper conveying robot 51b: Lower conveying robot 52a: Fixed frame 52b: Fixed frame 53a: Movable frame 53b: Movable frame 54: Base 55: Rotating base 56: Arm 61a: Upper conveying space 61b: Lower conveying space 62: Opening ratio adjustment member 62a: Plate 62b: Shielding part 63: Gap 71: Upper perforated plate 72: Lower perforated plate 73: Exhaust fan 81: First rectifying section 82: Second rectifying section 83: Third rectifying section 111: Box-shaped member 112: Fan 611: Upper sidewall 611a: Upper gap forming section 612: Lower sidewall 612a: Lower gap forming section 613: Top C: Carrier TW, TW1, TW2, TW3, TW4: Tower unit W: Substrate

Figure 1 is a perspective view showing the overall structure of a substrate processing apparatus according to embodiment 1 of the present invention. Figure 2 is an exploded perspective view of the substrate processing apparatus according to embodiment 1 of the present invention. Figure 3 is a side view showing the internal structure of the substrate processing apparatus according to embodiment 1 of the present invention. Figure 4 is a top view showing the internal structure of the substrate processing apparatus according to embodiment 1 of the present invention. Figure 5 is a side view showing the internal structure of a transfer block of the substrate processing apparatus. Figure 6 is a perspective view showing a carrier block and a transfer block of the substrate processing apparatus. Figure 7 is another side view showing the internal structure of the substrate processing apparatus according to embodiment 1 of the present invention. Figure 8 is a front view showing the internal structure of the carrier block of the substrate processing apparatus. 9 is a perspective view showing a conveying block of a substrate processing apparatus.   In FIG. 10, (a) is a view showing a cross section of an upper side wall portion and a lower side wall portion. (b) is a perspective view showing an opening ratio adjusting component.   In FIG. 11, (a) is another view showing a cross section of an upper side wall portion and a lower side wall portion. (b) is a perspective view showing another state of the opening ratio adjusting component.   FIG. 12 is a view showing an enlarged portion of a conveying block provided in a substrate processing apparatus of embodiment 2 of the present invention.   FIG. 13 is another view showing an enlarged portion of a conveying block provided in a substrate processing apparatus of embodiment 2 of the present invention.

1: Substrate processing equipment

6: Transport block

6a: Upper conveying section

6b: Lower conveying section

11: Upper FFU

12: Upper FFU

13: Lower FFU

14: Lower FFU

61a: Upper transport space

61b: Lower transport space

71: Upper punching plate

72: Lower punching plate

73:Exhaust fan

111: Box-shaped component

112: Fan

Claims (13)

A substrate processing device, which processes substrates, comprises: a processing unit, which processes the substrates; a first conveying unit, which is adjacent to the processing unit; a second conveying unit, which is adjacent to the processing unit and is disposed below the first conveying unit; a transfer unit, which carries in and carries out the substrates; the first conveying unit, which is disposed between the transfer unit and the first conveying unit and temporarily carries the substrates; and the second conveying unit, which is disposed between the transfer unit and the second conveying unit and temporarily carries the substrates; and the first The conveying part comprises: a first substrate conveying part, which conveys the substrate; a first conveying space, which accommodates the first substrate conveying part; a first conveying fan filter unit, which is arranged above the first conveying space and supplies gas from the top to the bottom of the first conveying space; a first bottom, which has a plurality of first through holes, and is arranged below the first conveying space; and a first side wall part, which is adjacent to the processing part; the second conveying part comprises: a second substrate conveying part, which conveys the substrate; a second conveying space, which The second substrate conveying section is provided to accommodate the second substrate conveying section; the second conveying fan filter unit is provided below the first bottom and supplies gas from the upper part of the second conveying space to the lower part; the second bottom has a plurality of second through holes and is provided below the second conveying space; the exhaust fan is provided below the second bottom and exhausts the gas passing through the plurality of second through holes; and the second side wall is adjacent to the processing section and provided below the first side wall; and the first side wall is connected to the second At least one of the sidewalls further comprises a gap forming portion for forming a gap between the first sidewall and the second sidewall; at least one of the first conveying portion and the second conveying portion further comprises an opening ratio adjusting member for adjusting the opening ratio of the gap; the carrier portion comprises: a carrier conveying portion for carrying in and out the substrate; a carrier space for accommodating the carrier conveying portion; and a carrier fan filter unit portion, which is disposed above the carrier space and supplies gas from the top of the carrier space to the bottom. A substrate processing device as claimed in claim 1, wherein the first transport section has a plurality of the first transport fan filter units. A substrate processing device as claimed in claim 2, wherein the first substrate transport unit includes a first transport robot moving in the first transport space, and the plurality of first transport fan filter units are arranged in a manner to cover the moving range of the first transport robot. A substrate processing device as claimed in claim 1, wherein the second transport section has a plurality of the second transport fan filter units. A substrate processing device as claimed in claim 4, wherein the second substrate transport unit includes a second transport robot moving in the second transport space, and the plurality of second transport fan filter units are arranged in a manner to cover the moving range of the second transport robot. A substrate processing device as claimed in any one of claims 1 to 5, wherein the first conveying unit further comprises a first rectifying unit disposed at the first bottom, and the first rectifying unit rectify the gas passing through the plurality of first through holes. A substrate processing device as claimed in any one of claims 1 to 5, wherein the second transport fan filter unit has a fan, a box-shaped component supporting the fan, and a second rectifying section disposed on the box-shaped component, and the second rectifying section rectify the gas passing through the plurality of first through holes. A substrate processing device as claimed in any one of claims 1 to 5, wherein the second transport unit further comprises: a top portion for mounting the second transport fan filter unit; and a third rectifying unit disposed on the top portion; and the third rectifying unit rectifying the gas passing through the plurality of first through holes. A substrate processing device as claimed in any one of claims 1 to 5, wherein the carrier fan filter unit has: a first carrier fan filter unit, which is arranged on the side opposite to the first conveying part and the second conveying part; and a second carrier fan filter unit, which is arranged on the side of the first conveying part and the second conveying part. As in claim 9, the substrate processing device, wherein the carrier part further comprises: a first opening, which is connected to the first conveying part; and a second opening, which is arranged below the first opening and is connected to the second conveying part; and the carrier fan filter unit part further comprises a third carrier fan filter unit, and when the first opening and the second opening are observed from the front, the third carrier fan filter unit is arranged on one side of the first carrier fan filter unit and the second carrier fan filter unit. The substrate processing device of claim 10, wherein the transfer space includes: a first transfer space; and a second transfer space, which is located on one side of the first transfer space when the first opening and the second opening are observed from the front; and the uppermost portion of the first transfer space is located higher than the uppermost portion of the second transfer space, the first transfer fan filter unit and the second transfer fan filter unit supply gas from the upper part of the first transfer space to the lower part, and the third transfer fan filter unit supplies gas from the upper part of the second transfer space to the lower part. The substrate processing device of claim 10, wherein the carrier and transport section includes: a carrier and transport robot that transports the substrate; and a guide rail that guides the carrier and transport robot in the up and down directions; and the third carrier fan filter unit is disposed on the side opposite to the guide rail side when the first opening and the second opening are observed from the front. A substrate processing device as claimed in any one of claims 1 to 5, wherein the exhaust fan generates an airflow from the transfer space through the second transfer section to the second transfer space.

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