TW202208157A - Multi-layer plate having composite material - Google Patents
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本揭露是有關於一種混成材料(hybrid material)製作技術,且特別是有關於一種具複合材料材料之多層板及其製造方法。The present disclosure relates to a hybrid material fabrication technology, and more particularly, to a multi-layer board with a composite material and a fabrication method thereof.
消費者對於3C產品的需求除了體積輕薄外,也愈來愈在意外殼的金屬質感。舉例而言,目前市售的筆電外殼的材質一般可分成三大類,即塑膠、金屬、與纖維複材。金屬外殼堅固,外觀典雅,且觸感細膩,因而高端筆電商品的需求以金屬質感為主,特別是鋁合金經陽極處理發色之質感。Consumers' demand for 3C products is not only light and thin, but also pays more and more attention to the metal texture of the casing. For example, the materials of currently commercially available laptop casings can generally be divided into three categories, namely plastic, metal, and fiber composite materials. The metal shell is sturdy, elegant in appearance, and delicate in touch. Therefore, the demand for high-end notebook products is mainly metal texture, especially the texture of aluminum alloy with anodized color.
目前輕薄型筆電的外殼大都使用鋁合金陽極處理發色的材料。而隨著對於更輕薄筆電的追求,對於比鋁合金陽極處理之殼件還要更輕,又同時具有金屬質感之材料的需求也隨之提高。At present, the casings of thin and light notebooks are mostly made of aluminum alloy anodized materials. With the pursuit of thinner and lighter notebooks, the demand for materials that are lighter than aluminum alloy anodized shells and at the same time have a metallic feel has also increased.
一種解決方式係採用比鋁合金還要輕的材料。一般而言,鋁合金材料密度約為2.70g/cm3 。而比鋁合金更輕的材料有鎂合金與碳纖維複合材料,其中鎂合金的密度約為1.83g/cm3 ,碳纖維複合材料的密度則約為1.55g/cm3 ,皆可減輕外殼的重量。然而,鎂合金與碳纖維複合材料只能以噴漆方式上色,易產生肥邊或橘皮等問題。此外,經噴漆後之鎂合金與碳纖維複合材料的質感也不如陽極處理鋁合金。One solution is to use materials that are lighter than aluminum alloys. Generally speaking, the density of aluminum alloy material is about 2.70 g/cm 3 . Materials lighter than aluminum alloys include magnesium alloys and carbon fiber composite materials, wherein the density of magnesium alloys is about 1.83g/cm 3 and the density of carbon fiber composite materials is about 1.55g/cm 3 , both of which can reduce the weight of the shell. However, magnesium alloy and carbon fiber composite materials can only be painted by spray painting, which is prone to problems such as fat edges or orange peel. In addition, the texture of magnesium alloy and carbon fiber composite material after painting is not as good as that of anodized aluminum alloy.
另一種解決方式係在塑膠結構件的表面上,以膠合方式貼上鋁合金蒙皮,藉以得到金屬質感的外殼。然而,塑膠本身的強度低,若要得到符合產品規格的彎曲強度,就必須增加厚度,如此便無法達成體積輕薄的需求。Another solution is to attach an aluminum alloy skin to the surface of the plastic structural member by gluing, so as to obtain a metallic shell. However, the strength of the plastic itself is low. In order to obtain the bending strength that meets the product specifications, the thickness must be increased, so the requirement of light and thin volume cannot be achieved.
一種解決方式則係以冷噴塗方式將金屬粒子塗覆在玻璃纖維複合材料的外層上,藉以得到金屬質感的輕量化殼件。然而,冷噴塗的壓力會造成玻璃纖維複合材料變形。而若換成碳纖維複合材料,雖可以抑制冷噴塗所造成的變形,但成本提高,不具市場競爭力。A solution is to coat metal particles on the outer layer of the glass fiber composite material by cold spraying, so as to obtain a lightweight shell with a metallic texture. However, the pressure of cold spray can cause the glass fiber composite to deform. If it is replaced with carbon fiber composite materials, although the deformation caused by cold spraying can be suppressed, the cost will increase and it will not be competitive in the market.
一種技術係在塑膠材料的表面,利用真空氣相沉積方式來將塑膠材料的表面金屬化,再對金屬化後的塑膠材料部件做表面陽極處理,使部件外觀更具質感。然而,這樣的技術因經過真空鍍膜,成本較高。此外,對於大尺寸或高分子材料而言,就不適合利用這樣的沉積方式形成金屬膜。One technology is to metallize the surface of the plastic material by vacuum vapor deposition, and then anodize the surface of the metallized plastic material part to make the appearance of the part more textured. However, such a technology is expensive due to vacuum coating. In addition, for large-sized or high-molecular materials, it is not suitable to form a metal film by such a deposition method.
另有一種手機殼體製作技術係在金屬部件的表面上形成氧化層,其中氧化層具有微小孔洞。再將此金屬部件予以浸泡腐蝕,以再次造孔,使再次製作出的孔洞與先前氧化層中的微小孔洞連通,形成雙層立體空間結構。接著,射出樹脂而注入這些雙層孔洞中,以使樹脂與金屬部件上的氧化層之間達到機械鎖固的效果,藉此可增加樹脂與金屬部件等異材之間的接合強度。然而,由於孔洞之孔徑太小,若採板材熱壓接合等非射出製程時,孔洞中的氣體常無法排出,如此造成樹脂與金屬部件之間的接合性差,容易產生異材間分層的現象。Another mobile phone case manufacturing technology is to form an oxide layer on the surface of the metal part, wherein the oxide layer has tiny holes. The metal part is then immersed and corroded to make holes again, so that the holes made again are connected with the tiny holes in the previous oxide layer to form a double-layer three-dimensional space structure. Next, the resin is injected and injected into these double-layered holes, so that the resin and the oxide layer on the metal parts can achieve a mechanical locking effect, thereby increasing the bonding strength between the resin and different materials such as the metal parts. However, since the hole diameter is too small, the gas in the hole often cannot be discharged during non-injection processes such as sheet thermocompression bonding, which results in poor bonding between resin and metal parts, and is prone to delamination between dissimilar materials.
因此,本發明之一目的就是在提供一種具複合材料之多層板及其製造方法,其係將鋁基薄片與複合材料層予以層疊熱壓而製成具複合材料之多層板。透過調整鋁基薄片與複合材料層的疊層比例,可順利獲得不同的輕量化且具金屬質感之複合材料的多層板。Therefore, one object of the present invention is to provide a multi-layer board with composite material and a manufacturing method thereof. The aluminum-based sheet and the composite material layer are laminated and hot-pressed to form a multi-layer board with composite material. By adjusting the lamination ratio of the aluminum-based sheet and the composite material layer, different multi-layer boards of light-weight and metallic-like composite materials can be successfully obtained.
本發明之另一目的就是在提供一種具複合材料之多層板及其製造方法,其可先以化學蝕刻方式在鋁基薄片的表面產生具有明顯銳角形貌的微結構孔洞。藉此,可以直接熱壓鋁基薄片與複合材料層的層疊結構的方式,使熱壓鋁合金薄片與複合材料層穩固結合,而無需使用膠合劑來進行鋁基薄片與複合材料層之間的異材接合。Another object of the present invention is to provide a multi-layer board with composite material and a manufacturing method thereof, which can firstly generate microstructure holes with obvious acute angle morphology on the surface of the aluminum-based sheet by chemical etching. In this way, the laminated structure of the aluminum-based sheet and the composite material layer can be directly hot-pressed, so that the hot-pressed aluminum alloy sheet and the composite material layer can be firmly combined, without using an adhesive for the bonding between the aluminum-based sheet and the composite material layer. Dissimilar bonding.
本發明之又一目的就是在提供一種具複合材料之多層板及其製造方法,其鋁基薄片與複合材料層之間沒有膠合劑,因此多層板可通過陽極處理製程中的酸鹼液,而不會產生脫層現象,進而可有效製作出具多樣性之金屬質感又輕量化的多層板。Another object of the present invention is to provide a multi-layer board with composite material and a manufacturing method thereof. There is no adhesive between the aluminum-based sheet and the composite material layer, so that the multi-layer board can pass through the acid and alkali solution in the anodic treatment process. There will be no delamination phenomenon, which can effectively produce multi-layer boards with various metallic textures and light weight.
根據本發明之上述目的,提出一種具複合材料之多層板。此具複合材料之多層板包含鋁基薄片以及複合材料層。鋁基薄片依序包含第一鈍化層、鋁基金屬層、以及第二鈍化層。鋁基薄片包含第一表面以及相對第一表面之第二表面。第一表面以及第二表面均佈設有複數個微孔洞,且第二表面之微孔洞之孔徑為0.5μm至10μm。複合材料層包含熱塑性高分子以及纖維材料。複合材料層具有第三表面以及相對第三表面之第四表面。第二表面與第三表面相鄰或相接,且熱塑性高分子之至少一部分嵌入第二表面之微孔洞中。According to the above object of the present invention, a multi-layer board with composite material is proposed. The multi-layer board with composite material includes an aluminum-based sheet and a composite material layer. The aluminum-based sheet sequentially includes a first passivation layer, an aluminum-based metal layer, and a second passivation layer. The aluminum-based sheet includes a first surface and a second surface opposite to the first surface. A plurality of micro-holes are evenly distributed on the first surface and the second surface, and the diameter of the micro-holes on the second surface is 0.5 μm to 10 μm. The composite material layer contains thermoplastic polymer and fiber material. The composite material layer has a third surface and a fourth surface opposite the third surface. The second surface is adjacent to or connected to the third surface, and at least a part of the thermoplastic polymer is embedded in the micro-holes of the second surface.
依據本發明之一實施例,上述之第一表面之微孔洞之孔徑為0.01μm至0.1μm。According to an embodiment of the present invention, the diameter of the micro-holes on the first surface is 0.01 μm to 0.1 μm.
依據本發明之一實施例,上述之第二表面之平均粗糙度為1.5μm至3.5μm。According to an embodiment of the present invention, the average roughness of the second surface is 1.5 μm to 3.5 μm.
依據本發明之一實施例,上述之每個微孔洞具有銳角形貌。According to an embodiment of the present invention, each of the above-mentioned micro-holes has an acute-angled shape.
依據本發明之一實施例,上述之第一鈍化層的厚度大於第二鈍化層的厚度。According to an embodiment of the present invention, the thickness of the first passivation layer is greater than the thickness of the second passivation layer.
依據本發明之一實施例,上述之具複合材料之多層板更包含第二鋁基薄片,其中第二鋁基薄片與第四表面相鄰或相接。According to an embodiment of the present invention, the above-mentioned multilayer board with composite material further comprises a second aluminum-based sheet, wherein the second aluminum-based sheet is adjacent to or connected to the fourth surface.
根據本發明之上述目的,另提出一種具複合材料之多層板的製造方法。在此方法中,提供至少一鋁合金薄片。每個鋁基薄片之彼此相對之第三表面及第二表面均佈設有複數個微孔洞。將至少一複合材料層與上述至少一鋁基薄片交錯層疊,以形成多層板,其中複合材料層之數量少於或等於鋁基薄片。對多層板進行熱壓操作,以使複合材料層之一部分嵌入鄰接之鋁基薄片之微孔洞中。對多層板進行陽極處理中的鈍化製程,以在第三表面上形成第一鈍化層以及第一表面。According to the above purpose of the present invention, another method for manufacturing a multi-layer board with composite material is proposed. In this method, at least one aluminum alloy sheet is provided. A plurality of micro-holes are evenly distributed on the third surface and the second surface of each aluminum-based sheet which are opposite to each other. At least one composite material layer and the at least one aluminum-based sheet are alternately laminated to form a multi-layer board, wherein the number of composite material layers is less than or equal to the aluminum-based sheet. The multi-layer board is subjected to a hot pressing operation so that a portion of the composite material layer is embedded in the micro-cavities of the adjoining aluminum-based sheets. A passivation process in anodizing is performed on the multilayer board to form a first passivation layer and a first surface on the third surface.
依據本發明之一實施例,上述提供鋁基薄片包含對鋁基薄片之鋁基金屬層進行化學蝕刻操作,以使鋁基薄片之三表面與第二表面中形成具有銳角形貌之微孔洞。According to an embodiment of the present invention, the above-mentioned provision of the aluminum-based sheet includes chemically etching the aluminum-based metal layer of the aluminum-based sheet, so that micro-holes with acute-angle morphology are formed in the third surface and the second surface of the aluminum-based sheet .
依據本發明之一實施例,上述提供鋁基薄片包含對鋁基金屬片進行熱滾壓減薄處理,以製得鋁基薄片之鋁基金屬層。According to an embodiment of the present invention, the above-mentioned provision of the aluminum-based sheet includes performing a hot rolling thinning process on the aluminum-based metal sheet to obtain an aluminum-based metal layer of the aluminum-based sheet.
依據本發明之一實施例,上述進行熱滾壓減薄處理包含使鋁合金薄片之鋁基金屬層之表面具有(110)平面的晶粒優選方位。According to an embodiment of the present invention, the above-mentioned hot rolling thinning process includes making the surface of the aluminum-based metal layer of the aluminum alloy sheet have a preferred orientation of (110) plane grains.
有鑑於習知技術對於具金屬質感之材料開發的瓶頸,本發明實施方式在此提出一種具複合材料之多層板及其製造方法,其利用鋁基薄片疊層至熱塑纖維複合材料而形成一種具複合材料之多層板。此多層板比鋁合金輕且具有金屬質感,適用於作為3C產品之高質感殼件材料。此外,多層板可利用調整疊層比例來達到不同的輕量化程度,且外層之鋁合金薄片更可經陽極處理的發色處理後獲得所需的金屬質感。In view of the bottleneck in the development of materials with metallic texture in the prior art, the embodiments of the present invention provide a multi-layer board with a composite material and a manufacturing method thereof, which utilizes aluminum-based sheets to be laminated to thermoplastic fiber composite materials to form a composite material. Multilayer boards with composite materials. This multi-layer board is lighter than aluminum alloy and has a metallic texture, which is suitable for high-quality shell materials of 3C products. In addition, the multi-layer board can be adjusted to achieve different degrees of light weight by adjusting the lamination ratio, and the aluminum alloy sheet of the outer layer can be anodized to obtain the desired metallic texture after color development.
請參照圖1至圖3,其中圖1係繪示依照本發明之第一實施方式的一種具複合材料之多層板的立體示意圖,圖2係繪示圖1之多層板的局部放大剖面示意圖,圖3為依照本發明之第一實施方式的一種具複合材料之多層板之鋁合金薄片的掃瞄式電子顯微影像。此實施方式之具複合材料之多層板100a包含鋁基薄片110以及複合材料層120。鋁基薄片110依序包含第一鈍化層112,鋁基金屬層114以及第二鈍化層116。複合材料層120包含熱塑性高分子122及分散在熱塑性高分子122的纖維材料124。在此實施方式中,鋁基薄片110與複合材料層120的數量相同,均為1個。如圖1所示,鋁基薄片110與複合材料層120互相疊置。鋁基薄片110具有彼此相對之第一表面110a與第二表面110b。在一實施例中,鋁基金屬層114具有第三表面114a以及第四表面114b。此外,第三表面114a、第四表面114b或兩者具(110)平面的晶粒優選方位(Preferred Orientation)。在一實施例中,可透過X-ray繞射分析證明第三表面114a、第四表面114b或兩者具有(110)平面的晶粒優選方位。在一實施例中,鋁基金屬層114表面之(110)平面的X-ray繞射分析的強度大於(100)平面以及(111)平面的強度。Please refer to FIG. 1 to FIG. 3 , wherein FIG. 1 is a three-dimensional schematic diagram showing a multilayer board with composite material according to the first embodiment of the present invention, and FIG. 2 is a partial enlarged cross-sectional schematic diagram showing the multilayer board of FIG. 1 , 3 is a scanning electron microscope image of an aluminum alloy sheet of a multi-layered plate with composite materials according to the first embodiment of the present invention. The multilayer board with
在一實施例中,鋁基薄片110之第一表面110a以及第二表面110b分別佈設有許多第一微孔洞112a以及第二微孔洞116a,如圖2所示。在一實施例中,第一微孔洞112a之平均孔徑小於第二微孔洞116a之平均孔徑。在一實施例中,每個第一微孔洞112a之孔徑可為約0.01μm至約0.1μm。如圖3所示,在一實施例中,每個第二微孔洞116a之孔徑可為約0.5μm至約10μm。在另一實施例中,每個第二微孔洞116a之孔徑可為約1μm至約4μm。第二微孔洞116a之孔徑在0.5μm之上則鋁基薄片110與複合材料層120在熱壓製程中,複合材料層120中的熱塑性高分子122能夠充分的填入第二微孔洞116a因此鋁基薄片110與複合材料層120之間具有良好的接合性及氣密性。此外,在一實施例中,鋁基薄片110之第一表面110a的平均粗糙度(Ra)可為約0.1μm至約0.5μm且第二表面110b的平均粗糙度可為約1.5μm至約3.5μm。在一些實施例中,這些第二微孔洞116a之形狀大部分為長方形、矩形、或多邊形的銳角形貌,而非圓弧狀形貌。In one embodiment, the
參閱圖2所示,第一鈍化層112的厚度大於該第二鈍化膜116的厚度。Referring to FIG. 2 , the thickness of the
在第二鈍化層116與熱塑性高分子122的緊密接合下,使得鋁基薄片110與複合材料層120之間的接合面可抵擋陽極處理之酸鹼液的侵蝕。藉此,可對具複合材料之多層板100a進行陽極處理,而使具複合材料之多層板100a之表面具有陽極處理發色後的金屬質感。在一些示範例子中,具複合材料之多層板100a經鹽霧試驗1000小時後,表層經百格測試可達5B等級。Under the close bonding between the
複合材料層120具有彼此相對之第一表面120a與第二表面120b。複合材料層120之第一表面120a壓合在鋁基薄片110的第二表面110b上,且複合材料層120的一部分熱塑性高分子122嵌入鄰接之鋁基薄片110之第二表面110b的第二微孔洞116a中。由於鋁基薄片110之第二微孔洞116a具有銳角形貌,因此複合材料層120與鋁基薄片110之間具有良好的接合性及氣密性。The
複合材料層120中纖維材料124可例如為碳纖維或玻璃纖維。熱塑性高分子122可例如為聚丙烯(PP)、聚氯乙烯(PVC)、聚碳酸酯(PC)、聚醯胺樹脂(PA)、聚醚醚酮(PEEK)、熱塑性聚醯亞胺(TPI)、或聚苯硫醚(PPS)。The
如圖1所示,在一些實施例中,具複合材料之多層板100a之第一鈍化層112以及第二鈍化層116可為鋁基金屬層114之材料的氧化層,例如氧化鋁(Al2
O3
)層。在一實施例中,第一鈍化層112經由陽極鈍化處理因此厚度與孔隙的大小與第二鈍化層116不同。As shown in FIG. 1 , in some embodiments, the
請參照圖4,其係繪示依照本發明之第二實施方式的一種具複合材料之多層板的立體示意圖。此實施方式之具複合材料之多層板100b與圖1之具複合材料之多層板100a的架構大致相同,二者的差異在於具複合材料之多層板100b包含二個鋁基薄片110與140。因此,具複合材料之多層板100b的鋁基薄片110與140的數量比複合材料層120的數量多1個。Please refer to FIG. 4 , which is a three-dimensional schematic view of a multilayer board with composite materials according to a second embodiment of the present invention. The structure of the
鋁基薄片140依序包含第三鈍化層142、鋁基金屬層144、以及第四鈍化層146。鋁基薄片140具有相對之第一表面140a與第二表面140b。鋁基金屬層144之組成可與鋁基金屬層114之組成相同,亦可與鋁基金屬層114之組成不同。在一實施例中,鋁基金屬層144具有第三表面144a以及第四表面144b。此外,第三表面144a及/或第四表面144b具(110)平面的晶粒優選方位。在一實施例中,鋁基金屬層144表面之(110)平面的X-ray繞射分析的強度大於(100)平面以及(111)平面的強度。The aluminum-based
鋁基薄片140之第一表面140a以及第二表面140b分別佈設有許多微孔洞(未繪示於圖中)。佈設於鋁基薄片140之第一表面140a的微孔洞以及第二表面140b的微孔洞型態與尺寸分別如圖2所示之第二微孔洞116a以及第一微孔洞112a。由於第一微孔洞112a以及第二微孔洞116a之型態與尺寸已詳細說明於上,故於此不再針對鋁基薄片140之第一表面140a以及第二表面140b之微孔洞的型態與尺寸詳細描述。此外,在一實施例中,鋁基薄片140之第一表面140a的平均粗糙度可為約1.5μm至約3.5μm,且第二表面140b的平均粗糙度可為約0.1μm至約0.5μm。The
此外,如圖4所示,第三鈍化層142的厚度小於第四鈍化膜146的厚度。In addition, as shown in FIG. 4 , the thickness of the
在熱塑性高分子122與第二鈍化層116及第三鈍化層142的緊密接合下,使得鋁基薄片110及140與複合材料層120之間的接合面可抵擋陽極處理之酸鹼液的侵蝕。藉此,可對具複合材料之多層板100b進行陽極處理,而使具複合材料之多層板100b之表面具有陽極處理發色後的金屬質感。Under the close bonding between the
在具複合材料之多層板100b中,鋁基薄片110與140和複合材料層120交錯層疊,因此複合材料層120夾設於鋁基薄片110與140之間。複合材料層120之第一表面120a與第二表面120b分別和鋁基薄片110之第二表面110b與鋁基薄片140之第一表面140a壓合。此外,鋁基薄片110與140中分別為具複合材料之多層板100b的二外層。In the
複合材料層120的一部分熱塑性高分子122嵌入鄰接之鋁基薄片110之第二表面110b的第二微孔洞116a中,複合材料層120的另一部分熱塑性高分子122則嵌入鄰接之鋁基薄片140之第一表面140a的微孔洞中。由於鋁基薄片110之第二微孔洞116a與鋁基薄片140之第一表面140a中的微孔洞均具有銳角形貌,因此複合材料層120與鋁基薄片110之間、及與鋁基薄片140之間均具有良好的接合性及氣密性。A part of the
如圖4所示,在一實施例中,鋁基薄片140之第三鈍化層142以及第四鈍化層146可為鋁基金屬層144之材料的氧化層,例如氧化鋁層。在一實施例中,第四鈍化層146經由陽極鈍化處理因此厚度與孔隙的大小與第三鈍化層142不同。As shown in FIG. 4 , in one embodiment, the
請參照圖5,其係繪示依照本發明之第三實施方式的一種具複合材料之多層板的立體示意圖。此實施方式之具複合材料之多層板100c與圖4之具金屬質感之混成材料100b的架構大致相同,二者的差異在於具複合材料之多層板100c包含二個複合材料層120與150。因此,具複合材料之多層板100c的鋁基薄片110與140的數量和複合材料層120與150的數量相同。Please refer to FIG. 5 , which is a three-dimensional schematic view of a multilayer board with composite materials according to a third embodiment of the present invention. The structure of the
複合材料層150包含熱塑性高分子152及分散在熱塑性高分子152的纖維材料154。熱塑性高分子152之組成可與熱塑性高分子122之組成相同,亦可與熱塑性高分子122之組成不同。纖維材料154之組成可與纖維材料124之組成相同或不同。複合材料層150具有相對之第一表面150a與第二表面150b。The
在熱塑性高分子122與第二鈍化層116及第三鈍化層116,以及熱塑性高分子152與第四鈍化層146的緊密接合下,使得鋁基薄片110及140與複合材料層120及150之間的接合面可抵擋陽極處理之酸鹼液的侵蝕。藉此,可對具複合材料之多層板100c進行陽極處理,而使具複合材料之多層板100c之表面具有陽極處理發色後的金屬質感。Under the close bonding of the
在具複合材料之多層板100c中,鋁基薄片110與140和複合材料層120與150交錯層疊,因此鋁基薄片110與140中的鋁合金薄片110為具複合材料之多層板100c的一外層。複合材料層150之第一表面150a和鋁基薄片140之第二表面140b壓合,且複合材料層150的一部分熱塑性高分子152嵌入鄰接之鋁基薄片140之第二表面140b的微孔洞中。由於鋁基薄片140之第二表面140b中的微孔洞具有銳角形貌,因此複合材料層150與鋁基薄片140之間具有良好的接合性及氣密性。In the
請參照圖6,其係繪示依照本發明之第四實施方式的一種具複合材料之多層板的立體示意圖。此實施方式之具複合材料之多層板100d與圖5之具複合材料之多層板100c的架構大致相同,二者的差異在於具複合材料之多層板100d包含三個鋁基薄片110、140、與160。因此,具複合材料之多層板100d的鋁基薄片110、140、與160的數量比複合材料層120與150的數量多1個。Please refer to FIG. 6 , which is a three-dimensional schematic view of a multilayer board with composite materials according to a fourth embodiment of the present invention. The structure of the
鋁基薄片160依序包含第五鈍化層162、鋁基金屬層164、以及第六鈍化層166。鋁基薄片160具有相對之第一表面160a與第二表面160b。鋁基金屬層164之組成可與鋁基金屬層114及144之組成相同,或可與鋁基金屬層114及144之組成不同,或者可與鋁基金屬層114及144之一者的組成相同而與另一者不同。在一實施例中,鋁基金屬層164具有第三表面164a以及第四表面164b。此外,第三表面164a及/或第四表面164b具(110)平面的晶粒優選方位。在一實施例中,鋁基金屬層164表面之(110)平面的X-ray繞射分析的強度大於(100)平面以及(111)平面的強度。The aluminum-based
鋁基薄片160之第一表面160a與第二表面160佈設有許多微孔洞(未繪示於圖中)。佈設於鋁基薄片160之第一表面160a的微孔洞以及第二表面160b的微孔洞型態與尺寸分別如圖2所示之第二微孔洞116a以及第一微孔洞112a。故,於此不再針對鋁基薄片160之第一表面160a以及第二表面160b之微孔洞的型態與尺寸詳細描述。此外,在一實施例中,鋁金屬薄片160之第一表面160a的平均粗糙度可為約1.5μm至約3.5μm,且第二表面140b的平均粗糙度可為約0.1μm至約0.5μm。The
此外,如圖6所示,第五鈍化層162的厚度小於第六鈍化膜166的厚度。In addition, as shown in FIG. 6 , the thickness of the
在熱塑性高分子122與第二鈍化層116及第三鈍化層142,熱塑性高分子152與第四鈍化層146及第五鈍化層162的緊密接合下,使得鋁基薄片110、140、及160與複合材料層120及150之間的接合面可抵擋陽極處理之酸鹼液的侵蝕。藉此,可對具複合材料之多層板100d進行陽極處理,而使具複合材料之多層板100d之表面具有陽極處理發色後的金屬質感。Under the close bonding of the
在具複合材料之多層板100d中,鋁基薄片110、140、與160和複合材料層120與150交錯層疊,如此複合材料層120與150分別夾設於鋁基薄片110與140之間、以及鋁基薄片140與160之間。複合材料層150之第二表面150b和鋁基薄片160之第一表面160a壓合。此外,鋁基薄片110與160中分別為具複合材料之多層板100d的二外層。In the multilayer board with
複合材料層150的另一部分熱塑性高分子152嵌入鄰接之鋁基薄片160之第一表面160a的微孔洞中。由於鋁基薄片160之微孔洞具有銳角形貌,因此複合材料層150與鋁基薄片160之間具有良好的接合性及氣密性。Another part of the
如圖6所示,在一實施例中,鋁基薄片160之第五鈍化層162以及第六鈍化層166可為鋁基金屬層164之材料的氧化層,例如氧化鋁層。在一實施例中,第六鈍化層166經由陽極鈍化處理因此厚度與孔隙的大小與第五鈍化層162不同。As shown in FIG. 6 , in one embodiment, the
根據上述實施方式可知,本發明可利用調整具複合材料之多層板中鋁基薄片與複合材料層的疊層比例,來達到不同的輕量化。舉例而言,本發明之具複合材料之多層板至少可比鋁合金輕量化15%以上。綜合上述之實施方式,本發明之具複合材料之多層板包含交錯疊層之至少一鋁基薄片以及至少一複合材料層,且複合材料層的數量可等於或小於鋁基薄片的數量。According to the above-mentioned embodiments, the present invention can achieve different weight reduction by adjusting the lamination ratio of the aluminum-based sheet and the composite material layer in the multilayer board with the composite material. For example, the multi-layer board with the composite material of the present invention can be at least 15% lighter than the aluminum alloy. Combining the above-mentioned embodiments, the multi-layer board with composite material of the present invention comprises at least one aluminum-based sheet and at least one composite material layer alternately stacked, and the number of composite material layers can be equal to or less than the number of aluminum-based sheets.
請參照圖7,其係繪示依照本發明之一實施方式的一種具複合材料之多層板之製造方法的流程圖。製作具複合材料之多層板時,可先進行步驟200,以提供至少一鋁基薄片,如圖1之鋁基薄片110,或圖4與圖5之鋁基薄片110與140,或圖6之鋁基薄片110、140、與160。在一些例子中,提供鋁基薄片時,可對鋁基金屬片進行熱滾壓減薄處理,以製得所需厚度的鋁基金屬層。在一實施例中,對鋁基金屬片進行熱滾壓減薄處理時,可使所形成之鋁基金屬層之表面具(110)平面之晶粒優選方位。舉例而言,進行熱滾壓減薄處理時之溫度可控制在約275℃。Please refer to FIG. 7 , which is a flowchart illustrating a method for manufacturing a multi-layer board with a composite material according to an embodiment of the present invention. When fabricating a multi-layer board with composite materials,
在一實施例中,提供鋁基薄片時,可於鋁基金屬層形成後,對鋁基金屬層進行化學蝕刻操作,以蝕刻鋁基金屬層,而在鋁基金屬層的表面中形成具有銳角形貌的微孔洞。發明人發現,表面具(110)平面的晶粒優選方位之鋁基金屬層可在化學蝕刻後產生具有明顯銳角形貌之微結構孔洞。這些微孔洞之形狀大部分為長方形、矩形、或多邊形的銳角形貌,而非圓弧狀形貌。在一實施例中,每個微孔洞之孔徑可為約0.5μm至約10μm。在另一實施例中,每個微孔洞之孔徑可為約1μm至約4μm。此外,鋁基金屬層之表面的平均粗糙度可例如為約1.5μm至約3.5μm。In one embodiment, when the aluminum-based sheet is provided, after the aluminum-based metal layer is formed, a chemical etching operation may be performed on the aluminum-based metal layer to etch the aluminum-based metal layer, and an acute angle is formed in the surface of the aluminum-based metal layer. Morphology of micropores. The inventors found that an aluminum-based metal layer with a grain-preferred orientation of (110) planes on the surface can produce microstructured pores with obvious sharp-angle topography after chemical etching. The shapes of these micro-holes are mostly rectangular, rectangular, or polygonal acute-angled shapes, rather than arc-shaped shapes. In one embodiment, the pore size of each micro-hole may be about 0.5 μm to about 10 μm. In another embodiment, the pore size of each micro-hole may be about 1 μm to about 4 μm. In addition, the average roughness of the surface of the aluminum-based metal layer may be, for example, about 1.5 μm to about 3.5 μm.
發明人亦發現鋁基金屬層之表面具(110)平面的晶粒優選方位具較低彈性能,因此鋁基金屬層之表面容易快速產生鈍化膜。故,在一實施例中,提供鋁基薄片時,可於完成鋁基金屬層的薄化後,形成鈍化層分別覆蓋在鋁基金屬層的表面。這些鈍化層可為鋁基金屬層之材料的氧化層,例如氧化鋁層。鈍化層可保護鋁基金屬層,以避免鋁基金屬層被酸鹼液所腐蝕。The inventors also found that the grains with the (110) plane on the surface of the aluminum-based metal layer preferably have a lower elastic energy, so that the surface of the aluminum-based metal layer is likely to quickly generate a passivation film. Therefore, in one embodiment, when the aluminum-based sheet is provided, after the thinning of the aluminum-based metal layer is completed, a passivation layer can be formed to cover the surface of the aluminum-based metal layer, respectively. These passivation layers may be oxide layers of the material of the aluminum-based metal layer, such as aluminum oxide layers. The passivation layer can protect the aluminum-based metal layer to prevent the aluminum-based metal layer from being corroded by acid and alkali solutions.
提供鋁基薄片後,可進行步驟210,以先提供至少一複合材料層,如圖1與圖4之複合材料層120,或圖5與圖6之複合材料層120與150。再將複合材料層與鋁基薄片予以交錯層疊,而形成多層板。在本實施方式中,提供鋁基薄片與複合材料層之步驟可調整,亦可先提供複合材料層,或同時提供。複合材料層的數量可等於或小於鋁基薄片的數量。在多層板中,當鋁基薄片的數量為多個時,多層板之相對二外層中之一個外層或二個外層對應為這些鋁基薄片之一個或二個。即,鋁基薄片為多層板的至少一外層,以提供多層板具金屬質感的表面。這些複合材料層的組成與變化如上述實施方式所描述,於此不再贅述。After the aluminum-based sheet is provided,
接著,可進行步驟220,以利用例如熱壓機對多層板進行熱壓操作,而將交錯堆疊之多層板熱壓接合成板材,大致完成具複合材料之多層板,例如上述之具複合材料之多層板100a~100d的製作。在熱壓操作中,複合材料層中的熱塑性高分子經熱壓機加熱加壓後,熱塑性高分子的一部分可流入鋁基薄片之表面的微孔洞中,而使每個熱塑性高分子的一部分嵌入鄰接之鋁基薄片的微孔洞中。由於鋁基薄片經化學處理後其表面產生具有銳角形貌的微孔洞,因此熱壓操作時可使鋁基薄片與熱塑性高分子發生錨固效應,直接接合鎖固,而使具複合材料之多層板具有優異的接合力與氣密性,進而可大幅提升具複合材料之多層板之機械性質與可靠度。故,本實施方式可無需使用膠合劑,即可進行大面積之鋁基薄片與複合材料層的異材接合。Next, step 220 can be performed to perform a hot pressing operation on the multi-layer board by using, for example, a hot-pressing machine, and thermo-compression bonding the cross-stacked multi-layer boards into a board to substantially complete a multi-layer board with a composite material, such as the above-mentioned one with a composite material. Fabrication of
在一些例子中,藉由調整具複合材料之多層板中鋁基薄片與複合材料層的堆疊結構,可使具複合材料之多層板之彎曲強度範圍為約230MPa至約550MPa,密度為約1.95g/cm3 至約2.35g/cm3 ,極具產業價值。各實施例之具複合材料之多層板可做為輕量化之3C產品的殼體,重量可較鋁合金輕15%以上。In some examples, by adjusting the stacking structure of the aluminum-based sheet and the composite material layer in the multilayer board with composite material, the flexural strength of the multilayer board with composite material can range from about 230 MPa to about 550 MPa, and the density is about 1.95 g /cm 3 to about 2.35 g/cm 3 , which is of great industrial value. The multi-layer boards with composite materials of each embodiment can be used as the shell of the lightweight 3C product, and the weight can be more than 15% lighter than that of the aluminum alloy.
之後可進行步驟230,以圖2所示之結構為例,對已與複合材料層120疊合的鋁基薄片110進行陽極處理的鈍化製程以形成第一鈍化層112。由於鋁基薄片與複合材料層之間具有良好的接合性及氣密性,且鋁基薄片之表面覆設有鈍化層,因此具複合材料之多層板可通過陽極處理製程中之酸鹼液而不會產生脫層。藉此,可進一步對具複合材料之多層板進行陽極處理後續的發色製程來予以加飾,使具複合材料之多層板之外觀顏色更具多樣化。通過陽極處理中金屬質感發色的方式,較習知碳纖維複合材料與鎂合金的外觀噴漆方式在質感有優勢,且無揮發性有機化合物(VOC)汙染的問題。After that, step 230 may be performed. Taking the structure shown in FIG. 2 as an example, an anode treatment passivation process is performed on the aluminum-based
以下利用多個實施例與比較例的實驗結果,來更具體說明利用本發明之實施例的技術內容與功效,然其並非用以限定本發明。The following uses the experimental results of various embodiments and comparative examples to describe the technical content and effects of the embodiments of the present invention in more detail, but it is not intended to limit the present invention.
實施例之具複合材料之多層板與比較例之材料組成與特性如下表1所列示。
表1
上表1之鋁片厚度、纖維厚度、與結構厚度的單位均為mm,密度的單位為g/cm3 ,抗彎強度的單位為MPa,抗彎模量的單位為GPa。其次,鋁種類M1為型號CA01且厚度0.3mm的鋁合金片,鋁種類M2為型號1050且厚度0.3mm的鋁合金片,鋁種類M3為型號1100且厚度0.15mm的鋁合金片,鋁種類M4為型號1050且厚度0.15mm的鋁合金片,鋁種類M5為型號5052且厚度0.1mm的鋁合金片,鋁種類M6為型號1050且厚度0.2mm的鋁合金片。纖維種類G為厚度0.2mm之玻璃纖維增強熱塑性塑料(GFRTP),其中之熱塑性高分子為聚碳酸酯。此外,結構A為M1/G/M3/G/M1疊層結構,結構B為M2/G/M3/G/M2疊層結構,結構C為M4/G/M5/G/M4疊層結構,結構D為M1/2G/M1疊層結構,結構E為M2/2G/M2疊層結構,結構F為M6/2G/M6疊層結構。The unit of aluminum sheet thickness, fiber thickness and structural thickness in Table 1 above is mm, the unit of density is g/cm 3 , the unit of flexural strength is MPa, and the unit of flexural modulus is GPa. Next, the aluminum type M1 is an aluminum alloy sheet of type CA01 and a thickness of 0.3 mm, the aluminum type M2 is an aluminum alloy sheet of a type of 1050 and a thickness of 0.3 mm, the aluminum type M3 is an aluminum alloy sheet of a type of 1100 and a thickness of 0.15 mm, and the aluminum type M4 It is an aluminum alloy sheet of type 1050 and a thickness of 0.15 mm, the aluminum type M5 is an aluminum alloy sheet of a type of 5052 and a thickness of 0.1 mm, and the aluminum type M6 is an aluminum alloy sheet of a type of 1050 and a thickness of 0.2 mm. The fiber type G is glass fiber reinforced thermoplastic (GFRTP) with a thickness of 0.2 mm, wherein the thermoplastic polymer is polycarbonate. In addition, the structure A is the M1/G/M3/G/M1 stack structure, the structure B is the M2/G/M3/G/M2 stack structure, the structure C is the M4/G/M5/G/M4 stack structure, The structure D is the M1/2G/M1 stack structure, the structure E is the M2/2G/M2 stack structure, and the structure F is the M6/2G/M6 stack structure.
由上表1可知,本發明之實施例的具複合材料之多層板可在保持與比較例之鋁合金相當的結構強度下,有效降低材料密度,達到輕量化的效果。From Table 1 above, it can be seen that the multi-layer board with composite material of the embodiment of the present invention can effectively reduce the material density and achieve the effect of light weight while maintaining the structural strength equivalent to the aluminum alloy of the comparative example.
對實施例3之具複合材料之多層板進行可靠度驗證,實施例3之鹽霧測試條件列示於下表2。
表2
實施例3之具複合材料之多層板在上表2的鹽霧試驗條件下進行鹽霧試驗後,並未發現腐蝕與陽極處理脫落的現象。此外,實施例3之具複合材料之多層板於鹽霧試驗後,表層再經百格測試為5B等級,陽極處理為脫落,可靠度佳。After the multi-layer board with composite material of Example 3 was subjected to the salt spray test under the conditions of the salt spray test in Table 2 above, no corrosion and anodic treatment peeling were found. In addition, after the salt spray test of the multi-layer board with the composite material of Example 3, the surface layer was rated as 5B after the 100-grid test, and the anodized treatment showed good reliability.
由上述之實施方式可知,本發明之一優點就是因為本發明之實施方式係將鋁基薄片與複合材料層予以層疊熱壓而製成具複合材料之多層板,因此透過調整多層板中鋁基薄片與複合材料層的疊層比例,可順利獲得不同的輕量化且具金屬質感之複合材料的多層板。It can be seen from the above-mentioned embodiments that one of the advantages of the present invention is that in the embodiment of the present invention, the aluminum-based sheet and the composite material layer are laminated and hot-pressed to form a multi-layer board with a composite material. The lamination ratio of the thin sheet and the composite material layer can smoothly obtain the multi-layer boards of different lightweight and metal-like composite materials.
由上述之實施方式可知,本發明之另一優點就是因為本發明之實施方式可先以化學蝕刻方式在鋁基薄片的表面產生具有明顯銳角形貌的微結構孔洞。藉此,可以直接熱壓鋁基薄片與複合材料層的層疊結構的方式,使熱壓鋁基薄片與複合材料層穩固結合,而無需使用膠合劑來進行鋁基薄片與複合材料層之間的異材接合。As can be seen from the above-mentioned embodiments, another advantage of the present invention is that the embodiments of the present invention can firstly generate microstructured pores with obvious acute-angle morphology on the surface of the aluminum-based sheet by chemical etching. In this way, the laminated structure of the aluminum-based sheet and the composite material layer can be directly hot-pressed, so that the hot-pressed aluminum-based sheet and the composite material layer can be firmly combined without using an adhesive for the bonding between the aluminum-based sheet and the composite material layer. Dissimilar bonding.
由上述之實施方式可知,本發明之又一優點就是因為本發明之具複合材料之多層板的鋁基薄片與複合材料層之間沒有膠合劑,因此多層板可通過陽極處理製程中的酸鹼液,而不會產生脫層現象,進而可有效製作出具多樣性之金屬質感又輕量化的多層板。It can be seen from the above-mentioned embodiments that another advantage of the present invention is that there is no adhesive between the aluminum-based sheet and the composite material layer of the multi-layer board with composite material of the present invention, so the multi-layer board can pass the acid and alkali in the anodic treatment process. liquid, without the phenomenon of delamination, and can effectively produce multi-layer boards with a variety of metal textures and light weight.
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何在此技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed as above with examples, it is not intended to limit the present invention. Anyone with ordinary knowledge in this technical field can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention should be determined by the scope of the appended patent application.
100a:具複合材料之多層板
100b:具複合材料之多層板
100c:具複合材料之多層板
100d:具複合材料之多層板
110:鋁基薄片
110a:第一表面
110b:第二表面
112:第一鈍化層
112a:第一微孔洞
114:鋁基金屬層
114a:第三表面
114b:第四表面
116:第二鈍化層
116a:第二微孔洞
120:複合材料層
120a:第一表面
120b:第二表面
122:熱塑性高分子
124:纖維材料
140:鋁基薄片
140a:第一表面
140b:第二表面
142:第三鈍化層
144:鋁基金屬層
144a:第三表面
144b:第四表面
146:第四鈍化層
150:複合材料層
150a:第一表面
150b:第二表面
152:熱塑性高分子
154:纖維材料
160:鋁基薄片
160a:第一表面
160b:第二表面
162:第五鈍化層
164:鋁基金屬層
164a:第三表面
164b:第四表面
166:第六鈍化層
200:步驟
210:步驟
220:步驟
230:步驟100a: Multilayer boards with
為讓本發明之上述和其他目的、特徵、優點與實施例能更明顯易懂,所附圖式之說明如下: [圖1]係繪示依照本發明之第一實施方式的一種具複合材料之多層板的立體示意圖; [圖2]係繪示圖1之多層板的局部放大剖面示意圖; [圖3]為依照本發明之第一實施方式的一種具複合材料之多層板的掃瞄式電子顯微影像; [圖4]係繪示依照本發明之第二實施方式的一種具複合材料之多層板的立體示意圖; [圖5]係繪示依照本發明之第三實施方式的一種具複合材料之多層板的立體示意圖; [圖6]係繪示依照本發明之第四實施方式的一種具複合材料之多層板的立體示意圖;以及 [圖7]係繪示依照本發明之一實施方式的一種具複合材料之多層板之製造方法的流程圖。In order to make the above and other objects, features, advantages and embodiments of the present invention more clearly understood, the accompanying drawings are described as follows: [FIG. 1] is a three-dimensional schematic diagram showing a multilayer board with composite material according to the first embodiment of the present invention; [Fig. 2] is a partial enlarged cross-sectional schematic diagram showing the multilayer board of Fig. 1; [ Fig. 3 ] is a scanning electron microscope image of a multilayer board with composite material according to the first embodiment of the present invention; [ Fig. 4 ] is a perspective view showing a multi-layer board with a composite material according to a second embodiment of the present invention; [ Fig. 5 ] is a perspective view showing a multi-layer board with a composite material according to a third embodiment of the present invention; [ Fig. 6 ] is a perspective view showing a multi-layer board with a composite material according to a fourth embodiment of the present invention; and [ FIG. 7 ] is a flow chart illustrating a method for manufacturing a multi-layer board with a composite material according to an embodiment of the present invention.
國內寄存資訊(請依寄存機構、日期、號碼順序註記) 無 國外寄存資訊(請依寄存國家、機構、日期、號碼順序註記) 無Domestic storage information (please note in the order of storage institution, date and number) without Foreign deposit information (please note in the order of deposit country, institution, date and number) without
100a:具複合材料之多層板 100a: Multilayer boards with composite materials
110:鋁基薄片 110: Aluminum base sheet
110a:第一表面 110a: First surface
110b:第二表面 110b: Second surface
112:第一鈍化層 112: the first passivation layer
112a:第一微孔洞 112a: the first micro-hole
114:鋁基金屬層 114: Aluminum base metal layer
114a:第三表面 114a: Third surface
114b:第四表面 114b: Fourth surface
116:第二鈍化層 116: the second passivation layer
116a:第二微孔洞 116a: second micro-hole
120:複合材料層 120: Composite layer
120a:第一表面 120a: first surface
120b:第二表面 120b: Second surface
122:熱塑性高分子 122: Thermoplastic polymers
124:纖維材料 124: Fiber Material
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