CN115891355A - Fluorine-based composite film and reinforcing plate - Google Patents
Fluorine-based composite film and reinforcing plate Download PDFInfo
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- CN115891355A CN115891355A CN202211286382.XA CN202211286382A CN115891355A CN 115891355 A CN115891355 A CN 115891355A CN 202211286382 A CN202211286382 A CN 202211286382A CN 115891355 A CN115891355 A CN 115891355A
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Abstract
The invention discloses a fluorine-series composite film and a stiffening plate, wherein the fluorine-series composite film comprises a fluorine-series polymer layer, an epoxy glue layer and a polyimide layer; the thickness of the epoxy glue layer is 5-50 μm; the thickness of the fluorine-based polymer layer is 5 to 125 μm; the thickness of the polyimide layer is 5-75 μm. The composite structure is selected to manufacture the composite film and the reinforcing plate, and the composite material has the advantages of good dimensional stability, high wear resistance, ultralow water absorption, excellent mechanical property, high adhesion strength and the like.
Description
Technical Field
The invention belongs to the technical field of FPC (flexible printed circuit board), and particularly relates to a fluorine composite film and a reinforcing plate.
Background
With the rapid development of information technology, printed circuit boards are indispensable materials in electronic products, and with the increase in consumer electronic product demand, the demand for printed circuit boards is increasing. Since a Flexible Printed Circuit (FPC) has the characteristics of flexibility and three-dimensional wiring, the FPC is widely used in computers and peripheral devices thereof, communication products, consumer electronic products, and the like.
In the using process of products, the surface abrasion of the FPC is one of important factors influencing the service life of the FPC, and the water absorption rate of the material also influences the effective exertion of the product performance, so that the material with high abrasion resistance and low water absorption rate is sought to be used for the FPC to improve the service life and high efficiency of the products.
When the fluorine-based resin is arranged on the outermost layer, the fluorine-based resin has good abrasion resistance and can play a role in good protection, and the fluorine-based resin has the excellent property of low water absorption of about 0.03%, and can perfectly isolate water vapor in the air to protect the inner layer material and reduce the whole water absorption.
However, the fluorine-based resin has a high thermal expansion coefficient (about 200 ppm/DEG C) and is liable to cause poor dimensional stability. In addition, the fluorine-based resin is limited by the process technology, has high requirements on manufacturing equipment and can be operated only in a higher temperature environment (> 280 ℃), and the film thickness is uneven; in addition, faced PTFE again mostly the pressfitting technology that the volume to volume can not be used to the slice, leaded to processing difficulty, volume production nature is low, the consumptive material is more.
Disclosure of Invention
The present invention provides a fluorine composite film and a reinforcing plate, wherein an epoxy adhesive layer is used to bond a PI film multilayer structure and a fluorine polymer layer, and a PI film with a small thermal expansion coefficient is used as a support (if a PI film with a thermal expansion coefficient less than 10 ppm/DEG C is used, the thermal expansion coefficient of the integral composite PI is 5-25 ppm/c), so as to compensate the deficiency of the high thermal expansion coefficient of the fluorine resin, and the integral structure has good bonding strength, low thermal expansion coefficient and high dimensional stability. Because the high thermal expansion coefficient of the fluorine-based resin is not matched with PI to cause huge thermal stress, the ratio of the PI to the thickness of the fluorine-based resin is 1-10, the larger the thickness ratio is, the more the thermal stress influence can be reduced, and the better the flatness is.
In order to solve the technical problems, the invention adopts a technical scheme that: a fluorine-based composite film comprises a fluorine-based polymer layer, an epoxy glue layer and a polyimide layer;
the thickness of the epoxy glue layer is 5-50 μm;
the thickness of the fluorine-based polymer layer is 5 to 125 μm;
the thickness of the polyimide layer is 5-75 μm.
The fluorine-based composite film is a single-sided fluorine-based composite film, and the single-sided fluorine-based composite film sequentially comprises a fluorine-based polymer layer, a polyimide layer, at least one epoxy glue layer and at least one polyimide layer from top to bottom.
The fluorine-based composite film is a double-sided fluorine-based composite film, and the double-sided fluorine-based composite film sequentially comprises a fluorine-based polymer layer, at least one polyimide layer, at least one epoxy glue layer, a polyimide layer and a fluorine-based polymer layer from top to bottom.
The fluorine-based resin in the fluorine-based polymer layer is at least one selected from the group consisting of polytetrafluoroethylene, polyvinylidene fluoride, a copolymer of vinyl fluoride and vinyl ether, a copolymer of tetrafluoroethylene and ethylene, a copolymer of polychlorotrifluoroethylene and ethylene, tetrafluoroethylene, a copolymer of hexafluoropropylene and vinylidene fluoride, a copolymer of tetrafluoroethylene-perfluoroalkyl vinyl ether, polychlorotrifluoroethylene, polyvinyl chloride, a copolymer of tetrafluoroethylene-hexafluoropropylene, a copolymer of ethylene-vinyl fluoride and a copolymer of tetrafluoroethylene-hexafluoropropylene-trifluoroethylene.
More specifically, the preparation method of the single-sided fluorine-based composite film by a sintering method comprises the following steps:
step one, coating the fluorine polymer layer on the polyimide layer, and sintering at the temperature of more than 280 ℃ to obtain a semi-finished product A;
and step two, coating an epoxy adhesive layer on a polyimide layer, baking at 60-160 ℃ for 3-5 min to remove the solvent, then attaching the polyimide layer of the semi-finished product A, and drying and curing at 160 ℃ for 2h to obtain the finished product of the single-sided fluorine composite film.
More specifically, if the composite film has a 2n +4 (n is a positive integer) layer structure of not less than six layers, the preparation method of the single-sided fluorine-based composite film by the sintering method comprises the following steps:
step one, coating the fluorine polymer layer on the polyimide layer, and sintering at the temperature of more than 280 ℃ to obtain a semi-finished product A;
step two, coating an epoxy glue layer on a polyimide layer, baking at 60-160 ℃ for 3-5 min to remove the solvent, and attaching the polyimide layer to another polyimide layer, wherein the step is repeated n times (step two, step two-2, step two-3,. The.. The. Step two-n);
and step three, coating the material obtained in the step two with an epoxy glue layer, baking at 60-160 ℃ for 3-5 min to remove the solvent, then attaching the semi-finished product A polyimide layer, drying and curing at 160 ℃ for 2h to obtain the single-sided fluorine composite film.
More specifically, the preparation method of the single-sided fluorine-based composite film by the bonding method comprises the following steps:
step one, coating the polyimide adhesive layer on the fluorine polymer film, and baking at 60-160 ℃ for 3-5 min to remove a solvent to obtain a semi-finished product A;
step two, after coating an epoxy glue layer on one polyimide layer, baking the polyimide layer at the temperature of 60-160 ℃ for 3-5 min to remove the solvent, and attaching the polyimide layer to the other polyimide layer;
and step three, adhering the polyimide adhesive layer of the semi-finished product A to the material obtained in the step two, and drying and curing for 2 hours at 160 ℃ to obtain the single-sided fluorine composite film.
More specifically, if the composite film has a 2n +3 (n is a positive integer) layer structure with not less than five layers, the preparation method of the single-sided fluorine-based composite film by the bonding method comprises the following steps:
step one, coating the polyimide adhesive layer on the fluorine polymer film, and baking at 60-160 ℃ for 3-5 min to remove a solvent to obtain a semi-finished product A;
step two, coating an epoxy glue layer on a polyimide layer, baking at 60-160 ℃ for 3-5 min to remove a solvent, and attaching the polyimide layer to another polyimide layer, wherein the step is repeated for n times (step two, step two-2, step two-3,... An., step two-n);
and step three, attaching the polyimide adhesive layer of the semi-finished product A to the material obtained in the step two, and drying and curing at 160 ℃ for 2 hours to obtain the single-sided fluorine composite film.
More specifically, the preparation method of the double-sided fluorine-based composite film by a sintering method comprises the following steps:
step one, coating the fluorine polymer layer on the polyimide layer, and sintering at the temperature of more than 280 ℃ to obtain a semi-finished product A I and a semi-finished product A II;
step two, coating the polyimide layer of the semi-finished product A on an epoxy adhesive layer, baking at 60-160 ℃ for 3-5 min to remove the solvent, then attaching the polyimide layer of the semi-finished product A on the polyimide layer, drying and curing at 160 ℃ for 2h to obtain the double-sided fluorine composite film;
further, if the composite film is partially of a 2n +5 (n is a positive integer) layer structure of not less than seven layers, the preparation method of the double-sided fluorine-based composite film by the sintering method comprises the following steps:
step one, coating the fluorine polymer layer on the polyimide layer, and sintering at the temperature of more than 280 ℃ to obtain a semi-finished product A I and a semi-finished product A II;
step two, coating the semi-finished product A, namely a polyimide layer, with an epoxy glue layer, baking at 60-160 ℃ for 3-5 min to remove the solvent, and attaching the semi-finished product A to another polyimide layer, wherein the step is repeated for n times (step two, step two-2, step two-3, step two.
And step three, coating the non-fluorine polymer layer obtained in the step two with an epoxy glue layer, baking at 60-160 ℃ for 3-5 min to remove the solvent, then attaching the semi-finished product A of the dimeric imide layer, drying and curing at 160 ℃ for 2h to obtain the double-sided fluorine composite film.
More specifically, the preparation method of the double-sided fluorine-based composite film by the bonding method comprises the following steps:
step one, coating the polyimide adhesive layer on the fluorine polymer film, and baking at 60-160 ℃ for 3-5 min to remove a solvent to obtain a semi-finished product A I and a semi-finished product A II;
step two, after coating an epoxy glue layer on one polyimide layer, baking the polyimide layer at 60-160 ℃ for 3-5 min to remove the solvent, and attaching the polyimide layer to the other polyimide layer;
step three, respectively pasting polyimide glue layers of the semi-finished product A I and the semi-finished product A II on two sides of the material obtained in the step two, and drying and curing for 2 hours at 160 ℃ to obtain a double-sided fluorine composite film;
further, if the composite film is partially 2n +5 (n is a positive integer) layer structure of not less than seven layers, the preparation method of the double-sided fluorine-based composite film by the bonding method comprises the following steps:
step one, coating the polyimide adhesive layer on the fluorine polymer film, baking at 60-160 ℃ for 3-5 min to remove a solvent, and obtaining a semi-finished product A I and a semi-finished product A II;
step two, coating an epoxy glue layer on a polyimide layer, baking at 60-160 ℃ for 3-5 min to remove the solvent, and attaching the polyimide layer to another polyimide layer, wherein the step is repeated n times (step two, step two-2, step two-3,. The.. The. Step two-n);
and step three, respectively adhering polyimide adhesive layers of the semi-finished product A I and the semi-finished product A II to two sides of the material obtained in the step two, and drying and curing for 2 hours at 160 ℃ to obtain the double-sided fluorine composite film.
A fluorine system stiffening plate comprises a fluorine system polymer layer, a polyimide layer, at least one epoxy glue layer, at least one polyimide layer, an epoxy glue layer and a release layer from top to bottom in sequence.
The release layer can be a release film made of at least one of polypropylene, biaxially oriented polypropylene and polyethylene terephthalate, and can be a release film with double-sided release capability or release paper.
Further, the preparation method of the fluorine-based reinforcing plate by the sintering method comprises the following steps:
coating an epoxy glue layer on the non-fluorine polymer layer of the single-sided fluorine composite film prepared by the sintering method, baking at 60-160 ℃ for 3-5 min to remove the solvent, then attaching a release layer, drying and curing at 160 ℃ for 2h to obtain the finished fluorine reinforcing plate.
Further, the preparation method of the fluorine-based reinforcing plate by the bonding method comprises the following steps:
coating an epoxy glue layer on the non-fluorine polymer layer of the single-sided fluorine composite film prepared by the attaching method, baking at 60-160 ℃ for 3-5 min to remove the solvent, and then attaching a release layer, drying and curing at 160 ℃ for 2h to obtain the finished fluorine reinforcing plate.
The invention has the beneficial effects that: has the advantages of good dimensional stability, high wear resistance, ultralow water absorption, excellent mechanical property, high adhesion strength and the like.
Drawings
FIG. 1 is a schematic view showing the structures of a single-sided fluorine-based composite film, a double-sided fluorine-based composite film and a fluorine-based reinforcing plate according to the present invention (sintering method);
FIG. 2 is a schematic structural view of a single-sided fluorine-based composite film, a double-sided fluorine-based composite film and a fluorine-based reinforcing plate according to the present invention (bonding method);
FIG. 3 is a flow chart of a single-sided fluorine-based composite film according to the present invention produced by a sintering method;
FIG. 4 is a flow chart of a double-sided fluorine-based composite film according to the present invention produced by a sintering method;
FIG. 5 is a flow chart of the fluorine-based reinforcing plate of the present invention produced by a sintering method;
FIG. 6 is a flow chart of the single-sided fluorine-based composite film of the present invention formed by a bonding method;
FIG. 7 is a flow chart of a double-sided fluorine-based composite film according to the present invention formed by a bonding method;
FIG. 8 is a flow chart of the fluorine-based reinforcing plate of the present invention produced by a bonding method;
the reference numbers are as follows:
fluorine-based composite film 100
Fluorine-based reinforcing plate 200
Fluorine-based polymer layer 101, polyimide layer 102, epoxy glue layer 103, polyimide glue layer 104, and release layer 201
Detailed Description
The following detailed description of the preferred embodiments of the present invention, taken in conjunction with the accompanying drawings, will make the advantages and features of the invention easier to understand by those skilled in the art, and thus will clearly and clearly define the scope of the invention.
Example (b): a fluorine-based composite film 100 includes a fluorine-based polymer layer 101, an epoxy glue layer 103, and a polyimide layer 102;
the thickness of the epoxy glue layer is 5-50 μm; preferably 15-30 μm;
the thickness of the fluorine-based polymer layer is 5 to 125 μm; preferably 5 to 50 μm;
the thickness of the polyimide layer is 5-75 μm; preferably 12.5-50 μm.
As shown in fig. 1-a and fig. 2-a, the fluorine-based composite film is a single-sided fluorine-based composite film, and the single-sided fluorine-based composite film sequentially includes a fluorine-based polymer layer, a polyimide layer, at least one epoxy glue layer, and at least one polyimide layer from top to bottom.
As shown in fig. 1-B and fig. 2-B, the fluorine-based composite film is a double-sided fluorine-based composite film, and the double-sided fluorine-based composite film sequentially includes a fluorine-based polymer layer, at least one polyimide layer, at least one epoxy glue layer, a polyimide layer, and a fluorine-based polymer layer from top to bottom.
The fluorine-containing resin in the fluorine-containing polymer layer is at least one selected from polytetrafluoroethylene, polyvinylidene fluoride, a copolymer of vinyl fluoride and vinyl ether, a copolymer of tetrafluoroethylene and ethylene, a copolymer of polychlorotrifluoroethylene and ethylene, tetrafluoroethylene, a copolymer of hexafluoropropylene and vinylidene fluoride, a copolymer of tetrafluoroethylene-perfluoroalkyl vinyl ether, polychlorotrifluoroethylene, polyvinyl chloride, a copolymer of tetrafluoroethylene-hexafluoropropylene, a copolymer of ethylene-vinyl fluoride and a copolymer of tetrafluoroethylene-hexafluoropropylene-trifluoroethylene. The fluorine-based resin in the fluorine-based polymer layer is not limited to the prior art commercially available or sintered using the self-owned technique.
The fluorine polymer layer can be generated by a sintering method and a bonding method, wherein the sintering method is to coat the fluorine polymer on the surface of the polyimide layer and sinter the polyimide layer at the temperature of more than 280 ℃, and the thickness of the fluorine polymer layer is 5-50 mu m; the pasting method is obtained by coating a polyimide glue layer on a PTFE film and pasting the PTFE film and the polyimide layer, and the thickness is 25-125 μm.
The preparation method of the single-sided fluorine composite film generated by the sintering method comprises the following steps:
step one, coating the fluorine polymer layer on the polyimide layer, and sintering at the temperature of more than 280 ℃ to obtain a semi-finished product A;
and step two, coating an epoxy adhesive layer on a polyimide layer, baking at 60-160 ℃ for 3-5 min to remove the solvent, then attaching the semi-finished product A polyimide layer, and drying and curing at 160 ℃ for 2h to obtain the finished product single-sided fluorine composite film.
As shown in fig. 3, if the composite film has a 2n +4 (n is a positive integer) layer structure of not less than six layers, the preparation method of the single-sided fluorine-based composite film by the sintering method includes the following steps:
step one, coating the fluorine polymer layer on the polyimide layer, and sintering at the temperature of more than 280 ℃ to obtain a semi-finished product A;
step two, coating an epoxy glue layer on a polyimide layer, baking at 60-160 ℃ for 3-5 min to remove the solvent, and attaching the polyimide layer to another polyimide layer, wherein the step is repeated n times (step two, step two-2, step two-3,. The.. The. Step two-n);
and step three, coating the material obtained in the step two with an epoxy glue layer, baking at 60-160 ℃ for 3-5 min to remove the solvent, then attaching the semi-finished product A polyimide layer, drying and curing at 160 ℃ for 2h to obtain the single-sided fluorine composite film.
The preparation method of the single-sided fluorine composite film by a bonding method comprises the following steps:
step one, coating the polyimide adhesive layer 104 on the fluorine polymer film, baking at 60-160 ℃ for 3-5 min to remove a solvent, and obtaining a semi-finished product A;
step two, after coating an epoxy glue layer on one polyimide layer, baking the polyimide layer at the temperature of 60-160 ℃ for 3-5 min to remove the solvent, and attaching the polyimide layer to the other polyimide layer;
and step three, adhering the polyimide adhesive layer of the semi-finished product A to the material obtained in the step two, and drying and curing for 2 hours at 160 ℃ to obtain the single-sided fluorine composite film.
As shown in fig. 6, if the composite film has a 2n +3 (n is a positive integer) layer structure of not less than five layers, the preparation method of the single-sided fluorine-based composite film by the bonding method includes the following steps:
step one, coating the polyimide adhesive layer on the fluorine polymer film, and baking at 60-160 ℃ for 3-5 min to remove a solvent to obtain a semi-finished product A;
step two, coating an epoxy glue layer on a polyimide layer, baking at 60-160 ℃ for 3-5 min to remove a solvent, and attaching the polyimide layer to another polyimide layer, wherein the step is repeated for n times (step two, step two-2, step two-3,... An., step two-n);
and step three, adhering the polyimide adhesive layer of the semi-finished product A to the material obtained in the step two, and drying and curing for 2 hours at 160 ℃ to obtain the single-sided fluorine composite film.
The preparation method of the double-sided fluorine composite film generated by a sintering method comprises the following steps:
step one, coating the fluorine polymer layer on the polyimide layer, and sintering at the temperature of more than 280 ℃ to obtain a semi-finished product A I and a semi-finished product A II;
step two, coating the polyimide layer of the semi-finished product A on an epoxy adhesive layer, baking at 60-160 ℃ for 3-5 min to remove the solvent, then attaching the polyimide layer of the semi-finished product A on the polyimide layer, drying and curing at 160 ℃ for 2h to obtain the double-sided fluorine composite film;
as shown in fig. 4, if the composite film is partially 2n +5 (n is a positive integer) layer structure of not less than seven layers, the preparation method of the double-sided fluorine-based composite film by the sintering method includes the following steps:
step one, coating the fluorine polymer layer on the polyimide layer, and sintering at the temperature of more than 280 ℃ to obtain a semi-finished product A I and a semi-finished product A II;
step two, coating an epoxy adhesive layer on a polyimide layer of the semi-finished product A, baking at 60-160 ℃ for 3-5 min to remove a solvent, and attaching the polyimide layer to another polyimide layer, wherein the step is repeated for n times (step two, step two-2, step two-3,... An., step two-n);
and step three, coating the non-fluorine polymer layer obtained in the step two with an epoxy glue layer, baking at 60-160 ℃ for 3-5 min to remove the solvent, then attaching the semi-finished product A of the dimeric imide layer, drying and curing at 160 ℃ for 2h to obtain the double-sided fluorine composite film.
The preparation method of the double-sided fluorine composite film by a bonding method comprises the following steps:
step one, coating the polyimide adhesive layer on the fluorine polymer film, baking at 60-160 ℃ for 3-5 min to remove a solvent, and obtaining a semi-finished product A I and a semi-finished product A II;
step two, after coating an epoxy glue layer on one polyimide layer, baking the polyimide layer at the temperature of 60-160 ℃ for 3-5 min to remove the solvent, and attaching the polyimide layer to the other polyimide layer;
step three, respectively pasting polyimide glue layers of the semi-finished product A I and the semi-finished product A II on two sides of the material obtained in the step two, and drying and curing for 2 hours at 160 ℃ to obtain a double-sided fluorine composite film;
as shown in fig. 7, if the composite film is partially 2n +5 (n is a positive integer) layer structure of not less than seven layers, the preparation method of the double-sided fluorine-based composite film by the bonding method includes the following steps:
step one, coating the polyimide adhesive layer on the fluorine polymer film, and baking at 60-160 ℃ for 3-5 min to remove a solvent to obtain a semi-finished product A I and a semi-finished product A II;
step two, coating an epoxy glue layer on a polyimide layer, baking at 60-160 ℃ for 3-5 min to remove the solvent, and attaching the polyimide layer to another polyimide layer, wherein the step is repeated n times (step two, step two-2, step two-3,. The.. The. Step two-n);
and step three, respectively pasting polyimide glue layers of the semi-finished product A I and the semi-finished product A II on two sides of the material obtained in the step two, and drying and curing for 2 hours at 160 ℃ to obtain the double-sided fluorine composite film.
A fluorine system stiffening plate (as shown in figure 1-C and figure 2-C) comprises a fluorine system polymer layer, a polyimide layer, at least one epoxy glue layer, at least one polyimide layer, an epoxy glue layer and a release layer 201 from top to bottom in sequence.
The release layer can be a release film made of at least one of polypropylene, biaxially oriented polypropylene and polyethylene terephthalate, and can be a release film with double-sided release capability or release paper.
As shown in fig. 5, the manufacturing method of the fluorine-based reinforcing plate by the sintering method includes the following steps:
coating an epoxy glue layer on the non-fluorine polymer layer of the single-sided fluorine composite film prepared by the sintering method, baking at 60-160 ℃ for 3-5 min to remove the solvent, then attaching a release layer, drying and curing at 160 ℃ for 2h to obtain the finished fluorine reinforcing plate.
As shown in fig. 8, the method for manufacturing the fluorine-based reinforcing plate by the bonding method includes the steps of:
coating an epoxy glue layer on the non-fluorine polymer layer of the single-sided fluorine composite film prepared by the bonding method, baking at 60-160 ℃ for 3-5 min to remove the solvent, then bonding the release layer, drying and curing at 160 ℃ for 2h to obtain the finished fluorine reinforcing plate.
Table 1 shows the stacking structure of the fluorine-based composite film, the reinforcing plate and the comparative example
Comparative examples 1 and 2 are general commercial composite film products
Comparative example 3 is a general market reinforcing plate product
TABLE 1
Table 2 shows the results of the physical property tests of the fluorine-based composite film, the reinforcing plate and the comparative examples of the present invention
The flatness test method comprises the following steps: a reinforcing plate was prepared by laminating a pure rubber (trade name: D3450) produced by SONY on the surface of a fluorine-based composite film. Cutting the reinforcing plate into 25cm × 25cm, pressing the reinforcing plate onto a 74.5 + -1 μm 3-Layer double-sided flexible copper foil substrate at 180 ℃, curing the reinforcing plate at 160 ℃, placing the samples of each embodiment and the control sample on a smooth plane, standing the samples for 20 minutes, measuring the warping heights of four corners, and testing the flatness.
Abrasion resistance test method: firstly, cutting a test sample into a size of 15cm multiplied by 10cm, then fixing the test sample on a smooth platform of a wear-resistant tester, setting the No. 0000 steel wool to be a load of 1kg, enabling the steel wool to rub back and forth on the surface of the test sample until the surface of the test sample is scratched, and then stopping rubbing until the scratch is generated, wherein the number of times of rubbing before the scratch is generated is a test result (the steel wool rubs back and forth is one time).
TABLE 2
As shown in table 2, compared with the market specifications, the fluorine-based composite membrane/reinforcing plate of the present invention has lower water absorption rate, good flatness, dimensional stability and wear resistance, and the high hardness thereof can better prevent scratches and scratches. The fluorine-based composite film/reinforcing plate has a relatively small warp height and thus has a good flatness, and the flatness becomes more remarkable as the total thickness increases. The highest warping height of the fluorine-based composite membrane and the stiffening plate is less than or equal to 1cm, and the composite membrane is a super flat stiffening plate.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent structural changes made by using the contents of the present specification and the drawings, or applied directly or indirectly to other related technical fields, are included in the scope of the present invention.
Claims (15)
1. A fluorine-based composite film characterized by: comprises a fluorine polymer layer, an epoxy glue layer and a polyimide layer;
the thickness of the epoxy glue layer is 5-50 μm;
the thickness of the fluorine-based polymer layer is 5-125 μm;
the thickness of the polyimide layer is 5-75 μm.
2. The fluorine-based composite film according to claim 1, wherein: the fluorine-based composite film is a single-sided fluorine-based composite film, and the single-sided fluorine-based composite film sequentially comprises a fluorine-based polymer layer, a polyimide layer, at least one epoxy glue layer and at least one polyimide layer from top to bottom.
3. The fluorine-based composite film according to claim 1, wherein: the fluorine system composite film is a double-sided fluorine system composite film, and the double-sided fluorine system composite film sequentially comprises a fluorine system polymer layer, at least one polyimide layer, at least one epoxy glue layer, a polyimide layer and a fluorine system polymer layer from top to bottom.
4. The fluorine-based composite film according to claim 1, wherein: the fluorine-containing resin in the fluorine-containing polymer layer is at least one selected from polytetrafluoroethylene, polyvinylidene fluoride, a copolymer of vinyl fluoride and vinyl ether, a copolymer of tetrafluoroethylene and ethylene, a copolymer of polychlorotrifluoroethylene and ethylene, tetrafluoroethylene, a copolymer of hexafluoropropylene and vinylidene fluoride, a copolymer of tetrafluoroethylene-perfluoroalkyl vinyl ether, polychlorotrifluoroethylene, polyvinyl chloride, a copolymer of tetrafluoroethylene-hexafluoropropylene, a copolymer of ethylene-vinyl fluoride and a copolymer of tetrafluoroethylene-hexafluoropropylene-trifluoroethylene.
5. The fluorine-based composite film according to claim 2, wherein: the preparation method of the single-sided fluorine composite film generated by the sintering method comprises the following steps:
step one, coating the fluorine polymer layer on the polyimide layer, and sintering at the temperature of more than 280 ℃ to obtain a semi-finished product A;
and step two, coating an epoxy adhesive layer on a polyimide layer, baking at 60-160 ℃ for 3-5 min to remove the solvent, then attaching the polyimide layer of the semi-finished product A, and drying and curing at 160 ℃ for 2h to obtain the finished product of the single-sided fluorine composite film.
6. The fluorine-based composite film according to claim 2, wherein: if the composite film is 2n +4 (n is an integer more than or equal to 1) layer structure, the preparation method of the single-side fluorine-based composite film by a sintering method comprises the following steps:
step one, coating the fluorine polymer layer on the polyimide layer, and sintering at the temperature of more than 280 ℃ to obtain a semi-finished product A;
step two, after coating an epoxy glue layer on a polyimide layer, baking the polyimide layer at 60-160 ℃ for 3-5 min to remove the solvent, and attaching the polyimide layer to another polyimide layer, wherein the step is repeated for n times;
and step three, coating the material obtained in the step two with an epoxy glue layer, baking at 60-160 ℃ for 3-5 min to remove the solvent, then attaching the semi-finished polyimide layer A, drying and curing at 160 ℃ for 2h to obtain the single-sided fluorine composite film.
7. The fluorine-based composite film according to claim 2, wherein: the preparation method of the single-sided fluorine composite film by a bonding method comprises the following steps:
step one, coating the polyimide adhesive layer on the fluorine polymer film, and baking at 60-160 ℃ for 3-5 min to remove a solvent to obtain a semi-finished product A;
step two, after coating an epoxy glue layer on one polyimide layer, baking the polyimide layer at 60-160 ℃ for 3-5 min to remove the solvent, and attaching the polyimide layer to the other polyimide layer;
and step three, adhering the polyimide adhesive layer of the semi-finished product A to the material obtained in the step two, and drying and curing for 2 hours at 160 ℃ to obtain the single-sided fluorine composite film.
8. The fluorine-based composite film according to claim 2, wherein: if the composite film is 2n +3 (n is an integer more than or equal to 1) layer structure, the preparation method of the single-side fluorine-based composite film by the attaching method comprises the following steps:
step one, coating the polyimide adhesive layer on the fluorine polymer film, and baking at 60-160 ℃ for 3-5 min to remove a solvent to obtain a semi-finished product A;
step two, after coating an epoxy glue layer on a polyimide layer, baking the polyimide layer at 60-160 ℃ for 3-5 min to remove the solvent, and attaching the polyimide layer to another polyimide layer, wherein the step is repeated for n times;
and step three, attaching the polyimide adhesive layer of the semi-finished product A to the material obtained in the step two, and drying and curing at 160 ℃ for 2 hours to obtain the single-sided fluorine composite film.
9. The fluorine-based composite film according to claim 3, wherein: the preparation method of the double-sided fluorine composite film generated by a sintering method comprises the following steps:
step one, coating the fluorine polymer layer on the polyimide layer, and sintering at the temperature of more than 280 ℃ to obtain a semi-finished product A I and a semi-finished product A II;
and step two, coating an epoxy adhesive layer on the polyimide layer of the semi-finished product A, baking at 60-160 ℃ for 3-5 min to remove the solvent, and then adhering the polyimide layer of the semi-finished product A to the polyimide layer of the semi-finished product A, drying and curing at 160 ℃ for 2h to obtain the double-sided fluorine composite film.
10. The fluorine-based composite film according to claim 3, wherein: if the composite film is partially 2n +5 (n is an integer more than or equal to 1) layer structure, the preparation method of the double-sided fluorine composite film by a sintering method comprises the following steps:
step one, coating the fluorine polymer layer on the polyimide layer, and sintering at the temperature of more than 280 ℃ to obtain a semi-finished product A I and a semi-finished product A II;
step two, after coating an epoxy glue layer on the polyimide layer of the semi-finished product A, baking the semi-finished product A at the temperature of 60-160 ℃ for 3-5 min to remove the solvent, and attaching the semi-finished product A to another polyimide layer, wherein the step is repeated for n times;
and step three, coating an epoxy adhesive layer on the non-fluorine polymer layer obtained in the step two, baking at 60-160 ℃ for 3-5 min to remove the solvent, then attaching a semi-finished product A of a polyimide layer, and drying and curing at 160 ℃ for 2h to obtain the double-sided fluorine composite film.
11. The fluorine-based composite film according to claim 3, wherein: the preparation method of the double-sided fluorine composite film by a bonding method comprises the following steps:
step one, coating the polyimide adhesive layer on the fluorine polymer film, baking at 60-160 ℃ for 3-5 min to remove a solvent, and obtaining a semi-finished product A I and a semi-finished product A II;
step two, after coating an epoxy glue layer on one polyimide layer, baking the polyimide layer at the temperature of 60-160 ℃ for 3-5 min to remove the solvent, and attaching the polyimide layer to the other polyimide layer;
and step three, respectively pasting polyimide glue layers of the semi-finished product A I and the semi-finished product A II on two sides of the material obtained in the step two, and drying and curing for 2 hours at 160 ℃ to obtain the double-sided fluorine composite film.
12. The fluorine-based composite film according to claim 3, wherein: if the composite film part is 2n +5 (n is an integer more than or equal to 1) layer structure, the preparation method of the double-sided fluorine composite film by the attaching method comprises the following steps:
step one, coating the polyimide adhesive layer on the fluorine polymer film, baking at 60-160 ℃ for 3-5 min to remove a solvent, and obtaining a semi-finished product A I and a semi-finished product A II;
step two, after coating an epoxy glue layer on a polyimide layer, baking the polyimide layer at 60-160 ℃ for 3-5 min to remove the solvent, and attaching the polyimide layer to another polyimide layer, wherein the step is repeated for n times;
and step three, respectively pasting polyimide glue layers of the semi-finished product A I and the semi-finished product A II on two sides of the material obtained in the step two, and drying and curing for 2 hours at 160 ℃ to obtain the double-sided fluorine composite film.
13. A fluorine system stiffening plate is characterized in that: the fluorine system stiffening plate is fluorine system polymer layer, polyimide layer, at least one deck epoxy glue film, at least one deck polyimide layer, epoxy glue film and release layer from top to bottom in proper order.
14. The fluorine-based reinforcing plate according to claim 13, wherein: the preparation method of the fluorine system reinforcing plate generated by the sintering method comprises the following steps:
coating an epoxy glue layer on the non-fluorine polymer layer of the single-sided fluorine composite film prepared by the sintering method, baking at 60-160 ℃ for 3-5 min to remove the solvent, then attaching a release layer, drying and curing at 160 ℃ for 2h to obtain the finished fluorine reinforcing plate.
15. The fluorine-based reinforcing plate according to claim 13, wherein: the preparation method of the fluorine-based reinforcing plate generated by the laminating method comprises the following steps:
coating an epoxy glue layer on the non-fluorine polymer layer of the single-sided fluorine composite film prepared by the bonding method, baking at 60-160 ℃ for 3-5 min to remove the solvent, then bonding the release layer, drying and curing at 160 ℃ for 2h to obtain the finished fluorine reinforcing plate.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211286382.XA CN115891355A (en) | 2022-10-20 | 2022-10-20 | Fluorine-based composite film and reinforcing plate |
| TW112140029A TW202417250A (en) | 2022-10-20 | 2023-10-19 | Fluorine-based composite film, stiffener comprising same, and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211286382.XA CN115891355A (en) | 2022-10-20 | 2022-10-20 | Fluorine-based composite film and reinforcing plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115891355A true CN115891355A (en) | 2023-04-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211286382.XA Pending CN115891355A (en) | 2022-10-20 | 2022-10-20 | Fluorine-based composite film and reinforcing plate |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN115891355A (en) |
| TW (1) | TW202417250A (en) |
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2022
- 2022-10-20 CN CN202211286382.XA patent/CN115891355A/en active Pending
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2023
- 2023-10-19 TW TW112140029A patent/TW202417250A/en unknown
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| TW202417250A (en) | 2024-05-01 |
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