TW202205547A - 蓋構件、蓋構件的製造方法、包裝盒及包裝盒的製造方法 - Google Patents
蓋構件、蓋構件的製造方法、包裝盒及包裝盒的製造方法 Download PDFInfo
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- TW202205547A TW202205547A TW110123079A TW110123079A TW202205547A TW 202205547 A TW202205547 A TW 202205547A TW 110123079 A TW110123079 A TW 110123079A TW 110123079 A TW110123079 A TW 110123079A TW 202205547 A TW202205547 A TW 202205547A
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- 238000000034 method Methods 0.000 title claims description 55
- 238000004519 manufacturing process Methods 0.000 title claims description 31
- 229910052751 metal Inorganic materials 0.000 claims abstract description 82
- 239000002184 metal Substances 0.000 claims abstract description 82
- 239000000463 material Substances 0.000 claims abstract description 37
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 25
- 238000004806 packaging method and process Methods 0.000 claims description 21
- 229910000449 hafnium oxide Inorganic materials 0.000 claims description 16
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 claims description 16
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 15
- 238000005304 joining Methods 0.000 claims description 11
- 230000015572 biosynthetic process Effects 0.000 claims description 8
- 239000010453 quartz Substances 0.000 claims description 5
- 238000004544 sputter deposition Methods 0.000 claims description 5
- 238000002834 transmittance Methods 0.000 claims description 4
- 238000007740 vapor deposition Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 66
- 239000000758 substrate Substances 0.000 description 27
- 238000001816 cooling Methods 0.000 description 12
- 238000010438 heat treatment Methods 0.000 description 10
- 229910045601 alloy Inorganic materials 0.000 description 8
- 239000000956 alloy Substances 0.000 description 8
- 238000005520 cutting process Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 6
- 229910052697 platinum Inorganic materials 0.000 description 6
- 238000007789 sealing Methods 0.000 description 6
- 238000001771 vacuum deposition Methods 0.000 description 6
- 238000000576 coating method Methods 0.000 description 5
- 239000002344 surface layer Substances 0.000 description 5
- 238000011109 contamination Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 238000007733 ion plating Methods 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 229910052715 tantalum Inorganic materials 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910015363 Au—Sn Inorganic materials 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 229910017401 Au—Ge Inorganic materials 0.000 description 1
- 229910017709 Ni Co Inorganic materials 0.000 description 1
- 229910003267 Ni-Co Inorganic materials 0.000 description 1
- 229910003262 Ni‐Co Inorganic materials 0.000 description 1
- 229910020220 Pb—Sn Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910001080 W alloy Inorganic materials 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000005354 aluminosilicate glass Substances 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
- Packaging Frangible Articles (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020111510A JP2022010778A (ja) | 2020-06-29 | 2020-06-29 | 蓋部材、蓋部材の製造方法、パッケージ、及びパッケージの製造方法 |
| JP2020-111510 | 2020-06-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW202205547A true TW202205547A (zh) | 2022-02-01 |
Family
ID=79316118
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW110123079A TW202205547A (zh) | 2020-06-29 | 2021-06-24 | 蓋構件、蓋構件的製造方法、包裝盒及包裝盒的製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2022010778A (ja) |
| TW (1) | TW202205547A (ja) |
| WO (1) | WO2022004390A1 (ja) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002334943A (ja) * | 2001-05-09 | 2002-11-22 | Murata Mfg Co Ltd | 電子部品 |
| JP2004207539A (ja) * | 2002-12-26 | 2004-07-22 | Kyocera Corp | 電子部品収納用容器および電子装置 |
| JP2008118585A (ja) * | 2006-11-08 | 2008-05-22 | Nippon Dempa Kogyo Co Ltd | 表面実装用の電子部品 |
| JP2009200093A (ja) * | 2008-02-19 | 2009-09-03 | Murata Mfg Co Ltd | 中空型の電子部品 |
| JP6294417B2 (ja) * | 2016-09-01 | 2018-03-14 | 日機装株式会社 | 光半導体装置および光半導体装置の製造方法 |
| WO2020071452A1 (ja) * | 2018-10-05 | 2020-04-09 | Ａｇｃ株式会社 | 窓材、光学パッケージ |
-
2020
- 2020-06-29 JP JP2020111510A patent/JP2022010778A/ja active Pending
-
2021
- 2021-06-16 WO PCT/JP2021/022889 patent/WO2022004390A1/ja active Application Filing
- 2021-06-24 TW TW110123079A patent/TW202205547A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP2022010778A (ja) | 2022-01-17 |
| WO2022004390A1 (ja) | 2022-01-06 |
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