TW202202341A - Release film roll, production method therefor, ceramic component sheet, production method therefor, ceramic component, and production method therefor - Google Patents
Release film roll, production method therefor, ceramic component sheet, production method therefor, ceramic component, and production method therefor Download PDFInfo
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H18/00—Winding webs
- B65H18/08—Web-winding mechanisms
- B65H18/26—Mechanisms for controlling contact pressure on winding-web package, e.g. for regulating the quantity of air between web layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/32—Wound capacitors
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Ceramic Capacitors (AREA)
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Abstract
Description
本揭示係關於一種剝離膜卷及其製造方法、陶瓷零件片材及其製造方法、以及陶瓷零件及其製造方法。The present disclosure relates to a release film roll and its manufacturing method, a ceramic part sheet and its manufacturing method, and a ceramic part and its manufacturing method.
近年來,隨著電子機器小型化之要求,電子零件亦逐漸小型化。電子零件之一種即陶瓷零件亦逐年小型化。例如,陶瓷零件之一種即積層陶瓷電容器將介電層及內部電極之厚度薄化,而謀求大電容化。一般之積層陶瓷電容器藉由將剝離膜作為載體膜,將介電層及內部電極形成於載體膜上作為生坯片,剝離生坯片並積層而製造。In recent years, with the requirement of miniaturization of electronic machines, electronic components are also gradually miniaturized. One of the electronic parts, namely ceramic parts, has been miniaturized year by year. For example, a multilayer ceramic capacitor, which is one of the ceramic parts, has reduced the thickness of the dielectric layer and the internal electrodes, and has sought to increase the capacitance. A general multilayer ceramic capacitor is manufactured by using a release film as a carrier film, forming a dielectric layer and an internal electrode on the carrier film as a green sheet, peeling off the green sheet, and laminating.
若積層陶瓷電容器之介電層之厚度變薄,則有表示會產生短路等問題之耐電壓強度之耐壓性能降低之傾向。尤其,介電層之厚度不均一之情形時,較薄部分會成為耐壓性能降低之要因。具備具有此種較薄部分之介電層之積層陶瓷電容器耐壓不良,積層陶瓷電容器之良率降低。另一方面,若介電層之厚度均一,則耐壓性能良好,積層陶瓷電容器之良率提高。When the thickness of the dielectric layer of the multilayer ceramic capacitor becomes thinner, the withstand voltage performance, which is a problem such as short circuit, tends to decrease. In particular, when the thickness of the dielectric layer is non-uniform, the thinner portion may be a cause of lowering the withstand voltage performance. The multilayer ceramic capacitor having the dielectric layer having such a thin portion has poor withstand voltage, and the yield of the multilayer ceramic capacitor decreases. On the other hand, if the thickness of the dielectric layer is uniform, the withstand voltage performance is good, and the yield of the multilayer ceramic capacitor is improved.
作為介電層之載體膜使用之剝離膜中存在之損傷等成為介電層之厚度變動之要因。又,剝離膜表面之平滑性會對介電層之厚度均一性造成影響。鑑於此種狀況,例如專利文獻1中,研討有可使剝離膜平滑化而減少介電層之厚度不均之剝離膜卷。
[先前技術文獻]
[專利文獻]Damage or the like in the release film used as the carrier film for the dielectric layer is a factor for the thickness variation of the dielectric layer. In addition, the smoothness of the surface of the release film affects the thickness uniformity of the dielectric layer. In view of such a situation, for example, in
專利文獻1:日本專利特開2011-206995號公報Patent Document 1: Japanese Patent Laid-Open No. 2011-206995
[發明所欲解決之問題][Problems to be Solved by Invention]
陶瓷零件之製造步驟中,於自剝離膜卷拉出之剝離膜之剝離層之表面,形成陶瓷生坯片。此處,作為用以提高陶瓷零件之生產性之對策,認為加長捲繞於剝離膜卷之剝離膜之捲繞長度,減少剝離膜卷之更換頻率較為有效。In the manufacturing step of the ceramic part, a ceramic green sheet is formed on the surface of the release layer of the release film drawn from the release film roll. Here, as a measure for improving the productivity of ceramic parts, it is considered to be effective to lengthen the winding length of the release film wound around the release film roll and reduce the frequency of replacement of the release film roll.
另一方面,將平滑化之剝離膜捲繞於捲芯之情形時,有相鄰之剝離膜間之空氣不易逸散之傾向。若空氣逸散存在不均,則會產生偏芯,剝離膜之捲繞狀態之品質降低。為了提高捲繞狀態之品質需抑制捲繞偏移等之產生,故需要增大捲繞時之剝離膜之張力。為了較大地維持捲繞時之剝離膜之張力,隨著捲繞進展捲繞卷之徑變大,需要提高捲軸之轉矩。然而,若使捲軸之轉矩提高,過度增大捲繞時之張力,則有將捲芯表面之突起及剝離膜所含之填充料等之形狀轉印於剝離膜,於剝離膜之剝離層之表面(剝離面)產生凹凸及變形之虞。為抑制此種形狀轉印,需要以較低之張力捲繞剝離膜。鑑於此種事項,若剝離膜之捲繞長度變長,則難以僅憑捲軸之轉矩控制而兼顧捲繞狀態之品質與減少剝離膜之凹凸及變形。On the other hand, when the smoothed release film is wound around the core, there is a tendency that the air between the adjacent release films does not easily escape. If there is unevenness in air escape, eccentricity will occur, and the quality of the wound state of the release film will decrease. In order to improve the quality of the winding state, it is necessary to suppress the occurrence of winding deviation and the like, so it is necessary to increase the tension of the release film during winding. In order to maintain a large tension of the release film during winding, the diameter of the winding roll becomes larger as the winding progresses, and it is necessary to increase the torque of the winding shaft. However, if the torque of the reel is increased and the tension during winding is excessively increased, the protrusions on the surface of the core and the shape of the filler contained in the release film may be transferred to the release film, and the release layer of the release film may be transferred to the release film. The surface (peeling surface) may be uneven and deformed. In order to suppress such shape transfer, the release film needs to be wound with a relatively low tension. In view of such a matter, if the winding length of the release film becomes longer, it becomes difficult to achieve both the quality of the winding state and the reduction of unevenness and deformation of the release film only by the torque control of the reel.
因此,本揭示提供一種捲繞狀態之品質較高,且可充分減少剝離膜表面之凹凸及變形的剝離膜卷及其製造方法。又,本揭示提供一種藉由使用此種剝離膜卷而具有優異之可靠性之陶瓷零件片材及其製造方法。又,本揭示提供一種藉由使用此種陶瓷零件片材而具有優異之可靠性之陶瓷零件及其製造方法。 [解決問題之技術手段]Therefore, the present disclosure provides a release film roll with high quality in a wound state and capable of sufficiently reducing unevenness and deformation on the surface of the release film, and a manufacturing method thereof. Furthermore, the present disclosure provides a ceramic component sheet having excellent reliability by using such a release film roll, and a method for producing the same. Furthermore, the present disclosure provides a ceramic component having excellent reliability by using such a ceramic component sheet, and a manufacturing method thereof. [Technical means to solve problems]
本揭示之剝離膜卷之製造方法具有捲繞步驟,其一面將接觸輥按壓於捲繞卷一面將剝離膜捲繞於捲繞卷,捲繞步驟中,一面使接觸輥旋轉驅動一面捲繞剝離膜。剝離膜之搬送可使用搬送輥。另,捲繞卷是指已於捲芯進行包含剝離膜之膜之捲繞之狀態之膜卷。The manufacturing method of the release film roll of the present disclosure includes a winding step in which the release film is wound on the winding roll while pressing the touch roll against the winding roll, and in the winding step, the touch roll is rotated and driven while the roll is wound and peeled off. membrane. A conveyance roller can be used for conveyance of the release film. In addition, the winding roll refers to the film roll in the state in which the film including the release film was wound on the core.
上述製造方法中,捲繞步驟中,將接觸輥按壓於捲繞卷,且一面使該接觸輥旋轉驅動一面將剝離膜捲繞於捲繞卷。藉由該接觸輥之按壓與旋轉驅動,可促進捲繞之剝離膜間之空氣逸散。藉此,可縮小捲繞卷之轉矩,抑制剝離膜中之凹凸形狀之轉印,且抑制捲繞偏移之產生。因此,可製造捲繞狀態之品質較高,且充分減少剝離膜表面之凹凸及變形之剝離膜卷。In the above-mentioned production method, in the winding step, the release film is wound around the winding roll while the touch roll is pressed against the winding roll, and the touch roll is rotationally driven. By the pressing and rotational driving of the contact roller, the air escape between the wound release films can be promoted. Thereby, the torque of the winding roll can be reduced, the transfer of the uneven shape in the release film can be suppressed, and the occurrence of winding offset can be suppressed. Therefore, it is possible to manufacture a release film roll with high quality in a wound state and sufficiently reduced unevenness and deformation on the surface of the release film.
上述製造方法中,於捲繞步驟,將剝離膜之厚度設為F[m],將剝離膜之寬度設為W[m],將旋轉驅動捲繞卷之捲軸之轉矩設為T[N·m]時,可將T/(F·W)之值維持在70,000~420,000 N/m之範圍內。In the above-mentioned manufacturing method, in the winding step, the thickness of the release film is F[m], the width of the release film is W[m], and the torque of the reel that rotates and drives the winding roll is T[N] ·m], the value of T/(F·W) can be maintained within the range of 70,000 to 420,000 N/m.
如先前般不使用接觸輥捲繞之情形時,若將T/(F·W)之值設為上述範圍,則雖可充分減少因轉印所致之凹凸,但產生捲繞剝離膜時之力作用於捲繞至其內側之剝離膜,而於與捲繞方向正交之方向偏移之所謂捲繞偏移。上述捲繞步驟中,由於接觸輥按壓剝離膜且旋轉驅動,故即使將T/(F·W)之值設為上述範圍亦可抑制捲繞偏移之產生。其結果,可進而抑制剝離膜中之凹凸形狀之轉印與捲繞偏移之產生。因此,可製造捲繞狀態之品質充分高,且進而減少剝離膜表面之凹凸及變形之剝離膜卷。If the value of T/(F·W) is set to the above range, the unevenness due to transfer can be reduced sufficiently, but when the release film is wound, there is a A force acts on the release film wound to the inner side, and the so-called winding offset is shifted in a direction orthogonal to the winding direction. In the said winding process, since a touch roll presses a peeling film and drives it to rotate, even if the value of T/(F·W) is set to the said range, generation|occurrence|production of a winding misalignment can be suppressed. As a result, the transfer of the uneven shape in the release film and the occurrence of winding offset can be further suppressed. Therefore, it is possible to manufacture a roll of the release film which has a sufficiently high quality in the wound state, and further reduces the unevenness and deformation of the surface of the release film.
上述製造方法中,於捲繞步驟,將旋轉驅動捲繞卷之捲軸之轉矩T[N·m]之最大值設為Tmax [N·m],將最小值設為Tmin [N·m],及將上述最大值與上述最小值之和的1/2設為Tave [N·m]時,亦可滿足下述式(1)及(2)。 Tmax ≦1.2×Tave (1) Tmin ≧0.8×Tave (2)In the above-mentioned manufacturing method, in the winding step, the maximum value of the torque T[N·m] of the reel for rotationally driving the winding reel is set to T max [N·m], and the minimum value is set to T min [N·m] m], and the following formulae (1) and (2) may be satisfied when 1/2 of the sum of the above-mentioned maximum value and the above-mentioned minimum value is set to T ave [N·m]. T max ≦1.2×T ave (1) T min ≧0.8×T ave (2)
藉由滿足上述式(1)及式(2),可減少捲軸之轉矩變動。藉此,可充分抑制捲繞之剝離膜之張力劇烈變化,捲繞卷之捲繞位置偏移,或產生褶皺。By satisfying the above equations (1) and (2), the torque fluctuation of the reel can be reduced. Thereby, it can fully suppress that the tension|tensile_strength of the wound release film changes rapidly, the winding position of a winding roll is shifted, and wrinkles generate|occur|produce.
上述製造方法可包含使用搬送輥搬送剝離膜之搬送步驟、及沿長邊方向切斷剝離膜之切斷步驟。可於切斷剝離膜之前,由夾壓輥與搬送輥夾持剝離膜。藉由以夾壓輥與搬送輥夾持剝離膜,可對切斷之剝離膜賦予特定張力。藉此,可順利地進行切斷步驟,且高精度地調整剝離膜之切斷部分之形狀。The said manufacturing method may include the conveyance process of conveying a release film using a conveyance roll, and the cutting process of cutting|disconnecting a release film in a longitudinal direction. Before cutting the release film, the release film can be pinched by a nip roll and a conveyance roll. A specific tension can be given to the cut release film by pinching the release film between the nip roll and the conveyance roll. Thereby, the cutting step can be performed smoothly, and the shape of the cut portion of the release film can be adjusted with high precision.
本揭示之一態樣之剝離膜卷藉由上述任一製造方法獲得。由於該剝離膜卷係藉由上述任一製造方法獲得者,故捲繞狀態之品質較高,且充分減少剝離膜表面之凹凸及變形。The release film roll of one aspect of this disclosure is obtained by any of the above-mentioned manufacturing methods. Since the roll of the release film is obtained by any of the above-mentioned manufacturing methods, the quality of the rolled state is high, and the unevenness and deformation of the surface of the release film are sufficiently reduced.
本揭示之一態樣之陶瓷零件片材之製造方法具有以下步驟:於自上述任一剝離膜卷拉出之剝離膜之剝離層之表面,使用包含陶瓷粉末之糊膏形成陶瓷生坯片。A method of manufacturing a ceramic part sheet according to an aspect of the present disclosure includes the steps of forming a ceramic green sheet using a paste containing ceramic powder on the surface of the release layer of the release film drawn from any of the above-mentioned release film rolls.
上述製造方法使用自上述任一剝離膜卷拉出之剝離膜。上述剝離膜卷可充分抑制因捲繞偏移而於剝離膜之表面產生損傷、及因轉印而於剝離膜之表面產生凹凸。因此,可於遍及自捲繞於剝離膜卷之剝離膜之前端至後端間之廣闊區域,形成充分減少厚度變動及針孔之陶瓷生坯片。因此,可製造可靠性優異之陶瓷零件片材。本揭示中,剝離膜之「後端」是指與捲芯相接之側之一端,剝離膜之「前端」是指出現於剝離膜卷之外周面之側之一端。The above-mentioned production method uses the release film drawn from any of the above-mentioned release film rolls. The said release film roll can fully suppress the generation|occurence|production of damage to the surface of a release film by winding deviation, and generation of unevenness|corrugation to the surface of a release film by transcription|transfer. Therefore, a ceramic green sheet with sufficiently reduced thickness variation and pinholes can be formed over a wide area from the front end to the rear end of the release film wound on the release film roll. Therefore, a ceramic component sheet excellent in reliability can be produced. In the present disclosure, the "rear end" of the release film refers to an end on the side that is in contact with the roll core, and the "front end" of the release film refers to an end on the side that appears on the outer peripheral surface of the release film roll.
本揭示之一態樣之陶瓷零件之製造方法具有以下步驟:使用由上述製造方法獲得之陶瓷零件片材,獲得包含陶瓷生坯片之積層體;及燒成積層體,獲得燒結體。A method of manufacturing a ceramic part according to one aspect of the present disclosure includes the steps of: obtaining a laminate including a ceramic green sheet using the ceramic part sheet obtained by the above-described manufacturing method; and firing the laminate to obtain a sintered body.
上述製造方法中,使用充分抑制因捲繞偏移及轉印所致之表面凹凸及厚度變動之剝離膜,製造陶瓷零件。藉此,可形成充分減少厚度變動及針孔之陶瓷生坯片。因此,可製造可靠性優異之陶瓷零件。In the above-mentioned production method, a ceramic part is produced using a release film that sufficiently suppresses surface irregularities and thickness fluctuations due to winding offset and transfer. Thereby, a ceramic green sheet with sufficiently reduced thickness variation and pinholes can be formed. Therefore, a ceramic part excellent in reliability can be manufactured.
本揭示之一態樣之陶瓷零件片材係可於自上述任一剝離膜卷拉出之剝離膜之剝離層之表面,形成包含陶瓷生坯片之生坯片而獲得。The ceramic part sheet of one aspect of the present disclosure can be obtained by forming a green sheet including a ceramic green sheet on the surface of the release layer of the release film drawn from any of the above-mentioned release film rolls.
使用自上述任一剝離膜卷拉出之剝離膜,獲得上述陶瓷零件片材。上述剝離膜之剝離層已充分抑制因捲繞偏移及轉印所致之表面凹凸及變形。因此,可充分減少陶瓷生坯片之厚度變動及針孔。形成包含此種陶瓷生坯片之生坯片而獲得之陶瓷零件片材具有優異之可靠性。The above-mentioned ceramic component sheet was obtained using the release film drawn out from any of the above-mentioned release film rolls. The release layer of the above-mentioned release film has sufficiently suppressed surface unevenness and deformation due to winding offset and transfer. Therefore, thickness variation and pinholes of the ceramic green sheet can be sufficiently reduced. A ceramic part sheet obtained by forming a green sheet including such a ceramic green sheet has excellent reliability.
本揭示之一態樣之陶瓷零件具備燒結體,其係形成包含上述陶瓷零件片材之陶瓷生坯片之積層體,將該積層體燒成而獲得。上述陶瓷生坯片之厚度變動及針孔已充分減少。上述陶瓷零件因具備將包含此種陶瓷生坯片之積層體燒成而獲得之燒結體而可靠性優異。 [發明之效果]A ceramic component of one aspect of the present disclosure includes a sintered body obtained by forming a layered body of ceramic green sheets including the ceramic component sheet, and firing the layered body. The thickness variation and pinholes of the above-mentioned ceramic green sheets have been sufficiently reduced. The above-mentioned ceramic component is excellent in reliability because it includes a sintered body obtained by sintering a layered body including such a ceramic green sheet. [Effect of invention]
根據本揭示,可提供一種即使加長剝離膜之捲繞長度,捲繞狀態之品質亦較高,且可充分減少剝離膜表面之凹凸及變形的剝離膜卷及其製造方法。又,可提供一種藉由使用此種剝離膜卷,而具有優異之可靠性之陶瓷零件片材及其製造方法。又,可提供一種藉由使用此種陶瓷零件片材,而具有優異之可靠性之陶瓷零件片材及其製造方法。According to the present disclosure, even if the winding length of the release film is increased, the quality of the wound state is high, and the unevenness and deformation of the surface of the release film can be sufficiently reduced, and a release film roll and a manufacturing method thereof can be provided. Moreover, by using such a peeling film roll, the ceramic component sheet which has excellent reliability, and its manufacturing method can be provided. Furthermore, by using such a ceramic component sheet, a ceramic component sheet having excellent reliability and a method for producing the same can be provided.
以下,根據情形,參照圖式說明本揭示之實施形態。各圖式中,對同一或同等要件標註同一符號,根據情形省略重複之說明。但,以下之實施形態係用以說明本揭示之例示,並非旨在將本揭示限定於以下內容。Hereinafter, embodiments of the present disclosure will be described with reference to the drawings depending on the circumstances. In each drawing, the same or equivalent elements are marked with the same symbols, and repeated explanations are omitted depending on the situation. However, the following embodiments are examples for explaining the present disclosure, and are not intended to limit the present disclosure to the following contents.
圖1係一實施形態之剝離膜卷之立體圖。圖1之剝離膜卷100具備:剝離膜20,其具有基材膜及剝離層;及捲芯10,其捲繞有剝離膜20。剝離膜20例如於以積層陶瓷電容器為代表之陶瓷零件之製造步驟中,作為載體膜使用。該製造步驟中,例如於剝離膜之上藉由塗佈或印刷,而形成成為介電質生坯片之陶瓷生坯片,及成為內部電極之電極生坯片,其後,將該等剝離並積層,燒成積層體而製造陶瓷零件。剝離膜20係自剝離膜卷100拉出而使用。Fig. 1 is a perspective view of a release film roll according to an embodiment. The
作為捲芯10之材質,列舉紙、塑膠、金屬等。製造陶瓷零件時,由於顆粒會成為產生針孔之原因,故較佳為包含不產生紙粉之輕量之塑膠者。作為此種材料,列舉ABS樹脂、酚醛樹脂及纖維增強塑膠等。纖維增強塑膠因除了較高機械強度外還具有柔軟性,故可較佳使用。作為纖維增強塑膠,列舉以熱硬化性樹脂強化纖維者。作為樹脂,列舉環氧樹脂、不飽和聚酯樹脂等。作為纖維,列舉玻璃纖維、芳族聚醯胺纖維等。考慮成本方面等,樹脂可為不飽和聚酯樹脂。基於同樣觀點,纖維可為玻璃纖維。Examples of the material of the core 10 include paper, plastic, metal, and the like. In the manufacture of ceramic parts, since the particles may cause pinholes, it is preferable to include a lightweight plastic that does not generate paper dust. As such a material, ABS resin, phenol resin, fiber-reinforced plastic, etc. are mentioned. Fiber-reinforced plastics can be preferably used because they have flexibility in addition to higher mechanical strength. Examples of fiber-reinforced plastics include fibers reinforced with thermosetting resins. As resin, epoxy resin, unsaturated polyester resin, etc. are mentioned. As fiber, glass fiber, aramid fiber, etc. are mentioned. In consideration of cost and the like, the resin may be an unsaturated polyester resin. From the same viewpoint, the fibers may be glass fibers.
捲芯10之外徑可為150 mm以下,亦可為100 mm以下。藉此,可減小剝離膜卷100之尺寸,減少設置空間及輸送成本。The outer diameter of the core 10 may be 150 mm or less, or 100 mm or less. Thereby, the size of the peeling
捲繞於捲芯10之剝離膜20之捲繞長度可為4000 m以上,可為5000 m以上,亦可為6000 m以上。藉此,於陶瓷生坯片及陶瓷零件等之製造步驟中,可減少剝離膜卷100之更換頻率,進而提高各種製品之生產效率。剝離膜20之厚度可為10~110 μm,亦可為20~60 μm。剝離膜20之寬度可為例如0.1~2 m。另,本揭示中,將拉出及捲繞剝離膜時,搬送剝離膜之方向稱為長邊方向,將與剝離膜之長邊方向正交之方向稱為剝離膜之寬度方向。The winding length of the
圖2係顯示剝離膜之一例之剖視圖。剝離膜20具有基材膜22及其一面上之剝離層24。基材膜22可為合成樹脂膜。作為合成樹脂,列舉聚酯樹脂、聚丙烯樹脂及聚乙烯樹脂等聚烯烴樹脂、聚乳酸樹脂、聚碳酸酯樹脂、聚甲基丙烯酸甲酯樹脂等丙烯酸系樹脂、聚苯乙烯樹脂、尼龍等聚醯胺樹脂、聚氯乙烯樹脂、聚胺酯樹脂、氟系樹脂、以及聚苯硫醚樹脂等。其中,較佳為聚酯樹脂。聚酯樹脂中,基於力學性質、透明性、成本等觀點,更佳為聚對苯二甲酸乙二酯(PET,polyethylene terephthalate)。FIG. 2 is a cross-sectional view showing an example of a release film. The
基材膜22之厚度較佳為10~100 μm,更佳為20~50 μm。厚度未達10 μm之情形時,有剝離膜20之尺寸穩定性等物理特性受損之傾向。厚度超出100 μm之情形時,有導致剝離膜20之每單位面積之製造成本上升之傾向。The thickness of the
基於充分提高剝離膜20之機械強度之觀點,基材膜22可以無損透明性之程度含有填充料(填充劑)。本實施形態之剝離膜卷100係即使基材膜22含有填充料,亦可充分抑制將填充料之形狀轉印於在沿剝離膜卷100之徑向上相鄰之剝離膜20之剝離層24。填充料並非特別限定者,列舉例如碳酸鈣、磷酸鈣、二氧化矽、高嶺土、滑石粉、氧化鈦、燒製二氧化矽、氧化鋁、及有機粒子等。From the viewpoint of sufficiently improving the mechanical strength of the
剝離層24係於基材膜22之一面上塗佈包含剝離劑之溶液,使之乾燥及硬化而形成。塗佈方法未特別限定,只要使用反向塗佈法、凹版塗佈法、桿式塗佈法、棒式塗佈法、邁耶棒式塗佈法、模塗法、噴塗法等即可。乾燥可使用熱風乾燥、紅外線乾燥、自然乾燥等。為抑制乾燥時之水分結露,較佳進行加熱,且可為60~120°C左右。The
作為用以形成剝離層24之剝離劑,列舉例如矽酮系剝離劑、長鏈烷基系剝離劑、氟系剝離劑及胺基醇酸樹脂系者。矽酮系剝離劑基於硬化反應之差異,有加成反應系矽酮剝離劑、縮合系矽酮剝離劑、紫外線硬化系剝離劑等。As a release agent for forming the
硬化條件只要根據剝離劑之硬化系統適當選擇即可。例如,若剝離劑為加成反應系之矽酮,則可藉由以80~130°C加熱處理數十秒而使之硬化。若為紫外線硬化系,則可將水銀燈、金屬鹵素燈等作為光源,照射紫外線使之硬化。照射紫外線使自由基聚合之情形時,為防止氧抑制,較佳於氮氣氛圍下進行硬化。剝離層24之厚度變動幅度宜小為佳。The curing conditions may be appropriately selected according to the curing system of the release agent. For example, if the release agent is an addition reaction type silicone, it can be hardened by heat treatment at 80-130°C for several tens of seconds. In the case of an ultraviolet curing system, a mercury lamp, a metal halide lamp, or the like can be used as a light source, and ultraviolet rays can be irradiated and cured. In the case of radical polymerization by irradiation with ultraviolet rays, it is preferable to perform curing in a nitrogen atmosphere in order to prevent oxygen inhibition. The thickness variation of the
加成反應系矽酮剝離劑使於聚二甲基矽氧烷之末端及/或側鏈導入有乙烯基者與氫矽氧烷反應而硬化。硬化可使用鉑催化劑。例如,可以100°C左右之硬化溫度使之硬化數十秒至數分鐘。剝離層24之厚度亦可為50~300 nm左右。作為加成反應系之剝離劑,可列舉信越化學工業股份有限公司製之K847、KS847T、KS-776L、KS-776A、KS-841、KS-774、KS-3703T、KS-3601等(皆為商品名)。The addition reaction-based silicone release agent reacts with hydrosiloxane to harden the polydimethylsiloxane with vinyl groups introduced into the terminal and/or side chain. Hardening can use platinum catalysts. For example, it can be hardened at a hardening temperature of about 100°C for several tens of seconds to several minutes. The thickness of the
剝離層24亦可以例如(甲基)丙烯酸酯成分與(甲基)丙烯酸酯改性矽酮之硬化物構成。由於此種硬化物可以紫外線硬化,故可增大剝離層24之厚度。因此,例如於基材膜22包含填充料之情形時,可覆蓋因填料所致之突起,使剝離層24之表面(剝離面)平滑化。該情形時,剝離層24之厚度亦可為30~3000 nm。The
亦可使用互不相溶之(甲基)丙烯酸酯單體與(甲基)丙烯酸酯改性矽酮油。將該等與反應引發劑一起混合於溶劑中,塗佈於基材膜22後,使溶劑乾燥。如此,亦可於使矽酮改性矽酮油於表面附近局部化之狀態下,利用紫外線使之硬化,形成剝離層24。作為(甲基)丙烯酸酯改性矽酮油,可使用眾所周知者。例如,可列舉信越化學工業股份有限公司製之X-22-164A、X-22-164B、X-22-174DX、X-22-2445(皆為商品名)等。It is also possible to use immiscible (meth)acrylate monomers and (meth)acrylate modified silicone oils. These are mixed with a reaction initiator in a solvent, and after apply|coating to the
剝離膜20之剝離層24之表面較佳為平滑。具體而言,剝離層24之表面粗糙度(Rp)較佳為100 nm以下,更佳為50 nm以下。本實施形態之剝離層24之表面粗糙度(Rp)為JIS B 0601-2001所規定之最大峰值,可使用接觸式表面粗糙度計或掃描型白色干涉顯微鏡測定。The surface of the
一實施形態之剝離膜卷100之製造方法具有:搬送步驟,其使用搬送輥搬送剝離膜;切斷步驟,其沿長邊方向切斷剝離膜;及捲繞步驟,其一面將接觸輥按壓於捲繞卷,一面以捲繞卷捲繞剝離膜。搬送步驟亦可於切斷步驟前後之任一者或兩者進行。The manufacturing method of the
圖3係顯示進行剝離膜卷100之製造方法之製造裝置之一例之圖。圖3之製造裝置300中,使用剝離膜卷200。剝離膜卷200將具有較剝離膜20寬之寬度(例如1~2 m)之剝離膜20A捲繞於卷芯11。剝離膜卷200藉由以眾所周知之方法,將剝離膜20A捲繞於捲芯11而製造。剝離層可以與基材膜之長邊方向平行之方式條紋狀排列複數個而形成。此時,可將剝離膜20A之基材膜側作為內側,捲繞於捲芯11,亦可將剝離層側作為內側而捲繞。剝離膜卷200之捲繞長度可長於剝離膜卷100之捲繞長度。亦可以對剝離膜卷100之捲繞長度之整數倍之長度,加上伴隨於切斷作業之損耗量之長度,製作剝離膜卷200。該情形時,捲繞步驟中,可於剝離膜卷100完成後,將自剝離膜卷200送出之剝離膜20A沿寬度方向切斷,將該剝離膜卷200繼續使用於其它剝離膜卷100之製造。藉此,可謀求生產性之效率化。3 : is a figure which shows an example of the manufacturing apparatus which performs the manufacturing method of the peeling
製造裝置300在設置於上游側之送出部110中,將剝離膜卷200之捲芯11插入至旋轉軸202,旋轉軸202可旋轉地支持剝離膜卷200。再者,製造裝置300具備於上下方向夾著自剝離膜卷200拉出之剝離膜20A之一對輥50。製造裝置300於進行搬送步驟之一對輥50之下游側,依序具備進行切斷步驟之切斷部120、及進行捲繞步驟之捲繞部130。The
作為一對輥50之材質,列舉金屬、塑膠、橡膠等。構成一對輥50之上輥50a與下輥50b可以互不相同之材質構成。例如,基於使剝離膜20A與上輥50a充分接觸之觀點,上輥50a可為至少表面為橡膠製之搬送輥。為了抑制下輥50b自身變形而致使搬送速度變得不穩定,下輥50b可為金屬製之夾壓輥。一對輥50之構成未特別限定,變化例中,亦可使上輥50a為夾壓輥,使下輥50b為搬送輥。The material of the pair of
一對輥50可具有使剝離膜20A之張力於其上游側與下游側不同之功能。與剝離膜20A之行進方向反向之轉矩作用於送出部110之旋轉軸202,對剝離膜20A施加張力。作為反向之轉矩,可使用摩擦轉矩、或電磁閘等予以施加。藉由一對輥50具有使剝離膜20A之張力不同之功能,而可高自由度地進行切斷部120及捲繞部130中之剝離膜20之張力控制。The pair of
切斷部120具有上刃輥60a與下刃輥60b。上刃輥60a可沿其之旋轉軸方向,以特定間隔安裝複數片上刃。上刃輥60a之上刃可與下刃輥60b嚙合。將通過一對輥50之剝離膜20A於上刃輥60a與下刃輥60b間,沿長邊方向切斷。藉此,分割成例如具有100~500 mm寬度之剝離膜20。若於捲軸102安裝複數個捲芯10,一面以接觸輥70按壓被切斷之剝離膜20一面將其捲繞於捲芯10,則可一次性製造複數個剝離膜卷100。切斷部120可使用排刃等眾所周知之切斷機。另,亦可不具有切斷部120。該情形時,可自一個剝離膜卷200獲得一個剝離膜卷100。The cutting
捲繞部130具備捲軸102,其插入至捲繞卷100a之捲芯10,可旋轉地支持捲芯10。以切斷部120切斷所得之剝離膜20捲繞於捲繞部130中安裝在捲軸102之捲芯10。此時,捲軸102以特定轉矩旋轉,且接觸輥70將捲繞之剝離膜20按壓於捲芯10側。即,剝離膜20一面由接觸輥70按壓一面被捲繞。藉由捲軸102以特定捲繞轉矩旋轉驅動,可提高剝離膜20之捲繞性。又,接觸輥70對捲繞卷100a之按壓大小可適當調整。The winding
該例中,接觸輥70與捲軸102反向旋轉,但不限定於此。接觸輥70與捲軸102亦可以相同方向旋轉。但,基於進而提高捲繞狀態之品質,且進而減少剝離膜20表面之凹凸及變形之觀點,較佳為接觸輥70與捲軸102反向旋轉。In this example, the
圖4係顯示進行剝離膜卷100之製造方法之製造裝置之另一例之圖。圖4之製造裝置301於取代捲繞部130而具有捲繞部131之點,與圖3之製造裝置300不同。製造裝置301之送出部110及切斷部120可與製造裝置300相同。製造裝置301之捲繞部131中,剝離膜20首先與接觸輥70接觸,於與接觸輥70接觸之狀態下,繞接觸輥70約半圈後,被夾於接觸輥70與捲繞卷100a間。剝離膜20於接觸輥70與捲繞卷100a間一面受按壓,一面由以特定轉矩旋轉之捲軸102捲繞。該例中,剝離膜20一面由接觸輥70按壓一面捲繞。接觸輥70旋轉驅動,且捲軸102亦以特定捲繞轉矩旋轉驅動,藉此可提高剝離膜20之捲繞性。4 : is a figure which shows another example of the manufacturing apparatus which performs the manufacturing method of the peeling
圖5係模式性顯示施加於捲繞部130、131中捲繞於捲繞卷100a之剝離膜20之張力變化的圖。圖5之橫軸係捲繞卷100a之卷形狀之大小,縱軸係施加於捲繞之剝離膜20之張力。圖5之直線1表示將剝離膜20以恆定張力捲繞以恆定張力控制捲繞時之張力變化。恆定張力控制時,由於自捲繞開始時至結束時以恆定張力捲繞剝離膜,故於內側,捲芯表面之突起及剝離膜所含之填充料等之形狀被轉印於剝離膜,易於剝離膜之剝離層表面產生凹凸。FIG. 5 is a diagram schematically showing a change in the tension applied to the
圖5之曲線2表示以錐度張力控制捲繞剝離膜時之張力變化。該情形時,隨著捲繞進展,卷徑變大,與直線1相比,可減小施加於捲繞之剝離膜20之張力。因此,可抑制於剝離膜20之剝離層24之表面產生凹凸。
圖5之曲線3表示將捲軸102之轉矩控制為恆定,捲繞剝離膜20時之張力變化。該情形時,隨著捲繞進展卷徑變大,可較曲線2進而減小施加於捲繞之剝離膜20之張力。因此,可充分抑制於剝離膜20之剝離層24之表面產生凹凸。The
接觸輥70藉由驅動部旋轉驅動。如圖5之曲線3所示,即使以較低張力捲繞剝離膜20,亦一面由接觸輥70按壓一面旋轉驅動接觸輥70,故可減少沿捲繞卷100a之徑向上相鄰之剝離膜20間之空氣。藉此,可抑制產生捲繞偏移、滑動現象及捲繞過緊,可抑制於剝離層24產生褶皺及損傷等凹凸。接觸輥70之旋轉速度可適當微調。切斷部120之切斷速度恆定之情形時,接觸輥70之旋轉速度亦可大致恆定。The
接觸輥70之材質列舉金屬、塑膠、橡膠等。剝離膜20易帶電之情形時,亦可將接觸輥70設為導電性者。亦可根據接觸輥70之材質,適當調整接觸輥70之直徑。例如,若為硬材質,則可使用直徑較大者,若為柔材質,則可使用直徑較小者。The material of the
圖6係顯示圖3之捲繞部130之控制方法之一例之圖。捲繞部130可具有:轉矩控制部81a,其控制旋轉驅動捲繞卷100a之捲軸102之轉矩T;及旋轉驅動部82,其基於來自轉矩控制部81a之轉矩資訊,旋轉驅動捲軸102。旋轉驅動部82基於來自轉矩控制部81a之轉矩資訊,以轉軸102之轉矩(捲繞轉矩)成為T之方式旋轉驅動。另,捲繞卷100a係捲繞剝離膜20時之剝離膜卷,當捲繞結束時成為剝離膜卷100。FIG. 6 is a diagram showing an example of a control method of the winding
將捲繞之剝離膜20之厚度設為F[m],將剝離膜20之寬度設為W[m],將旋轉驅動捲繞卷100a之捲軸102之轉矩設為T[N·m]時,T/(F·W)之值可維持在70,000~420,000 N/m之範圍內。該值表示捲軸102賦予至剝離膜20之每單位剖面之轉矩之大小。藉由將捲繞步驟之T/(F·W)之值設為上述範圍,可抑制沿剝離膜卷100之徑向上相鄰之剝離膜彼此之凹凸轉印,且減少剝離膜20間之空氣,使剝離膜彼此充分密接。基於相同觀點,捲繞步驟之T/(F·W)之值可在70,000~280,000 N/m之範圍內,亦可在100,000~210,000 N/m之範圍內。Let the thickness of the
捲軸102之轉矩T之變動宜小為佳。例如,將捲繞步驟之捲軸102之轉矩T[N·m]之最大值設為Tmax
[N·m],將最小值設為Tmin
[N·m]、及將最大值Tmax
與最小值Tmin
之和的1/2設為Tave
[N·m]時,可滿足下述式(1)及(2),亦可滿足下述式(3)及(4)。
Tmax
≦1.2×Tave
(1)
Tmin
≧0.8×Tave
(2)
Tmax
≦1.1×Tave
(3)
Tmin
≧0.9×Tave
(4)It is better that the variation of the torque T of the
捲繞步驟中,藉由滿足下述(1)及(2)或式(3)及4(4),可縮小捲軸102之轉矩T之變化幅度。藉此,可充分抑制因轉矩T變大而可能產生之捲繞過緊。另,捲繞步驟中若將轉矩T設為恆定,則隨著捲繞卷100a之卷徑r變大,剝離膜20之捲繞張力變低。本實施形態中,因一面由接觸輥70按壓剝離膜20一面藉由旋轉驅動進行捲繞,故即使捲繞張力變低,亦可充分減少於徑向上相鄰之剝離膜20間之空氣量。In the winding step, by satisfying the following (1) and (2) or equations (3) and 4 (4), the variation range of the torque T of the
製造裝置300亦可具有:轉矩控制部81b,其控制接觸輥70之旋轉軸72之轉矩T’;及旋轉驅動部83,其基於來自轉矩控制部81b之轉矩資訊,旋轉驅動旋轉軸72。旋轉驅動部83基於來自轉矩控制部81b之轉矩資訊,以旋轉軸72之轉矩成為T’之方式旋轉驅動。若增大接觸輥70之轉矩T’,則捲繞之剝離膜20之張力變大。The
例如,於卷徑r較小時,為了不對剝離膜20過度施加張力,而縮小接觸輥70之轉矩T’。且,若隨著捲繞進展卷徑r變大,而增大轉矩T’,則可以接觸輥70之轉矩T’輔助轉矩T為恆定轉矩以下時之剝離膜20之張力降低。藉此,可減少捲繞卷100a中之空氣量,且抑制隨著張力降低之剝離膜20之翻轉,提高切斷時之穩定性。For example, when the roll diameter r is small, the torque T' of the
有時控制裝置300由按壓控制部81c與缸體部84構成,該按壓控制部81c控制接觸輥70對捲繞卷100a之按壓P,該缸體部84產生實際按壓。缸體部84藉由對缸體送入壓縮之空氣而產生按壓。藉由調整壓縮之空氣之氣壓而控制接觸輥之按壓。The
接觸輥70對捲繞卷100a之按壓P可隨著卷徑r變大而逐漸變大。使捲軸102之轉矩T恆定之情形時,隨著卷徑r變大,剝離膜20之張力變小。因此,若增大接觸輥70之按壓P,則可充分減少於徑向上相鄰之剝離膜20間之空氣量。按壓亦可根據切斷步驟中之切斷速度及剝離膜20之寬度等設定。The pressing force P of the
捲軸102亦可具備用以將捲芯10固定於捲軸102之固定機構。剝離膜20之捲繞結束,獲得剝離膜卷100後,使用缸體部84移動接觸輥70,使其離開剝離膜卷100。接著,解除捲軸102之固定機構,將剝離膜卷100自捲軸102卸下。如此可製造剝離膜卷100。The
如此製造之剝離膜卷100於捲繞步驟中,以接觸輥70將剝離膜20按壓於捲繞卷100a,且一面使該接觸輥70旋轉驅動一面捲繞剝離膜20。接觸輥70以按壓P將捲繞於捲繞卷100a之剝離膜20朝捲繞卷100a按壓。又,接觸輥70以轉矩T’旋轉驅動。因此,可促進捲繞之剝離膜20間之空氣逸散,抑制捲繞偏移之產生。又,可縮小捲繞卷100a之捲軸102之轉矩T,減少對剝離膜20之剝離層24表面轉印凹凸形狀。因此,可製造捲繞狀態之品質較高,且充分減少剝離膜20表面之凹凸及變形之剝離膜卷100。The thus-produced
控制部80具有轉矩控制部81a、81b及按壓控制部81c。控制部80由通常之電腦系統構成,該電腦系統包含:CPU(Central Processing Unit:中央處理單元)、ROM(Read Only Memory:唯讀記憶體)及RAM(Ramdom Access Memory:隨機存取記憶體)等主記憶裝置、鍵盤及滑鼠等輸入裝置、顯示器等輸出裝置、用以於與各種測定部間進行資料收發之收發部、及硬碟等輔助記憶裝置等。轉矩控制部81a、81b及按壓控制部81c可包含於一個電腦系統中,亦可分別由個別之電腦系統構成。The
轉矩控制部81a、旋轉驅動部82及捲軸102無須以個別之硬體構成,亦可由一個或二個硬體構成。例如,轉矩控制部81a與旋轉驅動部82之功能亦可由市場銷售之轉矩馬達實現。轉矩控制部81之轉矩控制方法未特別限制,例如亦可使用摩擦軸進行。轉矩控制部81b、旋轉驅動部83及旋轉軸72亦無須以個別之硬體構成,亦可由一個或二個硬體構成。例如,轉矩控制部81b與旋轉驅動部83之功能亦可以市場銷售之轉矩馬達實現。又,按壓控制部81c及缸體部84亦無須以個別之硬體構成,亦可由一個硬體構成。The
圖7係本揭示之一實施形態之陶瓷零件片材之剖視圖。圖7之陶瓷零件片材40之製造方法具有以下步驟:於自剝離膜卷100拉出之剝離膜20之剝離層24之表面24a,使用包含陶瓷粉末之糊膏與電極糊膏,形成包含陶瓷生坯片32及電極生坯片34之生坯片30。7 is a cross-sectional view of a ceramic component sheet according to an embodiment of the present disclosure. The manufacturing method of the
陶瓷生坯片32可塗佈含有陶瓷粉末之陶瓷糊膏,使之乾燥而形成。電極生坯片34可於陶瓷生坯片32之上塗佈電極糊膏,使之乾燥而形成。The ceramic
例如若為積層陶瓷電容器,則可將介電質原料(陶瓷粉末)與有機媒劑混練而調製陶瓷糊膏。作為介電質原料,列舉藉由燒成而成為複合氧化物或氧化物之各種化合物。例如,可自碳酸鹽、硝酸鹽、氫氧化物、有機金屬化合物等適當選擇使用。介電質原料之平均粒子徑為4 μm以下,較佳為0.1~3.0 μm之粉末。For example, in the case of a multilayer ceramic capacitor, a ceramic paste can be prepared by kneading a dielectric raw material (ceramic powder) and an organic vehicle. As a dielectric raw material, various compounds which become composite oxides or oxides by firing are exemplified. For example, carbonates, nitrates, hydroxides, organometallic compounds and the like can be appropriately selected and used. The average particle size of the dielectric raw material is 4 μm or less, preferably 0.1-3.0 μm powder.
電極糊膏例如可將選自由各種導電性金屬及合金等之導電體材料、以及各種氧化物、有機金屬化合物及樹脂酸鹽等於燒成後成為導電體材料之材料等所組成之群之至少一者、與有機媒劑混練而調製。作為製造電極糊膏時使用之導電體材料,較佳使用Ni金屬、Ni合金、或該等之混合物。為提高接著性,電極糊膏亦可包含塑化劑。作為塑化劑,列舉鄰苯二甲酸丁基苄酯(BBP,Butyl Benzyl Phthalate)等鄰苯二甲酸酯、己二酸、磷酸酯、乙二醇類等。The electrode paste can be, for example, at least one selected from the group consisting of conductive materials such as various conductive metals and alloys, and various oxides, organometallic compounds, and resinates that become conductive materials after firing. It is prepared by mixing with organic media. As the conductor material used in the production of the electrode paste, Ni metal, Ni alloy, or a mixture thereof is preferably used. To improve adhesion, the electrode paste may also contain a plasticizer. Examples of the plasticizer include phthalates such as butyl benzyl phthalate (BBP, Butyl Benzyl Phthalate), adipic acid, phosphoric acid esters, glycols, and the like.
陶瓷糊膏及電極糊膏所含之有機媒劑係將黏合劑樹脂溶解於有機溶劑中而調製。作為用於有機媒劑之黏合劑樹脂,列舉例如乙基纖維素、丙烯酸系樹脂、縮丁醛系樹脂、聚乙烯縮醛、聚乙烯醇、聚烯烴、聚胺酯、聚苯乙烯、及該等之共聚物等。其中,較佳使用縮丁醛系樹脂,具體而言係聚乙烯縮丁醛系樹脂。藉由使用縮丁醛系樹脂,可提高陶瓷生坯片之機械強度。陶瓷糊膏及電極糊膏之一者或兩者亦可視需要含有選自由各種分散劑、塑化劑、除電劑、介電質、玻璃粉、絕緣體等所組成之群之至少一種添加物。The organic vehicle contained in the ceramic paste and the electrode paste is prepared by dissolving a binder resin in an organic solvent. Examples of the binder resin used for the organic vehicle include ethyl cellulose, acrylic resin, butyral resin, polyvinyl acetal, polyvinyl alcohol, polyolefin, polyurethane, polystyrene, and the like. Copolymers, etc. Among them, butyral-based resins, specifically polyvinyl butyral-based resins, are preferably used. By using the butyral-based resin, the mechanical strength of the ceramic green sheet can be improved. One or both of the ceramic paste and the electrode paste may optionally contain at least one additive selected from the group consisting of various dispersants, plasticizers, antistatic agents, dielectrics, glass frit, insulators, and the like.
使用例如刮板裝置等,將上述陶瓷糊膏塗佈於剝離膜20之剝離層24之表面24a。且,使塗佈之陶瓷糊膏於乾燥裝置內,例如以50~100°C之溫度乾燥1~20分鐘,形成陶瓷生坯片32。陶瓷生坯片32與乾燥前相比,收縮5~25%。The above-mentioned ceramic paste is applied to the
其後,於陶瓷生坯片32之表面32a上,使用例如網版印刷裝置,以成為特定圖案之方式印刷上述電極糊膏。使印刷後之電極糊膏於乾燥裝置內,例如以50~100°C之溫度乾燥1~20分鐘,形成電極生坯片34。如此,可獲得於剝離膜20之剝離層24之上依序積層有陶瓷生坯片32與電極生坯片34之陶瓷零件片材40。Then, on the
若剝離膜卷100之剝離膜20之凹凸或厚度變動變大,則陶瓷生坯片32之厚度變動幅度變大。自剝離膜卷100拉出之剝離膜20已充分減少於剝離層24因捲繞偏移及滑動現象等所致之損傷之產生及凹凸。因此,可遍及自捲繞於剝離膜卷100之剝離膜20之前端至後端間之廣闊區域,充分抑制厚度變動及針孔之陶瓷生坯片32。使用具備此種陶瓷生坯片之陶瓷零件片材40製作之陶瓷零件可靠性佳。When the unevenness or thickness variation of the
陶瓷生坯片32及電極生坯片34之厚度亦可分別為1.0 μm以下。即使厚度如此小,厚度變動亦得到抑制,因此可獲得具有高可靠性之陶瓷零件。本揭示之陶瓷零件片材不限定於圖7者,例如亦可不具有電極生坯片,僅以陶瓷生坯片32構成。The thickness of the ceramic
本揭示之一實施形態之陶瓷零件之製造方法具有:積層步驟,其準備複數個陶瓷零件片材,積層複數個陶瓷零件片材之生坯片,獲得積層體;燒成步驟,其燒成積層體,獲得燒結體;及電極形成步驟,其於該燒結體形成端子電極,獲得積層陶瓷電容器。A method of manufacturing a ceramic part according to an embodiment of the present disclosure includes: a lamination step of preparing a plurality of ceramic part sheets, laminating green sheets of the plurality of ceramic part sheets to obtain a laminated body; and a firing step of firing the laminated body body to obtain a sintered body; and an electrode formation step of forming terminal electrodes on the sintered body to obtain a multilayer ceramic capacitor.
圖8係顯示以上述製造方法製造之積層陶瓷電容器之一例之剖視圖。積層陶瓷電容器90具備內層部92、及於積層方向夾著該內層部92之一對外層部93。積層陶瓷電容器90於側面具有端子電極95。FIG. 8 is a cross-sectional view showing an example of a multilayer ceramic capacitor manufactured by the above-described manufacturing method. The multilayer
內層部92具有複數層(本例中為13層)陶瓷層96(介電層)、及複數層(本例中為12層)內部電極層94。陶瓷層96與內部電極層94交替積層。內部電極層94與端子電極95電性連接。外層部93由陶瓷層形成。該陶瓷層例如亦可與陶瓷生坯片32同樣地形成。The
積層步驟中,剝離圖7所示之陶瓷零件片材40之剝離膜20,獲得生坯片30。將該生坯片30之一面30b積層於外層用生坯片。自另一陶瓷零件片材40剝離另一剝離膜20,獲得另一生坯片30,以最先剝離之生坯片之電極生坯片34與另一生坯片30之一面30b相向之方式積層。其後,藉由重複進行此種順序,積層生坯片30,而獲得積層體。即,該積層步驟中,剝離剝離膜20,獲得生坯片30,並依序積層生坯片30。藉由重複複數次該順序,形成積層體。最後,亦進行外層用生坯片之積層。In the lamination step, the
積層體之生坯片之積層片數未特別限制,例如可為數十層至數百層。亦可於與積層體之積層方向正交之兩端面,設置未形成電極層之厚的外層用生坯片。亦可於形成積層體後,切斷積層體而作為生坯片。The number of laminated sheets of the green sheets of the laminated body is not particularly limited, and may be, for example, tens to hundreds of layers. A green sheet for an outer layer having a thickness where no electrode layer is formed may be provided on both end surfaces orthogonal to the lamination direction of the laminate. After forming the layered body, the layered body may be cut and used as a green sheet.
燒成步驟中,將積層步驟中獲得之積層體(生坯片)進行燒成,獲得燒結體。燒成條件較佳以1100~1300°C,於加濕之氮氣與氫氣之混合氣體等之氛圍下進行。但,燒成時之氛圍中之氧分壓較佳為10-2 Pa以下,更佳為10-2 ~10-8 Pa。另,較佳於燒成前實施積層體之脫黏合劑處理。脫黏合劑處理可以通常之條件進行。例如,使用Ni或Ni合金等賤金屬作為內部電極層之介電質材料之情形時,較佳以200~600°C進行。In the firing step, the layered body (green sheet) obtained in the layering step is fired to obtain a sintered body. The firing conditions are preferably 1100 to 1300°C in an atmosphere such as a humidified mixed gas of nitrogen and hydrogen. However, the oxygen partial pressure in the atmosphere during firing is preferably 10 -2 Pa or less, more preferably 10 -2 to 10 -8 Pa. In addition, it is preferable to perform the debindering process of a laminated body before baking. The debinder treatment can be carried out under normal conditions. For example, when a base metal such as Ni or a Ni alloy is used as the dielectric material of the internal electrode layer, it is preferably performed at 200 to 600°C.
燒成後,為了使構成燒結體之陶瓷層再氧化,亦可進行熱處理。熱處理之保持溫度或最高溫度較佳為1000~1100°C。熱處理時之氧分壓較佳高於燒成時之還原氛圍之氧分壓,更佳為10-2 Pa~1Pa。較佳為對如此獲得之燒結體利用例如滾筒研磨、噴砂等實施端面研磨。After firing, in order to reoxidize the ceramic layer constituting the sintered body, heat treatment may be performed. The holding temperature or the maximum temperature of the heat treatment is preferably 1000 to 1100°C. The oxygen partial pressure during heat treatment is preferably higher than the oxygen partial pressure of the reducing atmosphere during firing, more preferably 10 -2 Pa to 1 Pa. The sintered body thus obtained is preferably subjected to face grinding by, for example, barrel grinding, sandblasting, or the like.
電極形成步驟中,藉由於燒結體之側面上燒接端子電極用糊膏,形成端子電極95,而可獲得圖8所示之積層陶瓷電容器90。該積層陶瓷電容器90之製造方法中,使用具有充分減少因剝離膜20之凹凸及捲繞偏移等所致之損傷之剝離層的剝離膜卷100。因此,可充分減少陶瓷層96及內部電極層94之厚度不均及針孔。因此,抑制耐壓降低,可靠性優異。In the electrode forming step, the
以上,雖已說明若干實施形態,但本揭示並非限定於上述實施形態者。例如,雖已說明形成積層陶瓷電容器作為陶瓷零件之例,但本揭示之陶瓷零件不限定於積層陶瓷電容器,例如亦可為其它陶瓷零件。陶瓷零件亦可為例如變阻器或積層電感器。 [實施例]Although some embodiments have been described above, the present disclosure is not limited to the above-mentioned embodiments. For example, although the example of forming a multilayer ceramic capacitor as a ceramic component has been described, the ceramic component of the present disclosure is not limited to a multilayer ceramic capacitor, and may be other ceramic components, for example. The ceramic part can also be, for example, a varistor or a multilayer inductor. [Example]
雖欲參照實施例及比較例,更詳細地說明本揭示之內容,但本揭示並非限定於下述實施例者。Although the content of the present disclosure will be described in more detail with reference to Examples and Comparative Examples, the present disclosure is not limited to the following Examples.
(實施例1) <剝離膜卷之製作> 為製作剝離膜,根據以下順序調製剝離劑溶液。對於100質量部之壬二醇二丙烯酸酯,準備0.25質量部之丙烯酸酯改性矽酮油(商品名:X-22-2445,信越化學工業股份有限公司製)、100質量部之甲基乙基酮、及100質量部之甲苯。將該等放入金屬製容器中攪拌混合,獲得無色透明溶液。(Example 1) <Production of peeling film roll> In order to prepare a release film, a release agent solution was prepared according to the following procedure. For 100 parts by mass of nonanediol diacrylate, prepare 0.25 parts by mass of acrylate-modified silicone oil (trade name: X-22-2445, manufactured by Shin-Etsu Chemical Co., Ltd.), and 100 parts by mass of methyl ethyl acetate ketone, and 100 parts by mass of toluene. These were put into a metal container, stirred and mixed to obtain a colorless and transparent solution.
於上述溶液中加入2.5質量部之反應引發劑(商品名:Omnirad127、IGM Rasins B.V.製),調製塗佈液。自塗佈裝置之縫隙擠出塗佈液,塗佈於寬度1100 mm之雙軸延伸聚對苯二甲酸乙二酯膜(PET膜,厚度:30 μm)之一面,以溫度80°C之熱風吹30秒,使甲基乙基酮及甲苯蒸發。如此,於PET膜上形成塗佈層。2.5 parts by mass of a reaction initiator (trade name: Omnirad127, manufactured by IGM Rasins B.V.) was added to the above solution to prepare a coating liquid. The coating liquid was extruded from the gap of the coating device, and coated on one side of a biaxially stretched polyethylene terephthalate film (PET film, thickness: 30 μm) with a width of 1100 mm, and heated at a temperature of 80°C. The air was blown for 30 seconds to evaporate methyl ethyl ketone and toluene. In this way, a coating layer is formed on the PET film.
接著,於氧濃度100 ppm之氮氣氛圍下照射紫外線,使塗佈層硬化,形成具有剝離功能之剝離層。如此,獲得於PET膜之一面具有剝離層之剝離膜(切斷前)。使用掃描型白色干涉顯微鏡(裝置名:VS1540,日立Hightech股份有限公司製),測定剝離膜之剝離層之表面粗糙度(Rp)。其結果,剝離層之表面粗糙度(Rp)為30 nm。剝離層之厚度為1 μm。將此種剝離膜捲繞於捲芯,獲得剝離膜卷(切斷前)。又,製作之剝離膜之全長為7000 m。Next, ultraviolet rays are irradiated in a nitrogen atmosphere with an oxygen concentration of 100 ppm to harden the coating layer to form a peeling layer with a peeling function. In this way, a release film (before cutting) having a release layer on one surface of the PET film was obtained. Using a scanning white interference microscope (device name: VS1540, manufactured by Hitachi Hightech Co., Ltd.), the surface roughness (Rp) of the release layer of the release film was measured. As a result, the surface roughness (Rp) of the peeling layer was 30 nm. The thickness of the peeling layer was 1 μm. Such a release film was wound around a core to obtain a release film roll (before cutting). In addition, the total length of the produced release film was 7000 m.
使用如圖3所示之製造裝置,將上述剝離膜卷200(切斷前)安裝於旋轉軸202。以切斷部120將自剝離膜卷200(切斷前)拉出之剝離膜沿長邊方法切斷成5卷,設為寬度200 mm之尺寸。如圖3所示,將5卷剝離膜(切斷後)以剝離層24成為外側之方式,分別捲繞於外徑為88.2 mm之FRP製卷芯10。捲繞時,對捲繞卷100a按壓接觸輥70,且一面使捲軸102與接觸輥70旋轉驅動,一面將剝離膜捲繞於捲芯10。使用摩擦軸作為捲軸102。Using the manufacturing apparatus shown in FIG. 3, the said peeling film roll 200 (before cutting) was attached to the
捲軸102之轉矩T固定為0.868 N·m。即,最大值Tmax
及最小值Tmin
皆為0.868 N/m。T/(F·W)之值為140,000 N/m。獲得之5卷剝離膜卷之捲繞長度皆為6000 m。The torque T of the
<捲繞狀態之品質評估> 以目視評估剝離膜卷之捲繞狀態。將側面中,剝離膜之側端部整齊地排列無捲繞偏移之情形評估為「A」,將有捲繞偏移之情形評估為「B」。結果如表1所示。<Quality evaluation of winding state> The winding state of the release film roll was visually evaluated. Among the side surfaces, the case where the side end portions of the release films were arranged neatly without winding offset was evaluated as "A", and the case with winding offset was evaluated as "B". The results are shown in Table 1.
<介電質生坯片之形成及評估> 使用製作之剝離膜卷,按照以下順序形成介電質生坯片作為陶瓷零件片材。分別準備BaTiO3 系粉末作為陶瓷粉末,聚乙烯縮丁醛(PVB,Polyvinyl butyral)作為有機黏合劑,及甲醇作為溶劑。接著,對於100質量部之陶瓷粉末,調配10質量部之有機黏合劑、及165質量部之溶劑,以球磨機混練,獲得介電質漿料。<Formation and Evaluation of Dielectric Green Sheet> Using the produced release film roll, a dielectric green sheet was formed as a ceramic component sheet in the following procedure. BaTiO3 - based powder was prepared as a ceramic powder, polyvinyl butyral (PVB) as an organic binder, and methanol as a solvent, respectively. Next, with respect to 100 parts by mass of the ceramic powder, 10 parts by mass of the organic binder and 165 parts by mass of the solvent were prepared, and kneaded with a ball mill to obtain a dielectric slurry.
將剝離膜卷安裝於塗布機,於自剝離膜卷拉出之剝離膜之剝離層側塗佈介電質漿料,於剝離膜之剝離層之表面形成介電質生坯片。介電質生坯片之厚度設定值為0.9 μm。介電質生坯片之厚度變動幅度係使用直列設置之透過型X射線膜厚計(商品名:AccureX,(股份)Hutec製),一面於剝離膜之寬度方向橫穿一面沿長邊方向連續測定。厚度變動幅度由厚度之平均值、最大值及最小值求得。即,將最大值-平均值之絕對值與最小值-平均值之絕對值中較大的值設為厚度變動幅度。另,於距離捲繞於捲芯之剝離膜卷之後端之長度為100 m範圍內之剝離膜,因塗布機裝置上之制約而未形成介電質生坯片。The release film roll is installed on the coating machine, and the dielectric slurry is coated on the release layer side of the release film pulled out from the release film roll to form a dielectric green sheet on the surface of the release layer of the release film. The thickness of the dielectric green sheet was set at 0.9 μm. The thickness variation of the dielectric green sheet was measured by using a transmission-type X-ray film thickness gauge (trade name: AccureX, manufactured by Hutec Co., Ltd.) installed in-line. Determination. The thickness variation range is obtained from the average value, maximum value and minimum value of the thickness. That is, the larger value of the absolute value of the maximum value and the average value and the absolute value of the minimum value and the average value is used as the thickness variation width. In addition, the release film within a length of 100 m from the rear end of the release film roll wound on the core was not formed into a dielectric green sheet due to restrictions on the coater device.
針對製作之剝離膜上之介電質生坯片,調查針孔與介電質生坯片之厚度變動幅度。只要介電質生坯片之厚度在0.855 μm至0.945 μm之範圍內,即厚度變動幅度為0.045 μm(設定厚度之±5%),即為良品。厚度變動幅度為0.03 μm,為良品。又,未檢測出針孔。For the dielectric green sheets on the produced release films, the pinholes and the thickness variation of the dielectric green sheets were investigated. As long as the thickness of the dielectric green sheet is in the range of 0.855 μm to 0.945 μm, that is, the thickness variation is 0.045 μm (±5% of the set thickness), it is considered a good product. The thickness fluctuation range is 0.03 μm, which is a good product. Also, no pinhole was detected.
(實施例2~7)
除藉由變更作為捲軸102使用之摩擦軸,如表1所示般變更捲軸102之轉矩T以外,皆與實施例1同樣地製作剝離膜卷。與實施例1同樣地進行捲繞狀態之品質評估、介電質生坯片之形成及評估。結果如表1所示。(Examples 2 to 7)
A release film roll was produced in the same manner as in Example 1, except that the torque T of the
(比較例1) 使用與實施例7相同之摩擦軸。不使用接觸輥進行剝離膜之捲繞。進行獲得之剝離膜卷之捲繞狀態之品質評估時,在剝離膜卷之側面,剝離膜之切斷面(端面)不整齊。又,捲繞結束後,若自捲軸卸下剝離膜卷,則內側之剝離膜滑動,剝離膜卷竹筍狀變形。認為其原因在於,隨著卷徑變大,儘管捲繞之剝離膜之張力降低,但不使用接觸輥之故。於該狀態下,無法以塗佈裝置塗佈介電質漿料,故於該時點結束評估。另,解卷剝離膜卷觀察剝離膜時,於自側端部往內側約3 cm以內之區域,可見如剝離膜折疊之變形。(Comparative Example 1) The same friction shaft as in Example 7 was used. The release film is wound without using a touch roll. When the quality evaluation of the winding state of the obtained release film roll was performed, the cut surface (end surface) of the release film was uneven on the side surface of the release film roll. Moreover, when the peeling film roll is unloaded from the reel after the winding is completed, the peeling film on the inner side slides, and the peeling film roll is deformed like a bamboo shoot. The reason for this is considered to be that the contact roll was not used although the tension of the wound release film decreased as the roll diameter became larger. In this state, the dielectric paste could not be applied by the coating device, so the evaluation was ended at this point. In addition, when unwinding the release film roll and observing the release film, deformation such as folding of the release film can be seen in the area within about 3 cm from the side end to the inner side.
(比較例2) 調整捲繞卷之捲軸之轉矩,以施加於捲繞之剝離膜之張力恆定之方式,捲繞剝離膜(張力恆定控制)。與實施例1同樣地進行獲得之剝離膜卷之捲繞狀態之品質評估、介電質生坯片之形成及評估。結果如表1所示。(Comparative Example 2) Adjust the torque of the reel of the winding roll, and wind the release film in such a way that the tension applied to the wound release film is constant (constant tension control). In the same manner as in Example 1, the quality evaluation of the winding state of the obtained release film roll, and the formation and evaluation of the dielectric green sheet were performed. The results are shown in Table 1.
觀察到剝離膜卷夾帶空氣。又,接近剝離膜卷之捲芯之部分,具體而言,距離捲繞於捲芯之剝離膜卷之後端之長度在100 m至500 m範圍之剝離膜中,隨著變為內側介電質生坯片之厚度變動幅度惡化,介電質生坯片之厚度變動幅度為0.06 μm。如此,有厚度變動幅度超出設定厚度之±5%範圍之部分,為不良。又,距離捲繞於捲芯之剝離膜卷之後端之長度在100 m至250 m範圍之剝離膜中,觀察到介電質生坯片以如針孔般之形態變薄之部分。Air was observed to be entrapped by the release film roll. In addition, the part close to the core of the release film roll, specifically, in the release film with a length in the range of 100 m to 500 m from the rear end of the release film roll wound on the core, as the inner dielectric is changed. The thickness variation of the green sheets deteriorated, and the thickness variation of the dielectric green sheets was 0.06 μm. In this way, there is a portion where the thickness fluctuation range exceeds the range of ±5% of the set thickness, which is a defect. In addition, in the release film whose length from the rear end of the release film roll wound around the core was in the range of 100 m to 250 m, the thinned part of the dielectric green sheet in the form of a pinhole was observed.
[表1]
[產業上之可利用性] 根據本揭示,可提供一種即使加長剝離膜之捲繞長度,捲繞狀態之品質亦較高,且充分減少剝離膜表面之凹凸及變形的剝離膜卷及其製造方法。又,可提供一種藉由使用此種剝離膜卷,而具有優異之可靠性之陶瓷零件片材及其製造方法。又,可提供一種藉由使用此種陶瓷零件片材,而具有優異之可靠性之陶瓷零件及其製造方法。[Industrial Availability] According to the present disclosure, even if the winding length of the release film is increased, the quality of the wound state is high, and the unevenness and deformation of the surface of the release film can be sufficiently reduced, and a release film roll and a manufacturing method thereof can be provided. Moreover, by using such a peeling film roll, the ceramic component sheet which has excellent reliability, and its manufacturing method can be provided. Furthermore, by using such a ceramic component sheet, a ceramic component having excellent reliability and a manufacturing method thereof can be provided.
10:捲芯
11:捲芯
20:剝離膜
20A:剝離膜
22:基材膜
24:剝離層
24a:表面
30:生坯片
30b:一面
32:陶瓷生坯片
32a:表面
34:電極生坯片
40:陶瓷零件片材
50:輥
50a:上輥
50b:下輥
60a:上刃輥
60b:下刃輥
70:接觸輥
72:旋轉軸
80:控制部
81a:轉矩控制部
81b:轉矩控制部
81c:按壓控制部
82:旋轉驅動部
83:旋轉驅動部
84:缸體部
90:積層陶瓷電容器
92:內層部
93:外層部
94:內部電極層
95:端子電極
96:陶瓷層
100:剝離膜卷
100a:捲繞卷
102:捲軸
110:送出部
120:切斷部
130:捲繞部
131:捲繞部
200:剝離膜卷
202:旋轉軸
300:製造裝置
301:製造裝置
P:按壓
r:卷徑
T:轉矩
T':轉矩10: roll core
11: roll core
20: peel off
圖1係一實施形態之剝離膜卷之立體圖。 圖2係顯示剝離膜之一例之剖視圖。 圖3係顯示剝離膜卷之製造裝置之一例之圖。 圖4係顯示剝離膜卷之製造裝置之另一例之圖。 圖5係模式性顯示捲繞部中捲繞於捲繞卷之剝離膜之張力變化之圖。 圖6係顯示捲繞部之控制方法之一例之圖。 圖7係一實施形態之陶瓷零件片材之剖視圖。 圖8係顯示一實施形態之陶瓷零件之剖視圖。Fig. 1 is a perspective view of a release film roll according to an embodiment. FIG. 2 is a cross-sectional view showing an example of a release film. FIG. 3 is a view showing an example of a manufacturing apparatus of a peeling film roll. FIG. 4 is a view showing another example of the manufacturing apparatus of the peeling film roll. FIG. 5 is a diagram schematically showing a change in the tension of the release film wound around the winding roll in the winding section. FIG. 6 is a diagram showing an example of a control method of the winding unit. Fig. 7 is a cross-sectional view of a ceramic component sheet according to an embodiment. FIG. 8 is a cross-sectional view showing a ceramic part according to an embodiment.
10:捲芯 10: roll core
11:捲芯 11: roll core
20:剝離膜 20: peel off film
20A:剝離膜 20A: Release film
50:輥 50: Roller
50a:上輥 50a: top roll
50b:下輥 50b: Lower roll
60a:上刃輥 60a: Upper edge roller
60b:下刃輥 60b: Lower edge roller
70:接觸輥 70: Contact Roller
100:剝離膜卷 100: peel off film roll
100a:捲繞卷 100a: winding roll
102:捲軸 102: Scroll
110:送出部 110: Delivery Department
120:切斷部 120: Cutting part
130:捲繞部 130: winding part
200:剝離膜卷 200: Peel film roll
202:旋轉軸 202: Rotary axis
300:製造裝置 300: Manufacturing Device
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