TW202202338A - Flexible metal-clad layered sheet having microstrip line structure - Google Patents

Abstract

The present invention addresses the problem of realizing further reduction in the transmission loss in a flexible metal-clad layered sheet. The present invention can solve the aforementioned problem by providing a flexible metal-clad layered sheet having a microstrip line structure, characterized by: including at least a signal line (3), a first polyimide layer (2), and a ground layer (1), in the stated order; and the first polyimide layer (2) having a thickness of 75-200 [mu]m and a dielectric loss of 0.008 or less at 10 GHz.

Description

Flexible metal-laminated laminate with microstrip structure

The present invention relates to a flexible metal-laminated laminate with a microstrip line structure.

Due to its excellent mechanical strength, heat resistance, electrical insulation and chemical resistance, polyimide films are mostly used for electronic substrate materials. For example, a polyimide film is used as the substrate material to manufacture a flexible copper-laminated laminate (hereinafter also referred to as FCCL) with copper foil layered on at least one area, or a flexible printed circuit board (hereinafter also referred to as a flexible printed circuit board) with a circuit formed thereon. Called FPC), etc., used in various electronic machines.

In recent years, with the high-speed signal transmission of electronic devices, the electrical signals transmitted in the circuit have become high-frequency, and the low dielectric constant and low dielectric loss factor of polyimide as a substrate material are increasingly required. With the continuous development of high frequency, it is considered that a material with low dielectric constant and low dielectric loss factor is required in the region of 5 GHz or higher, and further in the region of 10 GHz or higher. Furthermore, the propagation speed of signals in electronic circuits decreases as the dielectric constant of the substrate material increases. In addition, if the dielectric constant and the dielectric loss factor increase, the transmission loss of the signal will also increase. Therefore, low dielectric constant and low dielectric loss factor of polyimide as a substrate material, and further reduction of transmission loss in the state of being made into FPC, etc., are important for high performance of electronic equipment.

As a film used for a circuit board suitable for high frequency, an insulating resin layer is known, and the insulating resin layer is a polyimide resin mixed with a resin powder having a relatively low dielectric constant. For example, Patent Document 1 discloses an example of using a polyimide containing a fine powder of a fluorine-based resin for a circuit board.

In addition, Patent Document 2 describes that it is effective to lower the dielectric constant and lower the dielectric loss of polyimide as a substrate material. As a representative method of wiring high-speed transmission lines in an FPC, a strip line and a microstrip line are known. The structure of the microstrip line is simple, and the transmission line is wired on the surface layer of the substrate, so it has excellent signal characteristics and can be manufactured at low cost. In addition, the strip line is covered by two GND (Ground, ground) planes, so compared with the microstrip line, it has the characteristic of suppressing electromagnetic interference (EMI). In recent years, among various characteristics, the demand for low transmission characteristics has increased, so that microstrip lines with excellent transmission characteristics have been used in many cases. On the other hand, in order to reduce the transmission loss by the strip line, it is described that it is effective to lower the dielectric constant and lower the dielectric loss of polyimide as a substrate material (Patent Document 2). [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Laid-Open Patent Publication "Japanese Unexamined Patent Publication No. 2017-78102" [Patent Document 2] Japanese Laid-Open Patent Publication "Japanese Unexamined Patent Publication No. 2018-145303"

[Problems to be Solved by Invention] However, as a method for reducing transmission loss, Patent Document 2 only mentions lowering the dielectric loss of polyimide as a substrate material, and cannot achieve lower transmission loss in a flexible metal-laminated laminate . There is a limit to the low dielectric constant and low dielectric loss of polyimide, and the subject of the present invention is to provide a method for manufacturing a flexible metal-laminated laminate, and a flexible metal-laminated sheet with low transmission loss Laminated board, so that the flexible metal laminated board can achieve lower transmission loss.

[Technical means to solve problems] As a result of earnest research by the present inventors, it was found that the above-mentioned problems can be solved by the configuration described below. That is, the present invention has the following configuration.

One embodiment of the present invention relates to a flexible metal-laminated laminate, which is characterized in that: it has a microstrip line structure, and at least sequentially includes a signal line/a first polyimide layer/ground layer, the above-mentioned The thickness of the first polyimide layer is 75-200 μm, and the dielectric loss at 10 GHz is 0.008 or less.

In addition, an embodiment of the present invention relates to a method for manufacturing a flexible metal-laminated laminate, characterized in that it is a method for manufacturing a flexible metal-laminated laminate having a microstrip line structure, wherein the above-mentioned flexible The metal bonded laminate has at least a signal line/first polyimide layer/ground layer in this order, and a polyimide film with a thickness of 75-200 μm and a dielectric loss of 0.008 or less at 10 GHz is used as the The above-mentioned first polyimide layer.

[Effect of invention] According to the present invention, it is possible to provide a method for manufacturing a flexible metal-bonded laminate that can easily avoid transmission loss of the flexible metal-bonded laminate, and a flexible metal-bonded laminate with a small transmission loss. The above-mentioned flexible metal-laminated laminate is suitable for flexible applications and antenna applications in place of coaxial cables that require high-speed and high-frequency transmission paths.

The flexible metal-laminated laminate of the present invention is characterized in that it has a microstrip line structure, and at least sequentially includes a signal line/a first polyimide layer/ground layer, and the thickness of the first polyimide layer is 75～200 μm, and the dielectric loss at 10 GHz is less than 0.008.

In addition, the flexible metal-laminated laminate of the present invention may further include a ground layer/second polyimide layer/adhesive layer, at least a ground layer/second polyimide layer/adhesive layer/signal in this order Line/first polyimide layer/ground layer, the thickness of the second polyimide layer is 75-200 μm and the dielectric loss at 10 GHz is 0.008 or less.

Furthermore, in the specification of this case, "a flexible metal-laminated laminate having a microstrip line structure" means "a flexible metal-laminated laminate having at least a signal line/first polyimide layer/ground layer in this order. laminate". In addition, "a flexible metal-laminated laminate having a stripline structure" means "having at least a ground layer/second polyimide layer/adhesive layer/signal line/first polyimide layer/ Flexible metal-laminated laminates for ground planes”.

First, the polyimide film used for the first polyimide layer and the second polyimide layer of the present invention will be described. The thickness of the polyimide film used in the first polyimide layer and the second polyimide layer is 75-200 μm, and the dielectric loss at 10 GHz is 0.008 or less. By using the polyimide film, the insertion loss at 10 GHz of a flexible metal-laminated laminate with a microstrip line structure and a flexible metal-laminated laminate with a stripline structure can be - 3.2 dB above 0 dB below.

In order to easily manufacture a flexible metal-laminated laminate, it is preferable that the first polyimide layer has a thermoplastic polyimide layer and a non-thermoplastic polyimide layer, or the first polyimide layer and the second polyimide layer each has a thermoplastic polyimide layer and a non-thermoplastic polyimide layer.

The polyimide film used for each of the first polyimide layer and the second polyimide layer is not particularly limited, as long as the thickness is 75 to 200 μm, and the dielectric loss at 10 GHz is 0.008 or less. Can. On the other hand, it is preferable to use a polyimide film having a multi-layer structure having a three-layer structure having thermoplastic polyimide layers on both surfaces of the non-thermoplastic polyimide layers. Although this case increases the lamination step compared with the case of using a single layer of polyimide, the overall manufacturing cost of the film tends to decrease, so it is desirable.

As the polyimide film used for each of the first polyimide layer and the second polyimide layer, the following films are particularly preferred. That is, when at least two or more polyimide films having a three-layer structure with a thickness of less than 75 μm are laminated (crimped) and made into a thickness of 75 to 200 μm, the three-layer structure is based on a non-thermoplastic polyimide film. Both sides of the imine layer have thermoplastic polyimide layers. Thereby, the total manufacturing cost of the film can be minimized, which is ideal.

(Polyimide adhesive sheet: Polyimide film having a three-layer structure with thermoplastic polyimide layers on both sides of non-thermoplastic polyimide layers) The following describes a polyimide film having a three-layer structure having a thermoplastic polyimide layer on both surfaces of a non-thermoplastic polyimide layer. For convenience, a polyimide film having a three-layer structure with a thermoplastic polyimide layer on both sides of the non-thermoplastic polyimide layer is referred to as a polyimide adhesive sheet. First, the non-thermoplastic polyimide precursor used in the non-thermoplastic polyimide layer, that is, the raw material monomer of polyimide, and the above-mentioned non-thermoplastic polyimide precursor of the polyimide The production, the production method of the non-thermoplastic polyimide film, and the thermoplastic polyimide layer will be described in detail.

(Non-thermoplastic polyimide precursor is the raw material monomer of polyimide) Regarding the non-thermoplastic polyimide precursor in the present invention, that is, the raw material monomer of polyimide, the non-thermoplastic polyimide obtained by amination of the polyimide as the precursor is not particularly limited. , to meet the following requirements. That is, the above-mentioned non-thermoplastic polyimide is not particularly limited, as long as it has the solder heat resistance, dimensional stability, and flame retardancy required by the previous flexible printed circuit board materials, and can be controlled by the primary structure and the manufacturing method. Solder heat resistance, dimensional stability, and flame retardancy are sufficient. As the above-mentioned raw material monomers, for example, diamines and acid dianhydrides generally used for the synthesis of polyamic acid can be used.

The diamine is not particularly limited as long as the effects of the present invention can be exhibited, and examples thereof include 2,2'-bis[4-(4-aminophenoxy)phenyl]propane, 4,4'-bis Aminodiphenylpropane, 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenyl sulfide, 3,3'-diaminodiphenyl sulfide, 4,4' -Diaminodiphenylamine, 4,4'-oxydiphenylamine, 3,3'-oxydiphenylamine, 3,4'-oxydiphenylamine, 4,4'-diaminodiphenyldiethyl Silane, 4,4'-diaminodiphenylsilane, 4,4'-diaminodiphenylethylphosphine oxide, 4,4'-diaminodiphenyl N-methylamine, 4, 4'-Diaminodiphenyl N-aniline, 1,4-diaminobenzene (p-phenylenediamine), bis{4-(4-aminophenoxy)phenyl}benzene, bis{4- (3-aminophenoxy) phenyl} bismuth, 4,4'-bis(4-aminophenoxy)biphenyl, 4,4'-bis(3-aminophenoxy)biphenyl, 1,3-bis(3-aminophenoxy)benzene, 1,3-bis(3-aminophenoxy)benzene, 3,3'-diaminobenzophenone, 4,4'- Diaminobenzophenone, 2,2-bis(4-aminophenoxyphenyl)propane, and the like, may be used alone or in combination.

Examples of diamines useful for realizing low dielectric loss include aliphatic diamines having 36 carbon atoms, 1,4-diaminobenzene (p-phenylenediamine), 1,3-bis(4-amino) phenoxy)benzene, 1,3-bis(3-aminophenoxy)benzene, 4,4'-diamino-2,2'-dimethylbiphenyl, 4,4'-diamino -3,3'-Dimethylbiphenyl, 4,4'-diamino-2,2'-bis(trifluoromethyl)biphenyl, 4,4'-diamino-p-terphenyl, bis (4-Aminophenyl) terephthalate, 2,2-bis(4-aminophenoxyphenyl)propane, 2,2-bis(4-aminophenoxyphenyl)hexanoate Fluoropropane, 4,4'-bis(4-aminophenoxy)biphenyl, etc. These diamines are preferably contained in 30 to 100 mol % in the total diamine component, more preferably 50 to 100 mol %, and still more preferably 70 to 100 mol %.

In addition, the acid dianhydride-based compound that can be used as a raw material monomer of polyamic acid is not particularly limited, as long as the effect of the present invention can be exhibited, and examples include: pyromellitic dianhydride, 2,3,6, 7-Naphthalenetetracarboxylic dianhydride, 3,3',4,4'-biphenyltetracarboxylic dianhydride, 1,2,5,6-Naphthalenetetracarboxylic dianhydride, 2,2',3,3 '-Biphenyltetracarboxylic dianhydride, 3,3',4,4'-benzophenone tetracarboxylic dianhydride, 2,2',3,3'-benzophenone tetracarboxylic dianhydride, 4,4'-Oxyphthalic dianhydride, 3,4'-Oxyphthalic dianhydride, 2,2-bis(3,4-dicarboxyphenyl)propionic dianhydride, 3,4, 9,10-Perylenetetracarboxylic dianhydride, bis(3,4-dicarboxyphenyl)propionic acid dianhydride, 1,1-bis(2,3-dicarboxyphenyl)ethane dianhydride, 1,1 -Bis(3,4-dicarboxyphenyl)ethane dianhydride, bis(2,3-dicarboxyphenyl)formic acid dianhydride, bis(3,4-dicarboxyphenyl)acetic acid dianhydride, oxygen di-ortho Phthalic acid dianhydride, bis(3,4-dicarboxyphenyl)sulfonic acid dianhydride, p-phenylene bis(trimellitic acid monoester anhydride), ethylidene bis(trimellitic acid monoester anhydride) , bisphenol A bis (trimellitic acid monoester anhydride) and the likes of these.

Examples of acid dianhydrides useful for realizing low dielectric loss include 3,3',4,4'-biphenyltetracarboxylic dianhydride, p-phenylene bis(trimellitic acid dianhydride), 4,4'-oxydiphthalic dianhydride, 2,2'-bis(4-(3,4-dicarboxyphenoxy)phenyl)propionic dianhydride, pyromellitic dianhydride and the like. These acid dianhydrides are preferably contained in the total acid dianhydride in an amount of 30 to 100 mol %, more preferably 50 to 100 mol %, and still more preferably 70 to 100 mol %.

The said 1st polyimide layer and the 2nd polyimide layer can be manufactured by the following method, for example. That is, by using the above-mentioned diamine and the above-mentioned acid dianhydride as raw materials, a ring-opening multi-addition reaction can be performed in a solvent to obtain a polyamic acid solution, and then the polyamic acid is heated to carry out a dehydration cyclization reaction (imide amide). amination) method. Accordingly, the dielectric loss of the first polyimide layer and the second polyimide layer at 10 GHz can be controlled within the range of 0.008 or less.

(Manufacture of Polyamic Acid as Precursor of Non-thermoplastic Polyimide) As the organic solvent used in the production of the polyamic acid as the precursor of the non-thermoplastic polyimide, any solvent that dissolves the non-thermoplastic polyamic acid can be used. For example, it is preferable to use an amide-based solvent, that is, N,N-dimethylformamide, N,N-dimethylacetamide, N-methyl-2-pyrrolidone, etc., and it is more preferable to use N , N-dimethylformamide, N,N-dimethylacetamide. The solid content concentration of the polyimide as the precursor of the non-thermoplastic polyimide is not particularly limited, and as long as it is in the range of 5% by weight to 35% by weight, it can be used to prepare the non-thermoplastic polyimide. The film has sufficient mechanical strength as a polyamic acid as a precursor of a non-thermoplastic polyimide.

The order of addition of the aromatic diamines and aromatic acid dianhydrides as raw materials is also not particularly limited, but not only the chemical structure of the raw materials but also the order of addition can be used to control the amount of the obtained non-thermoplastic polyimide. characteristic.

Fillers can be added to the above-mentioned non-thermoplastic polyamides to improve various properties of the film such as sliding property, thermal conductivity, electrical conductivity, corona resistance, ring stiffness and the like. Anything can be used as the filler, and preferable examples include silicon dioxide, titanium oxide, aluminum oxide, silicon nitride, boron nitride, calcium hydrogen phosphate, calcium phosphate, mica, and the like.

(Manufacturing method of non-thermoplastic polyimide film) In order to obtain the non-thermoplastic polyimide film of the present invention, the following steps are preferably included: i) The reaction of aromatic diamine and aromatic acid dianhydride in an organic solvent to obtain a polyamic acid solution (hereinafter also referred to as non-thermoplastic polyamic acid) as a precursor of non-thermoplastic polyimide step; ii) the step of forming a resin layer (sometimes also referred to as a liquid film) by casting the film-forming additive comprising the above-mentioned non-thermoplastic polyamide solution onto a support from a mold; iii) after heating the resin layer on the support to make a self-sustaining gel film, the step of peeling the gel film from the support; iv) A step of further heating, imidizing the remaining amide acid, and drying it to obtain a non-thermoplastic polyimide film.

In the subsequent step of ii), the imidization method can be roughly divided into thermal imidization method and chemical imidization method. The thermal imidization method is a method of carrying out imidization only by heating, without using a dehydration ring-closing agent or the like, but using a polyamic acid solution as a film-forming additive to cast on a support. Another chemical imidization method is to add at least any one of a dehydration ring-closing agent and a catalyst to the polyimide solution as an imidization accelerator to make a film-forming additive and use it to promote imidization. method of transformation. Either method can be used, but the chemical imidization method is excellent in productivity.

As the dehydration ring-closing agent, acid anhydrides typified by acetic anhydride are suitably used. As the catalyst, tertiary amines such as aliphatic tertiary amines, aromatic tertiary amines, and heterocyclic tertiary amines are suitably used.

As a support for casting the film-forming additive, a glass plate, an aluminum foil, an endless stainless steel belt, a stainless steel drum, etc. are suitably used. The heating conditions are set according to the thickness and production speed of the finally obtained film. After at least partial imidization or drying, the polyamide film (hereinafter referred to as gel film) is obtained by peeling off the support. .

The end of the gel film is fixed to avoid shrinkage during hardening, drying is performed to remove water, residual solvent and imidization accelerator on the gel film, and then the remaining imidization of the imidized acid is completed to obtain Films containing polyimide. The heating conditions may be appropriately set according to the thickness of the finally obtained film and the production speed.

(thermoplastic polyimide (layer)) The thermoplastic polyimide contained in the thermoplastic polyimide (layer) in the present invention can be obtained by imidizing a polyimide as its precursor.

As the thermoplastic polyimide precursor used in the present invention, that is, polyamic acid, the aromatic diamine and aromatic tetracarboxylic dianhydride used therefor can be exemplified by those used in the non-thermoplastic polyimide layer. the same. On the other hand, in order to prepare a thermoplastic polyimide film, it is preferable to react a flexible diamine and an acid dianhydride. As an example of the diamine having flexibility, 4,4'-diaminodiphenyl ether, 4,4'-bis(4-aminophenoxy)biphenyl, 4,4'-bis (3-aminophenoxy)biphenyl, 1,3-bis(3-aminophenoxy)benzene, 1,3-bis(4-aminophenoxy)benzene, 2,2-bis( 4-aminophenoxyphenyl) propane and the like. In order to adjust the glass transition temperature (Tg) of the above-mentioned polyimide film, the above-mentioned diamine can be combined with 1,4-diaminobenzene and/or 4,4'-diamino-2,2'-dimethyl Benzene is used. Moreover, as an example of the acid dianhydride suitable to be combined with these diamines, pyromellitic dianhydride, 3,3',4,4'-benzophenone tetracarboxylic dianhydride, 3,3', 4,4'-benzophenone tetracarboxylic dianhydride, 3, 3',4,4'-biphenyltetracarboxylic dianhydride, 4,4'-oxydiphthalic dianhydride, etc.

For the production method of the thermoplastic polyimide in the present invention, any known method can be used as long as the obtained thermoplastic polyimide can satisfy the following requirements. That is, the thermoplastic polyimide obtained by imidizing the obtained polyimide has the adhesiveness to metal foil, solder heat resistance, and dimensional stability required by the conventional flexible printed circuit board materials. , flame retardancy, any known method can be used.

For example, it can be produced by the following steps (A-a) to (A-c): (A-a) The step of reacting an aromatic diamine and an aromatic acid dianhydride in an organic solvent in an excess of the aromatic diamine to obtain a prepolymer having amine groups at both ends; (A-b) an additional step of adding an aromatic diamine having a different structure from that used in step (A-a); (Ac) and then adding an aromatic acid dianhydride having a structure different from that used in the step (Aa) in such a way that the aromatic diamine and the aromatic acid dianhydride in the step become substantially equimolar to carry out the polymerization step .

Or can also obtain polyamic acid by following steps (B-a)～(B-c): (B-a) the step of reacting an aromatic diamine and an aromatic acid dianhydride in an organic polar solvent in an excess of the aromatic acid dianhydride to obtain a prepolymer having acid anhydride groups at both ends; (B-b) an additional step of adding an aromatic acid dianhydride having a different structure from that used in step (B-a); (Bc) The step of polymerizing by adding an aromatic diamine having a different structure from that used in step (Ba) so that the aromatic diamine and the aromatic acid dianhydride in all steps are substantially equimolar. .

(Solid Content Concentration of Polyamide) The solid content concentration of the polyamic acid of the present invention is not particularly limited, but is usually obtained at a concentration of 5 to 35% by weight, preferably 10 to 30% by weight. If the concentration is within this range, appropriate molecular weight and solution viscosity can be obtained.

(Manufacturing method of polyimide adhesive sheet) The manufacturing method of the laminated body which has a thermosetting resin layer and a polyimide layer in this invention is demonstrated in detail. The manufacturing method of the layered product in the present invention can, for example, synthesize the non-thermoplastic polyimide in the above i), and then perform the above steps ii) to iv) to coat the thermoplastic polyimide film on both sides of the temporarily recovered non-thermoplastic polyimide film. Polyamic acid, followed by imidization. Moreover, a thermoplastic polyimide solution which can form a thermoplastic polyimide layer can be applied to both surfaces of the non-thermoplastic polyimide film, and dried to form a polyimide adhesive sheet.

As another method, the following method is mentioned. In the above-mentioned i), a non-thermoplastic polyamic acid was synthesized, and at the same time, a polyamic acid (hereinafter referred to as thermoplastic polyamic acid) as a precursor of thermoplastic polyimide was separately synthesized. In the above step ii), the additive comprising thermoplastic polyamic acid/the film forming additive comprising the above-mentioned non-thermoplastic polyamic acid solution/the additive comprising thermoplastic polyamic acid are sequentially cast to the support from the mold A three-layer structure is formed thereon, and a resin layer (sometimes also referred to as a liquid film) is formed. The steps of iii) and iv) are carried out in the same manner as follows to prepare the polyimide adhesive sheet of the present invention.

<Flexible metal-laminated laminate with microstrip structure> The following flexible metal-laminated laminates are described, which are characterized by having a microstrip line structure, a signal line/first polyimide layer/ground layer in this order, and the above-mentioned first polyimide layer/ground layer. 1 The thickness of the polyimide layer is 75-200 μm, and the dielectric loss at 10 GHz is below 0.008.

As shown in FIG. 1 , the flexible metal-laminated laminate having a microstrip line structure of the present invention has a signal line/first polyimide layer/ground layer in sequence. In addition, a polyimide film having a thickness of 75 to 200 μm and a dielectric loss at 10 GHz of 0.008 or less is used for the first polyimide layer. In this way, the insertion loss at 10 GHz can be kept from -2.4 dB to 0 dB.

Moreover, as shown in FIG. 2, you may have a plurality of signal lines.

<Manufacturing method of flexible metal-laminated laminate with microstrip structure> As shown in Figure 3, a plurality of polyimide adhesive sheets (polyimide adhesive sheets having a three-layer structure with thermoplastic polyimide layers on both sides of the non-thermoplastic polyimide layer) are sandwiched between two copper foils. amine film), and lamination together. Then, etching is performed to form signal lines, whereby a microstrip line structure can be easily formed.

A single-layer thermoplastic polyimide film can also be used instead of the above-mentioned polyimide adhesive sheet, and the following method can be used. That is, for example, overlapping copper foil/monolayer thermoplastic polyimide/non-thermoplastic polyimide/monolayer thermoplastic polyimide/non-thermoplastic polyimide/monolayer thermoplastic polyimide in sequence Imide/copper foil can also be made by laminating together. In this case, the total thickness of the thermoplastic polyimide and the non-thermoplastic polyimide (thickness of the polyimide layer) is preferably 75 μm or more.

(thermoplastic polyimide (single layer)) The above thermoplastic polyimide (single layer) is the same polyamide as the polyamide acid as the precursor of the thermoplastic polyimide described in the item "Thermoplastic polyimide (layer)". The acid is imidized to form a sheet (film). The production of the above thermoplastic polyimide (monolayer) is preferably carried out by the same method as the production method of the non-thermoplastic polyimide film.

(Non-thermoplastic polyimide (single layer)) The above-mentioned non-thermoplastic polyimide (monolayer) is obtained by imidizing the same polyamic acid as the non-thermoplastic polyimide precursor to obtain a single-layer sheet ( membrane). The production of the above-mentioned non-thermoplastic polyimide (monolayer) is preferably carried out by the same method as the production method of the non-thermoplastic polyimide film.

Various well-known methods can be used as the method of lamination, but in order to suppress the generation of wrinkles and the like of the single-sided flexible metal-bonded laminate, a thermocompression bonding method obtained by bonding by thermocompression bonding is preferred. As a method of laminating a polyimide adhesive sheet and a metal foil, for example, a thermocompression bonding method in which batch processing is performed by pressing a single plate, a lamination apparatus using a hot roll (also referred to as a thermolamination apparatus) can be exemplified. Or a thermocompression bonding method for continuous processing by a double belt pressing (DBP) device. Among them, a thermocompression bonding method using a heat roll lamination apparatus having a pair of metal rolls or more is preferred in terms of productivity and equipment cost including maintenance costs. The "hot roll lamination apparatus having a pair of metal rolls" here is not particularly limited as long as it has a metal roll for heating and pressing the material.

In terms of helping to reduce transmission loss, the surface roughness (Ra) on the side of the first polyimide layer of the signal line is preferably small, but it is also necessary to ensure adhesion. Therefore, it is preferably 0.05 μm to 0.5 μm, more preferably 0.08 μm to 0.3 μm, and still more preferably 0.1 μm to 0.2 μm. The surface roughness depends on the surface roughness on the side of the polyimide layer, so it can be controlled by the metal foil used.

As a method of forming the ground layer, the method of bonding metal foil will be described, but one or both of the ground layers may be formed by applying a conductive paste and drying, or a conductive shielding film may be bonded to form the ground layer. one or both.

Various well-known methods can be applied as the method of lamination, but in order to suppress the occurrence of defects in appearance of the double-sided flexible metal-laminated laminate, a thermocompression bonding method obtained by lamination by thermocompression bonding is preferred. As a bonding method, for example, a thermocompression bonding method in which batch processing is performed by pressing a single plate, a hot roll lamination apparatus (also referred to as a thermal lamination apparatus), or a double tape press (DBP) apparatus can be mentioned. Thermocompression bonding method of continuous processing, etc. From the viewpoint of productivity and equipment cost including maintenance costs, a thermocompression bonding method using a heat roll lamination apparatus having a pair of metal rolls or more is preferred. The "hot roll lamination apparatus having a pair of metal rolls" here is not particularly limited as long as it has a metal roll for heating and pressing the material.

In this thermocompression bonding method, since the metal foil is subjected to high heat treatment twice during the manufacture of the single-sided flexible metal-laminated laminate and during the manufacture of the double-sided flexible metal-laminated laminate, there is a possibility that the metal foil may be burnt. Coke and thermal deformation easily lead to the problem of poor appearance. In order to improve thermal deformation, in the above-mentioned thermocompression bonding method, a thermocompression bonding method using a thermoroller lamination device having more than one pair of metal rollers is used, and the tension of the metal foil and the single-sided flexible metal-laminated laminate is , or the tension of metal foil and double-sided flexible metal laminated laminate can be controlled. Specifically, it is preferable to set the tension before thermocompression bonding high, and it is preferable to set the supply tension of the single-sided flexible metal-laminated laminate, or the supply of the double-sided flexible metal-laminated laminate. The tension is set to 40 kgf/270 mm or more. Moreover, in order to improve scorch, it is preferable to use a protective film at the time of hot roll lamination.

The heating method of the material to be laminated in the above-mentioned thermocompression bonding mechanism is not particularly limited, and for example, conventionally known heating mechanisms that can heat at a specific temperature, such as a thermal cycle method, a hot air heating method, and an induction heating method, can be used. Likewise, the pressurizing method of the material to be laminated in the above thermocompression bonding mechanism is not particularly limited, and for example, conventionally known pressurizing mechanisms that can apply a specific pressure such as hydraulic pressure, air pressure, and gap pressure can be used.

Regarding the heating temperature in the above-mentioned thermocompression bonding step, that is, the pressure bonding temperature (lamination temperature), in the production of the single-sided flexible metal-laminated laminate, the polyimide adhesive sheet on the side that is in close contact with the metal foil is The temperature should just be the minimum temperature which can be closely contacted with the metal foil. In addition, the polyimide adhesive sheet on the side not in close contact with the metal foil may be at a temperature that does not adhere to other materials, peripheral members, and the like. Therefore, the lamination temperature during the manufacture of the single-sided flexible metal-laminated laminate may be set to the glass transition temperature (Tg)+20°C to (Tg)+60°C of the polyimide adhesive sheet used.

Furthermore, when the above-mentioned polyimide adhesive sheet is heated at a temperature exceeding Tg, the above-mentioned polyimide adhesive sheet becomes soft as the heating temperature becomes high, and it becomes easy to adhere to peripheral members. At this time, since the polyimide adhesive sheet on the side not in close contact with the metal foil may come into contact with peripheral members during processing, it is preferable that the adhesiveness is low. Therefore, it is preferable to use the above lamination temperature.

On the other hand, in the manufacture of double-sided flexible metal-laminated laminates, it is desirable that the adhesion of each layer is high. Therefore, lamination can be performed at a higher temperature than that of single-sided flexible metal-laminated laminates. Therefore, the lamination temperature during the manufacture of the double-sided flexible metal-laminated laminate is preferably the glass transition temperature (Tg)+20℃～(Tg)+90℃ of the polyimide adhesive sheet used, and more It is preferably Tg+50°C to (Tg)+80°C of the adhesive sheet (C).

The lamination speed in the above-mentioned thermocompression bonding step is preferably 0.5 m/min or more, more preferably 1.0 m/min or more. If it is 0.5 m/min or more, sufficient thermocompression bonding can be performed, and if it is 1.0 m/min or more, productivity can be further improved.

The higher the pressure in the above-mentioned thermocompression bonding step, that is, the higher the lamination pressure, the lower the lamination temperature and the faster the lamination speed. Dimensional changes show a worsening trend. On the other hand, when the lamination pressure is too low, the adhesive strength of the metal foil of the obtained metal-laminated laminate tends to decrease. Therefore, the lamination pressure is preferably in the range of 49 N/cm to 490 N/cm (5 kgf/cm to 50 kgf/cm), more preferably in the range of 98 N/cm to 294 N/cm (10 kgf/cm cm to 30 kgf/cm). Within this range, all three conditions of lamination temperature, lamination speed, and lamination pressure can be made favorable, and productivity can be further improved.

In order to obtain the single-sided flexible metal-laminated laminate or the double-sided flexible metal-laminated laminate of the present invention, it is preferable to use a hot roll lamination device that continuously heats the material to be laminated and performs pressure-bonding. In the hot roll lamination device, a lamination material unwinding mechanism for winding out the laminated material can be provided in the front stage of the hot lamination mechanism, and a lamination material for winding up the laminated material can also be provided in the rear stage of the hot lamination mechanism. take-up mechanism. By providing these mechanisms, the productivity of the above-mentioned hot roll lamination apparatus can be further improved. The specific configuration of the above-mentioned lamination material unwinding mechanism and lamination material winding mechanism is not particularly limited, and for example, a well-known roll-shaped roll capable of winding up adhesive sheets, metal foils, or obtained metal-laminated laminates can be exemplified. Pick up and so on.

Furthermore, it is more preferable to provide a take-up mechanism or a take-up mechanism that can take up or take out the protective film. By having these winding mechanisms and unwinding mechanisms, the protective film that has been used once can be wound up in the thermocompression bonding step and placed on the unwinding side again, whereby the protective film can be reused. Moreover, when winding up a protective film, an edge part position detection mechanism and a winding position correction mechanism can be provided so that these both ends may be aligned. Thereby, since these end parts can be aligned with high precision and coiled, the efficiency of reuse can be improved. In addition, the specific configuration of the winding mechanism, the winding-out mechanism, the end position detection mechanism, and the winding position correction mechanism is not particularly limited, and various conventionally known devices can be used.

(metal foil) The metal foil that can be used in the present invention is not particularly limited. When the flexible metal-laminated laminate of the present invention is used for electronic equipment and electrical equipment, for example, copper or copper alloys, stainless steel or its alloys, nickel or nickel alloys (including 42 alloys) can be exemplified. , aluminum or aluminum alloy foil. In general flexible laminates, copper foils such as rolled copper foil and electrolytic copper foil are often used, and these can also be suitably used in the present invention. Furthermore, the surfaces of these metal foils may be coated with a rust-proof layer, a heat-resistant layer, or an adhesive layer. Moreover, the thickness of the said metal foil is not specifically limited, According to the use, it can set the thickness which can exhibit a sufficient function.

Transmission loss mainly includes conductor loss caused by copper foil and dielectric loss caused by insulating resin base material. The conductor loss is affected by the skin effect of the copper foil, which is more pronounced at higher frequencies. Therefore, in order to suppress the transmission loss in high-frequency applications, the roughness of the copper foil is required to be low. In addition, it is known that the electrical conductivity of alloys containing magnetic substances such as nickel and cobalt for improving rust prevention and adhesion varies with frequency, which may lead to poor transmission loss, so care should be taken during use.

The thickness of the metal foil is, for example, preferably 3 μm to 30 μm, more preferably 5 μm to 20 μm. In consideration of the adhesion with the polyimide layer, the surface roughness (Ra) of the metal foil is preferably 0.05 μm to 0.5 μm, more preferably 0.08 μm to 0.3 μm, and still more preferably 0.1 μm to 0.2 μm. When the surface roughness (Ra) is smaller than this range, the adhesion with the polyimide layer will be low, and when Ra is larger than this range, the conductor loss will be large, making it difficult to reduce the transmission loss.

<Surface Treatment of Polyimide Adhesive Sheet> The polyimide adhesive sheet has an adhesive layer on the outermost layer, so it is not necessary to carry out the usual surface treatment to improve the adhesion. However, when the adhesive sheets are attached to each other, they become the same material, so the surface states of each other become the same, so that the anchoring effect becomes smaller and the adhesiveness tends to become lower. At this time, the adhesion force of the polyimide adhesive sheets can be improved by performing the surface treatment of the adhesive layer, which is usually not performed, on at least one of the bonding surfaces.

It does not specifically limit as a method of surface treatment, For example, corona treatment, plasma treatment, sand blasting, etc. can be used.

<Flexible metal-laminated laminate with stripline structure> A flexible metal-laminated laminate having a stripline structure and having at least a ground layer/second polyimide layer/adhesive layer/signal line/first polyimide layer/ground layer in this order will be described.

As shown in FIG. 4 , the flexible metal-laminated laminate with a stripline structure of the present invention sequentially includes a ground layer/second polyimide layer/adhesive layer (adhesive layer 1)/signal line/first 1 polyimide layer/ground plane. In addition, a polyimide film having a thickness of 75 to 200 μm and a dielectric loss at 10 GHz of 0.008 or less was used for the first polyimide layer and the second polyimide layer, respectively. As a result, the insertion loss at 10 GHz can be set to -3.2 dB or more and 0 dB or less.

Moreover, as shown in FIG. 5, you may have an adhesive agent layer (adhesive agent layer 2) between a copper layer which is a signal line, and a 1st polyimide layer.

Furthermore, as shown in FIG. 6, you may have a plurality of signal lines.

As shown in FIG. 7 , the flexible metal-laminated laminate with a stripline structure of the present invention can be obtained by combining the single-sided flexible metal-laminated laminate (ground layer/second polyimide layer) with The adhesive layer (bonding sheet) and the double-sided flexible metal bonding laminate were bonded and manufactured. An example in which a bonding sheet is used for the adhesive layer is described here. On the other hand, instead of using the bonding sheet, the adhesive can be bonded by coating the polyimide surface of the single-sided flexible metal-laminated laminate or on the polyimide surface of the double-sided flexible metal-laminated laminate. A flexible metal-bonded laminate was produced in the same manner.

<Manufacturing method of single-sided flexible metal-laminated laminate> In the present invention, the single-sided flexible metal-laminated laminate can be made into the above-mentioned polyimide adhesive sheet (having a three-layer structure with thermoplastic polyimide layers on both sides of the non-thermoplastic polyimide layers) The thermoplastic polyimide layer of the polyimide film) of the adhesive layer is obtained by laminating the metal foil (ground layer). As shown in Figure 8, a plurality of polyimide adhesive sheets with a thickness of 75 μm or less can be laminated (laminated) to form an adhesive layer with a thickness of 75 μm or more, and then a metal layer can be laminated on one side to form an adhesive layer. A single-sided flexible metal-laminated laminate. Moreover, as shown in FIG. 9, a metal foil and a plurality of polyimide adhesive sheets may be bonded together to form a single-sided flexible metal-bonded laminate.

In FIG. 9, an example of using a polyimide adhesive sheet (a polyimide film having a three-layer structure with thermoplastic polyimide layers on both sides of a non-thermoplastic polyimide layer) is shown, and also As shown in FIG. 10, metal foil (ground layer)/thermoplastic polyimide (single layer)/non-thermoplastic polyimide (single layer) can be laminated in sequence. In this case, the total thickness of the thermoplastic polyimide and the non-thermoplastic polyimide is preferably 75 μm or more.

(thermoplastic polyimide (single layer)) The thermoplastic polyimide (single layer) and the thermoplastic polymer in the flexible metal-laminated laminate with a microstrip line structure of the present invention (hereinafter referred to as "flexible metal-laminated laminate 1") Imide (monolayer) is the same. That is, it is produced by imidizing the same polyamic acid as the polyamic acid as the thermoplastic polyimide precursor described in the above-mentioned section "Thermoplastic polyimide (layer)" Sheet (film) who. The production of the above thermoplastic polyimide (monolayer) is preferably carried out by the same method as the production method of the non-thermoplastic polyimide film.

(Non-thermoplastic polyimide (single layer)) The above-mentioned non-thermoplastic polyimide (single layer) is the same as the non-thermoplastic polyimide (single layer) in the above-mentioned flexible metal-laminated laminate 1 . That is, it is a single-layer sheet (film) obtained by imidizing the same polyamic acid as the non-thermoplastic polyimide precursor. The production of the above-mentioned non-thermoplastic polyimide (monolayer) is preferably carried out by the same method as the production method of the non-thermoplastic polyimide film.

Furthermore, as shown in FIG. 11, a plurality of metal foil (ground layer)/thermoplastic polyimide/non-thermoplastic polyimide/thermoplastic polyimide/non-thermoplastic polyimide may be overlapped in order (thermoplastic polyimide/non-thermoplastic polyimide) layer and lamination. In this case, the total thickness of the thermoplastic polyimide and the non-thermoplastic polyimide is 75 μm or more.

As the method of lamination, various known methods can be applied, and the same method as the lamination method in the above-mentioned manufacturing method of the flexible metal-laminated laminate 1 can be adopted.

<Manufacturing method of double-sided flexible metal-laminated laminate> In the present invention, the double-sided flexible metal-laminated laminate can be made into the above-mentioned polyimide adhesive sheet (having a three-layer structure with thermoplastic polyimide layers on both sides of the non-thermoplastic polyimide layers) The thermoplastic polyimide layer of the adhesive layer of the polyimide film) is obtained by laminating the metal foil. As shown in FIG. 12 , the metal foil/a plurality of polyimide adhesive sheets/metal foil can be laminated together to form a double-sided flexible metal-laminated laminate (FIG. 12b). Moreover, as shown in FIG. 13, the polyimide adhesive sheet which laminated|stacked (laminate|stacked) the polyimide adhesive sheet of the thickness of 75 micrometers or less may be used instead of a plurality of polyimide adhesive sheets. Then, the signal line can be formed by etching one surface of the double-sided flexible metal-laminated laminate (FIG. 12b, FIG. 13b). The signal lines may be plural as shown in FIG. 6 . As described above, a double-sided flexible metal-bonded laminate can be produced (FIG. 12c, FIG. 13c).

It is preferable that the surface roughness (Ra) of the 1st polyimide layer side of a signal line is small from the point which contributes to the reduction of a transmission loss. However, since it is necessary to ensure the adhesion, it is preferably 0.05 μm to 0.5 μm, more preferably 0.08 μm to 0.3 μm, and still more preferably 0.1 μm to 0.2 μm. The surface roughness depends on the surface roughness on the side of the first polyimide layer of the metal foil laminated on the double-sided flexible metal-laminated laminate, so it can be controlled by the metal foil used.

As the method of forming the ground layer, the method of bonding the metal foil will be described, but the same method as the method of forming the ground layer in the above-mentioned manufacturing method of the flexible metal-laminated laminate 1 may be employed. That is, the conductive paste may be applied and dried to form one or both of the ground layers, or a conductive shield film may be bonded to form one or both of the ground layers.

As the method of lamination, various known methods can be applied, and the same method as the lamination method in the above-mentioned manufacturing method of the flexible metal-laminated laminate 1 can be adopted.

(metal foil) The metal foil that can be used in the flexible metal-laminated laminate having a stripline structure of the present invention is not particularly limited, and the same metal foil as the metal foil in the flexible metal-laminated laminate 1 can be used. metal foil.

<Surface Treatment of Polyimide Adhesive Sheet> The polyimide adhesive sheet in the flexible metal-laminated laminate with a stripline structure is the same as the polyimide adhesive sheet in the flexible metal-laminated laminate 1, and has an adhesive layer on the outermost layer . Therefore, it is not necessary to perform general surface treatment to improve the adhesion. However, when the adhesive sheets are attached to each other, they become the same material, so the surface states of each other become the same, so that the anchoring effect becomes smaller and the adhesiveness tends to become lower. At this time, the adhesion force of the polyimide adhesive sheets can be improved by performing the surface treatment of the adhesive layer, which is usually not performed, on at least one of the bonding surfaces.

The method of surface treatment is not particularly limited, and for example, corona treatment, plasma treatment, sand blast treatment, and the like can be used.

The present invention may include the inventions shown below.

(A1) A multi-layer flexible metal-laminated laminate, characterized in that: it has a microstrip line structure, and at least sequentially has a signal line/polyimide layer/ground layer, and one of the polyimide layers is The thickness is 75-200 μm, and the dielectric loss at 10 GHz is below 0.008.

(A2) The flexible metal-laminated laminate according to (A1), wherein the insertion loss at 10 GHz is 2.4 dB or more and 0 dB or less.

(A3) The flexible metal-laminated laminate according to (A1) or (A2), wherein the polyimide layer has a thermoplastic polyimide layer and a non-thermoplastic polyimide layer .

(A4) The flexible metal-laminated laminate as described in any one of (A1) to (A3), wherein the polyimide layer has thermoplastic polyimide on both sides of the non-thermoplastic polyimide layer. Three-layer structure of polyimide layer.

(A5) The flexible metal-laminated laminate according to (A4), wherein the polyimide layer is a laminate of two or more polyimide films, and the polyimide film has a thickness of Less than 75 μm and has the above-mentioned three-layer structure.

(A6) The flexible metal-laminated laminate according to any one of (A1) to (A5), characterized by having two or more signal lines.

(A7) The flexible metal-laminated laminate according to any one of (A1) to (A6), wherein the surface roughness (Ra) of the signal line on the side of the polyimide layer is 0.05 μm～0.5 μm.

(A8) A method of manufacturing a flexible metal-laminated laminate, characterized in that it is a method of manufacturing a flexible metal-laminated laminate having a microstrip line structure, wherein the multilayer flexible metal-laminated laminate is It has at least a signal line/polyimide layer/ground layer in sequence. The polyimide layer is a polyimide film with a thickness of 75-200 μm and a dielectric loss of 0.008 or less at 10 GHz.

(A9) The method for producing a flexible metal-laminated laminate according to (A8), wherein the insertion loss at 10 GHz is 2.4 dB or more and 0 dB or less.

(A10) The method for producing a flexible metal-laminated laminate as described in (A8) or (A9), wherein the polyimide layer includes a thermoplastic polyimide layer and a non-thermoplastic polyimide layer. imine.

(A11) The method for producing a flexible metal-laminated laminate according to any one of (A8) to (A10), wherein the polyimide layer is made of a thermoplastic polyimide film and a non-woven fabric. Thermoplastic polyimide is bonded and laminated.

(A12) The method for producing a flexible metal-laminated laminate according to any one of (A8) to (A11), wherein the polyimide layer has a non-thermoplastic polyimide layer. Three-layer structure with thermoplastic polyimide layers on both sides.

(A13) The method for producing a flexible metal-laminated laminate according to (A12), wherein the polyimide layer is laminated with at least two or more polyimide films, the polyimide The amine film has a thickness of less than 75 μm and has the above-mentioned three-layer structure.

(A14) The method for manufacturing a flexible metal-laminated laminate according to any one of (A8) to (A13), wherein the flexible metal-laminated laminate has two or more signal lines .

(A15) The method for producing a flexible metal-laminated laminate according to any one of (A8) to (A14), wherein the surface roughness (Ra) on the polyimide layer side of the signal line is ) is 0.05 μm to 0.5 μm.

(B1) A multi-layer flexible metal-laminated laminate, characterized in that it is a multi-layer flexible metal-laminated laminate having a stripline structure, and at least sequentially has a ground layer/first polyimide layer /adhesive layer/signal line/second polyimide layer/ground layer, the thickness of the first polyimide layer and the second polyimide layer is 75-200 μm, and the dielectric under 10Hz Loss is 0.008 or less.

(B2) The multi-layer flexible metal-laminated laminate according to (B1), wherein the insertion loss at 10 GHz is -3.2 dB or more and 0 dB or less.

(B3) The multilayer flexible metal-laminated laminate according to (B1) or (B2), wherein the first polyimide layer and the second polyimide layer have thermoplastic polyimide layers. Amine layer and non-thermoplastic polyimide layer.

(B4) The multilayer flexible metal-laminated laminate according to any one of (B1) to (B3), wherein the first polyimide layer and the second polyimide layer have Both sides of the non-thermoplastic polyimide have a three-layer structure of thermoplastic polyimide layers.

(B5) The multilayer flexible metal-laminated laminate according to (B4), wherein the first polyimide layer and the second polyimide layer are two or more polyimide films The laminate, the thickness of the polyimide film is less than 75 μm and has the above-mentioned three-layer structure.

(B6) The multi-layer flexible metal-laminated laminate according to any one of (B1) to (B5), characterized in that: further, between the copper layer serving as the signal line and the second polyimide layer Has an adhesive layer.

(B7) The multilayer flexible metal-laminated laminate according to any one of (B1) to (B6), wherein the multilayer flexible metal-laminated laminate has two or more signal lines.

(B8) The multi-layer flexible metal-laminated laminate according to any one of (B1) to (B7), wherein the signal line has a surface roughness (Ra on the side of the second polyimide layer) ) is 0.05 μm to 0.5 μm.

(B9) A method for manufacturing a multi-layer flexible metal-laminated laminate, characterized in that it is a method for manufacturing a multi-layer flexible metal-laminated laminate having a stripline structure, wherein the multi-layer flexible metal laminate is The laminate has at least a ground layer/first polyimide layer/adhesive layer/signal line/second polyimide layer/ground layer, the first polyimide layer and the second polyimide layer in this order A polyimide film with a thickness of 75-200 μm and a dielectric loss at 10 Hz of 0.008 or less is used.

(B10) The method for manufacturing a multi-layer flexible metal-laminated laminate according to (B9), wherein the insertion loss at 10 GHz is -3.2 dB or more and 0 dB or less.

(B11) The method for producing a multi-layer flexible metal-laminated laminate according to (B9) or (B10), wherein the first polyimide layer and the second polyimide layer have thermoplastic Polyimide layer and non-thermoplastic polyimide.

(B12) The method for producing a multilayer flexible metal-laminated laminate according to any one of (B9) to (B11), wherein the first polyimide layer and the second polyimide layer The layer system is laminated by laminating a thermoplastic polyimide film and a non-thermoplastic polyimide.

(B13) The method for producing a multilayer flexible metal-laminated laminate according to any one of (B9) to (B12), wherein the first polyimide layer and the second polyimide layer The layers have a three-layer construction with thermoplastic polyimide layers on both sides of the non-thermoplastic polyimide.

(B14) The method for producing a multi-layer flexible metal-laminated laminate according to (B13), wherein the first polyimide layer and the second polyimide layer-based laminate have at least two sheets For the above polyimide film, the thickness of the polyimide film is less than 75 μm and has the above three-layer structure.

(B15) The method for producing a multi-layer flexible metal-laminated laminate as described in any one of (B9) to (B14), wherein the copper layer serving as the signal line and the second polyimide are further added. There is an adhesive layer between the layers.

(B16) The method for producing a multi-layer flexible metal-laminated laminate according to any one of (B9) to (B15), wherein the multi-layer flexible metal-laminated laminate has two or more signal line.

(B17) The method for producing a multi-layer flexible metal-laminated laminate according to any one of (B9) to (B16), wherein the surface of the signal line on the side of the second polyimide layer is rough Degree (Ra) is 0.05 μm to 0.5 μm.

(C1) A flexible metal-laminated laminate, characterized in that: it is a flexible metal-laminated laminate with a microstrip line structure, and at least sequentially has a signal line/a first polyimide layer/connection In the formation, the thickness of the first polyimide layer is 75-200 μm, and the dielectric loss at 10 GHz is 0.008 or less.

(C2) The flexible metal-laminated laminate according to (C1), further comprising a ground layer/second polyimide layer/adhesive layer, and at least a ground layer/second polyamide layer in this order imine layer/adhesive layer/signal line/first polyimide layer/ground layer, The thickness of the second polyimide layer is 75-200 μm, and the dielectric loss at 10 GHz is 0.008 or less.

(C3) The flexible metal-laminated laminate according to (C1) or (C2), characterized in that the insertion loss at 10 GHz is -3.2 dB or more and 0 dB or less.

(C4) The flexible metal-laminated laminate according to any one of (C1) to (C3), wherein the first polyimide layer has a thermoplastic polyimide layer and a non-thermal The plastic polyimide layer, or the first polyimide layer and the second polyimide layer each have a thermoplastic polyimide layer and a non-thermoplastic polyimide layer.

(C5) The flexible metal-laminated laminate as described in any one of (C1) to (C4), wherein the first polyimide layer has an interlayer between the non-thermoplastic polyimide layers. Three-layer structure with thermoplastic polyimide layers on both sides, or each of the first polyimide layer and the second polyimide layer has thermoplastic polyimide on both sides of the non-thermoplastic polyimide layer Three-layer structure of layers.

(C6) The flexible metal-laminated laminate according to (C5), wherein the first polyimide layer is a laminate of two or more polyimide films, and the polyimide The film has the above-mentioned three-layer structure and the thickness is less than 75 μm, or the above-mentioned first polyimide layer and the above-mentioned second polyimide layer are each a laminate of two or more polyimide films, and the polyimide film The amine film had the above-mentioned three-layer structure and had a thickness of less than 75 μm.

(C7) The flexible metal-laminated laminate according to any one of (C1) to (C6), wherein the signal line is a copper layer, An adhesive layer is further provided between the copper layer and the first polyimide layer.

(C8) The flexible metal-laminated laminate according to any one of (C1) to (C7), characterized by having two or more of the above-mentioned signal lines.

(C9) The flexible metal-laminated laminate according to any one of (C1) to (C8), wherein the signal line has a surface roughness (Ra on the side of the first polyimide layer) of the signal line. ) is 0.05 μm to 0.5 μm.

(C10) A method for manufacturing a flexible metal-laminated laminate, characterized in that it is a method for manufacturing a flexible metal-laminated laminate having a microstrip line structure, wherein the flexible metal-laminated laminate has at least It has signal line/first polyimide layer/ground layer in this order, and uses a polyimide film with a thickness of 75-200 μm and a dielectric loss at 10 GHz of 0.008 or less as the first polyimide Floor.

(C11) The method for producing a flexible metal-laminated laminate as described in (C10), further comprising a ground layer/second polyimide layer/adhesive layer, and at least a ground layer/first layer in this order. 2 polyimide layer/adhesive layer/signal line/2nd polyimide layer/ground layer, and A polyimide film having a thickness of 75 to 200 μm and a dielectric loss at 10 GHz of 0.008 or less is used as the second polyimide layer.

(C12) The method for manufacturing a flexible metal-laminated laminate as described in (C10) or (C11), wherein the insertion loss at 10 GHz is -3.2 dB or more and 0 dB or less.

(C13) The method for producing a flexible metal-laminated laminate according to any one of (C10) to (C12), wherein the first polyimide layer has a thermoplastic polyimide layer and a non-thermoplastic polyimide layer, or the first polyimide layer and the second polyimide layer each have a thermoplastic polyimide layer and a non-thermoplastic polyimide layer.

(C14) The method for producing a flexible metal-laminated laminate according to any one of (C10) to (C13), wherein the first polyimide layer is a thermoplastic polyimide film It is formed by laminating and laminating with a non-thermoplastic polyimide, or the first polyimide layer and the second polyimide layer are each formed by combining a thermoplastic polyimide film and a non-thermoplastic polyimide It is formed by lamination and lamination.

(C15) The method for producing a flexible metal-laminated laminate according to any one of (C10) to (C14), wherein the first polyimide layer has a non-thermoplastic polyimide layer. Both sides of the amine layer have a three-layer structure of thermoplastic polyimide layers, or the first polyimide layer and the second polyimide layer each have a thermoplastic polyimide layer on both sides of the non-thermoplastic polyimide layer. Three-layer structure of imide layer.

(C16) The method for producing a flexible metal-laminated laminate according to (C15), wherein the first polyimide layer is a laminate of at least two or more polyimide films, the The polyimide film has the above three-layer structure and the thickness is less than 75 μm, or the first polyimide layer and the second polyimide layer are each laminated with at least two polyimide films. , the polyimide film has the above-mentioned three-layer structure and the thickness is less than 75 μm.

(C17) The method for manufacturing a flexible metal-laminated laminate according to any one of (C10) to (C16), wherein the signal line is a copper layer, An adhesive layer is further provided between the copper layer and the first polyimide layer.

(C18) The method for producing a flexible metal-laminated laminate according to any one of (C10) to (C17), wherein the flexible metal-laminated laminate has two or more of the above-mentioned signals String.

(C19) The method for producing a flexible metal-laminated laminate according to any one of (C10) to (C18), wherein the signal line has a rough surface on the side of the first polyimide layer. Degree (Ra) is 0.05 μm to 0.5 μm.

[Example] The present invention will be specifically described below with reference to examples, but the present invention is not limited to these examples. Furthermore, the dielectric constant, dielectric loss factor, transmission characteristics of FPC, peel strength, film thickness, and evaluation of surface roughness of copper foil of the polyimide films in the synthesis examples, examples, and comparative examples were measured. The method is described below.

(Determination of dielectric constant and dielectric loss factor) As a measuring device, a cavity resonator perturbation method complex dielectric constant evaluation device (manufactured by Kanto Electronics Application Development Co., Ltd.) was used to measure the dielectric constant and dielectric loss factor of the multilayer polyimide film at the following frequencies. Measurement frequency: 10 GHz Measurement conditions: temperature 22℃～24℃, humidity 45%～55% Measurement sample: A sample that was left under the above measurement conditions for 24 hours was used.

(Fabrication of FCCL, measurement of transmission characteristics of microstrip and stripline) Under the following conditions, a polyimide film and a copper foil were laminated to obtain a double-sided FCCL. Copper foil used: thickness 12 μm, and the roughness of the surface adjoining the polyimide film is 0.45 μm or less Lamination conditions of polyimide and copper foil: lamination temperature 360℃, lamination pressure 0.8 tons, lamination speed 1 m/min

The fabrication of the microstrip circuit is performed by etching one side of the double-sided FCCL to produce a microstrip line with a line length of 10 cm, and copper plating the circuit portion and the terminal portion. The circuit width is calculated from the thickness of the constituent material, dielectric constant, and dielectric dissipation factor, so that the characteristic impedance becomes 50 Ω.

Then, the above-mentioned microstrip line circuit and single-sided FCCL were bonded together via an adhesive layer (bonding sheet) under the condition of heating under reduced pressure at 160° C. for 30 minutes to produce an FPC sample having a stripline structure. The circuit width is calculated from the thickness of the constituent material, dielectric constant, and dielectric dissipation factor, so that the characteristic impedance becomes 50 Ω.

The following treatments were performed on the obtained flexible metal-laminated laminate having a microstrip circuit and a flexible metal-clad laminate having a stripline circuit, respectively. That is, after drying at 150 degreeC for 30 minutes, humidity control was performed for 24 hours or more in the test room adjusted to 23 degreeC and 55%RH. Then, using a network analyzer E5071C (Keysight Technologies) and a GSG250 probe, the S21 parameter of the insertion loss was measured to obtain the transmission loss (dB/100 mm) at the measured frequency of 10 GHz.

(Measuring method of peel strength) The FCCL was analyzed according to "6.5 peel strength" of JIS C6471. Specifically, a metal foil portion with a width of 1 mm was peeled off under the conditions of a peeling angle of 90 degrees and 100 mm/min, and the load was measured. About peeling strength, the case of 12 N/cm or more was evaluated as "○" (good), and the case of less than 12 N/cm was evaluated as "x" (poor).

(thickness of film) The thickness of the film was measured using a LASER HOLOGAGE manufactured by Mitsutoyo Co., Ltd., a contact thickness gauge.

(Surface roughness Ra of copper foil) The arithmetic mean roughness under the following conditions was measured using a light wave interference type surface roughness measuring device (New View 5030 system manufactured by ZYGO Corporation).

(measurement conditions) Objective: 50x Mirau Image Zoom: 2 FDA Res: Normal Parsing conditions: Remove: Cylinder Filter: High Pass Filter Low Waven: 0.002 mm

(Synthesis Example 1) While keeping the inside of the reaction system at 20°C, 1,3-bis(4-aminophenoxy)benzene was added to 328.79 kg of N,N-dimethylformamide (hereinafter also referred to as DMF). (hereinafter also referred to as TPE-R) 11.64 kg, 4,4'-diamino-2,2'-dimethylbiphenyl (hereinafter also referred to as m-TB) 11.28 kg, and stirred in a nitrogen atmosphere. After visually confirming that TPE-R and m-TB were dissolved, 14.66 kg of 3,3',4,4'-biphenyltetracarboxylic dianhydride (hereinafter also referred to as BPDA) and pyromellitic anhydride (hereinafter also referred to as BPDA) were added. PMDA) 7.39 kg, stirred for 30 minutes. Next, 4.31 kg of p-phenylenediamine (hereinafter also referred to as PDA) and 9.85 kg of PMDA were added and stirred for 30 minutes.

Finally, 0.9 kg of PMDA was dissolved in DMF to prepare a solution with a solid content concentration of 7%. While paying attention to the rise in viscosity, the solution was slowly added to the above reaction solution, and the polymerization was terminated when the viscosity reached 3000 poise.

To the polyamic acid solution was added an imidization accelerator containing acetic anhydride/isoquinoline/DMF (weight ratio 2.0/0.7/4.0) in a weight ratio of 50% with respect to the polyamic acid solution. It is continuously stirred by a stirrer, extruded from a T-die and cast onto a stainless steel endless belt. After heating the resin film under the conditions of 130°C × 100 seconds, the self-sustaining gel film was peeled off from the endless belt and fixed to a tenter clip. It was dried and imidized for 120 seconds to obtain a polyimide film with a thickness of 17 μm.

(Synthesis example 2) While keeping the inside of the reaction system at 20° C., 15.76 kg of 4,4′-diaminodiphenyl ether (hereinafter also referred to as ODA) was added to 328.94 kg of DMF, and the mixture was stirred under a nitrogen atmosphere. After visually confirming that ODA was dissolved, 17.37 kg of BPDA and 2.57 kg of PMDA were added and stirred for 30 minutes. Next, 11.14 kg of m-TB and 12.30 kg of PMDA were added and stirred for 30 minutes.

Finally, 0.9 kg of PMDA was dissolved in DMF to prepare a solution with a solid content concentration of 7%. While paying attention to the rise in viscosity, the solution was slowly added to the above reaction solution, and the polymerization was terminated when the viscosity reached 3000 poise.

To the polyamic acid solution was added an imidization accelerator containing acetic anhydride/isoquinoline/DMF (weight ratio 2.0/0.7/4.0) in a weight ratio of 50% with respect to the polyamic acid solution. It is continuously stirred by a stirrer, extruded from a T-die and cast onto a stainless steel endless belt. After heating the resin film under the conditions of 130°C × 100 seconds, the self-sustaining gel film was peeled off from the endless belt and fixed to a tenter clip. It was dried and imidized for 120 seconds to obtain a polyimide film with a thickness of 17 μm.

(Synthesis example 3) While keeping the inside of the reaction system at 20°C, 10.53 kg of ODA, 2,2-bis[4-(4-aminophenoxy)phenyl]propane (hereinafter also referred to as BAPP) were added to 657.82 kg of DMF. ) 32.39 kg, stirred under nitrogen atmosphere. After visually confirming that ODA and BAPP were dissolved, 16.95 kg of 3,3',4,4'-benzophenonetetracarboxylic dianhydride (hereinafter also referred to as BTDA) and 14.34 kg of PMDA were added and stirred for 30 minutes. Next, PDA 14.22 kg and PMDA 29.83 kg were added and stirred for 30 minutes.

Finally, 1.7 kg of PDA was dissolved in DMF to prepare a solution with a solid content concentration of 10%. While paying attention to the rise in viscosity, the solution was slowly added to the above-mentioned reaction solution, and the polymerization was terminated when the viscosity reached 3000 poise.

To the polyamic acid solution was added an imidization accelerator containing acetic anhydride/isoquinoline/DMF (weight ratio 2.0/0.7/4.0) in a weight ratio of 50% with respect to the polyamic acid solution. It is continuously stirred by a stirrer, extruded from a T-die and cast onto a stainless steel endless belt. After heating the resin film under the conditions of 130°C × 100 seconds, the self-sustaining gel film was peeled off from the endless belt and fixed to a tenter clip. It was dried and imidized for 120 seconds to obtain a polyimide film with a thickness of 17 μm.

(Synthesis of thermoplastic polyimide precursor (polyamide)) 29.8 g of BAPP was dissolved in 249 g of DMF cooled to 10°C. After adding 21.4 g of BPDA to this and making it melt|dissolve, it stirred for 30 minutes, and formed a prepolymer. Further, a separately prepared BAPP solution in DMF (BAPP 1.57 g/DMF 31.4 g) was carefully added to the solution, and the addition was stopped when the viscosity reached about 1000 poise. After stirring for 1 hour, a polyamide acid solution having a solid content concentration of about 17% by weight and a rotational viscosity of 1000 poise at 23°C was obtained.

<Flexible metal-laminated laminate with microstrip structure> (Example 1) After diluting the thermoplastic polyamide solution with DMF to a solid content concentration of 10% by weight, the polyamide was coated on one side of the film obtained in Synthesis Example 1 by a corner wheel coater to make the final single side. The thickness was 4 μm, and heating was performed in a drying furnace set at 140° C. for 1 minute. The other side was similarly coated with polyamide so as to have a final thickness of 4 μm, and then passed through a drying oven set at 140° C. for 1 minute and heated. Next, heat treatment was performed for 20 seconds in a far-infrared heating furnace with an ambient temperature of 360° C. to obtain a polyimide laminate having a total thickness of 25.0 μm. Furthermore, copper foil/3 sheets of the above-mentioned polyimide laminate/copper foil with a total thickness of 25.0 μm were successively stacked, and a hot roll laminator was used at a lamination temperature of 360° C., a lamination pressure of 0.8 tons, and a lamination speed of 1.0 m. Thermal lamination was carried out under the condition of /min to produce a double-sided copper laminate (double-sided FCCL) (copper foil: CF-T49A-HD2, Ra=0.15 μm, thickness of polyimide layer: 75 μm). The above-mentioned three polyimide laminates correspond to the above-mentioned "first polyimide layer".

Etching one side of the double-sided FCCL containing the polyimide layer, making a microstrip line with a line length of 10 cm, plating copper on the circuit part and the terminal part, and making the flexible metal lamination board of the microstrip line. sample. The circuit width is calculated from the thickness of the constituent material, dielectric constant, and dielectric dissipation factor, so that the characteristic impedance becomes 50 Ω.

(Example 2) A sample of a flexible metal-bonded laminate was produced in the same manner as in Example 1, except that four polyimide laminates having a total thickness of 25.0 μm obtained in Example 1 were stacked. The above-mentioned four polyimide laminates correspond to the above-mentioned "first polyimide layer".

(Example 3) A sample of a flexible metal-laminated laminate was produced in the same manner as in Example 1, except that 6 sheets of the polyimide laminate having a total thickness of 25.0 μm obtained in Example 1 were stacked. The above-mentioned six polyimide laminates correspond to the above-mentioned "first polyimide layer".

(Example 4) A sample of a flexible metal-laminated laminate was produced in the same manner as in Example 1, except that eight polyimide laminates having a total thickness of 25.0 μm obtained in Example 1 were stacked. The above-mentioned eight polyimide laminates correspond to the above-mentioned "first polyimide layer".

From Examples 1 to 4, it was confirmed that the insertion loss of the flexible metal-laminated laminate decreases as the thickness of the polyimide laminate increases.

(Example 5) The thermoplastic polyimide solution was applied to the film obtained in Synthesis Example 2 by the same method as in Example 1, followed by drying and heat treatment to obtain a polyimide laminate. Furthermore, under the same bonding conditions as in Example 1, using the same copper foil as in Example 1, a sample of a flexible metal bonded laminate was produced.

(Comparative Example 1) A flexible metal sticker was produced in the same manner as in Example except that only one polyimide laminate with a total thickness of 25.0 μm obtained in Example 1 was used, and the thickness of the polyimide laminate was 25 μm. Samples of composite laminates. The above-mentioned one sheet of the polyimide laminate corresponds to the above-mentioned "first polyimide layer".

(Comparative Example 2) A flexible metal sticker was produced in the same manner as in Example 1, except that two polyimide laminates with a total thickness of 25.0 μm obtained in Example 1 were stacked so that the thickness of the polyimide laminate was 50 μm. Samples of composite laminates. The above-mentioned two polyimide laminates correspond to the above-mentioned "first polyimide layer".

From Example 1 and Comparative Examples 1 and 2, it was confirmed that the insertion loss of the flexible metal-laminated laminate deteriorates (the absolute value increases) as the thickness of the polyimide laminate becomes thinner.

(Comparative Example 3) In the same manner as in Example 2, except that the film obtained in Synthesis Example 3 was used, three polyimide laminates with a total thickness of 25.0 μm were stacked to prepare a sample of a flexible metal-bonded laminate.

According to Example 2 and Comparative Example 3, it was confirmed that the insertion loss of the flexible metal-laminated laminate was deteriorated by using a polyimide laminate having a large dielectric loss. In addition, according to Example 1 and Comparative Example 3, if a polyimide laminate having a large dielectric loss is used, even if the thickness of the laminate increases, the insertion loss of the flexible metal-laminated laminate will deteriorate. . From the above results, it can be seen that in order to obtain a good insertion loss, it is necessary to use a polyimide laminate with a small dielectric loss and to laminate a thick layer.

The dielectric constants and dielectric loss factors of the flexible metal-laminated laminates (multilayer polyimide films) obtained in Examples 1 to 5 and Comparative Examples 1 to 3 were obtained from the polyimide films. The peel strength of double-sided FCCL is shown in Table 1. Furthermore, Table 1 shows the transmission loss measurement results at 10 GHz measured using the FPC sample obtained under the above conditions using double-sided FCCL. [Table 1] Dielectric constant Dielectric Dissipation Factor Thickness (μm) Peel Strength (N/cm) Insertion Loss(dB)@10 GHz Example 1 3.1 0.008 75 12.4 -2.4 Example 2 3.1 0.008 100 12.1 -2.1 Example 3 3.1 0.008 150 11.4 -1.8 Example 4 3.1 0.008 200 10.3 -1.6 Example 5 3.2 0.006 75 12.1 -2.2 Comparative Example 1 3.1 0.008 25 14.3 -4.5 Comparative Example 2 3.1 0.008 50 13.5 3.0 Comparative Example 3 3.3 0.018 100 11.7 -3.4

<Flexible metal-laminated laminate with stripline structure> (Example 6) After diluting the thermoplastic polyamide solution with DMF to a solid content concentration of 10% by weight, the polyamide was coated on one side of the film obtained in Synthesis Example 1 by a corner wheel coater to make the final single side. The thickness was 4 μm, and heating was performed in a drying furnace set at 140° C. for 1 minute. The other side was similarly coated with polyamide so as to have a final thickness of 4 μm, and then passed through a drying oven set at 140° C. for 1 minute and heated. Next, heat treatment was performed for 20 seconds in a far-infrared heating furnace with an ambient temperature of 360° C. to obtain a polyimide laminate having a total thickness of 25.0 μm. Furthermore, copper foil/3 sheets of the above-mentioned polyimide laminate/copper foil with a total thickness of 25.0 μm were sequentially stacked, and a hot roll laminator was used at a lamination temperature of 360° C., a lamination pressure of 0.6 tons, and a lamination speed of 1.0 m. Thermal lamination was carried out under the condition of /min to produce a double-sided copper laminate (double-sided FCCL) (copper foil: CF-T49A-HD2, Ra=0.15 μm, thickness of polyimide laminate: 75 μm). The above-mentioned three polyimide laminates correspond to the above-mentioned "first polyimide layer".

In addition, copper foil/3 sheets of the above-mentioned polyimide laminates with a total thickness of 25.0 μm were successively stacked, and a hot roll laminator was used at a lamination temperature of 360° C., a lamination pressure of 0.8 tons, and a lamination speed of 1.0 m/min. Thermal lamination was carried out under the conditions to produce a single-sided copper laminate (single-sided FCCL) (copper foil: CF-T49A-HD2, Ra=0.15 μm, thickness of polyimide laminate: 75 μm). The above-mentioned three polyimide laminates correspond to the above-mentioned "second polyimide layer".

One side of the double-sided FCCL including the first polyimide layer was etched to produce a microstrip line with a line length of 10 cm, and copper was plated on the circuit portion and the terminal portion. The microstrip line circuit and the single-sided FCCL containing the second polyimide laminate were bonded together by heating under reduced pressure at 150° C. and 1 to 2 MPa for 30 minutes through a bonding sheet SAFY manufactured by Nikan Industries Co., Ltd. . Thereby, a sample of a flexible metal-bonded laminate having a stripline structure was produced. The circuit width is calculated according to the thickness of the constituent material, the dielectric constant, and the dielectric dissipation factor, so that the characteristic impedance is 50 Ω, and in order to reduce noise, the upper and lower ground layers are made into a structure that conducts through through holes ( Figure 4).

(Example 7) A test of producing double-sided FCCL, single-sided FCCL, and flexible metal-laminated laminates in the same manner as in Example 6, except that four polyimide laminates with a total thickness of 25.0 μm obtained in Example 6 were stacked. Sample. The above-mentioned four polyimide laminates correspond to the above-mentioned "first polyimide layer".

(Example 8) A test of producing double-sided FCCL, single-sided FCCL, and flexible metal-laminated laminates in the same manner as in Example 6, except that 6 sheets of the polyimide laminate with a total thickness of 25.0 μm obtained in Example 6 were stacked. Sample. The above-mentioned six polyimide laminates correspond to the above-mentioned "first polyimide layer".

(Example 9) A test of producing double-sided FCCL, single-sided FCCL, and flexible metal-laminated laminates in the same manner as in Example 6, except that 8 sheets of the polyimide laminate with a total thickness of 25.0 μm obtained in Example 6 were stacked. Sample. The above-mentioned eight polyimide laminates correspond to the above-mentioned "first polyimide layer".

From Examples 6 to 9, it was confirmed that the insertion loss decreases as the thickness of the polyimide laminate increases.

(Example 10) The thermoplastic polyimide solution was coated on the film obtained in Synthesis Example 2 by the same method as in Example 6, followed by drying and heat treatment to obtain a polyimide laminate. Furthermore, under the same bonding conditions as in Example 6, using the same copper foil as in Example 6, samples of double-sided FCCL, single-sided FCCL, and flexible metal-laminated laminates were produced.

(Comparative Example 4) The same procedure as in Example 6 was carried out, except that only one polyimide layered product with a total thickness of 25.0 μm obtained in Example 6 was used, and the thicknesses of the first and second polyimide layers were respectively 25 μm Samples of double-sided FCCL, single-sided FCCL, and flexible metal-laminated laminates were produced.

(Comparative Example 5) It was produced in the same manner as in Example 6, except that two polyimide laminates with a total thickness of 25.0 μm obtained in Example 6 were stacked so that the thicknesses of the first and second polyimide layers were 50 μm, respectively. Samples of double-sided FCCL, single-sided FCCL, and flexible metal-laminated laminates.

From Example 6 and Comparative Examples 4 and 5, it was confirmed that the insertion loss deteriorates (the absolute value increases) as the thickness of the polyimide laminate becomes thinner.

(Comparative Example 6) Except for using the film obtained in Synthesis Example 3, three sheets of polyimide laminates with a total thickness of 25.0 μm were stacked in the same manner as in Example 6 to produce double-sided FCCL, single-sided FCCL, and flexible metal-laminated laminates. sample.

From Example 7 and Comparative Example 6, it was confirmed that the insertion loss was deteriorated by using a polyimide laminate having a large dielectric loss. In addition, according to Example 6 and Comparative Example 6, when a polyimide laminate having a large dielectric loss is used, even if the thickness of the laminate is increased, the insertion loss is deteriorated. From the above results, it can be seen that in order to obtain a good insertion loss, it is necessary to use a polyimide laminate with a small dielectric loss and to laminate a thick layer.

The dielectric constant and dielectric loss factor of the flexible metal-laminated laminates (multilayer polyimide films) obtained in Examples 6 to 10 and Comparative Examples 4 to 6 were obtained from the polyimide films. The peel strength of double-sided FCCL is shown in Table 2. Furthermore, Table 2 shows the transmission loss measurement results at 10 GHz measured using the FPC sample obtained under the above conditions using double-sided FCCL. [Table 2] Layer composition Dielectric constant Dielectric Dissipation Factor Thickness (μm) Peel Strength (N/cm) Insertion Loss(dB)@10 GHz Example 6 Layer 4 2nd polyimide layer 3.1 0.008 75 12.4 -3.0 Layer 5 adhesive layer 2.7 0.002 25 Layer 2 1st polyimide layer 3.1 0.008 75 Example 7 Layer 4 2nd polyimide layer 3.1 0.008 100 12.1 -2.6 Layer 5 adhesive layer 2.7 0.002 25 Layer 2 1st polyimide layer 3.1 0.008 100 Example 8 Layer 4 2nd polyimide layer 3.1 0.008 150 11.4 -2.2 Layer 5 adhesive layer 2.7 0.002 25 Layer 2 1st polyimide layer 3.1 0.008 150 Example 9 Layer 4 2nd polyimide layer 3.1 0.008 200 10.3 -1.9 Layer 5 adhesive layer 2.7 0.002 25 Layer 2 1st polyimide layer 3.1 0.008 200 Example 10 Layer 4 2nd polyimide layer 3.2 0.006 75 12.1 -2.8 Layer 5 adhesive layer 2.7 0.002 25 Layer 2 1st polyimide layer 3.2 0.006 75 Comparative Example 4 Layer 4 2nd polyimide layer 3.1 0.008 25 14.3 -5.6 Layer 5 adhesive layer 2.7 0.002 25 Layer 2 1st polyimide layer 3.1 0.008 25 Comparative Example 5 Layer 4 2nd polyimide layer 3.1 0.008 50 13.5 -3.8 Layer 5 adhesive layer 2.7 0.002 25 Layer 2 1st polyimide layer 3.1 0.008 50 Comparative Example 6 Layer 4 2nd polyimide layer 3.3 0.018 100 11.7 -4.0 Layer 5 adhesive layer 2.7 0.002 25 Layer 2 1st polyimide layer 3.3 0.018 100

1: Ground plane 2: The first polyimide layer 3: Copper layer as signal line 4: The second polyimide layer 5: Adhesive layer 1 6: Adhesive layer 2 7: Single-sided flexible metal-laminated laminates 8: Adhesive layer (bonding sheet) 9: Double-sided flexible metal-laminated laminates 10: Non-thermoplastic polyimide 11: thermoplastic polyimide

FIG. 1 is a schematic cross-sectional view of a flexible metal-laminated laminate with microstrip lines. FIG. 2 is a schematic cross-sectional view of a flexible metal-laminated laminate with microstrip lines having a plurality of signal lines. FIG. 3 is a schematic view showing an example of a method of manufacturing a flexible metal-laminated laminate having a microstrip line. FIG. 4 is a schematic cross-sectional view of a flexible metal-laminated laminate with strip lines. FIG. 5 is a schematic cross-sectional view of a flexible metal-laminated laminate with strip lines. FIG. 6 is a schematic cross-sectional view of a flexible metal-laminated laminate with strip lines. FIG. 7 is a schematic view showing a manufacturing method of a flexible metal-laminated laminate having a strip line. Fig. 8 is a schematic view showing a lamination method of a polyimide adhesive sheet. FIG. 9 is a schematic view showing a manufacturing method of a single-sided flexible metal-laminated laminate used for the flexible metal-laminated laminate. FIG. 10 is a schematic view showing a manufacturing method of a single-sided flexible metal-laminated laminate used for the flexible metal-laminated laminate. FIG. 11 is a schematic view showing a method for producing a single-sided flexible metal-laminated laminate used for the flexible metal-laminated laminate. FIG. 12 is a schematic view showing a method for producing a double-sided flexible metal-laminated laminate used for the flexible metal-laminated laminate. FIG. 13 is a schematic view showing a manufacturing method of a double-sided flexible metal-laminated laminate used for the flexible metal-laminated laminate.

1: Ground plane

2: The first polyimide layer

3: Copper layer as signal line

Claims (19)

A flexible metal-laminated laminate is characterized in that: it has a microstrip line structure, and at least sequentially has a signal line/a first polyimide layer/ground layer, and one of the first polyimide layer The thickness is 75-200 μm, and the dielectric loss at 10 GHz is below 0.008. The flexible metal-laminated laminate according to claim 1, further comprising a ground layer/second polyimide layer/adhesive layer, and at least a ground layer/second polyimide layer/adhesive layer/ Signal line/1st polyimide layer/ground layer, The thickness of the second polyimide layer is 75-200 μm, and the dielectric loss at 10 GHz is 0.008 or less. If the flexible metal-laminated laminate of claim 1 or 2, its insertion loss at 10 GHz is above -3.2 dB and below 0 dB. The flexible metal-laminated laminate according to claim 1 or 2, wherein the first polyimide layer has a thermoplastic polyimide layer and a non-thermoplastic polyimide layer, or the first polyimide layer is The amine layer and the second polyimide layer described above each have a thermoplastic polyimide layer and a non-thermoplastic polyimide layer. The flexible metal-laminated laminate according to claim 1 or 2, wherein the first polyimide layer has a three-layer structure having thermoplastic polyimide layers on both sides of the non-thermoplastic polyimide layer, or The said 1st polyimide layer and the said 2nd polyimide layer each have a three-layer structure which has a thermoplastic polyimide layer on both surfaces of a non-thermoplastic polyimide layer. The flexible metal-laminated laminate according to claim 5, wherein the first polyimide layer is a laminate of two or more polyimide films, and the polyimide films have the three-layer structure and the thickness less than 75 μm, or the first polyimide layer and the second polyimide layer are each a laminate of two or more polyimide films having the above three-layer structure and Thickness does not reach 75 μm. The flexible metal-laminated laminate as claimed in claim 1 or 2, wherein The above signal lines are copper layers, An adhesive layer is further provided between the copper layer and the first polyimide layer. The flexible metal-laminated laminate according to claim 1 or 2, which has two or more of the above-mentioned signal lines. The flexible metal-laminated laminate according to claim 1 or 2, wherein the surface roughness (Ra) on the side of the first polyimide layer of the signal line is 0.05 μm to 0.5 μm. A manufacturing method of a flexible metal-laminated laminate, characterized in that: it is a manufacturing method of a flexible metal-laminated laminate having a microstrip line structure, and the flexible metal-laminated laminate at least sequentially has a signal For the line/first polyimide layer/ground layer, a polyimide film with a thickness of 75-200 μm and a dielectric loss at 10 GHz of 0.008 or less is used as the first polyimide layer. The method for manufacturing a flexible metal-laminated laminate according to claim 10, wherein the flexible metal-laminated laminate further has a ground layer/a second polyimide layer/adhesive layer, and at least a ground layer/ 2nd polyimide layer/adhesive layer/signal line/2nd polyimide layer/ground layer, A polyimide film having a thickness of 75 to 200 μm and a dielectric loss at 10 GHz of 0.008 or less is used as the second polyimide layer. As claimed in claim 10 or 11, the manufacturing method of a flexible metal-laminated laminate, wherein the insertion loss at 10 GHz is above -3.2 dB and below 0 dB. The method for manufacturing a flexible metal-laminated laminate according to claim 10 or 11, wherein the first polyimide layer has a thermoplastic polyimide layer and a non-thermoplastic polyimide layer, or the first polyimide layer The polyimide layer and the second polyimide layer described above each have a thermoplastic polyimide layer and a non-thermoplastic polyimide layer. The method for producing a flexible metal-laminated laminate according to claim 10 or 11, wherein the first polyimide layer is formed by laminating and laminating a thermoplastic polyimide film and a non-thermoplastic polyimide. Alternatively, the first polyimide layer and the second polyimide layer are each formed by laminating and laminating a thermoplastic polyimide film and a non-thermoplastic polyimide. The manufacturing method of a flexible metal-laminated laminate according to claim 10 or 11, wherein the first polyimide layer has three layers of thermoplastic polyimide layers on both sides of the non-thermoplastic polyimide layer structure, or each of the first polyimide layer and the second polyimide layer has a three-layer structure having a thermoplastic polyimide layer on both surfaces of the non-thermoplastic polyimide layer. The method for manufacturing a flexible metal-laminated laminate according to claim 15, wherein the first polyimide layer is laminated with at least two or more polyimide having the three-layer structure and a thickness of less than 75 μm Alternatively, the first polyimide layer and the second polyimide layer are each laminated with at least two or more polyimide films having the three-layer structure described above and having a thickness of less than 75 μm. As claimed in claim 10 or 11, the manufacturing method of a flexible metal-laminated laminate, wherein the signal line is a copper layer, An adhesive layer is further provided between the copper layer and the first polyimide layer. The manufacturing method of the flexible metal-laminated laminate according to claim 10 or 11, wherein the flexible metal-laminated laminate has two or more of the signal lines. The manufacturing method of a flexible metal-laminated laminate according to claim 10 or 11, wherein the surface roughness (Ra) of the signal line on the side of the first polyimide layer is 0.05 μm to 0.5 μm.

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