TW202200388A - Plasma corrosion-resistant component, reaction device and composite coating forming method solving the micro-particle pollution that the current coating gradually shows failure in the advanced manufacturing process - Google Patents

Abstract

The invention relates to the technical field of semiconductor processing, and specifically discloses a plasma corrosion-resistant component. A surface of a component body is provided with a composite coating, and the composite coating includes a magnetic coating and a plasma corrosion-resistant coating. The component and the reaction device provided in the present invention have a composite coating formed of a magnetic coating and a plasma corrosion-resistant coating on surfaces. By having a direction of movement of electrons and ions in the plasma cavity changed by means of a magnetic field of the magnetic coating, bombardment on the surface of the component in a normal direction can be reduced to prevent micro-particle pollution generated by the plasma corrosion-resistant coating, and by having the component protected by the plasma corrosion-resistant coating, micro-particle pollution issues that the current coating gradually shows failure in an advanced manufacturing process can be solved. Further, a method for preparing a component with the composite coating is also disclosed.

Description

Plasma corrosion-resistant parts and reaction device and method for forming composite coating

The invention relates to the technical field of semiconductor processing, in particular to a plasma corrosion-resistant component and a reaction device, and a method for forming a composite coating.

The statements herein merely provide background related to the present invention and do not necessarily constitute prior art.

In the fabrication of semiconductor devices, plasma etching is a key process for processing wafers into designed patterns.

In a typical plasma etching process, process gases (such as CF ₄ , O ₂ , etc.) are excited by radio frequency (RF) to form plasma. These plasmas undergo physical bombardment and chemical reactions with the surface of the wafer under the action of the electric field, thereby etching the wafer with a specific structure and completing the etching process.

The inventors found that at least the following problems exist in the prior art:

In the latest 5nm process, the total number of plasma etching process steps has increased to more than 17%, and the power has increased to more than 10kW. The substantial increase in the power and steps of the advanced etching process requires the components in the plasma etching chamber to have higher plasma corrosion resistance, resulting in less particle pollution and metal pollution sources, further ensuring the stability and reliability of the etching equipment process. Repeatability. At present, yttrium-containing (Y ₂ O ₃ , YF ₃ , etc.) coatings in common technologies gradually show ineffective micro-particle contamination in advanced manufacturing processes (below 10 nm), which cannot meet higher process requirements.

How to reduce the risk of micro-particle contamination of coatings due to plasma corrosion will be of great significance to improving the level of semiconductor etching processes.

The first object of the present invention is to provide a plasma corrosion-resistant component, so as to reduce particle pollution in the vacuum chamber and increase the life of the workpiece.

In order to achieve the above object, the technical scheme provided by the invention is:

A plasma corrosion-resistant component, comprising a component body, the surface of the component body is provided with a composite coating, the composite coating includes a magnetic coating and a plasma corrosion-resistant coating, and the magnetic coating is provided on the surface of the component body and the plasma corrosion-resistant coating between.

The composite coating on the surface of the above-mentioned parts has two functions of magnetism and protection. The magnetic field generated by the composite coating can change the movement direction of electrons and ions in the plasma reaction chamber, reduce their bombardment on the surface of the parts, and avoid the formation of the coating. Small particles, on the other hand, the outer layer of the composite coating has a dense structure, which can play a very good protective role and prevent the parts from being corroded by plasma.

Further, the magnetic coating material includes at least one of samarium cobalt magnets, neodymium iron boron magnets, ferrite magnets, iron cobalt magnets, alnico magnets, and iron platinum alloy magnets. These materials are selected to have additional magnetic properties.

Further, the plasma corrosion resistant coating material includes at least one of rare earth elements Y, Sc, La, Ce, Pr, Nd, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu. The corrosion-resistant coating has dense characteristics, good corrosion resistance, and is not easy to fall off.

Further, the plasma corrosion resistant coating includes oxides, fluorides or oxyfluorides of rare earth elements Y, Sc, La, Ce, Pr, Nd, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu at least one of them. The specific manifestations of the above-mentioned rare earth elements are generally oxides, fluorides, and oxyfluorides, which can be selected according to the F/O ratio in the specific plasma reaction process.

Further, the thickness of the magnetic coating is less than or equal to 100 μm. The purpose of the magnetic coating is to provide a magnetic field to change the direction of movement of electrons and ions in the plasma reaction chamber (mainly near the inner wall surface of the chamber).

The second object of the present invention is to provide a method for forming the above-mentioned composite coating, comprising the following steps:

Place the component body in the processing chamber, and coat the surface of the component body with a first coating, which is a magnetic coating;

A second coating is applied on the surface of the first coating, and the coating is a plasma corrosion resistant coating;

Adds magnetism to the first coating.

Further, the coating method of the first coating layer includes at least one of suspension coating, spray coating, CVD, PVD, ALD, and aerosol deposition method.

Further, the coating method of the second coating layer includes at least one of CVD, ALD, and PVD. The second coating obtained by these several methods has the characteristics of high density, and the coating with high density characteristics can prevent the effect of plasma corrosion.

Further, the density of the second coating is greater than or equal to 99%, the density of the second coating is within this range, and the protective effect is better.

Further, the method of adding magnetism is to add magnetism by arranging N-type or S-type permanent magnets on the back of the component body, or by one or more combinations of pulsed magnetic field, DC magnetic field, and alternating magnetic field. For example, in the magnetic force distribution of permanent magnets, the end faces with dense magnetic lines of force with high strength are generally magnetized. Therefore, setting N-type or S-type permanent magnets on the back has a better effect of adding magnetism to the first coating.

Further, the direction of the magnetic field of the additional magnetism can be changed by changing the arrangement position of the N-type or S-type permanent magnets on the backside of the component body.

Further, the direction of the magnetic field of the additional magnetism forms an included angle with the surface of the component body.

Further, the included angle ranges from 0° to 90°.

By adjusting the setting position of the N-type or S-type permanent magnet on the back of the part body, the direction of the magnetic field of the additional magnetic field is changed, so that the magnetic field direction and the surface of the part body form a certain angle, the angle range is 0~90°, within this range It can change the movement direction of electrons and ions that reach the inner wall surface in most plasma reaction chambers, weaken the bombardment effect of electrons and ions on the coating surface, and reduce the corrosion effect.

The parts obtained by the above method have a composite coating on the surface, and the composite coating has two properties of magnetism and protection, and is not easy to fall off under the bombardment of plasma, thereby reducing the pollution of tiny particles in the reaction chamber.

The third object of the present invention is to provide a plasma reaction device, which includes a vacuum reaction chamber and the above-mentioned plasma corrosion-resistant parts.

Further, the inner cavity wall surface of the vacuum reaction chamber has a composite coating. The surface of the inner chamber wall of the reaction chamber is exposed to the plasma environment, and the coating obtained by the above method is coated on the surface, which is beneficial to enhance the protection of the reaction chamber and improve the service life of the vacuum reaction chamber.

Further, the plasma reaction device is an inductively coupled plasma processing device, and the plasma corrosion-resistant components include one or more of an inner liner, a cover ring, a focus ring, an insulating ring, and a plasma confinement ring. These parts are exposed to the plasma environment to work, and the surface is coated with the above-mentioned composite coating for protection, and the obtained coating is not easy to fall off, which reduces the risk of environmental pollution in the internal cavity and increases the service life of the parts.

Further, the plasma reaction device is a capacitively coupled plasma processing device, and the plasma corrosion resistant parts include a gas shower head, an upper grounding ring, a lower grounding ring, a moving ring, a covering ring, a focusing ring, an insulating ring, and a plasma confinement ring. one or more of. These parts are exposed to the plasma environment to work, and the surface is coated with the above-mentioned composite coating for protection, and the obtained coating is not easy to fall off, which reduces the risk of environmental pollution in the internal cavity and increases the service life of the parts.

The composite coating on the surface of the inner cavity wall of the reaction chamber of the above-mentioned plasma reaction device and the surface of the parts resistant to plasma corrosion has two functions of magnetism and protection. .

Beneficial effects of the present invention:

The plasma corrosion-resistant parts and the vacuum chamber of the reaction device provided by the present invention have a composite coating formed by a magnetic coating and a plasma-corrosion-resistant coating on the surface, and the magnetic field of the magnetic coating changes the electrons and ions in the plasma chamber. The direction of movement of the component makes it move in a spiral line, so that the movement time increases, and the collision and recombination probability of electrons and ions increases, thereby reducing the number of plasma bombarding the component body. On the other hand, as electrons and ions gradually approach zero In the component body, the magnetic field strength gradually increases, the radius of the helix movement of electrons and ions is smaller, and the direction of the movement speed is more deviated from the normal direction, thus the frontal bombardment effect on the component body is greatly reduced. The coating provided by the invention greatly reduces the positive bombardment of electrons and ions along the normal direction on the surface of the parts and the surface of the vacuum cavity, thereby reducing the probability of corrosion of the plasma corrosion-resistant coating and reducing the generation of tiny particles in the vacuum cavity. The source of particles, thereby reducing the pollution of tiny particles, and improving the level of the application process of the plasma vacuum chamber.

The present invention provides a method for forming a composite coating. The method can form a composite corrosion-resistant coating on the surface of the plasma etching parts and the surface of the vacuum chamber of the reaction device. This coating is magnetic, and the magnetic field generated by the coating can change the moving direction of electrons and ions, reducing the impact on the parts body. The number of bombarded plasma and the normal bombardment intensity can reduce the plasma corrosion of the coating, thereby reducing the pollution of tiny particles, and meet the higher process etching requirements.

The plasma reaction device includes a vacuum reaction chamber. The reaction chamber is a plasma environment. The parts are exposed to the plasma environment. Since the plasma is highly corrosive, it is necessary to coat the surface of the parts body with a corrosion-resistant coating. , in order to prevent the corrosion of the parts body by the plasma and protect the parts in the reaction chamber. Generally speaking, yttrium-containing (Y ₂ O ₃ , YF ₃ , etc.) coatings gradually show ineffective micro-particle contamination in advanced manufacturing processes (below 10 nm), which cannot better meet process requirements. This is because, in order to meet the ever-shrinking line width requirements, the power and steps used in the plasma etching process have been greatly increased. As shown in Figure 1, the physical bombardment and chemical corrosion strength of the yttrium-containing coating by the plasma is greatly enhanced. , the action time is greatly prolonged, so that the yttrium-containing coating body begins to corrode, and tiny particles are generated on the side of the cavity, scattered on the side wall, top and even the substrate of the cavity, causing pollution. During the formation of these tiny particles, the coating is mainly bombarded by electrons and ions from all directions, including deviating from the substrate normal and parallel to the substrate normal. Improving the bombardment of electrons or ions 704 from these deviated normal directions can reduce the probability of corrosion of the surface coating of parts, reduce the source of tiny particles 705 generated in the etching cavity, and further reduce the pollution of the tiny particles 705 . In the figure, 701 refers to the plasma, 702 refers to the susceptor, and 703 refers to the wafer.

In order to solve the above technical problems, the present invention proposes a component and a reaction device that can improve the electron and ion bombardment phenomena deviating from the normal direction in the plasma cavity, and a composite material is coated on the surface of the component and the inner wall surface of the cavity of the reaction device. method of coating.

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those with ordinary knowledge in the art without creative work shall fall within the protection scope of the present invention.

It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relationship between various components under a certain posture (as shown in the accompanying drawings). The relative positional relationship, the movement situation, etc., if the specific posture changes, the directional indication also changes accordingly.

It should also be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.

In addition, the descriptions involving "first", "second", etc. in the present invention are only for descriptive purposes, and should not be construed as indicating or implying their relative importance or implicitly indicating the number of indicated technical features. Thus, a feature defined as "first" and "second" may expressly or implicitly include at least one of that feature. In addition, the technical solutions between the various embodiments can be combined with each other, but must be based on the realization by those with ordinary knowledge in the field. When the combination of technical solutions is contradictory or cannot be realized, it should be considered that the combination of technical solutions does not exist and is not within the scope of protection claimed by the present invention.

FIG. 2 is a flow chart of a method for coating a composite coating on the surface of a plasma-etched component or a surface of a vacuum chamber of a reaction device according to the present invention.

Please refer to FIG. 2, the method is carried out in the processing chamber of the coating device, and specifically includes the following steps:

Placing the substrate 100 in the processing chamber

The substrate 100 is the body of the plasma etched component or the vacuum chamber wall of the reaction device. The plasma etched component or the vacuum chamber wall of the reaction device is exposed to the plasma environment during operation and needs to be coated with a corrosion-resistant coating. protection;

Coating the first coating layer 102 on the surface of the substrate 100;

The coated first coating 102 is a magnetic coating, and the coating method is a gas coating method, including suspension coating, spray coating, PVD, CVD, ALD, aerosol deposition method and other methods,

Specifically, taking the PVD method as an example, as shown in FIG. 3 , a schematic diagram of the coating method of this embodiment is shown. The first coating layer 102 is coated in the processing chamber 200 , and the processing chamber 200 is provided with a first target material 301 . The first target 301 is excited to form a molecular flow, and a dense first coating 102 is formed on the surface of the substrate 100 through the action of the enhancement source 400, wherein the excitation method can be plasma, ion beam, electron beam, laser or thermal method. one or more combinations,

In practical situations, since the purpose of the first coating 102 is to provide a magnetic field and does not require high density, other common coating methods are also suitable. better solution;

Coating the second coating 103 on the surface of the first coating 102;

The coated second coating 103 is a plasma-resistant corrosion-resistant coating, and the coating method includes CVD, ALD, PVD and other methods. Preferably, the higher the density of the second coating 103, the better the corrosion resistance effect.

Specifically, taking the PVD method as an example, as shown in FIG. 4 , the schematic diagram of the coating method of this embodiment is shown. The second coating layer 103 is coated in the processing chamber 200 , and the processing chamber in this step can be used for preparing the first coating layer. The same processing chamber of the layer 102 can also be a different processing chamber. The processing chamber 200 is provided with a second target 302. The second target 302 is excited to form a molecular flow, and the enhancement source 400 acts on the first coating 102. A dense second coating 103 is formed on the surface, and the first coating 102 and the second coating 103 form a composite coating 101. The excitation method includes at least one of plasma, ion beam, electron beam, laser or thermal method.

adding magnetism to the first coating 102;

The way of adding magnetism includes adding magnetism through at least one way of permanent magnet, pulsed magnetic field, direct current magnetic field, alternating magnetic field, etc.

Specifically, as shown in FIG. 5 , a schematic diagram of the method for adding magnetism in this embodiment is provided. The N-type or S-type permanent magnets 500 are arranged on the back of the substrate 100 to add magnetism to the first coating 102 , and N-type or S-type permanent magnets are arranged on the back of the substrate 100 The magnet 500 adds magnetism to the first coating 102 as shown in FIG. 6 , a certain angle 105 is formed between the direction of the magnetic field and the substrate 100 , and the included angle is selected in the range of 0 to 90°. Within this range, the magnetic field effect can be changed to reach the plasma reaction. The movement direction of most electrons and ions on the inner wall surface of the chamber. The N-type or S-type permanent magnet 500 is at least one of a samarium cobalt magnet, a neodymium iron boron magnet, a ferrite magnet, an iron cobalt magnet, an alnico magnet, an iron platinum alloy magnet, and the like.

So far, a composite coating 101 with magnetic properties and corrosion resistance is obtained. The function of the first coating 102 is to provide a magnetic field, change the bombardment direction and deflect the electrons and ions reaching the inner wall surface of the plasma reaction chamber, and reduce the normal bombardment of the second coating 103; the second coating 103 Its function is to resist plasma bombardment and protect the first coating 102 and the substrate 100 from plasma corrosion.

It should be noted that the step 14 of adding magnetism to the first coating 102 in the above method is not limited to after the second coating 103 is applied, and the step 14 may also be after the first coating 102 is applied, and the second coating 102 is applied. Before coating 103.

FIG. 6 is a schematic cross-sectional view of the substrate 100 of the present invention.

Please refer to FIG. 6 , the substrate 100 in the figure is a plasma corrosion-resistant component or the inner cavity wall of a vacuum reaction chamber of a plasma reaction device, and a composite coating 101 is provided on the surface of the substrate 100 , and the composite coating 101 includes two kinds of coatings , respectively the first coating 102 (magnetic coating) and the second coating 103 (plasma corrosion-resistant coating), and the first coating 102 (magnetic coating) is provided on the substrate 100 and the second coating 103 (electrical-resistant coating) Between the plasma corrosion coatings), the first coating 102 (magnetic coating) covers the surface of the substrate 100, and the second coating 103 (plasma corrosion resistant coating) covers the surface of the first coating 102 (magnetic coating).

The first coating 102 (magnetic coating) and the first target 301 in the above method are selected from materials that can add magnetic properties, such as samarium cobalt magnets, neodymium iron boron magnets, ferrite magnets, iron cobalt magnets, and AlNiCo magnets. , at least one of iron-platinum alloy magnets and other materials. The purpose of choosing this material is to be able to add magnetism and to generate a magnetic field after adding magnetism. The thickness of the first coating 102 (magnetic coating) is not greater than 100 μm, the purpose of the first coating 102 (magnetic coating) is to provide a magnetic field, and the density of the first coating 102 (magnetic coating) may be more than 30%.

The materials of the second coating 103 (plasma corrosion resistant coating) and the second target 302 in the above method include rare earth elements Y, Sc, La, Ce, Pr, Nd, Eu, Gd, Tb, Dy, Ho, Er , Tm, Yb, Lu, the material of the second coating 103 (plasma corrosion resistant coating) can be a compound containing the above elements, or a combination of different compounds, such as oxides, fluorides, One or more of oxyfluorides. The second coating 103 (plasma corrosion-resistant coating) needs to withstand the bombardment of the plasma and generate as few micro-particle pollutants as possible, so its density is preferably above 99%.

In the vacuum chamber of the plasma reaction device, the inner wall of the chamber and the surfaces of parts are coated with a first coating 102 (magnetic coating) and a second coating 103 (plasma corrosion resistant coating), wherein the first coating An angle 105 exists between the direction of the magnetic field strength of 102 (magnetic coating) and the surface of the substrate 100 . Please refer to FIG. 7 , when the electrons or ions 704 deviate from the normal direction, due to the Lorentz force of the magnetic field, these electrons or ions 704 will move away from the straight line and become with a radius of r=mv*sinθ /eB (where m is the quality of electrons and ions, B is the magnetic induction intensity, and θ is the angle between the velocity v and B). On the one hand, the helical movement of electrons or ions 704 increases the movement time and increases the probability of collision and recombination of electrons and ions, which reduces the number of parts that can be bombarded with composite coatings; The electrons or ions 704 gradually approach the parts coated with the composite coating, B gradually increases, the radius of the helical motion of the electrons and ions is smaller, and the speed direction is further deviated from the normal direction, thus the normal bombardment effect on the substrate 100 Greatly reduced. In this way, the normal bombardment of electrons or ions 704 on the parts coated with the composite coating is greatly reduced, the probability of corrosion of the second coating 103 (plasma corrosion-resistant coating) on the surface of the substrate 100 is reduced, and the vacuum chamber is further reduced. The source of the microparticles 705 produced by the body, thereby reducing the contamination of the microparticles 705.

The plasma reaction device specifically includes an inductively coupled plasma processing device or a capacitively coupled plasma processing device. As shown in FIG. 8 , when the plasma reaction device is an inductively coupled plasma processing device, the plasma corrosion-resistant components included in it include an inner liner, a cover ring, a focus ring, an insulating ring, and a plasma confinement ring. As shown in FIG. 9 , when the plasma reaction device is a capacitively coupled plasma processing device, the plasma corrosion-resistant components included in it include a gas shower head, an upper grounding ring, a lower grounding ring, a moving ring, a covering ring, and a focusing ring. , insulating ring, plasma confinement ring and other components.

The inner cavity wall of the vacuum chamber of the plasma reaction device and the inner plasma etching components are exposed to the plasma environment, and the surface needs to be coated with the above-mentioned composite coating 101 to prevent the corrosion of the plasma.

FIG. 8 is a schematic structural diagram of a plasma reaction device of the present invention.

The plasma reaction device includes: a reaction chamber 609, and the reaction chamber 609 is a plasma environment; the components and the inner cavity wall of the reaction chamber are exposed to the plasma environment.

The plasma reaction apparatus further includes: a base 610, the base 610 is used to carry the substrate W to be processed, and the plasma is used to process the substrate W to be processed. Since the plasma is highly corrosive, in order to prevent the surface of the component and the inner cavity wall of the reaction chamber 609 from being corroded by the plasma, the composite coating 101 needs to be coated on the surface of the component and the inner cavity wall of the reaction cavity 609 .

Specifically, the plasma reaction device shown in FIG. 8 is an inductively coupled plasma processing device. Correspondingly, the components exposed to the plasma environment include: a bushing 601 , a gas nozzle 602 , an electrostatic chuck 603 , and a focus ring 604 , an insulating ring 605, a cover ring 606, a plasma confinement ring 607, a reaction chamber top wall 608 or a gas connection flange (not shown).

To sum up, the surfaces of the plasma corrosion-resistant parts and the reaction device obtained by the above method are covered with a composite coating, and the composite coating has two properties of magnetic properties and corrosion resistance, which can make the bombardment of electrons and ions on the substrate 100 deviate from the normal direction as a spiral. The linear motion mode reduces the normal bombardment intensity of the coating, reduces the pollution of micro-particles caused by the failure of the coating, and meets the higher process etching requirements.

The above are only preferred embodiments of the present invention, and are not intended to limit the scope of the present invention. Under the inventive concept of the present invention, the equivalent structure transformation made by the contents of the description and the accompanying drawings of the present invention, or directly/indirectly applied to Other related technical fields are included within the scope of patent protection of the present invention.

100: Substrate 101: Composite coating 102: First coat 103: Second coat 200: Processing chamber 301: The first target 302: Second target 400: Enhanced Source 500: N-type or S-type permanent magnet 601: Bushing 602: Gas Nozzle 603: Electrostatic chuck 604: Focus Ring 605: Insulation ring 606: Cover Ring 607: Plasma Confinement Ring 608: Reaction chamber top wall 609: Reaction chamber 610: Pedestal 611: Gas supply device 612: gas shower head; 701: Plasma 702: Pedestal 703: Wafer 704: Electron or Ion 705: Tiny particles W: substrate

In order to illustrate the embodiments of the present invention or the technical solutions in the prior art more clearly, the following briefly introduces the accompanying drawings that are required in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For those with ordinary knowledge in the art, without creative efforts, other structures such as the structures shown in these drawings can also be obtained. 's attached drawing.

Fig. 1 is a schematic diagram of micro-particle pollution caused by plasma bombardment of a common coating; Fig. 2 is the composite coating preparation flow schematic diagram of the present invention; Fig. 3 is the magnetic coating coating schematic diagram of the present invention; Fig. 4 is the coating schematic diagram of the anti-plasma corrosion coating of the present invention; 5 is a schematic diagram of the additional magnetic properties of the magnetic coating of the present invention; 6 is a schematic cross-sectional view of a plasma corrosion-resistant component of the present invention; Fig. 7 is the composite coating of the present invention to improve the schematic diagram of plasma bombardment; 8 is a schematic structural diagram of a plasma reaction device of the present invention; FIG. 9 is a schematic structural diagram of another plasma reaction device of the present invention.

701: Plasma

702: Pedestal

703: Wafer

704: Electron or Ion

705: Tiny particles

Claims (17)

A plasma corrosion-resistant component, which includes a component body, the surface of the component body has a composite coating, the composite coating includes a magnetic coating and a plasma corrosion-resistant coating, the magnetic coating is provided on the Between the surface of the part body and the plasma corrosion resistant coating. The plasma corrosion-resistant component according to claim 1, wherein the magnetic coating material includes samarium cobalt magnets, neodymium iron boron magnets, ferrite magnets, iron cobalt magnets, alnico magnets, and iron platinum alloy magnets. at least one. The plasma corrosion resistant component according to claim 1, wherein the plasma corrosion resistant coating material comprises rare earth elements Y, Sc, La, Ce, Pr, Nd, Eu, Gd, Tb, Dy, Ho, Er, Tm At least one of , Yb and Lu. The plasma corrosion resistant component according to claim 1, wherein the plasma corrosion resistant coating comprises rare earth elements Y, Sc, La, Ce, Pr, Nd, Eu, Gd, Tb, Dy, Ho, Er, Tm, At least one of Yb, Lu oxide, fluoride or oxyfluoride. The plasma corrosion-resistant component according to claim 1, wherein the thickness of the magnetic coating is less than or equal to 100 μm. A method for forming a composite coating as described in any one of claim 1 to claim 5, comprising the following steps: A component body is placed in a processing chamber, and a first coating is applied on the surface of the component body, and the coating is a magnetic coating; A second coating is applied on the surface of the first coating, and the coating is a plasma corrosion resistant coating; Add magnetic properties to the first coating. The method for forming a composite coating according to claim 6, wherein the coating method of the first coating comprises at least one of suspension coating, spray coating, PVD, CVD, ALD, and aerosol deposition. The method for forming a composite coating according to claim 6, wherein the coating method of the second coating comprises at least one of CVD, ALD, and PVD. The method for forming a composite coating according to claim 6, wherein the density of the second coating is greater than or equal to 99%. The method for forming a composite coating as claimed in claim 6, wherein the method of adding magnetism is by arranging N-type or S-type permanent magnets on the surface of the component body, or by one of pulsed magnetic field, DC magnetic field, and alternating magnetic field Or a combination of ways to add magnetism. The method for forming a composite coating as claimed in claim 10, wherein the direction of the magnetic field of the additional magnetism is changed by changing the arrangement position of the N-type or S-type permanent magnets on the backside of the component body. The method for forming a composite coating according to claim 6, wherein the direction of the magnetic field of the additional magnetism forms an angle with the surface of the component body. The method for forming a composite coating according to claim 12, wherein the included angle ranges from 0° to 90°. A plasma reaction device, comprising a vacuum reaction chamber and the plasma corrosion-resistant component according to any one of claim 1 to claim 5. The plasma reaction device according to claim 14, wherein the inner cavity wall surface of the vacuum reaction chamber has the composite coating obtained by the composite coating formation method according to any one of claim 6 to claim 15 . The plasma reaction device according to claim 14, wherein the plasma reaction device is an inductively coupled plasma processing device, and the plasma corrosion-resistant parts include an inner bushing, a cover ring, a focus ring, an insulating ring, and a plasma confinement ring. one or more of the rings. The plasma reaction device according to claim 14, wherein the plasma reaction device is a capacitively coupled plasma processing device, and the plasma corrosion resistant parts include a gas shower head, an upper ground ring, a lower ground ring, a moving ring, One or more of cover ring, focus ring, insulating ring, plasma confinement ring.

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