TW202146479A - Fluororesin film and manufacturing method for same - Google Patents

Fluororesin film and manufacturing method for same Download PDF

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TW202146479A
TW202146479A TW110111547A TW110111547A TW202146479A TW 202146479 A TW202146479 A TW 202146479A TW 110111547 A TW110111547 A TW 110111547A TW 110111547 A TW110111547 A TW 110111547A TW 202146479 A TW202146479 A TW 202146479A
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film
polymer
temperature
tetrafluoroethylene
die
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笠井渉
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日商Agc股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/03Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
    • B29C48/07Flat, e.g. panels
    • B29C48/08Flat, e.g. panels flexible, e.g. films
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/25Component parts, details or accessories; Auxiliary operations
    • B29C48/285Feeding the extrusion material to the extruder
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/25Component parts, details or accessories; Auxiliary operations
    • B29C48/30Extrusion nozzles or dies
    • B29C48/305Extrusion nozzles or dies having a wide opening, e.g. for forming sheets
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/25Component parts, details or accessories; Auxiliary operations
    • B29C48/36Means for plasticising or homogenising the moulding material or forcing it through the nozzle or die
    • B29C48/395Means for plasticising or homogenising the moulding material or forcing it through the nozzle or die using screws surrounded by a cooperating barrel, e.g. single screw extruders
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/25Component parts, details or accessories; Auxiliary operations
    • B29C48/36Means for plasticising or homogenising the moulding material or forcing it through the nozzle or die
    • B29C48/50Details of extruders
    • B29C48/695Flow dividers, e.g. breaker plates
    • B29C48/70Flow dividers, e.g. breaker plates comprising means for dividing, distributing and recombining melt flows
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/25Component parts, details or accessories; Auxiliary operations
    • B29C48/88Thermal treatment of the stream of extruded material, e.g. cooling
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/30Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/304Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl halide (co)polymers, e.g. PVC, PVDC, PVF, PVDF
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F214/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen
    • C08F214/18Monomers containing fluorine
    • C08F214/26Tetrafluoroethene
    • C08F214/262Tetrafluoroethene with fluorinated vinyl ethers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18Manufacture of films or sheets
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2327/00Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers
    • C08J2327/02Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment
    • C08J2327/12Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C08J2327/18Homopolymers or copolymers of tetrafluoroethylene

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Extrusion Moulding Of Plastics Or The Like (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)

Abstract

Provided is a film constituted by a tetrafluoroethylene-based polymer, the film having a thickness of 100-200 [mu]m, a haze of 8% or less, and a thermal expansion/contraction rate, after heating for 30 minutes at 180 DEG C, of -1% to +1%, inclusive, in both a width direction and a flow direction thereof.

Description

氟樹脂膜及其製法Fluorine resin film and method for producing the same

本發明係關於一種四氟乙烯系聚合物之膜及其製造方法。The present invention relates to a film of a tetrafluoroethylene-based polymer and a method for producing the same.

隨著電子機器之輕量化、小型化之發展,為了應對機器內之配線量或空間限制,廣泛地採用軟性印刷配線板(FPC)作為輕量且具備柔軟性之配線材料。近年來,印刷配線板中之傳輸信號日益高速化,而信號亦隨之高頻化。伴隨於此,對於FPC,強烈要求其於高頻區域內之低介電特性(低介電常數,低介電損耗因數)。針對此要求,提出有採用如下基材膜作為FPC所使用之基材膜,該基材膜係由具有低介電特性之液晶聚合物(LCP)、對排聚苯乙烯(SPS)、聚苯硫醚(PPS)等以代替先前之聚醯亞胺(PI)、聚對苯二甲酸乙二酯(PET)來構成。 另一方面,隨著人們對電子機器之設計性提昇之不斷追求,將軟性顯示器或觸控面板等軟性裝置、或者LED(Light Emitting Diode,發光二極體)等半導體元件進行回焊而使用之電子機器等越來越多地在可見之部位使用FPC。於此種電子機器等中,FPC需要兼具透明性。With the development of light weight and miniaturization of electronic equipment, flexible printed wiring boards (FPC) are widely used as light-weight and flexible wiring materials in order to cope with the limitation of wiring quantity or space in the equipment. In recent years, the transmission signal in the printed wiring board has become increasingly high-speed, and the signal has also increased in frequency. Along with this, low dielectric properties (low dielectric constant, low dielectric loss factor) in the high frequency region are strongly required for FPC. In response to this requirement, it is proposed to use the following substrate film as the substrate film for FPC. Sulfide (PPS) or the like is constituted in place of the conventional polyimide (PI) and polyethylene terephthalate (PET). On the other hand, with the continuous pursuit of improving the design of electronic equipment, flexible devices such as flexible displays and touch panels, or semiconductor components such as LEDs (Light Emitting Diodes) are used for reflow. Electronic machines, etc. are increasingly using FPC in visible parts. In such electronic devices, etc., the FPC needs to have both transparency.

PI膜雖然耐熱性優異,但於透明性方面存在問題。PET膜雖然透明性優異,但耐熱性較低,當用於軟性印刷配線板時,存在基材因回焊時之熱而產生翹曲或尺寸變化之問題。聚四氟乙烯(PTFE)等四氟乙烯系聚合物具有較高之透明度,且耐化學品性、撥水撥油性、耐熱性、電特性等物性優異,與PI、LCP、SPS、PPS等材料相比,介電常數與介電損耗因數亦較低,因此可用作透明且耐回焊性優異之FPC之基材膜。 另一方面,四氟乙烯系聚合物之尺寸穩定性較差,於電路加工階段容易發生位置偏移。因此,於專利文獻1中,提出有於製成膜之後利用退火處理(熱處理)去除其應變之方法。 先前技術文獻 專利文獻Although PI film is excellent in heat resistance, it has a problem in transparency. Although PET film has excellent transparency, it has low heat resistance, and when it is used in a flexible printed wiring board, there is a problem that the substrate is warped or dimensionally changed due to the heat during reflow. Tetrafluoroethylene polymers such as polytetrafluoroethylene (PTFE) have high transparency and excellent physical properties such as chemical resistance, water and oil repellency, heat resistance, and electrical properties, and are compatible with PI, LCP, SPS, PPS and other materials. In comparison, the dielectric constant and the dielectric loss factor are also low, so it can be used as the base film of FPC which is transparent and excellent in reflow resistance. On the other hand, tetrafluoroethylene-based polymers have poor dimensional stability and are prone to positional displacement during circuit processing. Therefore, Patent Document 1 proposes a method of removing the strain by annealing treatment (heat treatment) after film formation. prior art literature Patent Literature

專利文獻1:國際公開2019/203243號Patent Document 1: International Publication No. 2019/203243

[發明所欲解決之問題][Problems to be Solved by Invention]

四氟乙烯系聚合物具有結晶性,其結晶容易於熔融成形體之冷卻過程中生長,因此所獲得之膜即便光線透過率較高,其霧度亦容易變大。又,若膜變厚,則即便採取如專利文獻1之方法進行熱處理,亦難以消除應變,而且尺寸穩定性變差,因此,熱處理有時會使膜之平坦性受損。The tetrafluoroethylene-based polymer has crystallinity, and its crystals tend to grow during the cooling process of the melt-molded body. Therefore, even if the light transmittance of the obtained film is high, the haze tends to increase. In addition, when the film becomes thick, even if heat treatment is performed by the method of Patent Document 1, it is difficult to relieve the strain and the dimensional stability is deteriorated. Therefore, the flatness of the film may be impaired by the heat treatment.

本發明者進行了銳意研究,結果找出了尺寸穩定性良好,霧度較低,電路形成中之良率較佳,且能夠兼顧透明性與耐熱性之膜。 本發明之目的在於提供一種具備上述特性之膜及其製造方法。 [解決問題之技術手段]The inventors of the present invention have conducted intensive research, and as a result, have found a film that has good dimensional stability, low haze, good yield in circuit formation, and can achieve both transparency and heat resistance. An object of the present invention is to provide a film having the above-mentioned properties and a method for producing the same. [Technical means to solve problems]

本發明具有下述形態。 <1>一種膜,其係由四氟乙烯系聚合物構成之擠出成形膜,其厚度為100~200 μm,霧度為8%以下,180℃下加熱30分鐘後之熱伸縮率於膜之行進方向及寬度方向均為-1~+1%。 <2>如<1>之膜,其中上述四氟乙烯系聚合物包含基於四氟乙烯之單元及基於全氟(烷基乙烯基醚)之單元。 <3>如<1>或<2>之膜,其中上述四氟乙烯系聚合物包含基於全氟(烷基乙烯基醚)之單元且具有極性官能基、或相對於全部單元包含2.0~5.0莫耳%之基於全氟(烷基乙烯基醚)之單元且不具有極性官能基。 <4>如<1>至<3>中任一項之膜,其中上述四氟乙烯系聚合物之熔融溫度為260~320℃。The present invention has the following aspects. <1> A film, which is an extrusion-molded film composed of a tetrafluoroethylene-based polymer, the thickness of which is 100 to 200 μm, the haze is 8% or less, and the thermal expansion ratio after heating at 180°C for 30 minutes is the same as the film. The travel direction and the width direction are both -1 to +1%. <2> The film according to <1>, wherein the tetrafluoroethylene-based polymer includes a tetrafluoroethylene-based unit and a perfluoro(alkyl vinyl ether)-based unit. <3> The film according to <1> or <2>, wherein the tetrafluoroethylene-based polymer contains a perfluoro(alkyl vinyl ether)-based unit and has a polar functional group, or contains 2.0 to 5.0 with respect to all units Molar % of units based on perfluoro(alkyl vinyl ether) and without polar functional groups. <4> The film according to any one of <1> to <3>, wherein the melting temperature of the tetrafluoroethylene-based polymer is 260 to 320°C.

<5>一種如上述<1>至<4>中任一項之膜之製造方法,其係藉由T模鑄法製造該如上述<1>至<4>中任一項之膜之方法,其包括如下操作:將上述四氟乙烯系聚合物以熔融狀態自模頭吐出而擠出成形,將所得之膜夾入受到溫度控制之2根輥之間使其冷卻。 <6>如<5>之製造方法,其中上述受到溫度控制之2根輥,其中一根之溫度為150~250℃,另一根之溫度為80~150℃。 <7>如<5>或<6>之製造方法,其中具備具有混練部及連接於上述混練部之料斗的擠出成形裝置,於向上述料斗中投入熔融溫度為260~320℃之四氟乙烯系聚合物之顆粒,將經上述混練部熔融且混練後之熔融混練物自T模吐出而製造膜時,進而包括如下操作:將上述料斗之與上述混練部之連接部中之上述顆粒之溫度調整至(上述熔融溫度-200)~(上述熔融溫度-100)℃之範圍內,然後將上述顆粒供給至上述混練部。 <8>如<5>至<7>中任一項之製造方法,其中上述顆粒之直徑為1.0~4.0 mm。<5> A method for producing the film according to any one of the above <1> to <4>, which is a method for producing the film according to any one of the above <1> to <4> by a T-die casting method , which includes the following operations: the above-mentioned tetrafluoroethylene-based polymer is extruded from a die in a molten state and extruded, and the obtained film is sandwiched between two temperature-controlled rolls and cooled. <6> The manufacturing method according to <5>, wherein the temperature of one of the two rolls subject to temperature control is 150 to 250°C, and the temperature of the other is 80 to 150°C. <7> The production method according to <5> or <6>, comprising an extrusion molding apparatus having a kneading section and a hopper connected to the kneading section, and feeding tetrafluoroethylene having a melting temperature of 260 to 320° C. into the hopper When the pellets of the vinyl polymer are melted and kneaded by the above-mentioned kneading section and the melt-kneaded product is discharged from the T-die to produce a film, the following operation is further included: After the temperature is adjusted within the range of (the above-mentioned melting temperature-200) to (the above-mentioned melting temperature-100)° C., the above-mentioned pellets are supplied to the above-mentioned kneading section. <8> The production method according to any one of <5> to <7>, wherein the diameter of the particles is 1.0 to 4.0 mm.

<9>如<5>至<8>中任一項之製造方法,其中上述料斗係具備第1階部、及配置於較上述第1階部更靠上述混練部側之第2階部的多階式料斗。 <10>如<5>至<9>中任一項之製造方法,其中上述料斗之最靠近上述混練部之階部內之壓力為1000 Pa以下。 <11>如<5>至<10>中任一項之製造方法,其中上述擠出成形裝置具備:T模,其連接於上述混練部之軸方向上與上述料斗相反側;及靜止型混合器,其設置於上述混練部與上述T模之間。 <12>如<5>至<11>中任一項之製造方法,其進而包括如下操作:將上述四氟乙烯系聚合物以熔融狀態自T模吐出,對上述熔融狀態之四氟乙烯系聚合物在其接觸第一個冷卻輥之前利用非接觸式加熱部進行加熱。 <13>如<12>之製造方法,其中上述T模內之上述四氟乙烯系聚合物之溫度與上述第一個冷卻輥之溫度的差為250℃以下。 <14>如<12>或<13>之製造方法,其中上述T模內之上述四氟乙烯系聚合物之溫度與上述非接觸式加熱部之溫度之差的絕對值為70℃以下。<9> The manufacturing method according to any one of <5> to <8>, wherein the hopper is provided with a first stage portion and a second stage portion arranged on the side of the kneading portion with respect to the first stage portion. Multi-stage hopper. <10> The production method according to any one of <5> to <9>, wherein the pressure in the step portion of the hopper closest to the kneading portion is 1000 Pa or less. <11> The production method according to any one of <5> to <10>, wherein the extrusion molding apparatus includes: a T die connected to the kneading section on the opposite side of the hopper in the axial direction; and a static mixer A device is arranged between the above-mentioned kneading part and the above-mentioned T-die. <12> The production method according to any one of <5> to <11>, further comprising an operation of discharging the tetrafluoroethylene-based polymer in a molten state from a T-die, and treating the tetrafluoroethylene-based polymer in a molten state The polymer is heated with a non-contact heating section before it contacts the first chill roll. <13> The production method according to <12>, wherein the difference between the temperature of the tetrafluoroethylene-based polymer in the T-die and the temperature of the first cooling roll is 250°C or less. <14> The production method according to <12> or <13>, wherein the absolute value of the difference between the temperature of the tetrafluoroethylene-based polymer in the T-die and the temperature of the non-contact heating portion is 70°C or less.

<15>一種積層體,其具有由如上述<1>至<4>中任一項之膜構成之層、與由該膜以外之基材構成之基材層。 [發明之效果]<15> A layered body having a layer composed of the film according to any one of the above <1> to <4>, and a base material layer composed of a base material other than the film. [Effect of invention]

根據本發明,提供一種尺寸穩定性良好,霧度較低,電路形成中之良率較佳,且能夠兼顧透明性與耐熱性之膜及其製造方法。根據本發明,尤其可提供一種作為天線基板之基材較佳之100 μm左右之較厚之膜。本發明之膜可用作無色透明且低損耗之天線基板。According to the present invention, there is provided a film with good dimensional stability, low haze, good yield in circuit formation, and both transparency and heat resistance, and a manufacturing method thereof. According to the present invention, in particular, a relatively thick film of about 100 μm, preferably as a base material of an antenna substrate, can be provided. The film of the present invention can be used as a colorless, transparent and low-loss antenna substrate.

以下之用語具有下述含義。 「膜之厚度」係利用接觸式厚度計DG-525H(小野測器公司製造),使用探針AA-026(ϕ10 mm,SR7),於寬度方向上等距離地測定10點膜之厚度所得之測定值的平均值。 「聚合物之熔融溫度」係與藉由示差掃描熱量測定(DSC)法所測得之熔融峰之最大值對應的溫度。 聚合物中之「單元」意指藉由單體之聚合而形成之基於上述單體1分子的原子團。單元可為藉由聚合反應直接形成之單元,亦可為對聚合物進行處理而使上述單元之一部分轉換成其他結構之單元。以下,基於單體a之單元亦簡記為「單體a單元」。 「聚合物之玻璃轉移點」係藉由動態黏彈性測定(DMA)法對聚合物進行分析所測得之值。The following terms have the following meanings. "Film thickness" is obtained by measuring the thickness of the film at 10 points in the width direction at equal distances using a contact thickness gauge DG-525H (manufactured by Ono Shoki Co., Ltd.) and a probe AA-026 (ϕ10 mm, SR7). The average of the measured values. The "melting temperature of the polymer" is the temperature corresponding to the maximum value of the melting peak measured by differential scanning calorimetry (DSC). The "unit" in the polymer means an atomic group based on 1 molecule of the above-mentioned monomer formed by the polymerization of the monomer. The unit may be a unit directly formed by a polymerization reaction, or a unit in which a part of the above-mentioned unit is converted into another structure by treating the polymer. Hereinafter, the unit based on the monomer a is also abbreviated as "monomer a unit". The "glass transition point of the polymer" is the value determined by analyzing the polymer by the dynamic viscoelasticity measurement (DMA) method.

本發明之膜係由四氟乙烯系聚合物(以下,亦記為「F聚合物」)構成之擠出成形膜,厚度為100~200 μm,霧度為8%以下,180℃下加熱30分鐘後之熱伸縮率於膜之行進方向(以下,記為MD)及寬度方向(以下,記為TD)均為-1~+1%。 本發明之膜亦可為捲取狀態之捲筒膜。 又,作為具有由本發明之膜構成之層與由本發明之膜以外之基材構成之基材層的本發明之積層體,較佳為由本發明之膜與金屬箔積層而成之積層體。關於此種由本發明之膜與金屬箔積層而成之積層體,若切斷成特定之長度,並且將金屬箔加工成傳輸電路(包含貫孔(via)),則可適宜地用作FPC,例如適宜用作無色透明且電特性優異之天線基板。 再者,下文中將上述由本發明之膜構成之層稱為「F聚合物層」,由本發明之膜以外之基材構成之基材層只要未特別言明,則於下文中簡稱為「基材層」。The film of the present invention is an extrusion-molded film composed of a tetrafluoroethylene-based polymer (hereinafter, also referred to as "F polymer"), with a thickness of 100-200 μm, a haze of 8% or less, and heated at 180°C for 30 The thermal expansion and contraction rate after one minute is -1 to +1% in both the advancing direction (hereinafter, referred to as MD) and the width direction (hereinafter, referred to as TD) of the film. The film of the present invention may also be a roll film in a wound state. Moreover, as the laminated body of this invention which has the layer which consists of the film of this invention and the base material layer which consists of a base material other than the film of this invention, the laminated body which laminated|stacked the film of this invention and a metal foil is preferable. Such a laminate formed by laminating the film and metal foil of the present invention can be suitably used as an FPC if it is cut to a specific length and the metal foil is processed into a transmission circuit (including vias). For example, it is suitable for use as an antenna substrate that is colorless and transparent and has excellent electrical properties. Furthermore, the layer composed of the film of the present invention is hereinafter referred to as "F polymer layer", and the substrate layer composed of substrates other than the film of the present invention is hereinafter referred to as "substrate" unless otherwise specified. Floor".

通常之熱熔性氟樹脂之膜中,會殘存該製法(利用擠出成形之熔融成形法)所引起之成形應變。關於本發明之膜,藉由如下所述般適當地控制成形時之樹脂膜之冷卻條件,而使MD及TD均為-1~+1%之熱伸縮率,各個方向之應變較小且充分地均勻化,尺寸穩定性優異,並且即便厚度為100~200 μm,霧度亦為8%以下,透明性優異。 因此,具有該膜層之積層體由於應變較小且充分地均勻化,故認為其熱衝擊性優異並且變形得到抑制,且尺寸穩定性優異。例如,以金屬箔為基材層之本發明之積層體於加工成印刷配線板時,其形成通孔(through hole)或貫孔時之耐熱衝擊性較高,結果易於獲得不易發生斷線之印刷配線板。Forming strain caused by this production method (melt forming method by extrusion forming) remains in a film of a normal hot-melt fluororesin. Regarding the film of the present invention, by appropriately controlling the cooling conditions of the resin film during molding as described below, both MD and TD have a thermal expansion and contraction ratio of -1 to +1%, and the strain in each direction is small and sufficient Even if the thickness is 100 to 200 μm, the haze is 8% or less, and the transparency is excellent. Therefore, since the laminated body having this film layer has small strain and is sufficiently uniform, it is considered that it is excellent in thermal shock resistance, suppresses deformation, and is excellent in dimensional stability. For example, when the laminate of the present invention using metal foil as the base layer is processed into a printed wiring board, the thermal shock resistance when forming through holes or through holes is high, and as a result, it is easy to obtain a product that is less prone to breakage. printed wiring board.

再者,膜之熱伸縮率係以如下方式進行測定。首先,自膜切出具有沿著MD之兩邊及沿著TD之兩邊的12 cm見方之正方形之試片。其次,於所獲得之試片之表面,沿MD及TD分別描繪長度10 cm之線段。繼而,將該試片放入180℃之烘箱中加熱30分鐘後取出,自然冷卻至25℃,然後再次測定線段之長度。 熱伸縮率係按照式:{(加熱前之線段之長度)-(加熱後之線段之長度)}/(加熱前之線段之長度)×100計算出之值。即,熱伸縮率係加熱前後之線段長度之變化率(百分率)。再者,負數表示膜伸長,正數表示膜收縮。 本發明之膜之熱伸縮率於膜之MD及TD均為-1~+1%,分別較佳為-0.8~+0.8%,更佳為-0.5~+0.5%。若熱伸縮率處於上述範圍內,則即便被加熱,亦更難因膜之應變而產生皺褶。In addition, the thermal expansion-contraction rate of a film was measured as follows. First, a test piece having a square of 12 cm square along both sides of the MD and along the two sides of the TD was cut out of the film. Next, on the surface of the obtained test piece, a line segment with a length of 10 cm is drawn along MD and TD, respectively. Then, the test piece was heated in an oven at 180° C. for 30 minutes, taken out, cooled to 25° C. naturally, and then the length of the line segment was measured again. The thermal expansion ratio is calculated according to the formula: {(length of line segment before heating)-(length of line segment after heating)}/(length of line segment before heating)×100. That is, the thermal expansion and contraction rate is the change rate (percentage) of the segment length before and after heating. In addition, a negative number represents film elongation, and a positive number represents film shrinkage. The thermal expansion ratio of the film of the present invention is -1 to +1% in both MD and TD of the film, preferably -0.8 to +0.8%, respectively, and more preferably -0.5 to +0.5%. When the thermal expansion ratio is within the above range, even if it is heated, it becomes more difficult to generate wrinkles due to the strain of the film.

本發明中之F聚合物係包含基於四氟乙烯(TFE)之單元(TFE單元)之聚合物。本發明中之F聚合物為熱熔性,其熔融溫度較佳為260~320℃,更佳為275~315℃,進而較佳為290~310℃。於該情形時,F聚合物之成形加工性與本發明之膜之機械強度容易取得平衡。 F聚合物之玻璃轉移點較佳為75~125℃,更佳為80~100℃。The F polymer in the present invention is a polymer comprising tetrafluoroethylene (TFE) based units (TFE units). The F polymer in the present invention is hot-melt, and its melting temperature is preferably 260-320°C, more preferably 275-315°C, and still more preferably 290-310°C. In this case, the formability of the F polymer and the mechanical strength of the film of the present invention are easily balanced. The glass transition point of the F polymer is preferably 75 to 125°C, more preferably 80 to 100°C.

作為F聚合物,可例舉聚四氟乙烯(PTFE)、包含TFE單元及基於全氟(烷基乙烯基醚)(PAVE)之單元(PAVE單元)的聚合物(PFA)、包含基於六氟丙烯(HFP)之單元的聚合物(FEP),較佳為PFA。作為PAVE,較佳為CF2 =CFOCF3 、CF2 =CFOCF2 CF3 及CF2 =CFOCF2 CF2 CF3 (PPVE),更佳為PPVE。As the F polymer, polytetrafluoroethylene (PTFE), a polymer (PFA) containing a TFE unit and a unit (PAVE unit) based on a perfluoro(alkyl vinyl ether) (PAVE), a hexafluoro-based A polymer (FEP) of units of propylene (HFP), preferably PFA. As PAVE, CF 2 =CFOCF 3 , CF 2 =CFOCF 2 CF 3 , and CF 2 =CFOCF 2 CF 2 CF 3 (PPVE) are preferred, and PPVE is more preferred.

F聚合物較佳為具有極性官能基。極性官能基可包含於F聚合物中之單元,亦可包含於F聚合物之主鏈之末端基。作為後者之形態,可例舉聚合起始劑、具有極性官能基作為源自鏈轉移劑等之末端基的F聚合物、具有對F聚合物進行電漿處理或電離輻射處理而獲得之極性官能基的F聚合物。作為極性官能基,較佳為含有羥基之基及含有羰基之基。 作為含有羥基之基,較佳為含有醇性羥基之基,更佳為-CF2 CH2 OH及-C(CF3 )2 OH。 含有羰基之基係包含羰基(>C(O))之基,作為含有羰基之基,較佳為羧基、烷氧羰基、醯胺基、異氰酸酯基、胺基甲酸酯基(-OC(O)NH2 )、酸酐殘基(-C(O)OC(O)-)、醯亞胺殘基(-C(O)NHC(O)-等)及碳酸酯基(-OC(O)O-),更佳為酸酐殘基。The F polymer preferably has polar functional groups. The polar functional group may be included in the unit of the F polymer, and may also be included in the terminal group of the main chain of the F polymer. Examples of the latter form include a polymerization initiator, an F polymer having a polar functional group as a terminal group derived from a chain transfer agent or the like, and a polar functional polymer obtained by subjecting the F polymer to plasma treatment or ionizing radiation treatment. base F polymer. As the polar functional group, a hydroxyl group-containing group and a carbonyl group-containing group are preferable. As a group containing a hydroxyl group, a group containing an alcoholic hydroxyl group is preferable, and -CF 2 CH 2 OH and -C(CF 3 ) 2 OH are more preferable. The carbonyl group-containing group is a group containing a carbonyl group (>C(O)), and as the carbonyl group-containing group, a carboxyl group, an alkoxycarbonyl group, an amide group, an isocyanate group, a carbamate group (-OC(O) are preferred. )NH 2 ), acid anhydride residues (-C(O)OC(O)-), imide residues (-C(O)NHC(O)- etc.) and carbonate groups (-OC(O)O -), more preferably an acid anhydride residue.

於F聚合物具有含有羰基之基之情形時,F聚合物中之含有羰基之基之個數係相對於主鏈之碳數1×106 個,較佳為10~5000個,更佳為100~3000個,進而較佳為800~1500個。再者,F聚合物中之含有羰基之基之個數可根據聚合物之組成或國際公開第2020/145133號中所記載之方法來定量。When the F polymer has a carbonyl group-containing group, the number of carbonyl group-containing groups in the F polymer is 1×10 6 relative to the carbon number of the main chain, preferably 10-5000, more preferably 100 to 3000 pieces, more preferably 800 to 1500 pieces. In addition, the number of the carbonyl group-containing groups in the F polymer can be quantified according to the composition of the polymer or the method described in International Publication No. WO 2020/145133.

作為F聚合物,較佳為聚合物(1)及聚合物(2),上述聚合物(1)包含TFE單元及PAVE單元且具有極性官能基,上述聚合物(2)包含TFE單元及PAVE單元,且PAVE單元之含量為相對於全部單元之2.0~5.0莫耳%,且不具有極性官能基。 該等F聚合物容易在成形物中形成微小球晶,易於提高與其他成分之密接性。結果,更易於獲得表面平滑性、接著性及電特性優異之成形物。The F polymer is preferably a polymer (1) and a polymer (2), wherein the polymer (1) includes a TFE unit and a PAVE unit and has a polar functional group, and the polymer (2) includes a TFE unit and a PAVE unit , and the content of PAVE units is 2.0 to 5.0 mol % relative to all units, and it does not have polar functional groups. These F polymers are easy to form fine spherulites in the molded product, and it is easy to improve the adhesion with other components. As a result, it becomes easier to obtain a molded product excellent in surface smoothness, adhesiveness, and electrical properties.

聚合物(1)較佳為包含TFE單元、PAVE單元及基於具有極性官能基之單體之單元的聚合物,更佳為相對於全部單元,包含90~99莫耳%之TFE單元、0.5~9.97莫耳%之PAVE單元、0.01~3莫耳%之基於具有極性官能基之單體之單元的聚合物。又,作為具有極性官能基之單體,較佳為衣康酸酐、檸康酸酐及5-降莰烯-2,3-二羧酸酐(以下,亦記為「NAH」)。作為聚合物(1)之具體例,可例舉國際公開第2018/16644號中所記載之聚合物。The polymer (1) is preferably a polymer containing a TFE unit, a PAVE unit and a unit based on a monomer having a polar functional group, more preferably a TFE unit of 90 to 99 mol %, 0.5 to 99 mol % of the total unit. 9.97 mol % of PAVE units, 0.01-3 mol % of units based on monomers with polar functional groups. In addition, as the monomer having a polar functional group, itaconic anhydride, citraconic anhydride, and 5-norbornene-2,3-dicarboxylic anhydride (hereinafter, also referred to as "NAH") are preferred. As a specific example of the polymer (1), the polymer described in International Publication No. 2018/16644 can be mentioned.

聚合物(2)較佳為僅包含TFE單元及PAVE單元,且相對於全部單元,含有95.0~98.0莫耳%之TFE單元及2.0~5.0莫耳%之PAVE單元。聚合物(2)中之PAVE單元之含量係相對於全部單元,較佳為2.1~5.0莫耳%,更佳為2.2~5.0莫耳%。 再者,聚合物(2)不具有極性官能基意指相對於構成聚合物主鏈之碳原子數1×106 個,聚合物所具有之極性官能基之個數未達500個。上述極性官能基之個數較佳為100個以下,更佳為未達50個。上述極性官能基之個數之下限通常為0個。 聚合物(2)可使用不會產生極性官能基作為聚合物鏈之末端基的聚合起始劑或鏈轉移劑等來製造,亦可對具有極性官能基之F聚合物(於聚合物之主鏈之末端基具有源自聚合起始劑之極性官能基的F聚合物等)進行氟化處理來製造。作為氟化處理之方法,可例舉使用氟氣體之方法(參照日本專利特開2019-194314號公報等)。The polymer (2) preferably contains only TFE units and PAVE units, and contains 95.0 to 98.0 mol % of TFE units and 2.0 to 5.0 mol % of PAVE units with respect to all units. The content of the PAVE units in the polymer (2) is preferably 2.1 to 5.0 mol %, more preferably 2.2 to 5.0 mol %, based on the total units. Furthermore, the fact that the polymer (2) does not have polar functional groups means that the number of polar functional groups contained in the polymer is less than 500 with respect to the number of carbon atoms constituting the main chain of the polymer, 1×10 6 . The number of the above-mentioned polar functional groups is preferably 100 or less, more preferably less than 50. The lower limit of the number of the above-mentioned polar functional groups is usually zero. The polymer (2) can be produced by using a polymerization initiator or a chain transfer agent that does not generate polar functional groups as the terminal groups of the polymer chain, and can also be used for F polymers with polar functional groups (in the main polymer of the polymer). The terminal group of the chain has a polar functional group derived from a polymerization initiator, such as an F polymer, etc.), and is produced by fluorination treatment. As a method of the fluorination treatment, a method using a fluorine gas can be mentioned (refer to Japanese Patent Laid-Open No. 2019-194314, etc.).

本發明之膜可包含除F聚合物以外之其他樹脂。但是,膜所包含之F聚合物之含量較佳為80質量%以上,進而較佳為100質量%。作為除F聚合物以外之其他樹脂,可例舉環氧樹脂、聚醯亞胺樹脂、作為聚醯亞胺前驅物之聚醯胺酸、丙烯酸樹脂、酚系樹脂、液晶性聚酯樹脂、聚烯烴樹脂、改性聚苯醚樹脂、多官能氰酸酯樹脂、多官能馬來醯亞胺-氰酸酯樹脂、多官能性馬來醯亞胺樹脂、乙烯酯樹脂、脲樹脂、鄰苯二甲酸二烯丙酯樹脂、三聚氰胺樹脂、胍胺樹脂、三聚氰胺-脲共縮合樹脂、苯乙烯樹脂、聚碳酸酯樹脂、聚芳酯樹脂、聚碸、聚芳碸、芳香族聚醯胺樹脂、芳香族聚醚醯胺、聚苯硫醚、聚芳醚酮、聚醯胺醯亞胺、聚苯醚。The films of the present invention may contain other resins than F polymers. However, the content of the F polymer contained in the film is preferably 80% by mass or more, and more preferably 100% by mass. Examples of other resins other than the F polymer include epoxy resins, polyimide resins, polyimide as precursors of polyimide, acrylic resins, phenolic resins, liquid crystalline polyester resins, polyimide resins, and polyimide resins. Olefin resin, modified polyphenylene ether resin, polyfunctional cyanate resin, polyfunctional maleimide-cyanate resin, polyfunctional maleimide resin, vinyl ester resin, urea resin, phthalate Diallyl formate resin, melamine resin, guanamine resin, melamine-urea co-condensation resin, styrene resin, polycarbonate resin, polyarylate resin, polyarylene, polyarylene, aromatic polyamide resin, aromatic Polyetheramide, polyphenylene sulfide, polyaryletherketone, polyamideimide, polyphenylene ether.

本發明之膜例如亦可進而包含無機填料、有機填料、觸變性賦予劑、消泡劑、矽烷偶合劑、脫水劑、塑化劑、耐候劑、抗氧化劑、熱穩定劑、潤滑劑、抗靜電劑、增白劑、著色劑、導電劑、脫模劑、表面處理劑、黏度調節劑、阻燃劑等。The film of the present invention may further contain, for example, an inorganic filler, an organic filler, a thixotropy imparting agent, an antifoaming agent, a silane coupling agent, a dehydrating agent, a plasticizer, a weathering agent, an antioxidant, a heat stabilizer, a lubricant, and an antistatic agent. Agents, brighteners, colorants, conductive agents, mold release agents, surface treatment agents, viscosity modifiers, flame retardants, etc.

作為無機填料,較佳為氮化硼填料、氧化鈹填料(鈹之氧化物之填料)、矽酸鹽填料(氧化矽填料、矽灰石填料、滑石填料)及金屬氧化物(氧化鈰、氧化鋁、氧化鎂、氧化鋅、氧化鈦等)填料。又,無機填料亦可其表面之至少一部分經表面處理。作為該表面處理所使用之表面處理劑,可例舉多元醇、飽和脂肪酸、其酯、胺、石蠟、矽烷偶合劑、矽酮、聚矽氧烷。 無機填料之形狀可為粒狀、針狀(纖維狀)、板狀等中之任一種,作為具體之形狀,可例舉球狀、鱗片狀、層狀、葉片狀、杏仁狀、柱狀、雞冠狀、等軸狀、葉狀、雲母狀、塊狀、平板狀、楔狀、玫瑰花狀、網狀、角柱狀。As inorganic fillers, boron nitride fillers, beryllium oxide fillers (fillers of beryllium oxides), silicate fillers (silicon oxide fillers, wollastonite fillers, talc fillers) and metal oxides (cerium oxide, oxide Aluminum, magnesium oxide, zinc oxide, titanium oxide, etc.) fillers. Moreover, at least a part of the surface of an inorganic filler may be surface-treated. As the surface treatment agent used for the surface treatment, polyols, saturated fatty acids, esters thereof, amines, paraffins, silane coupling agents, silicones, and polysiloxanes may, for example, be mentioned. The shape of the inorganic filler can be any of granular, needle-like (fibrous), plate-like, and the like, and specific shapes include spherical, scaly, lamellar, leaf-like, almond-like, and columnar shapes. , cockscomb, equiaxed, leaf, mica, block, plate, wedge, rosette, reticulate, angular column.

以下,說明本發明之膜之製造方法。要想能夠調整膜之應變,本發明之膜可適宜地藉由T模鑄法(利用T模之熔融擠出法)製造。 本發明人等已瞭解到,T模鑄法所引起之膜之MD及TD之應變依存於熔融狀態之F聚合物之狀態(溫度、流動性)與冷卻條件,由自T模吐出之熔融之F聚合物藉由冷卻輥而結晶化為止之狀態決定。換言之,本發明人等已瞭解到,若適當地設定上述F聚合物之狀態與冷卻條件來控制F聚合物之結晶化,則可使所獲得之膜之MD及TD之熱收縮率(應變)收束於特定範圍內,並且由於結晶生長之抑制,而即便為100~200 μm之類的相對較厚之膜,亦可達成低霧度。Hereinafter, the manufacturing method of the film of this invention is demonstrated. In order to be able to adjust the strain of the film, the film of the present invention can be suitably produced by a T-die casting method (melt extrusion method using a T-die). The present inventors have found that the strain of MD and TD of the film caused by the T-die casting method depends on the state (temperature, fluidity) and cooling conditions of the F polymer in the molten state. The state until the F polymer is crystallized by the cooling roll is determined. In other words, the present inventors have found that if the state of the F polymer and the cooling conditions are appropriately set to control the crystallization of the F polymer, the thermal shrinkage (strain) of the MD and TD of the obtained film can be obtained. Condensed within a specific range, and due to the suppression of crystal growth, even a relatively thick film such as 100 to 200 μm can achieve low haze.

本發明之膜之製造方法包括如下操作:將F聚合物以熔融狀態自T模吐出而擠出成形,將所得之膜夾入受到溫度控制之2根輥之間使其冷卻(本法1)。適宜使上述受到溫度控制之2根輥中之一根之溫度為150~250℃,另一根之溫度為80~150℃。進而適宜使上述受到溫度控制之2根輥中之1根為被控制在150~250℃之金屬輥,另一根為被控制在80~150℃之金屬彈性輥。The production method of the film of the present invention includes the following operations: the F polymer is extruded from a T die in a molten state, and the resulting film is sandwiched between two temperature-controlled rolls and cooled (this method 1) . The temperature of one of the above-mentioned two rolls subject to temperature control is preferably 150 to 250°C, and the temperature of the other is 80 to 150°C. Furthermore, one of the two temperature-controlled rolls is preferably a metal roll controlled at 150 to 250°C, and the other is a metal elastic roll controlled at 80 to 150°C.

圖1係表示本法1所使用之膜之製造裝置之一實施方式的概略圖。圖1所示之製造裝置10具有T模20、配置於T模20之鉛直下方之第1冷卻輥(第一個冷卻輥)30、急冷輥301、與第1冷卻輥30並設之第2冷卻輥40、捲取膜1之捲取輥50、及配置於捲取輥50與第2冷卻輥40之間之搬送輥61、62。 又,第1冷卻輥30亦可進而具備氣刀70,較佳為具備氣刀70。FIG. 1 is a schematic diagram showing an embodiment of a film manufacturing apparatus used in the present method 1. FIG. The manufacturing apparatus 10 shown in FIG. 1 includes a T-die 20 , a first cooling roll (first cooling roll) 30 arranged vertically below the T-die 20 , a quenching roll 301 , and a second cooling roll 30 arranged in parallel with the first cooling roll 30 . The cooling roll 40 , the winding roll 50 that winds up the film 1 , and the conveying rolls 61 and 62 arranged between the winding roll 50 and the second cooling roll 40 . Moreover, the 1st cooling roll 30 may further be equipped with the air knife 70, Preferably it is equipped with the air knife 70.

F聚合物係在與T模20連接之擠出機(未圖示)內被加熱而熔融,然後被供給至T模20內。熔融狀態之F聚合物自T模20之模唇21朝向第1冷卻輥30吐出。繼而,吐出之熔融狀態之F聚合物接觸於第1冷卻輥30,並且藉由急冷輥301使F聚合物夾於第1冷卻輥30從而冷卻。進而,F聚合物通過第2冷卻輥40之後,被搬送輥61、62搬送。其後,F聚合物作為膜1被捲取至捲取輥50。作為第1冷卻輥30,較佳為使用能夠進行溫度控制之金屬輥,作為急冷輥301,較佳為使用金屬彈性輥。The F polymer is heated and melted in an extruder (not shown) connected to the T die 20 , and then fed into the T die 20 . The molten F polymer is discharged toward the first cooling roll 30 from the die lip 21 of the T die 20 . Then, the molten F polymer discharged is brought into contact with the first cooling roll 30, and the F polymer is sandwiched between the first cooling roll 30 by the quench roll 301 and cooled. Furthermore, the F polymer is conveyed by the conveyance rollers 61 and 62 after passing through the second cooling roll 40 . After that, the F polymer is wound up to the winding roll 50 as the film 1 . As the first cooling roll 30, a metal roll capable of temperature control is preferably used, and as the quench roll 301, a metal elastic roll is preferably used.

作為金屬彈性輥,可例舉表面由不鏽鋼等金屬材料構成且該表面金屬材料與軸輥之間填充有流體或橡膠等彈性材料的輥。金屬彈性輥例如包含:軸輥,其呈大致圓柱狀且旋轉自如地設置;金屬製薄膜,其以覆蓋該軸輥之外周面之方式配置,呈圓筒形且以膜狀物之形式接觸軸輥;以及流體,其被封入上述軸輥與金屬製薄膜之間。金屬彈性輥藉由上述流體而表現出彈性,具有能夠以低線壓進行輥壓接成形之特質,於本發明中有效利用該特質,有助於控制膜冷卻條件。 作為軸輥之材質,可例舉不鏽鋼。金屬製薄膜較佳為由不鏽鋼形成,且其厚度為2~5 mm。金屬製薄膜較佳為具有彎曲性或可撓性,且較佳為無熔接接合部之無縫構造。具備此種金屬製薄膜之金屬彈性輥其耐久性優異,並且若將金屬製薄膜鏡面化則可採取與通常之鏡面輥相同之操作。要想獲得表面平滑性優異之膜,更佳為使金屬彈性輥之表面為鏡面輥。作為金屬彈性輥之市售品,可例舉日立造船股份有限公司之UF輥、千葉機械工業股份有限公司之SF輥。As a metal elastic roll, the surface consists of a metal material, such as stainless steel, and the elastic material, such as fluid or rubber, is filled between the surface metal material and the shaft roll. The metal elastic roll includes, for example, a shaft roll that has a substantially cylindrical shape and is rotatably provided, and a metal thin film that is arranged so as to cover the outer peripheral surface of the shaft roll, has a cylindrical shape, and contacts the shaft as a film. a roll; and a fluid enclosed between the shaft roll and the metal film. The metal elastic roller exhibits elasticity by the above-mentioned fluid, and has the characteristic of being able to perform roll forming at low linear pressure. This characteristic is effectively utilized in the present invention to help control the film cooling conditions. As the material of the shaft roll, stainless steel can be exemplified. The metal thin film is preferably formed of stainless steel and has a thickness of 2 to 5 mm. The metal film preferably has bendability or flexibility, and preferably has a seamless structure without a welded joint. The metal elastic roll provided with such a metal film is excellent in durability, and when the metal film is mirror-finished, the same operation as a normal mirror-finished roll can be performed. In order to obtain a film with excellent surface smoothness, it is more preferable to make the surface of the metal elastic roll a mirror roll. As a commercial item of a metal elastic roll, the UF roll of Hitachi Shipbuilding Co., Ltd., and the SF roll of Chiba Machinery Industry Co., Ltd. are mentioned.

對熔融狀態之F聚合物,利用宜為金屬彈性輥之急冷輥301將其夾於宜為金屬輥之第1冷卻輥30而進行冷卻,藉此使膜迅速冷卻而抑制結晶之生長從而降低霧度,並且降低夾在第1冷卻輥與急冷輥之間之膜中的應變之蓄積。 第1冷卻輥30之溫度較佳為150~250℃,要想能夠使膜迅速地冷卻,急冷輥301之溫度較佳為80~150℃。再者,第1冷卻輥、急冷輥均較佳構成為具有使熱媒通過之機構,且較佳構成為具有供熱媒沿軸向往返而反覆通過之複式機構。第1冷卻輥之溫度、急冷輥之溫度均指熱媒之溫度。 於急冷輥為金屬彈性輥之情形時,較佳為不損害金屬彈性輥本身之特性的溫度範圍。The F polymer in the molten state is cooled by sandwiching it with a quenching roll 301, which is preferably a metal elastic roll, and a first cooling roll 30, which is preferably a metal roll, thereby cooling the film rapidly and suppressing the growth of crystals, thereby reducing fog. degree, and reduce the accumulation of strain in the film sandwiched between the first cooling roll and the quenching roll. The temperature of the first cooling roll 30 is preferably 150 to 250°C, and the temperature of the quench roll 301 is preferably 80 to 150°C so that the film can be rapidly cooled. Further, it is preferable that the first cooling roll and the quenching roll have a mechanism for passing the heat medium, and it is preferable to have a duplex mechanism for the heating medium to go back and forth in the axial direction and to pass through it repeatedly. The temperature of the first cooling roll and the temperature of the quenching roll refer to the temperature of the heat medium. When the quench roll is a metal elastic roll, it is preferably a temperature range that does not impair the properties of the metal elastic roll itself.

本法1中,較佳為於利用急冷輥301將熔融狀態之F聚合物夾於第1冷卻輥30之位置之正後方進而具備氣刀70。氣刀70具有如下作用:藉由向熔融狀態之F聚合物與第1冷卻輥30接觸之線上,自狹縫噴嘴沿第1冷卻輥30之寬度方向呈線狀均勻地吹送狹縫狀空氣流,而使熔融狀態之F聚合物冷卻並且將其壓抵於第1冷卻輥30。與急冷輥301同樣,有提高F聚合物之冷卻效率,抑制所獲得之膜之霧度,並且降低熱伸縮率之效果。 自氣刀吹出之空氣之溫度較佳為150~200℃,更佳為170~200℃。若為150℃以上,則膜之熱伸縮率變小,若為200℃以下,則霧度容易變小。 自氣刀吹出之空氣之流速較佳為10~20 m/秒。In this method 1, it is preferable to further provide the air knife 70 just behind the position of the 1st cooling roll 30 which clamps the F polymer in a molten state by the quench roll 301. The air knife 70 has a function of blowing a slit-shaped air stream uniformly and linearly along the width direction of the first cooling roll 30 from the slit nozzle to the line where the molten F polymer is in contact with the first cooling roll 30 , and the F polymer in the molten state is cooled and pressed against the first cooling roll 30 . Similar to the quench roll 301, it has the effect of improving the cooling efficiency of the F polymer, suppressing the haze of the obtained film, and reducing the thermal expansion and contraction rate. The temperature of the air blown out from the air knife is preferably 150-200°C, more preferably 170-200°C. If it is 150 degreeC or more, the thermal expansion-contraction rate of a film becomes small, and if it is 200 degreeC or less, haze tends to become small. The flow velocity of the air blown out from the air knife is preferably 10-20 m/sec.

本發明之膜之製造方法進而包括如下方法:於本法1中,例如使用圖2所示之擠出成形裝置11,由熔融溫度為260~320℃之F聚合物之顆粒製造膜(本法2)。 圖2係表示本法2中所使用之擠出成形裝置之一實施方式之概念圖。再者,於以下之說明中,以圖2中之右側(熔融混練物之移送方向之前方)為「前端」,以左側(上述移送方向之後方)為「基端」進行說明。The method for producing the film of the present invention further includes the following method: in the method 1, for example, using the extrusion molding apparatus 11 shown in FIG. 2). FIG. 2 is a conceptual diagram showing an embodiment of the extrusion molding apparatus used in the second method. In addition, in the following description, the right side in FIG. 2 (forward in the transfer direction of the melt-kneaded product) is referred to as a "front end", and the left side (rearward in the transfer direction described above) is referred to as a "base end".

圖2所示之擠出成形裝置11具備料斗2及與料斗2連通之混練部3。本實施方式之混練部3由具有汽缸31及能夠旋轉地設置於汽缸31內之1根螺桿32之單軸混練機構成。若使用單軸混練機,則於對顆粒進行熔融混練時,易於防止F聚合物劣化。 於該情形時,將螺桿32之全長設為L(mm),將直徑設為D(mm)時,以全長L相對於直徑D之比之形式表示之有效長度(L/D)更佳為30~45。若有效長度處於上述範圍內,則可防止F聚合物之劣化,並且對F聚合物賦予充分之剪切應力,易於降低熔融混練物之溫度不均。The extrusion molding apparatus 11 shown in FIG. 2 includes a hopper 2 and a kneading section 3 communicating with the hopper 2 . The kneading section 3 of the present embodiment is composed of a uniaxial kneader having a cylinder 31 and a single screw 32 rotatably provided in the cylinder 31 . When a uniaxial kneader is used, it is easy to prevent the deterioration of the F polymer when the pellets are melt-kneaded. In this case, when the overall length of the screw 32 is L (mm) and the diameter is D (mm), the effective length (L/D) expressed as the ratio of the overall length L to the diameter D is more preferably: 30 to 45. When the effective length is within the above-mentioned range, the deterioration of the F polymer can be prevented, and sufficient shear stress can be imparted to the F polymer, and the temperature unevenness of the melt-kneaded product can be easily reduced.

於汽缸31之基端側,依序配置有齒輪箱33與馬達34。於馬達34之旋轉軸341之前端部連接有齒輪(未圖示),該齒輪與齒輪箱33內之特定之齒輪(未圖示)嚙合。 於齒輪箱33中,使旋轉軸341之旋轉運動加速或減速,並傳遞至旋轉軸331。旋轉軸331之前端部連接於螺桿32之基端側。 藉由該構成,將馬達34之旋轉傳遞至螺桿32,使螺桿32以特定之旋轉速度旋轉。結果使得熔融混練物自圖2中之基端側(左側)朝向前端側(右側)被移送。On the base end side of the cylinder 31, a gear box 33 and a motor 34 are arranged in this order. A gear (not shown) is connected to the front end of the rotating shaft 341 of the motor 34 , and the gear meshes with a specific gear (not shown) in the gear box 33 . In the gear box 33 , the rotational motion of the rotating shaft 341 is accelerated or decelerated and transmitted to the rotating shaft 331 . The front end of the rotating shaft 331 is connected to the base end side of the screw 32 . With this configuration, the rotation of the motor 34 is transmitted to the screw 32, and the screw 32 is rotated at a predetermined rotational speed. As a result, the melt-kneaded product is transferred from the proximal end side (left side) toward the distal end side (right side) in FIG. 2 .

又,於汽缸31之外周部設置有加熱器35。被供給至汽缸31內之顆粒(F聚合物)藉由加熱器35之加熱而熔融,同時藉由螺桿32之旋轉而混合(混練)並且朝向前端側被移送。藉此,顆粒被熔融且混練,其熔融混練物自汽缸31之前端開口部311被擠出。 於汽缸31之前端側(混練部3之軸方向上與料斗2相反側)配置有T模5。自汽缸31之前端開口部311擠出之熔融混練物係自T模5之下端開口(吐出口)吐出,其後如本法1中所述般製造F聚合物之膜。此處,圖2之T模5只要理解為對應於圖1(或下文所述之圖3)中之T模20即可。再者,雖未圖示,但T模5中亦設置有加熱器。Further, a heater 35 is provided on the outer peripheral portion of the cylinder 31 . The pellets (F polymer) fed into the cylinder 31 are melted by the heating of the heater 35, mixed (kneaded) by the rotation of the screw 32, and transferred toward the front end side. Thereby, the pellets are melted and kneaded, and the melt-kneaded product is extruded from the front end opening 311 of the cylinder 31 . A T die 5 is arranged on the front end side of the cylinder 31 (the side opposite to the hopper 2 in the axial direction of the kneading portion 3). The melt-kneaded product extruded from the front end opening 311 of the cylinder 31 is discharged from the lower end opening (discharge port) of the T-die 5, and thereafter, as described in this method 1, a film of the F polymer is produced. Here, the T-mode 5 in FIG. 2 only needs to be understood as corresponding to the T-mode 20 in FIG. 1 (or FIG. 3 described below). In addition, although not shown in figure, a heater is also provided in the T-die 5 .

本實施方式中,於汽缸31(混練部3)與T模5之間,設置有靜止型混合器(靜態混合器)6。該靜止型混合器6係對熔融混練物之流路進行分割、轉換或反轉而攪拌熔融混練物之元件。 藉由設置此種靜止型混合器6,可不對熔融混練物施加多餘之外力,故而能抑制熔融混練物之劣化而均勻地混練。In the present embodiment, a static mixer (static mixer) 6 is provided between the cylinder 31 (kneading unit 3 ) and the T-die 5 . The static mixer 6 divides, switches, or reverses the flow path of the melt-kneaded product to stir the melt-kneaded product. By providing such a static mixer 6, the melt-kneaded product can be uniformly kneaded while suppressing deterioration of the melt-kneaded product without applying excessive external force.

於汽缸31之基端側,配置有料斗2。本實施方式之料斗2係由具備漏斗狀之第1階部21、及配置於較第1階部21更靠混練部3(汽缸31)側之漏斗狀之第2階部22的二階式料斗構成。 於第1階部21,連接有加熱器211與泵P1。藉此,可於減壓狀態下加熱被供給至第1階部21內之顆粒。 第1階部21經由連接部212連接於第2階部22。 於第2階部22,連接有加熱器221與泵P2。藉此,可於減壓狀態下加熱被供給至第2階部22內之顆粒。 第2階部22經由連接部222連接於汽缸31。 料斗2(第1階部21及第2階部22)之內表面(內周面)較佳為由樹脂膜被覆。即,料斗2之內表面較佳為樹脂襯裡。藉此,可充分地防止軟化之顆粒附著於料斗2之內表面。再者,作為樹脂膜之構成材料,可例舉PTFE等氟樹脂。The hopper 2 is arranged on the base end side of the cylinder 31 . The hopper 2 of the present embodiment is composed of a two-stage hopper having a funnel-shaped first-stage portion 21 and a funnel-shaped second-stage portion 22 disposed on the side of the kneading portion 3 (cylinder 31 ) rather than the first stage portion 21 . constitute. The heater 211 and the pump P1 are connected to the first stage portion 21 . Thereby, the pellets supplied into the first stage portion 21 can be heated in a decompressed state. The first step portion 21 is connected to the second step portion 22 via the connection portion 212 . The heater 221 and the pump P2 are connected to the second stage portion 22 . Thereby, the pellets supplied into the second stage portion 22 can be heated in a decompressed state. The second step portion 22 is connected to the cylinder 31 via the connection portion 222 . The inner surface (inner peripheral surface) of the hopper 2 (the first step portion 21 and the second step portion 22 ) is preferably covered with a resin film. That is, the inner surface of the hopper 2 is preferably resin lined. Thereby, the softened particles can be sufficiently prevented from adhering to the inner surface of the hopper 2 . In addition, as a constituent material of the resin film, a fluororesin such as PTFE may, for example, be mentioned.

本法2中所使用之顆粒亦可包含除F聚合物以外之成分,但F聚合物之含量較佳為80質量%以上,進而較佳為100質量%。作為除F聚合物以外之成分,可例舉上述其他樹脂或添加劑。 又,作為顆粒之形狀,可例舉球狀、圓柱狀,較佳為圓柱狀。顆粒之直徑較佳為1.0~4.0 mm。若為該直徑之顆粒,則可防止料斗2中之架橋(bridge)(堵塞),並且於料斗2中加熱時能充分地進行加熱(加溫)直至其內部。The particles used in this method 2 may contain components other than the F polymer, but the content of the F polymer is preferably 80% by mass or more, and more preferably 100% by mass. As components other than the F polymer, the above-mentioned other resins or additives can be exemplified. Moreover, as a shape of a particle, a spherical shape and a cylindrical shape are mentioned, Preferably it is a cylindrical shape. The diameter of the particles is preferably 1.0 to 4.0 mm. If it is a particle of this diameter, bridging (clogging) in the hopper 2 can be prevented, and when heating in the hopper 2, the heating (warming) can be sufficiently performed to the inside thereof.

本法2中,將F聚合物之顆粒於料斗2內預先加熱之後,供給至混練部3,於混練部3內進行熔融及混練,然後將所得之熔融混練物自T模5吐出從而製造膜。此時,將料斗2之與混練部3之連接部222中之顆粒之溫度調整至(X-200)~(X-100)℃之範圍內。再者,X係F聚合物之熔融溫度。料斗2之與混練部3之連接部222中之顆粒之溫度較佳為(X-175)~(X-125)℃。具體之顆粒之溫度較佳為70~225℃,更佳為105~195℃。於該情形時,不易因顆粒軟化而於料斗2內產生架橋。又,由於混練部3內之熔融混練物之溫度不均充分地減少,故而易於獲得具有均勻之厚度且防止了魚眼之產生的膜。In the present method 2, the pellets of the F polymer are preheated in the hopper 2, then supplied to the kneading section 3, melted and kneaded in the kneading section 3, and the obtained melt-kneaded product is discharged from the T-die 5 to produce a film . At this time, the temperature of the pellets in the connection part 222 of the hopper 2 and the kneading part 3 is adjusted in the range of (X-200)-(X-100) degreeC. Furthermore, X is the melting temperature of the F polymer. The temperature of the particles in the connection part 222 of the hopper 2 and the kneading part 3 is preferably (X-175) to (X-125)°C. The temperature of the specific particles is preferably 70-225°C, more preferably 105-195°C. In this case, it is difficult to generate bridges in the hopper 2 due to the softening of the particles. Moreover, since the temperature unevenness of the melt-kneaded material in the kneading section 3 is sufficiently reduced, it is easy to obtain a film having a uniform thickness and preventing the occurrence of fish eyes.

第2階部22(最靠近混練部3之階部)內之壓力以低於第1階部21之壓力為佳,較佳為1000 Pa以下,更佳為100 Pa以下。藉此,可充分地去除顆粒內之空氣,阻止空氣形成隔熱層,從而易於防止於混練部3中熔融混練物產生溫度不均。 軟化之顆粒被供給至混練部3。螺桿32之旋轉速度較佳為10~50 ppm。利用加熱器35之加熱溫度更佳為(X+30)~(X+50)℃。 若於上述條件下對顆粒進行熔融混練,則易於形成均質且溫度不均較少之熔融混練物。結果,更易於獲得本發明之膜。 熔融混練物經由靜止型混合器6被供給至T模5,自T模5吐出。自T模5吐出之熔融混練物係如本法1所記載般被膜化,並被捲取至捲取輥。 又,擠出成形裝置11可視需要具有切斷機。The pressure in the second stage part 22 (the stage part closest to the kneading part 3 ) is preferably lower than the pressure in the first stage part 21 , preferably 1000 Pa or less, more preferably 100 Pa or less. Thereby, the air in the pellets can be sufficiently removed, and the formation of a heat insulating layer by the air can be prevented, and the occurrence of temperature unevenness in the melt-kneaded product in the kneading section 3 can be easily prevented. The softened granules are supplied to the kneading section 3 . The rotational speed of the screw 32 is preferably 10-50 ppm. The heating temperature by the heater 35 is more preferably (X+30) to (X+50)°C. If the pellets are melt-kneaded under the above-mentioned conditions, a homogeneous melt-kneaded product with less temperature unevenness can be easily formed. As a result, the film of the present invention is easier to obtain. The melt-kneaded product is supplied to the T-die 5 via the static mixer 6 and discharged from the T-die 5 . The melt-kneaded material discharged from the T-die 5 is formed into a film as described in this method 1, and is wound up on a winding roll. Moreover, the extrusion molding apparatus 11 may have a cutter as needed.

根據本法2,高度抑制激變(surging)現象,並且不賦予過度之熱歷程而將聚合物均勻地熔融及混練,從而形成膜。因此,可容易地製造缺陷(魚眼)較少且短邊方向上亦具有充足之長度的寬幅之膜。 關於本發明之膜中之魚眼之個數,每1 m2 之膜中,較佳為未達0.05個。魚眼之個數之下限為0個。According to the present method 2, the surging phenomenon is highly suppressed, and the polymer is uniformly melted and kneaded without imparting an excessive thermal history, thereby forming a film. Therefore, a wide-width film with few defects (fish eyes) and a sufficient length in the short-side direction can be easily produced. The number of fish eyes in the film of the present invention is preferably less than 0.05 per 1 m 2 of the film. The lower limit of the number of fish eyes is 0.

本發明之膜之製造方法進而包括如下方法:於本法1或本法2中,將F聚合物以熔融狀態自T模吐出,對熔融狀態之F聚合物在其接觸第一個冷卻輥之前利用非接觸式加熱部進行加熱(本法3)。 圖3係表示本法3所使用之膜製造裝置之一實施方式之概略圖。圖3所示之製造裝置101係於本法1中之製造裝置10中,於T模20與第1冷卻輥30之間進而具有對向配置之一對加熱器(非接觸式加熱部)80,除此之外與製造裝置10相同。The production method of the film of the present invention further includes the following method: in the method 1 or the method 2, the F polymer is discharged from the T die in a molten state, and the molten F polymer is in a state before it contacts the first cooling roll. Heating is performed by a non-contact heating unit (this method 3). FIG. 3 is a schematic diagram showing an embodiment of the film manufacturing apparatus used in the present method 3. FIG. The manufacturing apparatus 101 shown in FIG. 3 is in the manufacturing apparatus 10 in the present method 1, and further has a pair of heaters (non-contact heating part) 80 arranged oppositely between the T-die 20 and the first cooling roll 30 , except that it is the same as the manufacturing apparatus 10 .

F聚合物係在與T模20連接之擠出機(未圖示)內被加熱而熔融,然後被供給至T模20內。熔融狀態之F聚合物自T模20之模唇21朝向第1冷卻輥30吐出。繼而,吐出之熔融狀態之F聚合物於通過一對加熱器80彼此之間時在不與加熱器80接觸之情況下被加熱,然後接觸於第1冷卻輥30,並且藉由急冷輥301被壓抵於第1冷卻輥30從而被冷卻。此時,亦可利用以如下方式設置之氣刀70,沿第1冷卻輥30之寬度方向呈線狀均勻地吹送狹縫狀空氣流,藉此將熔融狀態之F聚合物冷卻並且將其壓抵於第1冷卻輥30,上述氣刀70係沿著垂直於與第1冷卻輥30相接之切線的方向設置。進而,F聚合物於通過第2冷卻輥40之後,被搬送輥61、62搬送,作為膜1被捲取至捲取輥50。The F polymer is heated and melted in an extruder (not shown) connected to the T die 20 , and then fed into the T die 20 . The molten F polymer is discharged toward the first cooling roll 30 from the die lip 21 of the T die 20 . Then, the molten F polymer discharged is heated without contacting the heater 80 while passing between the pair of heaters 80 , and then contacts the first cooling roll 30 and is heated by the quenching roll 301 . It is cooled by being pressed against the first cooling roll 30 . At this time, the F polymer in the molten state can also be cooled and pressed by the air knife 70 provided in the following manner, and the slit-shaped air flow can be uniformly blown linearly along the width direction of the first cooling roll 30 . Abutting against the first cooling roll 30 , the air knife 70 is provided along a direction perpendicular to the tangent line contacting the first cooling roll 30 . Furthermore, after passing through the 2nd cooling roll 40, the F polymer is conveyed by the conveyance rolls 61 and 62, and is wound up by the winding roll 50 as the film 1.

根據該構成,自T模20吐出之熔融狀態之F聚合物於到達第1冷卻輥30為止之期間內,亦藉由利用加熱器80之加熱而維持在較高之溫度。因此,朝第1冷卻輥30流下之熔融狀態之F聚合物由於維持相對較高之流動性,故而不易變成諸如因其自身重量或第1冷卻輥30之拉伸力而延伸之狀態。結果,熔融狀態之F聚合物於膜化時產生彎曲(bowing)現象(F聚合物於MD及TD上之配向)得到抑制,由此推測可獲得如上所述之MD及TD之應變(熱伸縮率)較小之膜。According to this configuration, the F polymer in the molten state discharged from the T-die 20 is also maintained at a relatively high temperature by heating by the heater 80 until it reaches the first cooling roll 30 . Therefore, the F polymer in the molten state flowing down toward the first cooling roll 30 maintains relatively high fluidity, and thus does not easily become stretched by its own weight or the tensile force of the first cooling roll 30 . As a result, the phenomenon of bowing (the alignment of the F polymer in MD and TD) during film formation of the F polymer in the molten state is suppressed, and it is presumed that the above-mentioned strains in MD and TD (thermal expansion and contraction) can be obtained. rate) smaller films.

尤其是,於圖3所示之構成中,由於對自T模20吐出之F聚合物自其厚度方向之兩側利用加熱器80進行加熱,故厚度方向上之溫度之均勻性較高,抑制上述彎曲現象產生之效果優異。又,要想進一步提高抑制彎曲現象產生之效果,較佳為以亦可使F聚合物之寬度方向上之溫度均勻之方式構成加熱器80。於該情形時,例如,只要較F聚合物之寬度方向之長度足夠長地設計加熱器80之寬度即可。In particular, in the configuration shown in FIG. 3, since the F polymer discharged from the T-die 20 is heated by the heaters 80 from both sides in the thickness direction, the uniformity of the temperature in the thickness direction is high, and the The above-mentioned bending phenomenon produces an excellent effect. In addition, in order to further enhance the effect of suppressing the occurrence of the bending phenomenon, it is preferable to configure the heater 80 so that the temperature of the F polymer in the width direction can also be made uniform. In this case, for example, the width of the heater 80 may be designed to be sufficiently longer than the length in the width direction of the F polymer.

將T模20內之F聚合物之溫度規定為X1 [℃],將加熱器80之溫度規定為Z1 [℃]時,其差之絕對值(|X1 -Z1 |)較佳為70℃以下,更佳為30~50℃。於該情形時,可防止F聚合物之變質,並且將F聚合物之溫度維持得足夠高直至到達第1冷卻輥30。再者,於模頭溫度與模唇溫度不同之情形時,X1 指模頭溫度。 又,將第1冷卻輥30之溫度規定為Y1 [℃]時,差(X1 -Y1 )較佳為250℃以下,更佳為200℃以下,進而較佳為125~175℃。於該情形時,F聚合物藉由第1冷卻輥30之冷卻程度更適當,因此所獲得之膜1中不易殘存MD及TD之應變,亦能適宜地防止冷卻不足造成之變形。具體而言,Y1 較佳為150~250℃。When the temperature of the F polymer in the T-die 20 is defined as X 1 [° C.] and the temperature of the heater 80 is defined as Z 1 [° C.], the absolute value of the difference (|X 1 -Z 1 |) is preferably It is 70 degreeC or less, More preferably, it is 30-50 degreeC. In this case, the deterioration of the F polymer can be prevented, and the temperature of the F polymer can be maintained high enough until it reaches the first cooling roll 30 . Furthermore, when the die temperature is different from the die lip temperature, X 1 refers to the die temperature. When the temperature of the first cooling roll 30 is defined as Y 1 [° C.], the difference (X 1 −Y 1 ) is preferably 250° C. or lower, more preferably 200° C. or lower, and still more preferably 125 to 175° C. In this case, since the degree of cooling of the F polymer by the first cooling roll 30 is more appropriate, the obtained film 1 is less likely to remain in MD and TD strains, and deformation due to insufficient cooling can also be appropriately prevented. Specifically, Y 1 is preferably 150 to 250°C.

又,要想進一步提高抑制彎曲現象產生的效果,較佳為於利用第1冷卻輥30進行冷卻時亦以可使F聚合物之MD及TD上之溫度均勻之方式構成第1冷卻輥30。 因此,第1冷卻輥30較佳構成為具有使熱媒通過之機構,且較佳構成為具有供熱媒沿軸向往返而反覆通過之複式機構。再者,第1冷卻輥30之溫度Y1 係指熱媒之溫度。Furthermore, in order to further enhance the effect of suppressing the occurrence of the warping phenomenon, it is preferable to configure the first cooling roll 30 so that the temperature in the MD and TD of the F polymer can be made uniform even when the first cooling roll 30 is used for cooling. Therefore, it is preferable that the 1st cooling roll 30 is comprised so that it may have the mechanism which passes a heat medium, and it is preferable that it is comprised so that it may be comprised with the double-type mechanism which reciprocates and passes the heat medium in the axial direction. Furthermore, the temperature of the first cooling roll 30 Y 1 means the temperature of the heat medium.

再者,於圖3所示之構成中,配置有一對加熱器80,但亦可僅配置其中一個。又,非接觸式加熱部亦可由吹送熱風之鼓風(blow)裝置構成以代替加熱器80。In addition, in the structure shown in FIG. 3, a pair of heater 80 is arrange|positioned, but only one of them may be arrange|positioned. In addition, the non-contact heating part may be constituted by a blower device for blowing hot air instead of the heater 80 .

本法1~本法3中,接觸第1冷卻輥30之前之熔融狀態之F聚合物之厚度(圖1及圖3中為厚度t)均較佳為100~200 μm。於該情形時,利用加熱器80之加熱及利用第1冷卻輥30之冷卻之精度提高,所獲得之膜1中更不易殘存MD及TD之應變。In the present method 1 to the present method 3, the thickness (thickness t in FIGS. 1 and 3 ) of the F polymer in the molten state before contacting the first cooling roll 30 is preferably 100 to 200 μm. In this case, the accuracy of the heating by the heater 80 and the cooling by the first cooling roll 30 is improved, and the strain of MD and TD is less likely to remain in the obtained film 1 .

若T模20之模唇21之開度相對於最終獲得之膜1之厚度的比(拉伸比)較大,則F聚合物所包含之聚合物之分子鏈成為延伸程度較大之狀態,聚合物分子容易配向。結果使得膜1中殘存之MD及TD之應變趨於變大。因此,關於拉伸比,較佳為50以下。 又,要想進一步降低膜1中殘存之MD及TD之應變,第1冷卻輥30之周速(圖1及圖3中為周速S)亦更佳為2~20 m/分鐘。再者,第2冷卻輥40之溫度更佳為30~90℃。If the ratio (stretch ratio) of the opening degree of the die lip 21 of the T die 20 to the thickness of the film 1 finally obtained is large, the molecular chain of the polymer contained in the F polymer will be in a state with a large degree of extension, Polymer molecules are easily aligned. As a result, the strains of MD and TD remaining in the film 1 tend to be large. Therefore, the draw ratio is preferably 50 or less. Moreover, in order to further reduce the strain of MD and TD remaining in the film 1, the peripheral speed of the first cooling roll 30 (in FIGS. 1 and 3, the peripheral speed S) is also more preferably 2 to 20 m/min. Furthermore, the temperature of the second cooling roll 40 is more preferably 30 to 90°C.

脫離第1冷卻輥30後之F聚合物(膜1)亦可實施表面處理,以使接著性官能基能夠導入至其表面。作為該表面處理,可例舉電暈放電處理、電漿處理等放電處理、電漿接枝聚合處理、電子束照射、準分子UV(Ultraviolet,紫外)光照射等光線照射處理、使用火焰之ITRO處理、使用金屬鈉之濕式蝕刻處理。 藉由該表面處理,向膜1之表面導入羥基、羰基、羧基等極性官能基,結果與其他表面之接著性進而提高。The F polymer (film 1) after leaving|separated from the 1st cooling roll 30 can also be surface-treated so that an adhesive functional group can be introduce|transduced into the surface. Examples of the surface treatment include corona discharge treatment, discharge treatment such as plasma treatment, plasma graft polymerization treatment, electron beam irradiation, light irradiation treatment such as excimer UV (Ultraviolet) light irradiation, and ITRO using flame. Treatment, wet etching treatment using sodium metal. By this surface treatment, polar functional groups such as hydroxyl groups, carbonyl groups, and carboxyl groups are introduced into the surface of the film 1, and as a result, the adhesion to other surfaces is further improved.

以下,說明本發明之積層體(以下,亦記為「本積層體」)。 本積層體係依序積層有F聚合物層(由本發明之膜構成之層)與基材層之積層體。本積層體較佳為以如下方法獲得,即,將本發明之膜與除本發明之膜以外之膜狀或片狀之基材,以卷對卷方式例如於F聚合物之熔融溫度~400℃下進行層壓,或者重疊之後於F聚合物之熔融溫度~400℃下進行熱壓。Hereinafter, the laminate of the present invention (hereinafter, also referred to as "the present laminate") will be described. In this lamination system, a laminate of the F polymer layer (the layer composed of the film of the present invention) and the base material layer is sequentially laminated. The layered product is preferably obtained by combining the film of the present invention with a film-like or sheet-like substrate other than the film of the present invention in a roll-to-roll manner, for example, at the melting temperature of the F polymer -400 Lamination is performed at ℃, or hot pressing is performed at the melting temperature of the F polymer ~ 400 ℃ after overlapping.

作為本積層體中之基材層之材料,可例舉金屬或樹脂。作為樹脂,可例舉熱塑性樹脂、非熱熔性樹脂、硬化性樹脂之未硬化物、硬化性樹脂之硬化物等。尤其是,較佳為金屬及耐熱樹脂。 本積層體中之基材層較佳為由膜狀或片狀之基材形成之層。作為膜狀或片狀之基材,較佳為金屬箔及耐熱性樹脂膜。 本積層體中之基材層亦可為於本發明之膜之表面上藉由塗佈或鍍覆等方法形成之樹脂層或金屬層。As a material of the base material layer in this laminated body, a metal or resin can be mentioned. As resin, a thermoplastic resin, a non-thermofusible resin, an uncured product of a curable resin, a cured product of a curable resin, and the like can be mentioned. In particular, metal and heat-resistant resin are preferable. The base material layer in this laminate is preferably a layer formed of a film-like or sheet-like base material. As a film-shaped or sheet-shaped base material, a metal foil and a heat-resistant resin film are preferable. The base material layer in this laminate may also be a resin layer or a metal layer formed on the surface of the film of the present invention by a method such as coating or plating.

於本積層體中之基材層為由金屬箔形成之層之情形時,金屬箔之表面之十點平均粗糙度較佳為0.01 μm以上0.5 μm以下。於該情形時,易於使本發明之膜與金屬箔更牢固地密接。因此,具有膜厚精度較高之本發明之膜的積層體及對其進行加工而獲得之印刷基板易於顯著地表現出電特性。 具體而言,於本積層體中之基材層由金屬箔形成之情形時,本積層體之F聚合物層之頻率10 GHz時之介電損耗因數較佳為0.0001~0.0020。When the base material layer in this laminate is a layer formed of a metal foil, the ten-point average roughness of the surface of the metal foil is preferably 0.01 μm or more and 0.5 μm or less. In this case, the film of the present invention and the metal foil can be easily adhered more firmly. Therefore, the laminated body which has the film of this invention with high film thickness precision, and the printed circuit board obtained by processing it are easy to express electrical characteristics remarkably. Specifically, when the base material layer in the laminate is formed of a metal foil, the dielectric loss factor of the F polymer layer of the laminate at a frequency of 10 GHz is preferably 0.0001 to 0.0020.

作為金屬箔之材質,可例舉鐵、銅、鎳、鈦、鋁、其等之合金(不鏽鋼、鎳42合金等)。作為金屬箔,較佳為壓延銅箔及電解銅箔。 金屬箔之表面亦可進行防銹處理(鉻酸鹽等氧化物皮膜等之形成)。又,金屬箔之表面亦可藉由矽烷偶合劑進行處理。此時之處理範圍可為金屬箔之一部分表面,亦可為整個表面。 金屬箔之厚度較佳為0.1~20 μm,更佳為0.5~10 μm。The material of the metal foil may, for example, be iron, copper, nickel, titanium, aluminum, or alloys thereof (stainless steel, nickel 42 alloy, etc.). As a metal foil, a rolled copper foil and an electrolytic copper foil are preferable. The surface of the metal foil can also be subjected to anti-rust treatment (formation of oxide films such as chromate). Moreover, the surface of a metal foil can also be processed with a silane coupling agent. The treatment range at this time may be a part of the surface of the metal foil, or the entire surface. The thickness of the metal foil is preferably 0.1 to 20 μm, more preferably 0.5 to 10 μm.

又,作為金屬箔,亦可使用包含2層以上之金屬箔的附載子之金屬箔。作為附載子之金屬箔,可例舉包含載子銅箔(厚度:10~35 μm)、與介隔剝離層積層於載子銅箔上之極薄銅箔(厚度:2~5 μm)的附載子之銅箔。若使用該附載子之銅箔,則能夠藉由MSAP(改良型半加成)工藝形成精細圖案。作為上述剝離層,較佳為包含鎳或鉻之金屬層、及積層該金屬層所得之多層金屬層。 作為附載子之金屬箔之具體例,可例舉福田金屬箔粉工業股份有限公司製造之名為「FUTF-5DAF-2」之商品。Moreover, as a metal foil, the metal foil with a carrier which consists of two or more layers of metal foils can also be used. Examples of the metal foil with carriers include carrier copper foil (thickness: 10 to 35 μm), and ultra-thin copper foil (thickness: 2 to 5 μm) laminated on the carrier copper foil with a dielectric release layer. Copper foil with carrier. If the copper foil with the carrier is used, a fine pattern can be formed by the MSAP (modified semi-additive) process. As said peeling layer, the metal layer containing nickel or chromium, and the multilayer metal layer obtained by laminating|stacking this metal layer are preferable. As a specific example of the metal foil with a carrier, the product called "FUTF-5DAF-2" manufactured by Futian Metal Foil Powder Industry Co., Ltd. can be exemplified.

本積層體之基材層亦可為藉由氣相成膜法及鍍覆法形成之金屬層。金屬層例如可於本發明之膜之表面,藉由濺鍍法或無電解鍍覆法形成金屬之晶種層,進而藉由電鍍法自晶種層使金屬生長而形成。亦可於形成晶種層之前,對本發明之膜之表面進行表面處理。作為表面處理之方法,可例舉退火處理、電暈處理、電漿處理、臭氧處理、準分子處理、矽烷偶合處理。 作為藉由無電解鍍覆法鍍覆之金屬,可例舉銅、鎳。 作為晶種層中之金屬,可例舉銅、鎳、鉻、鎳鉻合金、鈦合金等。 作為藉由電鍍法鍍覆之金屬,可例舉銅。The base material layer of this laminate may be a metal layer formed by a vapor deposition method and a plating method. The metal layer can be formed by, for example, forming a metal seed layer on the surface of the film of the present invention by sputtering or electroless plating, and then growing the metal from the seed layer by electroplating. The surface of the film of the present invention may also be surface-treated before the seed layer is formed. As a method of surface treatment, annealing treatment, corona treatment, plasma treatment, ozone treatment, excimer treatment, and silane coupling treatment can be mentioned. As the metal to be plated by the electroless plating method, copper and nickel may, for example, be mentioned. As the metal in the seed layer, copper, nickel, chromium, nickel-chromium alloy, titanium alloy, and the like can be exemplified. As a metal plated by electroplating, copper can be mentioned.

於本積層體中之基材層為耐熱性樹脂膜之層之情形時,該膜包含1種以上之耐熱性樹脂,可為單層膜,亦可為多層膜。耐熱性樹脂膜中亦可埋設有玻璃纖維或碳纖維等。 於基材層為耐熱性樹脂膜之層之情形時,本積層體較佳為於基材層之兩面積層有本發明之膜之構造之積層體。於該情形時,本發明之膜積層於耐熱性樹脂膜之兩面,因此本積層體之線膨脹係數顯著下降,不易產生翹曲。 作為耐熱性樹脂,可例舉聚醯亞胺、聚芳酯、聚碸、聚芳碸、芳香族聚醯胺、芳香族聚醚醯胺、聚苯硫醚、聚芳醚酮、聚醯胺醯亞胺、液晶性聚酯、液晶性聚酯醯胺,較佳為聚醯亞胺(尤其是芳香族性聚醯亞胺)。When the base material layer in this laminate is a layer of a heat-resistant resin film, the film contains one or more heat-resistant resins, and may be a single-layer film or a multi-layer film. Glass fibers, carbon fibers, or the like may be embedded in the heat-resistant resin film. When the base material layer is a layer of a heat-resistant resin film, the layered product is preferably a layered product in which the structure of the film of the present invention is layered on both surfaces of the base material layer. In this case, since the film of the present invention is laminated on both sides of the heat-resistant resin film, the linear expansion coefficient of the laminated body is remarkably lowered, and warpage is less likely to occur. As the heat-resistant resin, polyimide, polyarylate, polyamide, polyarylene, aromatic polyamide, aromatic polyetheramide, polyphenylene sulfide, polyaryletherketone, polyamide may, for example, be mentioned. Imide, liquid crystal polyester, liquid crystal polyester imide, preferably polyimide (especially aromatic polyimide).

關於作為兩面具有本發明之膜之耐熱性樹脂膜的本積層體,其厚度(總厚度)較佳為220 μm以上,更佳為250 μm以上。上述厚度較佳為500 μm以下。於該構成中,2個F聚合物層之合計厚度相對於耐熱性樹脂膜之厚度之比更佳為0.8以上。關於上述比,較佳為5以下。 於該情形時,耐熱性樹脂膜之特性(較高之降伏強度、難塑性變形性)與F聚合物層之特性(較低之吸水性)的發揮取得平衡。The thickness (total thickness) of this laminate as a heat-resistant resin film having the film of the present invention on both surfaces is preferably 220 μm or more, more preferably 250 μm or more. The above-mentioned thickness is preferably 500 μm or less. In this configuration, the ratio of the total thickness of the two F polymer layers to the thickness of the heat-resistant resin film is more preferably 0.8 or more. About the said ratio, 5 or less is preferable. In this case, the properties of the heat-resistant resin film (higher yield strength, difficult plastic deformation) and the properties of the F polymer layer (lower water absorption) are balanced.

作為本積層體之具體例,可例舉具有金屬箔與該金屬箔之至少一表面上之F聚合物層的金屬箔積層體、以及具有聚醯亞胺膜與該聚醯亞胺膜之兩表面上之F聚合物層的多層膜。 作為基材層為耐熱性樹脂膜之本積層體之較佳形態,可例舉本發明之膜、聚醯亞胺膜、本發明之膜依序直接接觸地積層所得之3層膜,上述耐熱性樹脂膜為厚度20~100 μm之聚醯亞胺膜。該形態中之2個本發明之膜之厚度相同,較佳為100~200 μm。又,關於2個本發明之膜之合計厚度相對於聚醯亞胺膜之厚度之比,較佳為0.5~5。該形態之積層體最易於表現出上述積層體之效果。Specific examples of the laminate include a metal foil laminate having a metal foil and an F polymer layer on at least one surface of the metal foil, and a metal foil laminate having both a polyimide film and the polyimide film. Multilayer film of F polymer layer on the surface. As a preferred form of the laminate in which the base material layer is a heat-resistant resin film, the film of the present invention, the polyimide film, and the film of the present invention are laminated in this order in direct contact with the three-layer film. The flexible resin film is a polyimide film with a thickness of 20-100 μm. In this form, the thickness of the two films of the present invention is the same, preferably 100 to 200 μm. Moreover, it is preferable that it is 0.5-5 about the ratio of the total thickness of two films of this invention with respect to the thickness of a polyimide film. The layered product of this form is most likely to exhibit the effects of the above-described layered product.

此處,本積層體之最表面(F聚合物層之與基材層相反之側之表面)亦可進一步進行表面處理以進一步提高其線膨脹性或接著性。 作為表面處理之方法,可例舉退火處理、電暈處理、電漿處理、臭氧處理、準分子處理、矽烷偶合處理。 關於退火處理中之條件,較佳為將溫度設為120~180℃,將壓力設為0.005~0.015 MPa,將時間設為30~120分鐘。 作為電漿處理所使用之氣體,可例舉氧氣、氮氣、稀有氣體(氬氣等)、氫氣、氨氣、乙酸乙烯酯。該等氣體可使用1種,亦可併用2種以上。Here, the outermost surface (surface on the opposite side to the base material layer of the F polymer layer) of the layered product may be further surface-treated to further improve the linear expansion or adhesiveness. As a method of surface treatment, annealing treatment, corona treatment, plasma treatment, ozone treatment, excimer treatment, and silane coupling treatment can be mentioned. Regarding the conditions in the annealing treatment, the temperature is preferably 120 to 180° C., the pressure is 0.005 to 0.015 MPa, and the time is preferably 30 to 120 minutes. As a gas used for plasma processing, oxygen gas, nitrogen gas, rare gas (argon gas etc.), hydrogen gas, ammonia gas, and vinyl acetate are mentioned. These gases may be used alone or in combination of two or more.

對基材層為金屬箔之本積層體(附F聚合物層之金屬箔)之金屬箔進行蝕刻加工,形成傳輸電路而獲得印刷基板。具體而言,可藉由如下方法製造印刷基板,即,對金屬箔進行蝕刻處理而加工成特定之傳輸電路、或者藉由電鍍法(半加成法(SAP法)、MSAP法等)將金屬箔加工成特定之傳輸電路。 由附F聚合物層之金屬箔製造之印刷基板依序具有由金屬箔形成之傳輸電路與F聚合物層。作為印刷基板之構成之具體例,可例舉傳輸電路/F聚合物層/預浸體層、傳輸電路/F聚合物層/預浸體層/F聚合物層/傳輸電路。 製造該印刷基板時,可於傳輸電路上形成層間絕緣膜,亦可於傳輸電路上積層覆蓋層膜。該等層間絕緣膜及覆蓋層膜亦可由本發明之膜形成。The metal foil of the laminate (metal foil with F polymer layer) in which the base material layer is a metal foil is etched to form a transmission circuit to obtain a printed circuit board. Specifically, a printed circuit board can be produced by etching a metal foil to process it into a specific transmission circuit, or by plating a metal foil (semi-additive method (SAP method), MSAP method, etc.) The foils are processed into specific transmission circuits. The printed circuit board made of the metal foil with the F polymer layer has the transmission circuit formed of the metal foil and the F polymer layer in this order. As a specific example of the structure of a printed circuit board, a transmission circuit/F polymer layer/prepreg layer, a transmission circuit/F polymer layer/prepreg layer/F polymer layer/transmission circuit can be mentioned. When manufacturing the printed circuit board, an interlayer insulating film may be formed on the transmission circuit, or a coverlay film may be laminated on the transmission circuit. These interlayer insulating films and cover layer films may also be formed of the films of the present invention.

以上,說明了本發明之膜、其製造方法及本發明之積層體,但本發明並不限定於上述實施方式之構成。 例如,本發明之膜及本發明之積層體亦可於上述構成中追加其他任意之構成,宜與發揮相同功能之任意構成進行替換。 又,本發明之製造方法亦可於上述實施方式之構成中追加其他任意之步驟,宜與產生相同作用之任意步驟進行替換。 [實施例]As mentioned above, although the film of this invention, its manufacturing method, and the laminated body of this invention were demonstrated, this invention is not limited to the structure of the said embodiment. For example, the film of the present invention and the layered product of the present invention may add other arbitrary structures to the above-mentioned structures, and it is preferable to replace them with any structures that exhibit the same function. In addition, in the production method of the present invention, other arbitrary steps may be added to the configuration of the above-mentioned embodiment, and it is preferable to replace the arbitrary steps with the same functions. [Example]

以下,利用實施例詳細地說明本發明,但本發明並不限定於該等實施例。各成分之詳情如下所示。 [F聚合物] F聚合物1:包含98.0莫耳%之TFE單元、0.1莫耳%之NAH單元及1.9莫耳%之PPVE單元且具有酸酐基之聚合物(熔融溫度300℃) F聚合物2:包含98.0莫耳%之TFE單元及2.0莫耳%之PPVE單元且不具有官能基之聚合物(熔融溫度300℃) 再者,F聚合物1中,相對於主鏈碳數1×106 個,具有1000個含有羰基之基,F聚合物2則具有40個。 [顆粒] 顆粒1:F聚合物1之顆粒(直徑:2.2 mm) [霧度之測定] 各實施例等中所獲得之膜之霧度(濁度)係依據JIS K 7136,使用NDH5000(日本電色工業公司製造)來測定。 [熱伸縮率] 依據JISK7133:1999,將膜切割成120 mm×120 mm之尺寸之後,沿著膜行進方向(MD)與寬度方向(TD)畫出100 mm之標線,測定標線之長度。將該膜靜置於180℃之烘箱中並加熱30分鐘後,自然冷卻至25℃,然後再次測定標線之長度,按照下述式計算伸縮率。 式:{(加熱前之標線之長度)-(加熱後之標線之長度)}/(加熱前之標線之長度)×100 [膜外觀] 將膜靜置於平滑玻璃之表面,確認有無翹曲(起伏),按照以下之基準進行評價。 ○:未確認到翹曲(起伏)。 ×:確認到翹曲(起伏)。Hereinafter, the present invention will be described in detail using examples, but the present invention is not limited to these examples. Details of each ingredient are shown below. [F polymer] F polymer 1: a polymer containing 98.0 mol % of TFE units, 0.1 mol % of NAH units and 1.9 mol % of PPVE units and having an acid anhydride group (melting temperature 300°C) F polymer 2: A polymer containing 98.0 mol % of TFE units and 2.0 mol % of PPVE units and having no functional group (melting temperature 300°C) Furthermore, in the F polymer 1, the number of carbon atoms in the main chain is 1×10 6 , with 1000 carbonyl-containing groups, and F polymer 2 has 40. [Particles] Particle 1: Particles of F polymer 1 (diameter: 2.2 mm) [Measurement of haze] The haze (turbidity) of the films obtained in each of the examples and the like was based on JIS K 7136, using NDH5000 (Japan manufactured by Denshoku Industries Co., Ltd.) to measure. [Thermal expansion and contraction rate] According to JISK7133:1999, after the film is cut into a size of 120 mm × 120 mm, a 100 mm line is drawn along the film traveling direction (MD) and width direction (TD), and the length of the line is measured. . The film was left to stand in an oven at 180°C and heated for 30 minutes, then cooled to 25°C naturally, and then the length of the marking line was measured again, and the stretch ratio was calculated according to the following formula. Formula: {(Length of marking line before heating)-(Length of marking line after heating)}/(Length of marking line before heating)×100 [Film appearance] Put the film on the surface of the smooth glass and confirm The presence or absence of warpage (waving) was evaluated according to the following criteria. ○: Warpage (waving) was not recognized. ×: Warpage (waving) was confirmed.

[例1] (1)膜之製造 將F聚合物1投入至350℃之擠出機後,自1600 mm寬度之T模以厚度成為125 μm之方式擠出。模頭溫度為350℃,模唇溫度為370℃。擠出之熔融狀態之F聚合物1係藉由被控制在90℃之作為金屬彈性輥之急冷輥301而夾於200℃之第1冷卻輥30,繼而,自沿著垂直於與第1冷卻輥相接之切線之方向設置的氣刀(高度50 mm),朝向第1冷卻輥,以15 m/秒之風速沿第1冷卻輥30之寬度方向呈線狀均勻地吹送200℃之狹縫狀空氣流,而將F聚合物壓抵於第1冷卻輥30,繼而通過90℃之第2冷卻輥40之後,由加熱至90℃之捲取輥61、62拉取並捲取。所獲得之膜(以下,稱為PFA膜1)之霧度為3%,以180℃加熱30分鐘後之熱伸縮率於MD上為0.2%,於TD上為-0.3%。 再者,於擠出機之混練部之前段連接有料斗,F聚合物1之投入係以如下方式進行調整,即,向料斗中投入顆粒1,於料斗內進行減壓處理以使壓力為100 Pa以下,並進行加熱處理以使連接部中之F聚合物之溫度達到180℃。又,對自T模擠出之熔融狀態之F聚合物1,在其接觸於急冷輥與第1輥之前,利用非接觸式之加熱器實施加熱處理使其達到320℃。 (2)天線基板之製造與評價 於PFA膜1上,利用卷對卷方式以厚度成為10 nm之方式濺鍍鎳鉻合金而形成鎳鉻合金層,繼而,於該鎳鉻合金層之上,以厚度成為200 nm之方式濺鍍銅而形成銅層。進而,於銅層之上,以90℃輥層壓乾膜抗蝕劑之後,以寬度成為6 μm之方式進行曝光而顯影。 藉由利用硫酸銅之電鍍銅,對網眼部分進行鍍覆直至其厚度成為6 μm。其後,將乾膜抗蝕劑剝離,繼而,藉由蝕刻去除濺鍍形成之銅層及鎳鉻合金層,而獲得天線基板。 測定所獲得之天線基板之電阻,對是否導通進行評價,若導通則評價為(○),若未導通則評價為(×)。又,利用上述方法測定天線基板形成網狀天線後之霧度。 將膜製造條件及膜特性、作為天線之性能評價結果示於表1中。[example 1] (1) Manufacture of film After the F polymer 1 was put into an extruder at 350° C., it was extruded from a T die having a width of 1600 mm so that the thickness might be 125 μm. The die temperature was 350°C and the die lip temperature was 370°C. The extruded F polymer 1 in the molten state was sandwiched by the first cooling roll 30 at 200 °C by the quenching roll 301 as a metal elastic roll controlled at 90 °C. The air knife (height: 50 mm) installed in the direction of the tangent line where the rolls meet is directed toward the first cooling roll, and blows a slit of 200°C uniformly in a line along the width direction of the first cooling roll 30 at a wind speed of 15 m/s The F polymer is pressed against the first cooling roll 30 by the air flow, and after passing through the second cooling roll 40 at 90°C, it is pulled and wound by the take-up rolls 61 and 62 heated to 90°C. The haze of the obtained film (hereinafter, referred to as PFA film 1) was 3%, and the thermal expansion and contraction ratio after heating at 180° C. for 30 minutes was 0.2% in MD and −0.3% in TD. In addition, a hopper was connected to the front stage of the kneading section of the extruder, and the feeding of the F polymer 1 was adjusted as follows. Pa or less, and heat treatment was performed so that the temperature of the F polymer in the connecting portion reached 180°C. In addition, the F polymer 1 in the molten state extruded from the T-die was heated to 320° C. with a non-contact heater before it came into contact with the quench roll and the first roll. (2) Manufacture and evaluation of antenna substrate On the PFA film 1, a nickel-chromium alloy layer is formed by sputtering a nickel-chromium alloy with a thickness of 10 nm by a roll-to-roll method, and then, on the nickel-chromium alloy layer, sputtering is performed with a thickness of 200 nm. copper to form a copper layer. Furthermore, on the copper layer, after laminating a dry film resist with a 90 degreeC roll, it exposed and developed so that a width might become 6 micrometers. By electroplating copper using copper sulfate, the mesh portion was plated until its thickness became 6 μm. Then, the dry film resist was peeled off, and then, the copper layer and the nichrome layer formed by sputtering were removed by etching to obtain an antenna substrate. The resistance of the obtained antenna substrate was measured to evaluate whether or not it was conductive. If it was conductive, it was evaluated as (○), and if it was not conductive, it was evaluated as (x). In addition, the haze after the mesh antenna was formed on the antenna substrate was measured by the above-mentioned method. Table 1 shows the film production conditions, film properties, and performance evaluation results as an antenna.

[例2] 使用F聚合物2代替F聚合物1,於第1冷卻輥,不利用氣刀向熔融狀態之F聚合物2吹送空氣,除此之外,與例1之(1)同樣地製造膜(PFA膜2)。使用所獲得之PFA膜2,與例1之(2)同樣地製作天線基板及天線,並同樣地進行評價。將膜製造條件及膜特性、作為天線之性能評價結果示於表1中。[Example 2] A film (PFA) was produced in the same manner as in (1) of Example 1, except that the F polymer 2 was used instead of the F polymer 1, and the first cooling roll was not blown with the air knife to the molten F polymer 2. film 2). Using the obtained PFA film 2, an antenna substrate and an antenna were produced in the same manner as in (2) of Example 1, and evaluated in the same manner. Table 1 shows the film production conditions, film properties, and performance evaluation results as an antenna.

[例3] 將F聚合物1自T模以厚度成為125 μm之方式擠出,不使用急冷輥301(即,不進行向急冷輥301與第1冷卻輥30之間之夾入),並且於第1冷卻輥,不利用氣刀向熔融狀態之F聚合物1吹送空氣,經由第1冷卻輥捲取膜,除此之外,與例1之(1)同樣地製造膜(PFA膜3)。使用所獲得之PFA膜3,與例1之(2)同樣地製作天線基板及天線,並同樣地進行評價。 將所獲得之PFA膜3之膜製造條件及膜特性、作為天線之性能評價結果示於表1中。PFA膜3向第1冷卻輥之密接性較差,可見「空氣痕」,即空氣進入至膜與第1冷卻輥之間留下之痕跡,其外觀不良。[Example 3] The F polymer 1 was extruded from the T-die so as to have a thickness of 125 μm, without using the quench roll 301 (that is, without being sandwiched between the quench roll 301 and the first cooling roll 30 ), and cooled in the first A film (PFA film 3) was produced in the same manner as in (1) of Example 1, except that the film was wound up through the first cooling roll without blowing air to the molten F polymer 1 with an air knife. Using the obtained PFA film 3, an antenna substrate and an antenna were produced in the same manner as in (2) of Example 1, and evaluated in the same manner. Table 1 shows the film production conditions and film properties of the obtained PFA film 3, and the results of performance evaluation as an antenna. The adhesion of the PFA film 3 to the first cooling roll was poor, and "air marks", ie, traces left by air entering between the film and the first cooling roll, were seen, and the appearance was poor.

[表1] 表1    例1 例2 例3 製膜條件 (單元)             PFA種類    PFA1 PFA2 PFA1 膜厚度 (μm) 125 125 125 加熱器溫度 (℃) 320 320 320 第1冷卻輥溫度 (℃) 200 200 200 急冷輥﹡溫度 (℃) 90 90 - 氣刀    膜評價                霧度 (%) 2 4 12 熱伸縮率(MD/TD) (%/%) 0.2/-0.3 0.2/-0.3 0.8/-1.5 外觀    × 天線評價                導通    × 霧度 (%) 4 6 15 ﹡使用金屬彈性輥 [產業上之可利用性][Table 1] Table 1 example 1 Example 2 Example 3 Film making conditions (unit) Types of PFA PFA1 PFA2 PFA1 Film thickness (μm) 125 125 125 heater temperature (°C) 320 320 320 1st cooling roll temperature (°C) 200 200 200 Chill Roll *Temperature (°C) 90 90 - air knife have none none Membrane evaluation haze (%) 2 4 12 Thermal expansion ratio (MD/TD) (%/%) 0.2/-0.3 0.2/-0.3 0.8/-1.5 Exterior × Antenna Evaluation turn on × haze (%) 4 6 15 ﹡Use metal elastic roller [Industrial Availability]

本發明之膜由於透明且尺寸穩定性優異,故而可用作天線之覆蓋材。又,本發明之膜可容易地加工成金屬積層板(附樹脂之金屬箔),所獲得之加工物品能夠應用於具備透明性之軟性印刷基板、天線零件、印刷基板、運動用器具、食品工業用品等軟性裝置機器,以及重視設計性之可穿戴機器、醫療機器等各種領域。 再者,將2020年03月31日提出申請之日本專利申請2020-062167號說明書、申請專利範圍、摘要及附圖之全部內容引用至本文中,作為本發明之說明書之揭示而引入。Since the film of the present invention is transparent and has excellent dimensional stability, it can be used as a covering material for an antenna. In addition, the film of the present invention can be easily processed into a metal laminate (metal foil with resin), and the obtained processed article can be applied to a flexible printed circuit board with transparency, antenna parts, printed circuit boards, sports equipment, and food industries. Various fields such as soft devices such as supplies, wearable devices and medical devices that focus on design. Furthermore, the entire contents of Japanese Patent Application No. 2020-062167, the scope of application, abstract, and drawings filed on March 31, 2020 are incorporated herein by reference as a disclosure of the specification of the present invention.

1:膜 2:料斗 3:混練部 5:T模 6:靜止型混合器 10,101:製造裝置 11:擠出成形裝置 20:T模 21:模唇 21:第1階部 22:第2階部 30:第1冷卻輥 31:汽缸 32:螺桿 33:齒輪箱 34:馬達 35:加熱器 40:第2冷卻輥 50:捲取輥 61,62:搬送輥 70:氣刀 80:加熱器 211:加熱器 212:連接部 221:加熱器 222:連接部 301:急冷輥 311:前端開口部 331:旋轉軸 341:旋轉軸 D:直徑 L:全長 P1:泵 P2:泵 S:周速 t:厚度1: Membrane 2: Hopper 3: Mixing Department 5:T mode 6: Static mixer 10,101: Manufacturing devices 11: Extrusion forming device 20: T mold 21: Die lip 21: Part 1 22: Part 2 30: 1st cooling roll 31: Cylinder 32: Screw 33: Gearbox 34: Motor 35: Heater 40: 2nd cooling roll 50: take-up roll 61, 62: Conveying rollers 70: Air Knife 80: heater 211: Heater 212: Connector 221: Heater 222: Connector 301: quench roll 311: Front opening part 331: Rotary axis 341: Rotary axis D: diameter L: full length P1: Pump P2: Pump S: Peripheral speed t: thickness

圖1係表示本法1所使用之膜之製造裝置之一實施方式的概略圖。 圖2係表示本發明中能夠使用之擠出成形裝置之一實施方式之概略圖。 圖3係表示本法3所使用之膜之製造裝置之一實施方式的概略圖。FIG. 1 is a schematic diagram showing an embodiment of a film manufacturing apparatus used in the present method 1. FIG. FIG. 2 is a schematic view showing an embodiment of an extrusion molding apparatus that can be used in the present invention. FIG. 3 is a schematic view showing an embodiment of a film manufacturing apparatus used in the present method 3. FIG.

1:膜 1: Membrane

10:製造裝置 10: Manufacturing device

20:T模 20: T mold

21:模唇 21: Die lip

30:第1冷卻輥 30: 1st cooling roll

40:第2冷卻輥 40: 2nd cooling roll

50:捲取輥 50: take-up roll

61,62:搬送輥 61, 62: Conveying rollers

70:氣刀 70: Air Knife

301:急冷輥 301: quench roll

S:周速 S: Peripheral speed

t:厚度 t: thickness

Claims (15)

一種膜,其係由四氟乙烯系聚合物構成之擠出成形膜,其厚度為100~200 μm,霧度為8%以下,以180℃加熱30分鐘後之熱伸縮率於膜之行進方向及寬度方向均為-1~+1%。A film, which is an extruded film composed of a tetrafluoroethylene-based polymer, the thickness of which is 100-200 μm, the haze is 8% or less, and the thermal expansion and contraction rate after heating at 180 ° C for 30 minutes in the traveling direction of the film And the width direction is -1 to +1%. 如請求項1之膜,其中上述四氟乙烯系聚合物包含基於四氟乙烯之單元及基於全氟(烷基乙烯基醚)之單元。The film of claim 1, wherein the tetrafluoroethylene-based polymer comprises a tetrafluoroethylene-based unit and a perfluoro(alkyl vinyl ether)-based unit. 如請求項1或2之膜,其中上述四氟乙烯系聚合物包含基於全氟(烷基乙烯基醚)之單元且具有極性官能基、或相對於全部單元包含2.0~5.0莫耳%之基於全氟(烷基乙烯基醚)之單元且不具有極性官能基。The film according to claim 1 or 2, wherein the tetrafluoroethylene-based polymer contains a perfluoro(alkyl vinyl ether)-based unit and has a polar functional group, or contains 2.0 to 5.0 mol % based on the total unit. Units of perfluoro(alkyl vinyl ether) and no polar functional groups. 如請求項1至3中任一項之膜,其中上述四氟乙烯系聚合物之熔融溫度為260~320℃。The film according to any one of claims 1 to 3, wherein the melting temperature of the tetrafluoroethylene-based polymer is 260 to 320°C. 一種如請求項1至4中任一項之膜之製造方法,其係藉由T模鑄法製造該如請求項1至4中任一項之膜之方法,其包括如下操作:將上述四氟乙烯系聚合物以熔融狀態自模頭吐出而擠出成形,將所得之膜夾入受到溫度控制之2根輥之間使其冷卻。A method for producing the film according to any one of claims 1 to 4, which is a method for producing the film according to any one of claims 1 to 4 by T-die casting, comprising the following operations: The vinyl fluoride-based polymer was extruded from a die in a molten state, and the obtained film was sandwiched between two temperature-controlled rolls and cooled. 如請求項5之製造方法,其中上述受到溫度控制之2根輥,其中一根之溫度為150~250℃,另一根之溫度為80~150℃。The manufacturing method of claim 5, wherein the temperature of one of the two temperature-controlled rolls is 150 to 250°C, and the temperature of the other is 80 to 150°C. 如請求項5或6之製造方法,其中具備具有混練部及連接於上述混練部之料斗的擠出成形裝置,於向上述料斗中投入熔融溫度為260~320℃之四氟乙烯系聚合物之顆粒,將經上述混練部熔融且混練後之熔融混練物自T模吐出而製造膜時,進而包括如下操作:將上述料斗之與上述混練部之連接部中之上述顆粒之溫度調整至(上述熔融溫度-200)~(上述熔融溫度-100)℃之範圍內,然後將上述顆粒供給至上述混練部。The production method according to claim 5 or 6, comprising an extrusion molding apparatus having a kneading section and a hopper connected to the kneading section, and feeding into the hopper a tetrafluoroethylene-based polymer having a melting temperature of 260 to 320°C When the pellets are melted and kneaded by the kneading section and the melt-kneaded product is ejected from the T-die to manufacture a film, the following operation is further included: the temperature of the pellets in the connection part of the hopper and the kneading section is adjusted to (the above-mentioned Melting temperature -200) - (the said melting temperature-100) °C range, and then the said pellet is supplied to the said kneading part. 如請求項5至7中任一項之製造方法,其中上述顆粒之直徑為1.0~4.0 mm。The manufacturing method according to any one of claims 5 to 7, wherein the diameter of the above-mentioned particles is 1.0-4.0 mm. 如請求項5至8中任一項之製造方法,其中上述料斗係具備第1階部、及配置於較上述第1階部更靠上述混練部側之第2階部的多階式料斗。The manufacturing method according to any one of claims 5 to 8, wherein the hopper includes a first-stage portion and a multi-stage hopper arranged in a second-stage portion closer to the kneading portion than the first-stage portion. 如請求項5至9中任一項之製造方法,其中上述料斗之最靠近上述混練部之階部內之壓力為1000 Pa以下。The production method according to any one of claims 5 to 9, wherein the pressure in the step portion of the hopper closest to the kneading portion is 1000 Pa or less. 如請求項5至10中任一項之製造方法,其中上述擠出成形裝置具備:T模,其連接於上述混練部之軸方向上與上述料斗相反側;及靜止型混合器,其設置於上述混練部與上述T模之間。The manufacturing method according to any one of claims 5 to 10, wherein the extrusion molding device includes: a T die connected to the side opposite to the hopper in the axial direction of the kneading portion; and a static mixer provided in Between the above-mentioned kneading part and the above-mentioned T-die. 如請求項5至11中任一項之製造方法,其進而包括如下操作:將上述四氟乙烯系聚合物以熔融狀態自T模吐出,對上述熔融狀態之四氟乙烯系聚合物在其接觸第一個冷卻輥之前利用非接觸式加熱部進行加熱。The production method according to any one of claims 5 to 11, further comprising the operation of discharging the tetrafluoroethylene-based polymer in a molten state from a T-die, and contacting the tetrafluoroethylene-based polymer in a molten state with the tetrafluoroethylene-based polymer in a molten state. The first cooling roll is heated by a non-contact heating section. 如請求項12之製造方法,其中上述T模內之上述四氟乙烯系聚合物之溫度與上述第一個冷卻輥之溫度的差為250℃以下。The production method of claim 12, wherein the difference between the temperature of the tetrafluoroethylene-based polymer in the T-die and the temperature of the first cooling roll is 250°C or less. 如請求項12或13之製造方法,其中上述T模內之上述四氟乙烯系聚合物之溫度與上述非接觸式加熱部之溫度之差的絕對值為70℃以下。The production method according to claim 12 or 13, wherein the absolute value of the difference between the temperature of the tetrafluoroethylene-based polymer in the T-die and the temperature of the non-contact heating section is 70°C or less. 一種積層體,其具有由如請求項1至4中任一項之膜構成之層、與由該膜以外之基材構成之基材層。A layered product having a layer composed of the film according to any one of claims 1 to 4, and a base material layer composed of a base material other than the film.
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