TW202144125A - Grinding device capable of preventing the grinding wheel from being attached - Google Patents
Grinding device capable of preventing the grinding wheel from being attached Download PDFInfo
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- TW202144125A TW202144125A TW110117857A TW110117857A TW202144125A TW 202144125 A TW202144125 A TW 202144125A TW 110117857 A TW110117857 A TW 110117857A TW 110117857 A TW110117857 A TW 110117857A TW 202144125 A TW202144125 A TW 202144125A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/04—Headstocks; Working-spindles; Features relating thereto
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
- B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/20—Drives or gearings; Equipment therefor relating to feed movement
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/22—Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Machine Tool Sensing Apparatuses (AREA)
Abstract
Description
本發明關於一種研削裝置。The present invention relates to a grinding device.
如專利文獻1所示,研削裝置係將在基台環狀地配置有研削磨石之研削輪裝設在與主軸的前端連結之安裝件,並藉由使該主軸旋轉,而一邊使研削磨石旋轉,一邊使旋轉中的研削磨石接觸保持在卡盤台的保持面之被加工物,而研削被加工物。As shown in Patent Document 1, in a grinding device, a grinding wheel having a grinding stone arranged annularly on a base is mounted on a mount connected to a front end of a main shaft, and the main shaft is rotated to grind and grind the grinding wheel. As the stone rotates, the rotating grinding stone is brought into contact with the workpiece held on the holding surface of the chuck table, and the workpiece is ground.
在此,研削裝置中例如有雙軸研削裝置,所述雙軸研削裝置具備:裝設有粗研削輪之粗研削手段、與裝設有精研削輪之精研削手段。 [習知技術文獻] [專利文獻]Here, the grinding apparatus includes, for example, a biaxial grinding apparatus including rough grinding means equipped with a rough grinding wheel and fine grinding means equipped with a fine grinding wheel. [Previously known technical literature] [Patent Literature]
[專利文獻1]日本特開2017-127936號公報[Patent Document 1] Japanese Patent Laid-Open No. 2017-127936
[發明所欲解決的課題] 在上述雙軸研削裝置中,會有將粗研削輪與精研削輪裝錯的情況,例如,若將粗研削輪裝設在精研削手段、或將精研削輪裝設在粗研削手段而將被加工物進行研削加工,則會成為被加工物及研削磨石損壞之原因。 並且,在由具備一個研削手段之單軸研削裝置所進行之被加工物的研削加工中,係因應被加工物的種類而選擇並使用適當的研削輪。因此,在交換研削輪之際,存在所謂有裝錯之慮的問題。 因此,研削裝置具有防止裝錯研削輪之課題。[Problems to be solved by the invention] In the above-mentioned two-axis grinding device, the rough grinding wheel and the fine grinding wheel may be installed wrongly. When the workpiece is ground, the workpiece and the grinding stone will be damaged. In addition, in the grinding of the workpiece by the uniaxial grinding apparatus provided with one grinding means, an appropriate grinding wheel is selected and used according to the type of the workpiece. Therefore, when exchanging the grinding wheel, there is a problem of so-called wrong installation. Therefore, the grinding device has the problem of preventing wrong installation of the grinding wheel.
[用於解決課題的手段] 本發明係一種研削裝置,其具備:卡盤台,其將被加工物保持在保持面;研削手段,其將環狀地配置有多個研削輪石之研削輪裝設在主軸的前端,並研削保持在該保持面的被加工物;以及旋轉手段,其使該主軸以預定的旋轉速度旋轉,其中,所述研削裝置具備:感測器,其具備投射光之投光部、與接受該投光部所投射的該光之受光部;以及判斷手段,其在使以預定的旋轉速度旋轉之該研削磨石進入該感測器的該投光部與該受光部之間而能藉由該研削磨石遮蔽該光之狀態下,使用該受光部接受該光之時間、該受光部接受該光之次數、該受光部未接受該光之時間、該受光部未接受該光之次數中的至少一者而判斷該研削輪的種類。 上述該研削輪較佳為由依據後述條件而不同之種類所形成:環狀地配置之該研削磨石的圓周方向的長度、該研削磨石的數量、該環狀地配置且呈彼此相鄰之該研削磨石與該研削磨石之間的間隙的長度、該間隙的數量。[Means for solving problems] The present invention relates to a grinding device comprising: a chuck table for holding a workpiece on a holding surface; a grinding means for mounting a grinding wheel in which a plurality of grinding wheel stones are arranged annularly on a front end of a main shaft, and grinding the workpiece held on the holding surface; and rotating means for rotating the main shaft at a predetermined rotational speed, wherein the grinding device includes a sensor including a light projecting portion for projecting light, and a sensor for receiving the light a light-receiving part of the light projected by the light-projecting part; and a judging means, which can be obtained by making the grinding stone rotating at a predetermined rotational speed enter between the light-emitting part and the light-receiving part of the sensor In the state where the grinding stone blocks the light, use the time that the light-receiving part receives the light, the number of times the light-receiving part receives the light, the time that the light-receiving part does not receive the light, and the number of times that the light-receiving part does not receive the light. to determine the type of the grinding wheel. The above-mentioned grinding wheel is preferably formed of different types according to the conditions described below: the circumferential length of the grinding stones arranged annularly, the number of the grinding stones, the annular arrangement and adjacent to each other. The length of the gap between the grinding stone and the grinding stone, and the number of the gap.
[發明功效] 針對環狀地配置有多個研削磨石之研削輪,若為使以預定的旋轉速度旋轉之研削磨石進入感測器的投光部與受光部之間而能藉由研削磨石遮蔽光之狀態,則由於判斷手段使用受光部接受光之時間、受光部接受光之次數、受光部未接受光之時間、受光部未接受光之次數中的至少一者而判斷研削輪的種類,故可防止裝錯研削輪。[Inventive effect] For a grinding wheel in which a plurality of grinding stones are arranged annularly, if the grinding stone rotating at a predetermined rotational speed enters between the light-emitting portion and the light-receiving portion of the sensor, light can be shielded by the grinding stone. The state of the grinding wheel is determined by using at least one of the time when the light-receiving part receives light, the number of times the light-receiving part receives light, the time when the light-receiving part does not receive light, and the number of times the light-receiving part does not receive light. Prevents the wrong grinding wheel from being installed.
1 研削裝置的構成
圖1所示的研削裝置1係將被加工物14進行研削加工之研削裝置。以下說明研削裝置1的構成。1 Structure of the grinding device
The grinding apparatus 1 shown in FIG. 1 is a grinding apparatus which grinds the
如圖1所示,研削裝置1具備:基座10,其延伸設置在Y軸方向;以及柱體11,其立設在基座10上的+Y方向側。As shown in FIG. 1 , the grinding apparatus 1 includes a
在柱體11的-Y方向側的側面,配設有支撐研削手段3之研削進給手段4。研削手段3具備:主軸30,其具有Z軸方向的旋轉軸35;外殼31,其能旋轉地支撐主軸30;作為馬達的旋轉手段32,其以旋轉軸35作為軸並旋轉驅動主軸30;以及圓環狀的安裝件33,其與主軸30的下端連接。在圖1中,裝設有第一研削輪36,所述第一研削輪36被裝設在安裝件33的下表面。第一研削輪36相對於安裝件33為能裝卸,安裝件33亦可安裝其他種類的研削輪以取代第一研削輪36。On the side surface on the −Y direction side of the
第一研削輪36具備:第一輪基台361;以及多個第一研削磨石360,其等環狀地排列在第一輪基台361的下表面且具有大致長方體形狀。The first grinding
如圖2所示,相鄰的兩個第一研削磨石360係空開第一間隙長度363而配設,所有的第一研削磨石360被排列成整體呈環狀。各第一研削磨石360具有作為其圓周方向的長度之第一研磨齒長度364。第一研削磨石360的下表面362成為研削被加工物14的研削面。在研削磨石中,可藉由改變第一研磨齒長度364的值、第一間隙長度363的值而謀求研削品質的最佳化,因此準備有此等值不同之多種類的研削輪。As shown in FIG. 2 , two adjacent
使用圖1所示之旋轉手段32,並以旋轉軸35作為軸而使主軸30旋轉,藉此與主軸30連接之安裝件33及被裝設在安裝件33之第一研削輪36會以通過第一輪基台361的中心之Z軸方向的旋轉軸35為軸而旋轉。Using the
研削進給手段4具備:滾珠螺桿40,其具有Z軸方向的旋轉軸45;一對導軌41,其相對於滾珠螺桿40平行地配設;Z軸馬達42,其與滾珠螺桿40的上端連結並以旋轉軸45為軸而使滾珠螺桿40轉動;升降板43,其內部的螺帽與滾珠螺桿40螺合且側部與導軌41滑接;以及保持座44,其與升降板43連結並保持主軸30。
當藉由使用Z軸馬達42而驅動滾珠螺桿40,滾珠螺桿40以旋轉軸45為軸而旋轉,則成為後述的構成:升降板43會一邊被導軌41引導一邊在Z軸方向升降移動,伴隨於此,保持在保持座44之研削手段3會相對於保持面200往垂直方向(Z軸方向)移動。The grinding and feeding means 4 includes: a
在基座10上配設有卡盤台2。卡盤台2具備圓板狀的吸引部20與支撐吸引部20之環狀的框體21。吸引部20為具有多個細孔之多孔構件,吸引部20的上表面成為吸引保持被加工物14之保持面200。框體21的上表面210與保持面200形成為同一平面。The chuck table 2 is arranged on the
在卡盤台2的保持面200連接有未圖示的吸引源。例如,在被加工物14載置於保持面200之狀態,藉由使該吸引源運作,而可將被加工物14吸引保持在保持面200。A suction source (not shown) is connected to the
並且,在卡盤台2配設有未圖示的旋轉機構。藉由使用該旋轉機構,而可使卡盤台2旋轉。In addition, a rotation mechanism not shown is arranged on the chuck table 2 . By using this rotation mechanism, the chuck table 2 can be rotated.
在卡盤台2的周圍配設有蓋28,蓋28係能伸縮地與蛇腹27連結。
若卡盤台2在Y軸方向移動,則蓋28與卡盤台2一體地在Y軸方向移動,而蛇腹27會伸縮。A
在基座10上的卡盤台2的+Y方向側配設有感測器5。感測器5具備基台53與配設在基台53上的投受光元件54。投受光元件54為具備貫通X軸方向的凹部之構件,且具備投射光之投光部50與接受從投光部50投射的光之受光部51。The
設成在從投光部50投射的光被受光部51接受時檢測電壓,且在從投光部50投射的光未被受光部51接受時不檢測電壓。It is assumed that the voltage is detected when the light projected from the
感測器5係與判斷手段6連接。判斷手段6具有依據受光部51接受光之時間、受光部51接受光之次數、受光部51未接受光之時間、受光部51未接受光之次數中的至少一者而判斷研削輪的種類之功能。
例如,將與圖2所示之第一研磨齒長度364對應且受光部51未接受光之時間亦即第一遮光時間,預先儲存在判斷手段6。The
2 研削裝置的動作
(研削加工)
說明使用上述研削裝置1而將被加工物14進行研削加工之際的研削裝置1的動作。
在使用研削裝置1將被加工物14進行研削加工之際,首先,將圖1所示之被加工物14載置於卡盤台2的保持面200。然後,使連接至卡盤台2之未圖示的吸引源運作,將所產生的吸引力傳達至保持面200。藉此,被加工物14被吸引保持在保持面200。2 Operation of the grinding device
(grinding processing)
The operation of the grinding device 1 when grinding the
在被加工物14被吸引保持在保持面200之狀態,使用未圖示的Y軸移動手段等,使卡盤台2在+Y方向移動,而定位在研削手段3的下方。
接著,使用未圖示的旋轉機構而使卡盤台2旋轉,使保持在保持面200之被加工物14旋轉,且使用旋轉手段32以旋轉軸35為軸而使第一研削磨石360旋轉。In a state where the
在被加工物14以上述未圖示之旋轉機構的旋轉軸為軸而旋轉,且第一研削磨石360以旋轉軸35為軸而旋轉之狀態,使用研削進給手段4使研削手段3往-Z方向下降。藉由使第一研削磨石360往-Z方向下降,而第一研削磨石360的下表面362接觸被加工物14的上表面140。
在下表面362接觸被加工物14的上表面140之狀態,藉由使第一研削磨石360進一步往-Z方向下降而研削被加工物14。
被加工物14的研削加工結束後,則使用研削進給手段4使研削手段3往+Z方向移動,使第一研削磨石360從被加工物14的上表面140分離後,從卡盤台2的保持面200搬出被加工物14。In a state in which the
(研削輪的種類的判斷)
在研削裝置1中,在進行被加工物14的研削加工之前,係使用感測器5而判斷裝設在安裝件33之研削輪的種類。以下,說明判斷研削輪的種類之際的研削裝置1的動作。
在本實施方式中,判斷裝設在安裝件33之研削輪為圖2所示之第一研削輪36、或為圖3所示之第二研削輪37。(Judgment of the type of grinding wheel)
In the grinding apparatus 1 , before grinding the
在圖3中,表示第二研削輪37的俯視圖。第二研削輪37具備:環狀的第二輪基台371;以及多個第二研削磨石370,其等空開第二間隙長度373而環狀地排列在第二輪基台371的下表面。第二研削磨石370係與第一研削磨石360同樣地具有大致長方體形狀,且其圓周方向的長度成為比第一研磨齒長度364更短的長度亦即第二研磨齒長度374。
第二研削輪37在環狀地配置之各研削磨石的圓周方向的長度、研削磨石的數量、環狀地配置且呈彼此相鄰之研削磨石與研削磨石之間的間隙的長度、該間隙的數量,係與第一研削輪36不同。
亦即,第一研磨齒長度364與第二研磨齒長度374不同。並且,第一間隙長度363與第二間隙長度373不同。再者,第一研削輪36所具備之第一研削磨石360的數量與第二研削輪37所具備之第二研削磨石370的數量不同。除此之外,相鄰的第一研削磨石360彼此的間隙的數量與相鄰的第二研削磨石370彼此的間隙的數量不同。In FIG. 3, the top view of the
在判斷研削輪的種類之際,首先,使圖1所示的感測器5運作,從投受光元件54的投光部50朝向受光部51投射光。When determining the type of the grinding wheel, first, the
接著,使用旋轉手段32,例如使裝設在安裝件33之第一研削輪36以預定的速度旋轉。在此,預定的速度例如設為10rpm。Next, using the rotating
然後,使用研削進給手段4而使第一研削輪36往-Z方向只下降適當的距離。
如此,如圖4所示,第一研削磨石360進入投受光元件54的凹部540,第一研削磨石360的下表面362被定位在比以直線連結投光部50與受光部51之投受光連線52的高度位置更下方。Then, the
此時,由於第一研削磨石360旋轉,故會交互地重複第一研削磨石360與投受光連線52重疊而被遮光之狀態、與第一研削磨石360未與投受光連線52重疊而未被遮光之狀態。At this time, since the
在圖5中,表示在藉由旋轉的第一研削磨石360而從投光部50投射的光重複被遮蔽之狀態與未被遮蔽之狀態時感測器5所檢測之電壓的變化之圖表。
在圖5中,表示在第一研削輪36以預定的旋轉速度旋轉之情形中,從投光部50投射的光被第一研削磨石360遮蔽之時間亦即第一遮光時間365、與從投光部50投射的光未被第一研削磨石360遮蔽而被受光部51接受之時間以及第一受光時間366。在第一遮光時間365中,電壓的數值成為0V。並且,在第一受光時間366中,電壓的數值成為非0V的值(例如5V)。In FIG. 5 , a graph showing a change in the voltage detected by the
在此,在圖1所示的判斷手段6中,預先儲存有第一遮光時間365。若所儲存的第一遮光時間365與所測量的遮光時間一致,則藉由判斷手段6判斷裝設在安裝件33之研削輪是第一研削輪36。Here, in the determination means 6 shown in FIG. 1 , the first
另一方面,考慮例如將第二研削輪37取代第一研削輪36而裝設在安裝件33之情形。以圖3所示之第二研削磨石370的下表面372在被定位於比圖4所示的投受光連線52的高度位置更下方之狀態,藉由第二研削磨石370旋轉而重複遮光狀態與非遮光狀態。在圖6中,表示在所投射的光被第二研削輪37斷續地遮蔽之際感測器5所檢測之電壓的變化之圖表。On the other hand, consider a case where, for example, the
將從投光部50投射的光被第二研削磨石370遮蔽之時間設為第二遮光時間375,並將從投光部50投射的光未被第二研削磨石370遮蔽而被受光部51接受之時間設為第二受光時間376。
圖1所示的判斷手段6中,例如預先儲存有第二研削輪37以預定的旋轉速度旋轉之情形中的第二遮光時間375,所述第二遮光時間375是與第二研削磨石370的第二研磨齒長度374對應。若所儲存的第二遮光時間375與所測量的遮光時間一致,則藉由判斷手段6判斷裝設在安裝件33之研削輪是第二研削輪37。The time when the light projected from the
並且,在研削裝置1中,例如不僅可藉由受光部51未接受光之時間,也可藉由受光部51接受光之時間來判斷研削輪的種類。
例如,可預先使第一受光時間366及第二受光時間376儲存在判斷手段6,基於所測量的受光時間,判斷裝設在安裝件33之研削輪是第一研削輪36或第二研削輪37。Moreover, in the grinding apparatus 1, the type of grinding wheel can be judged not only by the time when the
再者,例如事先使在第一研削輪36、第二研削輪37旋轉一次的期間中受光部51接受光之次數,亦即相鄰的研削磨石間的間隙的數量分別儲存至判斷手段6,並測量在研削輪實際旋轉一次的期間中受光部51接受光之次數,藉此可判斷第一研削輪36、第二研削輪37是何者裝設在安裝件33。Furthermore, for example, the number of times the
除此之外,例如事先使在第一研削輪36、第二研削輪37旋轉一次的期間中受光部51未接受光之次數,亦即研削磨石的數量分別儲存至判斷手段6,並測量在研削輪實際旋轉一次的期間中受光部51未接受光之次數,藉此可判斷第一研削輪36、第二研削輪37是何者裝設在安裝件33。In addition to this, for example, the number of times the light-receiving
如以上所述,使用受光部51接受光之時間、受光部51接受光之次數、受光部51未接受光之時間、受光部51未接受光之次數中的至少一者而判斷研削輪的種類,藉此可防止裝錯研削輪,並可預防由使用錯的研削輪所導致之被加工物及研削磨石的損壞等。As described above, the type of grinding wheel is determined by using at least one of the time when the
此外,在本實施方式中,係判斷裝設在安裝件33的研削輪是第一研削輪36或第二研削輪37,但即使在研削輪是三種以上之情形中,亦可使用同樣的方法進行判斷。In addition, in the present embodiment, it is determined whether the grinding wheel mounted on the
1:研削裝置 10:基座 11:柱體 14:被加工物 140:上表面 2:卡盤台 20:吸引部 200:保持面 21:框體 210:框體的上表面 27:蛇腹 28:蓋 3:研削手段 30:主軸 31:外殼 32:旋轉手段 33:安裝件 35:旋轉軸 36:第一研削輪 360:第一研削磨石 361:第一輪基台 362:下表面 363:第一間隙長度 364:第一研磨齒長度 365:第一遮光時間 366:第一受光時間 37:第二研削輪 370:第二研削磨石 372:下表面 373:第二間隙長度 374:第二研磨齒長度 375:第二遮光時間 376:第二受光時間 4:研削進給手段 40:滾珠螺桿 41:導軌 42:Z軸馬達 43:升降板 44:保持座 45:旋轉軸 5:感測器 50:投光部 51:受光部 52:投受光連線 53:基台 54:投受光元件 6:判斷手段1: Grinding device 10: Pedestal 11: Cylinder 14: Processed objects 140: Upper surface 2: Chuck table 20: Attraction Department 200: keep face 21: Frame 210: The upper surface of the frame 27: Snake Belly 28: Cover 3: Grinding means 30: Spindle 31: Shell 32: Rotation Means 33: Mounting pieces 35: Rotary axis 36: First grinding wheel 360: First Grinding Grinding Stone 361: First round abutment 362: Lower Surface 363: First gap length 364: Length of the first grinding tooth 365: First shading time 366: The first light receiving time 37: Second grinding wheel 370: Second Grinding Stone 372: Lower Surface 373:Second gap length 374: Length of the second grinding tooth 375: Second shading time 376: Second light receiving time 4: Grinding feed method 40: Ball screw 41: Rails 42: Z-axis motor 43: Lifting plate 44: Hold the seat 45: Rotary axis 5: Sensor 50: Projection part 51: Light receiving part 52: Projecting and receiving light connection 53: Abutment 54: Light-emitting and receiving element 6: Judgment means
圖1係表示研削裝置的整體之立體圖。 圖2係第一研削輪的俯視圖。 圖3係第二研削輪的俯視圖。 圖4係從側面觀看研削磨石遮蔽從感測器的投光部所投射的光的情況之剖面圖。 圖5係表示第一研削輪斷續地遮蔽來自投光部的光之際的電壓的變化之圖表圖。 圖6係表示第二研削輪斷續地遮蔽來自投光部的光之際的電壓的變化之圖表圖。FIG. 1 is a perspective view showing the entirety of a grinding apparatus. Figure 2 is a top view of the first grinding wheel. Figure 3 is a top view of the second grinding wheel. 4 is a cross-sectional view of a state in which a grinding stone shields light projected from a light-projecting portion of a sensor viewed from the side. FIG. 5 is a graph showing a change in voltage when the first grinding wheel intermittently shields light from a light projecting portion. FIG. 6 is a graph showing a change in voltage when the second grinding wheel intermittently shields light from a light projecting portion.
3:研削手段3: Grinding means
5:感測器5: Sensor
6:判斷手段6: Judgment means
30:主軸30: Spindle
32:旋轉手段32: Rotation Means
33:安裝件33: Mounting pieces
36:第一研削輪36: First grinding wheel
360:第一研削磨石360: First Grinding Grinding Stone
361:第一輪基台361: First round abutment
362:下表面362: Lower Surface
50:投光部50: Projection part
51:受光部51: Light receiving part
52:投受光連線52: Projecting and receiving light connection
54:投受光元件54: Light-emitting and receiving element
540:凹部540: Recess
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JP2020-088666 | 2020-05-21 | ||
JP2020088666A JP2021183359A (en) | 2020-05-21 | 2020-05-21 | Grinding device |
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TW202144125A true TW202144125A (en) | 2021-12-01 |
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