TW202142339A - 加工系統 - Google Patents

加工系統 Download PDF

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Publication number
TW202142339A
TW202142339A TW110115215A TW110115215A TW202142339A TW 202142339 A TW202142339 A TW 202142339A TW 110115215 A TW110115215 A TW 110115215A TW 110115215 A TW110115215 A TW 110115215A TW 202142339 A TW202142339 A TW 202142339A
Authority
TW
Taiwan
Prior art keywords
processing
workpiece
processing system
stage
measuring
Prior art date
Application number
TW110115215A
Other languages
English (en)
Chinese (zh)
Inventor
立崎陽介
Original Assignee
日商尼康股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商尼康股份有限公司 filed Critical 日商尼康股份有限公司
Publication of TW202142339A publication Critical patent/TW202142339A/zh

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03Observing, e.g. monitoring, the workpiece
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Length Measuring Devices By Optical Means (AREA)
TW110115215A 2020-04-30 2021-04-28 加工系統 TW202142339A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/JP2020/018256 WO2021220456A1 (ja) 2020-04-30 2020-04-30 加工システム
WOPCT/JP2020/018256 2020-04-30

Publications (1)

Publication Number Publication Date
TW202142339A true TW202142339A (zh) 2021-11-16

Family

ID=78331891

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110115215A TW202142339A (zh) 2020-04-30 2021-04-28 加工系統

Country Status (2)

Country Link
TW (1) TW202142339A (ja)
WO (1) WO2021220456A1 (ja)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2853007B2 (ja) * 1994-03-29 1999-02-03 オー・エム・シー株式会社 ワークのレーザ加工方法とその装置
JP4989030B2 (ja) * 2005-03-07 2012-08-01 本田技研工業株式会社 内装材のレーザ加工方法
DE102006007700A1 (de) * 2006-02-13 2007-08-16 Stama Maschinenfabrik Gmbh Werkzeugmaschine und Verfahren zur spanabhebenden Bearbeitung von Werkstücken, insbesondere von metallischen Werkstücken
JP2013043196A (ja) * 2011-08-24 2013-03-04 Mitsubishi Materials Corp レーザ加工装置およびレーザ加工方法
JP2018008307A (ja) * 2016-07-15 2018-01-18 株式会社リコー 光加工装置及び光加工物の生産方法
JP6886102B2 (ja) * 2016-12-16 2021-06-16 澁谷工業株式会社 レーザ加工方法
JP7073127B2 (ja) * 2018-02-06 2022-05-23 東レエンジニアリング株式会社 レーザマーキング装置

Also Published As

Publication number Publication date
WO2021220456A1 (ja) 2021-11-04

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