TW202137445A - Heat sink - Google Patents

Abstract

The present invention provides a heat sink. The heat sink includes a substrate disposed above an immersion liquid-cooled server, and a heating device of the immersion liquid-cooled server is immersed in an insulating liquid. The substrate and the immersion liquid-cooled server are fixed to the bottom of the substrate; a second heat dissipation mechanism is fixed to the top of the substrate. The radiator of the present invention solves the problem of air-cooled heat dissipation, can support higher ambient temperature, higher heat dissipation capacity, larger heat dissipation area, and saves fan power consumption compared with full air-cooled heat dissipation; and the structure of the heat sink is simple. The production cost is low, which is convenient for disassembly and replacement.

Description

heat sink

The invention belongs to the technical field of heat dissipation, and particularly relates to a radiator.

With the ever-increasing demand for edge servers, their power consumption density is increasing, and the operating environment required to support them is also becoming increasingly strict. The traditional air-cooled edge server can no longer meet the increasing demand, and the traditional cold plate cannot adapt to the existing demand due to its compatibility and reliability. Edge servers are becoming more and more airtight. For this, we also provide a cooling solution based on two-phase technology. At the same time, it is also necessary to increase the heat dissipation facilities that conduct heat out of the server, such as a conventional condensate pan radiator. The conventional condensate pan must have cooling liquid to participate in the heat exchange, and at the same time, it needs to be equipped with an external pump, and the structure is more complicated.

Therefore, how to provide a radiator to solve the disadvantages of requiring cooling liquid to participate in heat exchange in the prior art and also requiring external pumps, resulting in a complicated server structure, has become a technical problem to be solved urgently by those skilled in the art.

In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a radiator to solve the problem that the prior art requires a cooling liquid to participate in heat exchange, and at the same time requires an external pump, which results in a complicated server structure.

In order to achieve the above-mentioned objects and other related objects, the present invention provides a radiator, the radiator comprising: a substrate, which is arranged above an immersed liquid-cooled server, and the heating device of the immersed liquid-cooled server is immersed in an insulating liquid; A heat dissipation mechanism is arranged between the substrate and the immersion liquid-cooled server and is fixed on the bottom of the substrate; and a second heat dissipation mechanism is fixed on the top of the substrate.

In an embodiment of the present invention, the first heat dissipation mechanism is located above the immersed liquid-cooled server; after the insulating liquid boils, the generated steam rises to the above-mentioned immersed liquid-cooled server. Condensation at the first heat dissipation mechanism.

In an embodiment of the present invention, the first heat dissipation mechanism includes a bottom fin group welded to the bottom of the substrate, and the fins of the bottom fin group are not interrupted.

In an embodiment of the present invention, the second heat dissipation mechanism includes a plurality of top fin groups, the plurality of top fin groups are welded on the substrate, and the heat dissipation fins in the top fin group are spaced apart Arranged, the top fin group forms an N×M array; where N and M are greater than one.

In an embodiment of the present invention, an arc-shaped groove is opened on the substrate, and the second heat dissipation mechanism further includes a plurality of heat dissipation pipes arranged in the arc-shaped groove.

In an embodiment of the present invention, each of the heat dissipation pipes extends and penetrates the heat dissipation fins.

In an embodiment of the present invention, when two radiating pipes are arranged in each of the arc-shaped grooves, the radiating pipes at the extension are in an inverted figure-eight-shaped structure.

In an embodiment of the present invention, when at least three of the heat dissipation pipes are arranged in each of the arc-shaped grooves, the heat dissipation pipes at the extension are arranged in a radial manner.

In an embodiment of the present invention, the heat dissipation pipes are connected inwardly from both ends of the top fin group.

In an embodiment of the present invention, the substrate, the first heat dissipation mechanism and the second heat dissipation mechanism are all made of metal materials.

As mentioned above, the heat sink of the present invention has the following beneficial effects:

The radiator of the present invention solves the problem of air-cooled heat dissipation, can support higher ambient temperature, has a higher heat dissipation capacity, a larger heat dissipation area, and saves fan power consumption compared with full-air-cooled heat dissipation; and the radiator has a simple structure, The production cost is low, and it is convenient to disassemble and replace.

The following specific examples illustrate the implementation of the present invention. Those familiar with the technology can easily understand the other advantages and effects of the present invention from the content disclosed in this specification.

Please refer to the attached picture. It should be noted that the structures, proportions, sizes, etc. shown in the accompanying drawings in this specification are only used to match the content disclosed in the specification for people familiar with this technology to understand and read, and are not intended to limit the implementation of the present invention. Limited conditions, so it has no technical significance. Any structural modification, proportional relationship change or size adjustment should still fall within the present invention without affecting the effects and objectives that can be achieved by the present invention. The disclosed technical content must be within the scope of coverage. At the same time, the terms such as "upper", "lower", "left", "right", "middle" and "one" quoted in this specification are only for convenience of description and are not used to limit the text. The scope of implementation of the invention, the change or adjustment of its relative relationship, shall be regarded as the scope of implementation of the invention without substantial changes to the technical content.

This embodiment provides a heat sink, which includes:

The substrate is arranged above the immersed liquid-cooled server, and the heating device of the immersed liquid-cooled server is immersed in the insulating liquid;

The first heat dissipation mechanism is arranged between the substrate and the immersion liquid-cooled server, and is fixed at the bottom of the substrate;

The second heat dissipation mechanism is fixed on the top of the substrate.

The heat sink provided in this embodiment will be described in detail below in conjunction with the drawings. The radiator described in this embodiment is applied to a submerged liquid-cooled server (also called a two-phase submerged liquid-cooled edge server) to seal the submerged liquid-cooled server. The heating device of the immersion liquid-cooled server is immersed in the insulating liquid.

Please refer to FIGS. 1A, 1B, 1C, 1D, and 1E, which respectively show a three-dimensional structure diagram of a heat sink in an embodiment, a front view structure diagram of a heat sink in an embodiment, and an embodiment A schematic diagram of the top structure of the radiator in, a schematic diagram of the bottom structure of the radiator in an embodiment, and a schematic diagram of the side structure of the radiator in an embodiment. The heat sink 1 includes a substrate 11, a first heat dissipation mechanism 12 and a second heat dissipation mechanism 13.

In this embodiment, the substrate 11 is arranged above the immersion liquid-cooled server. As shown in FIGS. 1A and 1C, N arc-shaped grooves 111 are opened in parallel on the substrate.

In this embodiment, the first heat dissipation mechanism 12 with condensation function is located above the submerged liquid-cooled server.

Please refer to FIG. 2, which shows a schematic bottom view of the first heat dissipation mechanism in an embodiment. As shown in FIG. 2, the first heat dissipation mechanism 12 includes a bottom fin group welded to the bottom of the base plate 11. Continuing to refer to FIG. 1C and FIG. 1E, the fins 121 of the bottom fin group are arranged side by side without interruption. In this embodiment, the material of the first heat dissipation mechanism is a metal material.

In this embodiment, when the heating device of the immersed liquid-cooled server boils the insulating liquid, the generated steam rises to the first heat dissipation mechanism above the immersed liquid-cooled server to condense to take away The heat generated by the heating device.

Please refer to FIG. 3, which shows a schematic top view of the second heat dissipation mechanism in an embodiment. As shown in FIGS. 1A, 1B, 1C and 3, the second heat dissipation mechanism 13 is fixed on the top of the substrate 11.

The second heat dissipation mechanism 13 includes a plurality of top fin groups (each top fin group includes a plurality of heat dissipation fins 131) and a plurality of heat dissipation tubes 132. A plurality of the top fin groups are welded to the top of the substrate 11. In order to improve the turbulence of the airflow and provide convection heat transfer efficiency, the heat dissipation fins 131 in the top fin group are arranged at intervals. The top fin group forms an N×M type array; wherein, N and M are greater than one. In this embodiment, the material of the second heat dissipation mechanism is a metal material.

1D, in this embodiment, a centrifugal fan is used to provide a higher wind pressure. Cold air enters between the heat dissipation fins 131 from the top of the radiator 1, and performs convective heat exchange with the cold air to take away the heat dissipation fins. Heat on slice 131.

In order to further provide thermal conductivity, at least one heat dissipation pipe 132 is provided in the arc-shaped groove 111 of the substrate 11.

Referring to FIG. 1A, FIG. 1D and FIG. 1E, each of the heat dissipation tubes 132 extends and penetrates the heat dissipation fins 131, and is connected inwardly from both ends of the top fin group.

As shown in FIG. 1B, when two radiating pipes 132 are provided in each of the arc-shaped grooves 111, the radiating pipes 132 at the extension are in an inverted eight-shaped structure.

When at least three of the heat dissipation pipes 132 are arranged in each of the arc-shaped grooves 111, the heat dissipation pipes 132 at the extension are arranged radially.

The radiator of the present invention solves the problem of air-cooled heat dissipation, can support higher ambient temperature, has a higher heat dissipation capacity, and a larger heat dissipation area, and saves fan power consumption compared with full-air-cooled heat dissipation; and the radiator has a simple structure and is produced The cost is low, and it is convenient to disassemble and replace. In summary, the present invention effectively overcomes various shortcomings in the prior art and has a high industrial value.

The above-mentioned embodiments only exemplarily illustrate the principles and effects of the present invention, but are not used to limit the present invention. Anyone familiar with this technology can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or changes made by those with ordinary knowledge in the technical field without departing from the spirit and technical ideas disclosed in the present invention should still be covered by the claims of the present invention.

1: radiator 11: substrate 12: The first heat dissipation mechanism 13: The second heat dissipation mechanism 111: curved groove 121: Each fin of the bottom fin group 131: cooling fins 132: heat pipe

FIG. 1A is a schematic diagram of a three-dimensional structure of a heat sink in an embodiment of the present invention. FIG. 1B is a schematic diagram of a front view of a heat sink in an embodiment of the present invention. FIG. 1C is a schematic diagram of the bottom structure of the heat sink in an embodiment of the present invention. FIG. 1D shows a schematic diagram of the top structure of the heat sink in an embodiment of the present invention. FIG. 1E is a schematic side view of the structure of the heat sink in an embodiment of the present invention. FIG. 2 is a schematic bottom view of the structure of the first heat dissipation mechanism in an embodiment of the present invention. FIG. 3 is a schematic top view of the structure of the second heat dissipation mechanism in an embodiment of the present invention.

1: radiator

11: substrate

12: The first heat dissipation mechanism

13: The second heat dissipation mechanism

111: curved groove

131: cooling fins

Claims (10)

A radiator, comprising: a substrate arranged above an immersed liquid-cooled server, a heating device of the immersed liquid-cooled server is immersed in an insulating liquid; a first heat dissipation mechanism, arranged on the substrate and the substrate The immersion liquid-cooled servers are fixed on the bottom of the substrate; and a second heat dissipation mechanism is fixed on the top of the substrate. The radiator according to claim 1, wherein the first heat dissipation mechanism is located above the immersed liquid-cooled server; after the insulating liquid boils, the generated steam rises above the immersed liquid-cooled server Condensation at the first heat dissipation mechanism. The heat sink according to claim 1, wherein the first heat dissipation mechanism includes a bottom fin group welded to the bottom of the base plate, and there is no interruption between the fins of the bottom fin group . The heat sink according to claim 1, wherein the second heat dissipation mechanism includes a plurality of top fin groups, the plurality of top fin groups are welded on the substrate, and the heat dissipation fins in the top fin group The fins are arranged at intervals, and the top fin group forms an N×M array; where N and M are greater than one. The heat sink according to claim 4, wherein an arc-shaped groove is defined on the substrate, and the second heat dissipation mechanism further includes a plurality of heat dissipation pipes arranged in the arc-shaped groove. The heat sink according to claim 5, wherein each of the heat dissipation pipes extends and penetrates the heat dissipation fins. The radiator according to claim 6, wherein, when two heat dissipation pipes are arranged in each of the arc-shaped grooves, the heat dissipation pipes at the extensions are in an inverted eight-shaped structure. The radiator according to claim 6, wherein, when at least three of the heat dissipation pipes are arranged in each of the arc-shaped grooves, the heat dissipation pipes at the extension are arranged radially. The radiator according to claim 6, wherein the heat dissipation pipes are connected inwardly from both ends of the top fin group. The heat sink according to claim 1, wherein the materials of the substrate, the first heat dissipation mechanism and the second heat dissipation mechanism are all metal materials.

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