CN207380661U - CPU novel heat pipe radiators - Google Patents
CPU novel heat pipe radiators Download PDFInfo
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- CN207380661U CN207380661U CN201721563661.0U CN201721563661U CN207380661U CN 207380661 U CN207380661 U CN 207380661U CN 201721563661 U CN201721563661 U CN 201721563661U CN 207380661 U CN207380661 U CN 207380661U
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Abstract
The utility model is related to hardware fields, more particularly to CPU novel heat pipe radiators, collecting plate including being used to install CPU, fit in two support bases at thermal-arrest plate surface both ends, it is arranged between collecting plate and two support bases or is used to carry out through two support bases the heat pipe heat of heat transfer, it is connected to the heat conduction ring of two free end of heat pipe heat, it is sheathed on outside heat conduction ring and in several radiating fins of circle ring array, the retainer ring outside all radiating fins is covered at, shown retainer ring is concentric circles with heat conduction ring；The heat pipe heat is connected with heat conduction ring；The heat pipe heat is not provided with radiating fin with heat conduction ring junction；The radiating fin includes aluminum lamella and is used for the heat conversion layer by converting heat for infrared ray coated on aluminum sheet surfaces；The collecting plate is coated with heat-conducting glue away from a side surface of support base.The utility model is simple in structure, heat dissipation area is big, heat transfer medium flows speed is fast, good heat dissipation effect.
Description
Technical field
The utility model is related to hardware fields, and in particular to CPU novel heat pipe radiators.
Background technology
CPU can generate substantial amounts of heat when work, if these heats not distributed in time, gently if cause it is dead
Machine, heavy then may burn CPU, cpu heat is exactly for radiating for CPU.Radiator plays certainly the stable operation of CPU
It qualitatively acts on, it is extremely important to choose a good radiator when assembling computer.
Cpu heat can be divided into three kinds of air-cooled, heat pipe and water cooling according to its radiating mode, wherein, heat-pipe radiator is one
Heat transfer element of the kind with very high thermal conductivity, it transfers heat by the evaporation of the liquid in Totally enclosed vacuum pipe with condensation
Amount.Most of such fan is " air-cooled+heat pipe " property, has both air-cooled and heat pipe advantage, has high thermal diffusivity.
The heat-pipe radiator of the prior art, on the one hand, radiator fan must be installed, structure is more complicated, second aspect, heat pipe
Interior heat transfer medium flows speed is fast, and heat-conducting effect is poor, poor so as to cause heat dissipation effect.
Utility model content
The purpose of the utility model is to overcome the deficiencies in the prior art, provide it is a kind of it is simple in structure, heat dissipation area is big, heat conduction
Media flow speed is fast, the CPU novel heat pipe radiators of good heat dissipation effect.
Technical solution is used by the utility model：CPU novel heat pipe radiators, the collection including being used to install CPU
Hot plate fits in two support bases at thermal-arrest plate surface both ends, is arranged between collecting plate and two support bases or through two
Support base is used to carry out the heat pipe heat of heat transfer, is connected to the heat conduction ring of two free end of heat pipe heat, be sheathed on outside heat conduction ring and
In several radiating fins of circle ring array, the retainer ring outside all radiating fins, shown retainer ring and heat conduction ring are covered at
For concentric circles；The heat pipe heat is connected with heat conduction ring；The heat pipe heat is not provided with radiating fin with heat conduction ring junction；It is described
Radiating fin includes aluminum lamella and is used for the heat conversion layer by converting heat for infrared ray coated on aluminum sheet surfaces；Institute
It states collecting plate and is coated with heat-conducting glue away from a side surface of support base.
To being further improved as the heat conducting pipe group includes being symmetrical arranged and fitting in collecting plate for above-mentioned technical proposal
First heat conducting pipe and the second heat conducting pipe deviate from the second heat conducting pipe one side positioned at the first heat conducting pipe and pass through the 3rd heat conduction of support base
Pipe, positioned at the second heat conducting pipe away from the first heat conducting pipe one side and through support base the 4th heat conducting pipe, the 3rd heat conducting pipe and
4th heat conducting pipe is symmetrical on the center line of the first heat conducting pipe and the second heat conducting pipe, first heat conducting pipe and the second heat conducting pipe it is outer
Footpath is more than the outer diameter of the 3rd heat conducting pipe and the 4th heat conducting pipe.
To being further improved as first heat conducting pipe and the second heat conducting pipe include tube body, sink for above-mentioned technical proposal
Product in the erosion resistant coating of inner surface of tube body, annular array in inboard wall of tube body several section fibre capillary structures, be filled in tubular body
Heat-conducting medium.
To being further improved as the circle ring inner wall and side wall that the radiating fin is formed are equipped with pottery for above-mentioned technical proposal
Porcelain cooling fin.
The beneficial effects of the utility model are：
1st, CPU is installed on collecting plate away from the surface of support base one side, CPU work generates substantial amounts of heat, is transferred to
Collecting plate, collecting plate transfer heat to heat pipe heat, and heat pipe heat is flowed by interior media, transfers heat to heat conduction ring, is led
With radiating fin disposed thereon heat exchange occurs for hot ring, transfers heat to radiating fin, radiating fin goes out conduct heat away
It goes.On the one hand, for radiating fin in circle ring array outside heat conduction ring, heat dissipation area is big, and work is blocked between adjacent heat radiation fin
With small, the flowing of radiating fin surrounding air is big, and heat exchange, good heat dissipation effect occurs convenient for radiating fin and surrounding air.Second
Aspect, retainer ring are covered at outside all radiating fins, prevent radiating fin from rocking, and ensure the stability of heat dissipation effect.3rd
Aspect, radiating fin include aluminum lamella and are used to convert converting heat for the heat of infrared ray coated on aluminum sheet surfaces
Layer is transferred to the heat of the aluminum lamella of radiating fin, can be transferred directly to surrounding, can also convert heat through heat conversion layer
It is radiated for infrared ray in ambient enviroment, further improves radiating efficiency.Fourth aspect, collecting plate deviate from the one of support base
Side surface is coated with heat-conducting glue, quickly can transfer out by the heat that CPU work generates, further improve radiating efficiency.
2nd, heat conducting pipe group includes being symmetrical arranged and fits in the first heat conducting pipe and the second heat conducting pipe of collecting plate, positioned at first
Heat conducting pipe deviates from the first heat conducting pipe away from the second heat conducting pipe one side and through the 3rd heat conducting pipe of support base positioned at the second heat conducting pipe
One side and the 4th heat conducting pipe for passing through support base, the 3rd heat conducting pipe and the 4th heat conducting pipe are led on the first heat conducting pipe and second
The center line of heat pipe is symmetrical, and the outer diameter of first heat conducting pipe and the second heat conducting pipe is more than the outer of the 3rd heat conducting pipe and the 4th heat conducting pipe
Footpath.Symmetrically arranged first heat conducting pipe and the second heat conducting pipe, the 3rd heat conducting pipe and the 4th heat conducting pipe, can uniformly work CPU
The heat of generation conducts, and heat dissipation effect is uniform, and sets there are four heat conducting pipe, and heat-transfer rate is fast, and four heat conducting pipes are with leading
Hot ring together with so that cooling medium be able to, in heat conducting pipe and heat conduction ring internal flow, further improve heat dissipation effect.
3rd, the first heat conducting pipe and the second heat conducting pipe include tube body, the erosion resistant coating for being deposited on inner surface of tube body, annular array
Several section fibre capillary structures in inboard wall of tube body, the heat-conducting medium for being filled in tubular body.Fiber capillary structure is situated between to heat conduction
Matter plays drainage in the flowing of tubular body, accelerates the flowing of tubular body heat-conducting medium so that heat conducting pipe can be quick
Heat at collecting plate is taken at radiating fin, further improves heat dissipation effect.Simultaneously as part heat-conducting medium has
Corrosivity, the design of inner surface erosion resistant coating, prevents tube body to be corroded, and extends the service life of heat conducting pipe, further improves
Heat dissipation effect.
4th, the circle ring inner wall and side wall that radiating fin is formed are equipped with ceramic cooling fin, ceramic cooling fin heat conduction efficiency
Height accelerates the conduction of radiating fin surface heat, further improves heat dissipation effect.
Description of the drawings
Fig. 1 is the stereogram of the utility model；
Fig. 2 is the stereogram at another visual angle of the utility model；
Fig. 3 is the cross-sectional view of the radiating fin of the utility model；
Fig. 4 is the cross-sectional view of first heat conducting pipe of the utility model.
Specific embodiment
The utility model is further described below in conjunction with attached drawing.
As depicted in figs. 1 and 2, it is respectively the stereogram of the utility model different visual angles.
CPU novel heat pipe radiators 110, the collecting plate 110 including being used to install CPU, fit in 110 surface of collecting plate
Two support bases 120 at both ends are arranged between collecting plate 110 and two support bases 120 or are used for through two support bases 120
The heat pipe heat 130 of heat transfer is carried out, the heat conduction ring 140 of 130 liang of free ends of heat pipe heat is connected to, is sheathed on outside heat conduction ring 140
And in several radiating fins 150 of circle ring array, cover at the retainer ring 160 outside all radiating fins 150, shown fixation
Ring 160 is concentric circles with heat conduction ring 140；The heat pipe heat 130 is connected with heat conduction ring 140；The heat pipe heat 130 and heat conduction ring
140 junctions are not provided with radiating fin 150.
As shown in figure 3, the cross-sectional view of the radiating fin for the utility model.
It is infrared that radiating fin 150, which includes aluminum lamella 151 and is used for coated on 151 surface of aluminum lamella by converting heat,
The heat conversion layer 152 of line；The collecting plate 110 is coated with heat-conducting glue away from a side surface of support base 120.
Heat conducting pipe group 130 includes being symmetrical arranged and fitting in the first heat conducting pipe 131 and the second heat conducting pipe of collecting plate 110
132, positioned at the first heat conducting pipe 131 away from 132 one side of the second heat conducting pipe and through the 3rd heat conducting pipe 133 of support base 120, it is located at
Second heat conducting pipe 132 deviates from 131 one side of the first heat conducting pipe and passes through the 4th heat conducting pipe 134 of support base 120, the 3rd heat conduction
133 and the 4th heat conducting pipe 134 of pipe is symmetrical on the center line of the first heat conducting pipe 131 and the second heat conducting pipe 132, first heat conducting pipe
131 and second the outer diameter of heat conducting pipe 132 be more than the outer diameter of the 3rd heat conducting pipe 133 and the 4th heat conducting pipe 134.Symmetrically arranged first
131 and second heat conducting pipe 132 of heat conducting pipe, the 3rd heat conducting pipe 133 and the 4th heat conducting pipe 134 can uniformly generate CPU work
Heat conducts, and heat dissipation effect is uniform, and sets there are four heat conducting pipe, and heat-transfer rate is fast, four heat conducting pipes with heat conduction ring 140
Together with so that cooling medium is able to, in 140 internal flow of heat conducting pipe and heat conduction ring, further improve heat dissipation effect.
As shown in figure 4, the cross-sectional view of the first heat conducting pipe for the utility model.
First heat conducting pipe 131 and the second heat conducting pipe 132 include tube body 131a, the anti-corrosion for being deposited on tube body 131a inner surfaces
Layer 131b, annular array in tube body 131a inner walls several section fibre capillary structure 131c, be filled in leading inside tube body 131a
Thermal medium 131d.Fiber capillary structure 131c plays drainage to flowings of the heat-conducting medium 131d inside tube body 131a, adds
The flowing of heat-conducting medium 131d inside fast tube body 131a so that heat conducting pipe can quickly take the heat at collecting plate 110 to scattered
At hot fin 150, heat dissipation effect is further improved.Simultaneously as part heat-conducting medium 131d has corrosivity, inner surface is prevented
The design of rotten layer 131b, prevents tube body 131a to be corroded, and extends the service life of heat conducting pipe, further improves heat dissipation effect
Fruit.
The circle ring inner wall and side wall that radiating fin 150 is formed are equipped with ceramic cooling fin 151, and ceramic 151 heat of cooling fin passes
It leads efficient, accelerates the conduction of 150 surface heat of radiating fin, further improve heat dissipation effect.
CPU is installed on collecting plate 110 away from the surface of 120 one side of support base, CPU work generates substantial amounts of heat, passes
Collecting plate 110 is handed to, collecting plate 110 transfers heat to heat pipe heat 130, and heat pipe heat 130 is flowed by interior media, by heat
Heat conduction ring 140 is transferred to, heat conduction ring 140 occurs heat exchange with radiating fin 150 disposed thereon, transfers heat to heat radiating fin
Piece 150, radiating fin 150 go out conduct heat away.On the one hand, radiating fin 150 in circle ring array outside heat conduction ring 140,
Heat dissipation area is big, and the effect of being blocked between adjacent heat radiation fin 150 is small, and the flowing of 150 surrounding air of radiating fin is big, convenient for heat dissipation
With surrounding air heat exchange, good heat dissipation effect occur for fin 150.Second aspect, retainer ring 160 cover at all radiating fins
It outside 150, prevents radiating fin 150 from rocking, ensures the stability of heat dissipation effect.The third aspect, radiating fin 150 include aluminum
Lamella 151 and coated on 151 surface of aluminum lamella be used for by converting heat be infrared ray heat conversion layer 152, be transferred to scattered
The heat of the aluminum lamella 151 of hot fin 150 can be transferred directly to surrounding, can also be converted heat to through heat conversion layer 152
Infrared ray and be radiated in ambient enviroment, further improve radiating efficiency.Fourth aspect, collecting plate 110 deviate from support base 120
A side surface coated with heat-conducting glue, quickly the heat that CPU work generates can be transferred out, further improve heat dissipation effect
Rate.
The operation principle of the utility model is：
CPU is installed on collecting plate 110 away from the surface of 120 one side of support base, CPU work generates substantial amounts of heat, warp
Heat-conducting glue is quickly transferred to collecting plate 110, and collecting plate 110 transfers heat to heat pipe heat 130, and heat pipe heat 130 is situated between by inside
Mass flow is moved, transfer heat to heat conducting pipe group 130 together with heat conduction ring 140, heat conduction ring 140 and radiating fin disposed thereon
150 occur heat exchange, transfer heat to radiating fin 150, on the one hand, with surrounding air heat exchange occurs for radiating fin 150
Cooling, second aspect, the heat conversion layer 152 on 150 surface of radiating fin convert heat to infrared radiation to ambient enviroment
In, radiating efficiency is high, good heat dissipation effect.
Embodiment described above only expresses the several embodiments of the utility model, and description is more specific and detailed,
But it should not be interpreted as limiting the scope of the present invention.It should be pointed out that for the common of this field
For technical staff, without departing from the concept of the premise utility, various modifications and improvements can be made, these all belong to
In the scope of protection of the utility model.Therefore, the protection domain of the utility model patent should be with appended claims.
Claims (4)
1.CPU novel heat pipe radiators, it is characterised in that：Collecting plate including being used to install CPU, fits in thermal-arrest plate surface
Two support bases at both ends are arranged between collecting plate and two support bases or carry out heat transfer through two support bases
Heat pipe heat is connected to the heat conduction ring of two free end of heat pipe heat, is sheathed on outside heat conduction ring and in several heat dissipations of circle ring array
Fin, covers at the retainer ring outside all radiating fins, and shown retainer ring is concentric circles with heat conduction ring；The heat pipe heat is with leading
Hot ring is connected；The heat pipe heat is not provided with radiating fin with heat conduction ring junction；The radiating fin include aluminum lamella and
The heat conversion layer by converting heat for infrared ray is used for coated on aluminum sheet surfaces；The collecting plate deviates from the one of support base
Side surface is coated with heat-conducting glue.
2. CPU novel heat pipe radiators according to claim 1, it is characterised in that：The heat pipe heat includes symmetrically setting
It puts and fits in the first heat conducting pipe and the second heat conducting pipe of collecting plate, away from the second heat conducting pipe one side and worn positioned at the first heat conducting pipe
The 3rd heat conducting pipe of support base is crossed, deviate from the first heat conducting pipe one side positioned at the second heat conducting pipe and passes through the 4th heat conduction of support base
Pipe, the 3rd heat conducting pipe and the 4th heat conducting pipe are symmetrical on the center line of the first heat conducting pipe and the second heat conducting pipe, and described first leads
The outer diameter of heat pipe and the second heat conducting pipe is more than the outer diameter of the 3rd heat conducting pipe and the 4th heat conducting pipe.
3. CPU novel heat pipe radiators according to claim 2, it is characterised in that：First heat conducting pipe and second
Heat conducting pipe includes tube body, the erosion resistant coating for being deposited on inner surface of tube body, annular array in several section fibre capillarys of inboard wall of tube body
Organize, be filled in the heat-conducting medium of tubular body.
4. CPU novel heat pipe radiators according to claim 3, it is characterised in that：The circle that the radiating fin is formed
Ring inner wall and side wall are equipped with ceramic cooling fin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721563661.0U CN207380661U (en) | 2017-11-21 | 2017-11-21 | CPU novel heat pipe radiators |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721563661.0U CN207380661U (en) | 2017-11-21 | 2017-11-21 | CPU novel heat pipe radiators |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207380661U true CN207380661U (en) | 2018-05-18 |
Family
ID=62332971
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721563661.0U Active CN207380661U (en) | 2017-11-21 | 2017-11-21 | CPU novel heat pipe radiators |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207380661U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113048097A (en) * | 2021-04-29 | 2021-06-29 | 杭州余杭特种风机有限公司 | Centrifugal blower impeller and centrifugal blower thereof |
| CN116997166A (en) * | 2023-09-26 | 2023-11-03 | 中国科学院长春光学精密机械与物理研究所 | Photoelectric device with heat dissipation function and photoelectric system |
-
2017
- 2017-11-21 CN CN201721563661.0U patent/CN207380661U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113048097A (en) * | 2021-04-29 | 2021-06-29 | 杭州余杭特种风机有限公司 | Centrifugal blower impeller and centrifugal blower thereof |
| CN116997166A (en) * | 2023-09-26 | 2023-11-03 | 中国科学院长春光学精密机械与物理研究所 | Photoelectric device with heat dissipation function and photoelectric system |
| CN116997166B (en) * | 2023-09-26 | 2023-12-19 | 中国科学院长春光学精密机械与物理研究所 | Photoelectric device with heat dissipation function and photoelectric system |
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