CN207380662U - CPU high-efficiency radiators - Google Patents

Abstract

The utility model relates to the field of hardware products, in particular to a high-efficiency radiator for a CPU, which includes a heat collecting plate for installing the CPU, a bottom plate arranged parallel to the heat collecting plate, and a heat conducting plate that is clamped between the heat collecting plate and the bottom plate Heat pipe group, the first heat dissipation group and the second heat dissipation group in the shape of a cuboid located on both sides of the bottom plate, one end of the heat pipe group passes through the first heat dissipation group, the other end of the heat pipe group passes through the second heat dissipation group, the heat collecting plate and the bottom plate Connected by screws; the heat pipe group is provided with six heat pipes distributed symmetrically in a U shape, and the first heat dissipation group and the second heat dissipation group are stacked with several heat dissipation fins with the same shape and structure; the heat dissipation The fins include an aluminum sheet layer and a heat conversion layer coated on the surface of the aluminum sheet layer for converting heat into infrared rays; the surface of the side of the heat collecting plate away from the bottom plate is coated with thermal conductive glue. The utility model has the advantages of simple structure, large heat dissipation area, fast cooling liquid flow speed and good heat dissipation effect.

Description

Efficient radiator for CPU

technical field

The utility model relates to the field of hardware products, in particular to a high-efficiency radiator for a CPU.

Background technique

When the CPU is working, it will generate a lot of heat. If the heat is not dissipated in time, it will cause a crash, or burn the CPU. The CPU radiator is used to dissipate heat for the CPU. The radiator plays a decisive role in the stable operation of the CPU. It is very important to choose a good radiator when assembling the computer.

CPU radiators can be divided into three types according to their heat dissipation methods: air cooling, heat pipe cooling and water cooling. Among them, the heat pipe radiator is a heat transfer element with extremely high thermal conductivity. It passes the evaporation and condensation of liquid in a fully enclosed vacuum tube to transfer heat. Most of these fans are "air-cooled + heat pipe", which has the advantages of both air-cooling and heat pipe, and has extremely high heat dissipation.

The heat pipe radiator in the prior art, on the one hand, must be equipped with a heat dissipation fan, and the structure is relatively complicated; on the other hand, the cooling medium in the heat pipe flows at a fast speed, and the heat conduction effect is poor, resulting in poor heat dissipation effect.

Utility model content

The purpose of the utility model is to overcome the deficiencies of the prior art and provide a high-efficiency radiator for CPU with simple structure, large heat dissipation area, fast cooling liquid flow speed and good heat dissipation effect.

The technical scheme adopted by the utility model is: a high-efficiency radiator for CPU, including a heat collecting plate for installing the CPU, a bottom plate arranged parallel to the heat collecting plate, and a heat conduction plate between the heat collecting plate and the bottom plate. Heat pipe group, the first heat dissipation group and the second heat dissipation group in the shape of a cuboid located on both sides of the bottom plate, one end of the heat pipe group passes through the first heat dissipation group, the other end of the heat pipe group passes through the second heat dissipation group, the heat collecting plate and the bottom plate Connected by screws; the heat pipe group is provided with six heat pipes distributed symmetrically in a U shape, and the first heat dissipation group and the second heat dissipation group are stacked with several heat dissipation fins with the same shape and structure; the heat dissipation The fins include an aluminum sheet layer and a heat conversion layer coated on the surface of the aluminum sheet layer for converting heat into infrared rays; the surface of the side of the heat collecting plate away from the bottom plate is coated with thermal conductive glue.

A further improvement to the above technical solution is that the overall shape of the heat dissipation fins is rectangular, and the center of the heat dissipation fins is symmetrically provided with six through holes for the heat pipe to pass through, and the edge of the through holes is vertically provided with a first positioning baffle to dissipate heat. There are serrations on the edges of the two long sides of the fin, and a card slot is opened in the middle of the two short sides of the heat dissipation fin. The two positioning baffles and the serrations are uniformly stamped and formed; the heights of the first locating baffle and the second positioning baffle are equal to the distance between two adjacent cooling fins.

A further improvement to the above technical solution is that the outer diameter of the heat pipe is equal to the distance between the heat collecting plate and the bottom plate.

A further improvement to the above technical solution is that the heat conduction tube includes a tube body, several sections of fibrous capillary tissue annularly arrayed on the inner wall of the tube body, and a heat conduction medium filled inside the tube body.

The beneficial effects of the utility model are:

1. Install the CPU on the heat collecting plate, the heat generated by the CPU working process is quickly transferred to the heat collecting plate, the temperature decreases after heat exchange with the heat pipe group, the temperature of the heat pipe group rises, and the heat pipe group transfers the heat to the first heat sink The first heat dissipation group and the second heat dissipation group transmit to the surroundings through the first heat dissipation group and the second heat dissipation group to reduce the temperature of the CPU and play a heat dissipation function. On the one hand, since the first heat dissipation group and the second heat dissipation group are equipped to dissipate heat at the same time, the heat dissipation efficiency is high. On the other hand, the heat pipe group is equipped with six heat pipes distributed symmetrically in a U shape, which can quickly export its own heat and further improve In order to improve the heat dissipation efficiency, in the third aspect, the first heat dissipation group and the second heat dissipation group are stacked with several heat dissipation fins with the same shape and structure, which increases the heat dissipation area and further improves the heat dissipation efficiency. In the fourth aspect, the heat dissipation fins Consisting of an aluminum sheet and a heat conversion layer coated on the surface of the aluminum sheet to convert heat into infrared rays, the heat transferred to the aluminum sheet of the heat dissipation fin can be directly transferred to the surroundings or through heat conversion The layer converts the heat into infrared rays and radiates it to the surrounding environment, which further improves the heat dissipation efficiency. In the fifth aspect, the surface of the heat collector plate away from the bottom plate is coated with thermal conductive glue, which can quickly conduct the heat generated by the CPU work, further Improved cooling efficiency.

2. The overall shape of the heat dissipation fins is rectangular. There are six through holes symmetrically opened in the center of the heat dissipation fins for the passage of heat pipes. The edges of the through holes are vertically provided with a first positioning block, and the edges of the two long sides of the heat dissipation fins are provided with serrations. , the setting of the sawtooth plays a drainage effect on the surrounding air, promotes air convection around the heat dissipation fins, and improves the heat dissipation effect. There is a card slot in the middle of the two short sides of the heat dissipation fin, and a second positioning block is vertically provided on the edge of the card slot. The through hole, the first positioning block, the card slot, the second positioning block, and the serrations are uniformly stamped and formed, and the processing technology is simple; the setting of the card slot facilitates the installation of the radiator on the CPU. The height of the first positioning block and the height of the second positioning block are both equal to the distance between two adjacent cooling fins. The first positioning baffle and the second locating baffle play the role of supporting the upper heat dissipation fin, ensuring that the distance between two adjacent heat dissipation fins will not be loose, thereby increasing the overall heat dissipation area and improving the heat dissipation effect.

3. The outer diameter of the heat pipe is equal to the distance between the heat collecting plate and the bottom plate. The heat pipe is in direct contact with the heat collecting plate, so the heat transfer speed is fast and the heat dissipation effect is improved.

4. The heat pipe includes a pipe body, several sections of fibrous capillary tissue annularly arrayed on the inner wall of the pipe body, and a heat-conducting medium filled inside the pipe body. The fibrous capillary tissue plays a drainage role in the flow of heat-conducting medium inside the pipe body, accelerating The flow of the heat-conducting medium inside the tube body enables the heat-conducting tube to quickly transfer the heat from the heat-collecting plate to the first and second heat-dissipating groups, further improving the heat-dissipating effect.

Description of drawings

Fig. 1 is the perspective view of the utility model;

Fig. 2 is a perspective view of another viewing angle of the utility model;

Fig. 3 is a schematic cross-sectional view of a heat dissipation fin of the present invention;

Fig. 4 is the structural representation of the cooling fin of the present utility model;

FIG. 5 is a schematic cross-sectional view of the heat pipe of the present invention.

Detailed ways

The utility model will be further described below in conjunction with the accompanying drawings.

As shown in Fig. 1 and Fig. 2, they are perspective views of different viewing angles of the utility model respectively.

The high-efficiency radiator 100 for the CPU includes a heat collecting plate 110 for installing the CPU, a bottom plate 120 arranged parallel to the heat collecting plate 110, and a heat pipe group 130 sandwiched between the heat collecting plate 110 and the bottom plate 120 for heat conduction, The first heat dissipation group 140a and the second heat dissipation group 140b in the shape of a cuboid located on both sides of the bottom plate 120, one end of the heat pipe group 130 passes through the first heat dissipation group 140a, and the other end of the heat pipe group 130 passes through the second heat dissipation group 140b. The heat plate 110 and the bottom plate 120 are screwed together by screws 150; the heat pipe group 130 is provided with six heat pipes 131 distributed symmetrically in a U shape; The cooling fins 160 have the same structure.

As shown in FIG. 3 and FIG. 4 , they are respectively a cross-sectional schematic diagram and a structural schematic diagram of the heat dissipation fin of the present invention.

The heat dissipation fin 160 includes an aluminum sheet layer 160a and a heat conversion layer 160b coated on the surface of the aluminum sheet layer 160a for converting heat into infrared rays; glue.

The cooling fin 160 has a rectangular shape as a whole, and the center of the cooling fin 160 is symmetrically provided with six through holes 161 for the heat pipe 131 to pass through. The edge of the through hole 161 is provided with a first positioning block 162. There are serrations 163 on the edge, and the setting of the serrations 163 can drain the surrounding air, promote air convection around the heat dissipation fins 160, and improve the heat dissipation effect. There is a card slot 164 in the middle of the two short sides of the heat dissipation fins 160, and the edge of the card slot 164 Vertically provided with a second positioning stopper 165, the through hole 161, the first positioning stopper 162, the draw-in groove 164, the second positioning stopper 165, and the sawtooth 163 are uniformly punched and formed, and the processing technology is simple; the first positioning stopper The height of 162 and the height of the second positioning block 165 are both equal to the distance between two adjacent cooling fins 160 . The first positioning baffle 162 and the second locating baffle 165 play the role of supporting the upper heat dissipation fin 160, ensuring that the distance between two adjacent heat dissipation fins 160 will not be loose, thereby increasing the overall heat dissipation area and improving heat dissipation. Effect.

As shown in FIG. 5 , it is a schematic cross-sectional view of the heat pipe of the present invention.

The outer diameter of the heat conducting pipe 131 is equal to the distance between the heat collecting plate 110 and the bottom plate 120, the heat conducting pipe 131 directly contacts the heat collecting plate 110, the heat transfer speed is fast, and the cooling effect is improved.

The heat pipe 131 includes a pipe body 131a, several sections of fibrous capillary tissue 131b annularly arrayed on the inner wall of the pipe body 131a, and a heat transfer medium 131c filled inside the pipe body 131a. Playing a drainage role, speeding up the flow of the heat transfer medium 131c inside the tube body 131a, so that the heat transfer tube 131 can quickly bring the heat at the heat collecting plate 110 to the first heat dissipation group 140a and the second heat dissipation group 140b, further improving heat dissipation Effect.

The CPU is installed on the heat collecting plate 110, the heat generated by the CPU working process is quickly transferred to the heat collecting plate 110, the temperature decreases after heat exchange with the heat pipe group 130, the temperature of the heat pipe group 130 rises, and the heat pipe group 130 transfers the heat to the The first heat dissipation group 140a and the second heat dissipation group 140b transmit to the surroundings through the first heat dissipation group 140a and the second heat dissipation group 140b, so as to reduce the temperature of the CPU and play a heat dissipation function. On the one hand, since the first heat dissipation group 140a and the second heat dissipation group 140b are provided to dissipate heat at the same time, the heat dissipation efficiency is high; on the other hand, the heat pipe group 130 is provided with six heat pipes 131 symmetrically distributed in a U-shape, which can quickly dissipate its own heat. It is derived that the heat dissipation efficiency is further improved. In the third aspect, the first heat dissipation group 140a and the second heat dissipation group 140b are stacked with several heat dissipation fins 160 with identical shapes and structures, which increases the heat dissipation area and further improves the heat dissipation efficiency. In a fourth aspect, the heat dissipation fin 160 includes an aluminum sheet layer 160a and a heat conversion layer 160b coated on the surface of the aluminum sheet layer 160a for converting heat into infrared rays, which is transferred to the aluminum sheet layer 160a of the heat dissipation fin 160 The heat can be directly transferred to the surroundings, or can be converted into infrared rays through the heat conversion layer 160b and radiated to the surrounding environment, which further improves the heat dissipation efficiency. There is thermal conductive glue, which can quickly conduct the heat generated by the CPU work, further improving the heat dissipation efficiency.

The working principle of the utility model is:

The CPU is installed on the heat collecting plate 110, and the heat generated by the CPU during operation is quickly transferred to the heat collecting plate 110 through the heat-conducting adhesive, and after heat exchange with the heat pipe group 130, the temperature decreases, the temperature of the heat pipe group 130 rises, and the heat inside the heat pipe group 130 The fibrous capillary structure 131b plays a drainage role in the flow of the heat-conducting medium 131c inside the tube body 131a, so that the heat-conducting tube 131 can quickly bring the heat at the heat-collecting plate 110 to the first heat dissipation group 140a and the second heat dissipation group 140b. The heat dissipation fins 160 of the first heat dissipation group 140a and the second heat dissipation group 140b are transmitted to the surroundings to reduce the temperature of the CPU and play a heat dissipation function.

The above-mentioned embodiments only express several implementations of the utility model, and the description thereof is relatively specific and detailed, but it should not be construed as limiting the patent scope of the utility model. It should be noted that those skilled in the art can make several modifications and improvements without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the scope of protection of the utility model patent should be based on the appended claims.

Claims (4)

1.CPU high-efficiency radiators, it is characterised in that：Collecting plate including being used to install CPU, the bottom set parallel to collecting plate Plate is arranged between collecting plate and bottom plate to carry out the heat pipe heat of heat transfer, positioned at bottom plate both sides in the of rectangular-shape One heat dissipation group and the second heat dissipation group, through the first heat dissipation group, the other end of heat pipe heat passes through the second heat dissipation group for one end of heat pipe heat, Collecting plate and bottom plate are spirally connected by screw；The heat pipe heat is equipped with u-shaped symmetrical six roots of sensation heat conducting pipe, and described first dissipates Heat group and the second heat dissipation group are folded equipped with the identical radiating fin of several shape and structures；The radiating fin includes aluminum Lamella and coated on aluminum sheet surfaces be used for by converting heat be infrared ray heat conversion layer；The collecting plate deviates from bottom plate A side surface be coated with heat-conducting glue.

2. CPU high-efficiency radiators according to claim 1, it is characterised in that：The radiating fin is integrally rectangular, dissipates Hot fin central symmetry is opened up there are six the through hole passed through for heat conducting pipe, and through hole edge hangs down equipped with the first locating stop piece, heat dissipation Two long side edge of fin is equipped with sawtooth, and two short side middle of radiating fin offers card slot, and pocket edges hang down equipped with the second positioning Catch, the integral punch forming of the through hole, the first locating stop piece, card slot, the second locating stop piece, sawtooth；First locating stop piece Height, the height of the second locating stop piece be equal to the distance between adjacent two radiating fin.

3. CPU high-efficiency radiators according to claim 1, it is characterised in that：The outer diameter of the heat conducting pipe is equal to thermal-arrest The distance between plate and bottom plate.

4. CPU high-efficiency radiators according to claim 1, it is characterised in that：The heat conducting pipe includes tube body, annular battle array It is listed in several section fibre capillary structures of inboard wall of tube body, is filled in the heat-conducting medium of tubular body.