CN207380662U - CPU high-efficiency radiators - Google Patents
CPU high-efficiency radiators Download PDFInfo
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- CN207380662U CN207380662U CN201721563664.4U CN201721563664U CN207380662U CN 207380662 U CN207380662 U CN 207380662U CN 201721563664 U CN201721563664 U CN 201721563664U CN 207380662 U CN207380662 U CN 207380662U
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- heat
- heat dissipation
- pipe
- bottom plate
- collecting plate
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model is related to hardware fields, more particularly to CPU high-efficiency radiators, collecting plate including being used to install CPU, the bottom plate set parallel to collecting plate, it is arranged between collecting plate and bottom plate to carry out the heat pipe heat of heat transfer, the first heat dissipation group and the second heat dissipation group in rectangular-shape positioned at bottom plate both sides, one end of heat pipe heat passes through the first heat dissipation group, the other end of heat pipe heat passes through the second heat dissipation group, and collecting plate and bottom plate are spirally connected by screw；The heat pipe heat is equipped with u-shaped symmetrical six roots of sensation heat conducting pipe, and the first heat dissipation group and the second heat dissipation group are folded equipped with the identical radiating fin of several shape and structures；The radiating fin includes aluminum lamella and is used for the heat conversion layer by converting heat for infrared ray coated on aluminum sheet surfaces；The collecting plate is coated with heat-conducting glue away from a side surface of bottom plate.The utility model is simple in structure, heat dissipation area is big, coolant flow speed is fast, good heat dissipation effect.
Description
Technical field
The utility model is related to hardware fields, and in particular to CPU high-efficiency radiators.
Background technology
CPU can generate substantial amounts of heat when work, if these heats not distributed in time, gently if cause it is dead
Machine, heavy then may burn CPU, cpu heat is exactly for radiating for CPU.Radiator plays certainly the stable operation of CPU
It qualitatively acts on, it is extremely important to choose a good radiator when assembling computer.
Cpu heat can be divided into three kinds of air-cooled, heat pipe and water cooling according to its radiating mode, wherein, heat-pipe radiator is one
Heat transfer element of the kind with very high thermal conductivity, it transfers heat by the evaporation of the liquid in Totally enclosed vacuum pipe with condensation
Amount.Most of such fan is " air-cooled+heat pipe " property, has both air-cooled and heat pipe advantage, has high thermal diffusivity.
The heat-pipe radiator of the prior art, on the one hand, radiator fan must be installed, structure is more complicated, second aspect, heat pipe
Interior cooling medium stream moves that speed is fast, and heat-conducting effect is poor, poor so as to cause heat dissipation effect.
Utility model content
The purpose of the utility model is to overcome the deficiencies in the prior art, provide it is a kind of it is simple in structure, heat dissipation area is big, cooling
Liquid flowing velocity is fast, the CPU high-efficiency radiators of good heat dissipation effect.
Technical solution is used by the utility model：CPU high-efficiency radiators, the collecting plate including being used to install CPU,
Parallel to the bottom plate that collecting plate is set, it is arranged in for carrying out the heat pipe heat of heat transfer between collecting plate and bottom plate, positioned at bottom plate
The the first heat dissipation group and the second heat dissipation group in rectangular-shape of both sides, one end of heat pipe heat pass through the first heat dissipation group, heat pipe heat
The other end passes through the second heat dissipation group, and collecting plate and bottom plate are spirally connected by screw；The heat pipe heat is equipped with u-shaped symmetrical
Six roots of sensation heat conducting pipe, the first heat dissipation group and the second heat dissipation group are folded to be equipped with the identical heat radiating fin of several shape and structures
Piece；The radiating fin includes aluminum lamella and is used to turn converting heat for the heat of infrared ray coated on aluminum sheet surfaces
Change layer；The collecting plate is coated with heat-conducting glue away from a side surface of bottom plate.
To being further improved as the radiating fin is integrally rectangular, radiating fin central symmetry for above-mentioned technical proposal
It opens up there are six the through hole passed through for heat conducting pipe, through hole edge hangs down equipped with the first locating stop piece, two long side edge of radiating fin
Equipped with sawtooth, two short side middle of radiating fin offers card slot, and pocket edges hang down equipped with the second locating stop piece, the through hole,
The integral punch forming of first locating stop piece, card slot, the second locating stop piece, sawtooth；The height of first locating stop piece, the second positioning
The height of catch is equal to the distance between adjacent two radiating fin.
The outer diameter being further improved as, the heat conducting pipe of above-mentioned technical proposal is equal between collecting plate and bottom plate away from
From.
To being further improved as the heat conducting pipe includes tube body, annular array in inboard wall of tube body for above-mentioned technical proposal
Several section fibre capillary structures, the heat-conducting medium for being filled in tubular body.
The beneficial effects of the utility model are：
1st, CPU is installed on collecting plate, the heat that the CPU courses of work generate quickly is transferred to collecting plate, with heat pipe heat
Temperature reduces after generation heat exchange, and heat is transferred to the first heat dissipation group and the second heat dissipation by heat pipe heat temperature rise, heat pipe heat again
Group is transferred to surrounding through the first heat dissipation group and the second heat dissipation group, to reduce cpu temperature, plays heat sinking function.On the one hand, due to
Heat dissipation is carried out at the same time equipped with the first heat dissipation group and the second heat dissipation group, radiating efficiency is high, second aspect, and heat pipe heat is equipped with u-shaped
Symmetrical six roots of sensation heat conducting pipe, can quickly export self heat, further improve radiating efficiency, the third aspect, and first
Heat dissipation group and the second heat dissipation group, which are folded, is equipped with the identical radiating fin of several shape and structures, adds heat dissipation area, into
One step improves radiating efficiency, fourth aspect, and radiating fin includes aluminum lamella and is used for coated on aluminum sheet surfaces by heat
Amount is converted into the heat conversion layer of infrared ray, is transferred to the heat of the aluminum lamella of radiating fin, can be transferred directly to surrounding,
Infrared ray can be converted heat to through heat conversion layer and be radiated in ambient enviroment, further improve radiating efficiency, the 5th
Aspect, away from a side surface of bottom plate coated with heat-conducting glue, heat that can be quickly by CPU work generations transfer out collecting plate,
Further improve radiating efficiency.
2nd, radiating fin is integrally rectangular, and radiating fin central symmetry is opened up there are six the through hole passed through for heat conducting pipe,
Through hole edge hangs down equipped with the first locating stop piece, and two long side edge of radiating fin is equipped with sawtooth, and the setting of sawtooth plays surrounding air
Drainage promotes radiating fin surrounding air convection current, improves heat dissipation effect, two short side middle of radiating fin offers card
Slot, pocket edges hang down equipped with the second locating stop piece, and the through hole, the first locating stop piece, card slot, the second locating stop piece, sawtooth are equal
Integrated punching is molded, and processing technology is simple；The setting of card slot, convenient for installation of the radiator on CPU.The height of first locating stop piece
Degree, the height of the second locating stop piece are equal to the distance between adjacent two radiating fin.First locating stop piece and the second positioning gear
Piece plays the role of a support radiating fin above, it is ensured that and distance will not centainly loosen between two neighboring radiating fin, from
And increase integral heat sink area, improve heat dissipation effect.
3rd, the outer diameter of heat conducting pipe is equal to the distance between collecting plate and bottom plate, and heat conducting pipe is directly contacted with collecting plate, and heat passes
It is fast to pass speed, improves heat dissipation effect.
4th, heat conducting pipe include tube body, annular array in inboard wall of tube body several section fibre capillary structures, be filled in tube body
The heat-conducting medium in portion, fiber capillary structure play drainage to flowing of the heat-conducting medium in tubular body, accelerate in tube body
The flowing of portion's heat-conducting medium so that heat conducting pipe quickly can take the heat at collecting plate to the first heat dissipation group and the second heat dissipation group
Place, further improves heat dissipation effect.
Description of the drawings
Fig. 1 is the stereogram of the utility model；
Fig. 2 is the stereogram at another visual angle of the utility model；
Fig. 3 is the cross-sectional view of the radiating fin of the utility model；
Fig. 4 is the structure diagram of the radiating fin of the utility model；
Fig. 5 is the cross-sectional view of the heat conducting pipe of the utility model.
Specific embodiment
The utility model is further described below in conjunction with attached drawing.
As depicted in figs. 1 and 2, it is respectively the stereogram of the utility model different visual angles.
CPU high-efficiency radiators 100, the collecting plate 110 including being used to install CPU, the bottom set parallel to collecting plate 110
Plate 120 is arranged in for carrying out the heat pipe heat 130 of heat transfer between collecting plate 110 and bottom plate 120, positioned at 120 both sides of bottom plate
In the first heat dissipation group 140a and the second heat dissipation group 140b of rectangular-shape, one end of heat pipe heat 130 passes through the first heat dissipation group 140a,
The other end of heat pipe heat 130 passes through the second heat dissipation group 140b, and collecting plate 110 and bottom plate 120 are spirally connected by screw 150；The heat
Pipe group 130 is equipped with u-shaped symmetrical six roots of sensation heat conducting pipe 131, the first heat dissipation group 140a and the second heat dissipation group 140b
It is folded to be equipped with the identical radiating fin 160 of several shape and structures.
As shown in Figure 3 and Figure 4, be respectively the utility model radiating fin cross-sectional view and structure diagram.
It is red that radiating fin 160, which includes aluminum lamella 160a and is used for coated on aluminum lamella 160a surfaces by converting heat,
The heat conversion layer 160b of outside line；The collecting plate 110 is coated with heat-conducting glue away from a side surface of bottom plate 120.
Radiating fin 160 is whole rectangular, and 160 central symmetry of radiating fin opens up that there are six pass through for heat conducting pipe 131
Through hole 161,161 edge of through hole hangs down equipped with the first locating stop piece 162, and 160 liang of long side edges of radiating fin are equipped with sawtooth 163,
The setting of sawtooth 163 plays drainage to surrounding air, promotes 160 surrounding air convection current of radiating fin, improves heat dissipation effect, dissipates
Hot 160 liang of short side middles of fin offer card slot 164, and 164 edge of card slot hangs down equipped with the second locating stop piece 165, the through hole
161st, the integral punch forming of the first locating stop piece 162, card slot 164, the second locating stop piece 165, sawtooth 163, processing technology letter
It is single；The height of first locating stop piece 162, the height of the second locating stop piece 165 be equal between adjacent two radiating fin 160 away from
From.First locating stop piece 162 and the second locating stop piece 165 play the role of a support radiating fin 160 above, it is ensured that adjacent
Distance will not centainly loosen between two radiating fins 160, so as to increase integral heat sink area, improve heat dissipation effect.
As shown in figure 5, the cross-sectional view of the heat conducting pipe for the utility model.
The outer diameter of heat conducting pipe 131 is equal to the distance between collecting plate 110 and bottom plate 120, and heat conducting pipe 131 is directly and collecting plate
110 contacts, heat transfer speed is fast, improves heat dissipation effect.
Heat conducting pipe 131 include tube body 131a, annular array in tube body 131a inner walls several section fibre capillary structure 131b,
The heat-conducting medium 131c being filled in inside tube body 131a, fiber capillary structure 131b is to heat-conducting medium 131c inside tube body 131a
Flowing play drainage, accelerate the flowing of heat-conducting medium 131c inside tube body 131a so that heat conducting pipe 131 can quickly by
Heat at collecting plate 110 is taken at the first heat dissipation group 140a and the second heat dissipation group 140b, further improves heat dissipation effect.
CPU is installed on collecting plate 110, the heat that the CPU courses of work generate quickly is transferred to collecting plate 110, with heat
Temperature reduces after heat exchange occurs for pipe group 130, and heat is transferred to the first heat dissipation by 130 temperature of heat pipe heat rise, heat pipe heat 130 again
Group 140a and the second heat dissipation group 140b is transferred to surrounding, to reduce CPU temperature through the first heat dissipation group 140a and the second heat dissipation group 140b
Degree, plays heat sinking function.On the one hand, heat dissipation is carried out at the same time due to being equipped with the first heat dissipation group 140a and the second heat dissipation group 140b, dissipated
The thermal efficiency is high, second aspect, and heat pipe heat 130 is equipped with u-shaped symmetrical six roots of sensation heat conducting pipe 131, can be quickly by itself heat
Amount export, further improves radiating efficiency, and the third aspect is equipped with if the first heat dissipation group 140a and the second heat dissipation group 140b are folded
The dry identical radiating fin 160 of shape and structure, adds heat dissipation area, further improves radiating efficiency, four directions
Face, it is infrared ray that radiating fin 160, which includes aluminum lamella 160a and is used for coated on aluminum lamella 160a surfaces by converting heat,
Heat conversion layer 160b, be transferred to the heat of the aluminum lamella 160a of radiating fin 160, can be transferred directly to around, also may be used
Infrared ray is converted heat to through heat conversion layer 160b and is radiated in ambient enviroment, further improves radiating efficiency, the
Five aspects, collecting plate 110, coated with heat-conducting glue, can quickly pass the heat that CPU work generates away from a side surface of bottom plate 120
Export comes, and further improves radiating efficiency.
The operation principle of the utility model is：
CPU is installed on collecting plate 110, the heat that the CPU courses of work generate quickly is transferred to collecting plate through heat-conducting glue
110, temperature reduces after heat exchange occurs with heat pipe heat 130, the rise of 130 temperature of heat pipe heat, the fiber capillary inside heat pipe heat 130
Tissue 131b drainage is played to flowings of the heat-conducting medium 131c inside tube body 131a so that heat conducting pipe 131 can quickly by
Heat at collecting plate 110 takes the first heat dissipation group 140a and the second heat dissipation group 140b to, is dissipated through the first heat dissipation group 140a and second
The radiating fin 160 of heat group 140b, to reduce cpu temperature, plays heat sinking function around being transferred to.
Embodiment described above only expresses the several embodiments of the utility model, and description is more specific and detailed,
But it should not be interpreted as limiting the scope of the present invention.It should be pointed out that for the common of this field
For technical staff, without departing from the concept of the premise utility, various modifications and improvements can be made, these all belong to
In the scope of protection of the utility model.Therefore, the protection domain of the utility model patent should be with appended claims.
Claims (4)
1.CPU high-efficiency radiators, it is characterised in that：Collecting plate including being used to install CPU, the bottom set parallel to collecting plate
Plate is arranged between collecting plate and bottom plate to carry out the heat pipe heat of heat transfer, positioned at bottom plate both sides in the of rectangular-shape
One heat dissipation group and the second heat dissipation group, through the first heat dissipation group, the other end of heat pipe heat passes through the second heat dissipation group for one end of heat pipe heat,
Collecting plate and bottom plate are spirally connected by screw；The heat pipe heat is equipped with u-shaped symmetrical six roots of sensation heat conducting pipe, and described first dissipates
Heat group and the second heat dissipation group are folded equipped with the identical radiating fin of several shape and structures；The radiating fin includes aluminum
Lamella and coated on aluminum sheet surfaces be used for by converting heat be infrared ray heat conversion layer；The collecting plate deviates from bottom plate
A side surface be coated with heat-conducting glue.
2. CPU high-efficiency radiators according to claim 1, it is characterised in that：The radiating fin is integrally rectangular, dissipates
Hot fin central symmetry is opened up there are six the through hole passed through for heat conducting pipe, and through hole edge hangs down equipped with the first locating stop piece, heat dissipation
Two long side edge of fin is equipped with sawtooth, and two short side middle of radiating fin offers card slot, and pocket edges hang down equipped with the second positioning
Catch, the integral punch forming of the through hole, the first locating stop piece, card slot, the second locating stop piece, sawtooth；First locating stop piece
Height, the height of the second locating stop piece be equal to the distance between adjacent two radiating fin.
3. CPU high-efficiency radiators according to claim 1, it is characterised in that：The outer diameter of the heat conducting pipe is equal to thermal-arrest
The distance between plate and bottom plate.
4. CPU high-efficiency radiators according to claim 1, it is characterised in that：The heat conducting pipe includes tube body, annular battle array
It is listed in several section fibre capillary structures of inboard wall of tube body, is filled in the heat-conducting medium of tubular body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721563664.4U CN207380662U (en) | 2017-11-21 | 2017-11-21 | CPU high-efficiency radiators |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721563664.4U CN207380662U (en) | 2017-11-21 | 2017-11-21 | CPU high-efficiency radiators |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207380662U true CN207380662U (en) | 2018-05-18 |
Family
ID=62332984
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721563664.4U Active CN207380662U (en) | 2017-11-21 | 2017-11-21 | CPU high-efficiency radiators |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207380662U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111864335A (en) * | 2020-06-11 | 2020-10-30 | 辽宁科技大学 | Five-tube fin antenna radiator |
| CN112136370A (en) * | 2019-04-25 | 2020-12-25 | 扎尔曼技术株式会社 | Electronic component cooling device with corrugated plate laminated cooling tower |
-
2017
- 2017-11-21 CN CN201721563664.4U patent/CN207380662U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112136370A (en) * | 2019-04-25 | 2020-12-25 | 扎尔曼技术株式会社 | Electronic component cooling device with corrugated plate laminated cooling tower |
| CN112136370B (en) * | 2019-04-25 | 2023-04-28 | 扎尔曼技术株式会社 | Electronic component cooling device provided with corrugated plate laminated cooling tower |
| CN111864335A (en) * | 2020-06-11 | 2020-10-30 | 辽宁科技大学 | Five-tube fin antenna radiator |
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