CN221827282U - A metal heat sink structure for notebook computers - Google Patents

Abstract

The utility model discloses a metal heat dissipation part structure of a notebook computer, which comprises a fan, wherein a copper pipe is fixedly arranged on one side of the fan, one end of the copper pipe is connected with a heat conducting plate, a water cooling ring is fixedly arranged outside the copper pipe, lantern rings are fixedly arranged at two ends of the water cooling ring, the lantern rings are sleeved outside the copper pipe, and the fan is symmetrically connected with the water cooling ring. According to the utility model, the double fans and the multi-copper-pipe radiating piece are arranged, the radiating fans on two sides are symmetrically arranged in the computer, the fans are connected with the heat conducting bottom plate so as to be convenient for connection with the CPU, the heat conducting bottom plate is connected with the CPU through the copper pipes, and meanwhile, copper pipes are arranged at the upper side ends of the heat conducting bottom plate, so that a large amount of generated heat can be outwards scattered; meanwhile, a water cooling ring is arranged between the copper pipes, copper pipe wrapping rings on two sides of the water cooling ring wrap the outer portion of the copper ring, fan blades inside the water cooling ring continuously rotate to drive cooling liquid inside the water cooling ring to move, the copper pipes are cooled, and the heat dissipation effect of the heat dissipation assembly are improved.

Description

A metal heat sink structure for notebook computers

Technical Field

The utility model belongs to the technical field of notebook production, and in particular relates to a metal heat sink structure for a notebook computer.

Background Art

Laptops are tools that people often use in their daily office work. Laptops generally generate a certain amount of heat when in use, which is dissipated through the internal thermal components. The thermal components are essential components of laptops and consist of a heat sink, a heat transfer pipe, a heat sink fin group, a fan, and a copper mounting bracket. The heat sink and the heat sink fin group are the core components of the heat sink assembly. The heat sink is installed under the CPU, and the heat of the CPU is conducted out through the heat transfer pipe, and then dissipated through the heat sink fin group. A fan is also provided in the heat sink assembly, which exchanges heat between the external cold air and the heat sink fin group, thereby cooling the CPU.

The heat dissipation effect of the thermal components of existing laptops is average. When the laptop is running at high load, it is easy for the heat to fail to dissipate, causing the computer to crash. Generally, the thermal components use a single fan with a few copper tubes to dissipate heat, resulting in heat accumulation. At the same time, existing laptops use liquid gold as a medium between the heat sink and the CPU for heat dissipation, but liquid gold is liquid and is prone to leakage during use, causing CPU damage.

Utility Model Content

In order to solve the above problems, the utility model aims to provide a metal heat sink structure for a notebook computer.

To achieve the above-mentioned purpose, the utility model proposes a metal heat sink structure for a laptop computer, comprising a fan, a copper tube fixedly installed on one side of the fan, one end of the copper tube is connected to a heat conducting plate, a water cooling ring fixedly installed on the outside of the copper tube, sleeves fixedly installed on both ends of the water cooling ring, the sleeves are sleeved on the outside of the copper tube, the fan is symmetrically connected with the water cooling ring, an extrusion plate is movably installed inside the heat conducting plate, a mounting plate is fixedly installed at the lower end of the heat conducting plate, and a chip is fixedly installed inside the mounting plate.

Preferably, a fin is fixedly mounted on one side of the fan, and the fin is in a groove shape.

Preferably, fan blades are movably installed inside the water cooling ring, and a water tank is opened inside the water cooling ring.

Preferably, heat conducting plates are fixedly mounted on both ends of the inner side of the water cooling ring, and arc-shaped stoppers are fixedly mounted inside the water cooling ring.

Preferably, mounting holes are fixedly provided at the four corners of the heat conducting plate, and an outer baffle is fixedly installed at the lower end of the heat conducting sheet.

Preferably, a connecting pipe is fixedly installed inside the heat conducting plate, a connecting ring is movably installed on the upper end of the connecting pipe, the connecting ring is connected to the copper pipe, and a spring is fixedly installed on the lower end of the connecting pipe.

Preferably, an inner baffle is fixedly mounted on the inner side of the upper end of the mounting plate, a sealing block is fixedly mounted on the lower end of the heat conducting plate, and a connecting layer is fixedly mounted on the inner side of the sealing block.

The metal heat sink structure of a notebook computer proposed by the utility model can bring the following beneficial effects:

1. By setting up a dual-fan multi-copper tube heat sink, a heat sink is added on the basis of the original heat sink. The heat sinks on both sides are symmetrically installed inside the computer. A heat-conducting base plate is connected between the fans to facilitate connection with the CPU. The heat-conducting base plates are connected by copper tubes. At the same time, copper tubes are installed on the upper sides to diffuse the generated heat outward in large quantities, thereby improving the heat dissipation efficiency. At the same time, a water-cooling ring is installed between the copper tubes. The copper tubes on both sides of the water-cooling ring are wrapped around the outside of the copper ring. The internal fan blades rotate continuously, driving the internal coolant to move, cooling the copper tubes, and increasing the heat dissipation function and effect of the heat dissipation component.

2. By setting up a device to prevent liquid gold leakage, during installation, first embed the installation base plate into the outer side of the CPU, then apply liquid gold to the upper end surface of the CPU, and then install the upper heat conduction plate to the upper end of the CPU, and install the whole on the mainboard through the screws on both sides. A conduction plate is installed inside the upper heat conduction plate, and a spring is installed on the upper end of the conduction plate for elastic extrusion to prevent damage to the CPU due to excessive extrusion during installation. Baffles are installed on both sides of the installation base plate, and a sealing plate is installed inside the heat conduction plate to connect them. An adhesive layer is installed on the inner side of the sealing plate to increase the connection effect and prevent leakage under high temperature conditions.

BRIEF DESCRIPTION OF THE DRAWINGS

The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation on the present invention.

In the attached picture:

FIG1 is a front view of the three-dimensional structure of the present invention.

FIG2 is a schematic diagram of a cross-sectional structure of a water-cooling ring of the present invention.

FIG3 is a schematic diagram of the three-dimensional structure of the heat conducting plate of the present invention.

FIG4 is a schematic diagram of the cross-sectional structure of the heat conducting plate of the present invention.

In the figure: 1. fan; 2. fins; 3. copper tube; 4. heat conducting plate; 5. water cooling ring; 6. collar; 7. fan blades; 8. water tank; 9. heat conducting plate; 10. block; 11. mounting hole; 12. outer baffle; 13. connecting pipe; 14. connecting ring; 15. spring; 16. sealing block; 17. extrusion plate; 18. chip; 19. connecting layer; 20. inner baffle; 21. mounting plate.

DETAILED DESCRIPTION

In order to more clearly illustrate the overall concept of the present invention, a detailed description is given below in the form of examples in conjunction with the accompanying drawings.

In the description of the present invention, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

In the present utility model, unless otherwise clearly specified and limited, the first feature "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. In the description of this specification, the description of reference terms "one scheme", "some schemes", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the scheme or example are included in at least one scheme or example of the present utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same scheme or example. Moreover, the specific features, structures, materials or characteristics described may be combined in an appropriate manner in any one or more schemes or examples.

As shown in Figures 1 to 4, an embodiment of the utility model proposes a metal heat sink structure for a laptop computer, including a fan 1, a copper tube 3 is fixedly installed on one side of the fan 1 to conduct and dissipate heat, a heat conducting plate 4 is connected to one end of the copper tube 3, a water cooling ring 5 is fixedly installed on the outside of the copper tube 3 to absorb and process the generated heat, collars 6 are fixedly installed on both ends of the water cooling ring 5, and the collar 6 is sleeved on the outside of the copper tube 3. The fan 1 is symmetrically connected with the water cooling ring 5 and can perform good heat dissipation. An extrusion plate 17 is movably installed inside the heat conducting plate 4 for fastening and connection. A mounting plate 21 is fixedly installed at the lower end of the heat conducting plate 4, and a chip 18 is fixedly installed inside the mounting plate 21 to increase the stability of the connection.

In this embodiment, a fin 2 is fixedly installed on one side of the fan 1, and the shape of the fin 2 is a groove to increase the heat dissipation effect. A fan blade 7 is movably installed inside the water-cooling ring 5. A water trough 8 is provided inside the water-cooling ring 5 to facilitate the flow of coolant. Heat conducting plates 9 are fixedly installed at both ends of the inner side of the water-cooling ring 5 to facilitate heat conduction. An arc-shaped stopper 10 is fixedly installed inside the water-cooling ring 5 to form a diversion.

In this embodiment, mounting holes 11 are fixedly provided at the four corners of the heat conducting plate 4 for easy fixed installation, an outer baffle 12 is fixedly installed at the lower end of the heat conducting plate 9 for tight connection, a connecting tube 13 is fixedly installed inside the heat conducting plate 4, a connecting ring 14 is movably installed at the upper end of the connecting tube 13 for increasing the flexibility of the connection, the connecting ring 14 is connected to the copper tube 3, a spring 15 is fixedly installed at the lower end of the connecting tube 13 for elastic connection to prevent damage to the components due to excessive extrusion, an inner baffle 20 is fixedly installed on the inner side of the upper end of the mounting plate 21, a sealing block 16 is fixedly installed at the lower end of the heat conducting plate 4, a connecting layer 19 is fixedly installed on the inner side of the sealing block 16 for increasing the tightness of the connection.

Working principle: When the laptop is in use, the chip 18 will generate a lot of heat, which needs to be cooled. A heat conducting plate 4 is installed on the upper end of the chip 18 to conduct the heat. A copper tube 3 is connected to the outside of the heat conducting plate 4. One end of the copper tube 3 is connected to the fan 1. The fan 1 rotates to dissipate the heat of the copper tube 3. A water cooling ring 5 is installed between the copper tubes 3. Rings 6 are installed on both sides of the water cooling ring 5. The heat conducting sheet 9 on the inner side of the water cooling ring 5 conducts the heat of the copper tube 3, and then the internal fan blades 7 drive the internal coolant. Movement is performed to absorb the heat of the copper tube 3; when the heat sink is installed, the mounting plate 21 is first installed to the outside of the chip 18, and then the heat conducting sheet 9 is installed to the upper end of the chip 18, and fixed by screws on both sides. An extrusion plate 17 is installed inside the heat conducting plate 4, and a spring 15 is installed on the upper end of the extrusion plate 17 for elastic support to prevent damage to the chip 18 caused by excessive extrusion. At the same time, the heat conducting sheet 9 and the mounting plate 21 are embedded with each other on both sides for sealing, and the internal connecting layer 19 is adhesively connected to increase the sealing effect of the connection.

Each embodiment in this specification is described in a progressive manner, and the same or similar parts between the embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the system embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiment.

The above description is only an embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent substitution, improvement, etc. made within the spirit and principle of the present invention shall be included in the scope of the claims of the present invention.

Claims (7)

1. A metal heat sink structure for a laptop computer, comprising a fan (1), characterized in that: a copper tube (3) is fixedly mounted on one side of the fan (1), one end of the copper tube (3) is connected to a heat conducting plate (4), a water cooling ring (5) is fixedly mounted on the outside of the copper tube (3), sleeves (6) are fixedly mounted on both ends of the water cooling ring (5), the sleeves (6) are sleeved on the outside of the copper tube (3), the fan (1) is symmetrically connected to the water cooling ring (5), an extrusion plate (17) is movably mounted inside the heat conducting plate (4), a mounting plate (21) is fixedly mounted on the lower end of the heat conducting plate (4), and a chip (18) is fixedly mounted inside the mounting plate (21). 2. A notebook computer metal heat sink structure according to claim 1, characterized in that a fin (2) is fixedly mounted on one side of the fan (1), and the fin (2) is in the shape of a groove. 3. A notebook computer metal heat sink structure according to claim 1, characterized in that a fan blade (7) is movably installed inside the water cooling ring (5), and a water tank (8) is opened inside the water cooling ring (5). 4. A notebook computer metal heat sink structure according to claim 2, characterized in that heat conducting plates (9) are fixedly installed at both ends of the inner side of the water cooling ring (5), and an arc-shaped stopper (10) is fixedly installed inside the water cooling ring (5). 5. A notebook computer metal heat sink structure according to claim 4, characterized in that the four corners of the heat conducting plate (4) are fixedly provided with mounting holes (11), and the lower end of the heat conducting sheet (9) is fixedly provided with an outer baffle (12). 6. A notebook computer metal heat sink structure according to claim 1, characterized in that a connecting tube (13) is fixedly installed inside the heat conducting plate (4), a connecting ring (14) is movably installed on the upper end of the connecting tube (13), the connecting ring (14) is connected to the copper tube (3), and a spring (15) is fixedly installed on the lower end of the connecting tube (13). 7. A notebook computer metal heat sink structure according to claim 1, characterized in that an inner baffle (20) is fixedly installed on the inner side of the upper end of the mounting plate (21), a sealing block (16) is fixedly installed on the lower end of the heat conducting plate (4), and a connecting layer (19) is fixedly installed on the inner side of the sealing block (16).