TW202129818A - 基板處理裝置及基板收納容器保管方法 - Google Patents

基板處理裝置及基板收納容器保管方法 Download PDF

Info

Publication number
TW202129818A
TW202129818A TW109137614A TW109137614A TW202129818A TW 202129818 A TW202129818 A TW 202129818A TW 109137614 A TW109137614 A TW 109137614A TW 109137614 A TW109137614 A TW 109137614A TW 202129818 A TW202129818 A TW 202129818A
Authority
TW
Taiwan
Prior art keywords
substrate
storage
storage container
processing apparatus
substrate storage
Prior art date
Application number
TW109137614A
Other languages
English (en)
Inventor
寺本聡寛
辻橋辰彦
井手康盛
Original Assignee
日商東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商東京威力科創股份有限公司 filed Critical 日商東京威力科創股份有限公司
Publication of TW202129818A publication Critical patent/TW202129818A/zh

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769Storage means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G1/00Storing articles, individually or in orderly arrangement, in warehouses or magazines
    • B65G1/02Storage devices
    • B65G1/04Storage devices mechanical
    • B65G1/0457Storage devices mechanical with suspended load carriers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715Changing the direction of the conveying path
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773Conveying cassettes, containers or carriers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67733Overhead conveying
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67736Loading to or unloading from a conveyor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766Mechanical parts of transfer devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775Docking arrangements
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02Articles
    • B65G2201/0297Wafer cassette

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)

Abstract

本發明的課題係於使收納基板的基板處理容器暫時待機的保管部,保管比先前多的基板收納容器。 解決手段是一種基板處理裝置,係處理基板的基板處理裝置,具有:基板收納容器載置部,係載置用以收納於前述基板處理裝置中處理之基板的基板收納容器;及保管區域,係以接近前述基板收納容器載置部之方式配置,保管前述基板收納容器;前述保管區域,係上下多段地具有將複數前述基板收納容器載置於水平方向來進行保管的保管部;位於最上部的保管部,係可在與移動於前述基板處理裝置的上方的頂板行走車之間收授前述基板收納容器;位於前述最上部的保管部之下側位置的其他保管部,係以與於位於最上部的保管部所載置且保管之基板收納容器不同的方向,載置且保管基板收納容器。

Description

基板處理裝置及基板收納容器保管方法
本發明係關於基板處理裝置及基板收納容器保管方法。
於專利文獻1,揭示基板的處理系統,使搬入至該基板的處理系統之複數晶匣待機的晶匣待機區以鄰接於基板的處理系統的搬出入區之方式設置的構造。 [先前技術文獻] [專利文獻]
[專利文獻1]日本特開2009-10287號公報
[發明所欲解決之課題]
本發明的技術係於使收納基板的基板處理容器暫時待機的保管部,保管比先前多的基板收納容器。 [用以解決課題之手段]
本發明的一樣態,係處理基板的基板處理裝置,具有:基板收納容器載置部,係載置用以收納於前述基板處理裝置中處理之基板的基板收納容器;及保管區域,係以接近前述基板收納容器載置部之方式配置,保管前述基板收納容器;前述保管區域,係上下多段地具有將複數前述基板收納容器載置於水平方向來進行保管的保管部;位於最上部的保管部,係可在與移動於前述基板處理裝置的上方的頂板行走車之間收授前述基板收納容器;位於前述最上部的保管部之下側位置的其他保管部,係以與於位於最上部的保管部所載置且保管之基板收納容器不同的方向,載置且保管基板收納容器。 [發明的效果]
依據本發明,於使收納基板的基板處理容器暫時待機的保管部,可保管比先前多的基板收納容器。
首先,針對專利文獻1所揭示之先前的基板(以下稱為晶圓)的處理系統的構造進行說明。於專利文獻1所揭示的處理系統,鄰接於處理系統的搬出入區,設置作為收容搬出入於該搬出入區之複數晶匣並使其待機之暫存盒的晶匣保管庫。晶匣保管庫係一般,被用以進行氣氛控制的殼體覆蓋,於該殼體的頂板面,形成晶匣的搬出入口。又,於晶匣保管庫的上方,配設在裝置間搬送晶匣之頂板行走車的軌道,裝置間晶匣搬送裝置以透過前述搬出入口,可從上方對於晶匣待機區搬出入晶匣之方式構成。
如上所述,一般被稱為FEX(Foup Exchanger)的晶匣待機區係用以將作為收容以基板處理裝置處理之複數片,例如25片之晶圓的基板收納容器的晶匣(Foup),暫時貯存複數個的裝置。於該FEX的內部,貯存複數例如10個程度的晶匣。如此,FEX係具有暫時貯存搬入出於處理系統之晶匣的功能,故一般鄰接於處理系統的搬出入區,亦即,例如於專利文獻1中設置於基板的處理系統之搬出入區的前面側。
然而,FEX貯存複數晶匣時,所有晶匣係以其前面側,亦即搬出入晶圓之側通常朝向基板處理裝置的搬出入區側對齊之方式保管。該狀況中,欲藉由FEX保管更多晶匣的話,必須擴大FEX的規模。
因此,本發明的技術之一樣態係於保管晶匣的保管區域,保管比先前還多的基板收納容器。
以下,針對作為本實施形態的基板處理裝置之晶圓處理裝置的構造,一邊參照圖面一邊進行說明。再者,於本說明書中,具有實質上相同之功能構造的要素中,藉由附加相同的符號而省略重複說明。
晶圓處理裝置1係如圖1及圖2所示,具有一體連接作為收納複數片基板即晶圓的FOUP等之基板收納容器(以下稱為晶匣)的搬出入部的搬出入工作站10,與作為具備對晶圓W施加所定處理之複數各種處理裝置(未圖示)的處理部的處理工作站20的構造。
搬出入工作站10係具有晶匣區11,與作為和晶匣區11連接,在與處理工作站20之間進行晶圓的中繼的搬出入部的搬出入區12。晶匣區11係具有也稱為裝載埠的晶匣載置台13,晶匣載置台13係複數例如在圖示的範例中4台晶匣30可於Y方向整列成一列以進行載置。
於搬出入區12內,具有取出載置於晶匣載置台13上的晶匣C內的未處理晶圓,搬送至處理工作站20側,又,將於處理工作站20中處理的晶圓,搬送至晶匣載置台13上的晶匣30內的搬送機械臂14。搬出入區12係高度比處理工作站20低,晶匣載置台13係高度設定為比搬出入區12更低。
於搬出入區12的上側,設置作為保管區域的晶匣保管區域40。晶匣保管區域40係以將晶匣30保管於上下3段的保管部之方式構成,最下段的保管部12a係設置於搬出入區12的上面。又,中段的保管部係設定於架板41上,最上段的保管部係設定於架板42。該等架板41、42係例如被處理工作站20的前面側的壁體20a支持。
於晶匣載置台13的上方,設置例如作為可沿著延伸於Y方向的搬送路徑R0自由移動的頂板行走車的OHT(Overhead Hoist Transport)。OHT係可在與設置於晶圓處理裝置1的外部之其他晶圓處理裝置之間保持並搬送晶匣30,可利用下降,從上方對於後述之架板42的載置板42a收授晶匣30。晶匣30係亦如圖2所示,具有搬出入晶圓的前面部31,與設置於上面之俯視為正方形之板狀的卡止部32,OHT係在將晶匣30的前面部31朝向晶圓處理裝置1的處理工作站20側之狀態下,保持卡止部32,移動於搬送路徑R0。
成為最上段的保管部的架板42係亦如圖3所示,可將4台晶匣30於Y方向整列且載置保管。然後,各晶匣30係被載置於設置在架板42的載置板42a上。於成為基板支持部的各載置板42a,設置直接支持晶匣30的下面的支持構件42b。然後,載置板42a係如圖3所示,可自由滑動於X方向,利用往X方向負方向移動,於晶匣載置台13的上方的位置中可接收前述OHT所保持之晶匣30,又,OHT可接收載置板42a上的晶匣30。
如此,成為最上段的保管部的架板42係將晶匣30與晶匣載置台13同樣,將晶匣30的前面部31朝向處理工作站20側對齊來整列載置。
另一方面,設置於搬出入區12的上面之最下段的保管部12a,與中段的保管部的架板41係如圖2、圖4所示,以與載置於最上段的架板42的晶匣30不同方向,亦即將前面部31全部朝向Y方向負方向,載置且保管晶匣30。
架板41、保管部12a的Y方向的長度係與最上段的架板42相同長度,但是,此種晶匣30係深度方向的長度比寬度的長度短,所以,利用將前面部31朝向Y方向負方向整列並載置,相較於載置、保管於最上部的架板42之狀況,可載置、保管更多的晶匣30。在圖示的範例中,於架板41、保管部12a,可載置並保管5台晶匣30。所以,相較於將載置於架板41、保管部12a的晶匣30,與載置於最上段的架板42的晶匣30同樣地,將其前面部31朝向處理工作站20側之狀況,可保管更多的晶匣30。
在該狀況中,如上所述,從OHT接收的晶匣30係在最上段的架板42中,將前面部31朝向處理工作站20側載置,所以,需要改變晶匣30的方向,轉運至架板41、保管部12a。
在本實施形態中,利用圖5所示的轉運裝置支持機構50、轉運裝置60來實現相關功能。亦即,如圖2所示,轉運裝置支持機構50係例如於晶匣載置台13的兩側,具有支持柱51、52。在支持柱51、52之間,交付轉運裝置支持構件53。該轉運裝置支持構件53係可藉由適當的驅動機構(未圖示),沿著支持柱51、52上下移動於Z方向。
轉運裝置60係其基部61可藉由適當的驅動機構(未圖示),自由移動於轉運裝置支持構件53的長邊方向,亦即Y方向。於基部61,設置有可藉由適當的驅動機構(未圖示)自由移動於X方向的滑動體62。然後,於該滑動體62的下面側,保持部63可藉由適當的驅動機構(未圖示)自由旋轉地設置。實施形態的保持部63係具有從兩側包夾設置於晶匣30的上面的卡止部32,以保持卡止部32的構造。
更詳細說明的話,例如利用從圖5所示的狀態,滑動體62往X方向正方向移動,晶匣30的卡止部32係藉由保持部63保持。然後,例如利用滑動體62往X方向負方向退避,藉由旋轉機構旋轉保持部63,可改變所保持的晶匣30的方向。在實施形態中,可將晶匣30的方向改變成360度任意的方向。
藉由以上的構造,轉運裝置60係可三維移動,且可將所保持之晶匣30以保持的位置為中心,至少於水平方向90度旋轉。
接著說明具有具有此種構造的轉運裝置60之實施形態之晶匣30的轉運程序的一例。
首先,如上所說明般,最上段的保管部即架板42的載置板42a如圖3所示,往X方向負方向滑動,在接收位置待機。接下來,OHT所保持的晶匣30係直接下降載置於載置板42a。載置晶匣30的載置板42a係往X方向正方向滑動,返回架板42的所定位置。以圖6的俯視圖揭示於例如架板42上載置4台晶匣30之狀態。
之後,轉運裝置60如圖5所示,移動至取出晶匣30的位置,使滑動體62往X方向正方向移動,保持晶匣30的卡止部32。在該狀態下使轉運裝置60一旦上升,接下來使滑動體62往X方向負方向移動,如圖7所示,使晶匣30從架板42退避。
之後,利用藉由旋轉機構旋轉保持部63,如圖8所示,可改變所保持之晶匣30的方向。在圖8的範例中,使晶匣30的前面部31順時鐘旋轉90度。
在該狀態下,使轉運裝置60往Z方向移動至設定於比改變晶匣30的方向並載置的架板41或保管部12a的高度稍高的位置的位置,又,使基部61往Y方向移動,如圖9所示,移動至載置於架板41或保管部12a的位置。在圖9的範例中,欲載置於中段的架板41。再者,此種轉運裝置60的Z方向、Y方向的移動同時進行亦可。
之後,使轉運裝置60的滑動體62往架板41側移動,將所保持的晶匣30移動至架板41之所定載置板41a的支持構件41b上。接下來,使轉運裝置60下降,將晶匣30載置於前述所定位置的支持構件41b上時,使滑動體62退避。
藉由此種轉運裝置60的移動,可將晶匣30,改變其方向,並於架板41及保管部12a上整列,以載置、保管。
如已說明般,於架板41、保管部12a上,將方向改變成與最上段的架板42不同來載置晶匣30,可將比先前多的晶匣30保管於晶匣保管區域40。
再者,將如此改變方向所載置的晶匣30,亦即如圖2所示,將晶匣30的前面部31朝向Y方向負方向所載置的晶匣30,朝晶匣載置台13改變方向載置時,利用與前述程序相反的程序來使轉運裝置60移動即可。亦即,對於載置於架板41的晶匣30使滑動體62前進,以保持部63保持晶匣30的卡止部32,之後,一旦使轉運裝置60上升之後退避,之後使保持部63往逆時鐘方向旋轉,將所保持之晶匣30的前面部31朝向處理工作站20側。然後,直接於晶匣載置台13上的所定位置載置晶匣30即可。轉運至最上段的架板42之狀況也與其同樣程序。
轉運裝置60並不限於以上所示的構造,只要是可三維移動,且具有使所保持的晶匣30在水平方向旋轉90度以上的構造者,即可適用。
又,在前述實施形態中,晶匣保管區域40係設置於搬出入區12的上側,不會增加晶圓處理裝置1的專用地板面積。可大量載置、保管暫時待機的晶匣30。
又,於搬出入區12內,如上所述,設置有搬送機械臂14,但是,由於搬出入區12通常是氣密地封鎖的區間,塵埃及粒子不會流通在設定於搬出入區12的上側的晶匣保管區域40與搬出入區12內之間。
又,對於為了將晶匣保管區域40本身維持在清淨氣氛來說,例如以板件等覆蓋轉運裝置支持機構50、轉運裝置60、晶匣保管區域40整體,僅在OHT與最上段的架板42之間收授晶匣30的部分,形成OHT、晶匣30可通過的開口,或進而設置可開閉該開口本身的閘門即可。
再者,進而保管更多的晶匣30時,例如挾持轉運裝置支持機構50、轉運裝置60在處理工作站20的相反側(X方向負方向),設置與晶匣保管區域40相同的其他保管區域亦可。此時,於其他保管區域,也與晶匣保管區域40同樣地,上下多段地設置將晶匣30改變其方向來載置、保管的架板等的話,可收容、保管非常多的晶匣30。此時,如上所述般,由轉運裝置60的滑動體62可移動於X方向,可進接保管於其他保管區域的晶匣及架板等。
以上,本次所揭示的實施形態全部為例示,並不是有所限制者。前述的實施形態係可不脫離附件之申請專利範圍及其主旨,以各種形態省略、置換、變更亦可。
再者,以下的構造也屬於本發明的技術範圍。 (1)一種基板處理裝置,係處理基板的基板處理裝置, 具有:基板收納容器載置部,係載置用以收納於前述基板處理裝置中處理之基板的基板收納容器;及保管區域,係以接近前述基板收納容器載置部之方式配置,保管前述基板收納容器;前述保管區域,係上下多段地具有將複數前述基板收納容器載置於水平方向來進行保管的保管部;位於最上部的保管部,係可在與移動於前述基板處理裝置的上方的頂板行走車之間收授前述基板收納容器;位於前述最上部的保管部之下側位置的其他保管部,係以與於位於最上部的保管部所載置且保管之基板收納容器不同的方向,載置且保管基板收納容器。 (2)(1)所記載之基板處理裝置,其中, 具有:搬出入部,係在前述基板收納容器載置部上的基板收納容器,與前述基板處理裝置的處理部側之間搬出入前述基板;前述保管區域,係設置於前述搬出入部的上側。 (3)(1)或(2)中任一項所記載之基板處理裝置,其中, 位於前述最上部的保管部,係具備:基板支持部,係可移動於在前述基板收納容器載置部的上方與前述頂板行走車之間收授前述基板收納容器的位置,與保管前述基板收納容器的位置之間。 (4)(2)或(3)中任一項所記載之基板處理裝置,其中, 於前述搬出入部內,具有在前述基板收納容器載置部上的基板收納容器,與前述基板處理裝置的處理部側之間搬出入前述基板的搬送機械臂; 前述搬出入部,係與前述保管區域氣密地區隔。 (5)(1)至(4)中任一項所記載之基板處理裝置,其中, 具有:轉運裝置,係可在位於最上部的保管部、位於前述最上部的保管部之下側位置的其他保管部、前述基板收納容器載置部之間,轉運前述基板收納容器; 前述轉運裝置,係具備在保持前述基板收納容器之狀態下,於水平方向改變方向的機構。 (6)(5)所記載之基板處理裝置,其中, 前述轉運裝置,係可三維移動,且具有將所保持之基板收納容器以保持的位置為中心,至少於水平方向90度旋轉的旋轉機構。 (7)(5)或(6)中任一項所記載之基板處理裝置,其中, 於挾持前述基板收納容器載置部而與前述保管區域對向的位置,具有保管基板收納容器的其他保管區域;前述轉運裝置,係可將被保管於該其他保管區域的基板收納容器,轉運至位於前述最上部的保管部與前述基板收納容器載置部。 (8)一種基板收納容器保管方法,係收納基板之基板收納容器的保管方法, 前述基板收納容器,係保管於以接近處理基板的基板處理裝置之基板收納容器載置部的方式配置的保管區域; 於前述保管區域,上下多段地設置將複數前述基板收納容器載置於水平方向來進行保管的保管部; 位於最上部的保管部,係可在與移動於前述基板處理裝置的上方的頂板行走車之間收授前述基板收納容器; 於位於前述最上部的保管部之下側位置的其他保管部,以與於位於最上部的保管部所載置且保管之基板收納容器不同的方向,載置且保管基板收納容器。
1:晶圓處理裝置 10:搬出入工作站 11:晶匣區 12:搬出入區 12a:保管部 13:晶匣載置台 20:處理工作站 20a:壁體 30:晶匣 31:前面部 32:卡止部 40:晶匣保管區域 41,42:架板 41a,42a:載置板 50:轉運裝置支持機構 51,52:支持柱 53:轉運裝置支持構件 60:轉運裝置 61:基部 62:滑動體 63:保持部
[圖1]模式揭示實施形態之晶圓處理裝置的概略構造的側視圖。 [圖2]圖1的晶圓處理裝置之搬出入部周遭的立體圖。 [圖3]圖1的晶圓處理裝置之最上部的保管部的立體圖。 [圖4]圖1之晶圓處理裝置的前視圖。 [圖5]圖1的晶圓處理裝置之轉運裝置的立體圖。 [圖6]揭示圖1的晶圓處理裝置之最上部的架板上所載置之晶匣的保管狀態的俯視圖。 [圖7]揭示取出圖6所示之最上部的架板上所載置之晶匣之一的狀態的俯視圖。 [圖8]揭示改變從圖7所示之最上部的架板取出之晶匣的方向之樣子的俯視圖。 [圖9]將圖8所示之改變方向的晶匣,載置於中段的架板之樣子的俯視圖。
12:搬出入區
12a:保管部
13:晶匣載置台
20:處理工作站
20a:壁體
30:晶匣
31:前面部
32:卡止部
40:晶匣保管區域
41:架板
42:架板
50:轉運裝置支持機構
51:支持柱
52:支持柱
53:轉運裝置支持構件
60:轉運裝置

Claims (8)

  1. 一種基板處理裝置,係處理基板的基板處理裝置,其特徵為具有: 基板收納容器載置部,係載置用以收納於前述基板處理裝置中處理之基板的基板收納容器;及 保管區域,係以接近前述基板收納容器載置部之方式配置,保管前述基板收納容器; 前述保管區域,係上下多段地具有將複數前述基板收納容器載置於水平方向來進行保管的保管部; 位於最上部的保管部,係可在與移動於前述基板處理裝置的上方的頂板行走車之間收授前述基板收納容器; 位於前述最上部的保管部之下側位置的其他保管部,係以與於位於最上部的保管部所載置且保管之基板收納容器不同的方向,載置且保管基板收納容器。
  2. 如請求項1所記載之基板處理裝置,其中,具有: 搬出入部,係在前述基板收納容器載置部上的基板收納容器,與前述基板處理裝置的處理部側之間搬出入前述基板; 前述保管區域,係設置於前述搬出入部的上側。
  3. 如請求項1所記載之基板處理裝置,其中, 位於前述最上部的保管部,係具備: 基板支持部,係可移動於在前述基板收納容器載置部的上方與前述頂板行走車之間收授前述基板收納容器的位置,與保管前述基板收納容器的位置之間。
  4. 如請求項2所記載之基板處理裝置,其中, 於前述搬出入部內,具有在前述基板收納容器載置部上的基板收納容器,與前述基板處理裝置的處理部側之間搬出入前述基板的搬送機械臂; 前述搬出入部,係與前述保管區域氣密地區隔。
  5. 如請求項1至4中任一項所記載之基板處理裝置,其中,具有: 轉運裝置,係可在位於最上部的保管部、位於前述最上部的保管部之下側位置的其他保管部、前述基板收納容器載置部之間,轉運前述基板收納容器; 前述轉運裝置,係具備在保持前述基板收納容器之狀態下,於水平方向改變方向的機構。
  6. 如請求項5所記載之基板處理裝置,其中, 前述轉運裝置,係可三維移動,且具有將所保持之基板收納容器以保持的位置為中心,至少於水平方向90度旋轉的旋轉機構。
  7. 如請求項5所記載之基板處理裝置,其中, 於挾持前述基板收納容器載置部而與前述保管區域對向的位置,具有保管基板收納容器的其他保管區域;前述轉運裝置,係可將被保管於該其他保管區域的基板收納容器,轉運至位於前述最上部的保管部與前述基板收納容器載置部。
  8. 一種基板收納容器保管方法,係收納基板之基板收納容器的保管方法,其特徵為: 前述基板收納容器,係保管於以接近處理基板的基板處理裝置之基板收納容器載置部的方式配置的保管區域; 於前述保管區域,上下多段地設置將複數前述基板收納容器載置於水平方向來進行保管的保管部; 位於最上部的保管部,係可在與移動於前述基板處理裝置的上方的頂板行走車之間收授前述基板收納容器; 於位於前述最上部的保管部之下側位置的其他保管部,以與於位於最上部的保管部所載置且保管之基板收納容器不同的方向,載置且保管基板收納容器。
TW109137614A 2019-11-06 2020-10-29 基板處理裝置及基板收納容器保管方法 TW202129818A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019201347A JP7412137B2 (ja) 2019-11-06 2019-11-06 基板処理装置及び基板収納容器保管方法
JP2019-201347 2019-11-06

Publications (1)

Publication Number Publication Date
TW202129818A true TW202129818A (zh) 2021-08-01

Family

ID=75687899

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109137614A TW202129818A (zh) 2019-11-06 2020-10-29 基板處理裝置及基板收納容器保管方法

Country Status (5)

Country Link
US (1) US11476143B2 (zh)
JP (2) JP7412137B2 (zh)
KR (1) KR20210054992A (zh)
CN (2) CN112786504A (zh)
TW (1) TW202129818A (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11984335B2 (en) * 2021-12-29 2024-05-14 Applied Materials, Inc. FOUP or cassette storage for hybrid substrate bonding system

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4266197B2 (ja) * 2004-10-19 2009-05-20 東京エレクトロン株式会社 縦型熱処理装置
JP4464993B2 (ja) 2007-06-29 2010-05-19 東京エレクトロン株式会社 基板の処理システム
JP5212165B2 (ja) * 2009-02-20 2013-06-19 東京エレクトロン株式会社 基板処理装置
JP6430870B2 (ja) * 2015-03-20 2018-11-28 東京エレクトロン株式会社 クランプ装置及びこれを用いた基板搬入出装置、並びに基板処理装置
CN107851594B (zh) * 2015-08-28 2021-06-22 株式会社国际电气 基板处理装置以及半导体装置的制造方法
JP6862163B2 (ja) * 2016-12-09 2021-04-21 東京エレクトロン株式会社 基板処理装置

Also Published As

Publication number Publication date
JP7412137B2 (ja) 2024-01-12
US20210134636A1 (en) 2021-05-06
JP2024023874A (ja) 2024-02-21
CN213546285U (zh) 2021-06-25
JP2021077691A (ja) 2021-05-20
KR20210054992A (ko) 2021-05-14
US11476143B2 (en) 2022-10-18
CN112786504A (zh) 2021-05-11

Similar Documents

Publication Publication Date Title
TWI508217B (zh) 基板處理裝置
TW408357B (en) Automated wafer buffer for use with wafer processing equipment
US9299597B2 (en) Scalable stockers with automatic handling buffer
EP2092555B1 (en) Workpiece stocker with circular configuration
US11978652B2 (en) Automatic handling buffer for bare stocker
US20030091410A1 (en) Reduced footprint tool for automated processing of microelectronic substrates
US20070134078A1 (en) Horizontal array stocker
JP7213056B2 (ja) 基板処理装置及び基板処理方法
JP2024023874A (ja) 基板処理装置及び基板収納容器保管方法
US6364592B1 (en) Small footprint carrier front end loader
EP2245656B1 (en) Automatic handling buffer for bare stocker
JP6562803B2 (ja) 基板処理システム
KR20220057012A (ko) 타워 리프트 장치
KR20220093801A (ko) 스토커 장치
JP2021057364A (ja) 搬送システム
JPH02270720A (ja) プロセス装置間の搬送設備
EP1460676A2 (en) Reduced footprint tool for automated processing of microelectronic substrates