TW202126393A - Improved grinding and cleaning device - Google Patents

Abstract

An improved grinding and cleaning device is provided, comprising a carrier platform and a grinding assembly. The carrier platform includes a surface for holding a product, and the grinding assembly, including a rotating shaft, is disposed above the product. A wiper is disposed at one end of the rotating shaft, and performs grinding and cleaning process to the product when the rotating shaft rotates. The proposed carrier platform in the present invention is provided both with a positive pressure area and a negative pressure area, wherein the positive pressure area is disposed correspondingly to an exterior contour of the product, and the negative pressure area is disposed correspondingly in the center of the carrier platform for vacuum absorbing the product. By employing the present invention, an air wall is formed closed to the exterior contour of the product, and solvents of the wiper during the cleaning process can be prevented from penetrating and contaminating the product due to the formed air wall. As a result, the cleaning yield of the product is effectively improved.

Description

Improved device for grinding and cleaning

The present invention relates to an abrasive cleaning device, in particular to an improved abrasive cleaning device designed with a bearing platform structure integrated with positive and negative pressure.

Generally speaking, in the prior art in the grinding and cleaning process, when the product is cleaned by vacuum adsorption on the stage, the solvent-containing dust-free cloth will often cause the solvent to ooze under the pressure of the product and the grinding object, and the vacuum on the stage In the case of adsorption, the solvent will be adsorbed to the vacuum cavity in the carrier along the non-clean surface of the product. When the product take-out stage is turned to positive pressure, the solvent is blown from the vacuum cavity to the non-clean surface of the product. It also causes pollution to the product, which greatly affects the reliability, quality and even function of the product.

For example, a prior art discloses a glass substrate support platform and a glass substrate macro inspection device. The glass substrate support platform includes a frame, a plurality of beams arranged side by side on the frame, and a glass substrate connected to the beam. Multiple suction cups. Another prior art discloses a non-contact transportation and positioning platform device and a control method. The device includes a transportation platform, a fixed platform located below the transportation platform, and a base located below the fixed platform. Wherein, the fixed platform is connected with the base through the fixed platform support, and a number of grooves are provided on the transportation platform. It is worth noting that the above-mentioned prior art only teaches the commonly used vacuum suction cups, which only replace the vacuum holes with common suction nozzles, thereby achieving the purpose of reducing the product contact area. Or even, the existing technology uses a non-contact transportation platform to support product transfer by positive pressure. However, from a practical application level, these existing technical solutions have no effective and significant contribution to improving the reliability, quality, or functional yield of actual products.

Therefore, in view of this, the present inventor feels that the above-mentioned deficiency can be improved, and based on years of relevant experience in this area, careful observation and research, and the use of scientific principles, propose a novel and effective design The present invention to improve the above-mentioned deficiencies discloses a polishing and cleaning improvement device with a load-bearing platform structure integrated with positive and negative pressures, and its specific structure and implementation will be described in detail below.

In order to solve the problems existing in the prior art, one purpose of the present invention is to provide an improved device for polishing and cleaning, which is an improvement in the design of the existing polishing and cleaning device. The improved device helps to provide better product cleaning quality and effectively improve its product yield.

Another object of the present invention is to provide an improved device for grinding and cleaning, which forms a positive pressure zone and a negative pressure zone on the platform carrying the product at the same time, so as to form an air wall near the outer contour of the adjacent product , And use the air wall to block the infiltration of the solvent in the dust-free cloth during the cleaning process, thereby avoiding the solvent from contaminating the product, and achieving the purpose of effectively improving the cleaning yield of the product.

Another object of the present invention is to provide an improved device for grinding and cleaning. With this improved device for grinding and cleaning, only the positive and negative pressure integrated stage design is required. On the one hand, the negative pressure zone in the central area can be used for adsorption. At the same time, the positive pressure is turned on to form an air wall near the outer contour of the product. It is currently known that the present invention can be widely used in most grinding and cleaning related industries, and has extremely high industrial applicability.

In view of the above, the present invention discloses an improved device for grinding and cleaning, which is suitable for cleaning a product and improving the cleaning yield of the product. The improved device for polishing and cleaning includes: a stage with a flat surface for carrying the product; and a polishing component, which is arranged above the product to clean the product through the polishing component, Wherein, the carrier is designed with a positive pressure zone and a negative pressure zone at the same time, the positive pressure zone is correspondingly arranged on the outer contour of the product, and the negative pressure zone is correspondingly arranged on the central area of the carrier.

In detail, the grinding assembly disclosed in the present invention has a rotating shaft, and one end of the rotating shaft is provided with a dust-free cloth. Therefore, when the rotating shaft rotates, the grinding assembly can contact the product through the dust-free cloth to correct The product is ground and cleaned. Among them, a solvent for cleaning the product is dissolved in the dust-free cloth.

For this reason, the present invention mainly designs a positive pressure zone corresponding to the outer contour of the product on the carrier to form the air wall near the outer contour of the product, and the air wall prevents the dust-free cloth during the cleaning process. The solvent inside penetrates and contaminates the product.

According to an embodiment of the present invention, the positive pressure zone is formed adjacent to the side of the product and falls within the outer contour of the product.

The positive pressure zone may include a plurality of positive pressure holes to open the positive pressure through the positive pressure holes.

For example, the range of the positive pressure zone can be, for example, an annular groove.

On the other hand, according to an embodiment of the present invention, the negative pressure zone may include a plurality of vacuum holes, and the negative pressure is opened through the vacuum holes and the product is adsorbed.

Therefore, with this novel and innovative design, the improved device for grinding and cleaning disclosed in the present invention can naturally use the air wall formed in its positive pressure zone to block the infiltration and pollution of solvents, thereby solving the problems in the prior art. Existing deficiencies, and improve the cleaning quality of the product and its yield rate.

Furthermore, the positive pressure zone is connected to a first air pressure source, and the first air pressure source may include at least one solenoid valve or a pressure regulating valve, so that the solenoid valve or the pressure regulating valve can be used to control the switch of the positive pressure With size. Wherein, there is at least one air inlet hose between the first air pressure source and the positive pressure zone to provide positive pressure through the air inlet hose.

Similarly, the negative pressure zone can also be selectively connected to a second air pressure source, and this second air pressure source can include at least one solenoid valve or a pressure regulating valve, so that the solenoid valve or the pressure regulating valve can be used to control the negative pressure. The switch and size of the pressure. Wherein, there may be at least one air outlet hose between the second air pressure source and the negative pressure zone, so as to provide negative pressure through the air outlet hose.

Hereinafter, the present invention is described in detail with specific embodiments in conjunction with the accompanying drawings, which will make it easier for those skilled in the art to understand the purpose, technical content, characteristics and effects of the present invention.

The above description of the content of the present invention, and the following embodiments are used to demonstrate and explain the spirit and principle of the present invention, and provide a further explanation of the patent application scope of the present invention. With regard to the features, implementation and effects of the present invention, preferred embodiments are described in detail as follows in conjunction with the drawings.

In order to effectively solve the problem mentioned in the prior art, since the prior art in the grinding and cleaning process of the product, the product is often polluted due to the exudation of the cleaning solvent; this has prompted the present invention to propose a better improved design for this goal, which is a kind of Improved device for grinding and cleaning. Among them, in order to better understand the technical content of the present invention, first of all, please refer to the structure shown in Figure 1, which is a schematic structural diagram of an improved device for polishing and cleaning according to an embodiment of the present invention, as shown in the figure. The improved device for polishing and cleaning includes a stage 10 with a flat surface 12 that can be used to carry a product 20. A polishing assembly 30 is arranged above the product 20. The polishing assembly 30 has a rotating shaft 31. One end of the rotating shaft 31 is provided with a dust-free cloth 33, and a solvent for cleaning the product 20 is dissolved in the dust-free cloth 33. Therefore, when the rotating shaft 31 starts to rotate, the polishing assembly 30 can contact the product 20 through the solvent-dissolved dust-free cloth 33, and the product 20 can be polished and cleaned.

In order to prevent the solvent from contaminating the product during the grinding and cleaning process, the present invention designs the stage 10 as an improved structure with integrated positive and negative pressure. Please also refer to the schematic diagrams of the structures shown in Figures 2 to 4. , Figure 2 is a side view of a positive and negative pressure integrated carrier structure according to an embodiment of the present invention, and Figure 3 is a top view of a positive and negative pressure integrated carrier structure according to an embodiment of the present invention. Fig. 4 is a schematic diagram after the carrier shown in Fig. 3 is used to carry products; the present invention is explained in detail based on these figures, which is disclosed as follows.

First, as drawn in these figures, the stage 10 disclosed in the present invention has a positive pressure zone 22 and a negative pressure zone 24 at the same time, and the positive pressure zone 22 is correspondingly arranged on the outer contour of the product 20, and, The positive pressure zone 22 is formed adjacent to the side of the product 20 and falls within the outer contour of the product (as shown by the thicker solid line in Figure 4). The negative pressure zone 24 is correspondingly arranged in the central area of the carrier 10.

Wherein, FIG. 5 is a schematic diagram of the structure of the integrated positive and negative pressure stage having a positive pressure hole and a vacuum hole according to an embodiment of the present invention. Please refer to the figures 3, 4 and 5 of the drawings of the present invention. The setting range of the positive pressure zone 22 can be, for example, an annular groove (groove), and as shown in Figure 5, the positive pressure The annular groove of the zone 22 may also include a plurality of positive pressure holes 55 to provide positive pressure through these positive pressure holes 55. In an embodiment of the present invention, generally speaking, the positive pressure zone 22 is connected to a first air pressure source, and there is at least one air inlet hose between the first air pressure source and the positive pressure zone 22 to pass through the The intake hose provides positive pressure. In addition, the first air pressure source may further include at least one solenoid valve or pressure regulating valve, so that the solenoid valve or the pressure regulating valve can be used to control the switch of the positive pressure gas source and the magnitude of the positive pressure value.

With this design, the positive pressure zone 22 designed in the present invention can form an air wall near the outer contour of the product 20, and the air wall prevents the solvent from penetrating and contaminating the product during the cleaning process.

On the other hand, as shown in Figure 5, a negative pressure zone 24 is simultaneously designed in the carrier 10, and a plurality of vacuum holes 44 are provided in the negative pressure zone 24 to open through the vacuum holes 44 Negative pressure, and adsorb the product 20. According to the embodiment of the present invention, generally speaking, the negative pressure zone 24 is connected to a second air pressure source, and there is at least one air outlet hose between the second air pressure source and the negative pressure zone 24 to pass through the air outlet hose A negative pressure is provided to complete the adsorption of the product 20. In addition, the second air pressure source can also optionally include at least one solenoid valve or pressure regulating valve, so that the solenoid valve or the pressure regulating valve can be used to control the switch of the negative pressure gas source and the magnitude of the negative pressure value.

For this reason, the present invention can use this integrated positive and negative pressure carrier design to form an air wall near the outer contour of the product to eliminate the lack of solvent penetration into the product under vacuum. When the product is placed on the carrier, the carrier On the one hand, the negative pressure zone in the central area can be used to adsorb the product, and at the same time, the positive pressure can be turned on to form an air wall near the outer contour of the product to avoid solvent infiltration and affect the optimal effect of the product, but it is worth explaining here As mentioned above in the present invention, the embodiment in which the positive pressure zone is designed as an annular groove is an exemplary embodiment based on the technical idea of the present invention, and is not intended to limit the technical scope of the present invention. In other words, according to the technical solution taught in the present invention, those with ordinary knowledge in the field can change the design shape, range, or length and width dimensions of the positive pressure zone at the actual implementation level, and they should all belong to the present invention. Scope of invention. The illustrative examples listed in the foregoing paragraphs of the present invention are intended to better explain the main technical features of the present invention so that those skilled in the art can understand and implement them accordingly. Examples are limited.

In view of the above, it is obvious that, compared with the prior art, the novel polishing and cleaning improved device disclosed in the present invention can effectively solve the defects of product loss or corrosion caused by solvent infiltration in the prior art. Significantly and efficiently improve the cleaning yield of products. According to the technical solution taught by the present invention, a positive pressure zone is formed on the carrier table corresponding to the outer contour of the product to form an air wall, and through the optimized design of the air wall, the more optimized of the present invention is realized Invention effect.

In summary, the improved device for polishing and cleaning disclosed in the present invention does have excellent industrial applicability and competitiveness. Obviously, the technical features, methods and effects achieved by the present invention are significantly different from the current solutions. It is not something that can be easily completed by those who are familiar with the technology. Therefore, it should have the patent requirements. I hope that the review committee will review them. .

10: Stage 12: plane 20: Products 22: Positive pressure zone 24: negative pressure zone 30: Grinding components 31: shaft 33: Clean cloth 44: Vacuum hole 55: Positive pressure hole

Fig. 1 is a schematic structural diagram of an improved device for polishing and cleaning according to an embodiment of the present invention. Fig. 2 is a side view of the integrated positive and negative pressure stage structure according to an embodiment of the present invention. FIG. 3 is a top view of a carrier structure with integrated positive and negative pressure according to an embodiment of the present invention. Fig. 4 is a schematic diagram after the carrier shown in Fig. 3 is used to carry products according to the present invention. FIG. 5 is a schematic diagram of the structure of a positive and negative pressure integrated stage with a positive pressure hole and a vacuum hole according to an embodiment of the present invention.

10: Stage

12: plane

20: Products

30: Grinding components

31: shaft

33: Clean cloth

44: Vacuum hole

55: Positive pressure hole

Claims (11)

An improved device for grinding and cleaning is suitable for cleaning a product and improving the cleaning yield of the product. The improved device includes: A carrier with a flat surface for carrying the product; and A polishing component is arranged above the product to clean the product through the polishing component, wherein the carrier has a positive pressure zone and a negative pressure zone, and the positive pressure zone is correspondingly disposed on the product The outer contour of the product, the negative pressure zone is correspondingly set in the central area of the carrier to form an air wall near the outer contour of the product, and the air wall prevents a solvent from infiltrating and polluting the product during the cleaning process. product. The improved device for polishing and cleaning according to claim 1, wherein the positive pressure zone includes a plurality of positive pressure holes to open the positive pressure through the positive pressure holes. The improved device for polishing and cleaning according to claim 2, wherein the positive pressure zone is formed adjacent to the side of the product and falls within the outer contour. The improved device for polishing and cleaning according to claim 2, wherein the range of the positive pressure zone is an annular groove. The improved device for polishing and cleaning according to claim 1, wherein the negative pressure zone includes a plurality of vacuum holes to open the negative pressure through the vacuum holes and absorb the product. The improved device for polishing and cleaning according to claim 1, wherein the positive pressure zone is connected to a first air pressure source, and the first air pressure source has at least one solenoid valve or pressure regulating valve to utilize the solenoid valve or pressure regulating valve The valve controls the switch and size of the positive pressure. The improved device for polishing and cleaning according to claim 6, wherein there is at least one air inlet hose between the first air pressure source and the positive pressure zone to provide positive pressure through the air inlet hose. The improved device for polishing and cleaning according to claim 1, wherein the negative pressure zone is connected to a second air pressure source, and the second air pressure source has at least one solenoid valve or pressure regulating valve to utilize the solenoid valve or pressure regulating valve The valve controls the switch and size of the negative pressure. The improved device for grinding and cleaning according to claim 8, wherein there is at least one air outlet hose between the second air pressure source and the negative pressure zone to provide negative pressure through the air outlet hose. The improved device for polishing and cleaning according to claim 1, wherein the polishing assembly has a rotating shaft, one end of the rotating shaft is provided with a dust-free cloth, and when the rotating shaft rotates, the product is contacted by the dust-free cloth, To grind and clean the product. The improved device for polishing and cleaning according to claim 10, wherein the solvent for cleaning the product is dissolved in the dust-free cloth.

Images